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Conferenceはどの学会が主催していますか。","sourceUrls":["https://plasma153.org/meetings/data/171120.html"]},{"answer":"2017年11月20日から24日に、兵庫県姫路市の姫路商工会議所で開かれました。","question":"PLASMA2017はいつ、どこで開かれましたか。","sourceUrls":["https://plasma153.org/meetings/data/171120.html"]},{"answer":"参加学会共通フォーマットの英文2ページです。","question":"予稿は何語で、何ページですか。","sourceUrls":["https://plasma153.org/meetings/data/171120.html","https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/"]},{"answer":"発表言語は日本語が基本で、発表資料は英語でも良いと案内されています。","question":"発表は英語で行う必要がありますか。","sourceUrls":["https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/"]},{"answer":"予稿はWeb上の予稿集で公開されました。会議後には全講演者を対象に、IEEE Transactions on Plasma Scienceの特集号とPlasma and Fusion Researchが原稿を募集しました。","question":"会議の論文はどこに載りますか。","sourceUrls":["https://plasma153.org/meetings/data/171120.html","https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/journal.html"]},{"answer":"第1回は2011年11月に金沢でPlasma Conference 2011として開かれ、第2回は2014年11月に新潟で開かれました。","question":"Plasma Conferenceはいつ始まりましたか。","sourceUrls":["https://www.jspf.or.jp/PLASMA2017/infomation.html"]}],"headline":"PLASMA2017は2017年11月20〜24日に姫路商工会議所で開かれ、応用物理学会・プラズマ・核融合学会・153委員会の会合を兼ねて口頭・ポスター発表と企業展示を行いました。","metaDescription":"Plasma Conference 2017（PLASMA2017）の主催4団体、姫路での会期、講演申込と英文2ページ予稿、基調講演と半導体シンポジウム、IEEE特集号、2011年金沢からの経緯を公式ページからまとめます。","oneLine":"Plasma Conferenceは、応用物理学会プラズマエレクトロニクス分科会・プラズマ・核融合学会・日本物理学会領域2などが合同で開く、国内のプラズマ関連の基礎から応用までを網羅する会議です。","pageTitle":"Plasma Conference（PLASMA2017）とは｜国内プラズマ4団体の合同会議","relatedConferenceIds":["plasma-fusion-society-annual-meeting","isplasma","jsap-spring-autumn","spie-advanced-etch","japan-mrs-annual-meeting"],"sections":{"cycle":{"id":"cycle","body":"PLASMA2017は2017年11月20日から24日の5日間、兵庫県姫路市の姫路商工会議所で開かれました。20日午後にチュートリアルがあり、基調講演は21日に行われました。会期中は10以上のセッションを並列で開催し、口頭・ポスター発表と企業展示を行いました。公式ページには会議が終了した旨が掲示されています。","facts":[{"label":"2017 会期","value":"2017-11-20〜24","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 会場","value":"姫路商工会議所（兵庫県姫路市下寺町43）","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 開催の形態","value":"5日間・10以上のセッションを並列開催、口頭・ポスター発表と企業展示","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 開催状況","value":"終了（公式ページの掲示）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"公式の開催案内は、国内のプラズマ関連の基礎から応用までを網羅する会議と説明しています。講演は主催4団体ごとのセッション名で受け付け、153委員会枠ではプロセシングプラズマの素過程・モデリング、薄膜・表面プロセス（エッチング、薄膜形成、表面改質）、エレクトロニクス・ナノテクノロジー応用などの細目が並びます。半導体プロセスに関わる研究者には、G6とG7の細目が投稿先の目安になります。","facts":[{"label":"会議の対象範囲（2017 開催案内）","value":"国内のプラズマ関連の基礎から応用まで","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 講演申込の区分","value":"主催4団体ごとのセッション名で申込","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 153委員会枠 細目G1","value":"プロセシングプラズマにおける素過程・モデリング","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 153委員会枠 細目G6","value":"プラズマによる薄膜・表面プロセス（エッチング，薄膜形成，表面改質）","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 153委員会枠 細目G7","value":"エレクトロニクス・ナノテクノロジー分野へのプラズマ応用","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 153委員会枠 細目G4","value":"大気圧プラズマ・熱プラズマの生成および応用","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"講演申込の募集要項は、対象分野で最近行われた学術的に価値のある未発表の研究に限ると定めています。発表の可否と講演番号は9月初め頃に電子メールで通知されました。登録した登壇者名と講演題目はそのままプログラムに掲載され、締切後は変更できません。プログラムにはポストデッドライン講演（PD）の枠もあります。","facts":[{"label":"2017 講演の要件","value":"最近行われた、学術的に価値のある未発表の研究","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 申込内容の扱い","value":"登録した登壇者名・講演題目がそのままプログラムに掲載、締切後の変更不可","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 ポストデッドライン講演","value":"ポストデッドライン講演（PD）の枠","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/"}],"title":"採否・審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"このページの会期・締切・プログラムはすべて2017年（PLASMA2017）の情報です。2017年より後のPlasma Conferenceの開催予定は、公式ページには載っていません。「開催の形態」は国際セッションを含むと書く一方、プログラムページは発表言語を日本語が基本と案内しており、国際セッションの言語規定は載っていません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"Plasma Conferenceは、2000年から10年間に3回開かれた「プラズマ科学シンポジウム（PSS）」を土台に、2011年に第1回として立ち上がりました。幹事学会は回ごとに替わり、2011年の金沢はプラズマ・核融合学会、2014年の新潟は日本物理学会領域2、2017年の姫路は応用物理学会プラズマエレクトロニクス分科会が務めています。2011年と2014年の回はいずれも1000人を超える参加者を集めたと公式案内は記しています。","facts":[{"label":"前身","value":"プラズマ科学シンポジウム（PSS）（2000年から10年間に3回開催）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"第1回（2011）","value":"2011年11月・金沢、プラズマ・核融合学会が幹事学会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2011 会期・会場","value":"2011-11-22〜25 / 石川県立音楽堂（金沢市）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"第2回（2014）","value":"2014年11月・新潟、日本物理学会領域2が幹事学会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2014 会期・会場","value":"2014-11-18〜21 / 朱鷺メッセ（新潟）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2011・2014 参加者規模","value":"いずれも1000人超","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"11月21日の基調講演の1件目は、日立ハイテクノロジーズの伊澤勝氏による半導体デバイスの原子レベル制御プラズマプロセスの講演でした。シンポジウム2「半導体製造とCarbon」にはSamsung Electronicsと日立製作所の登壇者が並び、HARCエッチングや高アスペクト比加工の形状異常を取り上げています。11月20日午後のチュートリアルは参加登録者なら無料で聴講でき、会期中は企業展示も開かれました。","facts":[{"label":"2017 基調講演（11/21）","value":"伊澤 勝（(株)日立ハイテクノロジーズ）「半導体デバイスにおける原子レベル制御プラズマプロセスの展望」","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/programs/plenary.html"},{"label":"2017 基調講演（11/21）","value":"Cary Forest（University of Wisconsin）「Laboratory Plasma Astrophysics in the Big Red Plasma Ball」","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/programs/plenary.html"},{"label":"2017 シンポジウム2（半導体製造とCarbon）講演","value":"S2-4 Future process vision on HARC etching using carbon mask（Samsung Electronics Co., Ltd.）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/programs/sympo.html"},{"label":"2017 シンポジウム2 講演","value":"S2-5 高アスペクト比加工における形状異常（㈱日立製作所）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/programs/sympo.html"},{"label":"2017 チュートリアル（11/20 午後）","value":"参加登録者は無料で聴講","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/tutorial/"},{"label":"2017 チュートリアル演題","value":"大気圧プラズマ と触媒反応（野崎 智洋、東京工業大学）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/tutorial/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生にとっては、会員の参加費が一般20,000円に対し学生4,000円で、日本物理学会領域2の学生優秀発表賞の申請者向け案内も公式ページにあります。企業の調査担当には、半導体製造をテーマにしたシンポジウムの登壇企業と、企業展示の出展者一覧が参加企業の顔ぶれを知る資料になります。保育サービスも用意されていました。","facts":[{"label":"2017 参加費（会員・学生）","value":"4,000円","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 参加費（会員・一般）","value":"20,000円","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 学生向け表彰の案内","value":"日本物理学会領域2の学生優秀発表賞","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/"},{"label":"2017 保育","value":"保育サービスを用意","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"}],"title":"読み手別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はPlasma Conference 2017、略称はPLASMA2017です。主催は応用物理学会プラズマエレクトロニクス分科会（幹事学会）、プラズマ・核融合学会、日本物理学会領域2、日本学術振興会プラズマ材料科学第153委員会の4団体です。応用物理学会第35回プラズマプロセシング研究会、プラズマ・核融合学会第34回年会、第30回プラズマ材料科学シンポジウムを兼ねています。","facts":[{"label":"2017 正式名称・略称","value":"Plasma Conference 2017（PLASMA2017）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 幹事学会","value":"公益社団法人 応用物理学会 プラズマエレクトロニクス分科会","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 主催（共同主催団体）","value":"一般社団法人 プラズマ・核融合学会","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 主催（共同主催団体）","value":"一般社団法人 日本物理学会・領域2","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 新たに加わった主催団体","value":"日本学術振興会プラズマ材料科学第153委員会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 兼ねる会合（応用物理学会）","value":"応用物理学会第35回プラズマプロセシング研究会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 兼ねる会合（プラズマ・核融合学会）","value":"プラズマ・核融合学会第34回年会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"},{"label":"2017 兼ねる会合（153委員会）","value":"第30回プラズマ材料科学シンポジウム","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"組織委員長は名城大学の平松美根男氏が務めました。組織委員会には大学に加えて凸版印刷、パナソニック、三菱電機の所属者が入っています。企業展示の出展者一覧にはアルバック、日立製作所、東芝エネルギーシステムズなどが並びます。","facts":[{"label":"2017 組織委員会委員長","value":"平松美根男（名城大学）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/committee.html"},{"label":"2017 組織委員会 副委員長（企業所属）","value":"宇山晴夫（凸版印刷（株））","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/committee.html"},{"label":"2017 組織委員（企業所属）","value":"大熊崇文（パナソニック（株））","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/committee.html"},{"label":"2017 組織委員（電気学会 放電技術委員会）","value":"稲永康隆（三菱電機（株））","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/committee.html"},{"label":"2017 企業展示 出展者（抜粋）","value":"(株)アルバック","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/tenji2017.pdf"},{"label":"2017 企業展示 出展者（抜粋）","value":"(株)日立製作所","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/tenji2017.pdf"},{"label":"2017 企業展示 出展者（抜粋）","value":"東芝エネルギーシステムズ(株)","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/plasma2017_prog/tenji2017.pdf"},{"label":"2017 事務局","value":"PLASMA2017事務局（プラズマ・核融合学会内）","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"}],"title":"委員会・協賛・展示","eyebrow":"community"},"comparison":{"id":"comparison","body":"PLASMA2017は、応用物理学会第35回プラズマプロセシング研究会、プラズマ・核融合学会第34回年会、第30回プラズマ材料科学シンポジウムを兼ねる会議です。日本物理学会2017秋季大会の参加者は、本会議の参加費を払わずに聴講できました。公式案内は、プラズマ基礎科学と工学、応用科学と工学、産業応用の融合の促進を会議の趣旨として書いています。","facts":[{"label":"2017 日本物理学会秋季大会との関係","value":"秋季大会参加者は本会議を参加費なしで聴講可","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 開催趣旨","value":"プラズマ基礎科学と工学、応用科学と工学、産業応用の融合","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/PLASMA2017/infomation.html"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2017年の講演申込は8月4日正午締切で、採否と講演番号は9月初め頃に電子メールで通知されました。予稿は参加学会共通フォーマットの英文2ページで、10月31日正午が提出期限です。発表は日本語が基本で、口頭発表は1件20分（発表15分、質疑5分）の枠でした。","facts":[{"label":"2017 講演申込期限","value":"2017-08-04 12:00","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 採否通知","value":"9月初め頃・電子メール","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 発表形式・持ち時間","value":"口頭・ポスター。口頭は1件20分（発表15分＋質疑5分）","checkedAt":"2026-10-08","sourceUrl":"https://plasma153.org/meetings/data/171120.html"},{"label":"2017 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Line","canonicalOrganizationSlug":"ix-140f3a9e72","canonicalCompanyId":null}],"conferenceResearchDossierV1":{"checkedAt":"2026-08-06","conferenceId":"icns","confidenceScore":1,"coverage":{"faqCount":10,"factCount":81,"topicCount":8,"sourceCount":25,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"第15回のICNS-15は2025年7月6日から11日まで、スウェーデン・マルメのClarion Hotel & Congress Malmö Liveで開催されました。Important datesページには「6th to 11th July 2025: ICNS-15 in Malmö」と印刷されており、Program bookletの各ページヘッダーにも「Malmö, Sweden, July 6 – 11, 2025」が入っています。","question":"ICNSはいつ、どこで開催されましたか。","sourceUrls":["https://mkon.nu/icns-15/important_dates","https://mkon.nu/icns-15/venue","https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]},{"answer":"ICNS-15のアブストラクト締切は当初2025年2月23日で、3月10日まで延長されました。採否通知は2025年4月末です。締切後の受け皿としてLate News投稿があり、締切は2025年5月8日(延長なし)、通知は5月20日でした。2026年8月6日時点でLate Newsページの表示は「Late news submission is closed.」です。","question":"投稿締切はいつでしたか。締切後に投稿する手段はありますか。","sourceUrls":["https://mkon.nu/icns-15/important_dates","https://mkon.nu/icns-15/late_news_submission"]},{"answer":"投稿はアブストラクト単位で、本文2400文字とは別に図表1ページを提出します。この図表ページは「The second part is only for review purposes and will not be published.」と印刷されており、審査資料として使われます。選考体制としてProgram Committee(Chair、Co-Chairs、America/Asia/Europeの地域Chair、および多数のメンバー)が公開されています。double-blindなど匿名審査を示す記述は公式ページにありません。なお論文化する場合、APL・JAP・AIP Advances側で「regular peer review」が行われるとProgram bookletに書かれています。","question":"査読はありますか。どう選考されますか。","sourceUrls":["https://mkon.nu/icns-15/abstract_submission","https://mkon.nu/icns-15/program_committee","https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]},{"answer":"採択率は公表されていません。投稿件数や採択件数もICNS-15公式サイトとProgram bookletに掲載されていません。公開されている規模の数字は、Program booklet冒頭の「770 presentations」と「researchers from 37 countries」の2つです。","question":"採択率は公表されていますか。","sourceUrls":["https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]},{"answer":"plenary speakersには大学(University of Technology Sydney、Nagoya University、Meijo University、Massachusetts Institute of Technology、Peking University、NC State University)とInstitute of High-Pressure Physics of the Polish Academy of Sciences、企業のams OSRAMが並びます。招待講演にはCrystal IS、HexaTech、Sumitomo Chemical、Mitsubishi Chemical、Sony Semiconductor Solutions、Toshiba、Infineon Technologies Austria、BluGlass、Googleなどの所属者が含まれます。加えて7月7日11:00-12:20にIndustrial SessionがProgram bookletに組まれており、Sponsor and exhibition opportunitiesページには「Platinum & Gold Sponsor Will be given the opportunity for an industrial talk in one of the parallel sessions.」と書かれています。","question":"どういう人が発表していますか。企業からの発表もありますか。","sourceUrls":["https://mkon.nu/icns-15/plenary_speakers","https://mkon.nu/icns-15/invited_speakers","https://mkon.nu/icns-15/sponsor_and_exhibition_opportunities","https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]},{"answer":"ICNS-15にはまとまったproceedings論文集がありません。会議原稿はApplied Physics Letters、Journal of Applied Physics、AIP Advancesのいずれかに個別投稿し、「Special-Topic Collection on Frontiers in Nitride Semiconductors Research」としてまとめられます。コレクションの受付は2025年7月に開き、期限は2025年12月と公式に書かれています。投稿は各誌の通常投稿サイトから行い、投稿時にドロップダウンでSpecial Topicを指定します。IEEE Xploreへの収録を示す記載は公式ページにありません。","question":"発表内容はどこに載りますか。IEEE Xploreに収録されますか。","sourceUrls":["https://mkon.nu/icns-15/publishing_agreement"]},{"answer":"ICNS-15の参加費は、2025年5月14日までの早期登録がNormal 9,000 SEK、Student 5,000 SEK、それ以降がNormal 11,200 SEK、Student 6,500 SEKです。いずれも25%のVATが別途加算され、エクスカーション費用も別です。Gala Dinnerは1,000 SEK、同伴者のwelcome receptionは250 SEKです。","question":"参加費はいくらですか。","sourceUrls":["https://mkon.nu/icns-15/fees"]},{"answer":"所属機関の所在地が日本である参加は公式ページ上に複数あります。International Advisory CommitteeにNagoya University、The University of Tokyo、Kyoto University、Mie Universityの所属者が入り、plenary speakersにNagoya UniversityとMeijo Universityの2名が並びます。招待講演にはKyoto University、Tohoku University、Osaka University、Mie University、Tokyo University of Agriculture and Technology、University of Tsukubaのほか、Sumitomo Chemical、Mitsubishi Chemical、Sony Semiconductor Solutions、Toshibaの所属者が掲載されています。これらは所属機関の所在国であり、個人の国籍ではありません。参加者の国別内訳はこれらのページに掲載されていません。","question":"日本からの参加はどの程度ありますか。","sourceUrls":["https://mkon.nu/icns-15/international_advisory_committee_iac","https://mkon.nu/icns-15/plenary_speakers","https://mkon.nu/icns-15/invited_speakers"]},{"answer":"公表されていません。ICNS-15公式トップページと全99ページのProgram bookletを開きましたが、ICNS-16の開催年、都市、投稿締切のいずれも掲載されていません(bookletに「ICNS-16」の文字列は1件もありません)。過去の開催地はwelcome letterの一覧でICNS-2(1997年、徳島)からICNS-14(2023年、福岡)まで一覧に載ります。","question":"次回ICNS-16の開催予定は公表されていますか。","sourceUrls":["https://mkon.nu/icns-15","https://mkon.nu/icns-15/customer","https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]},{"answer":"口頭発表はContributed talkが15分(12分+質疑3分)、Invited talkが30分(25分+質疑5分)、Plenary talkが40分(35分+質疑5分)です。スライドはWidescreen(16:9)が推奨され、1枚目に氏名と発表題目を入れます。ポスターは縦向き(portrait)で最大幅90cm、ポスターセッションは7月7日17:00-19:00、7月8日17:00-19:00、7月10日15:00-16:00の3回です。","question":"発表時間とポスターの規格を教えてください。","sourceUrls":["https://mkon.nu/icns-15/information_for_speakers_and_chairs","https://mkon.nu/icns-15/instructions_for_poster_presenters","https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"]}],"headline":"ICNS-15の公式サイトとProgram bookletに実際に印刷されている会期・トピック・投稿要件・掲載先・委員会構成を、出典ページ単位で列挙する。","metaDescription":"III族窒化物の結晶成長・物性・光/電子デバイスを対象とする国際会議ICNS。第15回ICNS-15は2025年7月6〜11日にスウェーデン・マルメで開催。会期・投稿締切・査読・参加費・掲載先を公式ページ出典付きで一覧。","oneLine":"ICNSはIII族窒化物半導体の材料からデバイスまでを4つのトピックに分けて対象とする国際会議で、第15回にあたるICNS-15は2025年7月6〜11日にスウェーデン・マルメのClarion Hotel & Congress Malmö Liveで開催された。","pageTitle":"ICNSとは:GaN・AlN窒化物半導体の国際会議ICNS-15の会期・投稿・査読・掲載先を公式ページ出典付きで一覧","relatedConferenceIds":["iwn","icscrm","iprm","cs-mantech","icmbe"],"sections":{"cycle":{"id":"cycle","body":"ICNS-15の会期はImportant datesページとProgram bookletのヘッダーで同じ日付が印刷されている。会場名は公式Venueページの表記(Clarion Hotel & Congress Malmö Live)を優先し、出張申請や宿泊手配にはこちらを使う。DB側にはMalmoMassanが残る。次サイクルであるICNS-16の年と開催地は、ICNS-15公式トップページにもProgram bookletにも載っていない。","facts":[{"note":"Important datesページの最終行。","label":"2025 会期","value":"6th to 11th July 2025(「6th to 11th July 2025: ICNS-15 in Malmö」)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/important_dates"},{"note":"Program bookletの全ページヘッダーに「Malmö, Sweden, July 6 – 11, 2025」と印刷されている。","label":"2025 都市・国","value":"Malmö, Sweden","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Venueページ。番地までの住所は同ページに掲載されていない。","label":"2025 会場","value":"Clarion Hotel & Congress Malmö Live(「It is located right in the city center next to the Central Station」、「22 meeting rooms」、「444 hotel rooms」)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/venue"},{"note":"Program booklet冒頭のICNS-15 Highlights内Program欄。","label":"2025 参加国数","value":"「The ICNS-15 brings together researchers from 37 countries」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"同じくProgram booklet冒頭のHighlights欄。","label":"2025 発表件数","value":"「770 presentations, including plenary, invited, and contributed talks, as well as poster sessions, rump sessions, late-news & special topic sessions」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"会議終了後に公開されているV9版で確認。","label":"次サイクル(ICNS-16)の公表状況","value":"Program booklet全99ページに「ICNS-16」の文字列はなく、次回の開催年・開催都市も印刷されていない。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"}],"title":"2025 サイクル(ICNS-15)の会期・会場・規模","eyebrow":"cycle"},"scope":{"id":"scope","body":"投稿先はTopic IからTopic IVの4区分で、各トピックに担当のProgram Chairが割り当てられている。プログラム中の講演番号はGR・PC・OD・EDの接頭辞を持ち、並列セッションの見出しも同じ4つの接頭辞で始まる。バルク結晶成長からRF・パワーデバイスまでが同一会議に入るため、材料側とデバイス側の発表を同じ会期内で追える。","facts":[{"note":"Topicsページ。","label":"2025 Topic I: Growth","value":"「Bulk crystal growth, III-nitride epitaxy, doping and point defects, nitride alloys, and heterostructures as well as growth methods and growth technologies, wafer processing, microstructures, nanostructures, theory, novel materials such as B and Sc containing III-nitrides, 2D materials, quaternary InAlGaN, etc.」/ Program Chair: Izabella Grzegory","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"},{"note":"Topicsページ。","label":"2025 Topic II: Physics and characterization","value":"「Optical and electronic properties of III-nitrides, including novel materials, structural analysis, defect characterization, nanophotonics, nanoelectronics, crystal band structures, electronic states of defects, theory and simulation.」/ Program Chair: Filip Tuomisto","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"},{"note":"Topicsページ。","label":"2025 Topic III: Optical devices","value":"「Nitride based light emitters such as micro-LEDs, edge emitting laser diodes, VCSELs, multi-section laser diodes, UV-LEDs, UV-laser diodes, single photon emitters, tunnel-junction LEDs, photo-detectors, photovoltaics, nanophotonic physics and devices, frequency combs, non-linear optics, intersubband emitters, sensors, device technologies and simulations.」/ Program Chair: Åsa Haglund","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"},{"note":"Topicsページ。","label":"2025 Topic IV: Electronic devices","value":"「Transistors, diodes, switches, amplifiers, power and RF applications, actuators, acoustic devices, device processing, transport and switching properties, contacts and reliability, device concepts and simulations.」/ Program Chair: Oliver Ambacher","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"},{"note":"Program bookletのProgram schedule – oral presentations(7月7日の表)。","label":"2025 プログラム上の講演番号接頭辞","value":"講演番号の接頭辞はGR・PC・OD・EDの4種。例: GR-Mon-B1、PC-Mon-1、OD-Mon-1、ED-Mon-1。並列セッションの見出しも「GR:」「PC:」「OD:」「ED:」で始まる。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"7月7日(月)11:00枠の並列セッション見出し。","label":"2025 セッション名の例","value":"「ED: Radio Frequency Devices 1 (Mobile Communication)」「OD: VCSELs」「GR: Boron Nitride crystals and applications」「PC: Novel nitrides & deep UV」「Industrial Session」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"4トピックの対象範囲のみが印刷されている。SiCやInPへの言及もない。","label":"明示された対象外","value":"Topicsページには対象外領域を列挙する記述が掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"}],"title":"対象技術領域とトピック構成","eyebrow":"scope"},"review":{"id":"review","body":"ICNS-15の採否はアブストラクト審査で決まり、Program CommitteeはChair、Co-Chair、地域Chair、一般メンバーの階層で公開されている。図表1ページは審査専用で公開されないと印刷されており、審査資料と公開物が分けられている。採択率はProgram bookletにも、Program Committeeページにも掲載されていない。","facts":[{"note":"Abstract submissionページ。Late newsページも同じ文を載せる。","label":"2025 審査用資料の公開範囲","value":"アブストラクトは本文が公開対象、図表1ページは「The second part is only for review purposes and will not be published.」。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/abstract_submission"},{"note":"Program Committeeページ。Co-Chairの3名はTopic I/II/IVのProgram Chairと同じ名前が並ぶ。","label":"2025 Program Committee体制","value":"Chair: Åsa Haglund(Chalmers University of Technology, Sweden)。Co-Chairs: Izabella Grzegory(Unipress, Poland)、Filip Tuomisto(University of Helsinki, Finland)、Oliver Ambacher(INATECH, University of Freiburg, Germany)。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/program_committee"},{"note":"地域別のChairが3名並ぶ。","label":"2025 Regional Chairs","value":"America: Srabanti Chowdhury(Stanford University, USA)、Asia: Hiroshi Fujioka(The University of Tokyo, Japan)、Europe: Michael Kneissl(Technical University Berlin, Germany)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/program_committee"},{"note":"Program bookletが公開するのは「770 presentations」という実施件数のみ。","label":"2025 採択率","value":"採択率・投稿件数・採択件数はProgram bookletに掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"同ページが公開しているのは委員会構成の名簿のみ。Abstract submissionページにも同種の記述はない。","label":"2025 審査方式の明示範囲","value":"double-blindなど匿名査読方式を示す記述は、Program Committeeページに掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/program_committee"},{"note":"Program bookletのPublishing節。会議発表の採否審査とは別に、投稿論文が各誌の通常査読を受けることを示す。","label":"2025 論文側の査読","value":"「Articles will undergo regular peer review and will be handled by regular Associate Editors at APL, JAP, and ADV.」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Young Scientists Awardsページ。審査員の氏名は同ページに掲載されていない。","label":"2025 受賞審査の観点","value":"「The evaluation of candidates will be based on their submitted abstracts, supplementary materials, and presentations with question and answer sessions.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/young_scientists_awards"}],"title":"審査方式と採択率の公表状況","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトとProgram bookletが公開していない項目は、ICNS-16の開催年・開催地・投稿締切、投稿件数・採択件数・採択率、参加登録者総数、hybrid開催やonline視聴の可否、Isamu Akasaki Memorial Award記念講演の題目、double-blindなど査読方式の明示、Event Sponsors各社の正式名称表記、スポンサー各枠の金額と特典一覧です。会場名は公式VenueページのClarion Hotel & Congress Malmö Liveを使います。このページはICNS-15公式サイトとProgram bookletの記載だけを対象とし、過去回の投稿要件・参加費・プログラム詳細は範囲外です。","facts":[{"note":"会議終了後もサイトはICNS-15の内容のまま公開されている。Program booklet全99ページにも「ICNS-16」の文字列はない。","label":"未公開: ICNS-16","value":"ICNS-15公式トップページに、次回ICNS-16の年・都市・投稿締切の記載はない。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15"},{"note":"Program bookletのHighlights欄。","label":"未公開: 採択率と参加者総数","value":"Program bookletが公開する規模の数字は「770 presentations」と「researchers from 37 countries」だけで、投稿件数・採択件数・採択率・参加登録者総数はいずれも掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"公式Venueページの表記を使用する。","label":"2025 公式会場名","value":"Clarion Hotel & Congress Malmö Live","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/venue"},{"note":"Important datesページ。同ページの7項目にLate Newsの締切は含まれていない(別ページ)。","label":"年度が混ざりやすい箇所: 締切表記","value":"Abstract submission締切は「23rd February 2025 Extended to 10th March 2025」と2つの日付が同じ行に併記されている。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/important_dates"},{"note":"The Isamu Akasaki Memorial Award and Lectureページ。開催日時も同ページにはない。","label":"未公開: 授賞講演の題目","value":"Isamu Akasaki Memorial Awardの受賞者名(Professor Asif Khan)は公開されているが、記念講演の題目は同ページに掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/the_isamu_akasaki_memorial_award_and_lecture"},{"note":"VenueページとDetailed programページにも同種の記載はない。Detailed programページで案内されるWeb Appはプログラム閲覧用。","label":"未公開: オンライン参加の可否","value":"hybrid開催やonline視聴に関する記載は、Feesページの料金表・注記のいずれにもない。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/fees"}],"title":"未公開項目と表記の注意","eyebrow":"caveats"},"history":{"id":"history","body":"ICNSの起点は1995年で、名古屋で開かれたTopical Workshop on III-V Nitridesとボストンで開かれたMRS Intl Symposium on Gallium Nitride and Related Materialsを合わせたものと公式に記載されている。以降ICNS-2からICNS-14までの開催地と年がwelcome letterに一覧で印刷されている。30周年に合わせてIsamu Akasaki Memorial Awardが新設され、ICNS-15が初回授賞となった。","facts":[{"note":"ICNS-15公式サイトのwelcome letterおよびProgram bookletのwelcome letterに同じ文が印刷されている。","label":"初回開催年と根拠","value":"「The first conference in 1995 was a combination of the Topical Workshop on III-V Nitrides held in Nagoya, Japan and the MRS Intl Symposium on Gallium Nitride and Related Materials held in Boston, USA」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"},{"note":"welcome letterの一覧。","label":"ICNS-2〜ICNS-8の開催地","value":"Tokushima, Japan(ICNS-2, 1997)、Montpellier, France(ICNS-3, 1999)、Denver, USA(ICNS-4, 2001)、Nara, Japan(ICNS-5, 2003)、Bremen, Germany(ICNS-6, 2005)、Las Vegas, USA(ICNS-7, 2007)、Jeju, Korea(ICNS-8, 2009)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"},{"note":"welcome letterの一覧。ICNS-13とICNS-14の間隔について同ページに記述はない。","label":"ICNS-9〜ICNS-14の開催地","value":"Glasgow, UK(ICNS-9, 2011)、Washington DC, USA(ICNS-10, 2013)、Beijing, China(ICNS-11 2015)、Strasbourg, France(ICNS-12, 2017)、Bellevue, USA(ICNS-13, 2019)、Fukuoka, Japan(ICNS-14, 2023)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"},{"note":"Program bookletのIsamu Akasaki Memorial Award節。","label":"2025 30周年の記念施策","value":"「To mark the 30 year anniversary of ICNS history, the chairs of ICNS-15 introduce the Isamu Akasaki Memorial Award and Lecture.」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"ICNS-13、ICNS-14、IWN2022、IWN2024を同じ系列の会合として並べた公式記載。","label":"2025 Women in Nitridesの開催回","value":"「This event is the fifth of its kind after Women in Nitrides at ICNS-13 and 14 as well as IWN2022 and IWN2024.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/women_in_nitrides_-_diversity_and_inclusion"},{"note":"Program bookletのIn memoriam節。","label":"2025 会議の献辞","value":"「We dedicate this conference to the Loving Memory of Professor Bo Monemar」(Bo Monemar, 24.01.1942 – 31.05.2025)","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"welcome letterの記述による。","label":"名称変更の有無","value":"welcome letterに会議名称の変更を示す記載はない。1995年の起点は2つの別イベントの統合と記載され、以降はICNS-2から連番で表記されている。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"}],"title":"1995年の起点と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"日曜夕方のWelcome Receptionで始まり、月曜から金曜まで本会議が組まれる。plenaryは月・水・金に組まれ、火曜夜にrump session、月曜夜にWomen in Nitridesが入る。Innovation and Breakthroughの特別セッションは金曜16:00-18:00としてProgram bookletに載る。企業側の講演枠はIndustrial Sessionにまとまっており、Platinum & Goldスポンサーには並列セッションでのindustrial talkの機会が与えられると公式に書かれている。","facts":[{"note":"Program booklet。","label":"2025 開催日ごとの構成","value":"Program schedule – oral presentationsの日付見出しはMonday 7th July、Tuesday 8th July、Wednesday 9th July、Thursday 10th July、Friday 11th July。Welcome ReceptionはSunday, July 6, 18:00 - 20:00。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Plenary speakersページ。講演題目も併記。Program bookletは別途「Do not miss the eight plenary session talks on Monday, Wednesday and Friday.」と記す。","label":"2025 plenary speakers","value":"Igor Aharonovich(University of Technology Sydney, Australia)、Maki Kushimoto(Nagoya University, Japan)、Michał Boćkowski(Institute of High-Pressure Physics of the Polish Academy of Sciences, Poland)、Tetsuya Takeuchi(Meijo University, Japan)、Tomás Palacios(Massachusetts Institute of Technology, USA)、Ulrich Steegmüller(ams OSRAM, Germany)、Xinqiang Wang(Peking University, China)、Zlatko Sitar(NC State University, USA)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/plenary_speakers"},{"note":"Program bookletのHighlights欄およびIsamu Akasaki Memorial Award節。記念講演の題目は印刷されていない。","label":"2025 Isamu Akasaki Memorial Award and Lecture","value":"「Akasaki Memorial Award and Lecture / Monday, July 7, 09:00」。inaugural recipientは「Professor Asif Khan, Distinguished Professor at the University of South Carolina」で、「sponsored by Toyoda Gosei」と印刷されている。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Program bookletのHighlights欄。同時間帯の並列セッションの1つとしてプログラム表にも載る。","label":"2025 Industrial Session","value":"「Industrial Session / Monday, July 7, 11:00 - 12:20」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Program bookletのProgram schedule – poster presentations。トピック別(Growth等)に分けて掲載されている。","label":"2025 ポスターセッション","value":"Poster Session 1: Monday July 7, 17:00 – 19:00 / Poster Session 2: Tuesday July 8, 17:00 – 19:00 / Poster Session 3: Thursday July 10, 15:00 – 16:00","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Rump sessionsページ。","label":"2025 Rump Sessions","value":"いずれもTuesday, July 8, 19:00 - 20:30。(1)「>kV Nitride Power Devices: Challenges and Technologies」(High 1、moderators: Matteo Meneghini / Jun Suda)、(2)「Novel Nitrides and Concepts」(High 4、moderators: Bernard Gil / Debdeep Jena)、(3)「microLEDs for displays and other applications」(Live 2 & 3、moderator: Martin Strassburg)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/rump_sessions"},{"note":"Women in Nitrides – diversity and inclusionページ。","label":"2025 Women in Nitrides","value":"Monday, July 7, 19:00 - 20:30、Clarion Hotel & Congress Malmö Liveで開催。「All participants can attend without additional charge.」「Space may be limited, and registration is required.」IEEE photonics society、ThorLabs、AlixLabs AB、Malmö Universityが一部協賛。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/women_in_nitrides_-_diversity_and_inclusion"},{"note":"Special sessionページ。日時と会場は同ページに掲載されていない(Program bookletでは金曜16:00-18:00、Live 2 & 3)。","label":"2025 Special focus session on Innovation and Breakthrough","value":"Lars Samuelsonを「Pioneering Nanoscience Visionary」として取り上げる特別セッション。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/special_session"}],"title":"2025 プログラムと併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"学生はBest Student AwardとOutstanding Poster Awardの対象になり、審査はアブストラクト・補足資料・発表と質疑で行われる。参加費はSEK建てで学生枠が別に設定され、表示額に25%のVATが加算される。企業側の窓口は出展・スポンサー枠とIndustrial Sessionで、Program bookletにはLund Universityの求人告知の掲載枠もある。","facts":[{"note":"Feesページ。同ページに1 SEK = 0.087 Euroの換算目安が併記されている。","label":"2025 早期登録費","value":"Until 14th May 2025: Normal 9,000 SEK / Student 5,000 SEK(「All fees below are shown in SEK excluding VAT. 25% VAT will be added on all costs」)。Welcome receptionは0 SEK、Gala Dinnerは1,000 SEK。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/fees"},{"note":"Feesページ。エクスカーション費用は別途と印刷されている。","label":"2025 通常登録費","value":"After 14th May 2025: Normal 11,200 SEK / Student 6,500 SEK(いずれも25% VAT別)。同伴者はwelcome reception 250 SEK、gala dinner 1,000 SEK。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/fees"},{"note":"Important datesページ。登録開始は「13th December 2024: Registration opened」。","label":"2025 早期登録締切","value":"「14th May 2025: Early bird registration deadline」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/important_dates"},{"note":"Young Scientists Awardsページ。表彰は7月11日のclosing sessionで行われ、conference chair署名の証書が付く。","label":"2025 学生向け表彰の条件","value":"Best Student Awardは「PhD student who is the first author and presenter of a paper」、Outstanding Poster Awardは「first authors on a paper who are under 40 years of age by July 11th, 2025」。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/young_scientists_awards"},{"note":"Invited speakersページ。所属機関の所在国が日本である発表者であり、個人の国籍を示すものではない。","label":"2025 招待講演に載る日本所属","value":"invited speakersにSumitomo Chemical Co., Ltd.、Mitsubishi Chemical Corporation、Sony Semiconductor Solutions Corporations、Toshiba Corporation、Kyoto University、Tohoku University、Osaka University、Mie University、Tokyo University of Agriculture and Technology、University of Tsukuba、Nagoya University、Meijo Universityの所属者が掲載されている。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/invited_speakers"},{"note":"Program bookletの目次。","label":"2025 Program booklet内の求人掲載","value":"目次に「Tenure Track Positions at Lund University 96」「Postdoc Position at Lund University 97」が含まれる。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"Program bookletの7月7日の並列セッション表。","label":"2025 産業側の講演枠","value":"Industrial Session(Monday, July 7, 11:00 - 12:20)の登壇者にはGregory Mills、Ehsan Mohseni、Christian Geng、Ashutosh Kumar、Anders Lundskog、Ronny Kirste、Zsolt Szekrényes、Reza Jafariが並ぶ。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ICNS-15の公式サイトはmkon.nuドメイン配下にあり、URLに回次(icns-15)が入る。フッターの著作権表記はMKON名義で、委員会名簿や問い合わせ先は各回の公式サイトで別々に管理される。開催間隔を明示する文言はwelcome letterに印刷されておらず、載っているのは過去開催の回次・年・都市の一覧だけなので、URLの回次と対象年が一致するページを開く。","facts":[{"note":"Program bookletの各ページヘッダーに同じ表記が入る。","label":"2025 正式名称","value":"15th International Conference on Nitride Semiconductors (ICNS-15)","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"welcome letterの冒頭に印刷されている。","label":"2025 第N回と節目","value":"「This 15th edition of the conference celebrates 30 years of ICNS history.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"},{"note":"Organizing CommitteeページのOrganizing Committee Chairs欄。","label":"2025 Conference Chairs","value":"Vanya Darakchieva(Lund University and Linköping University, Sweden)、Piotr Perlin(Unipress, Poland)、Lars Samuelson(Lund University, Sweden)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/organizing_committee"},{"note":"同ページのHonorary Chair欄とConference Secretary欄。","label":"2025 Honorary Chair / Conference Secretary","value":"Honorary Chair: Tadek Suski(Unipress, Poland)、Conference Secretary: Nerijus Armakavicius(Linköping University, Sweden)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/organizing_committee"},{"note":"出版担当が独立した役職として並ぶ。同ページにはLocal Organizing Committeeの名簿も続く。","label":"2025 Publishing Chairs","value":"Erik Lind(Lund University, Sweden)、Henrik Pedersen(Linköping University, Sweden)、Mathias Schubert(UNL & APL Associated Editor, USA)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/organizing_committee"},{"note":"Publishing agreementページのフッター表記。サイト自体がmkon.nuドメイン配下にある。","label":"2026 サイト著作権表記","value":"「Copyright 2026 © MKON. All rights reserved.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"「隔年」などの表現はこのページに印刷されていない。","label":"開催頻度の公式記載","value":"welcome letterには開催間隔を明示する文言が印刷されていない。載るのは1995年の起点と、ICNS-2からICNS-14までの回次・年・都市の一覧のみ。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/customer"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"委員会はOrganizing Committee、Program Committee、International Advisory Committee、Isamu Akasaki Memorial Award Committeeの4つが別ページで公開されている。Program Committee名簿は各メンバーの所属国が括弧付きで併記されており、日本・米国・中国・欧州各国・台湾・韓国・シンガポール・サウジアラビアの所属が並ぶ。スポンサーと出展者の一覧は、その企業が出展・支援した事実を示すもので、取引や共同研究を示す記載ではない。Our partners, sponsors and exhibitorsページはロゴ画像で構成されており、Event Sponsors欄の各社正式名称は本文テキストとして印刷されていない。","facts":[{"note":"International Advisory Committee (IAC)ページ。委員会の役割は同ページに掲載されていない。","label":"2025 International Advisory Committee","value":"22名が氏名・所属・国付きで掲載。Andrew A. Allerman(Sandia National Laboratories, USA)、Hiroshi Amano(Nagoya University, Japan)、Jürgen Christen(University of Magdeburg, Germany)、Bernard Gil(CNRS University of Montpellier, France)、Åsa Haglund(Chalmers University of Technology, Sweden)、Shuji Nakamura(University of California-Santa Barbara, USA)、Bo Shen(Peking University, China)、Rong Zhang(Xiamen University, China)ほか。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/international_advisory_committee_iac"},{"note":"所属の所在国が日本である委員。個人の国籍を示すものではない。","label":"2025 IACに載る日本の所属","value":"Hiroshi Amano(Nagoya University)、Hiroshi Fujioka(The University of Tokyo)、Yoichi Kawakami(Kyoto University)、Hideto Miyake(Mie University)","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/international_advisory_committee_iac"},{"note":"Program Committeeページ。所属機関の所在国であり、個人の国籍ではない。","label":"2025 Program Committeeに並ぶ所属国","value":"名簿の括弧書きにはJapan、USA、China、Germany、France、Poland、Sweden、Finland、Switzerland、Italy、Spain、United Kingdom、Ireland、Taiwan、South Korea、Singapore、Saudi Arabiaが並ぶ。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/program_committee"},{"note":"Program bookletのThe Isamu Akasaki Memorial Award Committee節。受賞者本人はrecusedと併記されている。","label":"2025 Isamu Akasaki Memorial Award Committee","value":"Chairs: Bernard Gil(CNRS University of Montpellier, France)、Asif Khan(University South Caroline, USA - recused)。Members: Hiroshi Amano、Oliver Ambacher、Ramon Collazo、Vanya Darakchieva、Russell Dupuis、Hiroshi Fujioka、Izabella Grzegory、Yoichi Kawakami、Umesh Mishra、Bo Monemar、Bo Shen、Tadek Suski、Euijoon Yoon。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"同ページの階層別ロゴ掲載。出展・支援の掲載であり、それ以外の関係を示す記載ではない。","label":"2025 Gold / Silver Sponsors","value":"GOLD SPONSORS: SEMPA、AIXTRON、ams OSRAM、AlixLabs、TNS、Infineon、RISE、Adroit Materials、Semilab、SweGaN、Hexatech。SILVER SPONSORS: LayTec、STR、DCA、Attolight、Oxford Instruments。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/our_partners__sponsors_and_exhibitors"},{"note":"同ページのEXHIBITORS欄。ブース出展の事実のみを示す。","label":"2025 Exhibitors","value":"Polar Light Technologies、Veeco GmbH、Dockweiler Chemicals GmbH、Beijing SinoGaN Semiconductor Technology Co., Ltd.、Ceramic Forum Co., Ltd、Edinburgh Instruments、NTT Advanced Technology Corporation、Sanoh Industrial Co., Ltd.、Samco Inc.、WIBASE & WBG Pilot Line。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/our_partners__sponsors_and_exhibitors"},{"note":"Sponsor and exhibition opportunitiesページ。金額表や特典一覧は同ページ本文になく、「CLICK HERE TO DOWNLOAD THE SPONSOR INVITATION AS A PDF」の別PDFに置かれている。","label":"2025 スポンサー特典と講演枠の関係","value":"「Platinum & Gold Sponsor Will be given the opportunity for an industrial talk in one of the parallel sessions.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/sponsor_and_exhibition_opportunities"}],"title":"委員会構成と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"ICNS-15の公式ページはIWN2022とIWN2024を、ICNS-13・ICNS-14と同じ系列のWomen in Nitrides開催実績として並べて記載している。ICNS側のトピックはIII族窒化物に限定され、バルク結晶成長から電子デバイスまでが同一会議に収まる構成になっている。他材料系の会議との棲み分けの判断材料は、各会議が公開しているトピック表になる。","facts":[{"note":"ICNS公式ページ上でIWNに言及している数少ない箇所。","label":"2025 IWNとの併記","value":"「Women in Nitrides at ICNS-13 and 14 as well as IWN2022 and IWN2024」と、ICNSとIWNが同じ系列の開催実績として並べて印刷されている。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/women_in_nitrides_-_diversity_and_inclusion"},{"note":"Topicsページ。SiCやInPなど他材料系を対象とする記述はない。","label":"2025 対象材料の限定","value":"4トピックの本文はいずれもIII-nitrides / nitride basedで始まり、B・Sc含有III族窒化物、2D materials、quaternary InAlGaNまでを窒化物系の範囲として列挙している。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"},{"note":"Publishing agreementページ。IEEE Xplore収録を示す記載はない。","label":"2025 掲載先の系統","value":"会議発表の論文化先はAIP Publishingの3誌(APL / JAP / AIP Advances)のSpecial-Topic Collectionである。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"Topicsページの4トピック本文。","label":"2025 材料からデバイスまでの同居","value":"Topic I(Growth)にbulk crystal growthとwafer processing、Topic IV(Electronic devices)にpower and RF applicationsとreliabilityが同居する。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/topics"}],"title":"近い会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿はオンラインポータル限定で、本文2400文字と図表1ページを分けて登録する。図表ページは審査用で公開されない。通常投稿の締切に間に合わなかった内容はLate News(5月8日締切、延長なし)で受け付けられ、こちらはoral contributionsとpostersの両方を対象とすると印刷されている。","facts":[{"note":"Important datesページ。当初締切と延長後締切が同じ行に併記されている。","label":"2025 投稿受付期間","value":"「22nd November 2024: Abstract submission opened」「23rd February 2025 Extended to 10th March 2025: Abstract submission deadline」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/important_dates"},{"note":"日付ではなく月末という表現で公開されている。","label":"2025 採否通知","value":"「End of April 2025: Notification of acceptance」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/important_dates"},{"note":"Late news submissionページ。2026年8月6日時点の表示は「Late news submission is closed.」。","label":"2025 Late News締切と通知","value":"「Late News submission deadline: May 8th, 2025 (no extension)」「Notification of acceptance: May 20th, 2025」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/late_news_submission"},{"note":"Abstract submissionページ。","label":"2025 アブストラクト書式","value":"本文は「maximum 2400 characters (including spaces)」、タイトルは「maximum 150 characters」(「Superscripts, subscripts and special characters are unfortunately not allowed in the title.」)、図表は「Max one A4 page with figures and tables」で「Allowed formats: pdf, .png, .doc, .docx. Max 2 MB.」。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/abstract_submission"},{"note":"Abstract submissionページ。Late newsページも「Late news submitted by regular mail, e-mail or other means will not be accepted.」と印刷している。","label":"2025 投稿手段の限定","value":"「Abstracts submitted by regular mail, e-mail or other means will not be accepted」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/abstract_submission"},{"note":"Abstract submissionページ。Late newsページも「Only late news of registered participants will be included in the conference material.」と同趣旨。","label":"2025 登録との連動","value":"「Only abstracts of registered participants will be included in the conference material.」「At least one of the authors must be registered for the conference.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/abstract_submission"},{"note":"Information for speakers and chairsページ。1枚目に氏名と発表題目を入れるよう指示がある。","label":"2025 発表時間","value":"Contributed talk: 15 min(12 min talk + 3 min questions)/ Invited talk: 30 min(25 min talk + 5 min questions)/ Plenary talk: 40 min(35 min talk + 5 min questions)。スライドは「Preferred format: Widescreen (16:9).」。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/information_for_speakers_and_chairs"},{"note":"Instructions for poster presentersページ。e-posterの提出締切は7月6日。","label":"2025 ポスター仕様","value":"「upright (portrait)」形式で「Maximum width: 90 cm」(1mのボードに収める)。「Poster pins are available on site.」で、当日中に撤去する。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/instructions_for_poster_presenters"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"ICNS-15には一括のproceedings論文集がなく、発表内容はAIP Publishingの3誌に個別投稿し、共通のSpecial-Topic Collectionにまとめられる。投稿窓口は2025年7月14日に開き、コレクションの受付期限は2025年12月と公式に書かれている。オープンアクセス費用の条件は誌ごとに異なるので、投稿誌の選定材料はPublishing agreementページの誌別APC条件になる。","facts":[{"note":"Publishing agreementページ。","label":"2025 掲載先コレクション名","value":"「Special-Topic Collection on Frontiers in Nitride Semiconductors Research」。投稿先はApplied Physics Letters(APL)、Journal of Applied Physics(JAP)、AIP Advances(ADV)の3誌。","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"同ページに「Submission must be done through the regular submission sites for APL, JAP, or ADV. During submission, the manuscript must be assigned to this Special Topic via a drop-down menu.」と続く。","label":"2025 コレクション受付期間","value":"「This Special-Topic Collection will open in July 2025 and close in December 2025.」投稿受付開始日は「Submission opening day for this Special Topic is July 14.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"「APL is a hybrid subscription journal.」と併記されている。","label":"2025 APLの費用条件","value":"「It is free to publish with APL's traditional license. Authors can elect for open access publication in APL but must agree to pay an Article Processing Charge (APC) of $3800.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"2025年内の投稿が条件として書かれている。","label":"2025 JAPの費用条件","value":"「All submissions in 2025, even if published in 2026, will be made Open Access at NO CHARGE to authors.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"APLやJAPで不適と判断された原稿の移送先としても案内されている。","label":"2025 AIP Advancesの費用条件","value":"「Authors must pay an APC of $1800 to publish. There are limited discounts and waivers available for authors of certain countries.」","checkedAt":"2026-08-06","sourceUrl":"https://mkon.nu/icns-15/publishing_agreement"},{"note":"Program bookletのPublishing節。","label":"2025 Special Topicのguest editors","value":"Oliver Ambacher、Vanya Darakchieva、Izabella Grzegory、Åsa Haglund、Erik Lind、Piotr Perlin、Filip Tuomisto、Lars Samuelson、およびAPLのAssociate EditorとしてMathias Schubert。","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"著者がどの誌に載せるかを選べると書かれている。","label":"2025 誌ごとの原稿形式","value":"「APL (short-form letters); JAP (comprehensive, long-form articles), and ADV (either format is acceptable)」","checkedAt":"2026-08-06","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"}],"title":"掲載先と出版条件","eyebrow":"publication"}},"sources":[{"url":"https://mkon.nu/icns-15","role":"official","label":"ICNS-15 公式トップ","checkedAt":"2026-08-06","evidenceLocator":"左ナビゲーション全体(Committees / Program / Abstract / Registration / Publishing / Awards / Sponsors and Exhibitors / Information / Social Program)とwelcome文。ICNS-16への言及はない。"},{"url":"https://mkon.nu/icns-15/customer","role":"history","label":"ICNS-15 Welcome letter(customer)","checkedAt":"2026-08-06","evidenceLocator":"本文のwelcome letter。1995年の起点とICNS-2〜ICNS-14の開催地・年の一覧、30周年の記述。開催間隔を示す文言はない。"},{"url":"https://mkon.nu/icns-15/important_dates","role":"cfp","label":"ICNS-15 Important dates","checkedAt":"2026-08-06","evidenceLocator":"7項目の日付リスト(投稿開始・登録開始・投稿締切と延長・通知・早期登録締切・プログラム公開・会期)。Late Newsの締切は含まれない。"},{"url":"https://mkon.nu/icns-15/topics","role":"cfp","label":"ICNS-15 Topics","checkedAt":"2026-08-06","evidenceLocator":"Topic I〜IVの対象範囲とそれぞれのProgram Chair名。対象外領域の列挙はない。"},{"url":"https://mkon.nu/icns-15/abstract_submission","role":"cfp","label":"ICNS-15 Abstract submission","checkedAt":"2026-08-06","evidenceLocator":"書式要件(2400文字・150文字・A4 1ページ・2MB)、投稿手段の限定、審査用図表の非公開、登録者要件。"},{"url":"https://mkon.nu/icns-15/late_news_submission","role":"cfp","label":"ICNS-15 Late news submission","checkedAt":"2026-08-06","evidenceLocator":"締切5月8日(延長なし)と通知5月20日、oral contributionsとpostersの両対象、投稿手段の限定、現在の受付終了表示。"},{"url":"https://mkon.nu/icns-15/detailed_program","role":"program","label":"ICNS-15 Detailed program","checkedAt":"2026-08-06","evidenceLocator":"Abstract booklet / Program booklet のPDFリンクとWeb Appの案内。"},{"url":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf","role":"program","label":"ICNS-15 Program booklet (PDF, V9)","checkedAt":"2026-08-06","evidenceLocator":"全99ページ。1ページ目のICNS-15 Highlights(37 countries / 770 presentations / 8 plenary talks / Industrial Session / Akasaki Memorial Award and Lecture)、2ページ目のwelcome letter、3ページ目のIn memoriam、9ページ目のIsamu Akasaki Memorial Award Committee、10ページ目のIsamu Akasaki Memorial Award、16-22ページの招待講演一覧、32ページ以降のoral program、41ページ以降のposter program、89ページのPublishing節、96-97ページの求人告知。"},{"url":"https://mkon.nu/icns-15/plenary_speakers","role":"program","label":"ICNS-15 Plenary speakers","checkedAt":"2026-08-06","evidenceLocator":"8名の氏名・所属・国・講演題目の一覧。"},{"url":"https://mkon.nu/icns-15/invited_speakers","role":"program","label":"ICNS-15 Invited speakers","checkedAt":"2026-08-06","evidenceLocator":"Topic I〜IVごとの招待講演者の氏名・所属・題目。"},{"url":"https://mkon.nu/icns-15/rump_sessions","role":"program","label":"ICNS-15 Rump sessions","checkedAt":"2026-08-06","evidenceLocator":"3つのrump sessionの題目・日時(7月8日19:00-20:30)・会場・moderator、およびRump Session 1の技術課題列挙。"},{"url":"https://mkon.nu/icns-15/special_session","role":"program","label":"ICNS-15 Special session Innovation and Breakthrough","checkedAt":"2026-08-06","evidenceLocator":"Lars Samuelsonを取り上げる旨と経歴紹介。日時と会場の記載はない。"},{"url":"https://mkon.nu/icns-15/women_in_nitrides_-_diversity_and_inclusion","role":"program","label":"ICNS-15 Women in Nitrides - diversity and inclusion","checkedAt":"2026-08-06","evidenceLocator":"7月7日19:00-20:30の開催案内、ICNS-13・14およびIWN2022・IWN2024に続く5回目である旨、協賛4団体。"},{"url":"https://mkon.nu/icns-15/information_for_speakers_and_chairs","role":"program","label":"ICNS-15 Information for speakers and chairs","checkedAt":"2026-08-06","evidenceLocator":"contributed / invited / plenaryの持ち時間と質疑時間、スライド比率、1枚目の記載事項、座長の進行ルール。"},{"url":"https://mkon.nu/icns-15/instructions_for_poster_presenters","role":"program","label":"ICNS-15 Instructions for poster presenters","checkedAt":"2026-08-06","evidenceLocator":"ポスターの向き(portrait)、最大幅90cm、掲示と撤去のルール、ピンの提供、e-poster締切7月6日。"},{"url":"https://mkon.nu/icns-15/the_isamu_akasaki_memorial_award_and_lecture","role":"program","label":"ICNS-15 The Isamu Akasaki Memorial Award and Lecture","checkedAt":"2026-08-06","evidenceLocator":"授賞趣旨、Toyoda Goseiによる協賛、初回受賞者Asif Khan(University of South Carolina)の紹介。記念講演の題目と日時の記載はない。"},{"url":"https://mkon.nu/icns-15/young_scientists_awards","role":"program","label":"ICNS-15 Young Scientists Awards","checkedAt":"2026-08-06","evidenceLocator":"Best Student AwardとOutstanding Poster Awardの応募条件、審査対象(アブストラクト・補足資料・発表と質疑)、7月11日closing sessionでの授賞と証書。審査員名の記載はない。"},{"url":"https://mkon.nu/icns-15/organizing_committee","role":"committee","label":"ICNS-15 Organizing Committee","checkedAt":"2026-08-06","evidenceLocator":"Organizing Committee Chairs / Honorary Chair / Conference Secretary / Publishing Chairs / Local Organizing Committeeの氏名・所属・国。フッターの著作権表記。"},{"url":"https://mkon.nu/icns-15/program_committee","role":"committee","label":"ICNS-15 Program Committee","checkedAt":"2026-08-06","evidenceLocator":"Chair / Co-Chairs / Regional Chairs(America・Asia・Europe)とメンバー名簿(所属国が括弧書き)。査読方式の記載はない。"},{"url":"https://mkon.nu/icns-15/international_advisory_committee_iac","role":"committee","label":"ICNS-15 International Advisory Committee (IAC)","checkedAt":"2026-08-06","evidenceLocator":"22名の氏名・所属・国の一覧。委員会の役割の説明はない。"},{"url":"https://mkon.nu/icns-15/publishing_agreement","role":"proceedings","label":"ICNS-15 Publishing agreement","checkedAt":"2026-08-06","evidenceLocator":"Special-Topic Collection名、対象3誌、開設と終了時期、7月14日の投稿開始日、ドロップダウンでのSpecial Topic指定、誌別のAPC条件、フッターの著作権表記。IEEE Xploreへの言及はない。"},{"url":"https://mkon.nu/icns-15/fees","role":"registration","label":"ICNS-15 Fees","checkedAt":"2026-08-06","evidenceLocator":"5月14日を境にした早期・通常の料金表(SEK、VAT別)、学生料金、同伴者料金、換算目安。hybrid / onlineへの言及はない。"},{"url":"https://mkon.nu/icns-15/venue","role":"venue","label":"ICNS-15 Venue","checkedAt":"2026-08-06","evidenceLocator":"会場名Clarion Hotel & Congress Malmö Live、中央駅隣接という立地の記述、22 meeting rooms・444 hotel roomsの記載。番地の住所とhybrid / onlineへの言及はない。"},{"url":"https://mkon.nu/icns-15/our_partners__sponsors_and_exhibitors","role":"sponsor","label":"ICNS-15 Our partners, sponsors and exhibitors","checkedAt":"2026-08-06","evidenceLocator":"EVENT SPONSORS / AKASAKI AWARD SPONSOR / GOLD SPONSORS / SILVER SPONSORS / EXHIBITORS / PARTNERSの見出し別ロゴ掲載。Event Sponsors欄は本文テキストではなくロゴ画像で構成されている。"},{"url":"https://mkon.nu/icns-15/sponsor_and_exhibition_opportunities","role":"sponsor","label":"ICNS-15 Sponsor and exhibition opportunities","checkedAt":"2026-08-06","evidenceLocator":"Platinum & Gold Sponsorに並列セッションでのindustrial talkの機会が与えられる旨の記載と、詳細PDFへの案内。金額表は本文にない。"}],"summary":"ICNS(International Conference on Nitride Semiconductors)は、III族窒化物半導体のバルク結晶成長、物性と特性解析、光デバイス、電子デバイスを1つの会議に収める国際会議である。第15回のICNS-15は2025年7月6日から11日にスウェーデン・マルメで開催され、公式サイトには会期、トピック構成、投稿締切、参加費、委員会名簿、スポンサー一覧が掲載されている。このページでは、ICNS-15の公式ページとProgram bookletに印刷されている範囲だけを出典付きで読める。採択率、ICNS-16の開催年と開催地、オンライン配信の有無は公式に公開されていないため、ここでは公開されていない事実と書く。過去回の詳細プログラムやICNS以外の会議の内容は、このページの範囲外とする。","topics":[{"note":"Poster Session 1のGrowth枠に、Na-flux法、HVPE、ammonothermal法によるGaN結晶成長の発表がGR-Mon-P番号で並ぶ。","label":"GaNバルク結晶成長(Na-flux / HVPE / ammonothermal)","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"plenaryにZlatko Sitarの「AlN – The Extreme Bandgap Semiconductor」、招待講演にHideto Miyakeの「Deep-UV LEDs Fabricated on Face-to-Face Annealed Sputter-Deposited AlN Templates」が載る。","label":"AlNとdeep-UV","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"plenaryに「Quantum Technologies with Hexagonal Boron Nitride」、7月7日の並列セッション見出しに「GR: Boron Nitride crystals and applications」がある。","label":"hexagonal boron nitride(hBN)","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"招待講演にChris Van de Walleの「First-principles description of ferroelectric nitrides」、Simon Fichtnerの「Ferroelectricity for a New Perspective on III-N Semiconductors」が入る。","label":"ScAlN・強誘電性窒化物","sourceUrl":"https://mkon.nu/icns-15/invited_speakers"},{"note":"招待講演にJim Speckの「Quantitative analysis of leakage current in III-nitride micro-light-emitting diodes」、Kentaro Hayashiの「Addressable 2D Array of GaN-based VCSELs with Curved Mirrors」、Susumu Nodaの「Recent progress in photonic-crystal surface-emitting lasers (PCSELs)」がある。","label":"micro-LED / VCSEL / PCSEL","sourceUrl":"https://mkon.nu/icns-15/invited_speakers"},{"note":"月曜のセッション「ED: Radio Frequency Devices 1 (Mobile Communication)」の1件目がGeok Ing Ngの「RF GaN-on-Si for Future 5G/6G Communications」。","label":"GaN HEMTのRF応用","sourceUrl":"https://files.mkon.nu/fmfiles/file/Program-booklet_ICNS-15_bookmarked_V9.pdf"},{"note":"rump session「>kV Nitride Power Devices: Challenges and Technologies」が「substrate research, device engineering, material quality, defect control, thermal management, and reliability under high-field operation」を挙げている。","label":"kV級窒化物パワーデバイス","sourceUrl":"https://mkon.nu/icns-15/rump_sessions"},{"note":"招待講演にMartin Kuballの「Thermal management efforts for GaN electronic devices」、Enrico Zanoniの「Device scaling and reliability of RF GaN 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Centreで、完全な現地開催として開かれました。","question":"LT30はいつ、どこで開かれましたか。","sourceUrls":["https://www.lt30.es/","https://www.lt30.es/venue-and-accommodation/"]},{"answer":"公式報告書によると、IUPAPのC5 commissionが3年ごとに組織しています。次回のLT31は2028年にPittsburghで開かれる予定です。","question":"LTシリーズはどのくらいの頻度で開かれますか。","sourceUrls":["https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf","https://www.lt30.es/"]},{"answer":"従来型のproceedingsの代わりに、Journal of Low Temperature Physicsに専用コレクションが設けられ、通常論文と同じ査読を経て掲載されます。投稿期間は2025年7月15日から2026年2月10日でした。","question":"LT30にproceedingsはありますか。","sourceUrls":["https://www.lt30.es/abstract-submission/"]},{"answer":"発表者1人あたり抄録は2件まで、口頭発表は1件までです。","question":"1人で何件まで抄録を出せますか。","sourceUrls":["https://www.lt30.es/abstract-submission/"]},{"answer":"公式トップによると、登録は1000件、参加者は43か国から973人でした。","question":"LT30には何人が参加しましたか。","sourceUrls":["https://www.lt30.es/"]},{"answer":"26社が出展し、Oxford Instruments NanoscienceとBlueforsがPlatinum、Keysight TechnologiesとSumitomo (SHI) Cryogenics of EuropeがGoldでした。","question":"どのような企業が出展しましたか。","sourceUrls":["https://www.lt30.es/","https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"]}],"headline":"LT30は2025年8月7〜13日にスペインのBilbao Exhibition Centreで開かれ、1000件の登録と43か国からの973人の参加がありました。","metaDescription":"LT30（30th International Conference on Low Temperature Physics）の会期・会場、IUPAPとの関係、6つのテーマ、抄録投稿と招待・一般講演枠、Journal of Low Temperature Physicsの特集、出展企業を公式サイトと公式報告書からまとめます。","oneLine":"LTはInternational Union of Pure and Applied Physics（IUPAP）のC5 commissionが3年ごとに組織する低温物理学の国際会議で、LT30はその第30回です。","pageTitle":"LT30とは｜IUPAPの低温物理学国際会議 第30回Bilbao大会","relatedConferenceIds":["applied-superconductivity-conference","iss-superconductivity","international-conference-on-magnetism","joint-mmm-intermag-conference","icps"],"sections":{"cycle":{"id":"cycle","body":"LT30は2025年8月7日から13日に、スペイン・BilbaoのBilbao Exhibition Centre（congress centre）で開かれました。完全な現地開催です。公式トップは1000件の登録、43か国からの973人の参加を報告し、次回LT31を2028年にPittsburghで開くと告知しています。","facts":[{"label":"2025 会期","value":"2025-08-07〜13 / Bilbao, Spain","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"label":"2025 会場","value":"Bilbao Exhibition Centre（congress centre）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/venue-and-accommodation/"},{"label":"2025 開催形式","value":"現地開催のみ","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/venue-and-accommodation/"},{"label":"2025 参加規模","value":"登録1000件、参加973人、43か国","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"note":"公式トップの表記は「Pittsburg」、公式報告書は「Pittsburgh」です。","label":"次回（LT31）","value":"2028年 / Pittsburgh","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"LT30は低温に関わる全分野からの投稿を受け付け、6つのテーマとそれぞれのProgram Committeeで構成されました。テーマは、量子気体・流体・固体、超伝導、量子物質（磁性・トポロジー）、ナノ物理と量子輸送、量子情報と量子技術、極低温技術と応用です。","facts":[{"label":"2025 投稿対象","value":"低温に関わる全分野","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 テーマ（PC1）","value":"Quantum gases, fluids and solids","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 テーマ（PC2）","value":"Superconductivity","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 テーマ（PC3）","value":"Quantum materials – magnetism and topology","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 テーマ（JLTP 特集の区分）","value":"LT30 – Quantum information and technologies","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 テーマ（JLTP 特集の区分）","value":"LT30 – Cryogenic techniques and applications","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 テーマ（JLTP 特集の区分）","value":"LT30 – Nanophysics and quantum transport","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"講演者の選考は6つのProgram Committeeが担い、科学諮問委員会から寄せられた800件超の推薦をもとに、投票と内部討議でplenary・half-plenary・招待講演者を決めました。発表形式は採否と同時に通知されます。会議後のJournal of Low Temperature Physics特集は、同誌の通常論文と同じ査読を受けます。","facts":[{"label":"2025 招待講演者の選考方法","value":"各Program Committeeが投票と内部討議で選考","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 推薦数と選考結果","value":"推薦800件超から plenary 12件・half-plenary 40件を選定（招待講演は156件）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 発表形式の通知","value":"採否通知と同時","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"JLTP特集の査読","value":"同誌の通常論文と同じ査読","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"}],"title":"査読・選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"このページの会期・締切・委員会はすべて2025年のLT30の情報です。公式サイトのページタイトルは「7-14 August 2025」、本文と報告書は「7 to 13 August」と表記が分かれます（14日は出展者の撤収日）。会場名も「Bilbao Exhibition Centre」と報告書の「Bilbao Exhibition Center」で綴りが揺れます。LTシリーズの初回開催年と過去の開催地一覧は公式ページに載っていません。抄録の採択率は公表されていません。出展・協賛企業の一覧は出展と協賛の事実を示すもので、取引や共同研究を示すものではありません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"LT30はLTシリーズの第30回で、公式トップはスペインで初めての開催と記しています。次回のLT31は2028年にPittsburghで開かれる予定で、3年ごとの間隔が続きます。","facts":[{"label":"2025 開催国","value":"スペインで初めての開催","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"label":"次回LT31（公式報告書）","value":"Pittsburgh","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"IUPAPの後援","value":"under the auspices of IUPAP","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"plenaryは12件、half-plenaryは40件で、招待・一般講演は午前9、午後10の並列セッションで進みました。Fritz London Memorial Prize、Simon Memorial Prize、Lounasmaa Memorial Prize、IUPAP early career scientist prizeが授与され、400件を超えるポスターが発表されました。plenary講演者にはTohoku UniversityのDai Aoki氏、Osaka Metropolitan UniversityのMakoto Tsubota氏、QuTech（TU Delft）のLieven Vandersypen氏らが並びます。Lancasterではサテライト会議ULT 2025が開かれました。","facts":[{"label":"2025 並列セッション数","value":"午前9・午後10の並列セッション","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 ポスター数","value":"400件超","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 授与された主要な賞","value":"Fritz London Memorial Prize / Simon Memorial Prize / Lounasmaa Memorial Prize / IUPAP early career scientist prize","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 Plenary（抜粋）","value":"Dai Aoki（Tohoku University）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/invited-speakers/"},{"label":"2025 Plenary（抜粋）","value":"Lieven Vandersypen（QuTech, TU Delft, 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参加費（学生・早期）","value":"290,40€","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 ポスター賞","value":"4回のポスターセッションで各約6件","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"}],"title":"読み手別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称は30th International Conference on Low Temperature Physicsです。公式報告書は、この会議がIUPAPのC5 commissionによって3年ごとに組織されると説明しています。LT30の主な組織者はUniversidad Autónoma de Madrid、Consejo Superior de Investigaciones Científicas（CSIC）、Donostia International Physics Center（DIPC）に属し、IUPAPの会議方針に従って運営されました。","facts":[{"label":"正式名称","value":"30th International Conference on LOW TEMPERATURE PHYSICS","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"label":"組織母体・開催頻度","value":"IUPAP C5 commission、3年ごと","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"IUPAPとの関係","value":"the C5 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Maeno氏らが名を連ねています。出展は26社で、Oxford Instruments NanoscienceとBlueforsがPlatinum、Keysight TechnologiesとSumitomo (SHI) Cryogenics of EuropeがGoldです。この一覧は出展・協賛の事実を示すものです。","facts":[{"label":"2025 Vice-Chair","value":"Fernando Luis（CSIC, Zaragoza）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 Vice-Chair","value":"Sebastian Bergeret（CSIC-DIPC, San Sebastián）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 Program Committee 委員（日本所在、PC1）","value":"Yuki Kawaguchi, Nagoya","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 Program Committee 委員（日本所在、PC2）","value":"Yoshiteru Maeno, Kyoto","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/committees/"},{"label":"2025 出展数","value":"26 exhibitors","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"label":"2025 Platinum","value":"Oxford Instruments Nanoscience / Bluefors","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 Gold（抜粋）","value":"Keysight Technologies","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"label":"2025 Gold（抜粋）","value":"Sumitomo (SHI) Cryogenics of Europe GmbH","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"}],"title":"委員会・出展","eyebrow":"community"},"submission":{"id":"submission","body":"抄録の締切は当初の2月28日から4月3日に延長され、評価結果は5月中旬に通知されました。発表者1人あたり抄録は2件まで、口頭発表は1件までで、招待講演（20分＋質疑5分）と一般講演（12分＋質疑3分）の枠は委員会が抄録から選びます。2025年6月15日までに登録していない著者の抄録は受理されません。抄録と最終論文はいずれも英語です。","facts":[{"label":"2025 抄録締切","value":"2025-02-28 → 2025-04-03 に延長","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 評価結果の通知","value":"5月中旬","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/"},{"label":"2025 投稿数の上限","value":"発表者1人あたり抄録2件まで、口頭発表は1件まで","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 講演枠","value":"招待（20分＋5分）・一般（12分＋3分）を委員会が抄録から選定","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 使用言語","value":"英語（抄録・最終論文とも）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"2025 登録要件","value":"2025-06-15までに登録していない著者の抄録は不受理","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"}],"title":"投稿・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"LT30は従来型のproceedingsの代わりに、Springer NatureのJournal of Low Temperature Physicsに専用コレクションを設けました。フル論文・perspective・reviewを受け付け、投稿期間は2025年7月15日から2026年2月10日です。著者は無料の通常出版かAPCを払うオープンアクセスを選べ、論文は6テーマに対応する6つの区分に分かれて掲載されます。","facts":[{"label":"掲載誌","value":"Journal of Low Temperature Physics（Springer Nature）の専用コレクション","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"受け付ける論文種別","value":"full research articles（従来型proceedingsの代わり）、perspectives、review papers","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"投稿期間","value":"2025-07-15〜2026-02-10","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"公開範囲","value":"無料の通常出版（Traditional Closed Publication）またはAPC付きOpen Accessを著者が選択","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"label":"掲載区分","value":"6委員会に対応する6区分（区分名は「LT30 –…」）","checkedAt":"2026-10-08","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"}],"title":"論文誌・出版","eyebrow":"publication"}},"sources":[{"url":"https://www.lt30.es/","role":"official","label":"LT30 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"ヒーロー見出し、Thank you to everyone!（参加規模・LT31）、IMPORTANT DATES AND 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の冒頭"},{"url":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf","role":"archive","label":"LT30 公式報告書（Report LT30, PDF）","checkedAt":"2026-10-08","evidenceLocator":"2. Introduction、4.1 Program committee、5. Publication、6. Exhibitors、7. Satellites、8. Budget"}],"summary":"LT30は30th International Conference on Low Temperature Physicsの略称で、LTシリーズとして初めてスペインで開かれました。プログラムは量子気体・流体・固体、超伝導、量子物質、ナノ物理と量子輸送、量子情報と量子技術、極低温技術と応用の6テーマで構成され、6つのProgram Committeeが講演者を選びました。12件のplenary、40件のhalf-plenary、156件の招待講演に加え、400件を超えるポスターが発表されています。会議後の論文はproceedingsの代わりにJournal of Low Temperature Physicsの特集コレクションとして通常の査読を経て掲載されます。次回のLT31は2028年にPittsburghで開かれる予定です。","topics":[{"note":"Program Committee 2のテーマです。","label":"Superconductivity","sourceUrl":"https://www.lt30.es/wp-content/uploads/2025/12/Report_LT30.pdf"},{"note":"6テーマの一つで、JLTP特集でも独立した区分になっています。","label":"Quantum information and technologies","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"note":"極低温技術と応用のテーマで、JLTP特集でも独立した区分です。","label":"Cryogenic techniques and applications","sourceUrl":"https://www.lt30.es/abstract-submission/"},{"note":"6テーマの一つで、JLTP特集の区分の一つです。","label":"Nanophysics and quantum 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of Science Tokyo Suzukakedai CampusのSUZUKAKE Hall（横浜市緑区長津田町）で開かれました。","question":"2025年の会期と会場は？","sourceUrls":["https://tsys.jp/iscsi/2025/program/program.html","https://iscsi.sakura.ne.jp/iscsi10/venue/"]},{"answer":"2025年はISCSI-XとICSI/ISTDM 2025が同じ会場・会期で合同開催され、採択論文はテーマに応じてISCSI、ICSI/ISTDM、Jointの各セッションに割り当てられました。2013年と2016年にも合同で開かれています。","question":"ICSI/ISTDMとはどういう関係ですか？","sourceUrls":["https://iscsi.sakura.ne.jp/iscsi10/"]},{"answer":"図表込み2ページの英文abstractをPDFで提出します。採否はabstractで決まり、未発表のオリジナルな研究であることが条件です。","question":"何を投稿しますか？","sourceUrls":["https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"]},{"answer":"Elsevierの学術誌Materials Science in Semiconductor Processing（MSSP）の特集号に投稿でき、MSSPの通常の査読を経て掲載されます。掲載料は無料で、Open Accessは任意・有料です。","question":"論文はどこに載りますか？","sourceUrls":["https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"]},{"answer":"2025年のスポンサーはApplied Materials、Samco、KIOXIA、Seinan Industriesで、展示にはR-DEC、Eiko、STR Japanなど7社が出展しました。","question":"どの企業が協賛・出展しましたか？","sourceUrls":["https://iscsi.sakura.ne.jp/iscsi10/sponsors/","https://iscsi.sakura.ne.jp/iscsi10/sponsors/exhibitors/"]}],"headline":"第10回のISCSI-Xは、ICSI/ISTDM 2025と合同で2025年11月10〜13日にInstitute of Science Tokyo Suzukakedai Campus（横浜市）で開かれました。","metaDescription":"ISCSI（International Symposium on Control of Semiconductor Interfaces）の沿革、2025年のISCSI-XとICSI/ISTDM 2025合同開催の会期・会場、2ページabstract投稿、MSSP特集号、プログラム構成を公式ページから整理しました。","oneLine":"ISCSIは、半導体の表面・界面の制御に関する研究結果を議論する国際シンポジウムで、1993年に軽井沢で始まり、国内各地で回を重ねてきたシリーズです。","pageTitle":"ISCSIとは｜半導体界面の制御を議論する国際シンポジウムとICSI/ISTDMとの合同開催","relatedConferenceIds":["sisc","iwjt","icsict","icmbe","ald-ale","icscrm"],"sections":{"cycle":{"id":"cycle","body":"2025年の会期は11月10日（月）の午後から11月13日（木）までの4日間で、会場はInstitute of Science Tokyo Suzukakedai CampusのSUZUKAKE Hallでした。11日と12日にポスターセッションが組まれています。","facts":[{"label":"2025 開始日","value":"2025-11-10（Opening 13:00）","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 最終日","value":"2025-11-13（Closing 17:30）","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 会場","value":"Institute of Science Tokyo, Suzukakedai Campus, SUZUKAKE Hall（Bldg. H1/H2）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/venue/"},{"label":"2025 会場住所","value":"4259 Nagatsuta-cho, Midori-ku, Yokohama, Kanagawa 226-8501 Japan","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/venue/"},{"label":"2025 参加登録費（Early, 2025-10-10まで）","value":"General JPY 40,000 / Student JPY 20,000","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/registration/"}],"title":"2025年会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2025年のTopic Areasは、薄膜成長と評価、表面・界面制御、ナノ構造の形成と評価、プロセス・デバイス技術の4分野です。材料ではSi、SiGe(C)、GeSn、SiC、ダイヤモンド、III族窒化物、酸化物半導体、high-k／low-k絶縁膜までを含み、デバイスではFin FET/GAAFETや量子技術まで並びます。採択論文はテーマに応じてISCSI、ICSI/ISTDM、Jointの各セッションに割り当てられました。","facts":[{"label":"2025 Topic Areas","value":"Thin Film Growth and Characterization / Surface and Interface Control / Formation and Characterization of Nanostructures / Process and Device Technology","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"2025 対象材料","value":"Si、Strained Si、Ge、SiGe(C)、GeSn、SiC、Diamond、Silicide、化合物半導体、III-nitrides、酸化物半導体、high-k／low-k絶縁膜","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"2025 表面・界面制御の項目","value":"表面パッシベーション、Schottky／ohmic contact、表面・界面の原子スケール評価、先端デバイスの界面課題","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"2025 デバイス技術の項目","value":"Fin FET/GAAFET、Semiconductor-superconductor integration、Photonic devices、Quantum technology ほか","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"2025 セッション割り当て","value":"テーマに応じてISCSI、ICSI/ISTDM、Joint sessionsのいずれかに優先的に配置","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"会議での採否はabstractの審査で決まり、abstractには研究の具体的な結果と独自性を示すことが求められます。International Technical Program CommitteeのChairはKatsunori Makihara（Nagoya Univ.）とTatsuro Maeda（AIST）です。MSSP特集号の論文は、学術誌MSSPの通常の査読を経て掲載されます。","facts":[{"label":"2025 採否の判断材料","value":"abstract投稿に基づいて採否を決定","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 abstractで示す内容","value":"研究の具体的な結果と独自性","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 International Technical Program Committee Chair","value":"Katsunori Makihara（Nagoya Univ.）、Tatsuro Maeda（AIST）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/committee/"},{"label":"2025 MSSP特集号の査読","value":"MSSPの通常の査読を経て掲載","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"ISCSIは毎年開催ではなく、2013年以降は2016・2019・2022・2025年の3年おきに開かれています（公式の沿革記述による）。2025年版の公式サイトは第10回（ISCSI-X）用で、次回（第11回）の会期・開催地は未公開です。2025年はICSI/ISTDM 2025との合同開催のため、委員会・招待講演・セッションがISCSI-X側とICSI/ISTDM側に分かれています。採択率や投稿数は公表されていません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式サイトはISCSIシリーズの初回を1993年の軽井沢としています。その後は1996・1999・2002年に軽井沢、2007年に八王子、2013年に福岡、2016年と2022年に名古屋、2019年に仙台で開かれました。合同相手のICSIは1999年に宮城・蔵王で、ISTDMは2003年に名古屋で始まり、合同のISTDM/ICSIとしては2018年にPotsdam、2023年にComoで開かれています。","facts":[{"label":"初回開催","value":"1993年、軽井沢","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"開催地の推移","value":"1996・1999・2002 軽井沢 / 2007 八王子 / 2013 福岡 / 2016・2022 名古屋 / 2019 仙台","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ISCSI-IX","value":"2022-09-07〜09、Nagoya University","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ICSIの初回","value":"1999年、宮城・蔵王","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ISTDM/ICSI合同開催","value":"2018 Potsdam、2023 Como","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"過去の合同開催（ISCSIとICSI/ISTDM）","value":"ISCSI-VII / ISTDM2016（名古屋大学）、ICSI-8 / ISCSI-VI（2013、九州大学）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"11月10日にはISCSI-X 10th Anniversary Sessionがあり、Keynoteは東京大学のShinichi Takagiらによる極薄nano-sheet MOSFETのチャネル工学、PlenaryはAISTのKazuya MasuとApplied MaterialsのSaurabh Chopraらが登壇しました。13日にはThA4 Quantum Device FabricationやThB2 Emerging Technologiesのセッションがありました。ポスターセッションは11月11日17:20〜18:40のTuP Poster 1と12日16:40〜18:00のWeP Poster 2で、展示も行われました。","facts":[{"label":"2025 Keynote","value":"Shinichi Takagi ほか（Univ. of Tokyo）「Channel engineering for extremely-thin nano-sheet MOSFETs」","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 Plenary（Applied Materials）","value":"Saurabh Chopra ほか「Epitaxial Processes for Advanced CMOS Logic and Memory Applications」","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 Plenary（AIST）","value":"Kazuya Masu「Semiconductors in the Agile Dynamic Era: From Process Innovation to System Integration」","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 記念セッション","value":"MoM ISCSI-X 10th Anniversary Session（11月10日 13:40〜15:00）","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 ポスターセッション","value":"TuP Poster 1（11月11日 17:20〜18:40）、WeP Poster 2（11月12日 16:40〜18:00）","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 Thursday セッション例","value":"ThA4 Quantum Device Fabrication、ThB2 Emerging Technologies","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"},{"label":"2025 招待講演者（企業所属の例）","value":"Tomoyuki Horikawa（GlobalWafers Japan）、Stefan Kubicek（imec）、Lutz Muehlenbein（ASM）、Tamás Sipőcz（Semilab）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/plenary-keynote-invited-speakers/"}],"title":"プログラム構成","eyebrow":"program"},"audience":{"id":"audience","body":"学生の参加登録費は一般の半額（早期JPY 20,000）です。MSSP特集号は掲載料が無料で、会議で発表していない関連論文も投稿できます。同伴者登録はJPY 5,000で、レセプション・休憩・バンケットに参加でき、セッションには参加できません。","facts":[{"label":"2025 学生登録費","value":"Early JPY 20,000 / 以降 JPY 25,000","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/registration/"},{"label":"2025 同伴者登録","value":"JPY 5,000、レセプション・休憩・バンケットに参加可、セッションは不可","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/registration/"},{"label":"2025 特集号論文の公開時期","value":"査読完了・採択後すぐにオンライン公開","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Symposium on Control of Semiconductor Interfacesで、2025年の開催は第10回（ISCSI-X）です。2025年はInternational Conference on Silicon Epitaxy（ICSI）とInternational SiGe Technology and Device Meeting（ISTDM）の合同会議ICSI/ISTDM 2025と合同で開かれました。ISCSI-XにはJSAPの2分科会、IEICE、Japan Society of Newer Metals、経済産業省、IEEE EDS Japan Chapterが協賛（endorsement）しています。","facts":[{"label":"正式名称・第N回","value":"10th International Symposium on Control of Semiconductor Interfaces（ISCSI-X）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"2025 合同開催の相手","value":"International Conference on Silicon Epitaxy and International SiGe Technology and Device Meeting（ICSI/ISTDM 2025）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ISCSI-X endorsement","value":"Japan Society of Newer Metals / IEICE / Ministry of Economy, Trade and Industry / JSAP Thin Film and Surface Physics Division / JSAP Silicon Technology Division / IEEE EDS Japan Chapter","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/endorsement/"},{"label":"2025 Organizing Committee Chairs","value":"Kenji Shiojima（Univ. of Fukui）、Osamu Nakatsuka（Nagoya Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/committee/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"ICSI/ISTDMのOrganizing Committee Vice-Chairはimec（Belgium）のRoger Looです。International Advisory CommitteeにはMattson Technology、IBM、Applied Materials（いずれもUSA）の所属委員が、TPCにはRenesas Electronics、KOKUSAI ELECTRIC、Toyota Central R&D Labs.、GlobalWafers Japanの所属委員がいます。スポンサーはApplied Materials、Samco、KIOXIA、Seinan Industriesで、展示にはR-DEC、STR Japanなど7社が出展しました。","facts":[{"label":"2025 ISCSI-X Sponsors","value":"Applied Materials / Samco / KIOXIA / Seinan Industries Co., Ltd","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/sponsors/"},{"label":"2025 Exhibitors","value":"R-DEC / J. A. Whoollam, Japan / Eiko / MeiwaForsis / Dr. Eberl MBE Komponenten / STR Japan / KEISOKU ENGINEERING SYSTEM","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/sponsors/exhibitors/"},{"label":"2025 ICSI/ISTDM Organizing Committee Vice-Chair","value":"Roger Loo（IMEC, Belgium）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/committee/"},{"label":"2025 TPC委員の企業所属（例）","value":"Renesas Electronics、KOKUSAI ELECTRIC、Toyota Central R&D Labs.、GlobalWafers Japan","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/committee/"},{"label":"2025 International Advisory Committee の企業所属（例）","value":"Mattson Technology、IBM、Applied Materials（いずれもUSA）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/committee/"},{"label":"2025 プログラム所属の国表記（例）","value":"Belgium（imec）など、セッション座長・著者の所属に国名を併記","checkedAt":"2026-10-08","sourceUrl":"https://tsys.jp/iscsi/2025/program/program.html"}],"title":"委員会・スポンサー・所在国","eyebrow":"community"},"comparison":{"id":"comparison","body":"ISCSIは公式サイトで半導体界面の研究結果を議論し情報交換する場と説明されています。合同相手のICSI/ISTDMは、IV族半導体工学を材料科学からデバイス応用まで議論する会議と書かれています。","facts":[{"label":"ISCSIの自己記述","value":"半導体界面の研究結果を議論し情報交換する場","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ICSI/ISTDMの自己記述","value":"IV族半導体工学を材料科学からデバイス応用まで議論","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"},{"label":"ISTDMの初回","value":"2003年、名古屋","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2025年の投稿は、図表込み2ページの英文abstractをPDFで提出する方式でした。締切は当初2025年7月10日、延長後は7月31日で、ISCSI-Xのポスターセッションに限り9月30日まで受け付けました。1ページ目の冒頭には題目、著者、所属、住所、電話番号、corresponding authorのe-mailを書きます。","facts":[{"label":"2025 投稿書式","value":"図表を含む2ページのabstract、PDFのみ、英文、8.5 x 11 inchまたはA4","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 abstract締切","value":"2025-07-10、延長後 2025-07-31","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 ISCSI-Xポスター限定の締切","value":"2025-09-30","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 投稿条件","value":"未発表のオリジナルな研究","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 1ページ目の記載事項","value":"題目、著者、所属、住所、電話番号、corresponding authorのe-mail","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 MSSP特集号の論文締切","value":"2025-12-31、延長後 2026-02-28","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"}],"title":"投稿区分・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2025年の論文はElsevierの学術誌Materials Science in Semiconductor Processing（MSSP）の特集号として出版されます。掲載料は無料で、Open Accessは著者が有料で選ぶ方式です。会議で発表していない関連分野の論文も特集号に投稿でき、abstract集は参加登録者向けにオンラインで配布されました。","facts":[{"label":"2025 proceedings掲載先","value":"Elsevier, Materials Science in Semiconductor Processing の特集号","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/abstract-submission/"},{"label":"2025 特集号の投稿区分名","value":"VSI: ISCSI & ICSI/ISTDM – Research Paper / Review Article","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"},{"label":"2025 特集号の掲載料","value":"無料（Open Accessは任意・有料）","checkedAt":"2026-10-08","sourceUrl":"https://iscsi.sakura.ne.jp/iscsi10/special-issue-of-mssp/"},{"label":"2025 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N. Bose National Centre for Basic SciencesとIIT Kharagpurが共同で主催しました。","question":"誰が主催していますか？","sourceUrls":["https://mems.iitm.ac.in/iwpsd2023/about-us","https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"]},{"answer":"IWPSD 2025は4ページのIEEE Conference Paperを提出する方式で、投稿期間は2025年4月30日から8月31日まででした。2023年第22回はabstract方式で、8月15日締切、9月15日採否通知でした。","question":"最新確認回はどのような形式で投稿しましたか？","sourceUrls":["https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf","https://mems.iitm.ac.in/iwpsd2023/"]},{"answer":"2019年の公式ページでは、採択論文全件がe-ProceedingsとBook of Abstractsにまとめられ、査読で選ばれたfull paperがSpringer Proceedings in Physicsに収録されると案内されています。","question":"論文はどこに載りますか？","sourceUrls":["https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp"]},{"answer":"2023年は2D Materials and Devices、Crystal Growth and Epitaxy、Memory and Logic Devices、Power Semiconductor Devices、Optoelectronicsなど12トラックで、列挙外のテーマも受け付ける書き方でした。","question":"対象分野は何ですか？","sourceUrls":["https://mems.iitm.ac.in/iwpsd2023/"]},{"answer":"2023年はPlatinumのスポンサー区分とExhibit Boothsの区分があり、Platinumにはindustrial technical sessionでの30分の発表枠とブースが含まれていました。","question":"企業は展示できますか？","sourceUrls":["https://mems.iitm.ac.in/iwpsd2023/sponsors"]}],"headline":"最新確認回のIWPSD 2025は2025年12月15〜18日にIIT Roorkeeで開催され、4ページのIEEE Conference Paperを8月31日まで受け付けました。","metaDescription":"IWPSD（International Workshop on Physics of Semiconductor Devices）の最新確認回は2025年第23回で、12月15〜18日にIIT Roorkeeで開催されました。4ページのIEEE Conference Paperは2025年4月30日から8月31日まで受け付けました。2023年と2019年の主催・委員会・掲載情報も履歴として整理しています。","oneLine":"IWPSDは、インドの研究機関がSociety for Semiconductor Devicesなどと組んで1981年から隔年で開く、半導体材料とデバイスの物理を対象とする国際ワークショップです。","pageTitle":"IWPSDとは｜1981年に始まったインドの隔年半導体デバイス物理ワークショップ","relatedConferenceIds":["icps","icds","electronic-materials-conference","ssdm","edssc"],"sections":{"cycle":{"id":"cycle","body":"最新確認回のIWPSD 2025は2025年12月15〜18日にIndian Institute of Technology Roorkeeで開催されました。2027年回の会期・会場は今回確認した資料では確認できません。2023年第22回はIIT Madras Research Park、2019年第20回はKolkataのNovotel Hotel and Residencesで開催されました。","facts":[{"label":"2023 本会議会期・会場","value":"2023-12-14〜17 / Research Park, IIT Madras（Chennai, India）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 Tutorials Session","value":"2023-12-13 / Research Park, IIT Madras","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 所在地","value":"Research Park, IIT Madras, Chennai - 600036","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2019 会期・会場（第20回）","value":"2019-12-17〜20 / Novotel Hotel And Residences, Kolkata, India","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"},{"label":"2025 会期・会場","value":"2025-12-15〜18 / Indian Institute of Technology Roorkee, Roorkee, India","checkedAt":"2026-10-14","sourceUrl":"https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf"}],"title":"最新確認回2025年の会期・会場と過去回の記録","eyebrow":"cycle"},"scope":{"id":"scope","body":"2023年の対象は12トラックで、2D材料、結晶成長、デバイスモデリング、量子技術向けデバイス、II-VI・酸化物・III-V半導体、メモリ・ロジック、MEMS/NEMS・センサ、有機・フレキシブル、太陽電池、パワー半導体、オプトエレクトロニクスが並びます。材料成長からデバイスのモデリングまで一つの会議に入っている点が特徴です。2019年はIII-NitridesやVLSI & ULSI Devicesなど10項目で、トラック名は回ごとに組み替えられています。","facts":[{"label":"2023 トラック（材料系）","value":"2D Materials and Devices / Crystal Growth and Epitaxy / II - VI and Oxide Semiconductors / III - V Semiconductors","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/technical_committee"},{"label":"2023 トラック（デバイス系）","value":"Device Modelling and Simulation / Devices for Quantum Technology / Memory and Logic Devices / Power Semiconductor Devices","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 トラック（応用系）","value":"MEMS, NEMS and Sensors / Organic and Flexible Electronics / Photovoltaics / Optoelectronics","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 対象範囲の書き方","value":"列挙トラックに限らない（but not limited to）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2019 トラック（抜粋）","value":"III-Nitrides: Materials and Devices / Compound Semiconductors / VLSI & ULSI Devices / 2D Materials and Molecular Electronics など10項目","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"}],"title":"対象分野・トラック","eyebrow":"scope"},"review":{"id":"review","body":"2023年はabstractの採否が通知される方式で、トラックごとのco-chairとmemberからなるTrack & Technical Committeeが組まれていました。2019年の公式ページは、full paperについては査読を経て選ばれたものだけがSpringer Proceedings in Physicsに載ると書いています。","facts":[{"label":"2023 技術委員会の構成","value":"Track & Technical Committee（トラックごとにCo-Chairs and Members）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/technical_committee"},{"label":"2019 full paperの査読","value":"査読を経て選ばれたfull paperがSpringer Proceedings in Physicsに掲載","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp"}],"title":"査読・採否","eyebrow":"review"},"caveats":{"id":"caveats","body":"最新確認回は2025年ですが、会期は終了しています。2027年回の告知、2025年の採否通知日、査読方式、proceedings掲載先は、今回確認した資料では確認できません。公式PDFホストは2026年10月14日の直接取得時に名前解決できず、2025年の根拠は公式PDF URLを検索インデックスが表示した本文の保存記録です。2023年の詳細と2019年のSpringer Proceedings in Physicsへの収録は、それぞれの過去公式サイトに基づく履歴です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式ページはシリーズの開始を1981年としており、以後隔年で開かれています。2017年の第19回はIIT Delhiで開かれ、約600名が参加したと2019年の公式ページが書いています。開催地は2017年デリー、2019年コルカタ、2023年チェンナイとインド国内で移っています。","facts":[{"label":"初回開催年","value":"1981年","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2017 第19回","value":"2017年12月 / IIT Delhi / 参加者約600名","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"},{"label":"2019 第20回","value":"XX th International Workshop on The Physics of Semiconductor Devices / Kolkata","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"},{"label":"2023 第22回","value":"XXII / IIT Madras, Chennai","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2023年はkeynoteにUniversity of RochesterのChing Wan Tang、plenaryにUC Santa BarbaraのUmesh MishraやPurdue UniversityのMuhammad Ashraful Alam、Karlsruhe Institute of TechnologyのHorst Hahnなどが並びました。S. C. Jain Memorial LectureはIndian Institute of ScienceのR. Muralidharanが担当しました。本会議前日にtutorialがあり、会期中は日ごとにBest Poster Awardが選ばれています。Platinumのスポンサー区分には、industrial technical sessionでの30分の発表枠とブース1区画が含まれます。","facts":[{"label":"2023 Keynote Speaker","value":"Ching Wan Tang（University of Rochester）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/keynote_speaker"},{"label":"2023 Keynote演題","value":"Development of Next-Generation Display Technology – Retrospection and Outlook","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/keynote_speaker"},{"label":"2023 Plenary Speakers（抜粋）","value":"Umesh Mishra（University of California, Santa Barbara）/ Muhammad Ashraful Alam（Purdue University）/ Horst Hahn（Karlsruhe Institute of Technology）など","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/plenary_speakers"},{"label":"2023 S. C. Jain Memorial Lecture","value":"R. 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N. Bose National Centre for Basic SciencesとIIT Kharagpurが主催しており、ホスト機関は回ごとに替わります。","facts":[{"label":"2023 正式名称・回次","value":"XXII International Workshop on Physics of Semiconductor Devices（第22回）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 主催・協力","value":"Indian Institute of Technology Madras（主催）/ Society for Semiconductor Devices / Semiconductor Society (India)（協力）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/about-us"},{"label":"開催頻度","value":"隔年（biennial）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/about-us"},{"label":"2019 主催（第20回）","value":"S. N. 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N. Bose National Centre for Basic Sciences, Kolkata）","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp"}],"title":"委員会・参加者","eyebrow":"community"},"comparison":{"id":"comparison","body":"IWPSDは自らを、半導体材料とデバイスの分野で科学者と技術者が交流する場と説明しています。結晶成長やII-VI・III-V材料からメモリ・ロジック、パワー、オプトエレクトロニクスまでを一つのワークショップに収め、主催機関は回ごとに替わります。","facts":[{"label":"公式の自己説明","value":"半導体材料・デバイス分野の科学者と技術者の交流の場","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/about-us"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"IWPSD 2025は4ページのIEEE Conference Paperを受け付け、投稿期間は2025年4月30日から8月31日まででした。採否通知日と査読方式は、今回確認した2025年資料では確認できません。2023年第22回はabstract方式で、8月15日締切、9月15日採否通知でした。以下では年を分けて記録します。","facts":[{"label":"2023 abstract締切","value":"2023-08-15（Abstract Submission Closed）","checkedAt":"2026-10-08","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"label":"2023 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論文締切","value":"2025-08-31","checkedAt":"2026-10-14","sourceUrl":"https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf"},{"label":"2025 投稿書式","value":"IEEE Conference Paper / 4 pages","checkedAt":"2026-10-14","sourceUrl":"https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf"}],"title":"最新確認回2025年の投稿条件と2023年の履歴","eyebrow":"submission"},"publication":{"id":"publication","body":"2019年の公式ページによれば、採択論文はe-ProceedingsとBook of Abstractsにまとめられ、そのうち査読を通ったfull paperがSpringer Proceedings in Physicsに収録されました。","facts":[{"label":"2019 e-Proceedings","value":"採択論文全件のe-ProceedingsとBook of Abstracts","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp"},{"label":"2019 書籍収録","value":"Springer Proceedings in Physics（査読選抜のfull paper）","checkedAt":"2026-10-08","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp"}],"title":"論文の公開先","eyebrow":"publication"}},"sources":[{"url":"https://mems.iitm.ac.in/iwpsd2023/","role":"official","label":"IWPSD 2023 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"ページ上部の会期・主催、About IWPSD 2023、Important Dates & Links、登録費表"},{"url":"https://mems.iitm.ac.in/iwpsd2023/about-us","role":"history","label":"IWPSD 2023 About","checkedAt":"2026-10-08","evidenceLocator":"About IWPSD 2023 本文とトピック一覧"},{"url":"https://mems.iitm.ac.in/iwpsd2023/committees","role":"committee","label":"IWPSD 2023 Organizing Committee","checkedAt":"2026-10-08","evidenceLocator":"Patron / General Chairs / Treasurer / Secretaries の欄"},{"url":"https://mems.iitm.ac.in/iwpsd2023/advisory_committee","role":"committee","label":"IWPSD 2023 Advisory Committee","checkedAt":"2026-10-08","evidenceLocator":"Advisory Committee 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Sponsorship","checkedAt":"2026-10-08","evidenceLocator":"スポンサー区分の表"},{"url":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp","role":"archive","label":"IWPSD 2019 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"ヘッダーの会期・会場、About本文、Scope"},{"url":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/publications.jsp","role":"proceedings","label":"IWPSD 2019 Publication","checkedAt":"2026-10-08","evidenceLocator":"IWPSD2019 Publication 欄と Chairman 欄"},{"url":"https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf","role":"cfp","label":"IWPSD 2025 Call for Papers（検索インデックス保存）","checkedAt":"2026-10-14","evidenceLocator":"IWPSD 2025、15-18 December 2025、IIT Roorkee、Paper Submission、Starts/Ends、IEEE Conference Paper、4 pagesの各行。直接DNS取得不能のため検索インデックス表示を保存。"}],"summary":"IWPSDは、インドの研究機関がSociety for Semiconductor Devicesなどと組み、1981年から隔年で開く半導体デバイス物理の国際ワークショップです。最新確認回のIWPSD 2025は12月15〜18日にIIT Roorkeeで開催され、4ページのIEEE Conference Paperを2025年4月30日から8月31日まで受け付けました。2027年回は今回確認した資料では確認できません。このページでは2025年の会期・会場・投稿条件を先に示し、2023年第22回の12トラック、委員会、講演者、abstract日程と、2019年第20回の掲載情報を履歴として残します。","topics":[{"note":"2023年のトラックの一つです。","label":"2D Materials and Devices","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/technical_committee"},{"note":"2023年のトラックに入っています。","label":"Power Semiconductor Devices","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"note":"2023年のトラックに入っています。","label":"Devices for Quantum Technology","sourceUrl":"https://mems.iitm.ac.in/iwpsd2023/"},{"note":"2019年の対象項目の筆頭に挙がっています。","label":"III-Nitrides: Materials and Devices","sourceUrl":"https://www.bose.res.in/Conferences/IWPSD2019_ORIG/index.jsp"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2023,"positionTier":{"value":"B","publicReason":"1981年に始まったインドの隔年の半導体デバイス物理の国際ワークショップ。結晶成長、ワイドバンドギャップ、メモリ、MEMS、光、太陽電池、RFのトラックで4ページの論文を募る。"},"publicReasons":[{"body":"投稿案内","sourceUrl":"https://www.iwpsd2025.co.in/assets/downloads/IWPSD_2025_CFP_Aug2025.pdf"}],"sourceUrls":[{"url":"https://mems.iitm.ac.in/iwpsd2023/"},{"url":"https://mems.iitm.ac.in/iwpsd2023/plenary_speakers"},{"url":"https://mems.iitm.ac.in/iwpsd2023/technical_committee"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"ended","label":"会期終了","closedNote":"","imminent":false,"staleEnded":false,"steps":[{"id":"pre-cfp","label":"投稿受付前","state":"done"},{"id":"open","label":"投稿受付中","state":"done"},{"id":"review","label":"投稿終了","state":"done"},{"id":"notified","label":"採否通知","state":"done"},{"id":"program","label":"プログラム公開","state":"done"},{"id":"live","label":"開催中","state":"done"},{"id":"ended","label":"終了","state":"current"}],"currentStep":"ended","nextEvent":null,"lastPast":{"kind":"paper","label":"論文締切","date":"2025-08-31"},"milestones":[{"kind":"opens","label":"投稿受付開始","date":"2025-04-30","state":"past"},{"kind":"paper","label":"論文締切","date":"2025-08-31","state":"past"},{"kind":"session","label":"開催","date":"2025-12-15","endDate":"2025-12-18","state":"past"}],"action":{"kind":"next","text":"次回の日程は公式サイトで発表されます。","href":"https://www.iwpsd2025.co.in/","linkLabel":"公式サイト"}},"programUrl":null,"proceedingsUrl":null,"abstractDeadline":null,"digestDeadline":null,"lateNewsDeadline":null,"finalPaperDeadline":null,"acceptanceNotice":null,"programPublishedOn":null},{"id":"nvmw","code":"NVMW","name":"Non-Volatile 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abstractで、2段組の一般的な会議書式を使います。","question":"NVMWには何ページの原稿を出しますか。","sourceUrls":["https://nvmw.ucsd.edu/submissions-2026/"]},{"answer":"出せます。2026年のCfPは、締切前18か月以内に発表済みの研究も対象とし、その場合は元論文の書誌と公開PDFへのリンクを含めるよう求めています。","question":"他の会議で発表済みの研究をNVMWに出せますか。","sourceUrls":["https://nvmw.ucsd.edu/submissions-2026/"]},{"answer":"印刷版のproceedingsは作らず、発表スライドとextended abstractをWebに掲載します。NVMWでの発表は、その後の論文出版を妨げないとCfPに書かれています。","question":"NVMWにproceedingsはありますか。","sourceUrls":["https://nvmw.ucsd.edu/submissions-2026/"]},{"answer":"2026年のCfPには「Submissions are not blind.」とあり、著者名を伏せずに投稿します。","question":"NVMWの査読は匿名ですか。","sourceUrls":["https://nvmw.ucsd.edu/submissions-2026/"]},{"answer":"2026年3月9〜10日に、UC Santa Cruz Silicon Valley Campus（3175 Bowers Ave, Santa Clara, CA）で開かれました。過去10年はUCSDキャンパスで開かれていました。","question":"NVMW 2026はどこで開かれましたか。","sourceUrls":["https://nvmw.ucsd.edu/","https://nvmw.ucsd.edu/attend/","https://nvmw.ucsd.edu/sponsor-the-nvmw/"]},{"answer":"Memorable Paper Awardがあり、研究時に筆頭著者が学生だった論文が対象です。分野別に2件、各$1000で、受賞した学生発表者には旅費補助も出ます。","question":"学生向けの賞はありますか。","sourceUrls":["https://nvmw.ucsd.edu/memorable-paper-award/"]}],"headline":"NVMW 2026は17th Annualとして、2026年3月9〜10日にUC Santa Cruz Silicon Valley Campus（Santa Clara, CA）で開かれました。","metaDescription":"NVMW（Non-Volatile Memories Workshop）の主催、2026年会期と会場、2ページextended abstractの投稿条件、査読の形式、スライド公開の方式、keynoteとセッション構成、賞、2010年からの開催歴を公式ページから整理しました。","oneLine":"NVMWは、UC San DiegoのCenter for Memory and Recording ResearchとNon-Volatile Systems Laboratoryがホストする、不揮発メモリのデバイス、符号化、アーキテクチャ、システム、応用を横断して発表する年次ワークショップです。","pageTitle":"NVMWとは｜不揮発メモリのデバイスからシステムまでを発表するUC San Diego発のワークショップ","relatedConferenceIds":["imw","fms","acm-ieee-international-symposium-on-computer-architecture","irps","intermag"],"sections":{"cycle":{"id":"cycle","body":"2026年は3月9〜10日の2日間、Santa ClaraのUC Santa Cruz Silicon Valley Campusで開かれ、Call for Submissionsでは現地開催（in-person）として計画されていました。2024年はUC San Diegoで3日間の会期でした。登録費は一般が$360、Student/Postdocが$250です。","facts":[{"label":"2026 会期・会場","value":"2026-03-09〜10 / UC Santa Cruz Silicon Valley Campus, Santa Clara, CA","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/"},{"label":"2026 会場住所","value":"3175 Bowers Ave, Santa Clara, CA 95054（USA）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/attend/"},{"label":"2026 開催形式","value":"現地開催（in-person）として計画","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 登録費（Regular）","value":"$360","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/attend/"},{"label":"2026 登録費（Student / Postdoc）","value":"$250","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/attend/"},{"label":"2024 会期・会場（前々回）","value":"2024-03-10〜12 / University of California, San Diego","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/home-2024/"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"対象はsolid-stateの不揮発メモリ全般で、デバイスから誤り符号化、アーキテクチャ、システム、応用までを1つの場で扱います。通常の研究発表に加え、実製品の動向を反映するindustry trackと、メモリ研究の新しいアイデアを受け付けるwork-in-progress trackがあります。2026年のセッション名はCXL memory、SSD、Intermittent computingなどシステム寄りの題目が多く、Deviceセッションも1つ組まれました。","facts":[{"label":"2026 対象領域","value":"solid-state, non-volatile memories（devices, error coding, architectures, systems, applications）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 対象テーマの範囲","value":"non-volatile, solid-state memoriesに関するあらゆるテーマ","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 industry track","value":"実際のメモリハードウェア製品、ソフトウェアシステム、新しい応用の動向を反映する投稿を受け付け","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 work-in-progress track","value":"メモリ研究の新しいアイデアを受け付け","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 セッション構成（Day 1）","value":"Session 1: CXL memory / Session 2: Device / Session 3: SSD / Session 4: Intermittent computing / Session 5: Caching","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/program-3/"},{"label":"2026 セッション構成（Day 2）","value":"Session 6: Persistent memory","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/program-3/"}],"title":"対象領域・トラック","eyebrow":"scope"},"review":{"id":"review","body":"2026年の投稿は匿名化しない方式（not blind）でした。abstractには研究の動機と想定される影響を中心にまとめることが求められ、work-in-progress trackでは議論を呼ぶ可能性を基準に選びます。学生論文のMemorable Paper Awardは、program committeeが候補を選び、その一部の委員が質、影響、当日の発表を合わせて受賞を決めます。","facts":[{"label":"2026 査読の匿名性","value":"not blind（著者名を伏せない）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 abstractに求める内容","value":"研究の要約。動機と潜在的な影響に重点","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 work-in-progress の選考基準","value":"議論や発想を喚起する可能性。研究が完結していなくてもよい","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"Memorable Paper Award の選考手順","value":"program committeeが候補を選び、委員の一部が質・影響・NVMWでの発表で受賞を決定","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/memorable-paper-award/"}],"title":"査読・選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"2027年（18th）の会期と会場は、確認した2026年10月8日時点の公式サイトに掲載がありません。Past Conferences一覧は2024年の15th Annualで止まっており、2025年の16th Annualのページはこの一覧にありません。会場名はトップページがUC Santa Cruz Silicon Valley Campus、CfPがUCSC Silicon Valley Extensionと表記が揺れています。トップページの賞の案内は推薦締切を2024年2月17日のまま載せており、Memorable Paper Awardの対象期間もトップページ（過去2年）と賞のページ（締切前18か月）で異なります。参加者数もCfPは200名近く、スポンサーページは約220名と書いています。採択率と投稿数は掲載がありません。","facts":[{"label":"会場名の表記（CfP）","value":"UCSC Silicon Valley Extension（トップページはUC Santa Cruz Silicon Valley Campus）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"トップページの賞推薦締切の表記","value":"February 17, 2024のまま掲載","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/"},{"label":"Memorable Paper Award の対象期間（トップページ）","value":"過去2年以内に出版された学生論文（賞のページは締切前18か月）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/"},{"label":"参加者数の表記（スポンサーページ）","value":"約220名（CfPは200名近く）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/sponsor-the-nvmw/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のPast Conferences一覧は2010年の1st Annualから始まり、2024年の15th Annualまで年ごとのページが並びます。スポンサー募集ページには、UCSDが過去10年にわたりUCSDキャンパスで開いてきたことと、17回目の2026年はUC Santa Cruz Silicon Valley Campusで開くことが書かれています。CfPでは過去の規模を約50名の講演者と200名近い参加者と説明しています。","facts":[{"label":"初回開催","value":"2010年（1st Annual Non-Volatile Memories 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Philip Wongによる酸化物半導体ゲインセルメモリ、keynote IIはUCIのBrian DemskyによるPersistent MemoryとCXL shared memoryのcrash consistencyの講演でした。一般セッションはCXL memory、Device、SSD、Intermittent computing、Caching、Persistent memoryの6つで、3月9日の17時40分からSocial & Refreshmentsが組まれています。賞はPersistent Impact PrizeとMemorable Paper Awardの2種類です。","facts":[{"label":"2026 Keynote I","value":"Oxide Semiconductor Gain Cell Memory — H.-S. 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Laboratory（NVSL）です。","facts":[{"label":"正式名称（2026）","value":"17th Annual Non-Volatile Memories Workshop","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/"},{"label":"略称","value":"NVMW（2026年はNVMW 2026）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"ホスト","value":"Center for Memory and Recording Research（CMRR）、Non-Volatile Systems Laboratory（NVSL）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/about/"},{"note":"名称に回次とAnnualが入ります。","label":"開催頻度","value":"年1回（Annual）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/about/"},{"label":"2026 回次","value":"第17回","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/sponsor-the-nvmw/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはUC RiversideのHung-Wei Tsengで、Program Co-chairsはPurdue UniversityとUniversity of Illinois at Urbana-Champaignの研究者でした。2026年の公式プログラムには大学に加え、SK hynix America、Solidigm、Silicon Motion、Samsung Electronicsなど企業所属の著者が並びます。スポンサーにはPlatinum（$5000超）とGold（$3000〜$4500）の2段階があります。","facts":[{"label":"2026 General Chair","value":"Hung-Wei Tseng（University of California, Riverside）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"2026 Program Co-chairs","value":"Changhee Jung（Purdue University）、Wenjuan Zhu（University of Illinois at Urbana-Champaign）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"Steering Committee（About掲載）","value":"Paul Siegel（UCSD）、Steven Swanson（UCSD）、Hung-Wei Tseng（UCR）、Eitan Yaakobi（Technion）、Jishen Zhao（UCSD）","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/about/"},{"label":"2026 企業所属の発表（Session 1）","value":"PoolSwitch — 著者3名ともSK hynix America所属","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/program-3/"},{"label":"2026 企業所属の発表（Session 3）","value":"Solidigm所属著者によるDQNを用いたデータセンターSSDのQoS最適化、Silicon Motion所属著者によるSSDコントローラのsoft 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後続出版との関係","value":"NVMWでの発表は今後の出版を妨げない","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/submissions-2026/"},{"label":"プログラム資料の公開先","value":"talk abstractとスライドへのリンク付きプログラムをnvmw.ucsd.eduに掲載","checkedAt":"2026-10-08","sourceUrl":"https://nvmw.ucsd.edu/sponsor-the-nvmw/"}],"title":"論文の公開","eyebrow":"publication"}},"sources":[{"url":"https://nvmw.ucsd.edu/","role":"official","label":"NVMW 2026 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"ヘッダー（17th Annual、会場、MARCH 9-10, 2026）、AWARDS欄"},{"url":"https://nvmw.ucsd.edu/submissions-2026/","role":"cfp","label":"NVMW 2026 Call for Submissions","checkedAt":"2026-10-08","evidenceLocator":"本文（対象、industry / work-in-progress track、proceedings方針、締切、委員）、Formatting Instructions"},{"url":"https://nvmw.ucsd.edu/program-3/","role":"program","label":"NVMW 2026 Program","checkedAt":"2026-10-08","evidenceLocator":"MONDAY, MARCH 9 / TUESDAY, MARCH 10 の時間割（Keynote、Session 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Lawrence Convention Center, 1000 Fort Duquesne Boulevard, Pittsburgh, PA 15222","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/"},{"label":"2026 開催形式","value":"Pittsburghでの現地発表のみ（virtual・hybrid発表は不可）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 プログラムの日数","value":"4.5日間（plenary、並行セッション、ポスター、展示など）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/exhibit-sponsorship/"},{"label":"次回（ASC 2028）の公表状況","value":"開催地・日程ともTBD","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"},{"label":"ASC 2028 Chair","value":"Anna Leese（Quantum Vector Inc、ASEF Vice President）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/board-committee/"}],"title":"開催サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"投稿は応用超伝導に関する英語のabstractに限られ、対象領域は超伝導を含む量子システム（量子計算・通信・センシング）、応用に関わる超伝導の科学、超伝導技術、超伝導デバイス・部品のシステム統合の4つです。冷凍、低温の非超伝導材料、電源、パワーエレクトロニクスなどの周辺技術も、応用超伝導との関係が明確なら対象です。2026年のセッションはLarge Scale 111、Electronics 67、Materials 39、Joint 4で、Fusion Magnets and Cables、Accelerator Magnets、Coated Conductors、Digital Logic、Superconducting Detectors、SQUIDsなどの小分野が並びました。","facts":[{"label":"2026 投稿の要件","value":"applied superconductivityに関する英語のabstractであること","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 対象領域（量子）","value":"Applications of superconductors in Quantum Systems – Quantum Computing / Communications / Sensing（デバイス・設計・パッケージ・システムを含む）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 対象領域（その他3領域）","value":"Advances in the science of superconductors relevant to applications / Advances in superconducting technology / Integration of superconducting devices and components in systems","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 周辺技術の扱い","value":"冷凍、低温の非超伝導材料、電源、パワーエレクトロニクスなどは応用超伝導との関係が明確なら対象","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 分野別セッション数","value":"Large Scale 111 / Electronics 67 / Materials 39 / Joint 4（計222の口頭・ポスターセッション）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/technical-program/"},{"label":"2026 Large Scale・Materialsの主な小分野","value":"Accelerator Magnets 13 / Fusion Magnets and Cables 17 / Coated Conductors 10 / Rotating Machines 9 など","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/technical-program/"},{"label":"2026 Electronicsの主な小分野","value":"Quantum Systems 5 / Digital Logic 7 / Superconducting Detectors 6 / SQUIDs 4 / Flux Trapping and Mitigation 4 など","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/technical-program/"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"abstractはProgram Committeeが審査し、ガイドラインに沿わないものは不採択にできます。審査では、査読者が科学的な質を判断できる情報量と、応用超伝導との関連の説明が観点になります。発表形式は、会場等の制約に応じてProgram Committeeが変更できます。論文はTAS特集号での査読を受けますが、査読の対象になるのは会議で発表した内容に限られ、abstractの採択や発表は論文採択を保証しません。","facts":[{"label":"2026 abstractの審査","value":"ガイドラインに沿わないabstractはProgram Committeeが不採択にできる","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 abstractの審査観点","value":"査読者が科学的な質を判断できる情報量、応用超伝導との関連の説明","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 発表形式の決定","value":"Program 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Dates）","value":"2026-10-06","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/important-dates/"},{"label":"2026 abstract締切の延長","value":"受付開始2025-12-10、延長後の締切2026-02-02","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/program/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のFuture & Past ASC's一覧は1966年のBrookhaven, NY（11月9〜11日）を最初に挙げ、次に1967年のAustin, TXを載せています。Pittsburghでは1978年と1996年に開かれており、2026年は3度目です。2020年はVirtual、直近はASC 2022 Honolulu, HI、ASC 2024 Salt Lake City, UTです。","facts":[{"label":"一覧上の最初の回","value":"ASC 1966, Brookhaven, NY（11月9〜11日）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"},{"label":"1967年回","value":"Austin, TX（11月6〜8日）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"},{"label":"過去のPittsburgh開催","value":"ASC 1978（9月25〜28日）/ ASC 1996（8月25〜31日）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"},{"label":"2020年回","value":"Virtual（10月24日〜11月7日）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"},{"label":"直近の開催地","value":"ASC 2022 Honolulu, HI / ASC 2024 Salt Lake City, UT","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/future-past-ascs/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年は7つのplenaryセッション、17の特別セッション、4つのmemorialセッションが組まれました。plenaryには高温超伝導の40周年を振り返るPaul C. W. Chu氏、超伝導量子計算のIrfan Siddiqi氏、2025年ノーベル物理学賞のJohn Clarke氏が登壇しました。特別セッションには、銅酸化物超伝導体発見40年のJointセッション、HTS特性の定義と試験法をIEC 61788規格へ積み上げる取り組み、核融合マグネットの放射線問題があります。","facts":[{"label":"2026 plenary・特別セッション数","value":"plenary 7 / special 17 / memorial 4","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/technical-program/"},{"label":"2026 plenary","value":"Paul C. W. 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61788規格へ積み上げる長期的取り組みの開始","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/special-sessions/"},{"label":"2026 特別セッション（例）","value":"Radiation Issues for Superconducting Fusion Magnets","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/special-sessions/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生と若手研究者向けには、ASEFのELEVATEプログラムが事前のvirtual workshop、short course、Early Career Plenaries、学生とYP・産業界の交流イベントを用意しています。2026年は1月15日に無料のVirtual Abstract Writing Workshopが開かれ、英語を母語としない著者向けの助言も含まれていました。企業や調査担当者にとっては、展示とスポンサーの場が卒業予定者や若手研究者の人材に出会う機会として案内されています。発表言語はすべて英語です。","facts":[{"label":"2026 ELEVATEの内容","value":"事前のvirtual workshop、short course、Early Career Plenaries、学生とYP/産業界の交流イベント","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/"},{"label":"2026 Virtual Abstract Writing 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2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/"},{"label":"運営母体","value":"Applied Superconductivity Educational Foundation（ASEF）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/"},{"label":"2026 Conference Chair / ASEF President","value":"Judy Wu（University of Kansas）/ Arthur Lichtenberger（University of Virginia）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/board-committee/"},{"label":"2026 Program Chair","value":"Timothy Haugan（Retired from AFRL/RQQM, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/program-committee/"},{"label":"会議運営事務局","value":"Centennial Conferences（Louisville, CO）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/"},{"label":"開催頻度の表記","value":"ASEFは会議を「bi-annual conferences」と表記","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のElectronics分野のProgram Committeeには、Google、Seeqc、Rigetti Computingの企業所属者、九州大学、産業技術総合研究所、横浜国立大学の日本の所属者、フランス、南アフリカ、オーストラリア（CSIRO）、ドイツ（Leibniz IPHT）の所属者が並びます。Topical ChairsはElectronicsがUC RiversideのShane Cybart、Large ScaleがORNLのRobert DuckworthとCERNのEzio Todesco、MaterialsがKwansei Gakuin UniversityのToshinori OzakiとENEAのGiuseppe Celentanoです。ASEFのLarge Scale選出理事の所属にはINFN（Italy）、CEA Paris Saclay（France）、Tampere University（Finland）、CERN（Switzerland）、LBNLなどが入っています。展示担当chairの歓迎文は、参加者を1,200人超と見込んでいました。","facts":[{"label":"2026 Program Committee（企業の例）","value":"Mike Hamilton（Google, USA）/ Oleg Mukhanov（Seeqc, Inc., USA）/ Maria Salatino（Rigetti Computing, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/program-committee/"},{"label":"2026 Program 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など","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/board-committee/"},{"label":"2026 想定参加者数","value":"1,200人超（展示担当chairの歓迎文）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/exhibit-sponsorship/"}],"title":"委員会・参加組織","eyebrow":"community"},"submission":{"id":"submission","body":"abstractは題名と本文を合わせて空白込み3,000字、謝辞は300字までです。2026年は2025年12月10日に受付を開始し、延長後の締切は2026年2月2日（EST 23:59）、採否のメール通知は3月16日でした。abstractの軽微な変更は8月3日まで受け付けられました。原稿の投稿は任意で、ScholarOneで9月21日に受付を始め、締切は10月6日（EST 23:59）でした。登録費には発表済みabstract1件分の原稿投稿が含まれ、追加の原稿は1本あたりUS $440です。","facts":[{"label":"2026 abstract締切（延長後）","value":"2026-02-02 11:59 PM EST","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 採否通知","value":"2026-03-16（メール）","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/authors/"},{"label":"2026 abstractの字数","value":"題名＋本文 3,000字、謝辞 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on Applied Superconductivity（TAS）の特集号に載ります。最終原稿は会議後平均90日ほどでIEEE Xploreに出始め、特集号全体の刊行は2027年8月の予定です。採択された発表abstractは会議前に公式プログラムとして公開されます。","facts":[{"label":"2026 特集号","value":"IEEE Transactions on Applied Superconductivity（TAS）特集号、発行はIEEE Council on Superconductivity","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/publication/"},{"label":"2026 IEEE Xploreでの公開時期","value":"会議後平均90日ほどから順次","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/publication/"},{"label":"2026 特集号全体の刊行","value":"2027年8月予定","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/publication/"},{"label":"2026 原稿投稿は任意","value":"発表者に原稿投稿の義務はない","checkedAt":"2026-10-08","sourceUrl":"https://www.appliedsuperconductivity.org/asc2026/publication/"},{"label":"2026 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Adrien-Pouliot）へ変更されました。","question":"ILCC 2026はいつ、どこで開かれましたか？","sourceUrls":["https://www.ilcc2026.org/en","https://www.ilcc2026.org/en/venue-change"]},{"answer":"本文・図・参考文献を含めて1ページ以内のabstractをPDFで投稿します。2026年の通常締切は2月22日で、その後はlate-breaking resultsとして会期まで随時受け付けました。","question":"何を投稿しますか？","sourceUrls":["https://www.ilcc2026.org/en","https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"]},{"answer":"ILCCはblind reviewを行わず、abstractに著者名と所属を記載します。技術的・科学的内容、革新性、文章の質で評価され、口頭・ポスター・不採択に振り分けられます。","question":"審査はblind reviewですか？","sourceUrls":["https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"]},{"answer":"1965年にKent State Universityで始まり、以後は地域を変えて隔年で開かれています。","question":"どのくらいの頻度で開かれていますか？","sourceUrls":["https://www.ilcsoc.org/ILCC"]},{"answer":"京都（1980年、2018年）と仙台（2000年）で開かれています。2018年京都は第27回でした。","question":"日本で開かれたことはありますか？","sourceUrls":["https://www.ilcsoc.org/ILCC","https://www.ilcc2026.org/en/about/previous-conferences"]},{"answer":"2026年は会期初日の6月21日午後にUniversité Lavalで学生向けの入門tutorialが3セッション開かれ、別途登録が必要でした。","question":"学生向けのプログラムはありますか？","sourceUrls":["https://www.ilcc2026.org/en/tutorial-sessions"]}],"headline":"ILCC 2026は第30回として2026年6月21〜26日にカナダ・Québec CityのUniversité Lavalで開かれました。","metaDescription":"ILCC（International Liquid Crystal Conference）の支援団体ILCS、2026年のQuébec City会期と会場変更、1ページabstractと非blind審査、6つのトピック、plenary・tutorial、1965年からの開催地を公式ページから整理しました。","oneLine":"ILCCは、International Liquid Crystal Societyが1965年の第1回から支援してきた、液晶とソフトマターの物理・化学・生物・材料・応用研究を発表する隔年の国際会議です。","pageTitle":"ILCCとは｜1965年から隔年で開く液晶とソフトマターの国際会議","relatedConferenceIds":["japanese-liquid-crystal-conference","international-display-workshops","display-week","am-fpd","mrs-fall-meeting"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は6月21日から26日までで、初日の21日午後にtutorialが開かれました。会場は当初のQuébec City Convention CentreからUniversité Lavalへ移り、受付はPavillon Alexandre-VachonのAtrium、学術発表はPavillon Adrien-Pouliotで行われました。発表は現地でのライブ発表のみで、リモートセッションはありません。公用語は英語で、同時通訳はありませんでした。","facts":[{"label":"2026 会期","value":"2026-06-21〜26 / Québec City, Canada","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en"},{"label":"2026 会場変更","value":"Québec City Convention Centre → Université Laval","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/venue-change"},{"label":"2026 受付","value":"Pavillon Alexandre-VachonのAtrium（1045 avenue de la 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reviewを行わないと明記しており、abstractには著者名と所属を記載します。abstractは技術的・科学的な内容、革新性、文章の質で評価され、口頭、ポスター、不採択のいずれかに振り分けられます。投稿時には6トピックの中から第1希望と第2希望のセッションを選びます。","facts":[{"label":"査読方式","value":"blind reviewなし（著者名・所属を記載）","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"},{"label":"評価観点","value":"technical-scientific characteristics, innovating aspects and the quality of the text","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"},{"label":"判定区分","value":"口頭 / ポスター / 不採択","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"},{"label":"セッション希望","value":"第1希望と第2希望を選択","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/late-breaking-results-abstract-submission"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年の会場はUniversité Lavalに変更されましたが、Late-Breaking Resultsのページは2026-10-08時点でも会場をCentre des Congrès de Québecと書いており、トップページにもQuebec Convention Centreの記事が残っています。詳細プログラムはFourwaves上にあり、閲覧にはログインが必要です。過去開催一覧は2018年京都の次が2022年Lisbonで、2020年の回は一覧にありません。回次の数え方では2018年が第27回、2026年が第30回です。採択率は公表されていません。次回（2028年）の開催地は2026年サイトとILCSのページに未掲載です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"第1回は1965年にKent State UniversityでGlenn H. Brownが組織しました。Kent（Ohio）は1965年から2016年までに6回の開催地になり、日本では1980年と2018年に京都、2000年に仙台で開かれています。2018年の京都の次は2022年のLisbonで、2024年がRio de Janeiro、2026年がQuébec Cityです。","facts":[{"label":"第1回","value":"1965年、Kent State University、Glenn H. Brownが組織","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcsoc.org/ILCC"},{"label":"第29回","value":"ILCC 2024、2024年7月21〜26日、Rio de Janeiro, Brazil","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/about/previous-conferences"},{"label":"第28回","value":"ILCC 2022、2022年7月24〜29日、Lisbon, Portugal","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/about/previous-conferences"},{"label":"第27回","value":"ILCC 2018、2018年7月22〜27日、Kyoto, Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/about/previous-conferences"},{"label":"日本での過去開催","value":"Kyoto 1980 / Sendai 2000 / Kyoto 2018","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcsoc.org/ILCC"},{"label":"Kentでの開催","value":"1965 / 1968 / 1972 / 1976 / 1996 / 2016","checkedAt":"2026-10-08","sourceUrl":"https://www.ilcc2026.org/en/about/previous-conferences"}],"title":"沿革と開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryは5名で、University of LeedsのHelen Gleeson氏やKAISTのDong Ki Yoon氏が含まれます。invited keynoteには、University of Colorado BoulderのNoel Clark氏やEindhoven University of TechnologyのAlbert P.H.J. 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evidence.","rows":[{"role":"sponsor listing","tier":"Sponsor","sourceUrl":"https://orion.polito.it/iolts/supporters/","organization":"IEEE","sourceStatus":"extractor_v0_source_checked","countryRegion":"United States","organizationType":"professional_society"},{"role":"sponsor listing","tier":"Sponsor","sourceUrl":"https://orion.polito.it/iolts/supporters/","organization":"IEEE Council on Electronic Design Automation","sourceStatus":"extractor_v0_source_checked","countryRegion":"United States","organizationType":"professional_society"},{"role":"sponsor listing","tier":"Sponsor","sourceUrl":"https://orion.polito.it/iolts/supporters/","organization":"IEEE Computer Society Test Technology Technical Council","sourceStatus":"extractor_v0_source_checked","countryRegion":"United States","organizationType":"professional_society"}],"label":"IOLTS 2026 sponsor listings","sourceUrl":"https://orion.polito.it/iolts/supporters/","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"3 official sponsor listing rows"}},"city":"Polignano a Mare","tier":"b","venue":"Hotel Covo dei Saraceni","country":"Italy","fieldId":"memory-reliability","editions":[],"genreIds":["reliability","circuits"],"processes":[{"id":"prc_8420d68149774e2d9c15468780c2f527","nameJa":"BIST（組込み自己テスト）","primary":true},{"id":"prc_a6f22e1b038f4c418b05dd9f3360ff02","nameJa":"テスト","primary":false},{"id":"prc_68c07e3f7bcd46508d80e56a7116cbb7","nameJa":"信頼性評価","primary":false}],"cycleLabel":"2026-07-01〜2026-07-03 / Hotel Covo dei Saraceni, Polignano a Mare (BA), Italy","fieldTitle":"Memory / Reliability / Failure Physics","organizers":[{"id":"org_02e2369d346a4c9f829698d1c9700f3c","name":"IEEE Computer Society"},{"id":"org_260508d3644b421582f47d43a4799b17","name":"IEEE Council on Electronic Design Automation"},{"id":"org_d07e6cb9e0c948349ee13a840b2d6015","name":"Politecnico di Torino"}],"lastVerified":"2026-09-13","paperDeadline":"2026-03-08","currentCycleEnd":"2026-07-03","abstractDeadline":"2026-03-01","acceptanceNotice":"2026-04-26","peerReviewStatus":"peer-reviewed","currentCycleStart":"2026-07-01","canonicalId":"conf_df2ae3c30eac48798e5c362528e0d0bf","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"iolts","confidenceScore":1,"coverage":{"faqCount":6,"factCount":59,"topicCount":6,"sourceCount":12,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年7月1〜3日に、イタリアのPolignano a Mare（BA）にあるHotel Covo dei Saraceniで、全面対面で開かれました。第32回の開催です。","question":"IOLTS 2026はいつ、どこで開かれましたか？","sourceUrls":["https://orion.polito.it/iolts/","https://orion.polito.it/iolts/venue/"]},{"answer":"IEEE Council on Electronic Design Automation（CEDA）とIEEE Computer Society Test Technology Technical Community（TTTC）がスポンサーで、2026年はPolitecnico di Torinoが運営しました。","question":"主催・スポンサーはどこですか？","sourceUrls":["https://orion.polito.it/iolts/about/"]},{"answer":"投稿はA4二段組6ページ以内の完全原稿で、参考文献はページ数に含めません。採択はfull paper（6ページ）とposter（4ページ）の2区分です。","question":"投稿のページ数と区分は？","sourceUrls":["https://orion.polito.it/iolts/authors-reviewers/","https://orion.polito.it/iolts/camera-ready-preparation-2026/"]},{"answer":"Program Committeeが、IOLTSとの関連性、新規性、技術的妥当性、再現性、明瞭さ、期待される影響の6基準で査読します。ページ上限を超えた論文は査読せずに返却されます。","question":"どんな基準で査読されますか？","sourceUrls":["https://orion.polito.it/iolts/authors-reviewers/"]},{"answer":"IOLTS 2026の優秀論文は、IEEE Transactions on Device and Materials Reliability（TDMR）のIOLTS 2026特集号へ拡張版の投稿に招待されます。","question":"論文誌への道はありますか？","sourceUrls":["https://orion.polito.it/iolts/"]},{"answer":"公式のPast eventsページは1995年のNiceを第1回としています。2002年まではIOLTW、2003年からIOLTSの表記です。","question":"いつから開かれていますか？","sourceUrls":["https://orion.polito.it/iolts/past-events/"]}],"headline":"第32回のIOLTS 2026は、2026年7月1〜3日にイタリアのPolignano a Mare（BA）で全面対面開催として開かれました。","metaDescription":"IOLTS（IEEE International Symposium on On-Line Testing and Robust System Design）の2026年会期と会場、投稿条件と6つの審査基準、IEEE TDMR特集号、セッション構成、1995年からの開催地を公式ページから整理しました。","oneLine":"IOLTSは、マイクロエレクトロニクス回路・システムの堅牢性、オンラインテスト、信頼性設計、故障を使う攻撃への対策などの研究を発表する、IEEE CEDAとIEEE Computer Society TTTCがスポンサーのシンポジウムです。","pageTitle":"IOLTSとは｜オンラインテストと高信頼システム設計を発表するIEEEシンポジウム","relatedConferenceIds":["dfts","ets","itc","vts","asian-test-symposium","irps"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は7月1〜3日で、会場はPolignano a Mare（BA）のHotel Covo dei Saraceniでした。全面対面で開かれました。","facts":[{"label":"2026 会期・都市","value":"2026-07-01〜03 / Polignano a Mare 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Papersは信頼性設計、機能安全、ナノメートル世代の劣化・放射線・EMI、オンラインテスト、故障を使う攻撃と対策まで列挙しています。公式のAboutページは、セキュリティ攻撃がしばしば故障を起点とすることから、信頼性設計とセキュリティ設計の結び付きを説明しています。","facts":[{"label":"対象範囲の公式記述","value":"マイクロエレクトロニクス回路・システムの堅牢性に関するあらゆる側面","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/"},{"label":"2026 CfP トピック（信頼性設計）","value":"Design-for-Reliability、Cross-layer reliability approaches、Fault-Tolerant and Fail-Safe systems、Functional safety","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/"},{"label":"2026 CfP トピック（ナノメートル世代の課題）","value":"Variability, Aging, EMI, and Radiation Effects in nanometer technologies","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/"},{"label":"2026 CfP トピック（オンラインテスト）","value":"デジタル・アナログ・ミックスドシグナル回路のオンラインテスト、電流・温度・プロセス変動・劣化のオンライン監視","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/"},{"label":"2026 CfP トピック（セキュリティ）","value":"Design for Security、Fault-based attacks and 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DRAMのresilience architectureを事例にした講演と、KU LeuvenのNele Mentensによるフレキシブル基板上のセキュアチップの講演です。Visionary talkはSynopsysのYervant Zorianが「Quality and reliability challenges for multi-die in AI era」を話しました。Regular SessionにはCompute-in-Memory and Emerging AI Hardware ReliabilityやOnline Testing, Self-Test and Runtime Validationがあり、Special Sessionの一つはAIアクセラレータの信頼性を扱います。","facts":[{"label":"2026 Keynote 1","value":"Sudhanva Gurumurthi（AMD Fellow）「Architecting for Resilience at Scale: From Research to Practice」","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/keynote/"},{"label":"2026 Keynote 1 の事例","value":"HBM3に採用されたdie-stacked DRAMのresilience architecture","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/keynote/"},{"label":"2026 Keynote 2","value":"Nele Mentens（KU Leuven）「Ultra low-cost secure chips on flexible foil: challenges and opportunities」","checkedAt":"2026-10-08","sourceUrl":"https://orion.polito.it/iolts/keynote/"},{"label":"2026 Special 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2）で開かれました。","question":"ICICDT 2026はいつ、どこで開かれましたか？","sourceUrls":["https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"]},{"answer":"2026年はPDFでのオンライン投稿のみで、2〜4ページでした。投稿締切は2026年3月2日 23:59 GMT（延長表示あり）、最終原稿の締切は2026年4月30日 12:00 GMTです。","question":"論文のページ数と締切は？","sourceUrls":["https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf","https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"]},{"answer":"採択論文はすべて短い口頭発表を行い、続くポスターセッションで参加者と議論します。ポスターはA0縦です。","question":"採択されるとどのように発表しますか？","sourceUrls":["https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf","https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"]},{"answer":"2026年の採択論文は、IEEEが出版するICICDT-2026のproceedingsに収録されます。","question":"論文はIEEE Xploreで読めますか？","sourceUrls":["https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html","https://ieeexplore.ieee.org/xpl/conhome/11078014/proceeding","https://ieeexplore.ieee.org/xpl/conhome/10332255/proceeding"]},{"answer":"2026年のCFPは2004年から続く会議シリーズと書き、2026年を23回目としています。","question":"ICICDTはいつから続いていますか？","sourceUrls":["https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"]}],"headline":"ICICDT 2026は第23回として2026年6月22〜24日にドイツ・DresdenのFraunhofer IPMSで開かれました。","metaDescription":"ICICDT（International Conference on IC Design and Technology）の2026年会期、Fraunhofer IPMSによる運営、2〜4ページ論文の投稿条件、IEEE Xploreへのproceedings収録、tutorial・keynote構成、過去の開催地を公式ページから整理しました。","oneLine":"ICICDTは、IC設計・デバイス技術・プロセス工学の境界をテーマに、短い口頭発表とポスター討論を組み合わせて論文を発表するIEEEの国際会議です。","pageTitle":"ICICDTとは｜IC設計とデバイス・プロセス技術の境界を扱うIEEE国際会議","relatedConferenceIds":["iedm","vlsi","edtm","vlsi-dat","date"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は6月22日から24日の3日間で、会場はDresdenのFraunhofer IPMS（Maria-Reiche-Str. 2）でした。6月23日にはmightyTwice HotelのLindengartenでconference dinnerが開かれました。CFPは開催地を、Silicon Saxonyの中心にあるDresdenと位置づけています。","facts":[{"label":"2026 会期","value":"2026-06-22〜24 / Dresden, Germany / Fraunhofer IPMS","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 会場住所","value":"Maria-Reiche-Str. 2, 01109 Dresden, Germany","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 テーマ","value":"From Integrated Devices to Integrated Chiplets: Design, Device and System Innovation for the Future","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 開催地の位置づけ（CFP記載）","value":"Silicon Saxonyの中心にあるDresden","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 参加費（IEEE Member）","value":"早期550ユーロ / 通常650ユーロ（早期料金は2026-05-06まで）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 conference dinner","value":"2026-06-23、mightyTwice HotelのLindengarten","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"ICICDTはIC設計、デバイス技術、プロセス工学の三者の境界を扱う場として自らを説明しています。2026年CFPのトピックは材料・プロセスからパワー半導体、2.5D/3D chiplet集積、酸化物半導体・2D材料、RF/アナログ・ミックスドシグナル回路、DFM/歩留まり/テスト、SoC/SiP設計にわたります。","facts":[{"label":"会議の狙い（2026 CFP）","value":"IC設計・デバイス技術・プロセス工学の境界をつなぐ分野横断のフォーラム","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 トピック（パッケージ）","value":"Advanced packaging, lateral and vertical (2.5D and 3D) chiplet integration","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 トピック（材料・デバイス）","value":"Advanced materials and processing technologies / Power semiconductor technologies and circuits / Oxide Semiconductor, 2D Materials","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 トピック（回路）","value":"RF/analog, mixed-signal, ESD Protection devices and circuits","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 トピック（設計・製造）","value":"Design for manufacturing, yield, and test / System-on-Chip (SoC) and System-in-Package (SiP) design integration","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 技術セッション名","value":"Session 1: Chiplet Interfaces and Low Noise Amplifiers ほか計5セッション","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"CFPは、design-technology boundaryを示すオリジナル論文を募集しています。採択論文はすべて短い口頭発表とインタラクティブなポスターセッションの組み合わせで発表されます。2026年はAward ChairにUniversity of SalentoのStefano D'Amico氏が就き、最終日の16:30〜17:00にAward & Closingが組まれました。","facts":[{"label":"募集する論文（2026 CFP）","value":"design-technology boundaryを示すオリジナル論文","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"採択論文の発表形式","value":"短い口頭発表＋インタラクティブなポスターセッション","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 Award Chair","value":"Prof. Stefano D'Amico（University of Salento）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 表彰","value":"最終日 16:30〜17:00 に Award & Closing","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"審査と発表形式","eyebrow":"review"},"caveats":{"id":"caveats","body":"会議名はCFPと公式ページでIC Design and Technology、IEEE XploreのシリーズページでIntegrated Circuit Design and Technologyと表記が揺れます。CFPに採択率や査読方式（single/double-blind）の記載はありません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"CFPによるとシリーズは2004年から続き、2026年が23回目です。開催地は、2008年Grenoble、2009年Austin、2010年Grenoble、2011年Kaohsiung、2012年Austin、2013年Pavia、2014年Austin、2015年Leuven、2016年Ho Chi Minh City、2017年Austin、2018年Otranto、2019年Suzhouと続きました。2021年はFraunhofer IPMSの運営でオンライン開催され、2022年はHanoi、2023年はTokyo、2024年はSingapore、2025年はLecceでした。","facts":[{"label":"2025 開催地","value":"Lecce, Italy","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2022〜2024 開催地","value":"2024 Singapore / 2023 Tokyo, Japan / 2022 Hanoi, Vietnam","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2021 開催形式","value":"オンライン、Fraunhofer IPMS運営","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2021 会期（Fraunhofer IPMSの2021年ページ）","value":"2021-09-15〜17、デジタル開催","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2021/ICICDT2021.html"},{"label":"2012〜2019 開催地","value":"2019 Suzhou / 2018 Otranto / 2017 Austin / 2016 Ho Chi Minh City / 2015 Leuven / 2014 Austin / 2013 Pavia / 2012 Austin","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2008〜2011 開催地","value":"2011 Kaohsiung / 2010 Grenoble / 2009 Austin / 2008 Grenoble","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"沿革と開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年のtutorialには、広島大学のShuhei Amakawa氏によるRFIC設計の入門、Samsung ElectronicsによるGAAスケーリングと3D積層FETに向けたデバイス技術とDTCO、IntelのRwik Sengupta氏によるMixed-Height CellのDTCOがありました。keynoteは、TELのGert Leusink氏が半導体材料・プロセス、imecのArnaud Furnemont氏が将来の計算技術、MIPSのCheng Wang氏がAI向け回路設計を取り上げています。技術セッションは5つで、Session 4はニューロモルフィック・量子計算向けのデバイスとプロセスです。Fraunhofer IPMSのshowroomと200 mmクリーンルームのツアーも任意で用意されました。","facts":[{"label":"2026 Tutorial 1","value":"A Prelude to the Nuts and Bolts of RFIC Design（Shuhei Amakawa, Hiroshima University）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Tutorial 2","value":"Device Technologies and DTCO Strategy for GAA Scaling and Beyond toward 3D Stacked FETs（Samsung Electronics）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Keynote 1","value":"Challenges and opportunities for semiconductor materials and processes in the AI age（Gert Leusink, TEL）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Keynote 2","value":"Future compute technologies: realism and hopes（Arnaud Furnemont, imec）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Keynote 4","value":"Circuit Design for AI Applications（Cheng Wang, MIPS）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Session 4","value":"Novel Devices and Processes for Neuromorphic and Quantum Computing","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 併設見学","value":"Fraunhofer IPMSのshowroomと200 mmクリーンルームのツアー（任意）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"CFPはエンジニア、研究者、大学院生、教員を参加者として挙げています。参加費はIEEE Memberが早期550ユーロ・通常650ユーロ、IEEE Student Memberが早期450ユーロ・通常500ユーロで、早期料金は2026年5月6日までです。企業の調査担当者は、keynoteとtutorialの登壇者所属（TEL、imec、Samsung Electronics、Intelなど）と技術セッション名から、2026年に取り上げられた技術テーマを追えます。","facts":[{"label":"想定参加者（2026 CFP）","value":"engineers, researchers, graduate students, and professors","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 学生参加費（IEEE Student Members）","value":"早期450ユーロ / 通常500ユーロ","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Tutorial 4","value":"Extending DTCO Methodologies for Mixed-Height Cell evaluation（Rwik Sengupta, Intel）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"参加者と使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Conference on IC Design and Technologyで、略称はICICDTです。2026年のCFPはIEEEの名を冠した第23回と表記し、開催運営はFraunhofer IPMSが担いました。","facts":[{"label":"正式名称","value":"International Conference on IC Design and Technology","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 回次とIEEE表記","value":"23rd IEEE International Conference on IC Design and Technology (ICICDT 2026)","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 開催運営","value":"Fraunhofer IPMS（Dresden, Germany）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"IEEE Xplore上のシリーズ名","value":"IEEE International Conference on Integrated Circuit Design and Technology (ICICDT)","checkedAt":"2026-10-08","sourceUrl":"https://ieeexplore.ieee.org/xpl/conhome/11078014/proceeding"},{"label":"シリーズの開始","value":"2004年から開催されている会議シリーズ","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはFraunhofer IPMSのWenke Weinreich氏で、General Co-ChairはSOITECのBich-Yen Nuygen氏です。TPC ChairはFraunhofer IPMSのMaximilian Lederer氏、Co-ChairはUniversity of SalentoのAntonio Vincenzo Radogna氏で、Keynote ChairはHuawei Technologies、Tutorial ChairはSamsung Semiconductor Institute of Technologyの所属です。スポンサー欄には、Huawei、GlobalFoundries、Advanced Microtesting、Infineon、Chipmetrics、AlixLabs、Tokyo Electron、NY Creates、Silicon Saxonyの9つが掲載されています。","facts":[{"label":"2026 General Chair","value":"Dr. Wenke Weinreich（Fraunhofer IPMS）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 General Co-Chair","value":"Bich-Yen Nuygen（SOITEC）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 TPC Chair / Co-Chair","value":"Dr. Maximilian Lederer（Fraunhofer IPMS） / Prof. Antonio Vincenzo Radogna（University of Salento）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Keynote Chair","value":"Dr. Daniele Leonelli（Huawei Technologies）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 Tutorial Chair","value":"Dr. Dong-Won Kim（Samsung Semiconductor Institute of Technology）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 スポンサー掲載","value":"Huawei / GlobalFoundries / Advanced Microtesting inc. / Infineon / Chipmetrics / AlixLabs / Tokyo Electron / NY Creates / Silicon Saxony（スポンサーとしての掲載）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"運営体制とスポンサー","eyebrow":"community"},"comparison":{"id":"comparison","body":"ICICDTの公式ページは、自らをIC設計と半導体技術の両領域にまたがる協働の場と説明し、設計・デバイス・プロセスの分野横断を前面に出しています。採択論文を全件ポスター討論に回すworkshop-styleの形式を、CFPは会議の特徴として挙げています。","facts":[{"label":"自己規定（2026 公式ページ）","value":"IC設計と半導体技術の両領域にまたがる協働とイノベーションのフォーラム","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"形式上の特徴（2026 CFP）","value":"workshop-style format","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年の論文投稿はPDFによるオンライン投稿のみで、2〜4ページの範囲に収める決まりでした。投稿受付は2025年12月10日に始まり、締切は2026年3月2日（GMT 23:59）とされ、CFPには延長の表示もあります。採択後の最終原稿はIEEE PDF eXpressで作成し、2026年4月30日までに提出する流れでした。","facts":[{"label":"2026 投稿形式","value":"PDFによるオンライン投稿のみ、2〜4ページ","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 投稿サイト開設","value":"2025-12-10","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 投稿締切","value":"2026-03-02 23:59 GMT（CFPに Extended! の表示あり）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"label":"2026 最終原稿締切","value":"2026-04-30 12:00 GMT","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 最終原稿の作成","value":"IEEE PDF eXpress（Conference ID 69693X）","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 ポスター判型","value":"A0縦","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"}],"title":"投稿と締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年の採択論文はIEEEが出版するICICDT-2026のproceedingsに収録され、著者はEasyChair経由でIEEEの著作権契約に署名します。","facts":[{"label":"2026 proceedings","value":"IEEEが出版するICICDT-2026のproceedings","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2026 著作権契約の手続き","value":"EasyChair経由でIEEE copyright agreementに署名","checkedAt":"2026-10-08","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"label":"2025 proceedings（IEEE Xplore）","value":"2025 International Conference on IC Design and Technology (ICICDT)、2025年6月23〜25日、41件","checkedAt":"2026-10-08","sourceUrl":"https://ieeexplore.ieee.org/xpl/conhome/11078014/proceeding"},{"label":"2025 proceedings 収録件数","value":"41件","checkedAt":"2026-10-08","sourceUrl":"https://ieeexplore.ieee.org/xpl/conhome/11078014/proceeding"},{"label":"2023 proceedings（IEEE Xplore）","value":"2023 International Conference on IC Design and Technology (ICICDT)、2023年9月25〜28日、80件","checkedAt":"2026-10-08","sourceUrl":"https://ieeexplore.ieee.org/xpl/conhome/10332255/proceeding"}],"title":"論文集の出版","eyebrow":"publication"}},"sources":[{"url":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html","role":"official","label":"ICICDT 2026 公式ページ（Fraunhofer IPMS）","checkedAt":"2026-10-08","evidenceLocator":"タブ About the conference / Registration / Program / Keynotes / Tutorials / Authors / Sponsors / Committee / Past Conferences"},{"url":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf","role":"cfp","label":"ICICDT 2026 Call for Papers（PDF）","checkedAt":"2026-10-08","evidenceLocator":"IMPORTANT DATES / SCOPES AND TOPICS / PAPER SUBMISSION"},{"url":"https://www.ipms.fraunhofer.de/en/events/2021/ICICDT2021.html","role":"history","label":"ICICDT 2021（Fraunhofer IPMS）","checkedAt":"2026-10-08","evidenceLocator":"冒頭の紹介文"},{"url":"https://ieeexplore.ieee.org/xpl/conhome/11078014/proceeding","role":"proceedings","label":"IEEE Xplore: 2025 ICICDT proceedings","checkedAt":"2026-10-08","evidenceLocator":"会議見出し・DOI・件数表示"},{"url":"https://ieeexplore.ieee.org/xpl/conhome/10332255/proceeding","role":"proceedings","label":"IEEE Xplore: 2023 ICICDT proceedings","checkedAt":"2026-10-08","evidenceLocator":"会議見出し・DOI・件数表示"}],"summary":"ICICDTは2004年から続く会議シリーズで、2026年のCall for Papersは23rd IEEE International Conference on IC Design and Technologyと表記しています。2026年のテーマは「From Integrated Devices to Integrated Chiplets」で、Fraunhofer IPMSがDresdenで運営しました。論文は2〜4ページのPDFをオンラインで投稿し、採択論文は短い口頭発表のあとにポスターで討論する形式で発表されます。proceedingsはIEEEから出版されます。技術セッションは5つ組まれ、keynoteにはTEL、imec、MIPSの登壇者が並びました。","topics":[{"note":"2026年のテーマとCFPトピックの両方にchiplet集積が入っています。","label":"Chiplet integration（2.5D/3D）","sourceUrl":"https://www.ipms.fraunhofer.de/content/dam/ipms/common/documents/2025/ICICDT26_CallForPapers.pdf"},{"note":"2026年はGAAとDTCO、Mixed-Height CellのDTCOを扱うtutorialが2件組まれました。","label":"DTCO / GAA","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"note":"2026年のSession 4はニューロモルフィックと量子計算向けのデバイスとプロセスをまとめたセッションです。","label":"Neuromorphic / Quantum devices","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"note":"2026年のCFPのトピックにパワー半導体が入っています。","label":"Power semiconductors / GaN","sourceUrl":"https://www.ipms.fraunhofer.de/en/events/2026/ICICDT2026.html"},{"note":"2026年CFPのトピック一覧に独立した項目として挙がっています。","label":"Oxide Semiconductor, 2D 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Showcaseがありました。invited talk、panel、tutorialの提案も2026年4月6日締切で募集されました。","question":"論文以外に発表できる枠はありますか。","sourceUrls":["https://www.islped.org/2026/call-for-low-power-designs/","https://www.islped.org/2026/call-for-wit/","https://www.islped.org/2026/"]},{"answer":"2026年のcamera-ready案内は、採択論文・ポスターの会場での発表を必須とし、発表されなかった論文は出版から除外するとしています。","question":"採択されたらオンライン発表でもよいですか。","sourceUrls":["https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"]}],"headline":"ISLPED 2026は31st Editionとして2026年8月5〜7日にNorthwestern University（Evanston, Illinois, USA）で開かれました。","metaDescription":"ISLPED（International Symposium on Low Power Electronics and Design）の主催、2026年会期と会場、投稿区分と締切、double-blind査読、ACMによるproceedings、プログラム構成を公式ページから整理しました。","oneLine":"ISLPEDは、プロセス技術から回路、EDA、システムソフトウェアまで、低消費電力のエレクトロニクスと設計に関する研究発表を集めるACM/IEEEの年次シンポジウムです。","pageTitle":"ISLPEDとは｜低消費電力の回路・設計・システムを発表するACM/IEEEシンポジウム","relatedConferenceIds":["dac","iccad","asp-dac","date","glsvlsi","cool-chips"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は8月5〜7日の3日間で、会場はNorthwestern UniversityのNorris University Center（Evanston, Illinois）でした。デザインコンテストのデモは現地での実演が必須で、採択論文も現地で発表されなければ出版から外れます。前年の2025年はアイスランド大学（Reykjavik）で開催されました。","facts":[{"label":"2026 会期","value":"2026-08-05〜07","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 会場","value":"Norris University Center, Northwestern University（1999 Campus Drive, Evanston, IL 60208, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/venue/"},{"label":"2026 開催都市","value":"Evanston, Illinois, USA（Chicagoの北、Lake Michigan沿い）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/venue/"},{"label":"2026 発表形式","value":"採択論文・ポスターは会場での発表が必須","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"},{"label":"2026 Design Contest のデモ形式","value":"現地でのデモが必須","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"},{"label":"2025 会期・会場（前サイクル）","value":"2025-08-06〜08 / University of Iceland, Reykjavik","checkedAt":"2026-10-08","sourceUrl":"https://islped.org/2025/"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"対象はプロセス技術、アナログ/デジタル回路、シミュレーションと合成ツール、AI/ML活用のEDA/CAD、システムレベル設計、システムソフトウェアと応用までの低消費電力全般です。2026年は3本の主要トラックとIndustrial Design Trackで募集され、Track 3にはAI/MLハードウェア、量子計算、新原理計算がまとめられました。Track 1.1にはデバイス、配線、ロジック、メモリ、2.5/3D、冷却、harvestingなどの低消費電力技術が含まれます。","facts":[{"label":"2026 対象領域","value":"process technologies, analog/digital circuits, simulation and synthesis tools, AI/ML-enhanced EDA/CAD, system-level design, optimization, system software, applications","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Track 1","value":"Technology, Circuits, and Architecture（1.1 Technologies and Circuits / 1.2 Logic and Architecture）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Track 2","value":"EDA, Systems, and Software（2.1 CAD Tools and Methodologies / 2.2 Systems and Platforms / 2.3 Software and Applications / 2.4 Hardware and System Security）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Track 3","value":"AI/ML, Quantum and Emerging Hardware（3.1 Analog, Mixed-Signal & Emerging AI Hardware / 3.2 Digital AI Hardware & Systems / 3.3 Quantum Computing and Emerging Computing Technologies）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Track 4","value":"Industrial Design Track（産業規模の設計で得た課題・解法・教訓を報告する論文）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Track 1.1 に含まれるデバイス・プロセス系の語","value":"device, interconnect, logic, memory, 2.5/3D, cooling, harvesting など。DTCO for low power も明記","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"}],"title":"対象分野・トラック","eyebrow":"scope"},"review":{"id":"review","body":"2026年の論文査読はdouble-blindで、投稿は匿名にする必要があります。PDFメタデータに著者情報が残るなど、blind-reviewの要件を満たさない投稿は査読なしで不採択です。利益相反には、直近4年以内の共同研究者も含まれます。Design Contestはライブデモとプレゼンテーションの質で賞を決めます。","facts":[{"label":"2026 査読方式","value":"Double-blind","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 匿名性違反の扱い","value":"blind-review要件を満たさない投稿は査読なしで不採択","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026CfP_V9.pdf"},{"label":"2026 利益相反（共同研究）","value":"直近4年以内の共同研究者は利益相反","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Design Contest の審査観点","value":"ライブデモとプレゼンテーションの質","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"},{"label":"2026 Design Contest の対象外","value":"最適化手法・アルゴリズムのみ、または実装を伴わないツール・シミュレーションのみの応募","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"}],"title":"査読","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年CfP PDFの締切時刻は11:59 PST、Webサイトは11:59 PM AoEと書かれており、表記が揃っていません。WIT Co-Chairの所属もPDF（Yale Univ.）とWebの委員一覧（University of Southern California）で異なります。テンプレートは2025年のIEEE Paper Templateから2026年はACMテンプレートへ変わっています。","facts":[{"label":"2026 CfP PDF の締切時刻表記","value":"11:59 PST（WebサイトはAoE）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026CfP_V9.pdf"},{"label":"2026 Webサイトの締切時刻表記","value":"11:59 PM Anywhere on Earth","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"WIT Co-Chair 所属（Web委員一覧）","value":"Priya Panda · University of Southern California（CfP PDFではYale Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/committee/"},{"label":"2025 のテンプレート","value":"IEEE Paper Template（2026年はACM）","checkedAt":"2026-10-08","sourceUrl":"https://islped.org/2025/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"2026年サイトのPast Eventsには2001年から2025年までの各年サイトへのリンクが並びます。2026年は31st Editionと表示されています。開催地は2025年がアイスランド、2026年が米国イリノイ州でした。","facts":[{"label":"公式アーカイブの範囲","value":"ISLPED 2001〜2025の過去サイトへのリンク","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/past-events/"},{"label":"アーカイブ最古の年","value":"ISLPED 2001","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/past-events/"},{"label":"2026 回次","value":"31st Edition","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2025 開催地","value":"University of Iceland, Reykjavik, Iceland","checkedAt":"2026-10-08","sourceUrl":"https://islped.org/2025/"},{"label":"2025 Track 3 の名称（前サイクル）","value":"Crosscutting Themes (AI/ML Hardware & Hardware Security)","checkedAt":"2026-10-08","sourceUrl":"https://islped.org/2025/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年は3日間の各日にkeynoteが1件ずつあり、Princeton University/EnCharge AI、University of Twente/University of Münster、SK hynixの講演者がin-memory computing、非線形計算、near-data computingを論じました。セッションはAとBの2会場で並行し、Best Paper Candidateに印が付きます。ほかにneuromorphic testbedsのSpecial Session、GenAIによる半導体設計のパネル、ポスター、Design Contestのデモ、WITの学生lightning talkが組まれました。","facts":[{"label":"2026 Keynote（Day 1）","value":"Naveen Verma（Princeton University / EnCharge AI）: In-Memory Computing for Next-Generation AI","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Keynote（Day 2）","value":"Wilfred G. van der Wiel（University of Twente / University of Münster）: Reconfigurable Nonlinear Computing in Silicon","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Keynote（Day 3）","value":"Hoshik Kim（SK hynix Inc.）: Near-Data Computing: The Energy Imperative","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Special Session","value":"Advancing Neuromorphic Testbeds（memristor・magnetic・superconducting技術）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/final-program/"},{"label":"2026 Panel","value":"Accelerating Silicon Innovation with GenAI（Moderator: AMD、Panelists: USC / Princeton / Cadence）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/final-program/"},{"label":"2026 セッション運営","value":"Session AとBを2会場（Louis South / Louis North）で並行、Best Paper CandidateにBPC表示","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/final-program/"},{"label":"2026 Women in Technology Showcase","value":"学部・大学院の学生によるlightning talk（abstract 300 words以内、締切 2026-05-29）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-wit/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生にはWIT Showcase（学部・修士・博士のフルタイム学生対象）があり、採択者は1日無料パスか、3日間学生パスの50%追加割引を選べます。Design Contestでは発表著者の登録費が50%割引になります。企業の調査担当者は、Industrial Design Trackと企業所属の講演・パネルから、AMD、SK hynix、Cadenceなどの技術者が低消費電力設計をどう論じているかを追えます。","facts":[{"label":"2026 WIT Showcase の対象","value":"BS/MS/PhDのフルタイム学生","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-wit/"},{"label":"2026 WIT 採択者の参加特典","value":"1日無料パス、または3日間学生パスの50%追加割引","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-wit/"},{"label":"2026 Design Contest 発表者の割引","value":"登録費50%割引","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"},{"label":"2026 登録費（Early Bird、ACM/IEEE会員）","value":"Professional Member $750、Student Member $450（6月30日まで）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/registration/"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"2026年サイトの正式表記はACM/IEEE International Symposium on Low Power Electronics and Designで、ACMとIEEEがTechnical Sponsorsとして並びます。2026年は31st Editionと表示されています。シリーズ全体はExecutive Committee（steering committee）が見ています。","facts":[{"label":"正式名称（2026年サイト表記）","value":"ACM/IEEE International Symposium on Low Power Electronics and Design","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"略称","value":"ISLPED","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Technical Sponsors","value":"ACM / IEEE","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 回次","value":"31st Edition","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"シリーズ運営組織","value":"Executive Committee（steering committee）、Chair: Massoud Pedram（University of Southern California）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/executive-committee/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral Co-ChairsはPurdue UniversityとAMD、Technical Program Co-ChairsはUniversity of Southern CaliforniaとNortheastern Universityで、大学と企業の双方から委員が出ています。Executive Committeeには日本からThe University of Tokyoの委員が含まれます。2026年プログラムの所属表記には国コードが付き、Shibaura Institute of Technology（JP）のほかIBM Research（CH）やSTMicroelectronicsの名前もあります。2025年のDesign Contest AwardはKyoto Universityのsub-nW CMOS timerでした。","facts":[{"label":"2026 General Co-Chairs","value":"Younghyun Kim（Purdue University）/ Srividhya Venkataraman（AMD）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/committee/"},{"label":"2026 Technical Program Co-Chairs","value":"Mehdi Kamal（University of Southern California）/ Aatmesh Shrivastava（Northeastern University）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/committee/"},{"label":"2026 Industrial Liaison","value":"Adam Teman（Bar-Ilan University）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/committee/"},{"label":"Executive Committee の日本所属委員","value":"Hiroshi Nakamura（The University of Tokyo）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/executive-committee/"},{"label":"2026 プログラムの日本所属","value":"Shibaura Institute of Technology（JP）を含む共著論文がSession 1Bで発表","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/final-program/"},{"label":"2026 プログラムの企業所属の例","value":"IBM Research（CH）とSTMicroelectronics（IT/IN/CH）の共著ポスター","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/final-program/"},{"label":"2025 Design Contest Award（前サイクル）","value":"Kyoto Universityのsub-nW CMOS timer","checkedAt":"2026-10-08","sourceUrl":"https://islped.org/2025/"}],"title":"運営体制・参加者の所属","eyebrow":"community"},"comparison":{"id":"comparison","body":"ISLPEDは自らの範囲を、プロセス技術とアナログ/デジタル回路から、シミュレーション・合成ツール、システムレベル設計、システムソフトウェアと応用までと書いています。2026年のIndustrial Design Trackは通常論文と同じ締切で産業規模の設計の課題と教訓を扱い、Low Power Design Contestは電力・エネルギー効率を高める設計とシステム解の実演を募りました。","facts":[{"label":"公式の範囲記述","value":"process technologies and analog/digital circuits から system software and applications まで","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Industrial Design Track の位置付け","value":"通常論文と同じ締切・同種のトピックで、産業規模設計の課題と教訓を報告する","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Design Contest の目的","value":"電力・エネルギー効率を高める設計とシステム解の実演","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年の論文投稿はabstract登録（3月11日）とfull paper（3月18日）の2段階で、締切はいずれも延長後の日付です。本文は6ページ以内のdouble-column、参考文献専用に1ページを追加でき、ACMのconference proceedingsテンプレートを使います。採択通知は5月18日、camera-readyは6月15日でした。論文とは別に、2ページのデモabstractによるLow Power Design Contestと、学生向けWIT Showcaseの募集がありました。","facts":[{"label":"2026 Abstract submission","value":"2026-03-11（当初 2026-03-09 から延長）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Full paper deadline","value":"2026-03-18（当初 2026-03-16 から延長）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Acceptance notification","value":"2026-05-18","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Camera-ready","value":"2026-06-15","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 ページ数・書式","value":"6ページ以内・double-column＋参考文献専用1ページ、ACM Conference proceedings template、US Letter","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-papers/"},{"label":"2026 Invited talk / panel / tutorial 提案締切","value":"2026-04-06","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"},{"label":"2026 Low Power Design Contest","value":"2ページのdemo abstract、締切 2026-05-25（AoE）、通知 2026-06-14","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"},{"label":"2026 投稿システム","value":"SoftConf（softconf.com/p/islped2026/）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/"}],"title":"投稿・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年のproceedingsはACMのsigconfテンプレートで作られ、IEEEテンプレートの論文は修正のため差し戻されます。ACM主催会議の2026年採択論文はOpen Accessで公開され、APCは補助後でACM/SIG会員が$250、非会員が$350です。採択論文は1件ごとにフル登録が必要で、発表されなかった論文は出版から除外されます。Design Contestの2ページdemo abstractもACM/IEEE proceedingsに掲載されます。","facts":[{"label":"2026 proceedings テンプレート","value":"ACM \"sigconf\"（IEEEテンプレートの論文は修正のため差し戻し）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"},{"label":"2026 公開範囲","value":"ACM主催会議の2026年採択論文はOpen Accessで公開","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"},{"label":"2026 APC（移行期の補助後）","value":"ACM/SIG会員 $250、非会員 $350","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"},{"label":"2026 掲載条件（登録）","value":"論文1件につきフル登録1件","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/registration/"},{"label":"2026 掲載条件（発表）","value":"発表されなかった論文は出版から除外","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/assets/files/ISLPED2026_Camera-Ready_Instructions.pdf"},{"label":"2026 Design Contest abstract の掲載","value":"採択デモの2ページabstractをACM/IEEE proceedingsに掲載（著者の申し出がない限り）","checkedAt":"2026-10-08","sourceUrl":"https://www.islped.org/2026/call-for-low-power-designs/"}],"title":"論文の掲載先","eyebrow":"publication"}},"sources":[{"url":"https://www.islped.org/2026/","role":"official","label":"ISLPED 2026 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"ヘッダー（名称・31st Edition）、The Symposium、Upcoming Dates、Keynotes、Technical Sponsors"},{"url":"https://www.islped.org/2026/call-for-papers/","role":"cfp","label":"ISLPED 2026 Call for Papers","checkedAt":"2026-10-08","evidenceLocator":"Topics of interest（Track 1〜4）、Submission、Conflict-of-Interest Definitions"},{"url":"https://www.islped.org/2026/assets/files/ISLPED2026CfP_V9.pdf","role":"cfp","label":"ISLPED 2026 Call for 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December 2025、要旨締切が extended until 15 March 2026、採択通知が postponed to 24 April 2026、論文締切が extended until 21 June 2026 です。Call for Papers PDF には当初日程（March 1 / April 5 / May 31, 2026）が残っているため、締切は Submissions ページ側を参照してください。","question":"投稿の締切はいつですか。要旨だけで足りますか。","sourceUrls":["https://www.estc-conference.net/submissions/","https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"]},{"answer":"Technical Program Committee ページに「Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.」とあり、10 のサブコミッティが要旨と本文の双方を査読する体制です。Steering Committee については品質と戦略の統括にあたると記載されています。一方で double-blind か single-blind かの別は公式ページでも未掲載です。","question":"査読はありますか。二重盲検ですか。","sourceUrls":["https://www.estc-conference.net/technical-program-committee/","https://www.estc-conference.net/estc-steering-committee/"]},{"answer":"採択率としての数値は未公表です。数量が読み取れるのは 2020年大会の振り返りページで、「124 presented papers, extracted from 194 submitted abstracts」と記載され、あわせて 245 registered attendees、24 countries が載っています。2026 サイクルの投稿件数・採択件数は Submissions ページでも未掲載です。","question":"採択率は公開されていますか。","sourceUrls":["https://www.estc-conference.net/previous-conferences/estc-2020/","https://www.estc-conference.net/submissions/"]},{"answer":"Call for Papers に「Accepted contributions will be published in the conference proceedings, and archived in IEEE Xplore (provided they comply with specifications).」とあり、proceedings 掲載と IEEE Xplore 収録が示されています。Submissions ページの Proceedings 節も括弧書きの条件を含めて同じ一文です。Call for Papers には「IEEE ESTC papers can be searched through IEEE, Google Scholar and other search engines.」も記載されています。ジャーナル特集号への招待は未掲載です。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf","https://www.estc-conference.net/submissions/"]},{"answer":"2026 の料金は、regular attendees が Early Bird €1,100.00 / Standard €1,300.00、presenting authors・committee・IEEE and IMAPS members が €970.00 / €1,150.00、students が €500.00 / €600.00 です。同ページに「All fees include 25.5% Finnish VAT.」と注記され、続けて「Fees cover access to all sessions, the exhibition, the welcome reception, the conference dinner and the conference proceedings.」と記載されています。早期割引の期限は同じページに June 21, 2026 と June 1, 2026 の2つの表記が併存しています。","question":"参加費はいくらですか。何が含まれますか。","sourceUrls":["https://www.estc-conference.net/registration/"]},{"answer":"Technical Program Committee の Chair・Co-Chair の所属は Fraunhofer IZM・Fraunhofer IWM・TU Dresden・Leibniz University Hannover・ECPE European Center for Power Electronics（Germany）、Aalto University・VTT（Finland）、University of South-Eastern Norway（Norway）、CEA LETI（France）、INEMI・Texas Instruments/Kilby Labs（USA）と印字され、Robert Bosch GmbH の行だけ所属名までの表記です。2026 の keynote は Nokia Solutions & Networks、IQM Quantum Computers、Infineon Technologies、imec、Unimicron Technology Corporation、ASE からの登壇です。スポンサー・出展社の掲載は、支援や出展の事実のみを示します。","question":"どの組織が登壇・運営に関わっていますか。","sourceUrls":["https://www.estc-conference.net/technical-program-committee/","https://www.estc-conference.net/keynotes/","https://www.estc-conference.net/exhibition-and-sponsoring/"]},{"answer":"Call for Papers は original, noncommercial papers を募集対象と印字しており、国や地域による限定については未掲載です。Student Travel Award の要件も「all full-time graduate students enrolled at an accredited institution in a program of study within the scope of IEEE ESTC」で、要旨の primary author であることが条件です。2020年大会の振り返りページには参加国の内訳として Japan 6 が載っています。ビザ招待状の発行手続きや日本語対応は公式サイトでは未掲載で、宿泊は Venue & Hotels ページに提携ホテルの料金と予約期限が並び、期限は 2026年8月9日 と 2026年9月1日 の2種類です。","question":"日本の研究室や企業からの参加・投稿はどう案内されていますか。","sourceUrls":["https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf","https://www.estc-conference.net/previous-conferences/estc-2020/","https://www.estc-conference.net/venue/"]}],"headline":"公式サイト、Call for Papers PDF、ConfTool 上のプログラム、IEEE EPS の告知ページから、2026年サイクルの会期・トピック・改訂後の締切・査読体制・収録先を拾い出しています。","metaDescription":"IEEE ESTC は IEEE-EPS 主催・IMAPS Europe 共催で欧州にて隔年開催される電子実装・システム統合の国際会議。2026年は9月9〜11日、Helsinki の Finlandia Hall。会期・10トピック・改訂後の締切・査読体制・IEEE Xplore 収録先を公式ページの原文から引用します。","oneLine":"IEEE ESTC は IEEE-EPS が sponsor、IMAPS Europe が co-sponsor となって欧州で隔年開催される電子実装・システム統合の国際会議で、2026年は第11回として9月9〜11日に Helsinki の Finlandia Hall で開かれます。","pageTitle":"ESTCとは|IEEE ESTC 2026の会期・投稿締切・査読体制・proceedings収録先をまとめた基礎ページ","relatedConferenceIds":["ectc","eptc","imaps-symposium","3dic","icept","epeps"],"sections":{"cycle":{"id":"cycle","body":"2026 サイクルは Helsinki の Finlandia Hall で9月9〜11日の3日間です。日付と会場は公式トップ、Venue & Hotels ページ、IEEE EPS の会議一覧の3か所で一致します。2028年の会期と開催地は未掲載のため、次回を追う場合は Previous Conferences ページと IEEE EPS の会議一覧を定期的に開き直すことになります。","facts":[{"note":"公式トップの日付表記","label":"2026 会期","value":"September 9–11, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/"},{"note":"公式トップの冒頭文","label":"2026 開催都市・国","value":"Helsinki, Finland","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/"},{"note":"Venue & Hotels ページの会場欄。国名は同ページで Finnland と綴られている","label":"2026 会場","value":"Finlandia Hall / Mannerheimintie 13e / 00100 Helsinki","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/venue/"},{"note":"IEEE EPS の Conferences ページの ESTC 行","label":"2026 会期・会場（IEEE EPS 側の記載）","value":"Finlandia Hall, Helsinki, Finland / Sep 09, 2026 - Sep 11, 2026","checkedAt":"2026-08-05","sourceUrl":"https://eps.ieee.org/conferences/"},{"note":"Previous Conferences 配下の ESTC 2024 振り返りページの末尾","label":"2026 開催地の告知","value":"We look forward to welcoming you all at IEEE ESTC 2026 in Helsinki!","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/estc2024/"},{"note":"Previous Conferences ページの一覧は 2024 まで。2026 より先の告知は未掲載","label":"次サイクル（2028）","value":"開催年・開催地とも未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/"}],"title":"2026 サイクルの会期・会場・開催形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"投稿先は 10 のトピックで構成され、Technical Program Committee のサブコミッティ名もこの 10 件と一致します。自分のテーマがどのサブコミッティへ回るかは、トピック名とその副題まで読み込むと判断がつきます。Call for Papers は noncommercial な論文を募ると印字しているため、製品紹介の比重が高い原稿は投稿前に構成を組み替える対象になります。","facts":[{"note":"Topics ページに 10 件が番号付きで並ぶ","label":"2026 トピック一覧","value":"Advanced Packaging / Materials for Interconnects and Packaging / Optoelectronic Systems Packaging / Assembly and Manufacturing Technologies / Design Tools and Modeling / Power Electronics System Packaging / Advanced Technologies for Emerging Systems / Reliability of Electronic Devices and Systems / Flexible, Printed and Hybrid Electronics / RF, mm-wave and THz Systems Packaging","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/topics/"},{"note":"Topics ページの当該トピック本文","label":"Advanced Packaging の副題","value":"Challenges and Solutions in 3D Integration, Embedded Structures, Wafer and Panel Level Packaging, Hybrid-bonding, Packaging Solutions for Chiplets, Advanced Substrates and Interposers Considering Reliability and Quality Aspects","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/topics/"},{"note":"Topics ページの当該トピック本文の冒頭。同じ本文には Thermal Management Challenges at the System Level と Reliability Plans for Quantum Photonic Subsystems Working at Cryogenic Temperatures も続く","label":"Optoelectronic Systems Packaging の副題","value":"Innovative Packaging Technologies for Quantum Photonic Subsystems, High Density Integration Technologies for SiPh","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/topics/"},{"note":"Topics ページの当該トピック本文。同じ本文に Integration Aspects of Wide Bandgap Power Semiconductor Devices も並ぶ","label":"Power Electronics System Packaging の副題","value":"High Performance Packaging (Low RDS(on), Low Rth, High Temperature, Fast-switching High-frequency Compatible)","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/topics/"},{"note":"Call for Papers 冒頭。noncommercial の語が入っている","label":"2026 募集対象の書き方","value":"The IEEE ESTC 2026 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"},{"note":"TPC ページのサブコミッティ見出し。Topics ページは Optoelectronic Systems Packaging が3番目、TPC ページは4番目","label":"トピックとサブコミッティの対応","value":"Technical Program Committee の 10 サブコミッティは Topics ページの 10 トピックと同じ名称で、掲載順だけが異なる","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"ConfTool のプログラム 9月9日 15:20–16:35 枠に並ぶ4本","label":"2026 セッションコードの例","value":"AP 1: Substrate Innovation / Rel 1: Reliability of Solder Joints / RF 1: System in Package Solutions for Radar Applications / Flex 1: Material Advances for Flexible Electronics","checkedAt":"2026-08-05","sourceUrl":"https://www.conftool.org/estc2026/sessions.php"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"査読は 10 のサブコミッティが要旨と本文の両方を対象とする体制で、その上に Technical Program Chair が立ちます。double-blind か single-blind かの別は公式ページでは未掲載で、所属を伏せる前提の指示も掲載範囲外です。採択率も未公表で、投稿要旨数と発表件数の対比が読み取れるのは 2020年大会の振り返りページです。","facts":[{"note":"Technical Program Committee ページの本文","label":"査読の担い手","value":"Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"Advanced Packaging と RF, mm-wave and THz Systems Packaging の Co-Chair、Power Electronics System Packaging の Chair は t.b.a. 表記","label":"2026 サブコミッティ数","value":"10（各トピックに Chair と Co-Chair）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"TPC ページ最上部。Executive Committee ページでは Program Chair (next GC) と併記","label":"2026 Technical Program Chair","value":"Grace O'Malley, INEMI, USA","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"Steering Committee ページの本文","label":"品質面の統括","value":"The ESTC Steering Committee is responsible for observing the general high-level quality of ESTC and for strategic decisions.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/estc-steering-committee/"},{"note":"同ページの記述はサブコミッティ構成と査読の担い手まで","label":"匿名査読の有無","value":"double-blind / single-blind の別は Technical Program Committee ページでは未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"2020年サイクルの数値であり、2026年サイクルの数値とは別","label":"採択率","value":"採択率としての数値は未公表。2020年大会ページに 124 presented papers, extracted from 194 submitted abstracts と記載","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/estc-2020/"}],"title":"査読体制と選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"このページの内容は 2026年8月5日に公式ページへ掲載されていた記述に基づきます。締切と早期割引期限は公式サイト内で複数の表記が併存するため、実務では Submissions ページと Registration ページを開き直してください。公式サイトと IEEE EPS の側で未公表のまま残るのは、採択率、査読が double-blind か single-blind かの別、本文のページ数上限と IEEE テンプレートと camera-ready 期限、オンライン配信や hybrid 参加の可否、そして 2028年大会の会期と開催地です。Previous Conferences ページの一覧が回次の数字を印字するのも 2008・2014・2016 の3行までです。Event & Media Partners ページはロゴ画像だけの構成で、社名は文字として未掲載のため、このページの収録範囲外としました。","facts":[{"note":"Call for Papers PDF の当初表記は Abstract March 1, 2026 / Notification April 5, 2026 / Paper May 31, 2026","label":"締切表記の差（2026）","value":"Submissions ページは extended until 15 March 2026 / postponed to 24 April 2026 / extended until 21 June 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/submissions/"},{"note":"公式サイトの 15 March 2026、Call for Papers の March 1, 2026 と合わせて3通りの日付が並ぶ","label":"IEEE EPS 側の締切表記","value":"Abstract Submission Date: Feb 26, 2026","checkedAt":"2026-08-05","sourceUrl":"https://eps.ieee.org/conferences/"},{"note":"スポンサー価格表の区切りも until June 1 / after June 1 の表記","label":"早期割引期限の二重表記","value":"The early bird phase is extended until June 21, 2026. と The early bird phase has been extended to June 1, 2026. の両方が同一ページに掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/registration/"},{"note":"登壇者名を数える場合は Keynotes ページ側","label":"keynote 人数の差","value":"Program ページは five distinguished packaging experts as keynote speakers、Keynotes ページには6名が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/keynotes/"},{"note":"会期前の同ページの掲載内容は発表当日の運用案内が中心","label":"本文書式の未掲載","value":"本文のページ数上限、IEEE テンプレート、PDF eXpress、camera-ready 期限は現行の Submissions ページでは未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/submissions/"},{"note":"所属名と国名の組み合わせが公式ページ上でそのまま印字されている","label":"所属表記の揺れ","value":"Design Tools and Modeling の Co-Chair は Chris Bailey, Arizona State University, UK と表記されている","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/technical-program-committee/"},{"note":"Executive Committee ページと Technical Program Committee ページの双方に未確定表記が残る","label":"未確定の委員ポスト","value":"Poster Chair は TBD、Advanced Packaging と RF, mm-wave and THz Systems Packaging の Co-Chair、Power Electronics System Packaging の Chair は t.b.a.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/executive-committee/"},{"note":"Previous Conferences ページの一覧は 2024 まで","label":"2028年大会","value":"会期・開催地とも掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/"}],"title":"未公開項目と表記の揺れ","eyebrow":"caveats"},"history":{"id":"history","body":"Previous Conferences ページの一覧は 2006年 Dresden から 2024年 Berlin まで偶数年で並び、2026年は公式トップで 11th と表記されています。開催地は Germany が繰り返し登場し、Helsinki は 2014年に続く2回目です。回次の数字が一覧に印字されるのは 2008・2014・2016 の3行だけなので、年と回次を対照する場合は各年の振り返りページを開くことになります。規模の数値をこのページで引いたのは 2020年と 2024年の振り返りページです。","facts":[{"note":"Previous Conferences ページの一覧で最も古い行。この行の表記は年・都市・国まで","label":"初回開催","value":"2006年 / Dresden, Germany","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/"},{"note":"Mission ページの冒頭文。premier venue は公式の自称表現をそのまま引用したもの","label":"シリーズ発足の記述","value":"Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/mission/"},{"note":"Previous Conferences ページの一覧表。回次の数字は 2008・2014・2016 の紹介文にだけ印字され、他の年は年・都市・国のみ","label":"開催地の推移","value":"2006 Dresden（Germany）→ 2008 Greenwich, London（UK、紹介文に 2nd edition）→ 2010 Berlin（Germany）→ 2012 Amsterdam（Netherlands）→ 2014 Helsinki（Finland、紹介文に 5th edition）→ 2016 Grenoble（France、紹介文に 6th edition）→ 2018 Dresden（Germany）→ 2020 Digital/Vestfold（Norway）→ 2022 Sibiu（Romania）→ 2024 Berlin（Germany）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/"},{"note":"ESTC 2020 振り返りページの本文","label":"2020年大会の形態","value":"ESTC 2020 was the first ESTC to take place completely on a virtual platform, enforced by the COVID-19 pandemic.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/estc-2020/"},{"note":"同ページに国別内訳（Germany 33, Norway 19, France 9, Belgium 8, Finland 8, Romania 7, UK 7, Japan 6）も掲載","label":"2020年大会の規模","value":"245 registered attendees / 124 presented papers, extracted from 194 submitted abstracts / 92 oral presentations in parallel sessions / 32 interactive poster presentations / 24 countries","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/estc-2020/"},{"note":"会期は Berlin | September 11 – 13, 2024","label":"2024年大会の規模","value":"430 delegates from 27 countries / 117 oral presentations, and 46 posters / 4 keynote speeches / Three Professional Development Courses (PDCs) / Five Special Sessions","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/previous-conferences/estc2024/"},{"note":"Mission ページ。EMPC は the major conference event organized by IMAPS Europe と書かれている","label":"EMPC との年次分担","value":"ESTC is held every even year, while EMPC, the IMAPS event, is held every odd year.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/mission/"}],"title":"沿革と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"2026 は oral 105 件・poster 108 件に、初日午前の PDC 8 講座、EPS HIR Workshop、special session 3 件、panel discussion 1 件が付きます。セッション単位の並びは ConfTool 上で公開され、AP・Rel・RF・Flex などのコードで最大4本が並行します。keynote は Program ページと Keynotes ページで人数の書き方に差があるため、登壇者を数えるときは Keynotes ページを開いてください。","facts":[{"note":"Program ページの本文。同ページには Please note that changes in the program may still occur. の注記が付く","label":"2026 発表件数","value":"105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/program/"},{"note":"Keynotes ページに印字された所属と所在国。Program ページ本文は five distinguished packaging experts as keynote speakers と書いている","label":"2026 keynote 登壇者","value":"Sami Repo（Nokia Solutions & Networks, Finland）／Dr. Jan Goetz（IQM Quantum Computers, Germany）／Thorsten Meyer（Infineon Technologies, Germany）／Joris Van Campenhout（imec, Belgium）／John H Lau（Unimicron Technology Corporation, Taiwan）／Dr. Christophe Zinck（ASE, France）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/keynotes/"},{"note":"Short Courses ページでは 08:00–10:15 と 10:30–12:45 の2枠に各4講座","label":"2026 professional development course","value":"eight professional development courses on the morning of the first conference day","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/program/"},{"note":"Short Courses ページの PDC Session 1 / 2 の一覧より","label":"2026 PDC の題目例","value":"Efficient Thermal Simulations Using Compact Models（Tamara Bechtold, Jade University of Applied Sciences, Germany）／Cu-Cu Hybrid Bonding and Glass Packaging（John H Lau, Unimicron Technology Corporation）／Integrated Photonic Packaging – Materials, Processes, Equipment, and Scaling to Production（Prof. Peter O'Brien, Tyndall Institute, University College Cork, Ireland）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/short-courses/"},{"note":"ConfTool のプログラムでは 9月9日に IEEE EPS Heterogeneous Integration Roadmap (HIR) I / II として並ぶ","label":"2026 併設ワークショップ","value":"an EPS HIR Workshop","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/program/"},{"note":"3件目は NanoIC・FAMES・APECS・WBG・PIXEurope の5件を主題とする","label":"2026 special session","value":"Quantum Chips and Their Packaging（9月10日 9:00–10:15am）／Skills Shortage in Electronics Packaging and Case Studies on Addressing It（9月10日 11:00am–12:15pm）／The First Five Pilot Lines Launched Under the Chips for Europe Initiative - Where We Are, and What's Next with Respect to Advanced Packaging（9月10日 1:45–3:00pm）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/special-sessions/"},{"note":"Panel Discussion ページの見出しと登壇者欄","label":"2026 panel discussion","value":"Sustainable Electronics: Emissions, Critical Materials and Circular Strategies（Thursday, September 10, 2026, 5:05pm – 6:20pm、モデレーター Prof. Mervi Paulasto-Kröckel, Aalto University）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/panel-discussion/"},{"note":"Conference Dinner ページの日時と会場欄","label":"2026 conference dinner","value":"Thursday, September 10, 2026, from 7:15 p.m. / Hilton Helsinki Kalastajatorppa, Kalastajatorpantie 1, 00330 Helsinki","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/conference-dinner/"}],"title":"2026 プログラムの構成","eyebrow":"program"},"audience":{"id":"audience","body":"学生は Bachelor/Master 区分の登録費が低く設定され、PDC には無料枠があります。大学院生には最大20件の渡航支援があり、要旨の primary author であることが条件です。企業側は出展・協賛の枠と価格が公開されているため、出展を選定するための数字はそのまま拾えます。","facts":[{"note":"Call for Papers の IEEE ESTC Student Travel Award 欄","label":"学生渡航支援","value":"The student travel grant program for IEEE ESTC awards up to 20 grants. The competition is open to all full-time graduate students enrolled at an accredited institution in a program of study within the scope of IEEE ESTC. The student must be listed as the primary author on the abstract.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"},{"note":"Submissions ページの見出し","label":"2026 学生コンペ","value":"Student Competition Challenge: Predictive Modeling and Design Optimization for Advanced Electronic Packaging","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/submissions/"},{"note":"Registration ページの料金表。同ページに All fees include 25.5% Finnish VAT. と併記","label":"2026 学生参加費","value":"Conference ticket for students: Early Bird €500.00 / Standard €600.00","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/registration/"},{"note":"Registration ページの料金表。同ページに All fees include 25.5% Finnish VAT. と併記","label":"2026 一般・著者参加費","value":"Conference ticket for regular attendees: Early Bird €1,100.00 / Standard €1,300.00／Conference ticket for presenting authors, committee, IEEE and IMAPS members: Early Bird €970.00 / Standard €1,150.00","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/registration/"},{"note":"Registration ページの Professional Development Courses 欄","label":"2026 PDC 参加費","value":"1 Course: Early Bird €250.00 / Standard €310.00、2 Courses: €400.00 / €500.00、Courses for Bachelor/Master students: €0.00","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/registration/"},{"note":"2026年8月5日時点の在庫表示。価格は until June 1, 2026 で Premium €5,099.61 net / Standard €3,346.62 net、after June 1, 2026 で Premium €5,976.10 net / Standard €3,904.39 net","label":"2026 出展枠の残数表示","value":"Premium Booth（Exhibition area 6 m², 3 m x 2 m）は SOLD、Standard Booth（Exhibition area 4 m², 2 m x 2 m）は 11 LEFT と表示","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/exhibition-and-sponsoring/"},{"note":"Program ページから Direct link to conference program として案内されている","label":"2026 プログラムの閲覧手段","value":"セッション別プログラムは ConfTool 上で公開（https://www.conftool.org/estc2026/sessions.php）","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/program/"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ESTC は IEEE-EPS が sponsor、IMAPS Europe が co-sponsor として名を連ねる会議で、公式表記は IEEE ESTC で通っています。回次は開催年ごとに更新され、2026年は 11th です。IEEE EPS 側のページでは ECTC・EPTC と同じ括りの EPS flagship conferences として登場するため、EPS のどの枠に属する会議かはこの節の facts から引けます。","facts":[{"note":"公式トップの冒頭文に印字された表記","label":"2026 正式名称","value":"The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026)","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/"},{"note":"Call for Papers 本文は IEEE ESTC、サイトのタイトルとドメインは ESTC","label":"略称","value":"IEEE ESTC / ESTC","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"},{"note":"Call for Papers 冒頭の記述をそのまま引用","label":"主催・共催","value":"It is sponsored by IEEE-EPS and co-sponsored by IMAPS Europe.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"},{"note":"Call for Papers 冒頭の1文","label":"開催頻度","value":"The conference is held biennially in Europe.","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/wp-content/uploads/2025/10/2026_CfP_ESTC.pdf"},{"note":"Mission ページの本文冒頭","label":"シリーズの発足主体","value":"Organized by IEEE-EPS (former CPMT) since 2006","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/mission/"},{"note":"IEEE EPS の 2026年6月 eNews 本文の一文をそのまま引用","label":"2026 IEEE EPS 側の呼称","value":"As the flagship conference of IEEE EPS in Europe, co-sponsored by IMAPS Europe, IEEE ESTC 2026 will be the largest electronics packaging and system integration conference in the region this year.","checkedAt":"2026-08-05","sourceUrl":"https://eps.ieee.org/enews/june-2026/conference-program-for-ieee-estc-2026-is-now-online/"},{"note":"同ページは ECTC・ESTC・EPTC をまとめて EPS flagship conferences と書いている","label":"IEEE EPS 会議一覧での表記","value":"2026 IEEE 11th Electronics System-Integration Technology Conference (ESTC)","checkedAt":"2026-08-05","sourceUrl":"https://eps.ieee.org/conferences/"}],"title":"会議の正体と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Executive Committee に印字された国は Finland・Germany・USA の3つで、Marketing Communications Chair の行だけ所属名までの表記です。Steering Committee には EPS の Vice President Conferences と Region 8 Director の席があります。TPC の Chair・Co-Chair は Fraunhofer 系と欧州の大学が中心で、産業側では Robert Bosch と Texas Instruments が入っています。スポンサーと出展社の一覧は、その企業が本大会を支援・出展した事実のみを示す掲載です。","facts":[{"note":"Executive Committee ページの筆頭","label":"2026 General Chair","value":"Toni Mattila, Business Finland, Finland","checkedAt":"2026-08-05","sourceUrl":"https://www.estc-conference.net/executive-committee/"},{"note":"Poster Chair は TBD のまま掲載されている","label":"2026 Executive Committee の役職","value":"General Chair / Program Chair (next GC) / Finance Chairs（Thomas Zerna, Karsten 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Xploreに載りますか？","sourceUrls":["https://ieee-isvlsi.github.io/ISVLSI_2026_Website/ieee-isvlsi/index.html","https://ieee-isvlsi.github.io/ISVLSI_2026_Website/call-for-papers/index.html"]},{"answer":"博士論文審査の前後1年以内の研究者を対象にResearch Forumがあります。選ばれると登録費が免除されます。","question":"博士課程の学生向けの枠はありますか？","sourceUrls":["https://ieee-isvlsi.github.io/ISVLSI_2026_Website/research-forum/index.html"]},{"answer":"2026年は1ページのLate Breaking Resultsが2026年6月1日締切で募集され、採択分はポスターで発表されました。","question":"締切後に出せる枠はありますか？","sourceUrls":["https://ieee-isvlsi.github.io/ISVLSI_2026_Website/late-breaking-research/index.html","https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"]}],"headline":"ISVLSI 2026は2026年7月7〜10日にインド・KolkataのITC Sonarで開かれ、初日にチュートリアルが組まれ、特別セッションは計15件でした。","metaDescription":"ISVLSI（IEEE Computer Society Annual Symposium on VLSI）の2026年会期（Kolkata）、6つのプログラムトラック、6ページ論文のblind review、IEEE Xplore収録とTVLSI特集号、LBR・User Design Track・Research Forum・量子ワークショップを公式ページから整理しました。","oneLine":"ISVLSIは、VLSI回路・システム・設計手法からnano/molecular devices、セキュリティ、AI、IoTまでVLSIの幅広い話題の研究発表を集めるIEEE Computer Societyの年次シンポジウムです。","pageTitle":"ISVLSIとは｜VLSI回路・CAD・post-CMOS・ハードウェアセキュリティのIEEE CSシンポジウム","relatedConferenceIds":["glsvlsi","vlsid","vlsi-soc","dac","date","iccad"],"sections":{"cycle":{"id":"cycle","body":"ISVLSI 2026は2026年7月7〜10日にインド・KolkataのITC Sonarで開かれました。7月7日（火）はチュートリアルの日で、チュートリアルは対面での実施が条件です。著者登録費には別途18% GSTが加算されます。","facts":[{"label":"2026 会期・会場","value":"2026-07-07〜10 / ITC Sonar, Kolkata, India","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/late-breaking-research/index.html"},{"label":"2026 会場","value":"ITC Sonar Kolkata","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/venue/index.html"},{"label":"2026 初日","value":"7月7日（火）にチュートリアル","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/program/index.html"},{"label":"2026 チュートリアルの形式","value":"対面のみ（hybrid・virtualは不可）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/tutorials/index.html"},{"label":"2026 著者登録費（海外・IEEE会員）","value":"USD 700（非会員USD 840、別途18% GST）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/registration/index.html"}],"title":"2026年の会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"シンポジウムの説明は、VLSI回路・システム・設計手法からシステムレベル設計、さらにnano/molecular devices、セキュリティ、AI、IoTといった新分野への展開、将来の設計手法とEDAツールまでを範囲に挙げます。2026年の論文募集は6つのトラックで、Emerging and Post-CMOS TechnologiesのトラックにはCNT、SET、QCA、可逆論理までが入ります。Call for PapersページのCRTトラックには、Power GaN Design and ReliabilityとDevice Modelingも加わっています。","facts":[{"label":"対象範囲","value":"VLSI回路・システム・設計手法、システムレベル設計、nano/molecular devices、セキュリティ、AI、IoT","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/ieee-isvlsi/index.html"},{"label":"EDA","value":"将来の設計手法と新しいEDAツールも主要テーマ","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/ieee-isvlsi/index.html"},{"label":"2026 トラック","value":"CRT（Circuits, Reliability, and Fault-Tolerance）/ CAD（Computer-Aided Design and Verification）/ DCF（Digital Circuits and FPGA based Designs）/ EPT（Emerging and Post-CMOS Technologies）/ SDS（System Design and Security）/ AFC（VLSI for Applied and Future Computing）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/call-for-papers/index.html"},{"label":"EPT トラックの範囲","value":"nanotechnology、molecular electronics、quantum devices、spin-based computing、CNT、SET、RTD、QCA、reversible logic など","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/call-for-papers/index.html"},{"label":"2026 CRT トラックの追加項目","value":"Power GaN Design and Reliability / Device Modeling","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/call-for-papers/index.html"},{"label":"SDS トラックの範囲","value":"hardware security、cryptography、IP protection、TRNG、PUF circuits など","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/call-for-papers/index.html"}],"title":"対象領域・トラック","eyebrow":"scope"},"review":{"id":"review","body":"主論文はblind reviewのために本文から著者リストを外して投稿し、投稿は未発表で他所で審査中でない論文に限られます。User Design Trackはdouble-blind reviewです。Research Forumは研究の質、ISVLSIとの関連、応募者の業績で選考されます。","facts":[{"label":"主論文の査読方式","value":"blind review（本文から著者リストを省く）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/cfp-paper-submission/index.html"},{"label":"二重投稿","value":"既発表・他所で審査中の論文は不可","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/cfp-paper-submission/index.html"},{"label":"User Design Track の査読","value":"double-blind review","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/user-design-track/index.html"},{"label":"Research Forum の選考基準","value":"研究の質、ISVLSIとの関連、応募者の業績","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/research-forum/index.html"},{"label":"2025 Best Paper Nominees の選定者","value":"Technical Program Committee","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2025_Website/"}],"title":"査読","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年の著者登録・camera-ready締切は、ISVLSI紹介ページが2026年5月10日、Call for Papersページと登録ページが5月20日と書いており、登録ページはさらに5月24日への延長を告知しています。TCVLSIの一覧は2021年版です。採択率と初回開催年は公式ページに記載がありません。","facts":[{"label":"2026 著者登録・camera-ready（ISVLSI紹介ページ）","value":"2026-05-10","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/ieee-isvlsi/index.html"},{"label":"2026 著者登録締切（登録ページ）","value":"20th May → 24th May, 2026","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/registration/index.html"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式サイトはシンポジウムが30年以上にわたってきたと説明し、Past Conferencesとして2012年から2025年の各年サイトへのリンクを並べています。2025年はギリシャのKalamataで7月6〜9日に開かれ、2021年はバーチャル開催でした。量子計算ワークショップQC-CSAAは2020・2021・2022・2024・2025年にも開かれました。","facts":[{"label":"歴史に関する公式記述","value":"30年以上（Over three decades）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/ieee-isvlsi/index.html"},{"label":"2025 開催","value":"Kalamata, Greece / 2025-07-06〜09","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2025_Website/"},{"label":"2021 開催","value":"Virtual / 2021-07-07〜09","checkedAt":"2026-10-08","sourceUrl":"https://tc.computer.org/tcvlsi/conferences/"},{"label":"QC-CSAAの過去開催","value":"2020, 2021, 2022, 2024, 2025","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/quantum-workshop/index.html"},{"label":"公式サイトのPast Conferences","value":"ISVLSI 2012〜2025の各年サイト","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"}],"title":"沿革・開催地","eyebrow":"history"},"program":{"id":"program","body":"7月7日のチュートリアルには、AMDのClock Domain Crossing and SynchronizationやGlobalFoundriesのPower GaN Devices & Systemsなどがありました。8〜10日のプログラムにはSpecial Session 5のHardware Verification using Large Language Modelsなど計15の特別セッション、Poster session 1〜3、Industry Forum PanelとAcademic Panel 1が入ります。keynoteにはUniversity of BremenのRolf Drechsler、Purdue UniversityのKaushik Roy、Stanford UniversityのSubhasish Mitraらと、Synopsys、Infineon Technologies、GlobalFoundries、Qualcommの講演者が並び、量子計算ワークショップQC-CSAAが併設されました。Banquet SpeakerはKU LeuvenのIngrid Verbauwhedeです。","facts":[{"label":"2026 keynote（大学）","value":"Rolf Drechsler（University of Bremen）/ Kaushik Roy（Purdue University）/ Subhasish Mitra（Stanford University）ほか","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"},{"label":"2026 keynote（企業）","value":"Amit Khanuja（Synopsys）/ Vinay Shenoy（Infineon Technologies）/ Sudipto Bose（GlobalFoundries）/ Sumit Goswami（Qualcomm）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"},{"label":"2026 チュートリアル（例）","value":"Clock Domain Crossing and Synchronization（AMD）/ Power GaN Devices & Systems（Global Foundries）ほか","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/program/index.html"},{"label":"2026 特別セッション（例）","value":"Special Session 5 – Hardware Verification using Large Language Models ほか計15","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/program/index.html"},{"label":"2026 併設ワークショップ","value":"2026 IEEE International Workshop on Quantum Computing: Circuits, Systems, Automation, and Applications (QC-CSAA)","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/quantum-workshop/index.html"},{"label":"2026 ポスター・パネル","value":"Poster session 1〜3 / Industry Forum Panel / Academic Panel 1","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/program/index.html"},{"label":"2026 Banquet Speaker","value":"Ingrid Verbauwhede（KU Leuven, COSIC）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"博士論文の審査前後1年以内の研究者はResearch Forumに応募でき、選ばれると登録費が免除され、Best PhD Poster賞の対象になります。企業の技術者にはスライド10枚以内で投稿するUser Design Trackがあり、採択者は発表動画の提出も求められます。学生も著者登録は正規料金です。","facts":[{"label":"Research Forum の対象","value":"博士論文審査の前後1年以内の研究者","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/research-forum/index.html"},{"label":"Research Forum の特典","value":"選考通過者は登録費免除、Best PhD Poster賞","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/research-forum/index.html"},{"label":"著者登録の条件","value":"学生を含め、1論文につき著者1名以上が正規のMember/Non-Member料金で登録","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/registration/index.html"},{"label":"User Design Track の発表義務","value":"採択投稿ごとに著者1名以上が登録・発表し、発表動画も提出","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/user-design-track/index.html"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はIEEE Computer Society Annual Symposium on VLSIで、略称ISVLSIです。IEEE Computer SocietyのTCVLSIは自らのConferencesページでISVLSIを資金協賛（financially sponsored/co-sponsored）会議の一つとして挙げています。名称の「Annual Symposium」のとおり毎年開かれています。","facts":[{"label":"正式名称","value":"IEEE Computer Society Annual Symposium on VLSI","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"},{"label":"TCVLSIでの位置づけ（2021年の一覧）","value":"TCVLSIのFinancially sponsored/co-sponsored conferencesに掲載","checkedAt":"2026-10-08","sourceUrl":"https://tc.computer.org/tcvlsi/conferences/"},{"label":"TCVLSIの協賛区分見出し","value":"TCVLSI Sponsored Conferences for 2021 / Financially sponsored/co-sponsored conferences","checkedAt":"2026-10-08","sourceUrl":"https://tc.computer.org/tcvlsi/conferences/"},{"label":"開催頻度","value":"年次（Annual Symposium）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のExecutive ChairはSynopsysのPrith Banerjee、General Co-ChairsはIIEST ShibpurのHafizur RahamanとブラジルUFRGSのRicardo Reisです。Advisory Committee Co-ChairsにはQualcomm、Marvell、Siemens EDAの所属者が入り、Technical Program Co-Chairsは米国の大学3名とUniversity of Calcuttaの1名です。Special Session Co-Chairsにはドイツ・Karlsruhe Institute of TechnologyのJürgen Beckerが入っています。","facts":[{"label":"2026 Executive Chair","value":"Prith Banerjee（Synopsys Innovation, USA）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/committees/index.html"},{"label":"2026 General Co-Chairs","value":"Hafizur Rahaman（IIEST Shibpur, India）/ Ricardo Reis（UFRGS Porto Alegre, Brazil）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/committees/index.html"},{"label":"2026 Advisory Committee Co-Chairs","value":"Sumit Goswami（Qualcomm, India）/ Navin Bishnoi（Marvell India）/ Veeresh Shetty（Siemens EDA）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/committees/index.html"},{"label":"2026 Technical Program Co-Chairs","value":"Sandip Kundu（UMass Amherst）/ Swarup Bhunia（University of Florida）/ Amlan Chakrabarti（University of Calcutta）/ Ujjwal Guin（Auburn University）","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/committees/index.html"},{"label":"2026 Special Session Co-Chairs（例）","value":"Jürgen Becker（Karlsruhe Institute of Technology, Germany）ほか","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/committees/index.html"}],"title":"運営体制","eyebrow":"community"},"comparison":{"id":"comparison","body":"ISVLSIは自らの範囲を、回路・システムの設計からnano/molecular devicesなどの新技術とEDAツールまでと書き、post-CMOSと量子計算を独立したトラックやワークショップに置いています。TCVLSIの2021年の一覧では、VLSI Design国際会議（VLSID）が技術協賛会議として並びます。2026年はスライドのみで投稿できるUser Design Trackを設け、産業界の取り組みを広く紹介する場としています。","facts":[{"label":"TCVLSIの技術協賛会議（2021年の一覧）","value":"VLSID, International Conference on VLSI Design","checkedAt":"2026-10-08","sourceUrl":"https://tc.computer.org/tcvlsi/conferences/"},{"label":"User Design Track の目的","value":"産業界の取り組みを広く紹介する場","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/user-design-track/index.html"}],"title":"近い会議との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"主論文は6ページ以内で200語以内のabstractを添え、IEEEの会議論文テンプレートで作成した単一PDFをEasyChairから投稿します。2026年の主論文締切は3月1日から3月15日 11:59 PM（IST）へ延長され、通知も4月30日から5月3日へ移りました。主論文以外に、1ページのLate Breaking Results（締切6月1日）、10枚以内のスライドで投稿するUser Design Track、量子計算ワークショップ（2ページ要旨または6ページ論文、締切4月15日）があります。","facts":[{"label":"主論文の分量","value":"最大6ページ + 200語以内のabstract","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/cfp-paper-submission/index.html"},{"label":"書式・投稿先","value":"IEEE Manuscript Template for Conference Proceedings / EasyChairに単一PDF","checkedAt":"2026-10-08","sourceUrl":"https://ieee-isvlsi.github.io/ISVLSI_2026_Website/cfp-paper-submission/index.html"},{"label":"2026 主論文締切","value":"2026-03-15 11:59 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Hall）で開かれました。主催は日本表面真空学会の未来真空エレクトロニクス部会です。","question":"IVNC 2026はいつ、どこで開かれましたか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/"]},{"answer":"A4・1ページのshort abstract（図表・参考文献込み、全フォント埋め込みPDF）を出し、program committeeが審査しました。2026年の締切は3月1日で、3月15日まで延長されました。","question":"投稿にはどんな原稿が必要でしたか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/abstract.html"]},{"answer":"会議後の論文はJournal of Vacuum Science and Technology B（JVST B）のSpecial Topic Collection on Vacuum Nanoelectronicsに投稿し、通常のJVST投稿と同じ基準で査読されます。2026年分の原稿締切は2026年10月15日です。","question":"論文はどこに掲載されますか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/authors.html"]},{"answer":"公式のpast conferences一覧では、1988年の第1回IVMC（米国ウィリアムズバーグ）から始まり、2004年の第17回からIVNCの名称になりました。2026年が第39回です。","question":"IVNCはいつから続いていますか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"]},{"answer":"学生またはポスドクの最優秀論文に贈るShoulders-Gray-Spindt Awardと、学生のStudent Presentation Awardがあります。SGS Awardには指導者の推薦状が必要です。","question":"学生向けの賞はありますか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/authors.html"]},{"answer":"scopeの材料区分にワイドバンドギャップ半導体が入り、2026年はKLAの半導体産業向け電子顕微鏡のplenaryや、GaN光カソードを半導体計測・検査に使う招待講演がありました。","question":"半導体とはどう関係しますか？","sourceUrls":["https://www.vacuum-electronics.org/ivnc2026/"]}],"headline":"第39回IVNC 2026は2026年7月13日〜17日に東京の日立馬場記念ホール（Hitachi Baba Memorial Hall）で開かれ、日本表面真空学会の未来真空エレクトロニクス部会が主催しました。","metaDescription":"International Vacuum Nanoelectronics Conference（IVNC）について、第39回東京会期、電子・イオン放出からX線源・電子顕微鏡応用までのscope、1ページshort abstractとprogram committee審査、JVST B特集、1988年IVMCからの開催地を公式ページから整理しました。","oneLine":"IVNC（International Vacuum Nanoelectronics Conference）は、真空と高電界の現象を使うマイクロ・ナノデバイス、つまり電界放出電子源やイオン源、X線源、電子顕微鏡用カソードなどの研究者が集まる国際会議シリーズです。","pageTitle":"IVNCとは｜電子源・電界放出・真空ナノエレクトロニクスの国際会議（第39回は2026年7月東京）","relatedConferenceIds":["eipbn","avs","jvss-annual-meeting","international-vacuum-congress","irmmw-thz"],"sections":{"cycle":{"id":"cycle","body":"IVNC 2026は2026年7月13日〜17日に東京の日立馬場記念ホールで開かれ、7月13日夕方にwelcome reception、16日午後にexcursionとbanquetが組まれました。会期はすでに終わり、7月24日に各賞の受賞者が発表されています。前年の第38回は2025年7月8日〜11日にアイスランドのReykjavík Universityで開かれました。","facts":[{"label":"2026 会期・会場","value":"2026-07-13〜17 / Hitachi Baba Memorial Hall, Tokyo, Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 welcome reception","value":"7月13日 17:00から（参加者は無料）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/program.html"},{"label":"2026 excursion・banquet","value":"7月16日 12:30〜21:00、banquetは八芳園","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/program.html"},{"label":"2026 受賞者発表","value":"2026-07-24","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2025 第38回（前回）","value":"2025-07-08〜11 / Reykjavík University, Iceland","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/"},{"label":"2026 参加登録費（早期）","value":"一般 JPY 65,000、学生 JPY 30,000（2026-04-22まで）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/registration.html"}],"title":"現行サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"scopeはEmission Fundamentals and Modeling、Novel Materials for Electron Emission and Vacuum Tunneling、Technology of Vacuum Nanoelectronics、Applications of Vacuum Nanoelectronicsの4区分です。材料側ではワイドバンドギャップ半導体、負の電子親和力、2D材料が並び、応用側ではX線源・イメージング、過酷環境用電子デバイス、電子顕微鏡と表面分析が入ります。","facts":[{"label":"2026 scope 1","value":"Emission Fundamentals and Modeling（電界・熱・光誘起の電子・イオン放出理論、液体金属イオン源、真空破壊）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 scope 2","value":"Novel Materials for Electron Emission and Vacuum Tunneling（CNT・グラフェン・ダイヤモンド、ワイドバンドギャップ半導体、NEA、2D材料）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 scope 3","value":"Technology of Vacuum Nanoelectronics（カソードデバイスと作製、光励起カソード、高速デバイス、熱電子エネルギーハーベスタ）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 scope 4","value":"Applications of Vacuum Nanoelectronics（X線源・イメージング、過酷環境の電子デバイス、顕微鏡・表面分析など）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"シリーズの対象例（シリーズ公式サイト）","value":"electron sources, plasmas, electric propulsion, X-rays, vacuum pumps, mass filters, harsh electronics など","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/"},{"label":"2026 発表形式","value":"oral sessions（招待講演を含む）とposter sessions","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"short abstractはprogram committeeが審査し、審査用で公開・出版はされません。abstractには具体的なデータを入れることが求められています。会議後のJVST B論文は会議の採択とは別に、JVSTの通常投稿と同じ基準で査読されます。","facts":[{"label":"short abstractの審査","value":"program committeeが審査","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"short abstractの扱い","value":"審査専用、公開・出版しない","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"short abstractの内容要件","value":"題目・著者・所属と、具体的なデータで研究を説明する本文","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"JVST B論文の査読","value":"通常のJVST投稿と同じ基準","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"会議採択と論文採択の関係","value":"会議発表の採択はJVST B掲載を保証しない","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"IVNC 2026の公式ページは会期を7月13日〜17日と書く一方で、本文に「a four-day conference」ともあり、日数の表記が揃っていません。シリーズ公式サイト（vacuumnanoelectronics.org）は2026-10-08時点で第38回（2025年）の案内のままで、次回IVNC 2027の会期・開催地は未掲載です。Steering Committeeの名簿は2025年版で、2026年の委員構成とは異なる可能性があります。採択率は公開されていません。","facts":[{"label":"会期日数の表記","value":"会期は5日間（7月13日〜17日）の表示と「four-day conference」の記述が併存","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"シリーズサイトの更新状況","value":"2026-10-08時点で第38回（IVNC 2025）の案内","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のpast conferences一覧は、1988年の第1回IVMC（米国ウィリアムズバーグ）から始まり、2003年の第16回（大阪）までIVMC、2004年の第17回（米国ケンブリッジ）からIVNCの名称を載せています。2019年は米国シンシナティでIVESCとの共同開催、日本では2018年の第31回が京都、2026年の第39回が東京でした。2020〜2022年はvirtual開催でした。","facts":[{"note":"開催地はWilliamsburg, USA。","label":"第1回","value":"第1回 IVMC（1988年）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"note":"開催地はOsaka, Japan。","label":"IVMCとしての最終回","value":"第16回 IVMC（2003年）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"note":"開催地はCambridge, USA。","label":"IVNC名称の初回","value":"第17回 IVNC（2004年）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"note":"2020・2021年はLyon、2022年はSeoulの主催でした。","label":"virtual開催","value":"第33回 IVNC 2020-Virtual（2021・2022年もVirtual）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"label":"2019 共同開催","value":"32 IVNC-IVESC 2019、Cincinnati","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"note":"開催地はKyoto, Japan。","label":"日本開催（直近の前回）","value":"第31回 IVNC（2018年）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"},{"note":"開催地はTokyo, Japan。","label":"2026 第39回","value":"第39回 IVNC（2026年）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/docs/PastConferences.xlsx.pdf"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryには、KLA CorporationのEdgardo Garcia氏（半導体産業向け電子顕微鏡）と、JEOLのYuji Kohno氏（磁性材料観察用電子顕微鏡）が登壇しました。招待講演にはPhoto electron SoulのTomohiro Nishitani氏（GaN光カソードによる光電子ビーム）やNEC Network and Sensor SystemsのYoshihiro Kajikawa氏（THz電子管）が名を連ね、ポスターはPoster Session 1・2で行われ、企業展示も受け付けました。","facts":[{"label":"2026 plenary","value":"Edgardo Garcia（KLA Corporation）\"Electron Microscopy for the Semiconductor Industry\"","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 plenary","value":"Yuji Kohno（JEOL Ltd.）\"Development of an Electron Microscope for the Observation of Magnetic Materials\"","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 invited（半導体計測）","value":"Tomohiro Nishitani（Photo electron Soul Inc.）\"GaN Photocathode-Based Photoelectron Beam for Semiconductor Metrology and Inspection\"","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 invited（THz電子管）","value":"Yoshihiro Kajikawa（NEC Network and Sensor Systems, Ltd.）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 企業展示","value":"メーカーの展示を受け付け","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 ポスターセッション","value":"Poster Session 1・2","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/program.html"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"Shoulders-Gray-Spindt Awardは学生またはポスドクの最優秀論文が対象で、指導者の推薦状が必要です。学生の参加費は一般の半額以下です。2026年のプログラムには、半導体産業向け電子顕微鏡のplenaryと、GaN光電子ビームを半導体計測・検査に使う招待講演が入りました。日本入国にビザが必要な参加者には、書類が提供されます。","facts":[{"label":"SGS Awardの対象","value":"学生またはポスドクの最優秀論文（指導者の推薦状が必要）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"SGS Awardの名称の由来","value":"Ken R. Shoulders、Henry F. Gray、Cap A. Spindt","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"2026 学生参加費（早期）","value":"JPY 30,000","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/registration.html"},{"label":"ビザ申請支援","value":"日本入国にビザが必要な参加者へ書類を提供","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Vacuum Nanoelectronics Conferenceで、2026年は第39回にあたります。IVNC 2026は日本表面真空学会の未来真空エレクトロニクス部会（Division of Future Vacuum Electronics）が主催し、Conference Chairは産業技術総合研究所のKatsuhisa Murakami氏でした。シリーズの公式サイトはvacuumnanoelectronics.orgで、2026年分は部会のサイトへ一時的に転送されています。","facts":[{"label":"正式名称・回次","value":"39th International Vacuum Nanoelectronics Conference（IVNC 2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 主催","value":"Division of Future Vacuum Electronics, the Japan Society of Vacuum and Surface Science","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 Conference Chair","value":"Dr. Katsuhisa Murakami（AIST）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"シリーズ公式サイト","value":"https://www.vacuumnanoelectronics.org/（2026年分は一時的に部会サイトへ転送）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"シリーズの対象（シリーズ公式サイト）","value":"真空・高電界現象を利用するマイクロ・ナノデバイスの科学と技術","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"IVNCにはInternational Steering Committeeがあり、2025年版の名簿ではSRI InternationalのChristopher Holland氏が委員長で、京都大学のYasuhito Gotoh氏や静岡大学のHidenori Mimura氏が名を連ねます。2026年の受賞者は千葉大学、京都大学、ドイツのLeibniz University、米国のMITの所属でした。","facts":[{"label":"International Steering Committee 委員長（2025年版名簿）","value":"Christopher Holland（SRI International）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/ivnc2025/conference-officials/"},{"label":"Steering Committee（日本の所属・2025年版名簿）","value":"Yasuhito Gotoh（Kyoto University）、Hidenori Mimura（Shizuoka University）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuumnanoelectronics.org/ivnc2025/conference-officials/"},{"label":"2026 Shoulders-Gray-Spindt Award","value":"Manato Tateno（Chiba University, Japan）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 Student Oral Presentation Award","value":"Aleksandra M. Buchta（Leibniz University, Germany）、Malick A. Sere（Massachusetts Institute of Technology, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"},{"label":"2026 Student Poster Presentation Award","value":"Tomoaki Osumi（Kyoto University, Japan）、Youngjin Shin（Massachusetts Institute of Technology, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/"}],"title":"運営・参加者","eyebrow":"community"},"submission":{"id":"submission","body":"2026年の投稿はA4・1ページのshort abstract（図表・文献込み、全フォント埋め込みPDF）で、締切は2026年3月1日から3月15日に延長されました。投稿システムはAMARYS-JTBで、採否と発表形式は2026年4月2日ごろに通知されました。会議後のJVST B論文の締切は2026年10月15日です。口頭発表は発表15分と質疑5分です。","facts":[{"label":"2026 short abstractの書式","value":"A4・1ページ（図表・参考文献込み）、全フォント埋め込みPDF","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"2026 short abstract締切","value":"2026-03-01（23:59 JST）、03-15に延長","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"2026 採否通知","value":"2026-04-02ごろ（発表形式も通知）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"投稿システム","value":"AMARYS-JTB system","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"2026 JVST B原稿締切","value":"2026-10-15","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"2026 口頭発表時間","value":"一般口頭発表は発表15分＋質疑5分","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"2026 ポスターボード","value":"900 mm（幅）× 2100 mm（高さ）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"}],"title":"投稿・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"IVNC 2026の論文はJVST BのSpecial Topic Collection on Vacuum Nanoelectronicsに投稿し、校正後すぐにJVST Bの次号にオンライン掲載されて、online Collectionにまとめられます。technical digestは、参加費に印刷版とUSBメモリ版が含まれます。シリーズ公式サイトによると、IVNC 2024（ブルノ）のTechnical DigestはIEEE Xploreで公開されています。","facts":[{"label":"2026 post-conference proceedings","value":"JVST Bのspecial issue（Special Topic Collection on Vacuum Nanoelectronics）","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/abstract.html"},{"label":"JVST Bでの掲載形態","value":"校正後すぐに次号オンライン掲載、online Collectionにまとめる","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/authors.html"},{"label":"2026 technical digest","value":"参加費に印刷版とUSBメモリ版を含む","checkedAt":"2026-10-08","sourceUrl":"https://www.vacuum-electronics.org/ivnc2026/registration.html"},{"label":"2024 Technical Digest","value":"IEEE Xploreで公開（IVNC 2024 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若手部会","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/section.html"},{"label":"2026 招待講演の例","value":"「多孔性金属錯体（MOF）の商業化最新動向 2026年4月」（樋口 雅一、京都大学高等研究院 iCeMS）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"},{"label":"2026 招待講演の例","value":"「ソーラー水素製造に向けた機能構造を有する光触媒シート」（嶺岸 耕、東京大学 先端科学技術研究センター）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"2026年大会の公式ページが示す選考は、若手を対象とした賞の選考です。若手の口頭発表にはNanoscale Horizons Award、ポスター発表には若手優秀ポスター発表賞が授与され、第23回大会からは若手優秀ポスター発表賞の受賞者の中からACS Publications Outstanding Poster Awardが選ばれています。Nanoscale Horizons Awardへの応募は、発表申込とは別に応募書類を提出する手続きでした。","facts":[{"label":"若手口頭発表の賞","value":"Nanoscale Horizons Award (RSC)","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"label":"ACS Publications Outstanding Poster Award の開始","value":"第23回大会から","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"label":"2026 Nanoscale Horizons Award の応募手続き","value":"発表申込に加えて別途応募書類を提出","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-submission.html"},{"note":"人数は受賞者一覧の掲載人数を数えた値","label":"2026 Young Best Presentation Award 受賞者数","value":"8名（若手優秀ポスター発表賞）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-awards.html"}],"title":"審査・表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"大会サイトは回ごとに別ドメインで作られ、第24回はorganosilica.com、第23回はsites.google.com上に置かれていたため、年度ごとにURLが変わります。19th International Symposium on Nanomedicineの会期は学会トップページと学会案内ページで表記が異なります（11/2〜4と11/22〜24）。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"ナノ学会は1997年発足の「超微粒子とクラスター懇談会」を前身とし、2003年に「ナノ学会」へ改組しました。大会は2003年5月29日〜31日の創立大会（神戸大学百年記念館六甲ホール）から続いています。2018年には東京大学で Asian Symposium on Nanoscience and Nanotechnology 2018が併催されました。2020年の第18回大会は現地開催が中止になり、2022年の第20回大会はZoomによるオンライン開催でした。2025年の第23回大会は東京都立大学南大沢キャンパスで開かれています。","facts":[{"label":"創立大会","value":"2003-05-29〜31 / 神戸大学 百年記念館六甲ホール","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/past_meeting.html"},{"label":"学会の前身と改組","value":"1997年「超微粒子とクラスター懇談会」発足、2003年「ナノ学会」へ改組","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"label":"2025 第23回大会","value":"2025-05-14〜16 / 東京都立大学南大沢キャンパス","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/past_meeting.html"},{"label":"2022 第20回大会の形式","value":"オンライン開催（Zoom利用）","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/past_meeting.html"},{"label":"2020 第18回大会","value":"横浜国立大学（常盤台キャンパス）、現地開催中止","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/past_meeting.html"},{"label":"2018 併催シンポジウム","value":"Asian Symposium on Nanoscience and Nanotechnology 2018（東京大学 武田先端知ビル）","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/past_meeting.html"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年の基調講演には、東京大学の高鍋 和広氏が水電解反応を、台湾National Cheng Kung UniversityのChen-Sheng Yeh氏が電気活性リポソーム膜とナノ粒子の組み合わせを取り上げた講演がありました。招待講演には、日本電子株式会社の研究者による電子顕微鏡のマルチスケール観察の講演も含まれます。併設展示は1区画に展示用テーブル1台（450mm×1800mm）が割り当てられました。","facts":[{"label":"2026 基調講演","value":"高鍋 和広（東京大学）「水電解反応の新展開 ― 動的イオン相互作用と非極pH反応場」","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"},{"label":"2026 基調講演","value":"Chen-Sheng Yeh（National Cheng Kung University, Taiwan）「Coupling Electroactive Liposome Membranes with Nanoparticles」","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"},{"label":"2026 招待講演（企業）","value":"春田 知洋（日本電子株式会社 ソリューション開発センター）「電子顕微鏡とその他観察技術を組み合わせたマルチスケール観察」","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"},{"label":"2026 併設展示の仕様","value":"1区画に展示用テーブル1台（450mm×1800mm）、出展料50,000円（税別）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-sponsor.html"},{"label":"2026 プログラム資料","value":"日程表とプログラムをPDFで掲載","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"2026年の事前参加登録費は会員9,000円、学生会員5,000円、非会員一般14,000円、非会員学生6,000円でした。大会期間中の宿泊費の一部を学部学生・大学院生に支援する宇部ステイ・アワードも設けられました。企業向けには、1口50,000円（不課税）の協賛、A4サイズ1ページ30,000円（税別）の予稿集広告、1区画50,000円（税別）の併設展示出展の枠が募集されています。","facts":[{"label":"2026 事前参加登録費","value":"会員9,000円 / 学生会員5,000円 / 非会員一般14,000円 / 非会員学生6,000円","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-registration.html"},{"label":"2026 学生宿泊支援","value":"宇部ステイ・アワード（学部学生・大学院生対象、宿泊費の一部を支援）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-awards.html"},{"label":"2026 予稿集広告","value":"A4サイズ後付1ページ、カラー、1ページ30,000円（税別）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-sponsor.html"}],"title":"参加する人へ","eyebrow":"audience"},"identity":{"id":"identity","body":"大会を主催するのはナノ学会（The Society of Nano Science and Technology）で、開催は年1回です。2026年の大会は第24回で、英語名はThe 24th Annual Meeting of the Society of Nano Science and Technologyです。運営はナノ学会第24回大会実行委員会が担いました。","facts":[{"label":"2026 正式名称（英語）","value":"The 24th Annual Meeting of the Society of Nano Science and Technology","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-home.html"},{"label":"主催学会","value":"ナノ学会（The Society of Nano Science and Technology）","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"label":"開催頻度","value":"年1回","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"label":"2026 回次","value":"第24回大会","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-home.html"},{"label":"2026 運営主体","value":"ナノ学会第24回大会実行委員会","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-home.html"},{"label":"2026 後援学会・団体","value":"応用物理学会、日本化学会、電子情報通信学会、日本物理学会、日本ＭＲＳなど19団体","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-home.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"第24回大会の実行委員長は山口大学大学院医学系研究科の中村 教泰氏でした。ナノ学会の会員数は2026年4月時点で474名で、そのうち学生会員が196名を占めます。2026年大会の予稿集広告には、東京化成工業、キーエンス、日本電子が掲載されています。","facts":[{"label":"2026 実行委員長","value":"中村 教泰（山口大学大学院 医学系研究科 教授）","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/section.html"},{"label":"学会の会員数（2026年4月）","value":"474名（個人256名、学生196名、賛助12社）","checkedAt":"2026-10-08","sourceUrl":"https://plaza.umin.ac.jp/nano/about.html"},{"note":"予稿集への広告掲載を示すもので、取引関係を示すものではありません","label":"2026 予稿集広告掲載","value":"東京化成工業株式会社、株式会社キーエンス、日本電子株式会社","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-home.html"},{"label":"2026 協賛の条件","value":"1口 50,000円（不課税）、1口につき1名の大会登録料無料と懇親会招待","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-sponsor.html"},{"label":"2026 招待講演者の所属国（海外）","value":"Taiwan（National Cheng Kung University）","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-program.html"}],"title":"運営・参加者","eyebrow":"community"},"submission":{"id":"submission","body":"2026年の発表形式は口頭発表かポスター発表で、発表言語は日本語か英語を選べ、投影資料とポスターは英語表記が推奨されました。発表申込と予稿提出は2026年3月6日の締切が3月16日に延長されています。予稿はA4×1枚で、フォントを埋め込みセキュリティロックを外したPDFとWordの両方を提出します。登壇者はナノ学会会員である必要があり、非会員は2026年4月3日までに入会手続きを終える必要がありました。","facts":[{"label":"2026 発表形式","value":"口頭発表またはポスター発表","checkedAt":"2026-10-08","sourceUrl":"https://www.organosilica.com/nano24-submission.html"},{"label":"2026 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の一部として2026年10月4日から9日まで、スペインの Barcelona で in-person 開催と公式トップページに記載されています。参加登録ページの区分では Main Conference が10月5〜7日、Tutorials が10月4日、MEMOCODE Symposium (incl. workshops) と Workshop が10月8〜9日、Virtual Education Classes が10月2日です。2025年サイクルは9月28日〜10月3日に台湾の Taipei で開催されました。2027年の会期・開催地は公式サイトに掲載されていません。","question":"CODES+ISSS は毎年いつ、どこで開催されますか。","sourceUrls":["https://esweek.org/","https://esweek.org/registration/","https://2025.esweek.org/"]},{"answer":"journal track は abstract が2026年3月23日（AOE）、full paper が3月30日（AOE, firm）で、first round notification が5月22日、改訂稿が6月19日（AOE, firm）、最終通知が7月17日、camera ready が8月17日です。late breaking track は6月5日（AoE, firm）提出で通知は7月17日です。いずれも2026年サイクルの日付であり、他年度の日付を流用することはできません。","question":"2026年の投稿締切はいつですか。","sourceUrls":["https://esweek.org/","https://esweek.org/codesisss-call-for-wip-papers/"]},{"answer":"double-blind の査読が課されます。author information ページには \"a double-blind review process will be enforced\" と明記され、preprint がある場合はタイトルを変更して追跡できないようにするよう求められています。journal track は初回査読を通過した論文が約3週間で改訂し第2段階の査読に進む2段階方式です。late-breaking track は \"All LB papers go through one stage of review.\" と記載された1段階の査読です。","question":"査読はありますか。どのような方式ですか。","sourceUrls":["https://esweek.org/author-information/"]},{"answer":"公表されていません。2026年サイクルの CFP ページ、author information ページ、program committee ページのいずれにも、採択率・投稿数・採択数の数値は掲載されていません。過去年の数値も公式ページからは読めないため、このページでは数値を置きません。","question":"採択率は公表されていますか。","sourceUrls":["https://esweek.org/codes_isss_cfp/","https://esweek.org/author-information/"]},{"answer":"2026年サイクルの author information は full length paper について \"published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)\" と記載し、late-breaking paper は IEEE Embedded Systems Letters（ESL）に掲載されると CFP に記載されています。2025年サイクルの CFP では full paper の掲載先が ACM Transactions on Embedded Computing Systems と記載されており、サイクルによって掲載誌の記述が異なります。会議録としては DBLP に CODES+ISSS 2025（ACM/IEEE, ISBN 979-8-4007-1992-9）などの巻が収録されています。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://esweek.org/author-information/","https://esweek.org/codes_isss_cfp/","https://2025.esweek.org/codes_isss_cfp/","https://dblp.org/db/conf/codesisss/index.html"]},{"answer":"公式ページは CODES+ISSS を \"a forum bringing together academic research and industrial practice for all aspects related to system-level and hardware/software co-design\" と記述しています。CFP の Track 9 は industrial practices and case studies として産業側からの実適用事例を明示的に受け付けています。program committee 名簿には大学のほか Intel、AMD、Apple、Microsoft、Amazon などの所属表記の委員が含まれますが、これは委員個人の所属であって投稿元や採択実績を示すものではありません。","question":"どういう人が投稿する会議ですか。","sourceUrls":["https://esweek.org/codes-isss/","https://esweek.org/codes_isss_cfp/","https://2025.esweek.org/codesisss-program-committee/"]},{"answer":"2026年サイクルの本会議（10月5〜7日）は IEEE/ACM Member が early €950・regular €1150、Non-Member が €1150・€1350、Student Member が €500・€600、Student Non-Member が €600・€700 です。tutorial は Member/Non-Member €250（early）、学生 €75（early）で、Virtual Education Classes は無料です。料金は \"All rates listed are in Euro and include VAT.\" と明記されています。early registration の締切は2026年8月31日、著者登録の締切は8月24日です。","question":"参加費はいくらですか。","sourceUrls":["https://esweek.org/registration/"]},{"answer":"発表は現地対面が条件です。author informationには「ESWEEK is a conference held exclusively in person」とあり、採択論文は著者1名のfull conference rateでの登録と著者によるin-person発表が必要です。2026年サイクルはBarcelona開催で、camera ready（8月17日）の直後に著者登録期限（8月24日）が来ます。公式full programは公開済みで、CODESセッションは10月5〜7日に掲載されています。会場施設名は今回確認したページでは分かりません。","question":"日本から参加する場合に注意する点はありますか。","sourceUrls":["https://esweek.org/author-information/","https://esweek.org/codes_isss_cfp/","https://esweek.org/registration/","https://esweek.org/schedule/","https://esweek.org/full-program/"]}],"headline":"ESWEEK 公式サイト（esweek.org / 2025.esweek.org）と DBLP の巻情報だけを読み、CODES+ISSS の2026年サイクルの締切・査読方式・掲載誌・参加費・委員会構成を原文ベースで並べます。","metaDescription":"CODES+ISSS（HW/SWコデザイン国際会議）を公式サイトの記述だけで整理。ESWEEK 2026 Barcelona の会期、journal track と late breaking の締切、double-blind査読、TCAD・ESL掲載、参加費を確認できます。","oneLine":"CODES+ISSS は IEEE/ACM Embedded Systems Week（ESWEEK）を構成する3会議のひとつで、system-level design と hardware/software co-design を対象に journal track と late breaking track で論文を募集する国際会議です。","pageTitle":"CODES+ISSSとは｜ESWEEK構成会議のHW/SWコデザイン国際会議、2026年サイクルの締切・査読・掲載先","relatedConferenceIds":["dac","iccad","date","asp-dac","islped","vlsi-soc"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルはBarcelonaでin-person開催です。公式full programは10月2日、4日、5〜9日の各日を選べる日程表を公開し、CODESの技術セッションを10月5〜7日に掲載しています。会場施設名は今回確認したページでは分からないため、渡航手配では公式サイトの更新を確認してください。","facts":[{"note":"トップページの原文。国は Spain。","label":"2026 会期・都市・形式","value":"\"ESWEEK 2026 will take place as an in-person event from October 4th to October 9th, 2026 in Barcelona, Spain.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"registration ページの登録カテゴリ行に印字された区分名と日付。同ページは会議ごとに登録を分けておらず、CODES+ISSS 個別の登録区分は設けられていない。","label":"2026 日程の内訳（参加登録の区分）","value":"Virtual Education Classes: Oct. 2 ／ Tutorials: Oct. 4 ／ Main Conference: Oct. 5–Oct. 7 ／ MEMOCODE Symposium (incl. workshops): Oct. 8–9 ／ Workshop (both days): Oct. 8-9 ／ Workshop (one day): Oct. 8 or Oct. 9","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/registration/"},{"note":"organizing committee ページの掲載。所属はページ表記のまま。","label":"2026 現地運営責任者","value":"Conference and Local Chair: Francisco J. Cazorla（BSC, Spain）／Conference and Local Co-Chair: Sergi Abadal（UPC, Spain）、Jaume Abella（BSC, Spain）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizing-committee/"},{"note":"公式2026 full programのdate/track filtersとCODESセッションを確認。個別項目に残るTBD表記は別途維持する。","label":"2026 full programの公開状況","value":"10月2日、4日、5〜9日の日別フィルタとCODESトラックを公開。CODESセッションは10月5〜7日に掲載。","checkedAt":"2026-10-14","sourceUrl":"https://esweek.org/full-program/"},{"note":"2025年サイクルの公式サイトのトップ表示。","label":"2025 会期・都市","value":"\"SEPTEMBER 28 - OCTOBER 3, 2025 | TAIPEI, TAIWAN\"","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/"},{"note":"2025年サイクルの schedule at a glance に記載された会場表記。","label":"2025 バンケット会場","value":"\"Banquet (3F, Ballroom II, Grand Hyatt Taipei)\"（2025年9月30日）","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/schedule-abstract/"},{"note":"2026年8月5日時点の掲載状況。","label":"次サイクル（2027）の公表状況","value":"esweek.org トップページは 2026年10月4〜9日・Barcelona の開催のみを掲示しており、2027年の会期・開催地は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"}],"title":"2026 サイクルの会期・開催地・形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"CODES+ISSS の CFP は投稿分野を9つの Track に分けて明示しています。system-level design から embedded AI、industrial practices まで幅があり、どの Track に該当するかを CFP の文言と突き合わせてから投稿先を決められます。対象外領域の明示的な列挙は CFP にありません。","facts":[{"note":"公式サイト自身の表現をそのまま引用。日本語への言い換えは行わない。","label":"公式スコープ文（会議紹介ページ）","value":"\"the premier event in system-level design, hardware/software co-design, modeling, analysis, and implementation of modern Embedded Systems, Cyber-Physical Systems (CPS), and Internet-of-Things (IoT), from system-level specification and optimization to system synthesis of multi-processor hardware/software implementations.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes-isss/"},{"note":"2026年サイクルの CFP ページ冒頭の一文をそのまま引用。","label":"公式スコープ文（2026 CFP）","value":"\"The IEEE/ACM International Conference on Codesign of Embedded Systems (CODES) is the premier conference in system-level design, hardware/software co-design, modeling, analysis, and implementation of modern embedded systems, cyber-physical systems, and internet-of-things, from system-level specification and optimization to synthesis of system-on-chip hardware/software implementations.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"CFP に列挙された9トラックの名称。","label":"2026 トラック構成（9本）","value":"Track 1) System-level design / Track 2) Application-specific design / Track 3) System architecture / Track 4) Simulation, validation, and verification / Track 5) Embedded software / Track 6) Safety, security, and reliability / Track 7) Power-aware systems / Track 8) Embedded artificial intelligence / Track 9) Industrial practices and case studies","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"CFP の Track 3 の説明文に列挙された項目。","label":"Track 3 の内容（半導体設計に近い範囲）","value":"heterogeneous systems、many-cores、distributed systems、application-specific processors と accelerators の architecture / micro-architecture 設計と探索、reconfigurable・self-programmable・self-adaptive architectures、storage、memory systems、networks-on-chip、networks-of-networks","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"CFP の Track 8 の説明文。","label":"Track 8 の内容","value":"resource・power 制約のある embedded / CPS / IoT デバイス向けの machine learning のハードウェア・ソフトウェア設計、実装、最適化","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"産業側からの投稿を明示的に受け付けるトラック。","label":"Track 9 の内容","value":"現在および将来の産業への実務的インパクト、wireless・networking・multimedia・automotive・cyber-physical・IoT・aerospace・space computing・federated systems などにおける最新手法やツールの適用","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"投稿制限として書かれているのは新規性・二重投稿の条件のみ。","label":"明示された対象外領域","value":"2026 CFP に「対象外（out of scope）」として除外される領域の列挙はない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"}],"title":"対象領域と9トラック構成","eyebrow":"scope"},"review":{"id":"review","body":"査読は double-blind が強制され、preprint がある場合はタイトル変更まで求められます。journal track は初回査読を通過した論文が約3週間で改訂し第2段階に進む構造で、2026年サイクルでは full paper 提出3月30日、first round notification 5月22日、改訂稿6月19日、最終通知7月17日という並びになります。採択率は公式ページに数値の掲載がありません。","facts":[{"note":"journal track・late-breaking track の双方に適用される旨が author information に記載。","label":"査読方式","value":"\"a double-blind review process will be enforced (in case your paper has been published as a preprint or as a research report, please change the title so that your preprint cannot be tracked.)\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"著者情報の間接的な露出も禁止されている。","label":"匿名化の要求水準","value":"\"Authors must not reveal their identity directly or indirectly\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"2026年サイクルでは first round notification 5月22日、revised paper 6月19日がこの区間に対応する。","label":"2段階査読の運用","value":"\"Papers passing the first stage of reviews will be asked to revise their work based on reviewer comments within a short time frame of around three weeks and enter the second stage of reviews.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"過去年の数値も公式ページからは読めない。","label":"採択率","value":"2026 CFP ページに採択率・投稿数・採択数の数値は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"掲載されているのは形式要件・匿名化・新規性・段階制の運用のみ。","label":"審査観点の明文リスト","value":"author information ページに採点基準（novelty / soundness などの配点表）の一覧は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"artifact 提出は同ページの通知日程（7月17日）と同じ日に招待が置かれている。","label":"Artifact 評価の存在","value":"2026 CFP ページに \"Call for Artifacts\" への参照があり、important dates に Invitation to submit an artifact 7月17日、Artifact submission deadline 7月24日、Artifact decision notification 8月24日が掲示されている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"2025年サイクルの CFP に掲載された日付。2026年の日付とは別物。","label":"2025 サイクルの査読日程（比較用）","value":"First Round Reviews: May 08, 2025 ／ Revised Paper Submission: June 15, 2025 ／ Final Notification: July 13, 2025 ／ Camera-ready Submission: August 11, 2025","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codes_isss_cfp/"}],"title":"査読方式と2段階レビュー","eyebrow":"review"},"caveats":{"id":"caveats","body":"採択率・投稿数・採択数、査読の採点配点、採択論文のアクセス条件、2026年の会場施設名、企業スポンサーと展示出展社の一覧、2027年の会期と開催地は今回確認した公式ページでは分かりません。2026年のfull programは公開済みですが、個別項目にはTBDのchairやspeakerが残るため、プログラム全体の公開と個々の未確定表示を区別してください。掲載誌・書式・通貨はサイクルで変わるため、年度をまたいで流用できません。","facts":[{"note":"同じ 2026 サイクルの author information ページでは会議を区別せず TCAD と記載されている。CODES への適用可否はこのページでは断定しない。","label":"CFP ページに残る他会議名の表記","value":"CODES 2026 の CFP ページにある TCAD 掲載の説明文は \"All full papers accepted in EMSOFT'25 will be published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).\" と、他会議名と前年の年次を含む文面になっている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"2026年サイクルの掲載誌（IEEE TCAD）は esweek.org/author-information/ 側の記載で、publication セクションに別項として置いた。投稿年に対応するページを参照する必要がある。","label":"掲載誌がサイクルで異なる（2025年サイクル側の記載）","value":"2025年サイクルの CFP は full paper の掲載先を \"the ACM Transactions on Embedded Computing Systems\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codes_isss_cfp/"},{"note":"2025年サイクルの ACM one-column 20ページ規定は 2025.esweek.org/codes_isss_cfp/ 側の記載で、publication セクションに別項として置いた。旧年度のテンプレートを流用すると規定違反になる。","label":"書式規定がサイクルで異なる（2026年サイクル側の記載）","value":"2026年サイクルの journal track は IEEE transactions two-column で初稿12ページ・改訂稿14ページ","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"author information ページ・program committee ページにも同様の数値はない。外部の集計サイトは本ページの引用対象外。","label":"採択率・投稿数","value":"2026 CFP ページに、採択率および投稿数・採択数の数値は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"2026年10月14日時点。個別項目に残るTBDはプログラム全体の未公開を意味しない。","label":"2026 full programと残るTBD","value":"full programは公開済み。日付・track別scheduleを確認できるが、個別のchairやspeakerにはTBD表記が残る。","checkedAt":"2026-10-14","sourceUrl":"https://esweek.org/full-program/"},{"note":"並んでいる大学名・企業名は委員個人の所属機関表記であり、所在国も機関の所在地。国籍を示すものではない。","label":"委員名簿の所属の読み方","value":"program committee ページは委員ごとに氏名・所属機関・国コードだけを並べており、投稿元組織や採択実績を示す欄はない","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codesisss-program-committee/"},{"note":"通し回数として使うと年ごとにずれる。","label":"巻見出しの序数の不統一","value":"DBLP の CODES+ISSS 巻見出しは 2012 年が \"10th CODES+ISSS 2012: Tampere, Finland\"、2025 年が \"CODES+ISSS 2025: Taipei, Taiwan\" と、序数の有無が年で揃っていない","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codesisss/index.html"},{"note":"日別の割り当ては同サイトの schedule at a glance 側にしかない。full program ページの記載だけから日程を読むことはできない。","label":"2025 併設イベントの日程が full program ページにないこと","value":"2025年サイクルの full program ページは TUTORIALS / WORKSHOPS（TCRS・MSC・RSP）／ EDUCATION CLASSES ／ PhD Forum and Recruitment Event ／ Embedded Systems Software Competition (ESSC) の名称とリンクを並べるのみで、各イベントの開催日は印字されていない。MEMOCODE は WORKSHOPS ではなく SYMPOSIA の見出し下に置かれている","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/full-program/"},{"note":"参照した公式ページの範囲外。","label":"このページで扱わない範囲","value":"CASES・EMSOFT・MEMOCODE の個別 CFP と採択内容、掲載誌側の購読・オープンアクセス条件、2025年以前の各年のプログラム詳細","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"}],"title":"未公開項目と読み違えやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"CODES+ISSS は、別々に存在した CODES（Hardware/Software Codesign）と ISSS（System Synthesis）が2002年をもってそれぞれ終了し、統合された系列です。DBLP の巻一覧で両系列の最終巻と統合後の巻を突き合わせられます。開催地は北米・欧州・アジアの間を移動しています。","facts":[{"note":"DBLP の conf/codes 系列に収録されている最も古い巻。第3回が1994年である旨がタイトルに含まれる。","label":"CODES 単独系列の最古巻","value":"\"Proceedings of the Third International Workshop on Hardware/Software Codesign, CODES 1994, Grenoble, France, September 22-24, 1994. IEEE Computer Society 1994, ISBN 0-8186-6315-4\"","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codes/index.html"},{"note":"DBLP の系列注記。","label":"CODES 単独系列の最終巻と終了","value":"\"Proceedings of the Tenth International Symposium on Hardware/Software Codesign, CODES 2002, Estes Park, Colorado, USA, May 6-8, 2002. ACM 2002, ISBN 1-58113-542-4\"。ページには \"as of 2002, this venue has been discontinued\" と、successor (merged into) が CODES+ISSS である旨が記載されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codes/index.html"},{"note":"ISSS も \"as of 2002, this venue has been discontinued\" とされ、successor (merged into) が CODES+ISSS と記載されている。最終巻の開催地は京都。","label":"ISSS 系列の最古巻と最終巻","value":"最古: \"Proceedings of the 7th International Symposium on High Level Synthesis, HLSS'94, Niagra-on-the-Lake, ON, Canada, May 18-20, 1994\"／ 最終: \"Proceedings of the 15th International Symposium on System Synthesis (ISSS 2002), October 2-4, 2002, Kyoto, Japan\"","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/isss/index.html"},{"note":"ページ上で本文として読めるのは2012年以降の巻見出し。2003〜2011 はジャンプ一覧側にのみ現れる。","label":"統合後 CODES+ISSS の収録範囲","value":"DBLP の CODES+ISSS 系列ページは巻見出しとして 2012 年から 2025 年までを展開表示し、年次ジャンプ一覧では 2003 年までさかのぼる年が並ぶ","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codesisss/index.html"},{"note":"DBLP の巻見出しに印字された開催地。2026年の開催地（Barcelona, Spain）は esweek.org トップページ側の記載で、cycle セクションに別項として置いた。","label":"近年の開催地ローテーション","value":"2012 Tampere, Finland ／ 2023 Hamburg, Germany ／ 2024 Raleigh, NC, USA ／ 2025 Taipei, Taiwan","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codesisss/index.html"},{"note":"2012年が archive の最古年として並ぶ。","label":"ESWEEK アーカイブの収録年","value":"archive ページは2012年から2025年までの各年について Call For Papers / Program Committee 等へのリンクを掲載している","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/archive/"},{"note":"ESWEEK としての組織化の節目を示す記載。","label":"運営規程の制定・改定履歴","value":"by-laws は \"December 2014: Approved by ESWEEK SC\" が原版で、その後 2015年11月・2021年5月・2023年4月・2023年9月に改定されている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizational-structure/"},{"note":"旧名 CODES+ISSS と現行表記 CODES が同一ページ内で併存している状態。","label":"会議名表記の変化","value":"会議紹介ページは見出しと副題に CODES+ISSS / International Conference on Hardware/Software Codesign and System Synthesis を掲げ、同じページの本文では IEEE/ACM International Conference on Codesign of Embedded Systems (CODES) を用いている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes-isss/"}],"title":"CODES と ISSS の系譜と開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年の公式full programは公開済みで、日付・trackフィルタからCODESセッションを確認できます。CODESの技術セッションは10月5〜7日に配置され、ESWEEK全体のkeynote、tutorial、workshop、education classなども同じ日程表に掲載されています。個別セッション内にTBDのchairやspeakerが残る場合は、その項目だけを未確定として扱います。","facts":[{"note":"keynote ページに氏名と所属のみ掲載され、講演タイトルは掲載されていない。","label":"2026 keynote 登壇者","value":"Farinaz Koushanfar（UC San Diego）／ Edward Lee（UC Berkeley）／ Orlando Moreira（Chief Computer Architect for AI Cores at Snap Inc.）／ Hsien-Hsin Sean Lee（Intel、IEEE CEDA Luncheon Keynote）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/keynotes/"},{"note":"2025年サイクルのトップページに掲載。","label":"2025 keynote 登壇者","value":"Nicky Lu（AITA）／ David Atienza Alonso（EPFL）／ Nikil Dutt（UC Irvine）／ Sanjit A. Seshia（UC Berkeley）","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/"},{"note":"schedule at a glance の並列トラック表記。","label":"2025 CODES+ISSS のセッション数","value":"\"CODES+ISSS #1\" から \"#7\" までの技術セッションと、9月30日の \"CODES+ISSS SS 1\"（special session）が並列開催として掲載","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/schedule-abstract/"},{"note":"ESWEEK 公式ページ掲載。\"The champions will represent SIGBED and compete against other SIGs in the ACM Grand Finals.\" とも記載されている。","label":"2026 ACM SIGBED Student Research Competition","value":"\"There are two categories: Undergraduate and Graduate.\"、第1段階は \"a 2-page extended abstract describing his/her original work to be reviewed\"、通過者は \"will make a live presentation in ESWEEK 2026\"。第1段階の締切は \"31 July\"。賞金は \"Champions, first runners-up and second runners-up will receive USD $500, $300 and $200, respectively.\"","checkedAt":"2026-08-05","sourceUrl":"http://esweek.org/acm-sigbed-student-research-competition-2026/"},{"note":"公式full programを2026年10月14日に確認。","label":"2026 詳細プログラム","value":"公開済み。CODESトラックを含む日付別・track別のscheduleを掲載。","checkedAt":"2026-10-14","sourceUrl":"https://esweek.org/full-program/"}],"title":"keynote・tutorial・併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"学生にとっては education class が無償、tutorial が学生 €75、PhD Forum と SRC が別ルートで用意されており、論文採択がなくても関われる入口があります。企業側は Track 9 が industrial practices and case studies を明示的に受け付けるため、実適用事例の投稿先として CFP の文言を確認できます。日本から参加する場合、発表は現地対面が必須で、著者登録の締切が早い点が日程上の制約になります。","facts":[{"note":"\"All rates listed are in Euro and include VAT.\" と明記されている。","label":"2026 本会議の参加費（Oct. 5–7）","value":"IEEE/ACM Member €950（early）／ €1150（regular）、Non-Member €1150 ／ €1350、Student Member €500 ／ €600、Student Non-Member €600 ／ €700","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/registration/"},{"note":"education class はオンライン開催として区分されている。","label":"2026 tutorial・education class の参加費","value":"Tutorials（Oct. 4）: Member/Non-Member €250（early）／ €350（regular）、Student €75 ／ €150。Virtual Education Classes（Oct. 2）: 全区分 無料","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/registration/"},{"note":"camera ready（8月17日）の直後に著者登録期限が来る。","label":"2026 登録の締切","value":"\"The author registration deadline is August 24, 2026.\" ／ \"The early registration deadline is August 31, 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/registration/"},{"note":"オンライン発表の枠は記載されていない。","label":"現地参加の必須要件","value":"\"ESWEEK is a conference held exclusively in person.\" とされ、\"it is mandatory that at least one author of each accepted paper physically attends the session where the paper is presented\" が求められる","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"トップページの important dates 表に記載。本会議論文の採択とは別枠の参加経路。ACM SIGBED Student Research Competition の要件は program セクションに別項として置いた。","label":"2026 PhD Forum の提出締切","value":"ESWEEK Ph.D. Forum Submission Deadline: August 5, 2026","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"automotive、aerospace、IoT、federated systems などが例示されている。","label":"企業からの投稿窓口","value":"Track 9) Industrial practices and case studies が \"Practical impact on current and/or future industries\" を対象として CFP に明記されている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"2025年は USD 建て、2026年は EUR 建てで通貨が異なる。2025年の early registration は8月31日、author registration は8月23日。","label":"2025 サイクルの参加費（比較用）","value":"Main Conference（Sep. 29–Oct. 1）は IEEE/ACM Member $900（early）／ $1000（regular）、Non-Member $1000 ／ $1100、Student Member $500 ／ $600、Student Non-Member $600 ／ $700（USD）","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/registration/"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"CODES+ISSS は単独開催ではなく、ESWEEK（Embedded Systems Week）というアンブレラ・イベントの中の1会議として運営されています。投稿規定・査読日程・参加登録が ESWEEK 側で共通化されているため、CODES+ISSS 単独のページだけを見ると規定を取りこぼします。会議名は公式サイト内でも CODES+ISSS と CODES の2通りが併存するので、検索時は両方を使ってください。","facts":[{"note":"ESWEEK公式の会議紹介ページで、見出し CODES+ISSS の直下に副題として掲げられている名称。","label":"正式名称","value":"International Conference on Hardware/Software Codesign and System Synthesis（略称 CODES+ISSS）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes-isss/"},{"note":"ESWEEK 2026 トップページの Conferences 欄に印字された表記。by-laws ページも3会議を CASES / CODES / EMSOFT と表記している。","label":"2026 サイト上の会議名表記","value":"CODES（IEEE/ACM International Conference on Codesign of Embedded Systems）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"トップページの原文。CODES+ISSS はこの3会議のうちの1つ。","label":"ESWEEK の構成","value":"\"By bringing together three leading conferences, (CASES, CODES, EMSOFT), one symposium (MEMOCODE), and several workshops, tutorials, and education classes\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"by-laws ページの原文。CODES+ISSS も「all technical events inside ESWEEK」に含まれる。","label":"主催（sponsor）","value":"\"The IEEE and ACM sponsor ESWEEK and therefore all technical events inside ESWEEK.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizational-structure/"},{"note":"by-laws ページに 2023 Society Representatives として列挙されているもの。年次が明記された名簿である点に注意。","label":"Society Representatives（2023年時点の掲載）","value":"IEEE CEDA/CAS: Atienza Alonso David / ACM SIGBED: Wanli Chang / ACM SIGMICRO: Erik Altman / ACM SIGDA: Sudeep Pasricha","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizational-structure/"},{"note":"公式ページには「年1回」という明文はないため、巻の並びとして記載する。","label":"開催年の連続性","value":"DBLP の CODES+ISSS 巻一覧は年別のジャンプ一覧に 2003 年までさかのぼる年次を並べ、2023（Hamburg）・2024（Raleigh）・2025（Taipei）の巻が連続して掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codesisss/index.html"},{"note":"巻見出しの序数の有無が年によって異なるため、通し番号としては扱えない。ESWEEK 公式の会議紹介ページには回数の記載自体がない。","label":"第N回の表記","value":"DBLP では 2012 年巻の見出しが \"10th CODES+ISSS 2012: Tampere, Finland\"、2025 年巻の見出しは \"CODES+ISSS 2025: Taipei, Taiwan\" で序数なし","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/codesisss/index.html"}],"title":"正式名称と主催の枠組み","eyebrow":"identity"},"community":{"id":"community","body":"CODES+ISSS の TPC は年ごとに chair が交代し、2026年サイクルは米国と台湾の chair 体制です。TPC 名簿には大学に加えて企業所属の委員も並びますが、これは委員個人の所属機関の表記であって、企業の投稿・採択・取引を示すものではありません。所在国も所属機関の所在地であり、委員の国籍ではありません。","facts":[{"note":"program committee ページの表記のまま。","label":"2026 CODES TPC chair","value":"TPC Chair: Paul Bogdan（University of Southern California, US）／ TPC Co-Chair: Yuan-Hao Chang（National Taiwan University, TW）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codesisss-program-committee/"},{"note":"2025年サイクルの committee ページ。Artifact Evaluation Chair は Aruna Jayasena（University of Florida, USA）。","label":"2025 CODES+ISSS TPC chair","value":"TPC Chair: Prabhat Mishra（University of Florida, FL, US）／ TPC Co-Chair: Paul Bogdan（University of Southern California, US）","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codesisss-program-committee/"},{"note":"CODES+ISSS を含む ESWEEK 全体の統括。","label":"2026 ESWEEK General Chair","value":"General Chair: Andy Pimentel（University of Amsterdam, NL）／ General Co-Chair: Mohammad Al Faruque（UC Irvine, US）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizing-committee/"},{"note":"名簿に印字された所属機関の所在国であり、委員の国籍ではない。","label":"TPC 委員の所属国（2025年名簿の表記）","value":"USA のほか Germany, Canada, China, UAE, Taiwan, Netherlands, Italy, South Korea, Belgium, Singapore, UK, India, Japan, Ireland, France の機関が名簿に並ぶ","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codesisss-program-committee/"},{"note":"委員個人の所属表記であり、これらの企業の論文投稿・採択・スポンサー参加を示すものではない。","label":"産業界所属の委員（2025年名簿の表記）","value":"\"Intel, USA\"、\"AMD, USA\"、\"Apple, USA\"、\"Microsoft, USA\"、\"Amazon, USA\"、\"Medtronics, USA\" などの所属が名簿に含まれる","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codesisss-program-committee/"},{"note":"by-laws ページ。CODES+ISSS からも2名が SC に入る。","label":"Steering Committee の構成","value":"\"6 conference representatives: 2 members from each conference (CASES, CODES, and EMSOFT), who bring each conference's perspective\" に、General Chair の輪番プール（past 2・current・next）と SC Chair を加えた構成","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/organizational-structure/"},{"note":"トップページには Sponsoring Societies の見出しとロゴがあるのみで、企業名の列挙はない。","label":"sponsor・exhibitor 一覧","value":"esweek.org のトップページ・organizing committee ページ・registration ページに、2026年サイクルの sponsor 企業一覧や展示出展社一覧の掲載は確認できない","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"}],"title":"委員会構成と参加組織の所在国","eyebrow":"community"},"comparison":{"id":"comparison","body":"同じ週に開催される CASES・CODES+ISSS・EMSOFT は、公式ページの scope 文で守備範囲が書き分けられています。投稿規定・締切・掲載誌・参加登録は3会議で共通のため、選択の軸は scope 文の対象範囲になります。MEMOCODE は会議ではなく symposium として別枠です。","facts":[{"note":"compiler と architecture が軸。","label":"CASES の scope（公式文）","value":"\"CASES is a premier forum where researchers, developers and practitioners exchange information on the latest advances in compilers and architectures for high-performance, low-power embedded systems.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/cases/"},{"note":"embedded software と cyber-physical systems が軸。","label":"EMSOFT の scope（公式文）","value":"\"Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/emsoft/"},{"note":"system-level design と HW/SW co-design が軸。","label":"CODES+ISSS の scope（公式文）","value":"\"The conference is a forum bringing together academic research and industrial practice for all aspects related to system-level and hardware/software co-design.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes-isss/"},{"note":"会議ごとに規定が分岐している記述はこのページにない。","label":"2026 3会議で共通の投稿ルール","value":"投稿は3会議とも hotCRP 経由、journal track のページ数（初稿12ページ／改訂14ページ）、double-blind 査読、in-person 発表要件が author information ページで一括して規定されている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"本会議（Oct. 5–7）とは日程・料金が分かれる。ESWEEK が3会議に加えて1つの symposium（MEMOCODE）を含む構成である旨はトップページ側の記載。","label":"2026 MEMOCODE の登録区分","value":"registration ページの区分行は \"MEMOCODE Symposium (incl. workshops) Oct. 8—9\" で、\"Main Conference Oct. 5–Oct. 7\" とは別の料金行として掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/registration/"}],"title":"ESWEEK 内3会議の棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は journal track（full paper）と late breaking track（LB/WiP）の2本立てで、それぞれページ数と締切が異なります。journal track は初稿12ページ・改訂稿14ページという2段構えなので、初稿の段階で改訂余地を残す分量設計が要ります。締切はすべて2026年サイクルのもので、前年の日付から推定しないでください。","facts":[{"note":"author information ページに3区分のページ数規定が並記されている。","label":"2026 投稿区分","value":"Journal Track（full paper）／ Late Breaking Track（LB/WiP paper）／ Special Session（提案ベース）","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"参考文献・appendix もページ数に算入。余白に line numbers を入れることが求められる。","label":"2026 journal track ページ数","value":"\"Papers should not exceed 12 pages in the IEEE transactions two-column format for the initial submission.\" 改訂稿は \"the revised manuscript should not exceed 14 pages in the same format.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"journal track と異なり改訂ラウンドがない。","label":"2026 late-breaking ページ数と付随物","value":"\"The submissions should not exceed 4 pages (IEEE transactions two-column and 10pt font size format).\"、\"All LB papers go through one stage of review.\"、\"ESL policy requires all accepted papers to be accompanied by a 3-minute video preview\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"1本の合同論文か、発表ごとの2ページ拡張アブストラクトかを選ぶ。","label":"2026 Special Session の分量","value":"\"Special Session papers are either 10 pages (one joint paper) or 2-page Extended Abstracts (per presentation) using IEEE conference format.\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"camera ready は \"All tracks (full paper, LB, Special Session)\" 共通の日付として掲示されている。","label":"2026 journal track 締切一覧","value":"Abstract Submission: March 23, 2026 (AOE) ／ Full Paper Submission: March 30, 2026 (AOE, firm) ／ First Round Notification: May 22, 2026 ／ Revised paper submission: June 19, 2026 (AOE, firm) ／ Notification: July 17, 2026 ／ Camera ready: August 17, 2026","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"journal track と通知日は同じ 7月17日。","label":"2026 late breaking 締切","value":"Late Breaking Tracks: Paper Submission: June 5, 2026 (AoE, firm) ／ Notification: July 17, 2026","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codesisss-call-for-wip-papers/"},{"note":"トップページの important dates 表に記載。","label":"2026 その他の提案・付随締切","value":"Special Session / Workshop proposals: March 30, 2026 ／ Tutorial Proposals: June 30, 2026 ／ Invitation to submit an artifact: July 17, 2026 ／ Artifact submission: July 24, 2026 ／ ESWEEK Ph.D. Forum Submission: August 5, 2026 ／ Artifact decision notification: August 24, 2026","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/"},{"note":"CODES 2026 の投稿リンクは CFP ページ上に \"Submit an Article to CODES 2026\" として置かれている。","label":"投稿システムと新規性要件","value":"\"All papers...must be submitted through the hotCRP management tool from the corresponding web page of each conference (CASES, CODES, EMSOFT)\"。論文は \"original material that has not been previously published in another conference or journal, nor is currently under review by another conference or journal\" であることが要件","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"}],"title":"投稿区分・ページ数・2026年サイクルの締切","eyebrow":"submission"},"publication":{"id":"publication","body":"CODES+ISSS の採択論文は会議録だけでなくジャーナルに載る journal-integrated 方式で、掲載誌はサイクルによって異なります。2025年サイクルは ACM TECS、2026年サイクルは IEEE TCAD と公式ページの記述が変わっているため、引用や業績登録の際は投稿年のページを参照してください。登録と現地発表を欠くとジャーナルからも取り下げられる条件が明記されています。","facts":[{"note":"ESWEEK 2026 author information ページの記述。CASES / CODES / EMSOFT を区別せずに TCAD と記載されている。","label":"2026 journal track の掲載誌","value":"\"Full length papers describe mature work and are published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/author-information/"},{"note":"CODES 2026 CFP ページの原文。","label":"2026 late-breaking の掲載誌","value":"\"All late-breaking papers accepted in one of the three conferences will be published in IEEE Embedded Systems Letters (ESL).\"","checkedAt":"2026-08-05","sourceUrl":"https://esweek.org/codes_isss_cfp/"},{"note":"2025年サイクルの CODES+ISSS CFP。full paper の掲載誌が2026年サイクルの記述と異なる。","label":"2025 サイクルの掲載誌","value":"\"Accepted full papers will be published in the ACM Transactions on Embedded Computing Systems. Accepted LBR papers will be published in IEEE Embedded Systems Letters.\"","checkedAt":"2026-08-05","sourceUrl":"https://2025.esweek.org/codes_isss_cfp/"},{"note":"2026年サイクルの IEEE two-column 12ページ規定とは書式・分量が異なる。","label":"2025 サイクルのページ数規定","value":"\"Journal-track papers must be up to 20 pages in ACM one-column format, including references. 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sessionの会場です。公式サイトのwelcome文は本会議をbiennial meetingと表記しており、開催は隔年です。次回にあたる第38回の開催地と会期はICPS2026公式サイトに掲載されていません。","question":"ICPSはいつ、どこで開かれますか。","sourceUrls":["https://icps2026.jp/","https://icps2026.jp/venue"]},{"answer":"2026年サイクルのabstract締切は当初 March 15, 2026, 23:59 PDT で、延長後は March 29, 2026, 23:59 PDT と公式ページに掲載されています。投稿は約40語(約300字)のプレーンテキストによるshort abstractと、公式テンプレートで作成したA4縦1ページのabstract PDFの二部構成です。英語のみ、1バイトのローマン体フォントのみが認められ、日本語などの2バイト文字は使用できません。参照時点で投稿受付はCLOSEDと表示されています。","question":"投稿の締切と形式はどうなっていますか。","sourceUrls":["https://icps2026.jp/abstract-submission"]},{"answer":"Abstract Submissionページには \"The final determination of the presentation type and category will be made by the Program Committee.\" と記載され、発表形式とカテゴリの決定はProgram Committeeが行います。double-blindなどの査読方式、査読者数、審査観点の一覧は公開されていません。採択率も公式サイトのどのページにも数値が掲載されていません。","question":"査読はありますか。採択率は公表されていますか。","sourceUrls":["https://icps2026.jp/abstract-submission","https://icps2026.jp/committees"]},{"answer":"Abstract 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Chairが置かれます。plenary speakerはETH Zurich、MIT、University of California, Santa Barbara、RIKEN、CNRS、University of New South Walesの所属で7名が演題つきで掲載されています。公式ページに印字されているのは所属機関名であり、委員や参加者の国籍・国別内訳は公表されていません。","question":"どういう人が発表しているのですか。","sourceUrls":["https://icps2026.jp/committees","https://icps2026.jp/plenary-speakers"]},{"answer":"会場は新宿の2か所(京王プラザホテルと工学院大学新宿キャンパス、徒歩約1分)で、現地開催のみの案内です。オンライン参加区分はRegistrationページに設けられていません。キャンセルは6月7日(JST)以降は全額不返金と明記されています。口頭発表の持ち時間はPresentation Guidelinesの表にあり、Plenaryが35分講演と5分質疑、Invitedが25分と5分、Regularが12分と3分、ポスターパネルは W900 × H2100 (mm) です。","question":"日本から参加する場合、何を確認しておけばよいですか。","sourceUrls":["https://icps2026.jp/venue","https://icps2026.jp/registration","https://icps2026.jp/presentation-guidelines"]},{"answer":"Sponsorship and Exhibition Opportunitiesページに、Diamond 2,000,000円、Platinum 1,000,000円、Gold 500,000円、Silver 200,000円(いずれも税別)の協賛枠と、1小間300,000円(税別)の展示ブースが掲載されています。申込締切は2026年7月3日です。展示会期は8月17日午後から21日午前までとされていますが、見出しに (Tentative) が付されており確定日程ではありません。ブースの総数は同ページに記載がありません。","question":"企業として出展・協賛はできますか。","sourceUrls":["https://icps2026.jp/sponsorship"]},{"answer":"IUPAP C8 Commission on Semiconductors が隔年で授与する Early Career Scientist Prizes (ECSP) in Semiconductor Physics があり、授賞と受賞講演がICPS2026の会期中に行われます。応募資格は博士号取得後8年以内(キャリア中断は除外)で自薦は認められず、推薦締切は延長後で2026年3月31日です。2件が授与され、受賞者にはIUPAPメダルと1,000ユーロ、ICPS 2026での招待口頭発表が与えられます。","question":"若手向けの制度はありますか。","sourceUrls":["https://icps2026.jp/iupap-ecsp"]}],"headline":"ICPS2026の公式サイトで実際に読める記載だけを、投稿・選考・プログラム・committee構成・参加費の順に並べます。","metaDescription":"ICPSは隔年開催の半導体物理の国際会議で、第37回は2026年8月16〜21日に東京・新宿の2会場で開かれます。1ページabstractの投稿要領、Program Committeeによる口頭/ポスター決定、参加費、committee構成を公式ページの記載で確認できます。","oneLine":"ICPS(International Conference on the Physics of Semiconductors)は隔年開催の半導体物理の国際会議で、第37回は2026年8月16〜21日に東京・新宿の京王プラザホテルと工学院大学新宿キャンパスの2会場で開かれます。","pageTitle":"ICPS(半導体物理の国際会議)とは|第37回2026年 東京・新宿開催の投稿要領とプログラム","relatedConferenceIds":["ssdm","icds","iwn","icscrm","jps-annual-meeting","mnc"],"sections":{"cycle":{"id":"cycle","body":"Venueページは冒頭で \"Two Conference Venues\" と明記し、会場が2か所に分かれることを示しています。京王プラザホテルがplenary・技術セッション・展示・banquet・受付のmain venueで、poster sessionとWomen in Physics、IUPAP Award sessionは徒歩約1分の工学院大学新宿キャンパスで行われます。オンライン配信やhybrid参加の案内は公式ページに出ていないため、遠隔参加を前提にした計画は立てられません。","facts":[{"note":"トップページに会期として掲出。Program at a Glanceも8月16日(日)から8月21日(金)までの6日分の時間割を並べている。","label":"2026 会期","value":"August 16 - 21, 2026(2026年8月16日〜21日)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"Venueページの \"Two Conference Venues\" 欄に記載。京王プラザホテルがplenary・技術セッション・展示・banquet・受付のmain venue、工学院大学新宿キャンパスが poster session(8月18・19・20日)、Women in Physics(8月16日)、IUPAP Award session(8月19日)の会場。成田・羽田からのアクセスも同ページに案内。","label":"2026 会場","value":"Keio Plaza Hotel Tokyo(2-2-1 Nishi-Shinjuku, Shinjuku-Ku, Tokyo 160-8330 Japan)と Kogakuin University, Shinjuku Campus(1-24-2 Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-8677 Japan)の2会場。両者は徒歩約1分","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/venue"},{"note":"Venueページのアクセス案内に記載。カウンター位置も同欄に記載されている。","label":"2026 空港ホスピタリティデスク","value":"成田・羽田の両空港で8月15日(土)・16日(日)に対応。羽田14:00-20:00、成田10:00-16:00","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/venue"},{"note":"main venueの京王プラザホテルとは別施設。同ページには \"Date & Time: 4pm - 5pm, August 16, 2026\" と記載。","label":"2026 Women in Physicsの会場","value":"Urban Tech Hall, Kogakuin University(新宿キャンパス3階)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/women-in-physics"},{"note":"Registrationページの参加区分は現地参加の料金のみで、オンライン参加区分の記載はない。Program at a Glanceにも配信の記載はない。","label":"2026 オンライン/hybrid開催","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"ICPS2026公式サイトのトップおよびナビゲーション内に次回開催の告知ページはない。","label":"次サイクル(第38回)の開催地・会期","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"}],"title":"2026年サイクルの会期・会場・開催形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"Conference Topicsページに14区分のカテゴリが番号付きで並び、投稿時のカテゴリ選択もこの区分に対応します。材料成長・評価から量子ホール効果、量子ビットやcryo-CMOSまで幅が広く、デバイス製造プロセスよりも物理現象そのものに寄った区分立てになっています。除外領域の明示はないため、区分に当てはまるかどうかは14区分の文言で判断することになります。","facts":[{"note":"Conference TopicsページにCategory 1〜Category 14の番号付きで列挙されている。","label":"2026 カテゴリ数","value":"14区分","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"},{"note":"Conference Topicsページの原文表記(Category 1、2、4、5)。","label":"2026 材料・構造系のカテゴリ","value":"\"Material growth, structural properties, and characterization (bulk, nanowires, dots)\" / \"Wide-bandgap semiconductors and devices\" / \"Graphene, 2D materials\" / \"Halide perovskites and organic semiconductors\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"},{"note":"Conference Topicsページの原文表記(Category 6、8、9、13)。","label":"2026 量子・低次元系のカテゴリ","value":"\"Topological states of matter\" / \"Low-dimensional semiconductor systems (1D, 2D)\" / \"Quantum Hall effect, fractional quantum Hall effect\" / \"Quantum technologies: semiconductor qubits and applications, cryo-CMOS technologies\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"},{"note":"Conference Topicsページの原文表記(Category 3、7、10、11、12、14)。","label":"2026 光・スピン系のカテゴリ","value":"\"Semiconductors for terahertz and mid infrared\" / \"Spintronics, spin-related phenomena, novel spintronics materials and devices\" / \"Optical properties of quantum dots and nanocrystals, optoelectronics\" / \"Nanophotonics\" / \"Quantum optics, quantum emitters, NV centers\" / \"Semiconductor hybrid systems, nano-mechanics, novel devices\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"},{"note":"Conference Topicsページには14区分の列挙のみで、対象外や範囲制限の記述はない。","label":"2026 明示された対象外領域","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"},{"note":"Invited Speakersページで、\"Invited Speakers (to be updated)\" の一覧とは別の見出しとして掲載されている。","label":"2026 追加の特別区分","value":"Special session on oxide semiconductors","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/invited-speakers"}],"title":"対象領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"公式ページに書かれているのは、発表形式とカテゴリの最終決定をProgram Committeeが行うという点です。single-blindやdouble-blindといった査読方式、査読者数、審査観点の一覧は公表されていないため、投稿前に評価基準を読み込むことはできません。Program Committeeは14区分に対応する小委員会で構成され、chairとvice-chairが公表されています。","facts":[{"note":"口頭・ポスターの別とカテゴリの双方をProgram Committeeが決めると明記。","label":"2026 発表形式の決定主体","value":"\"The final determination of the presentation type and category will be made by the Program Committee.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページの Presentation Type 欄に記載。","label":"2026 受理される発表形式","value":"\"ICPS2026 will be held in person. Both oral and poster presentations will be accepted.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Vice-Chairsは Yoichi Kawakami (Kyoto Univ.) と Akira Oiwa (The Univ. of Osaka)。","label":"2026 Program Committee Chair","value":"Kazuhiko Hirakawa (The Univ. of Tokyo)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"},{"note":"Committeesページのプログラム委員一覧はカテゴリ別に並ぶ。Category 2の下には \"Special Session : Recent advances in oxide-based widegap semiconductors\" の委員も置かれている。","label":"2026 Program Committeeの区分","value":"Conference Topicsの14カテゴリに対応する形で、Category 1〜14ごとにSubcommittee Chairと委員が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"},{"note":"Abstract Submissionページにdouble-blind、single-blind、査読者数、審査観点の記載はない。","label":"2026 査読方式(blind査読の別)","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページ、Program at a Glance、Committeesページのいずれにも投稿件数や採択率の数値はない。","label":"2026 採択率","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"}],"title":"選考のしくみと公表範囲","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトが公開していない項目がいくつもあります。proceedingsの発行先・特集号招待・著作権譲渡、査読方式と査読者数と審査観点、投稿件数と採択率、参加者数、次回(第38回)の開催地と会期、展示ブースの総数、camera-readyの手順、一人あたりの投稿件数上限、オンライン/hybrid参加区分、そしてsponsor・supporting organizationとして掲出される各団体の正式名称は、いずれも公式ページに印字されていません。締切と採否通知は二重表記と幅のある表現が混在するため、日付を引用するときは延長後の表記かどうかを確かめてください。会場が2か所に分かれる点と、開催頻度の英語表記が出典によって揺れる点も読み違えやすい箇所です。","facts":[{"note":"引用時はどちらの日付を指しているかを明示する必要がある。","label":"締切の二重表記","value":"Abstract Submissionページには当初の March 15, 2026 と延長後の March 29, 2026 の両方が残っている","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"5月の特定日を通知日として扱うことはできない。","label":"採否通知の表現","value":"\"By mid-May\" とだけ記載され、確定日付は公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"いずれも隔年開催の意味で用いられているが、原文を引く際は出典ごとの綴りに従う。","label":"開催頻度の表記揺れ","value":"ICPS2026公式サイトは \"biennial\"、IUPAP C8のGeneral Assembly報告は \"biannual\" と表記","checkedAt":"2026-08-05","sourceUrl":"https://archive2.iupap.org/general-assembly/24th-general-assembly/reports/c8-report/"},{"note":"参照時点の一覧が最終版ではない。","label":"invited speaker一覧の暫定性","value":"Invited Speakersページの見出しに \"(to be updated)\" が付されている","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/invited-speakers"},{"note":"Venueページの \"Two Conference Venues\" に明記。会場をひとつと前提して移動計画を立てると齟齬が出る。","label":"会場が2か所に分かれる行事","value":"main venue は京王プラザホテルだが、poster session(8月18・19・20日)、Women in Physics(8月16日)、IUPAP Award session(8月19日)は工学院大学新宿キャンパスで行われる","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/venue"},{"note":"Sponsorship and Exhibition Opportunitiesページ。ブース総数も同ページに記載がない。","label":"展示会期の暫定表記","value":"見出しが \"Exhibition Period (Tentative)\" で、確定日程として扱えない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsorship"},{"note":"sponsorとexhibitorの掲載は協賛・出展の事実のみを示す。2026年サイクルの参加者数は公式サイトに記載がない。","label":"本ページで扱わない範囲","value":"個別発表の技術評価、企業間の取引関係、参加者数の推計は扱わない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsors"}],"title":"未公開項目と読み違えやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"公式サイトは初回開催年を明記せず、1950年代にさかのぼる系譜という表現にとどめています。回次は2026年が第37回、2024年が第36回で、開催地は大陸をまたいで移動します。過去回の具体的な会期・都市・参加者数は、IUPAP C8のGeneral Assembly報告に記載が残っています。","facts":[{"note":"トップページのwelcome文。初回開催年そのものは公式サイトに数字で書かれていない。","label":"系譜に関する公式表記(2026)","value":"\"The conference will reflect the state of the art in semiconductor physics with a heritage dating back to the 1950s.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"ICPS2026公式サイトのトップページ。Venueページでは工学院大学新宿キャンパスを加えた2会場と記載される。","label":"第37回(2026)","value":"Keio Plaza Hotel, Shinjuku, Tokyo、August 16 - 21, 2026","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"ICPS2024公式サイトのInfoページ。同ページには \"ICPS 2024 will be held for in-person attendance only\" とも記載。","label":"第36回(2024)","value":"\"36th International Conference on the Physics of Semiconductors (ICPS) 2024\"、July 28 to August 2, 2024、Shaw Centre(55 Colonel By Drive, Ottawa, Ontario, Canada)、テーマ \"Foundation of Quantum Technology\"","checkedAt":"2026-08-05","sourceUrl":"https://uottawacpd.eventsair.com/QuickEventWebsitePortal/icps2024/info"},{"note":"IUPAP C8の第24回General Assembly報告(1999-2002年期)に \"The 25th ICPS, in Osaka, Japan, 1050 participants, Sept. 17-22, 2000.\" と記載。","label":"第25回(2000)","value":"大阪(日本)、2000年9月17〜22日、参加者1,050名","checkedAt":"2026-08-05","sourceUrl":"https://archive2.iupap.org/general-assembly/24th-general-assembly/reports/c8-report/"},{"note":"IUPAP C8の第24回General Assembly報告に \"The 26th ICPS in Edinburgh, Scotland, 1043 participants, July 29-Aug.2, 2002.\" と記載。同報告は第24回(1998年、エルサレム)にも言及している。","label":"第26回(2002)","value":"エディンバラ(スコットランド)、2002年7月29日〜8月2日、参加者1,043名","checkedAt":"2026-08-05","sourceUrl":"https://archive2.iupap.org/general-assembly/24th-general-assembly/reports/c8-report/"},{"note":"IUPAP C8のGeneral Assembly報告。同報告は開催頻度を \"biannual\" と表記している。","label":"C8とICPSの関係","value":"IUPAP Commission C8 の主要活動としてICPSの organization and supervision が挙げられ、各ICPSでC8の委員会を開いて統計や次回開催地を議論すると記載","checkedAt":"2026-08-05","sourceUrl":"https://archive2.iupap.org/general-assembly/24th-general-assembly/reports/c8-report/"},{"note":"ICPS2026公式サイトに会議名の変更や他会議との統合に関する記載はない。","label":"名称変更・統合の履歴","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"}],"title":"会議の来歴と開催地ローテーション","eyebrow":"history"},"program":{"id":"program","body":"Program at a Glanceは8月16日(日)から21日(金)までの時間割を公開しています。口頭セッションは \"Oral sessions (7 parallel)\" の表記で8月17日から20日に置かれ、8月16日と21日にはコマがありません。8月16日はWomen in Physicsとget togetherのみ、8月17日はOpening(10:00-10:40)とSpecial Plenary session(10:40-12:00)から始まり、8月21日はplenary sessionとClosing(11:15-12:00)で終わります。poster sessionは8月18日と20日の17:45-19:30、8月19日の14:00-15:45の3回で、いずれも工学院大学新宿キャンパスが会場です。持ち時間はPresentation Guidelinesに明記されているので、発表準備の分量はそこから決められます。","facts":[{"note":"8月17日から20日にかけて、同表記のコマが繰り返し置かれている。8月16日と8月21日には口頭セッションのコマがない。","label":"2026 口頭セッションの並列数","value":"\"Oral sessions (7 parallel)\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/program-at-a-glance/"},{"note":"Special Plenary Sessionページに演題つきで掲載。von Klitzingは \"Quantum Hall Physics: From Fundamental Discovery to Precision Metrology\"、Amanoは \"Nitride Semiconductors: General Lighting and Beyond\"。","label":"2026 Special Plenary Session","value":"\"Celebrating Quantum in Semiconductor Physics: From Nobel Prize to New Applications\"(Klaus von Klitzing, Max Planck Institute for Solid State Research, Germany / Hiroshi Amano, Nagoya University, Japan)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/special-plenary-session"},{"note":"Plenary Speakersページに7名が演題つきで掲載。Jarillo-Herreroの演題には(tentative)が付されている。","label":"2026 plenary speaker","value":"Klaus Ensslin (ETH Zurich, Switzerland) / Pablo Jarillo-Herrero (MIT, USA) / Umesh Mishra (University of California, Santa Barbara, USA) / Naoto Nagaosa (RIKEN, Japan) / Pascale Senellart (CNRS, France) / Michelle Simmons (University of New South Wales, Australia) / Seigo Tarucha (RIKEN, Japan)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/plenary-speakers"},{"note":"Presentation Guidelinesの Time Schedule 表に session type 別で記載。同ページに \"contributed\" という語は使われておらず、一般口頭発表は Regular と表記されている。","label":"2026 発表持ち時間","value":"Plenary は35分の講演と5分のQ&A(計40分)、Invited は25分と5分(計30分)、Regular は12分と3分(計15分)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/presentation-guidelines"},{"note":"Presentation Guidelinesに記載。掲示はセッション開始前、撤去はセッション後に行い、残置物は主催者が処分する場合があるとされる。","label":"2026 ポスターパネル寸法","value":"\"The size of the poster panel is W900 × H2100 (mm).\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/presentation-guidelines"},{"note":"Sponsorship and Exhibition Opportunitiesページの Exhibition Overview 欄に記載。見出しは \"Exhibition Period (Tentative)\" で、確定日程ではない。","label":"2026 展示会期","value":"August 17 (Mon) Afternoon / August 18 (Tue) 10:00-18:00 / August 19 (Wed) 10:00-18:00 / August 20 (Thu) 10:00-18:00 / August 21 (Fri) Morning(会場は Keio Plaza Hotel, Tokyo)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsorship"}],"title":"2026年のプログラム構成","eyebrow":"program"},"audience":{"id":"audience","body":"学生料金はEarlyとRegularで一般の半額、Last Minuteでは75,000円と160,000円に設定されています。若手向けにはIUPAP Early Career Scientist Prizeの授賞と受賞講演が会期中に置かれます。企業側は協賛ティアと展示ブースの価格が公開されているため、出展判断の材料が事前に揃います。海外からの参加者にはビザ支援書類の発行条件と締切が明記されています。","facts":[{"note":"消費税10%込み。Registrationページの料金表。Early欄には \"(Extended until June 16)\" と付記されている。支払いは日本円のみ。","label":"2026 参加登録費(一般)","value":"Early(延長後・6月16日まで)100,000円 / Regular(6月17日〜8月7日)120,000円 / Last Minute(8月8日以降)160,000円","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"消費税10%込み。Registrationページの料金表。","label":"2026 参加登録費(学生)","value":"Early 50,000円 / Regular 60,000円 / Last Minute 75,000円","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"Registrationページの料金表。banquetは参加登録費に含まれない。","label":"2026 banquet・同伴者","value":"Banquet は一般12,000円・学生9,000円、Accompanying Person 12,000円。参照時点でいずれも Sold Out と表示","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"Registrationページのキャンセルポリシー。変更・取消は事務局への書面連絡が必要で、返金は自動では行われない。","label":"2026 キャンセル規定","value":"\"Before and on June 6 (JST) -- No charge\" / \"On or after June 7 (JST) -- 100% of the registration fee / No refund\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"授賞と受賞講演はICPS2026会期中に行われる。受賞者はIUPAP C8委員が選定する。","label":"2026 IUPAP Early Career Scientist Prize","value":"\"The Early Career Scientist Prizes (ECSP) in Semiconductor Physics are awarded biennially by the IUPAP C8 Commission on Semiconductors\" / 博士号取得後8年以内(キャリア中断は除外)/ 自薦不可 / 推薦締切は2026年3月31日(延長後)/ 2件を授与し、IUPAPメダルと1,000ユーロ、ICPS 2026での招待口頭発表","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/iupap-ecsp"},{"note":"Visaページ。どの国籍にビザが必要かは外務省サイトを参照する案内で、同ページに国別の一覧はない。観光を兼ねた申請は支援対象外と明記。","label":"2026 ビザ支援","value":"Invitation Letter、Letter of Guarantee、Letter of Reason for Invitation、Schedule of Stay、Certificate of Employment of the Inviter を発行。abstract投稿・採択・オンライン登録完了・参加費支払いの4条件をすべて満たすことが必要。申請締切は2026年7月20日(JST)、保証期間は8月14〜24日","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/visa"},{"note":"オーガナイザーはMomoko Deura (Waseda University, Japan)。講演後に質疑と参加者との討論。","label":"2026 Women in Physics session","value":"\"All ICPS participants, regardless of gender or career stage, are welcome to attend this session.\" 4pm - 5pm, August 16, 2026、講演者はGloria Platero (Instituto de Ciencia de Materiales de Madrid, Spain) と Junko Hayase (Keio University, Japan)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/women-in-physics"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"公式サイトのトップに回次入りの正式名称が掲げられており、略称のICPSとサイト名のICPS2026が併用されています。サイトヘッダーには \"Sponsored by\" として SCJ・IUPAP・JPS の3ロゴが、トップページには \"Supported by\" として JSAP・IEICE の2ロゴが置かれますが、いずれも略称のロゴ表示のみで、団体の正式名称は公式サイト上に印字されていません。日本開催回の実務はOrganizing Committeeが担い、chairとvice-chairが実名で公表されています。","facts":[{"note":"公式サイトの全ページのヘッダーとフッターに掲出。第37回にあたる。welcome文では \"the 37th International Conference on the Physics of Semiconductors (ICPS) 2026\" と略称つきで書かれる。","label":"2026 正式名称","value":"The 37th International Conference on the Physics of Semiconductors 2026","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"トップページのwelcome文の原文。biennial(隔年)とpremier forumという自己記述はいずれも公式サイト自身の表現であり、第三者の評価ではない。","label":"開催頻度(公式表記)","value":"\"This biennial meeting is the premier forum for reporting all aspects of semiconductor physics, including electronic, structural, optical, magnetic, and transport properties.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"Vice-Chairsは Hideo Ohno (Tohoku Univ.) と Seigo Tarucha (RIKEN)。Honorary Chairとして Leo Esaki が掲載されている。","label":"2026 Organizing Committee Chair","value":"Yasuhiko Arakawa (The Univ. of Tokyo)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"},{"note":"Vice-Chairは Mikito Koshino (The Univ. of Tokyo)。Organizing Committeeとは別建てのcommitteeとして掲載。","label":"2026 Steering Committee Chair","value":"Masaaki Tanaka (The Univ. of Tokyo)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"}],"title":"会議の正式名称と主催構成","eyebrow":"identity"},"community":{"id":"community","body":"公式サイトはOrganizing、International Advisory、Program、Steeringの四つのcommitteeを別建てで掲載しています。委員一覧には氏名と所属機関が印字されますが、国別の内訳や集計は公式サイトに掲載されていません。sponsorとexhibitorの掲載は、その企業が本会議に出展または協賛したという事実のみを示します。","facts":[{"note":"Committeesページに4つの見出しで分けて掲載されている。","label":"2026 committeeの構成","value":"Organizing Committee / International Advisory Committee / Program Committee / Steering Committee の4体制","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"},{"note":"SponsorsページのDiamond Sponsor / Gold Sponsor / Silver Sponsorの各見出しの下にロゴで掲載され、社名は各ロゴの代替テキストに印字されている。Platinum枠の見出しと掲載社はない。協賛の事実のみを示し、取引・採用・共同研究を示すものではない。","label":"2026 企業sponsor","value":"Diamond Sponsor: Bluefors K.K. / Gold Sponsor: Canon、KIOXIA / Silver Sponsor: EIKO CORPORATION、Nichia Corporation、Tokyo Electron Limited","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsors"},{"note":"SponsorsページのExhibitors欄にロゴで掲載され、社名は各ロゴの代替テキストに印字されている。出展の事実のみを示す。","label":"2026 exhibitor","value":"KEISOKU ENGINEERING SYSTEM CO., LTD.、JEOL Ltd.、ELIONIX INC.、Kenix、Samco、Surugaseiki、EpiQuest、Quantum Design、Quantum Machines、Spectra Quest Lab、R-DEC Co., Ltd.、Apollowave、TEGA Science、SK Fine、Basel Precision Instruments","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsors"},{"note":"Sponsorship and Exhibition Opportunitiesページに記載。ブース総数は同ページに記載がない。","label":"2026 協賛・出展の価格","value":"Diamond 2,000,000円 / Platinum 1,000,000円 / Gold 500,000円 / Silver 200,000円(いずれも消費税10%別)、展示ブースは1小間300,000円(税別)、申込締切は2026年7月3日","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/sponsorship"},{"note":"IUPAP policy statementsページ。conference organisersがハラスメント相談に応じるadvisorを2名、告発された側に助言するadvisorを1名置くとされる。","label":"2026 ハラスメント対応と参加ポリシー","value":"IUPAPの Free Circulation of Scientists と Harassment at Conferences のポリシーを掲示し、\"IUPAP should only sponsor conferences and events at institutions and in countries that uphold this principle\" と記載","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/policy-statement"},{"note":"Committeesページに印字されているのは委員の氏名と所属機関のみで、国・地域別の内訳や集計は掲載されていない。","label":"2026 委員の国別内訳","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/committees"}],"title":"committee構成とsponsor・exhibitor","eyebrow":"community"},"comparison":{"id":"comparison","body":"ICPSは投稿物が1ページabstractのみで、proceedings発行の案内を公式サイトに持ちません。デバイス実装や量産技術を主題にする会議とは、投稿物の重さと成果の残り方が異なります。同じ半導体分野でも、材料別・デバイス別の専門会議とは対象範囲の切り方が違うため、14区分の文言と投稿要件を突き合わせて選ぶことになります。","facts":[{"note":"full paperやextended abstractの提出要求はAbstract Submissionページに記載がない。","label":"2026 投稿物の重さ","value":"投稿物は約40語のshort abstractと1ページabstractのPDFのみ","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"毎年開催の会議と比べて次の投稿機会が2年後になる。トップページのwelcome文に記載。","label":"2026 開催間隔","value":"biennial(隔年)","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"プロセス統合や歩留まり、量産技術に対応する区分はConference Topicsの一覧にない。","label":"2026 対象の切り方","value":"14区分に量子ホール効果、topological states of matter、semiconductor qubits、cryo-CMOSなどの物理現象・量子技術側の区分が並ぶ","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/conference-topics"}],"title":"近い会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿はプレーンテキストのshort abstractと1ページPDFの二部構成で、公式テンプレートの使用が指定されています。フォント指定が細かく、日本語などの2バイト文字は不可と明記されているため、和文環境で作成する場合はフォント埋め込みまで確認が要ります。2026年サイクルの締切は3月15日から3月29日に延長され、現在は投稿受付が閉じています。","facts":[{"note":"Abstract Submissionページの \"Requirements for Submitting a One-Page Abstract\" に記載。","label":"2026 投稿の構成","value":"\"a short abstract of approximately 40 words (about 300 characters; plain text)\" と \"a one-page abstract uploaded as a PDF file\" の二部構成","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"テンプレートは同ページの Abstract Template Download からダウンロードする指定で、ファイルは ICPS2026_Abstract_Template.docx。","label":"2026 abstract書式","value":"\"Authors must prepare a one-page abstract on A4 size paper (portrait) using the official ICPS abstract template.\" / ページ番号は付けない / タイトル・著者名・所属・参考文献・図をすべて1ページ内に収める","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページのフォーマット要件に明記。","label":"2026 言語とフォント","value":"\"All abstracts must be written in English\" / \"Only single-byte Roman fonts (e.g., Times or Times New Roman) may be used.\" / \"The use of double-byte characters (e.g., Japanese, Korean, Chinese) and Asian fonts is not permitted.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページに記載。","label":"2026 提出方法","value":"PDFファイルのオンライン提出のみ。\"Abstracts submitted by e-mail or postal mail will not be accepted\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページに当初締切と延長後締切の両方が掲載されている。参照時点で投稿受付はCLOSEDと表示。","label":"2026 abstract締切","value":"当初 \"March 15, 2026, 23:59 PDT (UTC−07:00)\" 、延長後 \"Extended to March 29, 2026, 23:59 PDT (UTC−07:00)\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"確定した日付ではなく5月中旬という表現で掲載されている。","label":"2026 採否通知","value":"\"Acceptance Notification: By mid-May\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページにcamera-ready、最終稿差し替え、著作権譲渡に関する記載はない。","label":"2026 camera-ready・最終原稿","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Abstract Submissionページに投稿本数の上限に関する記述はない。","label":"2026 一人あたりの投稿件数上限","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"公式サイトはOnline Programを外部のConfitで提供しており、プログラムとabstractの閲覧はそこに集約されています。一方でproceedingsの発行先、IEEE Xplore等への収録、特集号への招待に関する記載は公式ページに見当たりません。発表資料の扱いについてはPresentation Guidelinesに会場PC上のデータ消去の方針が書かれています。","facts":[{"note":"ICPS2026公式サイトのナビゲーション「Online Program」のリンク先。参照時点で当該URLへの機械的アクセスは403応答となり、本文は確認できていない。","label":"2026 Online Programの提供先","value":"https://pub.confit.atlas.jp/en/event/icps2026","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/"},{"note":"Abstract Submissionページにproceedings、論文誌特集号、著作権譲渡に関する記述はない。","label":"2026 proceedings掲載先","value":"公開されていない","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/abstract-submission"},{"note":"Presentation Guidelinesの Confidentiality の項に記載。","label":"2026 発表データの取り扱い","value":"\"All presentation data stored on conference equipment will be completely deleted after the session.\"","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/presentation-guidelines"},{"note":"Registrationページの参加費に含まれるものの説明。\"Admission to social events, except for the banquet.\" も含まれる。","label":"2026 セッション聴講の範囲","value":"参加登録に \"Admission to the plenary session, special plenary session, and all technical sessions.\" が含まれる","checkedAt":"2026-08-05","sourceUrl":"https://icps2026.jp/registration"},{"note":"DBLPの検索結果ページで確認。計算機系の書誌データベースに会議録が索引されていないことを示すのみで、他の出版形態の有無を否定するものではない。","label":"DBLPにおけるvenueレコード","value":"\"International Conference on the Physics of Semiconductors\" で検索した結果、venue・publication ともに no matches","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/search?q=International+Conference+on+the+Physics+of+Semiconductors"}],"title":"発表内容の公開範囲とproceedings","eyebrow":"publication"}},"sources":[{"url":"https://icps2026.jp/","role":"official","label":"ICPS2026 公式トップページ","checkedAt":"2026-08-05","evidenceLocator":"ヘッダーの会議名と \"Sponsored by\" ロゴ、会期・会場の帯、welcome文(biennial / premier forum / heritage dating back to the 1950s)、\"Supported by\" ロゴ、およびグローバルナビゲーションのリンク一覧"},{"url":"https://icps2026.jp/abstract-submission","role":"cfp","label":"ICPS2026 Abstract Submission","checkedAt":"2026-08-05","evidenceLocator":"冒頭の締切欄(当初・延長後)と Acceptance Notification、Presentation Type 欄のProgram Committee決定の記述、Requirements for Submitting a One-Page Abstract 欄の書式・フォント・言語規定、Abstract Template Download"},{"url":"https://icps2026.jp/conference-topics","role":"cfp","label":"ICPS2026 Conference Topics","checkedAt":"2026-08-05","evidenceLocator":"本文に Category 1〜Category 14 の番号付きで列挙されたカテゴリ一覧"},{"url":"https://icps2026.jp/committees","role":"committee","label":"ICPS2026 Committees","checkedAt":"2026-08-05","evidenceLocator":"Organizing / International Advisory / Program / Steering の各見出しと、chair・vice-chairの氏名と所属、Category 1〜14ごとのSubcommittee Chairと委員一覧"},{"url":"https://icps2026.jp/program-at-a-glance/","role":"program","label":"ICPS2026 Program at a Glance","checkedAt":"2026-08-05","evidenceLocator":"8/16(Sun)から8/21(Fri)までの列を持つタイムテーブル。Oral sessions (7 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Athenaeum Athens Hotelで開催されます。会期のうち10月31日と11月1日はworkshopとtutorialの日程です。hybridやオンライン参加についての記載は、2026年8月5日時点のAttendページにありません。","question":"MICRO 2026はいつ、どこで開催されますか。","sourceUrls":["https://www.microarch.org/micro59/","https://www.microarch.org/micro59/attend/","https://www.microarch.org/micro59/submit/workshops.php"]},{"answer":"abstract締切が2026年3月31日 11:59 PM EDT、full paper締切が2026年4月7日 11:59 PM EDTでした。その後、rebuttal/revisionが2026年6月3日から17日、著者通知が7月7日、camera-readyが9月11日です。workshop/tutorialの提案締切は2026年5月29日、通知は6月12日でした。","question":"MICRO 2026の投稿締切はいつでしたか。","sourceUrls":["https://www.microarch.org/micro59/submit/papers.php","https://www.microarch.org/micro59/submit/workshops.php"]},{"answer":"あります。Regular Trackは「All submissions will undergo a rigorous double-blind peer-review process」と明記されており、著者名の非記載、PDFメタデータの削除、artifactリンクの匿名化、謝辞の非記載、自己引用の三人称化が求められます。一方、2026年に新設されたIndustry Trackは「Single-Blind Review」で、全著者の所属開示が必要です。","question":"査読はありますか。どのような方式ですか。","sourceUrls":["https://www.microarch.org/micro59/submit/papers.php","https://www.microarch.org/micro59/submit/guidelines.php","https://www.microarch.org/micro59/submit/industrial.php"]},{"answer":"公表されていません。MICRO 2026のCall for Papersにも、完了済みのMICRO 2025のサイトにも、採択率や投稿本数の記載はありません。数値が必要な場合は、公式が掲示していないという前提で扱ってください。","question":"採択率は公表されていますか。","sourceUrls":["https://www.microarch.org/micro59/submit/papers.php","https://microarch.org/micro58/"]},{"answer":"2026年のOrganizing Committeeには大学・研究機関に加えてAMDとNVIDIAの役職者が入っており、2026年からは企業実務者向けにIndustry Trackが新設されました。Industry Trackは実運用中の製品の事後評価、tape-out間近のロードマップ、test chipの結果、中止された製品計画から得られた教訓を対象としており、投稿時にmain trackではなくIndustry Trackに属する理由の説明を添えます。","question":"誰が論文を出す会議ですか。企業からも出せますか。","sourceUrls":["https://www.microarch.org/micro59/committees/org.php","https://www.microarch.org/micro59/submit/industrial.php"]},{"answer":"会議のproceedingsに掲載されます。MICRO 2025は「Proceedings of the 58th IEEE/ACM International Symposium on Microarchitecture, MICRO 2025, Seoul, Republic of Korea, October 18-22, 2025」としてACMから刊行され、ISBNは979-8-4007-1573-0です。発行元は年により入れ替わり、DBLPの記録では2024年はIEEE、2023年はACMです。Industry Track論文もregular MICRO paperとして収録され、proceedings上ではIndustry Trackとラベル付けされません。","question":"採択された論文はどこに掲載されますか。","sourceUrls":["https://dblp.org/db/conf/micro/micro2025.html","https://dblp.org/db/conf/micro/index.html","https://www.microarch.org/micro59/submit/industrial.php"]},{"answer":"2026年8月5日時点で、MICRO 2026の参加区分別の登録料金は公式サイトに掲載されていません。公表されているのは早期登録締切(2026年9月28日 AoE)と、会場ホテルの宿泊料金(Single €280.00、Double・Twin €295.00、税・料金・ビュッフェ朝食・Wi-Fi込み、別途Climate Crisis Resilience fee)、およびgroup rateと無料キャンセルの期限(2026年10月2日)です。","question":"参加費はいくらですか。","sourceUrls":["https://www.microarch.org/micro59/attend/","https://www.microarch.org/micro59/"]},{"answer":"開催国はギリシャで、ビザ要件はギリシャ外務省のサイトで確認するよう案内されています。招聘状はRegistration Chair(vkarakos@di.uoa.gr)に依頼しますが、発行には会議登録の完了が必要で、依頼締切は記載されていません。過去の日本開催はMICRO-51(2018年、福岡)で、公式の過去開催一覧に記載されています。","question":"日本から参加する場合に確認すべき点はありますか。","sourceUrls":["https://www.microarch.org/micro59/attend/visa.php","https://www.microarch.org/past.html"]}],"headline":"MICRO 2026(第59回)の公式ページと、完了済みのMICRO 2025(第58回)の公式ページを突き合わせ、会期・投稿区分・締切・査読方式・掲載先・委員会構成を公式記載のまま整理します。","metaDescription":"MICRO(IEEE/ACM International Symposium on Microarchitecture)の公式情報。第59回は2026年10月31日から11月4日にアテネで開催。会期・投稿締切・double-blind査読・11ページ制限・掲載先を確認できます。","oneLine":"MICRO(IEEE/ACM International Symposium on Microarchitecture)は、ACM SIGMICROとIEEE TCuARCHが技術協賛する年次のマイクロアーキテクチャ会議で、第59回(MICRO 2026)は2026年10月31日から11月4日までギリシャ・アテネで開催されます。","pageTitle":"MICROとは｜IEEE/ACM International Symposium on Microarchitectureの公式情報","relatedConferenceIds":["acm-ieee-international-symposium-on-computer-architecture","hot-chips","isscc","dac","iccad","islped"],"sections":{"cycle":{"id":"cycle","body":"MICRO 2026は本会議の前にworkshop/tutorialの日程が置かれ、5日間の日程全体がアテネの同一ホテルで組まれています。宿泊のgroup rateには締切があり、早期登録締切と別日付なので、渡航手配では2つの日付を分けて管理してください。前サイクルのMICRO 2025はソウル開催で、会期・会場ともに公式サイトに残っています。","facts":[{"note":"MICRO 2026トップページの会期表示。","label":"2026 会期","value":"October 31 – November 4, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"MICRO 2026トップページに記載。","label":"2026 開催都市・国","value":"Athens, Greece","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"Attendページに会場ホテルとして記載。group rateと無料キャンセルは2026年10月2日まで。","label":"2026 会場","value":"InterContinental Athenaeum Athens Hotel。宿泊のgroup rateはSingle Room €280.00 / Double・Twin Room €295.00(1泊あたり、税・料金・ビュッフェ朝食・Wi-Fi込み)で、別途Climate Crisis Resilience fee(10月末まで€15、11月1日以降€4、1室1泊あたり)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/attend/"},{"note":"Call for Workshops & Tutorialsに記載。","label":"2026 workshop/tutorial 日程","value":"October 31 – November 1, 2026(本会議に先行して開催)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/workshops.php"},{"note":"MICRO 2026トップページのkey dates欄に記載。Author Registration Deadlineは September 11, 2026 AoE と別掲。","label":"2026 早期登録締切","value":"Early Registration Deadline: September 28, 2026 AoE","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"MICRO 2025サイトに記載。","label":"2025 会期・都市・会場","value":"October 18–22, 2025 / Seoul, Korea / Lotte Hotel Seoul","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"オンライン配信の可否は2026年8月5日時点で公式に記載されていない。","label":"開催形式の記載","value":"Attendページには hybrid・オンライン参加についての記載がない。掲載されている見出しは会場ホテル、室料、予約期限、支払・キャンセル条件、追加情報、アテネ観光、会場地図、参加者行動指針","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/attend/"},{"note":"2026年8月5日時点の確認。","label":"2027年以降の開催地","value":"会議シリーズのトップページはMICRO-59(2026, Athens, Greece)までの各回へのリンクとPast Symposiaへのリンクのみを掲示しており、2027年以降の開催地は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/"}],"title":"MICRO 2026(第59回)の会期・会場と直前サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"Call for Papersが列挙する対象領域は、プロセッサ・メモリ・ストレージのアーキテクチャから、アクセラレータ、インターコネクト、量子計算、モデリング手法までを含みます。2026年からはRegular Trackに加えてIndustry Trackが設けられ、量産シリコンに関わる報告の受け皿が分かれました。投稿先を決めるときは、Industry Trackが求める報告の型(製品の事後評価、tape-out間近のロードマップ、test chip結果、中止プロジェクトの教訓)に自分の内容が当たるかを先に確認してください。","facts":[{"note":"Call for Papers冒頭の対象記述。","label":"2026 対象領域(CFPの記載)","value":"microarchitecture、compilers、hardware/software interfaces、advanced computing and communication systemsの設計に関する新しいアイデア","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Call for Papersのtopics列挙。","label":"2026 topics of interest","value":"性能・電力・エネルギー効率、セキュリティ・プライバシ・信頼性のためのマイクロアーキテクチャ技術、プロセッサ/メモリ/ストレージアーキテクチャ、マルチコア・マルチプロセッサ、instruction-/thread-/data-level parallelism、予測と投機機構、メモリ階層設計、クラウド・データセンタ、IoT・モバイル・組込み、interconnection networks・routers・network interface architectures、アクセラレータおよびreconfigurableアーキテクチャ、不揮発/永続メモリへのアーキテクチャ支援、quantum computing、in-/near-memory or in-/near-storage processing、回路・技術がアーキテクチャに与える影響、アーキテクチャのモデリング・シミュレーション・ベンチマーク手法、実システムの評価と測定","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Call for Papersに投稿サイトが両トラック共通と記載。","label":"2026 トラック構成","value":"Regular TrackとIndustry Trackの2トラック。HotCRPの投稿サイトは「both Tracks」共通","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Industry Track向けCall for Papersに記載。ページには「its first Inaugural Industry Track」と書かれている。","label":"2026 Industry Trackの対象","value":"実運用中の製品の事後評価(Retrospective Evaluations)、tape-out間近の製品ロードマップ(Upcoming Roadmaps)、新しいアーキテクチャの検証に用いた実験シリコンの結果(Test Chips)、中止された製品計画から得られた教訓(Insightful Cancellations)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"Submission Guidelinesの重複投稿に関する記載。","label":"対象外(投稿できないもの)","value":"実質的に同一の形で既に会議・論文誌・archived proceedingsを持つworkshopで公表済みまたは採択済みの原稿は投稿できない。archived proceedingsを持たないworkshopや、IEEE CAL、arXivは例外として扱われる","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/guidelines.php"}],"title":"対象領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"Regular Trackはdouble-blindで、匿名化の要件が個別に列挙されています。Industry Trackはsingle-blindで全著者の所属開示が必要なため、同じ締切でも原稿の作り方が変わります。rebuttal/revision期間が2週間確保されている点も、投稿後のスケジュールに組み込んでおいてください。","facts":[{"note":"Call for Papersの査読に関する記述。","label":"2026 Regular Trackの査読方式","value":"「All submissions will undergo a rigorous double-blind peer-review process」と記載","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"査読者が評価対象の製品とデータ提供元の企業を把握する必要があるためと説明されている。novelty評価の基準は異なりうるが、技術的深さと評価の水準はmain trackと同等と記載。","label":"2026 Industry Trackの査読方式","value":"「Single-Blind Review: Submissions must disclose the affiliations of all authors」と記載","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"Submission Guidelinesに列挙。","label":"2026 匿名化の要件","value":"投稿書類に著者名を記載しない(投稿フォームの所定欄を除く)、著者を特定できるPDFメタデータの削除、GitHub等のartifactリンクの完全な匿名化(匿名化できないリンクは削除)、謝辞の非記載、自身の先行研究は三人称で引用。匿名化ポリシー違反の論文は査読なしでrejectされる場合がある","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/guidelines.php"},{"note":"Call for Papersのimportant datesに記載。","label":"2026 rebuttal/revision期間","value":"June 3-17, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"General Chair(s)の投稿が明示的に認められる理由として、論文選考にもProgram Chair・Program Committeeの選定にも関与しないことが挙げられている。","label":"2026 委員の投稿可否","value":"Program Chair(s)は論文選考の責任者であり、偏りを避けるため論文を投稿しない。Program Committee membersとOrganizing Committee(General Chair(s)を含む)は、double-blind査読と利益相反(conflict-of-interest)の申告・運用があるため投稿できる","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Call for Papersに記載。「desk reject」という語は使われていない。","label":"2026 書式不遵守の扱い","value":"「Papers that violate these guidelines may be returned to the authors without review」と記載され、書式・投稿ガイドラインに従わない論文は査読なしで著者に返却される場合がある","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Organizing Committeeページは氏名・役職・所属のみを掲載し、評価の手順や締切は同ページには記載がない(別途Artifact Evaluationページへのリンクがある)。","label":"2026 artifact evaluation体制","value":"Artifact Evaluation Co-Chairsとして Qijing Jenny Huang (NVIDIA) と Sagar Karandikar (University of California, Berkeley) が置かれている","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"2026年8月5日時点の確認。","label":"採択率","value":"Call for Papersに採択率や採択本数の目標に関する記載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"}],"title":"査読方式と審査運用","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年8月5日時点で公式ページが掲載していないものを先に挙げます。参加区分別の登録料金額、MICRO 2026のセッション構成とkeynote、採択率・採択本数・投稿本数、参加者数、2027年以降の開催地、hybrid・オンライン参加の可否です。企業の売上・採用・共同研究に関する記載も公式ページにはありません。sponsor欄が示すのは当該大会への支援・技術協賛の事実だけなので、そこから取引関係を読み取ることはできません。","facts":[{"note":"早期登録締切(September 28, 2026 AoE)のみトップページに記載。2026年8月5日時点の確認。","label":"参加登録費","value":"Attendページには会場ホテル、室料、予約期限、支払・キャンセル条件の見出しと登録ページへのリンクがあるが、参加区分別の登録料金額は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/attend/"},{"note":"2026年8月5日時点の確認。","label":"採択率・投稿数・参加者数","value":"MICRO 2026のCall for Papersに、採択率、採択本数、投稿本数、参加者数の掲載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"2026年8月5日時点の確認。","label":"MICRO 2025サイトの数値掲載","value":"完了済みのMICRO 2025サイトにも、採択率、投稿本数、参加者数の掲載はない","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"2026年8月5日時点の確認。","label":"sponsor掲載の読み方","value":"MICRO 2026トップページのsponsor欄はtier(Diamond / Platinum / Gold / Technical Sponsors)と企業・団体名だけを掲示しており、取引関係・売上・採用・共同研究を示す記載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"}],"title":"未公開項目と読み違えやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"公式の過去開催一覧はMICRO-1(1968年)からMICRO-57(2024年)まで連続して回次・年・開催地を記載しており、初回開催年の根拠はこのページにあります。開催地は北米が多いものの、1989年以降は欧州・中東・南米・アジアにも広がっています。2020年と2021年はアテネからのオンライン開催として記録されています。","facts":[{"note":"公式の「List of Past MICRO Symposia」の末尾(最古)に記載。同一覧の最新項目はMICRO-57 (2024, Austin, Texas)。","label":"初回開催","value":"MICRO-1 (1968, Bedford, Massachusetts)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/past.html"},{"note":"公式の過去開催一覧の記載。","label":"北米以外の開催(公式一覧より)","value":"MICRO-22 (1989, Dublin, Ireland)、MICRO-29 (1996, Paris, France)、MICRO-32 (1999, Haifa, Israel)、MICRO-35 (2002, Istanbul, Turkey)、MICRO-38 (2005, Barcelona, Spain)、MICRO-41 (2008, Lake Como, Italy)、MICRO-44 (2011, Porto Alegre, Brazil)、MICRO-45 (2012, Vancouver, Canada)、MICRO-47 (2014, Cambridge, United Kingdom)、MICRO-49 (2016, Taipei, Taiwan)、MICRO-51 (2018, Fukuoka, Japan)、MICRO-56 (2023, Toronto, Canada)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/past.html"},{"note":"公式の過去開催一覧に記載された唯一の日本開催回。","label":"日本開催","value":"MICRO-51 (2018, Fukuoka, Japan)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/past.html"},{"note":"アテネは2020年・2021年にも配信元として記載されている。","label":"オンライン開催の回","value":"MICRO-53 (2020) と MICRO-54 (2021) は「global online event broadcast from Athens, Greece」として記載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/past.html"},{"note":"現行のbylawsはv1.2、2025年3月更新。","label":"bylaws制定","value":"2018年9月30日付のnewsで、MICRO Steering CommitteeがSteering Committeeと各年のchairの役割・責任を明文化するbylawsを策定し、version 1.1がSteering Committeeで全会一致で承認され、ACM SIGMICROとIEEE TCuARCHが全会一致で是認したと告知","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/news/"},{"note":"MICRO 2026のCFPでも、Program Chair(s)のみが投稿しない運用として記載されている。","label":"bylaws改訂(2025年)","value":"2025年3月23日付「MICRO Bylaws Updated」のnewsで、MICRO Steering Committeeがgeneral chairs(およびorganizing committeeの他のメンバー)が自身の運営する会議に論文を投稿できるようにすることを全会一致で合意したと告知","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/news/"},{"note":"newsページは受賞論文の題名と著者を列挙している。","label":"Test of Time Awardの過去表彰","value":"2021年1月18日付のnewsで、2020 MICRO Test of Time Awardとして「A Dynamic Multithreading Processor」(MICRO 1998)、「Fetch Directed Instruction Prefetching」(MICRO 1999)、「A Permutation-Based Page Interleaving Scheme to Reduce Row-Buffer Conflicts and Exploit Data Locality」(MICRO 2000)の3件を告知。2018年10月23日付のnewsでは3件を告知","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/news/"}],"title":"沿革と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"MICRO 2026のプログラムはまだ公開されていないため、当日の構成を見積もるにはMICRO 2025の確定プログラムを参照するのが実務的です。2025年はworkshop/tutorialに2日、本会議に3日を充て、本会議の初日と2日目の朝にkeynoteが置かれました。workshopとtutorialは計26件が並列開催されています。","facts":[{"note":"MICRO 2025 Main Programに記載。","label":"2025 プログラム構成","value":"10月18日・19日にworkshops & tutorials、19日夕方にSRC Poster Session(17:00–19:00)とWelcome Reception(18:00–21:00)。10月20日から22日が本会議で、並列セッション構成","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/program/"},{"note":"Keynotes & Special Panelページに記載。","label":"2025 keynote(1)","value":"Luis Ceze (NVIDIA and University of Washington)「AI compilers and inference at scale: efficiency and velocity」10月20日 8:30–9:30 KST","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro58/program/keynote.php"},{"note":"Keynotes & Special Panelページに記載。","label":"2025 keynote(2)","value":"Onur Mutlu (ETH Zürich)「Can We Do Better?」10月21日 8:00–9:00 KST","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro58/program/keynote.php"},{"note":"所属は公式ページの表記のまま。","label":"2025 special panel","value":"「AI Demon Hunters」10月21日 15:30–16:30 KST。moderatorはGabriel Loh (AMD Research)。panelistはTrevor Carlson (National University of Singapore)、Deming Chen (University of Illinois at Champaign-Urbana)、Esha Choukse (Microsoft Azure Research)、Daehyun Kim (Samsung Research)、Hoshik Kim (SK Hynix)、Hyesoon Kim (Georgia Institute of Technology)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro58/program/keynote.php"},{"note":"2日間で計26件が午前(8:00–12:00 KST)・午後(13:00–17:00 KST)の枠に並列配置されている。","label":"2025 workshop/tutorial(抜粋)","value":"10月18日午前に「Programming and Evaluating Performance of Novel AI Accelerators」「Computer Architecture Modeling and Simulation (CAMS)」「SHARQ: Secure Hardware and Architectures for Quantum Computing Systems」など。午後に「ZKARCH - 1st Workshop on Architectures for Zero-Knowledge Proofs and Verifiable Computation」「Workshop on Architecture for Health - Arch4Health」など。10月19日には「Hardware and Architectural Support for Security and Privacy (HASP)」「5th International Workshop on High Performance Chiplet and Interconnect Architectures (HiPChips)」「Seventh Annual Workshop on Domain Specific System Architecture (DoSSA-7)」「DRAM Standardization Trends, Commercialization Status, and Challenges」など","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro58/program/workshops.php"},{"note":"著者通知が2026年7月7日、camera-readyが9月11日という日程。2026年8月5日時点の確認。","label":"2026 プログラム公開状況","value":"MICRO 2026トップページに掲載されているのはkey datesとsponsorのみで、セッション構成やkeynoteは掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"Organizing Committeeページの表記のまま。","label":"2026 Student Research Competition","value":"Student Research Competition Co-Chairsとして Saugata Ghose (University of Illinois Urbana-Champaign) と Christina Giannoula (Max Planck Institute) が置かれている","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"}],"title":"プログラム構成(2025年実績と2026年の予定)","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からの投稿では、abstract締切での著者確定、11ページ・appendix不可、匿名化要件の3点が原稿計画を左右します。学生の参加にはStudent Research CompetitionとTravel Awardsの窓口が置かれています。企業の調査担当は、当該年のprogramとworkshop一覧、およびsponsor掲載を、そのままでは技術動向の一次情報として扱わず、掲載の意味(支援の事実)を区別して読んでください。","facts":[{"note":"Organizing Committeeページは氏名・役職・所属のみを掲載しており、各制度の応募要項は同ページには含まれない。","label":"学生向けの窓口","value":"Student Research Competition Co-Chairs、Travel Awards Chair (Baris Kasikci, University of Washington)、MaSS/MaSA Co-Chairs が2026年のOrganizing Committeeに置かれている","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"MICRO 2025サイトのsponsor掲載欄の記載。","label":"学生渡航支援(2025年実績)","value":"MICRO 2025のStudent Travel Sponsorsとして TCuARCH と ACM SIGMICRO が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"招聘状依頼の締切は当該ページに記載がない。","label":"2026 ビザ・招聘状","value":"ビザ要件はギリシャ外務省(Hellenic Republic's Ministry of Foreign Affairs)のサイトで確認するよう案内。招聘状はRegistration Chair(vkarakos@di.uoa.gr)に件名「MICRO 2026 VISA Support Request」で依頼し、発行には会議登録の完了が必要。依頼時は氏名(パスポート表記)、所属と職位、パスポート番号、発行国、生年月日、登録番号、該当する場合は論文タイトルを提供する","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/attend/visa.php"},{"note":"Industry Track向けCFPに記載。","label":"企業からの投稿経路","value":"Industry Trackへ投稿する際は、その論文がmain trackではなくIndustry Trackに属する理由を述べた短い説明を添える必要がある。書式(フォントサイズ・ページ数を含む)はMICRO共通のガイドラインに従う","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"MICRO 2026のプログラムが未公開の段階では、この確定プログラムが参照材料になる。","label":"当日構成の予習材料","value":"MICRO 2025のMain Programは、10月20日から22日の3日間に並列セッションを配置し、初日と2日目の朝にkeynoteを置く構成で公開されている","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/program/"}],"title":"研究室と企業での使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"公式サイトは回ごとに第N回を冠した名称を掲げており、2026年開催分は第59回、2025年開催分は第58回として表記されています。技術協賛はACM SIGMICROとTCuARCHの2団体で、会議そのものの意思決定はbylawsで定義されたSteering Committeeが担います。投稿や問い合わせの宛先を判断するときは、開催年ごとのOrganizing Committeeと、年をまたいで継続するSteering Committeeを分けて参照してください。","facts":[{"note":"MICRO 2026のトップページに掲げられた名称。®付きで表記されている。","label":"2026 正式名称","value":"59th IEEE/ACM International Symposium on Microarchitecture®","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"完了済みのMICRO 2025サイトに掲げられた名称。","label":"2025 正式名称","value":"58th IEEE/ACM International Symposium on Microarchitecture®","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"MICRO 2026トップページのsponsor欄に「Technical Sponsors」の見出しで2団体が掲載されている。","label":"2026 技術協賛","value":"Technical Sponsors: ACM SIGMICRO / TCuARCH","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"bylaws v1.2(2025年3月更新)に記載された構成。","label":"運営体制","value":"Steering Committeeが運営。構成は「at least 12 members」で、ACM SIGMICRO代表2名(SIGMICRO Chairが指名)、IEEE TCuARCH代表2名(TCuARCH Chairが指名)、3年任期の一般メンバー6名、1年任期の前回大会chair 2〜4名","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/bylaws.html"},{"note":"DBLPが収録する会議名の表記。","label":"開催頻度","value":"年次開催。DBLPは会議名を「Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)」として収録している","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/micro/index.html"},{"note":"この表現は公式サイト自身の記載であり、第三者による順位付けではない。","label":"会議の位置づけ(公式の記載)","value":"公式サイトはMICROを \"the premier forum\" と表現し、microarchitecture、compilers、hardware/software interfaces、advanced computing and communication systemsの新しいアイデアを発表・議論する場だと記載している","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Organizing Committeeは開催年ごとに編成され、大学と企業の双方から役職者が出ています。Steering Committeeは年をまたいで継続し、ACM SIGMICROとIEEE TCuARCHの代表枠が明示されています。sponsor掲載は当該年の大会を支援した事実を示すもので、そこから取引関係や採用・共同研究を読み取ることはできません。","facts":[{"note":"Organizing Committeeページの表記のまま。","label":"2026 General Chair","value":"Dimitris Gizopoulos (National and Kapodistrian University of Athens)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"Organizing Committeeページの表記のまま。","label":"2026 Program Co-Chairs","value":"Tushar Krishna (Georgia Institute of Technology) / Yakun Sophia Shao (University of California, Berkeley)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"Organizing Committeeページの表記のまま。","label":"2026 Industry Track Program Chair","value":"Gilles Pokam (AMD)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"公式ページに印字された所属の一覧。大学・研究機関に加えAMDとNVIDIAが役職に入っている。国名は機関名の表記に基づく。","label":"2026 Organizing Committeeの所属機関","value":"National and Kapodistrian University of Athens、Georgia Institute of Technology、University of California Berkeley、AMD、Politecnico di Torino、Hebrew University of Jerusalem、Shanghai Jiao Tong University、New York University Abu Dhabi、University of Edinburgh / Georgia Institute of Technology、KAIST、NTUA、University of Washington、University of Athens、University of Illinois Urbana-Champaign、Max Planck Institute、NVIDIA、University of Texas at Austin","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/org.php"},{"note":"計14名。IEEE TCuARCH repとして掲載されているのは1名。所属は公式ページの表記のまま。","label":"Steering Committee(2026サイト掲載)","value":"Chair: Lieven Eeckhout (Ghent University)。ACM SIGMICRO rep: Reetuparna Das (University of Michigan)、Onur Mutlu (ETH Zürich)。IEEE TCuARCH rep: Guru Venkataramani (GWU)。member: Erik Altman (IBM)、Jason Clemons (NVIDIA)、Mattan Erez (University of Texas at Austin)、Dimitris Gizopoulos (National and Kapodistrian University of Athens)、Aamer Jaleel (NVIDIA)、Hanjun Kim (Yonsei University)、Hyesoon Kim (Georgia Institute of Technology)、Minsoo Rhu (KAIST)、Won Woo Ro (Yonsei University)、Radu Teodorescu (Ohio State University)","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/committees/steering.php"},{"note":"MICRO 2026トップページのsponsor掲載。掲載は当該大会への支援を示すもので、取引・採用・共同研究を示すものではない。","label":"2026 sponsor掲載","value":"Diamond Sponsors: ByteDance。Platinum Sponsors: Semidynamics。Gold Sponsors: Panmnesia、Arm、IBM、Links Foundation。Technical Sponsors: ACM SIGMICRO、TCuARCH","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/"},{"note":"MICRO 2025サイトのsponsor掲載。掲載は当該大会への支援を示すもので、取引・採用・共同研究を示すものではない。","label":"2025 sponsor掲載","value":"Platinum: MangoBoost、XCENA、Mobilint、HyperAccel、Panmnesia、Samsung、SK hynix、Huawei、Ant Research、FriendliAI。Gold: Intel、Arm、FuriosaAI、AMD、Qualcomm、IBM、Yonsei University、Seoul National University。Silver: Google。Technical: ACM SIGMICRO、TCuARCH。Student Travel Sponsors: TCuARCH、ACM SIGMICRO。Domestic Sponsors: Bleisure Seoul、Visit Seoul","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"コミュニティからの推薦により選出される枠に対応する告知。","label":"Steering Committeeの改選","value":"2025年10月4日付のnewsで、2026年1月開始の3年任期のelected memberを対象としたSteering Committee推薦の受付(締切2025年10月31日)が告知された","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/news/"}],"title":"委員会構成とsponsor掲載","eyebrow":"community"},"comparison":{"id":"comparison","body":"同じ回路・システム領域の学会と並べるときは、対象領域の記述、査読方式、ページ数上限、産業側投稿の受け皿の4点を公式記載どうしで突き合わせてください。MICROはCFPで対象をmicroarchitecture、compilers、hardware/software interfacesと明記し、Regular Trackをdouble-blind、Industry Trackをsingle-blindと分けています。回路実装そのものの測定結果を主眼とする学会や、設計自動化を主題とする学会とは、CFPが列挙するtopicsの粒度で線引きを確認できます。","facts":[{"note":"CFP冒頭の対象記述。デバイス製造プロセスや回路実装の測定を主題とする旨の記載はない。","label":"MICROが明記する対象の軸","value":"microarchitecture、compilers、hardware/software interfaces、advanced computing and communication systemsの設計","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"産業発表を非査読のinvited扱いにせず、proceedings収録の査読論文として扱う設計。","label":"産業側投稿の受け皿","value":"2026年に「first Inaugural Industry Track」としてIndustry Trackを設置。single-blindで所属を開示し、採択論文はregular MICRO paperとしてproceedingsに掲載される","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"単一学会の主催ではなく、両団体の代表枠が制度として明記されている。","label":"二学会共同の運営","value":"Steering CommitteeにACM SIGMICRO代表2名とIEEE TCuARCH代表2名の枠が定められている","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/bylaws.html"}],"title":"近接する学会と比べるときの確認点","eyebrow":"comparison"},"submission":{"id":"submission","body":"abstractの事前登録が本文投稿より1週間早く、著者の追加はabstract締切までに完了させる必要があります。本文は11ページ以内でappendixが認められないため、評価データの置き場所を設計段階で決めておいてください。書式に違反した論文は査読なしで著者に返却される場合があると明記されています。","facts":[{"note":"Industry Track向けCFPに「the submission deadline is the same for the Industry Track and the Regular Track」と記載。","label":"2026 投稿区分","value":"Regular Track / Industry Track。両トラックの投稿締切は同一","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"Submission Guidelinesの記載。","label":"2026 ページ数","value":"本文は2段組・シングルスペースで最大11ページ(referencesを含まない)。referencesはページ数制限なしで全著者名の列挙が必要。appendixは認められない","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/guidelines.php"},{"note":"別のソフトウェアで組版する場合も上記ガイドラインに従う必要があると記載。行間の詰めによる調整は認められない。","label":"2026 書式","value":"本文9pt Times、section heading 12pt、subsection heading 10pt、references 8pt。用紙はUS Letter(8.5in×11in)、上下1インチ・左右0.75インチ余白、2段組・段間0.25in、行送り11pt。LaTeXテンプレートの使用が強く推奨される","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/guidelines.php"},{"note":"Call for PapersのImportant Datesに記載。abstractが本文より1週間先行する。","label":"2026 投稿締切","value":"Abstract Deadline: March 31, 2026 at 11:59 PM EDT / Full Paper Deadline: April 7, 2026 at 11:59 PM EDT","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Call for PapersのImportant Datesに記載。","label":"2026 通知日とcamera-ready","value":"Author Notification: July 7, 2026 / Camera Ready Deadline: September 11, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"Call for Papersに掲載された投稿先。","label":"2026 投稿システム","value":"HotCRP Submission Site (both Tracks): https://micro2026.hotcrp.com/","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"「The paper titles and abstracts should be close to the final one (and not just place holders) by the abstract deadline」とも記載。","label":"2026 著者リストの扱い","value":"全著者はabstract登録締切までに追加する必要があり、abstract締切以降の著者リスト変更は認められない。タイトルとabstractは投稿時に最小限の変更のみ可能","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/papers.php"},{"note":"提出先は micro59workshops@gmail.com。","label":"2026 workshop/tutorial提案","value":"提案締切 May 29, 2026、通知 June 12, 2026。提案は1〜2ページで、タイトル、organizerの氏名・所属・略歴、half dayかfull dayの別、継続開催の場合は前回の開催地・日付・採録数・参加者数と今回の新規内容、workshopはsample call for papersと主要topics、tutorialはabstract、および招待講演者・登壇者・委員会の多様性確保の計画を含める","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/workshops.php"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"MICROのproceedingsは年によって発行元がACMとIEEEで入れ替わるため、収録先データベースを年ごとに確認する必要があります。Industry Trackの採択論文もregular MICRO paperとしてproceedingsに載り、proceedings上ではIndustry Trackという区別が付きません。会議での長期的な評価としてはTest of Time Awardが別途運用されています。","facts":[{"note":"DBLPの当該巻ページに記載。","label":"2025 proceedings","value":"「Proceedings of the 58th IEEE/ACM International Symposium on Microarchitecture, MICRO 2025, Seoul, Republic of Korea, October 18-22, 2025」ACM刊、ISBN 979-8-4007-1573-0","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/micro/micro2025.html"},{"note":"年により発行元が異なるため、収録データベースも年ごとに確認が必要。","label":"発行元の交替","value":"DBLPの一覧では、2025年ACM、2024年IEEE、2023年ACM、2022年IEEE、2021年ACM、2020年IEEE、2019年ACM、2018年IEEE Computer Societyと記録されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/micro/index.html"},{"note":"Industry Track向けCFPに記載。","label":"2026 Industry Track論文の掲載","value":"採択されたIndustry Track論文はregular MICRO paperとしてconference proceedingsに掲載される。Industry Trackとして区別されるのは会議のセッション上のみ","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"Industry Track向けCFPに記載。","label":"2026 Industry TrackとHall of Fame","value":"Industry Track論文はMICRO Hall of Fameへの算入対象となる。プログラムに含まれるIndustry Track論文の本数に上限はなく、複数セッションにまたがりうる","checkedAt":"2026-08-05","sourceUrl":"https://www.microarch.org/micro59/submit/industrial.php"},{"note":"アクセス範囲(購読要否)については当該ページに記載がない。","label":"2025 proceedingsの公開","value":"MICRO 2025サイトに「We are excited to announce that the official proceedings are now available online!」と掲載され、ACM Digital Libraryへのリンクが置かれている","checkedAt":"2026-08-05","sourceUrl":"https://microarch.org/micro58/"},{"note":"Submission 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'26はいつ、どこで開かれましたか？","sourceUrls":["https://www.amfpd.jp/advanceprogram.pdf","https://www.amfpd.jp/26FinalCFP.pdf"]},{"answer":"一般論文は図表込み2〜4ページのcamera-ready論文をA4のPDFで投稿します。Late Newsは2ページです。原稿はIEEE PDF eXpressで認証したものを提出します。","question":"投稿する論文の長さは？","sourceUrls":["https://www.amfpd.jp/26FinalCFP.pdf","https://www.amfpd.jp/submission2_2.html"]},{"answer":"2026年のproceedingsはワークショップの約2か月後にIEEE Xploreで公開される予定と案内されています。収録にはIEEE Xploreの範囲・品質要件と、事前の剽窃検査が条件です。","question":"論文はIEEE Xploreに載りますか？","sourceUrls":["https://www.amfpd.jp/advanceprogram.pdf","https://www.amfpd.jp/26FinalCFP.pdf","https://ieeexplore.ieee.org/xpl/conhome/10615256/proceeding"]},{"answer":"委員会が審査し、原著性、新規性、AM-FPDの技術領域でのインパクトで採否を判断します。口頭・ポスターの割り振りはProgram Committeeが決めます。","question":"採否は何で決まりますか？","sourceUrls":["https://www.amfpd.jp/General_Information.html","https://www.amfpd.jp/26FinalCFP.pdf"]},{"answer":"Program Committeeの内部評価で選ばれた優秀論文に、IEEE J-EDSまたはECS JSSへの推薦状が出されます。推薦を受けた著者は会期後4か月以内に投稿します。","question":"ジャーナルへの推薦はありますか？","sourceUrls":["https://www.amfpd.jp/advanceprogram.pdf","https://www.amfpd.jp/General_Information.html"]},{"answer":"日本語のチュートリアルがあり、資料と講義は日本語です。2026年のT-2はIGZOからHMOまでの酸化物TFTが題材でした。料金はTutorial Onlyが7,000円、Conference Attendeeが5,000円で、学生は無料です。","question":"日本語で受講できるプログラムはありますか？","sourceUrls":["https://www.amfpd.jp/advanceprogram.pdf"]}],"headline":"AM-FPD '26は第33回として2026年7月7〜10日に京都の龍谷大学深草キャンパス成就館で開かれました。","metaDescription":"AM-FPD（International Workshop on Active-Matrix Flatpanel Displays and Devices）の主催FTFMDと協賛学会、2026年の京都会期、2〜4ページ論文と締切、IEEE Xplore収録、J-EDS・JSSへの推薦状、1994年からの開催地を公式資料から整理しました。","oneLine":"AM-FPDは、アクティブマトリクス型フラットパネルディスプレイとTFT、太陽電池、薄膜材料・デバイスの研究開発を発表する、1994年に始まった国際ワークショップです。","pageTitle":"AM-FPDとは｜TFT・ディスプレイ・薄膜太陽電池を扱う京都開催の国際ワークショップ","relatedConferenceIds":["international-display-workshops","display-week","japanese-liquid-crystal-conference","international-liquid-crystal-conference","ssdm","ecs-meeting"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は7月7日（火）から10日（金）までの4日間で、会場は龍谷大学深草キャンパスの成就館でした。7月8日にはSpecial Symposiumが開かれ、17:30からは成就館2階のRyukoku Live Theaterでバンケットが行われました。公用語は英語で、proceedingsは7月7日から電子版で配布されました。","facts":[{"label":"2026 会期・会場","value":"2026-07-07〜10 / Ryukoku University, Fukakusa Campus Jojukan, Kyoto, Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"2026 曜日","value":"7月7日（火）〜7月10日（金）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"公用語","value":"英語","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 参加費（Member、事前）","value":"50,000円（事前登録は2026-06-15 JSTまで、当日相当は55,000円）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 バンケット","value":"7月8日 17:30〜19:30、成就館2階 Ryukoku Live Theater","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 テーマ","value":"Towards a Smarter, Sustainable World","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年のCFPはFlat Panel Displays（FPD）、TFT Technologies（TFT）、Photovoltaics（PV）、Thin-Film Materials and Devices（TFMD）の4分野で論文を募集し、投稿時にこの区分を選びます。Advance Programによると、もとはAMLCD技術の発表の場で、AMOLEDや新型FPD、フレキシブル技術、TFT、PV、薄膜材料・デバイスへと範囲を広げてきました。TFT分野には酸化物TFT、有機TFT、Si系TFTが含まれ、TFMD分野には2D材料などの薄膜材料と加工が含まれます。","facts":[{"label":"2026 投稿分野区分","value":"FPD / TFT / PV / TFMD","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"TFT分野の対象（2026 CFP）","value":"oxide TFTs, organic TFTs, amorphous, microcrystalline and polycrystalline Si-based TFTs など","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"FPD分野の対象（2026 CFP）","value":"mini/micro-LED, LCD, OLED, e-paper, flexible display など","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"PV分野の対象（2026 CFP）","value":"thin-film solar cells (perovskite, organic, Si-based, and compound) など","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"対象範囲の広がり（2026 Advance Program）","value":"AMLCD・AMOLEDに加え、新型FPD、ディスプレイ材料、フレキシブル技術、TFT、PV、TFMD","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"投稿論文は委員会の審査を経て採否が決まり、判断基準は原著性、新規性、AM-FPDの技術領域でのインパクトです。原稿には目的と背景、具体的な新しい結果、既往研究と比べた意義、先行発表と参考文献を書くよう求められます。口頭かポスターかの割り振りはProgram Committeeが決めます。論文賞はBest Paper、Poster、Student Paper、Young Researcher Awardで、表彰はAM-FPD '27で行われます。","facts":[{"label":"採否の判断基準","value":"originality, novelty, and impact in the technical areas of AMFPD","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/General_Information.html"},{"label":"原稿に含める項目（2026 CFP）","value":"目的と背景 / 具体的な新しい結果 / 既往研究と比べたインパクト / 先行発表と参考文献","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"発表形式の決定","value":"口頭・ポスターの割り振りはProgram Committeeが決定","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"委員会審査","value":"論文は委員会の審査を経て採択","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/paper_submission.html"},{"label":"論文賞（2026）","value":"Best Paper / Poster / Student Paper / Young Researcher Award、Award CommitteeはYukiharu Uraoka（NAIST）が委員長、表彰はAM-FPD '27","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトのHTMLには過去年（AM-FPD'22など）の文面がコメントとして残っており、ページの表示内容と年度が混ざって見える箇所があります。展示ページは2026-10-08時点でAM-FPD'25の「展示なし」の文言のままで、2026年の展示の有無は未公開です。2026年がハイブリッド開催だったかは公式資料に明記がありません。締切はCFPの3月31日と延長後の4月7日の2つが公式サイトに並び、事前登録の期限もCFPの6月8日（発表者の条件）とAdvance Programの6月15日（割引期限）で意味が異なります。ポスターセッションの時刻は一般案内（17:00-18:30）と日程表（16:50～18:20）で食い違います。2025年と2026年のproceedingsがIEEE Xploreに掲載済みかは、この時点で確認していません。採択率は公表されていません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"第1回は1994年11月に工学院大学（東京）で開かれました。2011年から2019年の第18〜26回は龍谷大学アバンティ響都ホール（京都）が会場でした。2020年9月の第27回と2021年6月の第28回はオンライン、2022年7月の第29回は同ホールでのハイブリッドです。2024年の第31回と2025年の第32回は龍谷大学成就館で開かれました。","facts":[{"label":"創設年","value":"1994年、AMLCD技術の発表の場として設立","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"第1回","value":"1994年11月、Kogakuin University（Tokyo）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/history.html"},{"label":"第18〜26回の会場","value":"2011〜2019年、Ryukoku University Avanti Kyoto Hall","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/history.html"},{"label":"第27・28回","value":"2020年9月・2021年6月、オンライン","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/history.html"},{"label":"第29回","value":"2022年7月、Ryukoku University Avanti Kyoto Hall（Hybrid）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/history.html"},{"label":"第31・32回","value":"2024年7月・2025年7月、Ryukoku University Jojukan（Kyoto）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/history.html"}],"title":"沿革と開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年の基調講演はペロブスカイト太陽電池（The University of TokyoのHiroshi Segawa氏）と、ディスプレイ以外へ広がる酸化物半導体（NAISTのYukiharu Uraoka氏ほか）の2件でした。7月8日の9:30〜17:20は、車載ディスプレイを主題にしたSpecial Symposiumで、OEM、アナリスト、サプライヤー、大学の講演者が招かれる計画とCFPに書かれています。ほかにLatest Technologies in Flexible ElectronicsとEmerging Technologies for Advanced TFTs and Integrated SystemsのSymposiumがあり、日本語のチュートリアルではKochi University of TechnologyのM. Furuta氏が次世代酸化物TFTを取り上げました。","facts":[{"label":"2026 Keynote K_1","value":"Frontiers of Light Energy Conversion: A Future Society Enabled by Perovskite Solar Cells（H. Segawa, The University of Tokyo）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 Keynote K_2","value":"Oxide Semiconductors Beyond Displays: Toward the 3D Future of Electronics（Y. Uraoka ほか, NAIST）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 Special Symposium","value":"Human-Friendly In-Vehicle Displays, Future System Technologies for Quality Enhancement（7月8日 9:30〜17:20）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"Special Symposiumの講演者構成（2026 CFP）","value":"OEM、アナリスト、サプライヤー、大学研究者を世界から招待","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"2026 Symposium 1","value":"Latest Technologies in Flexible Electronics","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 Symposium 4","value":"Emerging Technologies for Advanced TFTs and Integrated Systems","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 日本語チュートリアル T-2","value":"Next-Generation Oxide TFTs: A Comprehensive Journey from IGZO to HMO（M. Furuta, Kochi University of Technology）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"発表時間（2026）","value":"一般口頭20分（発表15分＋討論5分）、Late News 15分、Keynote 45分","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生向けには学生参加費（事前20,000円、通常22,000円）があり、Student Paper AwardとYoung Researcher Awardが設けられています。日本語チュートリアルは初心者から知識を復習したい研究者までを対象に、資料と講義が日本語で、Tutorial Onlyは7,000円、Conference Attendeeは5,000円、学生は無料です。企業の調査担当者にとっては、Program Committeeの企業所属と車載ディスプレイのSpecial Symposiumの演題から、業界側の関心テーマを追えます。","facts":[{"label":"2026 学生参加費","value":"事前20,000円 / 通常22,000円","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"日本語チュートリアルの対象","value":"初心者から知識を復習したい研究者まで、資料と講義は日本語","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 チュートリアル料金","value":"Tutorial Only 7,000円 / Conference Attendee 5,000円 / Student 無料","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"Special Symposium単日券（2026）","value":"7月8日のSpecial Symposiumのみの1日券35,000円、proceedings込み","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"}],"title":"参加者と使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Workshop on Active-Matrix Flatpanel Displays and Devicesで、副題に―TFT Technologies and FPD Materials―を掲げます。主催はInternational Society of Functional Thin Film Materials & Devices（FTFMD）で、2026年はECS Electronics and Photonics Division、ECS Japan Section、IEEE Electron Devices Societyが技術協賛に並びました。協力団体には応用物理学会、電子情報通信学会、映像情報メディア学会、電気学会、Society for Information Displayなどが載っています。FTFMDは2015年に委員会メンバーが設立した一般社団法人です。","facts":[{"label":"正式名称（2026 回次込み）","value":"The 33rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD '26)","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/26FinalCFP.pdf"},{"label":"副題","value":"―TFT Technologies and FPD Materials―","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/"},{"label":"2026 主催","value":"International Society of Functional Thin Film Materials & Devices","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 技術協賛","value":"ECS Electronics and Photonics Division / ECS Japan Section / IEEE Electron Devices Society","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 協力団体（抜粋）","value":"The Japan Society of Applied Physics / IEICE / ITE / IEEJ ほか（Society for Information Displayを含む）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"主催法人","value":"一般社団法人 機能性薄膜材料デバイス国際会議（FTFMD）","checkedAt":"2026-10-08","sourceUrl":"http://www.syadan-amfpd.org/index.html"},{"label":"FTFMDの設立（Organizing Chair挨拶）","value":"2015年に委員会メンバーが設立した一般社団法人","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/greeting.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年はOrganizing ChairをFTFMDのHiroki Hamada氏、Steering ChairをNAISTのYukiharu Uraoka氏、Program ChairをKanagawa Univ.のNobuyuki Matsuki氏が務めました。Program Committeeには、Univ. of StuttgartのNorbert Fruehauf氏やNat'l Cheng Kung Univ.のChih-Lung Lin氏などの海外大学の所属者がいます。企業所属の委員には、Corning、Apple、Kioxia、Japan Displayの所属者が含まれます。","facts":[{"label":"2026 Organizing Chair","value":"Hiroki Hamada（FTFMD Association）","checkedAt":"2026-10-08","sourceUrl":"https://www.amfpd.jp/advanceprogram.pdf"},{"label":"2026 Steering / Program Chair（CFP）","value":"Steering Chair Y. 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はいつ・どこで開催されますか。","sourceUrls":["https://iccad.com/2026","https://iccad.com/2026/conference-hotel","https://iccad.com/2026/workshops"]},{"answer":"2026年サイクルは abstract が4月7日 23:59 AoE、本文が4月14日 23:59 AoE です。ワークショップ・チュートリアル・スペシャルセッション・パネルの提案も4月14日です。公式CFPには「Due to the limited review cycle, NO extensions will be granted for ANY reason.」と明記されており、abstract 締切後は新規のabstract提出そのものができません。","question":"投稿締切はいつですか。延長はありますか。","sourceUrls":["https://iccad.com/2026","https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"]},{"answer":"公式CFPに「IEEE/ACM ICCAD follows a double-blind review policy」と明記されています。本文・abstract・PDFの埋め込みデータのいずれにも著者名や所属を残してはならず、自著引用も三人称で書く必要があります。査読結果は6月10日に著者へ共有され、HotCRP上でrebuttalを提出しますが、この期間に論文本体を差し替えることはできません。","question":"査読はありますか。double-blind ですか。","sourceUrls":["https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf","https://iccad.com/2026/rebuttal-phase"]},{"answer":"公表されていません。2026-08-05時点で、iccad.com のCall for Papers ページ、トップページ、公式CFP PDFのいずれにも採択率・投稿件数・採択件数の記載はありません。公式に確認できるのは、Best Paper Award が分野別選考委員会によるノミネート論文からの選出であることまでです。","question":"採択率は公表されていますか。","sourceUrls":["https://iccad.com/2026/authors/call-for-papers","https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"]},{"answer":"IEEE の Council on Electronic Design Automation（CEDA）と ACM の Special Interest Group on Design Automation（SIGDA）が co-sponsor し、収支は IEEE CEDA 46.7%、IEEE CAS 20%、ACM SIGDA 33.3% で分担されています（2013年以降）。2026年のExecutive Committee には University of Illinois、Duke University、CUHK、Texas A&M、Politecnico di Milano、HKUST、TUM、National Central University といった大学と、AMD、Synopsys、Cadence といった企業の所属が併記されています。","question":"誰が投稿・運営している会議ですか。","sourceUrls":["https://iccad.com/2026/bylaws","https://iccad.com/2026/executive-committee"]},{"answer":"ICCAD 2026 の proceedings は ACM が著作権を保持し、発表されなかった論文は proceedings および ACM Digital Library から除外されうると記載されています。2026年からACMがOpen Accessへ完全移行するため全掲載論文にArticle Processing Charge（APC）が課され、金額は corresponding author の資格により ACM/SIG会員250米ドル、非会員350米ドルです。所属機関がACM Open参加なら自動免除、低所得国は原則100%免除、低中所得国は50%割引、それ以外はSIGDA支援のFinancial Hardship Waiverを申請できます（産業界の研究者による論文は同支援の対象外）。","question":"採択論文はどこに載りますか。掲載料はかかりますか。","sourceUrls":["https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf","https://iccad.com/2026/new-acm-publishing-model","https://iccad.com/2026/final-author-instructions"]},{"answer":"Early Bird（2026年6月1日〜8月24日）は ACM/IEEE Professional Member 975.00米ドル、ACM/IEEE Student Member 730.00米ドル、Non-Member 1,050.00米ドル、Student Non-Member 780.00米ドルです。Standard（8月24日〜11月12日）は順に1,045.00／835.00／1,150.00／895.00米ドルとなります。ワークショップは全価格に含まれ、ワークショップのみの参加は250.00米ドルです。著者・登壇者は論文1件あたり950.00米ドルで、8月24日までに支払いが処理されない論文は proceedings に掲載されません。","question":"参加費はいくらですか。","sourceUrls":["https://iccad.com/2026/registration/registration-information"]},{"answer":"Final Author Instructions に「ICCAD 2026 is an in-person conference.」と書かれており、採択論文は最低1名の著者が現地で発表する必要があります。ビザ招待状はACMのフォーム（https://supportletters.acm.org）から申請し、パスポート記載どおりの氏名・住所・会議名と登録確認番号などを入力します。公式ページは米国のvisitor visa申請でDS-160提出・手数料支払い・面接が通常必要である旨に触れ、最新情報は最寄りの米国大使館・領事館に確認するよう案内しています。支払いは全額USD建てで、銀行振込を選んだ場合は返金されません。","question":"日本から参加する場合に注意する点はありますか。","sourceUrls":["https://iccad.com/2026/final-author-instructions","https://iccad.com/2026/travel/visa-invitation-letter","https://iccad.com/2026/general-faq"]},{"answer":"Student Research Competition（SRC）、CADathlon、EDA Job Fair、CAD Contest at ICCAD、Student Scholar Program の5つが案内されています。SRC は abstract 締切が2026年8月16日 11:59 pm AoE、採否通知が9月16日で、ACM および ACM SIGDA の会員であることが条件です。CADathlon は11月8日にSan Jose Marriottで開催され、博士号授与機関にフルタイム在籍する学生2名1組で参加し、1位は1人あたり1,500米ドルです。Student Scholar Program は最大1,000米ドルの実費償還で、申請締切は延長後2026年7月31日と掲示されています。","question":"学生向けの支援やコンテストはありますか。","sourceUrls":["https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf","https://iccad.com/2026/student-research-competition","https://iccad.com/2026/cadathlon-at-iccad-2026","https://iccad.com/2026/student-scholar-program"]}],"headline":"公式サイト iccad.com の2026年サイクル各ページと公式Call for Papers PDF、およびDBLPの書誌情報だけを突き合わせ、ICCADの会期・投稿規定・査読方式・出版形態・委員構成を確認できる範囲で整理した。","metaDescription":"ICCADはIEEE CEDAとACM SIGDAが共催するCAD/EDAの国際会議。2026年は11月8〜12日にSan Joseで現地開催。二段階投稿・8ページ上限のdouble-blind査読とACM Open Access収録を公式記載だけで整理。","oneLine":"ICCAD（IEEE/ACM International Conference on Computer-Aided Design）は、IEEE CEDAとACM SIGDAが共催するCAD/EDAの国際会議で、2026年は11月8〜12日にカリフォルニア州San Joseで開催される。","pageTitle":"ICCADとは｜IEEE/ACM国際CAD会議の2026年会期・投稿締切・double-blind査読・掲載先を公式情報で確認","relatedConferenceIds":["dac","date","asp-dac","iwls","islped","itc"],"sections":{"cycle":{"id":"cycle","body":"2026年は11月8日から12日まで、California州San Joseで開催される。公式サイトが住所付きで案内しているのは San Jose Marriott（301 S Market St, San Jose, CA 95113）だが、これは Conference Hotel ページに conference hotel として掲載されているもので、同ページには San Jose Convention Center が直結していると書かれている一方、本会議のセッション会場そのものを名指しした記述はない。Final Author Instructions には「ICCAD 2026 is an in-person conference.」「採択論文は最低1名の著者が現地で発表すること」と明記されているため、オンライン発表を前提にした投稿計画は立てられない。ワークショップは会期最終日の11月12日（木）にまとめられているので、本会議だけ参加するか木曜まで滞在するかで出張日程が変わる。","facts":[{"label":"2026 会期","value":"NOVEMBER 8-12, 2026","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"label":"2026 開催都市・国","value":"SAN JOSE, CALIFORNIA, USA","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"note":"Conference Hotel ページに conference hotel として住所付きで掲載。同ページは San Jose Convention Center が直結していると案内するにとどまり、本会議のセッション会場を名指しした記載はない。","label":"2026 会場ホテル","value":"San Jose Marriott, 301 S Market St, San Jose, CA 95113","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/conference-hotel"},{"note":"Final Author Instructions は、発表されなかった論文が proceedings および ACM Digital Library から除外されうるとも記載している。","label":"2026 開催形式","value":"\"ICCAD 2026 is an in-person conference.\" / \"At least one author of each accepted paper must attend the conference and present the paper in person.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/final-author-instructions"},{"note":"公式CFP PDF にも「Typical workshops are one-day or half-day events on the Thursday of IEEE/ACM ICCAD」と記載がある。","label":"2026 ワークショップ開催日","value":"Thursday, November 12, 2026","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/workshops"},{"note":"History ページの一覧に記載。","label":"2025 サイクル（直前回）","value":"ICCAD 2025: October 26-30, 2025 | Munich, Germany","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"note":"2026-08-05 時点で確認。History ページの一覧も2025年で終わっている。","label":"2027 サイクルの公表状況","value":"iccad.com のトップページおよび History ページに2027年の会期・開催地の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"}],"title":"2026年サイクルの会期・会場・開催形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"ICCADのスコープは公式CFPで「device-level physics から system-level architecture まで」と宣言されており、トラックは大きく3系統（System-Level CAD／Synthesis・Verification・Physical Design・Analysis・Simulation・Modeling／CAD for Emerging Technologies, Paradigms）に分かれる。CFP PDFの2〜4ページには各系統の細目が1.1〜1.11、2.1〜2.7、3.1〜3.3という番号付きで列挙されているので、自分の研究がどのサブエリアに落ちるかはこの番号表で確認できる。2026年版のCFPでは 1.10「3D IC's, Chiplets, and Advanced Packaging」と 1.11「PHYSICAL AI & EMBODIED INTELLIGENCE」が独立した細目として立っている点が、後工程・ロボティクス寄りの読者にとって確認しやすい入口になる。","facts":[{"label":"スコープ宣言（2026 CFP）","value":"\"ICCAD 2026 explores the full spectrum of electronic design automation, extending from device-level physics to system-level architecture.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"CFP PDF 2〜4ページの各ページ見出し。","label":"2026 大区分（3系統）","value":"1) System-level CAD / 2) SYNTHESIS, VERIFICATION, PHYSICAL DESIGN, ANALYSIS, SIMULATION, AND MODELING / 3) CAD FOR EMERGING TECHNOLOGIES, PARADIGMS","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 System-level CAD の細目","value":"1.1 System Design / 1.2 Embedded, CPS, IoT Systems and Software / 1.3 AI Algorithms and Applications / 1.4 CAD for AI / 1.5 Hardware Systems and Architectures for Artificial Intelligence / 1.6 Reconfigurable Computing / 1.7 Algorithms and Computing for Security / 1.8 Architecture and Systems for Security / 1.9 Low Power and Approximate Computing / 1.10 3D IC's, Chiplets, and Advanced Packaging / 1.11 PHYSICAL AI & EMBODIED INTELLIGENCE","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 Synthesis/Verification/Physical Design 系の細目","value":"2.1 High-Level and Logic / 2.2 Testing, Validation, Simulation, and Verification / 2.3 Cell-Library Design, Partitioning, Floorplanning, Placement / 2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification / 2.5 Design for Manufacturability and Design for Synthesis and Optimization Reliability / 2.6 Timing, Power, and Signal Integrity / 2.7 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"3.3 には「New memory technologies (e.g. flash, PCM, STT-RAM, memristor)」「CAD for nano-photonics and optical devices/communication」などが含まれる。","label":"2026 Emerging Technologies 系の細目","value":"3.1 Bio-inspired and Neuromorphic Computing / 3.2 New System and Computing Paradigms / 3.3 Nanoscale and Post-CMOS Systems","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"列挙は限定列挙ではないと明記されている。一方で「対象外の技術領域」を名指しした記述はCFP PDFにもトップページにもない。","label":"トピック列挙の性格","value":"\"Original technical submissions on, but not limited to, the following topics are invited\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"Call for Papers ページおよびCFP PDF の CALL FOR PROPOSALS に列挙。","label":"本会議以外の募集区分","value":"Workshops / Tutorials / Special sessions / Panels","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/authors/call-for-papers"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"ICCADは double-blind 査読を採用しており、本文・abstract・PDFの埋め込み情報のいずれにも著者名や所属を残してはならず、自著引用も三人称で書くことが求められる。オープンソースを含む論文は推奨される一方、非匿名リポジトリへの直リンクは禁止で、anonymous.4open.science のような匿名化ツールの利用が案内されている。査読結果は6月10日に著者へ共有され、HotCRP上で rebuttal を提出するが、この期間に論文本体を差し替えることはできない。採択率は公式ページに掲載されていない。","facts":[{"label":"2026 査読方式","value":"\"IEEE/ACM ICCAD follows a double-blind review policy. Your submission must not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the manuscript, abstract, or in the embedded PDF data. References and bibliographic citations to the authors' own published works or affiliations should be made in the third person.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 審査観点（完成度）","value":"\"Regular papers will be reviewed as finished papers; preliminary submissions will be at a disadvantage.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 オープンソース公開の扱い","value":"オープンソースを伴う研究は推奨され、採択時に camera-ready と併せて公開することが期待される。double-blind 保護のため非匿名リポジトリへの直リンクは記載せず、テキストでの言及にとどめる。匿名化には anonymous.4open.science が案内されている。","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 rebuttal の運用","value":"査読結果はHotCRP上で「Review #1190A」のようなリンクとして表示され、著者は「Add Round1 response」から回答を提出する。\"No changes to the submitted paper are allowed during the rebuttal phase.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/rebuttal-phase"},{"note":"\"The rebuttal is not an opportunity to upload or submit a revised manuscript.\" とも記載されている。","label":"2026 rebuttal の目的","value":"\"The rebuttal response should be used to clarify misunderstandings, answer specific reviewer questions, and point reviewers to relevant parts of the submitted paper.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/rebuttal-phase"},{"note":"アーカイブされないワークショップ論文やarXivプレプリントからの投稿は許容されるが、double-blind への配慮が求められる。","label":"2026 二重投稿・既発表の扱い","value":"\"Submissions not adhering to these rules or determined to be previously published or simultaneously submitted to another conference, or journal, will be summarily rejected.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 COI申告","value":"\"Authors are responsible for declaring COIs, ensuring that their paper submission meets all guidelines, and that the PDF is readable.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"2026-08-05 時点で確認。トップページおよび公式CFP PDF にも同様に記載がない。","label":"採択率","value":"Call for Papers ページに採択率・投稿件数・採択件数の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/authors/call-for-papers"}],"title":"査読方式とrebuttal","eyebrow":"review"},"caveats":{"id":"caveats","body":"同じ2026年サイクルの情報でも、トップページのImportant Datesと公式CFP PDFの締切表で rebuttal 締切と通知日の粒度が食い違っているため、どちらを見たかを必ず控えておく必要がある。また公式CFP PDFは2ページ目以降のヘッダに「2022 INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN」という旧年度の文字列が残っており、ページ内容は2026年版でもヘッダの年は当てにできない。公式ソースが公表していない項目もはっきりしている。採択率・投稿件数・採択件数はCall for Papers ページにも公式CFP PDFにも数値がなく、初回開催年もHistory ページには数値として出てこない。2027年サイクルの会期と開催地、keynote の日時、EDA Job Fair の日時、ジャーナル特集号への招待、セッション別の採択論文一覧も、2026-08-05時点の公式ページには掲載がない。2026年サイクルの参加者内訳も公表されておらず、Become a Sponsor ページに載る内訳の数値は「Data pulled from the ICCAD 2025 conference」と注記された前年実績である。本会議のセッション会場そのものも、Conference Hotel ページが conference hotel を案内するにとどまるため、公式ページ上では特定できない。","facts":[{"note":"どちらが最終かを示す注記は両ページとも掲載していない。投稿前に Rebuttal Phase ページと合わせて再確認が必要。","label":"rebuttal 締切の不一致","value":"トップページの Important Dates は \"Author Rebuttals Submissions: June 20, 2026\"、公式CFP PDF 1ページ目の締切表は \"June 17, 2026 Author Rebuttals Submissions\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"label":"提案採否通知の粒度の不一致","value":"公式CFP PDF は \"June 8, 2026 Notifications for Workshops, Tutorials, Special Sessions, Panels\" と1行にまとめているのに対し、トップページは \"Notifications for Workshops: June 8, 2026\" と \"Notifications for Tutorials, Special Sessions, Panels: June 15, 2026\" に分けている","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"本文の締切・投稿先・APC条件はいずれも2026年サイクルの内容。年度の判断はヘッダではなく本文でおこなう必要がある。","label":"CFP PDF内の旧年度ヘッダ","value":"公式CFP PDF の2〜9ページのヘッダに \"2022 INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN\" という文字列が残っている（1ページ目は \"2026 INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN\"）","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"名称表記のゆれ","value":"トップページ見出しは \"ACM/IEEE ICCAD 2026\"、同ページ本文および公式CFP PDF は \"IEEE/ACM ICCAD\"、DBLPの巻タイトルは \"IEEE/ACM International Conference On Computer Aided Design\"（Computer Aided がハイフンなし）","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/iccad/index.html"},{"label":"初回開催年","value":"公式History ページは初回開催年を数値で公表していない。掲載されているのは \"more than 40 years ago\" と \"Over the last 44 years\" という表現のみで、一覧は2006年以降に限られる。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"note":"Call for Papers ページおよびトップページにも同様に記載がない。","label":"採択率・投稿件数","value":"公式CFP PDFに、採択率・投稿件数・採択件数の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"8ページで投稿してそのまま採択された場合、追加ページ料金が発生する構造になっている。","label":"ページ数条件の読み違えやすい箇所","value":"投稿時は本文8ページ以内＋参考文献1ページだが、camera-ready で無料になるのは6ページ＋参考文献1ページまでで、超過分は1ページ150米ドル","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/final-author-instructions"},{"note":"このため本ページでは参加者の地域構成・学生比率の数値そのものを扱わない。","label":"参加者内訳の対象年度","value":"Become a Sponsor ページの参加者内訳（\"Our Audience Breakdown\"）には \"*Data pulled from the ICCAD 2025 conference.\" と注記されており、2026年サイクルの数値ではない","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/affiliate/become-a-sponsor"},{"label":"Silver スポンサーの社名表記","value":"Sponsor Listing ページの Silver 段には2社が掲載されているが、社名表記の読み取りが安定しなかったため、このページでは社名を扱わない","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/sponsor-listing"}],"title":"未公開項目と表記のゆれ","eyebrow":"caveats"},"history":{"id":"history","body":"公式History ページは「ICCAD first edition was held more than 40 years ago」「Over the last 44 years」と述べるにとどまり、初回開催年そのものは記載していない。回次については2026年版CFP PDFが「45th Edition」と印刷しており、これが公式に確認できる唯一の回次表記である。History ページの一覧は2006年から2025年までで、2006年から2014年までは毎年San Jose、2015・2016はAustin、2017はIrvine、2018はSan Jose、2019はWestminster、2020〜2021年はVirtual、2022年はSan Jose、2023年はSan Francisco、2024年はNew Jersey、2025年はMunichと推移している。この一覧の範囲では、欧州都市が現れるのは2025年が最初である。2005年以前の開催記録は公式ページに掲載がないため、初期の開催地と初回開催年はこのページでは扱わない。","facts":[{"note":"History ページは初回開催年を数値で明示していない。","label":"初回開催に関する公式の記述","value":"\"ICCAD first edition was held more than 40 years ago.\" / \"Over the last 44 years, ICCAD has been held in:\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"note":"公式CFP PDF 1ページ目。History ページの「44 years」とあわせて読むと、回次と経過年数が公式サイト内で別々の場所に分かれて記載されている。","label":"2026 の回次表記","value":"45th Edition","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"History ページの掲載範囲","value":"ICCAD 2006 から ICCAD 2025 までの20回分のみが掲載され、2005年以前の開催記録は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"label":"開催地の推移（2006-2019）","value":"2006年から2014年までは毎年 San Jose, CA、2015・2016は Austin, TX、2017は Irvine, CA、2018は San Jose, CA、2019は Westminster, CO","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"label":"開催地の推移（2020-2025）","value":"ICCAD 2020（11月2-5日）とICCAD 2021（11月1-4日）は Virtual、2022はSan Jose, CA、2023はSan Francisco, CA、2024はNew Jersey, USA、2025はMunich, Germany","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"label":"収支配分の変更時期","value":"IEEE CEDA (46.7%)、IEEE CAS (20%)、ACM SIGDA (33.3%) という配分は「from 2013 onwards」と記載されている","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"}],"title":"沿革と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"2026年のkeynoteは2件で、CadenceのPaul CunninghamとUniversity of Toronto／Cerebras SystemsのVaughn Betzが登壇する。tutorialは本会議プログラムに組み込まれ、参加登録者は追加費用なしで聴講できるため、参加費の内訳を検討するときはtutorialが別料金でない点を押さえておくとよい。ワークショップは11月12日（木）に5本が並び、量子計算、LLM推論向けメモリ中心計算、ヘテロジニアスSoCの安全性・セキュリティ、サステナブルなハードウェアセキュリティ、ハードウェア／組込みセキュリティのTop Picksという構成である。学生向けにはCADathlon、Student Research Competition、EDA Job Fair、CAD Contestが併設される。keynote と EDA Job Fair の開催日時は、公式ページに記載がない。","facts":[{"label":"2026 keynote speakers","value":"Paul Cunningham（System Verification Group, Cadence）／Vaughn Betz（University of Toronto, Cerebras Systems）","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"note":"Keynote Speakers ページに日時の記載はない。","label":"2026 keynote 講演題目（Vaughn Betz）","value":"\"Spatial Computing Architectures: Opportunities and CAD Flows in the Deep Learning and More-than-Moore Era\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/keynote-speakers"},{"label":"2026 ワークショップ一覧（11月12日）","value":"2026 QCAS Quantum Computing Applications and Systems Workshop / Memory-Centric Computing for LLM Inference / SSH-SoC: Safety and Security in Heterogeneous Open System-on-Chip Platforms / SUSHI'26: Sustainable Hardware Security / The 8th Workshop on Top Picks in Hardware and Embedded Security","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/workshops"},{"note":"Special Session／Panel Session も通常1.5〜2時間、提案書は2ページ以内。","label":"2026 tutorial の位置づけ","value":"\"All IEEE/ACM ICCAD tutorials are embedded in the main technical program and free to conference attendees.\" 標準的な長さは1.5〜2時間、2ブロック構成の長尺も検討対象。","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"問題分野は Circuit Design & Analysis／Physical Design & DFM／Logic & High-Level Synthesis／System Design & Analysis／Functional Verification & Testing／Future technologies。","label":"2026 CADathlon","value":"2026年11月8日、San Jose Marriott にて開催。博士号授与機関にフルタイム在籍する学生2名1組で参加。1位は1人あたり1,500米ドル、2位は1人あたり750米ドル。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/cadathlon-at-iccad-2026"},{"note":"ACM SIGDA が ICCAD と共同で運営。ACM および ACM SIGDA の会員であることが条件。","label":"2026 Student Research Competition の日程","value":"abstract 締切 2026年8月16日（11:59 pm AoE）、採否通知 2026年9月16日、ポスターセッション 11月9日、発表セッション 11月10日、表彰 11月11日","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/student-research-competition"},{"note":"Job Fair ページに開催日時の記載はない。","label":"2026 EDA Job Fair","value":"\"ACM SIGDA and IEEE CEDA will host their 5th annual EDA Job Fair at the 2026 International Conference on Computer-Aided Design (ICCAD).\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/job-fair"},{"label":"2026 表彰","value":"IEEE/ACM William J. McCalla-ICCAD Best Paper Award（2件、分野別選考委員会がノミネート論文から選出し開会セッションで発表）／IEEE/ACM ICCAD Ten-Year Retrospective Most Influential Paper Award（2016年・2017年開催回の論文から1件）","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"}],"title":"keynote・tutorial・ワークショップ・併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からの参加を検討する場合、投稿本体の締切（4月7日／4月14日）とは別に、Student Research Competition の abstract 締切（8月16日）や Student Scholar Program の申請締切（延長後7月31日）という学生向けの独立した締切があるため、指導教員側で年間カレンダーを分けて管理しておくとよい。参加費はEarly Birdでも学生会員730米ドル、一般会員975米ドルで、ワークショップは全価格に含まれる一方、ワークショップのみの参加は250米ドルという別枠がある。企業・調査担当の側からは、Become a Sponsor ページの段階別 Patron 価格表と EDA Job Fair の存在が、どの程度の予算でどの接点を持てるかを見積もる材料になる。日本から参加する場合は現地参加が必須で、ビザ招待状はACMのsupportletters.acm.orgから申請する。","facts":[{"note":"ワークショップは全価格に含まれると記載されている。","label":"2026 参加登録費（Early Bird: 6月1日〜8月24日）","value":"ACM Professional Member 975.00米ドル／IEEE Professional Member 975.00米ドル／ACM Student Member 730.00米ドル／IEEE Student Member 730.00米ドル／Non-Member 1,050.00米ドル／Student Non-Member 780.00米ドル","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/registration/registration-information"},{"note":"その他に Workshop Only 250.00米ドル、Gala Dinner (Guest) 120.00米ドルの区分がある。","label":"2026 参加登録費（Standard: 8月24日〜11月12日）","value":"ACM/IEEE Professional Member 1,045.00米ドル／ACM/IEEE Student Member 835.00米ドル／Non-Member 1,150.00米ドル／Student Non-Member 895.00米ドル","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/registration/registration-information"},{"note":"\"An accepted paper will be published in the proceedings only if registration payment is received and processed by August 24, 2026.\"","label":"2026 著者・登壇者登録","value":"Moderator, TPC, EC & Speaker 950.00米ドル（論文1件あたり、ワークショップ込み）。6ページを超える追加ページは1ページ150米ドル。締切は2026年8月24日。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/registration/registration-information"},{"note":"本プログラムの支援がなければ参加できないことを指導教員のレターで示す必要があり、1論文につき1名まで、申請時点で学生かつACMまたはIEEEの会員であることが条件。","label":"2026 Student Scholar Program","value":"参加登録費・エコノミー航空券・宿泊・滞在費などを対象に、最大1,000米ドルまで実費償還。申請締切は「EXTENDED: July 31, 2026」。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/student-scholar-program"},{"note":"CFP PDF の ICCAD WORKFORCE DEVELOPMENT ACTIVITIES に5つがまとめて説明されている。","label":"2026 学生向け併設活動の一覧","value":"Student Research Competition (SRC)、CADathlon、EDA Job Fair、CAD Contest at ICCAD、Student Scholar Program","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"ページは米国のvisitor visa申請でDS-160提出・手数料支払い・面接が通常必要であることにも触れており、最新情報は最寄りの米国大使館・領事館に確認するよう案内している。","label":"2026 ビザ招待状の申請","value":"https://supportletters.acm.org のフォームから申請。パスポート記載どおりの氏名、現住所、会議名と登録確認番号、採択論文がある場合はその題目と著者区分を記入する。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/travel/visa-invitation-letter"},{"note":"領収書は電子メールでの電子発行のみ。参加証明書（Certificate of Attendance）は会期終了後に電子的に送付される。","label":"2026 参加登録の開始時期と支払い方法","value":"\"Registration will open on or before June 1, 2026.\" 支払いは全額USD建て、銀行振込も選択可能だが銀行振込分は返金されない。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/general-faq"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ICCADは単一団体の会議ではなく、IEEE CEDAとACM SIGDAが co-sponsor し、IEEE CAS も収支に加わる共催体制で運営されている。この体制は Bylaws ページに収支配分率まで書かれているため、「どの学会の会議として扱うべきか」を判断する必要があるとき（社内の学会区分、参加報告書の宛先、会員価格の適用判断など）はまず Bylaws を参照するのが確実である。名称表記はトップページの「ACM/IEEE ICCAD 2026」と本文中の「IEEE/ACM ICCAD」が併存しており、引用時はどちらの表記を採ったか明示しておくと後の照合が楽になる。","facts":[{"note":"同じトップページの自己紹介文では「IEEE/ACM ICCAD」という語順で書かれている。","label":"2026 トップページ見出し表記","value":"ACM/IEEE ICCAD 2026","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"note":"Bylaws ページの記載をそのまま引用。","label":"共催（co-sponsor）","value":"\"ICCAD is co-sponsored by the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE), and the Special Interest Group on Design Automation (SIGDA) of the Association for Computing Machinery (ACM)\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"note":"Bylaws ページに「from 2013 onwards」として記載。IEEE CAS も配分に含まれる点が名称表記からは読み取れない。","label":"収支配分（2013年以降）","value":"IEEE CEDA (46.7%)、IEEE CAS (20%)、ACM SIGDA (33.3%)","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"note":"co-sponsor（CEDA/SIGDA）とは別枠の in cooperation 関係として記載されている。","label":"技術協力","value":"\"held in cooperation with the IEEE Electron Device Society\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"label":"会議の目的（Bylaws の記述）","value":"\"The objective of the International Conference on Computer-Aided Design (ICCAD) is to provide education and technical enrichment for Computer-Aided Design (CAD) professionals of electrical and electronics engineering and promote advancement of the state-of-the-art in CAD and electronic design technology.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"note":"公式Call for Papers PDF 1ページ目の見出しブロックに「IEEE/ACM 45th Edition」と印刷されている。トップページには回次の記載がない。","label":"2026 サイクルの回次","value":"45th Edition","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"「年1回」という文言そのものは公式ページに書かれていないため、掲載状況として記述する。","label":"開催頻度","value":"History ページには2006年から2025年まで各年1件ずつの開催記録が掲載されている（欠年なし）","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/history"},{"note":"\"premier forum\" は公式サイト自身の表現であり、第三者評価やランキングではない。","label":"公式サイトによる自己紹介文","value":"\"Jointly sponsored by IEEE and ACM, IEEE/ACM ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Executive Committee は大学所属と企業所属が併記され、Program Chair は AMD、Tutorial & Special Session Chair は Synopsys、Industry Liaison は Cadence の所属として掲載されている。地域代表として Asian Representative と European Representative の枠があり、印刷された所属の所在地は米国・ドイツ／オーストリア・香港・台湾・イタリアにまたがる。委員の任命権と任期の上限は Bylaws に明文化されており、Oversight Committee が Officers of the Conference と International Representatives を任命・交代させる。スポンサー募集ページには Patron の段階別価格が掲載されている一方、同ページの参加者内訳の数値には「Data pulled from the ICCAD 2025 conference」という注記が付いており、2026年サイクルの参加者構成としては読めないため、このページでは数値を扱わない。スポンサー掲載は当該企業がイベントを支援・出展していることを示すもので、ICCADとの取引や共同研究を示すものではない。","facts":[{"label":"2026 Executive Committee（主要職）","value":"General Chair: Deming Chen（University of Illinois）／Program Chair: Ismail S. K. Bustany（AMD）／Vice Program Chair: Tsung-Yi Ho（The Chinese University of Hong Kong）／Past Chair, Treasurer: Robert Wille（Technical University of Munich & Software Competence Center Hagenberg GmbH）","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/executive-committee"},{"label":"2026 Executive Committee（その他の職）","value":"Tutorial & Special Session Chair: Ron Duncan（Synopsys）／Workshop Chair: Hai Helen Li（Duke University）／Student Scholar Program Chair: Andy Yu-Guang Chen（National Central University, TW）／Industry Liaison: William Hung（Cadence）","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/executive-committee"},{"note":"所属の所在地であり、個人の国籍を示すものではない。","label":"2026 学会代表・地域代表","value":"CEDA Representative: Jiang Hu（Texas A&M University）／ACM SIGDA Representative: Christian Pilato（Politecnico di Milano）／Asian Representative: Wei Zhang（The Hong Kong University of Science and Technology）／European Representative: Ulf Schlichtmann（Technical University of Munich）","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/executive-committee"},{"label":"委員の任命方法","value":"Oversight Committee（Past Conference Chairperson、Conference Chairperson、Technical Program Chairperson、Technical Program Vice-Chairperson、Special Session Chairperson の5職で構成）が Officers of the Conference と International Representatives を任命・交代させる。任期は原則2年で、同一職の連続在任は2年まで、Executive Committee 在任は連続5年までという制限がある（Chairperson の5年進行に入る場合を除く）。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"note":"掲載はイベントを支援・出展している事実のみを示す。Silver 枠にも2社が掲載されているが、表記の読み取りが安定しなかったため社名は記載しない。","label":"2026 スポンサー掲載（Platinum / Gold）","value":"Platinum: Cadence, Synopsys／Gold: Altera, AMD","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/sponsor-listing"},{"note":"Become a Sponsor ページの Patron 価格表に掲載されている金額。各段の特典欄（tabletop exhibit table やライブスポンサーセッションの有無）は読み取りが安定しなかったため、本ページでは金額のみを扱う。","label":"2026 スポンサー区分と価格","value":"Silver Patron 3,000米ドル／Gold Patron 6,000米ドル／Platinum Patron 12,000米ドル","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/affiliate/become-a-sponsor"}],"title":"委員構成と参加者・スポンサー","eyebrow":"community"},"comparison":{"id":"comparison","body":"ICCADと他のEDA系会議を比較するときは、他会議の情報を推測で補わず、各会議の公式ページで同じ3項目（スコープの上限と下限、査読方式、著作権と収録先）を突き合わせるのが確実である。ICCAD側の公式記述は、スコープが「device-level physics から system-level architecture まで」、査読が double-blind、2026年の proceedings 著作権が ACM でOpen Access／APC制、という3点に集約される。運営面では IEEE CEDA・IEEE CAS・ACM SIGDA の3者で収支を分ける共催体制であり、IEEE Electron Device Society とは in cooperation の関係にある点も、単独学会主催の会議との違いとして確認できる。","facts":[{"note":"デバイス物理からシステムアーキテクチャまでを1つの会議で扱うという範囲設定。","label":"スコープの上限と下限（ICCAD側の記述）","value":"\"extending from device-level physics to system-level architecture\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"匿名化の対象は本文・abstract・PDF埋め込みメタデータまで及ぶ。","label":"査読方式（ICCAD側の記述）","value":"double-blind review policy","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"共催体制（ICCAD側の記述）","value":"IEEE CEDA と ACM SIGDA の co-sponsor、収支は IEEE CEDA・IEEE CAS・ACM SIGDA の3者で分配、IEEE Electron Device Society とは in cooperation","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/bylaws"},{"note":"「Different from previous years」と明記された変更点であり、過去回の条件と混同しないよう注意が必要。","label":"2026 の出版形態（ICCAD側の記述）","value":"ACMが著作権を保持し、ACM Open Access ガイドラインに従って全掲載論文にAPCが課される","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"}],"title":"近接する会議と比べるときの確認点","eyebrow":"comparison"},"submission":{"id":"submission","body":"ICCADは abstract と本文を分ける二段階投稿で、abstract 締切（4月7日）を過ぎると新規投稿そのものができない。投稿本文は参考文献1ページを除いて8ページ以内・2段組・9ptまたは10ptと数値で決まっており、camera-ready では無料枠が6ページ＋参考文献1ページに縮むため、8ページで投稿した論文は超過分に1ページ150ドルの追加料金が発生する。投稿先はHotCRPで、Regular Paper と提案（Tutorial/Special Session/招待論文）でインスタンスが分かれているので、提出先URLの取り違えに注意が必要である。","facts":[{"note":"CFP PDF の SUBMISSION DETAILS に「we are using a new submission framework this year」と併記されている。","label":"2026 投稿区分と提出先","value":"Regular Papers: iccad2026.hotcrp.com / Invited Papers, Tutorials, and Special Session Proposals: iccad2026-proposals.hotcrp.com / Workshop Proposals: https://forms.gle/fFcnWYVwiRkEawmAA","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 二段階投稿の内容","value":"stage one（abstract submission）で title, abstract, 共著者全員のリストを提出。stage two（paper submission）で本文を提出し、stage one の abstract は修正可能。","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"PDF提出、テキストが選択可能であること（スキャン画像不可）、図中フォントの埋め込みも要件として明記。","label":"2026 投稿時のページ数・書式","value":"\"Each paper must be no more than 8 pages (including the abstract, figures and tables), double-columned, 9pt or 10pt font. One page of references is allowed, which does not count towards this 8-page limitation.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 camera-ready のページ数と超過料金","value":"\"Accepted regular and invited papers may be up to six (6) pages, plus one (1) additional page of references, at no charge.\" 6ページを超える分は1ページ150米ドル、最大8ページ＋参考文献1ページまで。","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/final-author-instructions"},{"note":"CFP PDF 1ページ目の締切表とは rebuttal 締切および Notifications の粒度が一致しない（caveats 参照）。","label":"2026 締切一覧（トップページ掲載）","value":"Abstract Submissions: April 7, 2026 / Proposal Submissions (Workshops, Tutorials, Special Sessions, Panels): April 14, 2026 / Regular Paper Submissions: April 14, 2026 / Notifications for Workshops: June 8, 2026 / Reviews Shared with Authors for Rebuttals: June 10, 2026 / Notifications for Tutorials, Special Sessions, Panels: June 15, 2026 / Author Rebuttals Submissions: June 20, 2026 / Notifications for Regular Papers: July 11, 2026 / Author Registration Deadline: August 24, 2026 / Camera Ready Paper Submission Deadline: August 24, 2026","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026"},{"note":"abstract 締切後は新規 abstract 提出が不可（\"NO abstract submissions will be possible after this deadline.\"）。","label":"2026 締切の時刻と延長方針","value":"abstract は April 7, 2026 at 23:59 AOE、本文は April 14, 2026 at 23:59 AOE。\"Due to the limited review cycle, NO extensions will be granted for ANY reason.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 投稿サイトの開設時期","value":"\"Paper submission will open on or before March 7, 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/general-faq"},{"note":"この人物の会員資格と所属が APC の金額と免除可否を決めると同ページに説明されている。","label":"2026 corresponding author の指定","value":"\"Authors must designate exactly one individual as the corresponding author for their submission.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/authors/call-for-papers"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"ICCAD 2026の proceedings はACMが著作権を保持し、ACMのOpen Access方針のもとで全論文にArticle Processing Charge（APC）が課される。所属機関がACM Openに参加していれば自動的に免除され、低所得国・低中所得国の著者には地域割引、それ以外にはSIGDA支援のFinancial Hardship Waiverの枠組みがある。金額は corresponding author の会員資格で決まり、2026年は ACM/SIG会員 250ドル、非会員 350ドルという一時的な割引価格が案内されている。8月24日までに著者登録と支払いが確認できない論文は proceedings から外れる点が、投稿計画上の実質的な締切になる。","facts":[{"note":"Bylaws では IEEE CEDA が3年のうち2年、ACM SIGDA が3年に1回 copyright を保持するローテーションが説明されている。","label":"2026 著作権と proceedings","value":"\"ACM will hold the copyright for ICCAD 2026 proceedings. Authors of accepted papers must sign an ACM copyright release form for their paper.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"camera-ready 提出前に ACM eRights（copyright）フォームの完了が必要。","label":"2026 収録先","value":"発表されなかった論文は proceedings および ACM Digital Library から除外されうる旨が Final Author Instructions に記載されている","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/final-author-instructions"},{"note":"ACM Open 参加機関に所属していればAPCは不要と説明されている。","label":"2026 Open Access への移行","value":"\"Starting January 1, 2026, ACM will fully transition to Open Access.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/new-acm-publishing-model"},{"note":"New ACM Publishing Model ページでは2026年会議限定の一時補助（65%割引）と説明されている。","label":"2026 APC 金額","value":"ACM/SIG会員 250米ドル、非会員 350米ドル（corresponding author の資格で決定）","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"産業界の研究者による論文はSIGDAの財政支援の対象外と明記されている。","label":"2026 APC の免除・割引","value":"所属機関がACM Open参加ならAPCは自動免除。低所得国の著者は原則100%免除、低中所得国の著者は50%割引。それ以外はSIGDA支援のFinancial Hardship Waiverを申請可能（承認時100%割引、対象は ACM/SIG会員価格250ドル分まで）。","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 収録の条件（登録）","value":"\"At least one author per accepted regular paper or invited paper must be registered to the conference by August 24, 2026. Failure to register will result in your paper being removed from the conference proceedings.\"","checkedAt":"2026-08-05","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"label":"2026 参加者への proceedings 提供","value":"\"All registered participants will receive electronic access to the official conference proceedings at the start of the event.\"","checkedAt":"2026-08-05","sourceUrl":"https://iccad.com/2026/general-faq"},{"label":"書誌データベースでの収録","value":"DBLP に ICCAD の巻が収録されており、最新は \"IEEE/ACM International Conference On Computer Aided Design, ICCAD 2025, Munich, Germany, October 26-30, 2025\"","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/iccad/index.html"}],"title":"proceedings と出版費用","eyebrow":"publication"}},"sources":[{"url":"https://iccad.com/2026","role":"official","label":"ICCAD 2026 公式トップページ","checkedAt":"2026-08-05","evidenceLocator":"ヘッダの「NOVEMBER 8-12, 2026 | SAN JOSE, CALIFORNIA, USA」「ACM/IEEE ICCAD 2026」、「MARK YOUR CALENDAR / Important Dates & Deadlines」の締切表、Keynote Speakers 欄、「Jointly sponsored by IEEE and ACM...」の自己紹介文。"},{"url":"https://iccad.com/2026/authors/call-for-papers","role":"cfp","label":"ICCAD 2026 Call for Papers（HTMLページ）","checkedAt":"2026-08-05","evidenceLocator":"Call For Papers 見出し以下の本文、corresponding author に関する注記（\"Authors must designate exactly one individual as the corresponding author for their submission.\"）、Covered Topics の3区分、Call for Proposals（Workshops / Tutorials / Special Sessions / Panels）、Key Deadlines。採択率・投稿件数の記載はない。"},{"url":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf","role":"cfp","label":"ICCAD 2026 公式 Call for Papers PDF（iccad.com からリンク）","checkedAt":"2026-08-05","evidenceLocator":"1ページ目の「45th Edition」表記・DEADLINES・ORGANIZING CHAIRS、2〜4ページのトピック細目1.1〜3.3、4〜5ページのSUBMISSION DETAILS／REGULAR PAPER SUBMISSIONS（8ページ制限とdouble-blind規定）、5〜6ページのPUBLICATION FEE GUIDELINES、7ページのCONFERENCE PROCEEDINGS・CONFERENCE REGISTRATION・各賞、8ページのWORKSHOP/TUTORIAL/SPECIAL SESSION PROPOSALS、9ページのWORKFORCE DEVELOPMENT ACTIVITIES。2〜9ページのヘッダは「2022 INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN」。"},{"url":"https://iccad.com/2026/history","role":"history","label":"ICCAD Conference History","checkedAt":"2026-08-05","evidenceLocator":"冒頭の「ICCAD first edition was held more than 40 years ago」「Over the last 44 years, ICCAD has been held in:」と、その下のICCAD 2006〜2025の年次一覧（20件、欠年なし、2026年以降の記載なし）。"},{"url":"https://iccad.com/2026/bylaws","role":"society","label":"ICCAD Bylaws","checkedAt":"2026-08-05","evidenceLocator":"co-sponsor（IEEE CEDA / ACM SIGDA）の規定、2013年以降の収支配分率、IEEE Electron Device Society との in cooperation、会議の objective、Oversight Committee の構成（Past Conference Chairperson 他5職）と役員任命・任期制限、著作権ローテーションの条項。"},{"url":"https://iccad.com/2026/executive-committee","role":"committee","label":"ICCAD 2026 Executive Committee","checkedAt":"2026-08-05","evidenceLocator":"General Chair から European Representative まで、役職名・氏名・所属が並ぶ12件の一覧。"},{"url":"https://iccad.com/2026/rebuttal-phase","role":"cfp","label":"ICCAD 2026 Rebuttal Phase","checkedAt":"2026-08-05","evidenceLocator":"HotCRP上での査読結果の表示方法（Review #1190A 等）、「Add Round1 response」の手順、rebuttal の目的と論文差し替え禁止の記述。締切日の記載はない。"},{"url":"https://iccad.com/2026/final-author-instructions","role":"cfp","label":"ICCAD 2026 Final Author Instructions","checkedAt":"2026-08-05","evidenceLocator":"camera-ready のページ数（6ページ＋参考文献1ページ無料、追加最大2ページを1ページ150米ドル）、ACM テンプレート指定、ACM eRights、8月24日の3つの締切、「ICCAD 2026 is an in-person conference.」と現地発表義務、proceedings / ACM Digital Library からの除外条件。"},{"url":"https://iccad.com/2026/new-acm-publishing-model","role":"official","label":"ICCAD 2026 New ACM Publishing Model","checkedAt":"2026-08-05","evidenceLocator":"2026年1月1日からのACM Open Access完全移行、APC 250/350米ドルと2026年会議限定の65%割引補助、ACM Open参加機関、SIGDA Financial Hardship Waiver の説明。"},{"url":"https://iccad.com/2026/keynote-speakers","role":"program","label":"ICCAD 2026 Keynote Speakers","checkedAt":"2026-08-05","evidenceLocator":"Vaughn Betz の所属と講演題目「Spatial Computing Architectures: Opportunities and CAD Flows in the Deep Learning and More-than-Moore Era」を含むプロフィール欄。日時の記載はない。"},{"url":"https://iccad.com/2026/workshops","role":"program","label":"ICCAD 2026 Workshops","checkedAt":"2026-08-05","evidenceLocator":"「Thursday, November 12, 2026」の日付表示と、5本のワークショップ名およびオーガナイザ一覧。"},{"url":"https://iccad.com/2026/registration/registration-information","role":"registration","label":"ICCAD 2026 Registration Information","checkedAt":"2026-08-05","evidenceLocator":"Moderator, TPC, EC & Speaker 区分の料金表（950.00米ドル、Additional Page 150米ドル）、June 1 - August 24 と August 24 - November 12 の会員・非会員・学生別料金表、Workshop ONLY 250.00米ドルと Gala Dinner 120.00米ドル、8月24日までの支払いに関する注記。"},{"url":"https://iccad.com/2026/general-faq","role":"official","label":"ICCAD 2026 General FAQ","checkedAt":"2026-08-05","evidenceLocator":"登録開始時期（6月1日）、投稿サイト開設時期（3月7日）、早期登録締切、支払い方法と通貨、銀行振込の返金不可、proceedings の電子アクセス、参加証明書に関する各Q&A。"},{"url":"https://iccad.com/2026/conference-hotel","role":"venue","label":"ICCAD 2026 Conference Hotel","checkedAt":"2026-08-05","evidenceLocator":"「San Jose Marriott, 301 S Market St, San Jose, CA 95113」の conference hotel 表示と予約案内、San Jose Convention Center が直結している旨の説明。"},{"url":"https://iccad.com/2026/affiliate/become-a-sponsor","role":"sponsor","label":"ICCAD 2026 Become a Sponsor","checkedAt":"2026-08-05","evidenceLocator":"Silver/Gold/Platinum Patron の価格表（3,000／6,000／12,000米ドル）と特典欄、および「Our Audience Breakdown」の見出しと「*Data pulled from the ICCAD 2025 conference.」という注記。"},{"url":"https://iccad.com/2026/sponsor-listing","role":"sponsor","label":"ICCAD 2026 Sponsor Listing","checkedAt":"2026-08-05","evidenceLocator":"Platinum（Cadence, Synopsys）／Gold（Altera, AMD）／Silver（2社）の各段に並ぶスポンサーロゴと社名。"},{"url":"https://iccad.com/2026/job-fair","role":"program","label":"ICCAD 2026 EDA Job Fair","checkedAt":"2026-08-05","evidenceLocator":"冒頭の「ACM SIGDA and IEEE CEDA will host their 5th annual EDA Job Fair」という一文と、参加対象の説明。日時の記載はない。"},{"url":"https://iccad.com/2026/student-research-competition","role":"program","label":"ICCAD 2026 Student Research Competition","checkedAt":"2026-08-05","evidenceLocator":"ACM SIGDA との共催に関する説明、ACM および ACM SIGDA 会員という参加資格、undergraduate / graduate の区分、Key Dates（8月16日 11:59 pm AoE、9月16日、11月9〜11日）。"},{"url":"https://iccad.com/2026/cadathlon-at-iccad-2026","role":"program","label":"ICCAD 2026 CADathlon@ICCAD","checkedAt":"2026-08-05","evidenceLocator":"競技の説明、参加資格（博士号授与機関にフルタイム在籍する学生2名1組）、Nov 08, 2026・San Jose Marriott の開催情報、6つの問題分野、賞金額（1位1人1,500米ドル、2位1人750米ドル）。"},{"url":"https://iccad.com/2026/student-scholar-program","role":"program","label":"ICCAD 2026 Student Scholar Program","checkedAt":"2026-08-05","evidenceLocator":"支援対象経費と上限1,000米ドル、応募資格、「Student Scholar Program Grant submission - EXTENDED: July 31, 2026」の締切表示。"},{"url":"https://iccad.com/2026/travel/visa-invitation-letter","role":"official","label":"ICCAD 2026 Visa Invitation Letter","checkedAt":"2026-08-05","evidenceLocator":"supportletters.acm.org への申請手順と必要記入項目、米国visitor visa申請（DS-160・手数料・面接）に関する注意書き。"},{"url":"https://iccad.com/2026/ieee-policies","role":"official","label":"ICCAD 2026 IEEE Policies","checkedAt":"2026-08-05","evidenceLocator":"Non-Discrimination Policy、イベント行動規範、IEEE Code of Ethics、通報手順の各節。"},{"url":"https://dblp.org/db/conf/iccad/index.html","role":"bibliographic","label":"DBLP: ICCAD conference series index","checkedAt":"2026-08-05","evidenceLocator":"巻の一覧（最新は「IEEE/ACM International Conference On Computer Aided Design, ICCAD 2025, Munich, Germany, October 26-30, 2025」）と、年代へのジャンプナビゲーション。"}],"summary":"ICCADは、IEEE の Council on Electronic Design Automation（CEDA）と ACM の Special Interest Group on Design Automation（SIGDA）が co-sponsor する、電子設計自動化（EDA）およびCADの国際会議である。このページでは、2026年サイクル（11月8〜12日／San Jose, California, USA）の会期・会場ホテル・締切・投稿規定・double-blind査読・ACM Open Access への収録条件・参加登録費・委員構成・学生向けプログラムを、iccad.com の各ページと公式CFP PDFに直接書かれている記載だけで確認できる。歴史については、公式History ページが2006年以降の開催地しか掲載していないため、初回開催年そのものは公式ページに明記がなく、確認できるのは公式CFP PDFの「45th Edition」と、History ページの「ICCAD first edition was held more than 40 years ago」「Over the last 44 years」という表現までである。採択率、2027年サイクルの会期・開催地、特集号招待の有無は公式ソースに掲載がないため、このページでは扱わない。スポンサー募集ページに掲載されている参加者内訳の数値は「Data pulled from the ICCAD 2025 conference」と注記された前年実績であり、2026年サイクルの参加者構成ではないため扱わない。他学会との優劣づけやランキング、スポンサー企業とICCADの取引関係についても、公式ソースに記載がないため扱わない。","topics":[{"note":"1.3 と 1.4 として独立した細目。LLMによる設計・検証（GenAI for EDA）、agentic AI、AIサロゲートモデリング、XAI for CAD などが列挙されている。","label":"AI Algorithms and Applications / CAD for AI","sourceUrl":"https://confcats-siteplex.s3.amazonaws.com/iccad/files/iccad26-cfp_web-17.pdf"},{"note":"1.11。ソフトウェア定義車両・ドローン・ヒューマノイド向けCAD、differentiable physics、sim-to-real適応、学習を含むシステムの機能安全検証などを含む。","label":"Physical AI & Embodied 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の2列を持ちますが、2026-08-05時点で前者の列のセルはダッシュ（----）表示で、金額は \"After 31 July 2026\" 列にのみ印字されています。\"In-Person BOTH Tutorial and Conference\" の同列は Professional・IEEE Memberが$815、Professional・Non-Memberが$980、Student・IEEE Memberが$250、Student・Non-Memberが$305です。区分はオンライン／現地本会議のみ／現地tutorial込みの3系統に、Professional・Student、IEEE Member・Non-Member、Student Developing Countryが組み合わされます。支払いはクレジットカードのみで、返金申請の期限は2026年8月19日 11:59 PM (PDT)、$25の事務手数料がかかります。","question":"参加費はいくらですか。","sourceUrls":["https://hotchips.org/registration/","https://hotchipssymposium.regfox.com/hot-chips-2026"]},{"answer":"Registrationページは \"Both in-person and online options available!\" としてオンライン参加の区分があることだけを記載しており、配信方式・視聴方法・質疑の手段は同ページに書かれていません。渡航なしでどこまで追えるかは、登録前に registration@hotchips.org へ確認してください。現地参加の場合はStanford学内の寮を1泊$125（3泊最低、8月23日チェックイン・8月26日チェックアウトで$375、8月22日からの早期チェックイン付きで$500）で予約でき、申込締切は2026年8月16日です。Housingページは会場までの学内無料バスも案内しています。学生はTCMM housing grantsの申請（期限2026年8月15日）で1泊$25（3泊$75、4泊$100）まで下がります。","question":"日本から参加する場合、宿泊やオンライン参加はどうなりますか。","sourceUrls":["https://hotchips.org/registration/","https://hotchips.org/housing/"]},{"answer":"2026年サイクルの公式サイトは \"Hot Chips 2026\" / \"HC2026\" と年で表記し、回数を印字していません。Archivesページはhc01〜hc34のあとにhc2023・hc2024・hc2025を並べており、hc34が2022年です。2026年の投稿システムのURLは hotchips38 を含み、DBLPは2025年の巻を \"37th Hot Chips Symposium 2025\" と表記しています。第1回（HC01）は1989年6月26〜27日にStanford UniversityのKresge Auditoriumで開かれました。","question":"Hot Chipsは第何回ですか。","sourceUrls":["https://hotchips.org/archives/","https://hc34.hotchips.org/","https://hc01.hotchips.org/","https://dblp.org/db/conf/hotchips/index.html"]}],"headline":"2026年サイクルの公式トップ・Call For Contributions・Program・Committees・Archives・Housing、および過去回のアーカイブサイトとDBLPのシリーズ索引を実際に開き、そこに印字されている記載だけを並べました。","metaDescription":"Hot Chipsの公式情報。2026年8月23〜25日のStanford開催、2ページextended abstractの投稿規定と3月29日／4月8日の締切、Program Committeeの選考観点、slidesのproceedings掲載を、公式ページ記載のまま確認できます。","oneLine":"Hot Chips（Hot Chips: A Symposium on High Performance Chips）は、1989年に始まり毎年8月にSilicon Valleyで開かれる高性能マイクロプロセッサと関連ICのシンポジウムで、written paperを必須とせず2ページのextended abstractをProgram Committeeが評価して30分の講演を選ぶ会議です。","pageTitle":"Hot Chipsとは｜高性能チップのシンポジウム、2026年会期・投稿締切・選考方式・proceedings","relatedConferenceIds":["isscc","cool-chips","a-sscc","acm-ieee-international-symposium-on-computer-architecture","aicas","cicc"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルは日曜のtutorial 1日と月曜・火曜の本会議2日という3日構成で、会場はStanfordのMemorial Auditoriumです。現地参加とオンライン参加の両方が登録区分として用意されていますが、オンライン参加で講演がどう配信されるか（配信方式や質疑の手段）はRegistrationページに書かれていません。Stanfordの学生寮を使う宿泊枠が公式に用意され、1泊$125・3泊最低・8月16日締切という条件まで公開されているため、宿泊費の見積もりは公式ページだけで組めます。2027年サイクルの会期や会場は、2026-08-05時点で公式サイトに掲載されていません。","facts":[{"note":"トップページに \"Sunday, August 23 - Tuesday, August 25, 2026\" と記載。8月23日がtutorial、24日・25日が本会議。","label":"2026 会期","value":"2026年8月23日（日）〜8月25日（火）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/"},{"note":"トップページの会場表記そのまま。","label":"2026 会場・都市・国","value":"Memorial Auditorium, Stanford, Palo Alto, CA（米国カリフォルニア州パロアルト）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/"},{"note":"同ページはオンライン区分が存在することを示すのみで、配信方式・視聴方法・質疑の手段は説明していない。","label":"2026 開催形式","value":"現地参加とオンライン参加の両方があり、Registrationページは \"Both in-person and online options available!\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/registration/"},{"note":"Tutorialsページの時間表記。","label":"2026 tutorial 実施日","value":"2026年8月23日（日）にTutorial 1（9:00AM-12:30PM）とTutorial 2（1:45PM-5:00PM）の2本","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/tutorials/"},{"note":"Conferenceページの時間割では、月曜は8:00AMのbreakfast/registrationと9:15AMのWelcomeのあと9:30AMのCPU 1から、火曜は7:45AMのbreakfast/registrationのあと8:30AMのFPGAから始まる。","label":"2026 本会議日","value":"2026年8月24日（月）と8月25日（火）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"\"Single occupancy, with shared bathrooms (separate facilities for men and women) at the end of each hallway\" と記載され、会場までの学内無料バスも案内されている。","label":"2026 公式宿泊枠","value":"Stanford University dorms（学内寮）、1泊$125・3泊最低、8月23〜26日の標準3泊で$375、8月22日からの早期チェックイン付き4泊で$500","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/housing/"},{"note":"トップページとHousingページの双方に同じ日付が出ている。","label":"2026 宿泊申込締切","value":"2026年8月16日（日）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/housing/"},{"note":"トップページは2026年サイクルの登録・宿泊・プログラムのみを案内している。","label":"2027 サイクルの公表状況","value":"2026-08-05時点のトップページに2027年の会期・会場の告知は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/"}],"title":"2026年サイクルの会期・会場・参加形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"Call For Contributionsに掲げられたTopics of Interestは、汎用プロセッサから domain-specific chip、reconfigurable chip、security、mobile/embedded、communications、emerging computing architectures、memory technologies、power/thermal・packaging等のenabling technologies、そして新しいハードウェア向けのsoftware and systemsまで10カテゴリに整理されています。Aboutページは実在する製品と実装可能な技術を重視すると述べており、投稿の評価観点にもmarket significanceが入ります。2026年の実際のセッション名は CPU 1 / CPU 2 / Automotive / GPU / FPGA / Memory / Networking & Interconnect / AI 1 / AI 2 で、CFPのカテゴリ名とセッション名は一対一で対応していません。対象外を明示する記述はCFPページに置かれていないため、境界の判断はProgram Committeeへの事前照会（program@hotchips.org）に委ねられます。","facts":[{"note":"Call For Contributionsの箇条書き見出し。各見出しの下に細目が並ぶ。","label":"2026 Topics of Interest（大分類）","value":"General-Purpose Processor Chips / Domain-Specific Chips / Reconfigurable Chips / Security / Mobile and Embedded Devices / Communications and Networking / Emerging Computing Architectures / Memory Technologies / Other Enabling Technologies / Software and Systems for Emerging Hardware","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"同ページの細目そのまま。","label":"2026 Domain-Specific Chips の細目","value":"AI Accelerators / Graphics Chips / Machine Learning Chips / Data Analytics and Big Data Processing / IoT and Always-On Functions / Custom Chips for Emerging Applications","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"同ページの細目そのまま。","label":"2026 Emerging Computing Architectures の細目","value":"Neuromorphic / Quantum Computing / Analog Computing, Photonic Chips","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"同ページの細目そのまま。","label":"2026 Other Enabling Technologies の細目","value":"Power and Thermal Management / Sustainable Computing / Generative Tools / Packaging and Testing / Display Technologies / On-Chip Optics & Sensors / Novel Computing Technologies","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Conferenceページの時間割に印字されたセッション見出し。","label":"2026 本会議のセッション名","value":"月曜: CPU 1 / CPU 2 / Keynote / Automotive / GPU、火曜: FPGA / Memory / Networking & Interconnect / AI 1 / AI 2","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"同ページはこの列挙のあとに \"For a complete list of topics, refer to the official call for papers.\" と続け、完全な一覧はCall For Contributions側にあるとしている。","label":"扱う対象についての公式方針","value":"Aboutページは \"The conference emphasis this year, as in previous years, is on 'real products and realizable technology.'\" と記し、\"hot\" topics の例として \"embedded and reconfigurable processors, quantum computing, nano structures, wireless chips, network/security processors, advanced packaging technology etc.\" を挙げている","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"2026-08-05時点で同ページを確認。境界の判断はProgram Committee Co-Chairs宛（program@hotchips.org）の照会先が案内されている。","label":"明示された対象外","value":"Call For Contributionsページに、受け付けない対象や scope 外を明示する記述は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"}],"title":"対象技術領域とセッション構成","eyebrow":"scope"},"review":{"id":"review","body":"Hot Chipsの選考はProgram Committeeによる評価で、Call For Contributionsに評価軸が5つ明記されています。デバイスの性能、革新度、先端技術の使用に加えて、市場としての意義（potential market significance）と聴衆の関心という、製品発表に近い観点が公式に含まれる点が投稿判断の材料になります。double-blindや外部査読者への割当といった査読手続きの記述は公式ページに置かれていないため、査読付き論文の実績としてカウントできるかは所属機関の基準に照らして確認が必要です。採択率と投稿件数は2026-08-05時点で公開されていません。","facts":[{"note":"原文の引用。評価軸は5つ。","label":"2026 選考主体と評価観点","value":"\"Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience.\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Committeesページの Program Committee 欄に掲載。","label":"2026 Program Committee Co-Chairs","value":"Borivoje Nikolic（UC Berkeley）、Jan-Willem van de Waerdt（Enphase Energy）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/committees/"},{"note":"個々の委員名と所属はCommitteesページに掲載されている。","label":"Program Committee の構成方針","value":"Aboutページは \"The program committee consisting of members from academia and industry, is busy sorting through a record number of paper submissions this year.\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"同ページに書かれているのは Program Committee による評価という主体と、5つの評価軸のみ。","label":"査読方式の詳細表記","value":"double-blind、単盲検、外部査読者への割当、査読者数といった査読手続きに関する記述は、Call For Contributionsページに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Aboutページが示す規模の目安は「3日間でおよそ25件の講演」という構成の説明にとどまる。","label":"採択率","value":"2026-08-05時点で、Call For ContributionsページおよびAboutページに採択率・投稿件数・採択件数の数値は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"未発表製品を扱う投稿を想定した項目。","label":"非公開希望の申告","value":"投稿時に \"if you would like the submission to be held confidential\" を申告する欄がある","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"}],"title":"選考方式と評価観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"Hot Chipsは公式サイトが年ごとにサブドメインで分かれるため、hotchips.org のURLは常に現行サイクル（2026年）を指し、過去回は hc34.hotchips.org / hc2025.hotchips.org のようなアドレスに残ります。資料を引用するときはURLのサブドメインで年を確認できます。回数表記は公式サイト（西暦）とDBLP（第N回）で系統が異なり、投稿システムのURLにも別の番号が現れます。公式サイトと公式登録ページが2026-08-05時点で公開していない項目は、採択率・投稿件数・採択件数、年次の実参加者数、2027年サイクルの会期と会場、2026年公式サイト上の回数表記（第N回）、オンライン参加の配信方式と質疑の手段、そしてregfox登録ページの \"Before 01 August 2026\" 列の金額（同列のセルはダッシュ表示）です。本ページもこれらの数値や手段を示していません。","facts":[{"note":"Archivesページから各年のサイトに辿れる。","label":"年の取り違えが起きやすい箇所","value":"hotchips.org 直下のトップ・Program・Registrationは常に現行サイクル（2026年）を指し、過去回は hc01.hotchips.org 〜 hc34.hotchips.org、hc2023〜hc2025.hotchips.org に分かれる","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/archives/"},{"note":"3系統の表記が併存するため、社内資料では出典と一緒に記す必要がある。","label":"回数表記の揺れ","value":"2026年公式サイトは年表記のみで回数を印字せず、投稿システムのURLは hotchips38、DBLPは2025年を37thと表記する","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"「1989年から毎年8月」という一文を第1回にそのまま適用すると日付が合わない。","label":"開催月の記述と第1回の食い違い","value":"Aboutページは毎年8月開催と記載する一方、第1回（HC01）のアーカイブに残る日付は1989年6月26〜27日","checkedAt":"2026-08-05","sourceUrl":"https://hc01.hotchips.org/"},{"note":"Aboutページにある規模の記述は「500名超」「およそ25件の講演」という構成の説明にとどまる。","label":"未公開の数値","value":"採択率、投稿件数、採択件数、年次の実参加者数は、Call For ContributionsページとAboutページのいずれにも掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"掲載は開催の支援を示すもので、取引関係・売上・採用・共同研究の根拠にはならない。","label":"sponsor 一覧の読み方","value":"Sponsoringページに並ぶ企業名は、金額区分に応じた協賛の掲出である","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/sponsoring/overview.html"},{"note":"掲載した事実はすべて hotchips.org 系ドメイン、公式登録ページ、およびDBLPのシリーズ索引で読める範囲。","label":"このページで扱わない範囲","value":"過去回の投稿統計、他会議とのランキング比較、参加報告や第三者の解説記事の内容は含めていない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/"},{"note":"掲載されているのはTopics of Interestの列挙のみ。","label":"対象外領域の明示","value":"投稿を受け付けない領域を明示する記述は、Call For Contributionsページにない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"}],"title":"このページで扱わない範囲と、年度が混ざりやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"第1回（HC01）は1989年6月26〜27日、Stanford UniversityのKresge Auditoriumで開かれています。Aboutページは1989年開始・毎年8月開催と説明していますが、第1回のアーカイブに残る日付は6月であり、年月の記述をそのまま第1回に当てはめると食い違います。会場はStanford構内が続き、2026年サイクルはMemorial Auditoriumです。回数の表記はhc34（2022年）までディレクトリ名に回数を使い、2023年以降は西暦へ切り替わっています。","facts":[{"note":"第1回アーカイブサイトの記載。SPARC CPU、Intel i860、Motorola 68040、Intel i486などのセッションが並ぶ。","label":"第1回の年・日付・会場","value":"HC01は1989年6月26〜27日、Kresge Auditorium, Stanford University","checkedAt":"2026-08-05","sourceUrl":"https://hc01.hotchips.org/"},{"note":"同じ文で毎年8月開催と説明されるが、第1回アーカイブの日付は6月26〜27日。","label":"初回開催年（公式の説明文）","value":"Aboutページは1989年に始まったと記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"回数付きディレクトリの最終回。Rhodium sponsorはIntel、PlatinumはAMDとJump Trading。","label":"hc34 の年","value":"Hot Chips 34は2022年8月21日（日）〜23日（火）","checkedAt":"2026-08-05","sourceUrl":"https://hc34.hotchips.org/"},{"note":"8月22日がtutorial、23〜24日が本会議という3日構成。","label":"hc33 の年","value":"Hot Chips 33は2021年8月22日（日）〜24日（火）","checkedAt":"2026-08-05","sourceUrl":"https://hc33.hotchips.org/"},{"note":"2024年アーカイブサイトの記載。西暦ディレクトリ（hc2024）で保存されている。","label":"2024 サイクルの会期","value":"2024年8月25〜27日","checkedAt":"2026-08-05","sourceUrl":"https://hc2024.hotchips.org/"},{"note":"2025年アーカイブサイトの記載。posterは12件。","label":"2025 サイクルの会期","value":"tutorialが2025年8月24日（日）、本会議が8月25日（月）〜26日（火）","checkedAt":"2026-08-05","sourceUrl":"https://hc2025.hotchips.org/"},{"note":"hc34が2022年であるため、2023年以降のサイクルは西暦で識別される。","label":"回数表記の切り替わり","value":"Archivesページは hc01〜hc34 の回数表記のあとに hc2023 / hc2024 / hc2025 の西暦表記を並べている","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/archives/"},{"note":"公式サイトが西暦表記に移行した後も、書誌側では回数が付与されている。","label":"書誌側に残る回数","value":"DBLPは2025年の巻を \"37th Hot Chips Symposium 2025: Stanford, CA, USA\" と表記している","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/hotchips/index.html"}],"title":"1989年の第1回と、その後の表記の変化","eyebrow":"history"},"program":{"id":"program","body":"2026年サイクルは日曜のtutorial 2本（Memory TechnologyとRISC-V）から始まり、月曜午後にkeynoteが置かれています。本会議の講演はCPU、GPU、Automotive、FPGA、Memory、Networking & Interconnect、AIの各セッションに配置され、演題には登壇組織名が併記されています。posterは11件が公式ページに掲載され、大学・国立研究所・企業の双方が並びます。過去回の構成を比較したい場合は、2024年サイクルのアーカイブに2件のkeynote題目が残っています。","facts":[{"note":"登壇はJim Handy（Objective Analysis）\"Memory: Feeding AI's voracious hunger for data\"、Raghu Sreeramaneni（Micron）、Sangwook Han（Samsung）\"HBM Base Die: How will HBM evolve in the future by utilizing the logic process?\"、Jaesik Lee（SK Hynix）、Sudeep Bhoja（D-Matrix）とAayush Ankit（Meta）、Anurag AgrawalとRadhakrishna Giduthuri（Oxmiq Labs）。","label":"2026 Tutorial 1","value":"Memory Technology（Chair: Suresh Rajgopal、9:00AM-12:30PM、8月23日）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/tutorials/"},{"note":"登壇はKrste Asanovic（SiFive）、Gordan Markus（Canonical）、Frans Sijstermans（NVIDIA）、Thomas Roecker（Infineon）。","label":"2026 Tutorial 2","value":"RISC-V（Chair: Marcel Tromp、1:45PM-5:00PM、8月23日）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/tutorials/"},{"note":"Conferenceページの時間割に掲載。","label":"2026 Keynote","value":"\"Compute in Motion: Challenges of Autonomous Driving\" — Daniel Rosenband（Waymo）、8月24日 2:15PM-3:15PM","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"CPU 1（9:30AM-11:00AM）とCPU 2（11:30AM-1:00PM）の6件。組織名は時間割に併記されたもの。","label":"2026 CPU セッションの演題","value":"\"The future IBM Z & LinuxONE Processor and AI Inference Acceleration Chipset\"（IBM）、\"Intel Core Series 3, codename Wildcat Lake\"（Intel）、\"NVIDIA's Vera CPU\"（NVIDIA）、\"Next-Generation Arm-based CPU FUJITSU-MONAKA for green AI data center\"（Fujitsu）、\"Arm AGI : A Disaggregated, Chiplet-Based Server SoC for scalable coherency and memory Bandwidth in the Terabyte/s Era\"（Arm）、\"Diamond Rapids: Next Generation Intel Xeon CPU\"（Intel）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"GPU（8月24日 4:45PM-6:45PM）、AI 1（8月25日 2:15PM-4:15PM）、AI 2（8月25日 4:45PM-6:15PM）から抜粋。","label":"2026 GPU / AI セッションの演題","value":"\"NVIDIA Rubin GPU: Driving the Era of Agentic AI\"（NVIDIA）、\"AMD Instinct MI400 Series GPU Architecture\"（AMD）、\"Crescent Island: GPU Designed for Agentic AI Inference\"（Intel）、\"MTIA: Meta's custom AI Silicon Program\"（Meta）、\"The Cerebras Rack-Scale Architecture for Wafer Scale Engine\"（Cerebras）、\"MAIA 200: A Data Center Scale AI system\"（Microsoft）、\"Dataflow at Scale: the SN50 RDU\"（SambaNova）、\"The Eighth Generation TPU Family: Two Chips Optimized for Training and Serving in the Agentic Era\"（Google）、\"You Can Just Build Things … Chips\"（OpenAI）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"\"World's First\" は演題に含まれる登壇者側の表記。","label":"2026 Memory / Networking セッションの演題","value":"\"Samsung LPDDR5X-PIM: World's First LPDDR based Processing in Memory (PIM) Solution for AI Inference\"（Samsung）、\"XCENA MX1 CXL Computational Memory Device\"（XCENA/Samsung Electronics）、\"Thor Ultra: An Ethernet NIC Chip Optimized for AI & HPC\"（Broadcom）、\"NVIDIA BlueField-4 Processor Powers the AI Factory Operating System\"（NVIDIA）、\"Massively Parallel Optical I/O Powered by Ultra-High-Density Micro-LEDs\"（Mojo Vision）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"Postersページに題目と所属が併記されている。ポスター発表の運用方法（掲示時間帯など）は同ページに記載されていない。","label":"2026 poster 件数と例","value":"11件。\"Croc: Training the Next Generation Chip Designers on Domain-Specific End-to-End Open Source Silicon\"（ETH Zurich）、\"Gemmelos: A Dual-Chip Platform in Intel 16 for Multimodal Edge AI Applications\"（UC Berkeley）、\"From Microarchitecture to Silicon: An End-to-End RISC-V CPU Design Course\"（University of Tokyo）、\"A Low-Power and Real-Time Vision-Language Navigation Processor with 3D Spatial Reasoning for Embodied Agents\"（KAIST）ほか","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/posters/"},{"note":"年ごとの実際の本数はプログラムページ側の記載が優先される。","label":"会議構成の一般的な説明","value":"Aboutページは、3日間の構成を2本のtutorial、2本のkeynote、panel discussion、およそ25件の講演とし、1件あたり30分と説明している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"2024年サイクル（2024年8月25〜27日）のアーカイブサイト掲載。","label":"2024 keynote（過去回の例）","value":"\"Predictable Scaling and Infrastructure\"（Trevor Cai、OpenAI）と \"The Journey to Life with AI Pervasiveness\"（Victor Peng、AMD）","checkedAt":"2026-08-05","sourceUrl":"https://hc2024.hotchips.org/"}],"title":"2026年のtutorial・keynote・セッション内容","eyebrow":"program"},"audience":{"id":"audience","body":"学生にとっては、posterが産業界・学界の双方から受け付けられ、大学で行った応用研究のposterが明示的に歓迎されている点が入口になります。費用面では学生区分の参加費に加えて、1泊$25まで下がるTCMM housing grantsが用意され、申請期限は2026年8月15日です。企業側の調査用途では、Registrationページが \"Both in-person and online options available!\" としてオンライン参加の区分を設けている点が入口になりますが、配信方式や質疑の手段は同ページに書かれていないため、渡航なしでどこまで追えるかは登録前に registration@hotchips.org へ確認する必要があります。参加費はhotchips.orgのRegistrationページには金額が出ておらず、regfoxの登録ページに \"Before 01 August 2026\" と \"After 31 July 2026\" の2列で掲載されています。2026-08-05時点では前者の列のセルがダッシュ表示で、金額は \"After 31 July 2026\" 列にのみ出ています。","facts":[{"note":"posterの提出形式は4 slidesとone-page summary。","label":"学生 poster の位置づけ","value":"Call For Contributionsは \"Poster submissions are also accepted from both industry and academia\" とし、大学で行った応用研究の学生posterを歓迎すると記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"通常の寮の料金は1泊$125（3泊最低）。","label":"学生向け宿泊補助","value":"TCMM housing grantsの適用で寮の宿泊費が1泊$25になり、申請期限は2026年8月15日","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/housing/"},{"note":"同ページはIEEE member、Student、Press、Speaker、委員・ボランティア向けの区分があることのみ記載している。","label":"2026 参加費の掲載場所","value":"hotchips.org/registration/ に金額表は掲載されておらず、登録は https://hotchipssymposium.regfox.com/hot-chips-2026 で行う","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/registration/"},{"note":"登録区分は On-Line Tutorial and Conference / In-Person Conference Days ONLY / In-Person BOTH Tutorial and Conference の3系統に、Professional・Studentと IEEE Member・Non-Member、および Student Developing Country が組み合わされる。In-Person BOTH Tutorial and Conference の After 31 July 2026 列は Professional・IEEE Member $815、Professional・Non-Member $980、Student・IEEE Member $250、Student・Non-Member $305。","label":"2026 参加費の価格列","value":"登録ページは \"Before 01 August 2026\" と \"After 31 July 2026\" の2つの価格列を表示し、2026-08-05時点では \"Before 01 August 2026\" 列のセルがダッシュ（----）表示で、金額は \"After 31 July 2026\" 列にのみ印字されている","checkedAt":"2026-08-05","sourceUrl":"https://hotchipssymposium.regfox.com/hot-chips-2026"},{"note":"Registrationページの記載。同ページは、この期限より後のキャンセルは受け付けず参加費は返金されないとしている。","label":"2026 支払い方法とキャンセル","value":"\"Credit Cards are the only forms of payment for HOT CHIPS 2026\"。返金申請の期限は \"11:59 PM (PDT) Wednesday, August 19, 2026\" で、$25の事務手数料がかかる","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/registration/"}],"title":"研究室・学生と、企業・調査担当それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"Hot Chipsの正式名称は各年のアーカイブサイトのヘッダーに \"Hot Chips: A Symposium on High Performance Chips\" として印字されており、同じヘッダー行に \"Conference Sponsor IEEE Technical Committee on Microprocessors and Microcomputers.\" が続きます。現行サイトのトップやContactページには主催団体を明文で説明する段落が置かれておらず、団体名はこのヘッダー行と、学生向け宿泊補助を \"TCMM student housing grant\" として案内するHousingページの記載から読み取れます。2026年サイクルの公式表記は \"Hot Chips 2026\" ないし \"HC2026\" で、回数（第N回）は印字されていません。社内資料で回数を使う場合は、投稿システムのURLが softconf.com/k/hotchips38 である点と、DBLPが2025年を \"37th Hot Chips Symposium 2025\" と表記している点を根拠として併記する形になります。","facts":[{"note":"アーカイブサイトのヘッダー行に印字された名称。2026年サイクルのトップページには \"A Symposium on High Performance Chips\" が掲げられている。","label":"正式名称","value":"Hot Chips: A Symposium on High Performance Chips","checkedAt":"2026-08-05","sourceUrl":"https://hc01.hotchips.org/"},{"note":"IEEE Technical Committee on Microprocessors and Microcomputers（TCMM）の名称はこの行に出る。ACMなど他団体の名称はこの行には並んでいない。","label":"Conference Sponsor の表記","value":"アーカイブサイト（hc01）のヘッダー行に \"Conference Sponsor IEEE Technical Committee on Microprocessors and Microcomputers.\" と印字されている","checkedAt":"2026-08-05","sourceUrl":"https://hc01.hotchips.org/"},{"note":"TCMMという略称が現行サイクルのページ上で使われている箇所。","label":"TCMM の関与（学生支援）","value":"Housingページは \"TCMM student housing grant\" の見出しで学生向け宿泊補助を案内し、\"TCMM is providing a limited number of housing grants to help eligible students offset the cost of staying in the Stanford dorms during Hot Chips.\" と記したうえで、適用時の宿泊費を1泊$25、申請期限を2026年8月15日（土）としている","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/housing/"},{"note":"原文の引用。順位を数値で示す記述は同ページにない。","label":"会議の性格に関する公式表現","value":"Aboutページは \"HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits.\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"同ページは開催地について \"the center of the world's capital of electronics activity, Silicon Valley\" という表現を使っている。","label":"開催頻度","value":"Aboutページは1989年開始で、毎年8月にSilicon Valleyで年1回開催すると記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"同じ2026年サイクルのCall For Contributionsが案内する投稿システムのURLは https://softconf.com/k/hotchips38 で、パスに hotchips38 が含まれる。","label":"2026 サイクルの回数表記","value":"2026年公式サイトのトップおよびProgramページは \"Hot Chips 2026\" / \"HC2026\" と年で表記し、第N回にあたる回数を印字していない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/conference/"},{"note":"回数表記が必要な場合の書誌側の根拠。公式サイト側の年表記とは表記系統が異なる。","label":"書誌データベース上のシリーズ名","value":"DBLPはシリーズ名を \"IEEE Hot Chips Symposium (HCS)\"、出版者をIEEEとして索引し、直近の巻を \"37th Hot Chips Symposium 2025: Stanford, CA, USA\" と表記している","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/hotchips/index.html"},{"note":"Contact Usページに列挙されたアドレス。役割別に9件のアドレスが並ぶ。","label":"問い合わせ窓口","value":"chair@hotchips.org（全般）、program@hotchips.org（プログラム）、registration@hotchips.org（参加登録）、sponsor@hotchips.org（協賛）、press@hotchips.org（プレス）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/contact_us/"}],"title":"会議の正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Committeesページには、運営を担うOrganizing Committee、投稿を評価するProgram Committee、継続性を担うSteering Committeeの3つが並び、それぞれ氏名と所属が印字されています。所属を見ると企業側（NVIDIA、AMD、Intel、Google、Micron、Arm、Meta、Microsoft、TSMC、Amazon、Cadence、Supermicro、Infineon、Tenstorrent、OpenAI等）と大学側（UC Berkeley、Stanford、Seoul National University、Hong Kong University）が混在します。sponsorはRhodium／Platinum／Gold／Silverの4段で掲載され、金額と特典も公開されています。sponsor掲載は開催の支援を示すもので、取引関係・売上・採用・共同研究を示すものではありません。","facts":[{"note":"Committeesページに掲載された氏名と所属。Press、Registration、Sponsorship等の担当も同ページに列挙されている。","label":"2026 Organizing Committee（一部）","value":"General Chair: Larry Yang（New Eggs Advisors）、Vice Chair: Nhon Quach、Publications: Stefan Rusu（TSMC）、Web/IT: Kevin Broch（Meta）、Virtual Services: Deepak Unnikrishnan（NVIDIA）、Communications: Cliff Young（Google）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/committees/"},{"note":"Committeesページ掲載の氏名と所属。産業界と大学の双方が含まれる。","label":"2026 Program Committee メンバー","value":"Alan Jay Smith（UC Berkeley）、Pradeep Dubey（Intel）、Gabriel Southern（NVIDIA）、Cliff Young（Google）、Ralph Wittig（AMD）、Ian Bratt（ARM）、Marcel Tromp（Infineon）、Suresh Rajgopal（Micron）、Thierry Tambe（Stanford）、John Wright（OpenAI）、Greg Papadopoulus（NEA）、Brucek Khailany（NVIDIA）、Jae W. Lee（Seoul National University）、Yuan Xie（Hong Kong University）、Yasuo Ishii（Tenstorrent）、Sherry Xu（Microsoft）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/committees/"},{"note":"Committeesページ掲載。","label":"Steering Committee","value":"Chair: Alan Jay Smith（UC Berkeley）。メンバーに Allen Baum、Keith Diefendorff、Pradeep Dubey（Intel）、John Hennessy（Stanford）、John Sell（Retired）、Lily Jow、Ralph Wittig（AMD）、Fred Weber、Alisa Scherer、Gabriel Southern（NVIDIA）","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/committees/"},{"note":"Sponsoringページのロゴ掲出。掲載は開催の支援を示すもので、取引・売上・採用・共同研究を示すものではない。","label":"2026 sponsor 掲載（Rhodium / Platinum）","value":"Rhodium: Volt AI、Google Cloud。Platinum: XSight、Normal Computing、NVIDIA、AMD、MuRata、Intel、Samsung、Advantest、Lanxin Computing、Marvell","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/sponsoring/overview.html"},{"note":"無料参加登録はSilver/Gold各1名、Platinum 3名、Rhodium 5名。ロゴ掲載とプレス対応は全段共通。","label":"2026 sponsor 区分と金額","value":"Silver $4,000（非営利団体および売上$20M未満の企業に限定）、Gold $8,000、Platinum $12,000、Rhodium $25,000以上","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/sponsoring/overview.html"},{"note":"\"There is no deadline for sponsoring Hot Chips\" と記載され、締切は設定されていない。","label":"2026 展示テーブル","value":"\"Each sponsor that reserves a table receives an 8 ft long 30-inch-wide table\"、追加費用$3,500（Rhodiumは含まれる）。電源とWi-Fi付き、テーブル要員2名までの3日分の昼食が付く","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/sponsoring/overview.html"},{"note":"Postersページに印字された所属名。同ページは所属名のみを掲げ、国名の欄は設けていない。","label":"2026 poster 発表者の所属表記","value":"ETH Zurich、UC Berkeley、Harvard、Lockheed Martin、Opticore、PNNL、KU Leuven、TU Delft、CMU、A*STAR、National University of Singapore、Normal Computing、University of Tokyo、KAIST","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/program/posters/"},{"note":"年ごとの実数は同ページに掲載されていない。","label":"参加者規模の公式記述","value":"Aboutページは、chip designer、architect、engineer、press、analyst、academic、national laboratory関係者を含む500名超の国際的な参加者が集まると記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"}],"title":"委員会構成とsponsor掲載","eyebrow":"community"},"comparison":{"id":"comparison","body":"Hot Chipsを他会議と分ける公式の手掛かりは、投稿要件と評価軸に出ています。written paperの提出が要件に入らず、2ページのextended abstractで応募し、採択後はslidesがproceedingsになるという流れは、フルペーパーの査読と収録を前提とする会議とは投稿物の形が異なります。評価軸に potential market significance と anticipated interest to the audience が入る点も、実装済みチップの発表を集める設計を示します。学術的な業績としての扱いが必要な場合は、IEEE Micro特集号への招待という別経路が用意されています。","facts":[{"note":"Call For Contributionsの投稿必須項目と \"Participants are not required to submit written papers\" の記述による。","label":"投稿物の形","value":"2ページ以内のextended abstractで応募し、written paperの提出は要件に含まれない","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"デバイス性能・革新度・先端技術の使用と並ぶ5軸のうちの2つ。","label":"評価軸に含まれる市場性","value":"評価軸に \"potential market significance and anticipated interest to the audience\" が明記されている","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"フルペーパー集としてのproceedingsではない。","label":"proceedings の中身","value":"proceedingsに載るのは presentation slides で、公式サイトのarchivesからも公開される","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"招待は全件ではなく選抜。","label":"学術業績につながる経路","value":"選ばれた発表にIEEE Micro特集号への投稿招待が出る","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"研究段階の提案のみを対象とする旨の記述は同ページにない。","label":"扱う対象","value":"Aboutページは実在する製品と実装可能な技術を重視すると記載している","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"}],"title":"他の回路・アーキテクチャ系会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は \"Presentation\" と \"Poster\" の2区分で、いずれも本文はextended abstractが2ページ以内という短い書式です。Posterは4枚のスライドと1ページのサマリという形で提出し、Presentationに採択された場合の登壇は30分・PowerPointまたはPDFになります。2026年の締切は3月29日の本締切と4月8日の延長締切という二段構えで、採択通知はEarly May, 2026、最終版の提出は7月17日です。投稿時には発表者の連絡先に加えて、同内容を他所へ投稿しているかの申告と、投稿内容を非公開扱いにしたいかの意思表示を求められます。","facts":[{"note":"投稿フォームで区分を選ぶ形式。Posterは産業界・学界の双方から受け付けると記載されている。","label":"2026 投稿区分","value":"\"Presentation\" または \"Poster\" の2区分","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Call For Contributionsの投稿必須項目およびPoster固有の提出形式として記載。テンプレートやフォントの指定は同ページにない。","label":"2026 原稿分量・書式","value":"Extended abstractは \"two pages maximum\"（2ページ以内）。Posterはこれに加えて 4 slides と one-page summary を提出する","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"原文の引用。1件30分。","label":"2026 講演形式","value":"\"Presentations at Hot Chips are in the form of 30-minute talks using PowerPoint or PDF.\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"同ページのKey Dates。2段階の締切が併記されている。","label":"2026 投稿締切","value":"Submission Deadline: March 29, 2026 / Extended Submission Deadline: April 8, 2026","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"採択通知は日付ではなく \"Early May\" という表記。最終版の提出物はproceedingsに載るpresentation slides。","label":"2026 採択通知と最終版提出（camera-ready 相当）","value":"Acceptance Notification: Early May, 2026 / Final Version Due: July 17, 2026","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"原文の項目列挙。連絡先は所属と役職まで求められる。","label":"2026 投稿必須項目","value":"\"'Presentation' or 'Poster', Title, Extended abstract (two pages maximum), Presenter's contact information (name, affiliation, job title, address, phone(s), and email)\" に加え、他所への類似投稿の有無と、非公開扱いを希望するかの申告","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Call For Contributionsから案内される公式投稿先。","label":"2026 投稿システム","value":"https://softconf.com/k/hotchips38","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"原文の引用。フルペーパーの提出は投稿要件に含まれていない。","label":"written paper の要否","value":"\"Participants are not required to submit written papers, but selected papers will be invited to submit a paper for inclusion in a special issue of IEEE Micro.\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"}],"title":"投稿区分・書式・2026年の締切一覧","eyebrow":"submission"},"publication":{"id":"publication","body":"Hot Chipsのproceedingsに載るのは presentation slides で、公式サイトのarchivesセクションからも公開されます。フルペーパーを書くかどうかは採択後の選択で、選ばれた発表にはIEEE Microの特集号への投稿招待が出ます。書誌データベース側では、DBLPが \"IEEE Hot Chips Symposium (HCS)\" というシリーズ名でIEEE刊行のproceedingsを索引しており、巻ごとにISBNが付与されています。過去回の資料は hcNN.hotchips.org / hcYYYY.hotchips.org という年別サイトに分かれて残り、2025年については全プログラムを1つのzip（約158MB）としてまとめたファイルも置かれています。","facts":[{"note":"Call For Contributionsの原文引用。","label":"proceedings に載るもの","value":"\"Presentation slides will be published in the Hot Chips Proceedings.\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Aboutページの原文引用。公式サイトのArchivesから辿れる。","label":"公開範囲","value":"\"Presentation slides are published in the HOT CHIPS proceedings and online in the archives section of the HOT CHIPS website.\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/about/"},{"note":"Call For Contributionsの原文引用。全件ではなく選抜された発表が対象。","label":"IEEE Micro 特集号への招待","value":"\"selected papers will be invited to submit a paper for inclusion in a special issue of IEEE Micro\"","checkedAt":"2026-08-05","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"索引されている巻は2006年、2009〜2016年、2019〜2025年の16件で、2007〜2008年と2017〜2018年は同索引に並んでいない。","label":"書誌索引と出版者","value":"DBLPはシリーズ \"IEEE Hot Chips Symposium (HCS)\" 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Posters（2026）","checkedAt":"2026-08-05","evidenceLocator":"11件のposter題目と、各件に併記された所属名。"},{"url":"https://hotchips.org/advance-program/","role":"program","label":"Advance Program（2026）","checkedAt":"2026-08-05","evidenceLocator":"3日間の全体構成（tutorial日・本会議2日・keynote・poster）。トップのProgramメニューからの遷移先。"},{"url":"https://hotchips.org/about/","role":"official","label":"About（会議の説明・沿革・proceedings方針）","checkedAt":"2026-08-05","evidenceLocator":"\"HOT CHIPS has been known as one of the semiconductor industry's leading conferences...\" の段落、1989年開始と毎年8月Silicon Valley開催の記述、500名超の参加者、3日構成の説明、slidesのproceedings掲載とIEEE Micro招待の記述。"},{"url":"https://hotchips.org/about/committees/","role":"committee","label":"Committees（2026 委員会名簿）","checkedAt":"2026-08-05","evidenceLocator":"Organizing Committee、Program Committee（Co-Chairsとメンバー）、Steering Committeeの各見出しの下に並ぶ氏名と所属。"},{"url":"https://hotchips.org/archives/","role":"archive","label":"Archives（回別サイト一覧）","checkedAt":"2026-08-05","evidenceLocator":"hc01〜hc34、hc2023、hc2024、hc2025のリンク一覧。各リンクは hcNN.hotchips.org / hcYYYY.hotchips.org に対応。"},{"url":"https://hotchips.org/registration/","role":"registration","label":"Registration（2026 参加登録案内）","checkedAt":"2026-08-05","evidenceLocator":"\"Both in-person and online options available!\"、割引対象区分の列挙、返金期限と$25手数料、クレジットカードのみという記述、regfoxへのリンク。"},{"url":"https://hotchipssymposium.regfox.com/hot-chips-2026","role":"registration","label":"Hot Chips 2026 登録ページ（regfox）","checkedAt":"2026-08-05","evidenceLocator":"登録区分の表。列見出しに \"Before 01 August 2026\" と \"After 31 July 2026\"、行に In-Person BOTH Tutorial and Conference / Professional, IEEE Member などの区分。2026-08-05時点で \"Before 01 August 2026\" 列のセルはダッシュ表示で、金額は \"After 31 July 2026\" 列にのみ印字。"},{"url":"https://hotchips.org/housing/","role":"venue","label":"Housing（2026 宿泊）","checkedAt":"2026-08-05","evidenceLocator":"Stanford学内寮の1泊$125・3泊$375・早期チェックイン$500、申込締切2026年8月16日、TCMM housing grantsの1泊$25と2026年8月15日の申請期限。"},{"url":"https://hotchips.org/sponsoring/overview.html","role":"sponsor","label":"Sponsoring Overview（2026 協賛）","checkedAt":"2026-08-05","evidenceLocator":"Silver $4,000 / Gold $8,000 / Platinum $12,000 / Rhodium $25,000+ の区分表と特典、テーブル$3,500の記述、Rhodium・Platinum等のロゴ掲出。"},{"url":"https://hotchips.org/contact_us/","role":"official","label":"Contact Us","checkedAt":"2026-08-05","evidenceLocator":"役割別の連絡先メールアドレス一覧（chair / program / registration / sponsor / press ほか）。"},{"url":"https://hc01.hotchips.org/","role":"history","label":"HC01 アーカイブ（1989年 第1回）","checkedAt":"2026-08-05","evidenceLocator":"ヘッダー行 \"Hot Chips: A Symposium on High Performance Chips | Conference Sponsor IEEE Technical Committee on Microprocessors and Microcomputers.\"、開催日1989年6月26〜27日、会場Kresge Auditorium, Stanford University、セッション一覧。"},{"url":"https://hc33.hotchips.org/","role":"archive","label":"HC33 アーカイブ（2021年）","checkedAt":"2026-08-05","evidenceLocator":"2021年8月22日のtutorialと8月23〜24日の本会議という時間割、\"Hot Chips 33 has concluded.\" の告知。"},{"url":"https://hc34.hotchips.org/","role":"archive","label":"HC34 アーカイブ（2022年）","checkedAt":"2026-08-05","evidenceLocator":"2022年8月21〜23日の日程、\"HC34 Sponsors\" のRhodium/Platinum/Gold/Silverロゴ一覧。"},{"url":"https://hc2024.hotchips.org/","role":"archive","label":"Hot Chips 2024 アーカイブ","checkedAt":"2026-08-05","evidenceLocator":"2024年8月25〜27日の日程、keynote題目2件（Trevor Cai / Victor Peng）。"},{"url":"https://hc2025.hotchips.org/","role":"archive","label":"Hot Chips 2025 アーカイブ","checkedAt":"2026-08-05","evidenceLocator":"tutorial 2025年8月24日・本会議8月25〜26日の時間割、poster 12件、\"hc2025-full-program-v4.zip\"（約158MB）のリンク、sponsor段組。"},{"url":"https://dblp.org/db/conf/hotchips/index.html","role":"bibliographic","label":"DBLP: IEEE Hot Chips Symposium (HCS) シリーズ索引","checkedAt":"2026-08-05","evidenceLocator":"シリーズ名 \"IEEE Hot Chips Symposium (HCS)\"、巻一覧（2006、2009-2016、2019-2025 の16件）、\"37th Hot Chips Symposium 2025: Stanford, CA, USA\"、出版者IEEEとISBN表示。"}],"summary":"Hot Chipsは、公式Aboutページが \"HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits.\" と記す会議で、同ページは1989年開始・毎年8月・Silicon Valley開催と説明しています。2026年サイクルは2026年8月23日（日）〜25日（火）、会場はMemorial Auditorium, Stanford, Palo Alto, CAで、現地とオンラインの両方の参加区分が用意されています。このページでは、\"Presentation\" と \"Poster\" の2区分・2ページ以内のextended abstract・2026年3月29日と4月8日の二段構えの締切・Program Committeeの評価観点・slidesをproceedingsに載せる公式文言・IEEE Micro特集号への招待・2026年のセッション構成とposter一覧・委員会名簿・sponsor一覧までを、出典URLつきで確認できます。一方で採択率、投稿件数、2027年サイクルの会期と会場、2026年公式サイト上の回数表記（第N回）、オンライン参加の配信方式や質疑の手段、そしてregfoxの早期割引価格（\"Before 01 August 2026\" 列のセルはダッシュ表示）は、2026-08-05時点の公式ページには出ていません。sponsor一覧は開催を支援する企業の掲載であり、取引関係や採用状況を示すものとしては扱いません。","topics":[{"note":"Topics of 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の細目として掲載されている。","label":"Sustainable Computing / Power and Thermal Management","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"Neuromorphic、Quantum Computing、Analog Computing, Photonic Chips が細目。","label":"Emerging Computing Architectures","sourceUrl":"https://hotchips.org/call_for_contrib/"},{"note":"2026年tutorial 2のテーマ。SiFive、Canonical、NVIDIA、Infineonからの登壇が掲載されている。","label":"RISC-V","sourceUrl":"https://hotchips.org/program/tutorials/"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"S","publicReason":"1989年から続く高性能チップのシンポジウム。NVIDIA、AMD、Intel、IBMなどが新しいCPU・GPUのアーキテクチャを発表し、講演は要旨で選び、資料はスライドで公開する。"},"industryTrend":{"publicBand":"strong"},"researchOrientation":{"value":"industry_centered","populationLabel":"28 official conference program presentation first-listed presenter affiliation organization 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integration、HPC、AI）、interconnect・bonding、高信頼・RF・MEMS・WLCSP・FOWLP、材料・装置・プロセス、design・modeling・metrologyが対象でした。","question":"どの技術領域が対象ですか？","sourceUrls":["https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"]}],"headline":"第59回International Symposium on Microelectronicsは2026年9月28日〜10月1日にEncore Boston Harborで開かれ、2027年はSan DiegoのTown & Country Resortで開かれます。","metaDescription":"IMAPS Symposium（International Symposium on Microelectronics）の主催、2026年Boston大会の会期、5つのtechnical track、査読つきproceedings paperの締切、PDC、2027年San Diego開催を公式ページから並べた解説です。","oneLine":"IMAPS（International Microelectronics Assembly and Packaging Society）が毎年開く、マイクロエレクトロニクス実装と先端パッケージの国際シンポジウムです。","pageTitle":"IMAPS Symposiumとは：IMAPSの年次マイクロエレクトロニクス実装シンポジウムの会期・トラック・論文審査","relatedConferenceIds":["ectc","iwlpc","estc","eptc","3dic","icep-hbs"],"sections":{"cycle":{"id":"cycle","body":"2026年大会は9月28日から10月1日までEncore Boston Harborで開かれ、初日がProfessional Development Courses、9月29日から10月1日がtechnical program、展示は9月29日と30日でした。2027年はSan DiegoのTown & Country Resortでの開催が告知されています。","facts":[{"label":"2026 会期","value":"2026-09-28〜2026-10-01","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 会場","value":"Encore Boston Harbor / Boston, Massachusetts / 米国","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 会場所在地","value":"1 Broadway, Everett, MA 02149","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 日程の内訳","value":"PDC 9月28日 / technical program 9月29日〜10月1日 / 展示 9月29日〜30日","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 テーマ","value":"Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2027 会場","value":"Town & Country Resort / San Diego, 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Williamson（Texas Instruments）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/Symposium2027Savethedate"}],"title":"2026年大会と次回","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年のcall for abstractsは、microelectronics/packaging supply chain全体の技術進展を示す原著論文を募集し、5つのtechnical trackとInteractive Poster Sessionを示しました。trackはパッケージ構造、interconnect・bonding、高信頼・RF・MEMS・WLCSP・FOWLP、材料・装置・プロセス、design・modeling・metrologyに分かれます。","facts":[{"label":"2026 募集対象","value":"microelectronics/packaging supply chain全体の技術進展を示すoriginal papers","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"},{"label":"2026 track数","value":"5 technical tracks + Interactive Poster Session","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"},{"label":"2026 track 1","value":"Advanced Packages & Structures (Heterogeneous Integration, HPC, 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Metrology","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"}],"title":"対象領域・track","eyebrow":"scope"},"review":{"id":"review","body":"proceedings paperはpeer reviewを受け、2026年は6月22日の初稿提出から7月22日の査読結果返送までが審査期間でした。keynoteとpanelは招待制で、plenary sessionとして実施されます。","facts":[{"label":"paperの査読","value":"full proceedings paperはpeer reviewを受ける","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"keynote・panel","value":"INVITED ONLY、plenary sessionとして実施","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 Technical Committee","value":"IMAPS Symposium 2026 Technical Committeeがabstractを募集","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"Past Eventsページは第59回を「September 28-October 1, 2025 / Boston」と記していますが、Symposiumページでは第59回は2026年9月28日〜10月1日で、年の表記が食い違っています。会場Encore Boston Harborの住所はEverett, MAで、公式ページの都市表記はBostonです。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"第50回（2017年）はRaleigh、第57回（2024年）はBoston、第58回（2025年）はSan Diegoで開かれ、2020年の第53回はVirtual開催でした。IMAPSはSymposiumが50周年を超えていると紹介しています。","facts":[{"label":"50周年","value":"Symposiumは50周年を超えている","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"第50回","value":"2017-10-09〜12 / Raleigh, North Carolina","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"第53回","value":"2020-10-05〜08 / Virtual","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"第58回","value":"2025-09-29〜10-02 / San Diego, California","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"第57回","value":"2024-09-30〜10-03 / Boston, Massachusetts","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"}],"title":"開催の記録","eyebrow":"history"},"program":{"id":"program","body":"2026年は初日9月28日にProfessional Development Coursesが開かれ、hybrid bondingとglass packaging、CoWoSにつながるflip chip技術、2.3D FOWLPなどが講座名に並びました。展示はSOLD OUTで、Symposium登録にSiPhotonics Workshopを追加できる料金体系もありました。ポスターは昼食時間のinteractive presentationです。","facts":[{"label":"2026 PDC例（hybrid bonding）","value":"Hybrid Bonding and Glass Packaging for Chiplet Heterogeneous Integration（John Lau, Unimicron）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 PDC例（CoWoS）","value":"Evolution of Flip Chip Package Technology as CoWoS Enabler（Vikas Gupta, ASE）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 PDC例（FOWLP）","value":"Advances in 2.3D Fan-Out Wafer Level Packaging (FOWLP)（Beth Keser, SEMI）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 展示","value":"Exhibitors SOLD OUT","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 SiPhotonics Workshop","value":"Symposium登録にSiPhotonics Workshopを追加可能","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"ポスターセッション","value":"昼食時間に開くinteractive presentation","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 登録料（会員・早期）","value":"$925（8月22日以前）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"}],"title":"PDC・展示・ポスター","eyebrow":"program"},"audience":{"id":"audience","body":"学生は単独参加、大学ブースの無料出展（student university booth）、IMAPS University & Community College Future Workforce Education Programの3つの形で参加でき、学生会員向けの登録料は$100（8月22日以前）です。参加者層はindustry engineers、top experts、researchers、studentsとされています。","facts":[{"label":"学生の参加形態","value":"単独参加、無料のstudent university booth、Future Workforce Education Program","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 学生登録料","value":"$100（8月22日以前、学生会員）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"参加者層","value":"industry engineers、top experts、researchers、students","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Symposium on Microelectronicsで、IMAPSが毎年開く年次シンポジウムです。","facts":[{"label":"正式名称・回次（2026）","value":"59th International Symposium on Microelectronics","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"主催","value":"International Microelectronics Assembly and Packaging Society（IMAPS）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"開催頻度","value":"年1回（annual Symposium on Microelectronics）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"2026 General Chair","value":"Karthik Dhandapani（Cerebras）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年の組織委員会はGeneral ChairがCerebras、General Chair-electがTexas Instruments、Past General ChairがBinghamton Universityの所属です。2028年のGeneral Chair-ElectにはNorthrop GrummanのFrank Eberle氏が就いています。","facts":[{"label":"2026 General Chair-elect","value":"Jaimal M. Williamson（Texas Instruments）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2026 Past General Chair（2025）","value":"Benson Chan（Binghamton University）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"label":"2028 General Chair-Elect","value":"Frank Eberle（Northrop Grumman）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/Symposium2027Savethedate"}],"title":"組織委員会","eyebrow":"community"},"comparison":{"id":"comparison","body":"IMAPSは年次Symposiumのほか、Device Packaging Conference（2026年は3月2日〜5日にPhoenix、2027年は3月1日〜4日）やCHIPcon（2026年は7月7日〜10日にSanta Clara）を開いています。","facts":[{"label":"Device Packaging Conference 2026","value":"2026-03-02〜05 / Phoenix, Arizona","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"CHIPcon 2026","value":"2026-07-07〜10 / Santa Clara, California","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"},{"label":"IMAPS DPC 2027","value":"2027-03-01〜04、call for abstracts受付中","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/SpeakandPublish"}],"title":"IMAPSの他イベントとの違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"abstractで応募し、採択された講演者はabstract、4〜6ページ以上のproceedings paper、発表スライド、略歴を提出します。2026年はpeer review用の初稿が6月22日、講演者登録が8月1日、修正版paperと著作権書式が8月12日の締切でした。","facts":[{"label":"2026 call for abstracts 掲載日","value":"2025-12-17","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"},{"label":"講演者の提出物","value":"abstract、full proceedings paper（4-6+ページ）、presentation slides、short bio","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 初稿（peer review用）締切","value":"6月22日","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 査読結果の返送","value":"7月22日","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 最終稿・著作権書式締切","value":"8月12日","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"2026 講演者登録締切","value":"8月1日","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"未提出時の扱い","value":"full proceedings paperと最終発表PDFを出さないと最終プログラムから外れる場合あり","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"}],"title":"投稿・提出物（2026年）","eyebrow":"submission"},"publication":{"id":"publication","body":"Symposiumのpaperとproceedingsは、IMAPSがIMAPSourceへ掲載します。編集者が一部の著者にJournal of Microelectronics and Advanced Packagingへの再投稿を招待することがあります。講演スライドのPDFは10月10日に参加者向けダウンロードへ公開されました。","facts":[{"label":"proceedings掲載先","value":"IMAPSource（Symposium Proceedingsを含むIMAPS刊行物）","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/SpeakandPublish"},{"label":"journalへの招待","value":"編集者が一部の著者をjournalへの再投稿に招待","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/SpeakandPublish"},{"label":"journal名","value":"Journal of Microelectronics and Advanced Packaging","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/SpeakandPublish"},{"label":"2026 発表PDFの公開","value":"10月10日に参加者向けダウンロードへ","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/IMAPS2026Speaker"},{"label":"open access proceedings","value":"過去イベントのOPEN ACCESS proceedingsを案内","checkedAt":"2026-10-08","sourceUrl":"https://imaps.org/page/PastEvents"}],"title":"proceedings・journal","eyebrow":"publication"}},"sources":[{"url":"https://imaps.org/page/IMAPS-Symposium","role":"official","label":"IMAPS Symposium 2026","checkedAt":"2026-10-08","evidenceLocator":"冒頭の会期・会場・テーマ、Organizing Committee、PDC一覧、登録料、展示、ホテル"},{"url":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm","role":"cfp","label":"Symposium 2026 Call for Abstracts","checkedAt":"2026-10-08","evidenceLocator":"募集文と5 technical tracksの一覧"},{"url":"https://imaps.org/page/IMAPS2026Speaker","role":"cfp","label":"IMAPS Symposium 2026 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modelingやmetrologyまでを含みます。採択された講演者は4〜6ページ以上のproceedings paperを提出し、そのpaperはpeer reviewを受けます。初日のProfessional Development Coursesではhybrid bonding、FOWLP、CoWoSにつながるflip chip技術などの講座が並びました。","topics":[{"note":"2026年はtrack 1とテーマ「Intelligent Packaging for the AI Era」が対応しています。","label":"Heterogeneous integration・HPC/AI向けパッケージ","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"},{"note":"track 2のbonding技術に加え、PDCにHybrid Bonding and Glass Packaging for Chiplet Heterogeneous Integrationの講座がありました。","label":"Hybrid bonding","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"note":"Symposium登録にSiPhotonics Workshopを追加できました。","label":"Co-packaged optics・photonics","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"note":"track 3にWLCSPとFOWLPが含まれ、PDCにAdvances in 2.3D Fan-Out Wafer Level Packagingの講座がありました。","label":"FOWLP・WLCSP","sourceUrl":"https://imaps.org/news/716864/Symposium-2026-Call-for-Abstracts.htm"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"A","publicReason":"IMAPS最大の年次会議で、5つの技術トラックを組む。先端実装、異種集積、フォトニクスの発表に企業の基調講演が加わり、パネル、ポスター、講習も開く。"},"publicReasons":[{"body":"会議サイト","sourceUrl":"https://imaps.org/page/IMAPS-Symposium"},{"body":"会議サイト","sourceUrl":"https://imaps.org/?trk=public_post-text"}],"sourceUrls":[{"url":"https://imaps.org/page/IMAPS-Symposium"},{"url":"https://imaps.org/page/IMAPS2025"},{"url":"https://virtual.oxfordabstracts.com/event/74397/titles"},{"url":"https://cdn.ymaws.com/imaps.site-ym.com/resource/resmgr/images/symp25/symposium_2025_sponsors_jun_.png"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"ended","label":"会期終了","closedNote":"","imminent":false,"staleEnded":false,"steps":[{"id":"pre-cfp","label":"投稿受付前","state":"done"},{"id":"open","label":"投稿受付中","state":"done"},{"id":"review","label":"投稿終了","state":"done"},{"id":"notified","label":"採否通知","state":"done"},{"id":"program","label":"プログラム公開","state":"done"},{"id":"live","label":"開催中","state":"done"},{"id":"ended","label":"終了","state":"current"}],"currentStep":"ended","nextEvent":null,"lastPast":{"kind":"author","label":"論文締切","date":"2026-06-22"},"milestones":[{"kind":"abstract","label":"要旨締切","date":"2026-04-10","state":"past"},{"kind":"acceptance","label":"採否通知","date":"2026-04-15","state":"past"},{"kind":"author","label":"論文締切","date":"2026-06-22","state":"past"},{"kind":"session","label":"開催","date":"2026-09-28","endDate":"2026-10-01","state":"past"}],"action":{"kind":"next","text":"次回の日程は公式サイトで発表されます。","href":"https://imaps.org/page/IMAPS-Symposium","linkLabel":"公式サイト"}},"proceedingsUrl":null,"digestDeadline":null,"lateNewsDeadline":null,"finalPaperDeadline":null,"submissionOpensOn":null,"programPublishedOn":null},{"id":"mbe","code":"M&BE","name":"International 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UniversityのCheolmin Park氏が健康モニタリングのための触覚ニューロモルフィックディスプレイを取り上げました。ドイツのAachen University of Applied SciencesからはMichael J. 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source-row grain.","rows":[{"rows":1,"company":"Commonwealth Fusion Systems"},{"rows":1,"company":"Randy Olson's ABT Institute"},{"rows":1,"company":"Western Digital"}],"label":"MMM 2026 invited and special-event program company affiliation rows","sourceUrl":"https://magnetism.org/2026/invited-speakers","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"75 official invited speaker + special-event speaker/chair affiliation rows"}],"countryBreakdowns":[{"note":"Country/region rows are based on the listed affiliation organizations for official invited speakers and visible special-event speakers/chairs.","rows":[{"rows":32,"country":"United States","percentage":42.7},{"rows":12,"country":"Japan","percentage":16},{"rows":5,"country":"Germany","percentage":6.7},{"rows":3,"country":"Switzerland","percentage":4},{"rows":3,"country":"United Kingdom","percentage":4},{"rows":2,"country":"China","percentage":2.7},{"rows":2,"country":"Denmark","percentage":2.7},{"rows":2,"country":"France","percentage":2.7},{"rows":2,"country":"India","percentage":2.7},{"rows":2,"country":"Netherlands","percentage":2.7},{"rows":2,"country":"Spain","percentage":2.7},{"rows":1,"country":"Australia","percentage":1.3},{"rows":1,"country":"Brazil","percentage":1.3},{"rows":1,"country":"Canada","percentage":1.3},{"rows":1,"country":"Luxembourg","percentage":1.3},{"rows":1,"country":"New Zealand","percentage":1.3},{"rows":1,"country":"South Korea","percentage":1.3},{"rows":1,"country":"Sweden","percentage":1.3},{"rows":1,"country":"Taiwan","percentage":1.3}],"label":"MMM 2026 invited and special-event program affiliation organization country/region","sourceUrl":"https://magnetism.org/2026/invited-speakers","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"75 official speaker/chair affiliation rows"}],"sponsorOrganizations":{"note":"The list enumerates the official sponsor, partner, and exhibitor rows visible on the MMM 2026 confirmed partners and exhibitors page.","rows":[{"role":"Conference sponsor","tier":"Conference Sponsors","organization":"AIP Publishing","organizationType":"professional_society"},{"role":"Conference sponsor","tier":"Conference Sponsors","organization":"IEEE Magnetics Society","organizationType":"professional_society"},{"role":"Partner","tier":"Platinum Partners","organization":"Western Digital","organizationType":"company"},{"role":"Partner","tier":"Gold Partners","organization":"Journal of Magnetism and Magnetic Materials","organizationType":"professional_society"},{"role":"Partner","tier":"Silver Partners","organization":"GMW Associates","organizationType":"company"},{"role":"Partner","tier":"Bronze Partners","organization":"Materion Corporation","organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitors","organization":"Correlated Magnetics Research Inc.","organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitors","organization":"GMW Associates","organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitors","organization":"QZabre","organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitors","organization":"Spin Sensing Factory","organizationType":"company"}],"label":"MMM 2026 sponsor / partner / exhibitor listing","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"10 official listing rows"}},"city":"Honolulu","tier":"a","venue":"Hilton Hawaiian Village Waikiki Beach Resort","country":"United States","fieldId":"memory-reliability","editions":[],"genreIds":["reliability","circuits","feol"],"processes":[],"cycleLabel":"2026-11-02〜06 / Hilton Hawaiian Village Waikiki Beach Resort, Honolulu, Hawaii, USA","fieldTitle":"Memory / Reliability / Failure Physics","organizers":[],"lastVerified":"2026-09-13","currentCycleEnd":"2026-11-06","abstractDeadline":"2026-04-29","acceptanceNotice":"2026-06-12","lateNewsDeadline":"2026-09-14","peerReviewStatus":"program-committee-selected","currentCycleStart":"2026-11-02","finalPaperDeadline":"2026-10-05","canonicalId":"conf_782e2e4e8bdc4730885d0926c316b4fe","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"mmm","confidenceScore":1,"coverage":{"faqCount":6,"factCount":65,"topicCount":4,"sourceCount":13,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年11月2〜6日に、米国ハワイ州HonoluluのHilton Hawaiian Village Waikiki Beach Resortで開かれます。","question":"MMM 2026はいつ、どこで開かれますか。","sourceUrls":["https://magnetism.org/2026"]},{"answer":"AIP PublishingとIEEE Magnetics Societyの共同主催です。","question":"主催団体はどこですか。","sourceUrls":["https://magnetism.org/2026"]},{"answer":"AIP Advancesのspecial topicとして2027年初めにオンライン公開され、著者の追加負担なしでオープンアクセスになります。掲載には会議での発表が必要です。","question":"会議論文はどこに掲載されますか。","sourceUrls":["https://magnetism.org/2026/publications"]},{"answer":"Program Committeeが、磁性と磁性材料の科学への実質的な進歩、独自性と重要性などを基準に審査し、発表形式も決めます。","question":"抄録の採否は何で決まりますか。","sourceUrls":["https://magnetism.org/2026/abstract-submissions"]},{"answer":"第1回Conference on Magnetism and Magnetic Materialsは1955年にPittsburghで開かれ、2026年が第71回です。","question":"MMMはいつから開かれていますか。","sourceUrls":["https://magnetism.org/2026/past-conferences","https://magnetism.org/2026"]},{"answer":"2028 Joint MMM-INTERMAGが2028年1月10〜14日にカナダのVancouverで予定されています。","question":"次の合同会議はいつですか。","sourceUrls":["https://magnetism.org/2026/future-conference"]}],"headline":"第71回のMMM 2026は2026年11月2〜6日に米国ハワイ州HonoluluのHilton Hawaiian Village Waikiki Beach Resortで開かれます。","metaDescription":"Annual Conference on Magnetism and Magnetic Materials（MMM）の主催、第71回Honolulu会期、ScholarOne抄録投稿とProgram Committeeの採択基準、AIP Advancesへの論文掲載、12の技術カテゴリ、1955年からの沿革を公式ページからまとめます。","oneLine":"MMMは、AIP PublishingとIEEE Magnetics Societyが共同で主催し、基礎から応用までの磁性と磁性材料の研究を集める年次の国際会議です。","pageTitle":"MMMとは｜AIP PublishingとIEEE Magnetics Societyの年次磁性会議","relatedConferenceIds":["intermag","joint-mmm-intermag-conference","international-conference-on-magnetism","magnetics-society-of-japan-annual-meeting","imw"],"sections":{"cycle":{"id":"cycle","body":"2026年回は11月2〜6日にHonoluluのHilton Hawaiian Village Waikiki Beach Resortで開かれます。Symposia、Tutorial、special sessionsは現地プログラムとして行われ、出版規定にはVirtual Presenters向けの原稿投稿枠も書かれています。次のサイクルとして、公式サイトはINTERMAG 2027（済州島）、ICM 2027、2028 Joint MMM-INTERMAG（Vancouver）、MMM 2028（San Antonio）を掲載しています。","facts":[{"label":"2026 会期・都市","value":"2026-11-02〜06 / Honolulu, Hawaii","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"2026 会場","value":"Hilton Hawaiian Village Waikiki Beach Resort, Honolulu, Hawaii, USA","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"2026 現地プログラム","value":"Symposia、Tutorial、special sessionsは現地開催","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/program-overview"},{"label":"2026 Virtual Presentersの原稿枠","value":"Virtual Presentersは原稿1本","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/publications"},{"label":"2026 早期登録","value":"10月9日までの登録で早期料金","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"2028 Joint MMM-INTERMAG","value":"2028-01-10〜14 / Vancouver, Canada","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/future-conference"},{"label":"MMM 2028","value":"October 30 - November 3 / San Antonio, Texas","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/future-conference"}],"title":"開催サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"MMM 2026は磁性と磁性材料の基礎・応用の科学と技術を対象とし、12の技術カテゴリを設けています。カテゴリ3のSpintronics（GMR/TMR、Altermagnets、Orbitronicsなど10区分）、カテゴリ9のMagnetic Recording, Storage and Computing、カテゴリ12のMagnetic Characterizationが並びます。半導体と接する区分としてSTT-MRAM, SOT-MRAM, Magnetic Logic, and Related Devicesがあり、Unconventional Computing（Neuromorphic, Ising, Stochastic, Reservoir...）やMagnetics for Power Electronics and Controlも区分に入っています。","facts":[{"label":"2026 対象の定義","value":"磁性と磁性材料の基礎・応用の科学と技術","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 カテゴリ3","value":"Spintronics（GMR/TMR、Altermagnets、Orbitronicsなど10区分）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 カテゴリ9","value":"Magnetic Recording, Storage and Computing","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 MRAM関連区分","value":"STT-MRAM, SOT-MRAM, Magnetic Logic, and Related Devices","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 非従来型計算","value":"Unconventional Computing (Neuromorphic, Ising, Stochastic, Reservoir...)","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 パワーエレクトロニクス向け磁性","value":"Magnetics for Power Electronics and Control","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"},{"label":"2026 カテゴリ12","value":"Magnetic Characterization","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/technical-categories"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"抄録はProgram Committeeが審査し、磁性と磁性材料の科学に対する実質的な進歩、独自性と重要性を基準にします。関連する複数の抄録は可能な限り1本にまとめるよう求められ、セッションと発表形式の最終決定もProgram Committeeが行います。会議論文はAIP Advancesの通常論文と同じ基準で1回の査読を受け、掲載の最終判断はAIPの編集者が下します。","facts":[{"label":"採択基準（進歩）","value":"磁性と磁性材料の科学への実質的な進歩","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/abstract-submissions"},{"label":"採択基準（独自性・重要性）","value":"独自かつ重要な知見","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/abstract-submissions"},{"label":"関連抄録の扱い","value":"関連する複数の抄録は可能な限り統合","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/abstract-submissions"},{"label":"2026 発表形式の決定","value":"Program Committeeがセッションと形式を最終決定","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/abstract-submissions"},{"label":"論文の査読","value":"1回の査読、最終判断はAIPの編集者","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/publications"},{"label":"論文の査読基準","value":"AIP Advancesの通常論文と同じ","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/publications"},{"label":"2026 Late-Breaking Postersの審査","value":"Program Committeeが全件を審査","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/late-breaking-posters"}],"title":"査読・採択","eyebrow":"review"},"caveats":{"id":"caveats","body":"MMM 2026は現地開催を基本としますが、出版規定にはVirtual Presentersの原稿枠があります。抄録締切は延長が重なっており、Important Datesページの日付は延長後の値です。Late-Breaking Postersの締切（9月14日）は通常抄録とは別の枠で、原稿投稿はできません。Past Conferencesの一覧ではMMM単独回とJoint MMM-INTERMAGで回次の数え方が別で、2020年はMMMがVirtual Conference、INTERMAG 2020は中止と記載されています。Organizing CommitteeページのProgram Committee Co-Chairの所属は「National Institute for Materials」と途中で切れた表記です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のPast Conferencesページによると、第1回Conference on Magnetism and Magnetic Materialsは1955年にPittsburghで開かれました。MMMとIntermagの合同会議は1976年6月の第1回Joint MMM-Intermag Conference（Pittsburgh）から始まり、一覧には1998年の第7回（San Francisco）、2022年、2025年（New Orleans、1月13〜17日）の合同会議も並びます。直前の単独回はMMM 2025（10月27〜31日、Palm Beach, Florida）です。","facts":[{"label":"初回開催年と根拠","value":"1955年 / Pittsburgh, PA","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"最初の合同会議","value":"1st Joint MMM-Intermag Conference（1976-06-15〜18, Pittsburgh）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"2025 MMM","value":"2025-10-27〜31 / Palm Beach, Florida, USA","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"2025 合同会議","value":"Joint MMM & INTERMAG 2025（2025-01-13〜17, New Orleans）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"2022 合同会議","value":"Joint MMM-INTERMAG 2022","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"1998 合同会議","value":"7th Joint MMM-Intermag Conference（San Francisco）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年の技術プログラムは、口頭・ポスター、招待シンポジウム、チュートリアル、special sessionsで組まれています。11月2日のTutorialは「Applications of Magnetic Micro/Nano Robots」、11月3日のspecial sessionは「Magnetism in Nuclear Fusion」で、11月4日にWomen in Magnetism Workshop、11月5日にIEEEのパワーエレクトロニクス向け磁性ロードマップ会合（ITRMP）、11月6日にYoung Professionals Lightning Talksが予定されています。","facts":[{"label":"2026 プログラム構成","value":"口頭・ポスター、招待シンポジウム、チュートリアル、special sessions","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"2026 Tutorial（11月2日）","value":"Applications of Magnetic Micro/Nano Robots","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"},{"label":"2026 Special Session（11月3日）","value":"Magnetism in Nuclear Fusion","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"},{"label":"2026 Women in Magnetism Workshop（11月4日）","value":"LeadHERship in Magnetism: Challenges and Opportunities","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"},{"label":"2026 併設会合（11月5日）","value":"IEEE Intersociety Technology Roadmap on Magnetics for Power Electronics Meeting (ITRMP)","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"},{"label":"2026 Young Professionals（11月6日）","value":"Young Professionals Lightning Talks","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生や若手研究者にとっては、Students in Magnetism Networking Event、Young Professionals Lightning Talks、ビザ取得に時間がかかる国からの参加者向けの早期決定枠が参加計画の材料になります。企業や調査担当にとっては、記録・ストレージ・MRAM、パワーエレクトロニクス向け磁性のカテゴリと、ストレージ企業や計測機器メーカーが並ぶパートナー・出展者一覧が手がかりになります。","facts":[{"label":"2026 学生向けイベント（11月3日）","value":"Students in Magnetism Networking Event","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/special-events-sessions"},{"label":"2026 Late-Breaking Postersの対象","value":"現地ポスター発表のみ","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/late-breaking-posters"},{"label":"2026 Late-Breaking Postersの賞","value":"Poster Awardsの対象","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/late-breaking-posters"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"2026年回の正式表記はThe 71st Annual Conference on Magnetism and Magnetic Materialsで、略称はMMM 2026です。AIP PublishingとIEEE Magnetics Societyが共同で主催し、公式サイトのConfirmed Partners/Exhibitorsページでも両者がConference Sponsorsとして並びます。","facts":[{"label":"2026 正式名称・回次","value":"The 71st Annual Conference on Magnetism and Magnetic Materials","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"主催","value":"AIP PublishingとIEEE Magnetics Societyの共同主催","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"},{"label":"2026 Conference Sponsors","value":"AIP Publishing / IEEE Magnetics Society","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors"},{"label":"開催頻度","value":"年次（Annual Conference）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のConference ChairはUniversity of LorraineのStéphane Mangin氏で、Program Committee Co-ChairにはUniversity of Texas at AustinのJean Anne Incorvia氏が入っています。Exhibits Co-Chairには東北大学のAtsufumi Hirohata氏がいます。Confirmed Partners/Exhibitorsページには、Platinum PartnerとしてWestern Digital、Gold PartnerとしてSeagateとJournal of Magnetism and Magnetic Materials、出展者としてLake Shore CryotronicsやQuantum Designが掲載されています。","facts":[{"label":"2026 Conference Chair","value":"Stéphane Mangin（University of Lorraine）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/about/organizing-committee"},{"label":"2026 Program Committee Co-Chair","value":"Jean Anne Incorvia（University of Texas at Austin）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/about/organizing-committee"},{"label":"2026 Exhibits Co-Chair（日本）","value":"Atsufumi Hirohata（Tohoku University）","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/about/organizing-committee"},{"label":"2026 Platinum Partner","value":"Western Digital","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors"},{"label":"2026 Gold Partner","value":"Seagate、Journal of Magnetism and Magnetic Materials","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors"},{"label":"2026 Exhibitor（例）","value":"Lake Shore Cryotronics","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors"},{"label":"2026 Exhibitor（例）","value":"Quantum Design","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/confirmed-partners-and-exhibitors"}],"title":"運営体制","eyebrow":"community"},"comparison":{"id":"comparison","body":"MMMの公式サイトは、自らの過去回・将来回の一覧にINTERMAG、Joint MMM-INTERMAG、ICM（International Conference on Magnetism）を併せて掲載しています。MMM単独回は2025年が10月27〜31日（Palm Beach）、2028年が10月30日〜11月3日（San Antonio）で、Joint MMM-INTERMAGは2025年と2028年（1月10〜14日、Vancouver）が1月開催です。INTERMAG 2023は仙台、INTERMAG 2027は済州島（5月10〜14日）、ICM 2027はSan Juan（6月14〜18日）で、INTERMAGは米国外でも開かれています。","facts":[{"label":"INTERMAG 2023","value":"Sendai, Japan","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/past-conferences"},{"label":"INTERMAG 2027","value":"May 10 - 14 / Jeju Island, South Korea","checkedAt":"2026-10-08","sourceUrl":"https://magnetism.org/2026/future-conference"},{"label":"ICM 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rows","sourceUrl":"https://fmcad.org/FMCAD25/","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"8 official listing rows"}},"city":"Graz","tier":"a","venue":"Schumpeter Laboratory, TU Graz Inffeldgasse Campus","country":"Austria","fieldId":"circuits-systems","editions":[],"genreIds":["circuits"],"processes":[],"cycleLabel":"2026-09-14〜2026-09-18 / Schumpeter Laboratory, TU Graz Inffeldgasse Campus, Graz, Austria","fieldTitle":"回路 / システム / 設計自動化","organizers":[{"id":"org_260508d3644b421582f47d43a4799b17","name":"IEEE Council on Electronic Design 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checking、theorem proving、equivalence checkingなどが対象です。","question":"FMCADはどんな分野の会議ですか？","sourceUrls":["https://fmcad.org/"]},{"answer":"2026年9月14〜18日に、オーストリアGrazのGraz University of Technology（Inffeldgasse Campus）で開かれました。VSTTE 2026と併催で、FMCAD本会議は9月16〜18日です。","question":"FMCAD 2026はいつ、どこで開かれましたか？","sourceUrls":["https://fmcad.org/FMCAD26/cfp/","https://fmcad.org/FMCAD26/important_dates/"]},{"answer":"2026年はRegular papersとTool & Case Study papersのどちらも、参考文献を除いて9ページ（long）か5ページ（short）です。書式はIEEE Transactions形式です。","question":"論文は何ページで投稿しますか？","sourceUrls":["https://fmcad.org/FMCAD26/cfp/"]},{"answer":"2026年は224件の投稿から71件が採択され、公式サイトは採択率31.7%と発表しています。","question":"採択率はどのくらいですか？","sourceUrls":["https://fmcad.org/FMCAD26/"]},{"answer":"FMCADのproceedingsはOpen Accessで、TU Wien Academic Pressから読めます。2026年版はCC BY 4.0です。IEEE Xploreには有料版が載っています。","question":"proceedingsは無料で読めますか？","sourceUrls":["https://fmcad.org/","https://www.tuwien.at/academicpress/en/product/proceedings-of-the-26th-conference-on-formal-methods-in-computer-aided-design-fmcad-2026-ebook/"]},{"answer":"Student Forumがあり、学部生・大学院生が進行中の研究を短い報告として投稿できます。採択されると短い発表とポスター発表を行います。","question":"学生向けの発表枠はありますか？","sourceUrls":["https://fmcad.org/FMCAD26/student_forum/"]}],"headline":"FMCAD 2026は26回目の会議として、2026年9月14〜18日にオーストリアのGraz（TU Graz）でVSTTE 2026と併催されました。","metaDescription":"FMCAD（Formal Methods in Computer-Aided Design）の主催、2026年Graz会期、投稿区分とページ数、single-blind査読と採択率、TU Wien Academic Pressのproceedings、1996年からの開催履歴を公式ページから整理しました。","oneLine":"FMCADは、ハードウェアとシステムの検証を中心に、形式手法の理論と応用を発表する年次の国際会議で、FMCAD Associationが運営しています。","pageTitle":"FMCADとは｜ハードウェアとシステム検証の形式手法を発表する国際会議","relatedConferenceIds":["iccad","dac","date","iwls","asp-dac"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は9月14〜18日で、会場はGraz University of TechnologyのSchumpeter Laboratory（Inffeldgasse 11）です。15日はFMCADとVSTTEの合同tutorial day、16〜18日がFMCAD本会議という日程で、FMCAD Student Forumも含まれました。proceedingsは9月8日に公開されています。","facts":[{"label":"2026 会期・都市","value":"2026-09-14〜18 / Graz, Austria","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 会場","value":"Graz University of Technology（TU Graz）, Graz, Austria","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 本会議の建物","value":"Schumpeter Laboratory（Inffeldgasse 11）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/venue/"},{"label":"2026 日程構成","value":"9/15 合同tutorial day、9/16〜18 FMCAD本会議","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/important_dates/"},{"label":"2026 併催","value":"VSTTE 2026と併催、FMCAD Student Forumを含む","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 proceedings公開","value":"2026-09-08に公開","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"CFPは、形式手法とそのcomputer-aided designへの応用全般を募集対象に掲げています。検証手法ではmodel checking、theorem proving、equivalence checking、abstraction and reduction、compositional methods、bit・word-levelの決定手続きが並びます。ハードウェア寄りの題目として、timing・power modeling、組込み・cyber-physical・車載システムのシステムレベル設計と検証、HW/SW co-designが入り、データ駆動AIシステムの形式検証も対象です。産業規模の設計へ形式手法を適用した経験も募集されています。","facts":[{"label":"2026 募集範囲","value":"形式手法とそのcomputer-aided designへの応用全般","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 トピック（検証手法）","value":"Model checking、theorem proving、equivalence checking、bit/word-levelの決定手続きなど","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 トピック（ハードウェア・組込み）","value":"timing・power modeling、組込み・cyber-physical・車載システム、HW/SW co-design","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 トピック（AI）","value":"データ駆動AIシステムの形式検証","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 トピック（産業適用）","value":"産業規模の設計への適用経験と検証ツール","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 program のハードウェア関連セッション","value":"Hardware Verification（9/16 午後）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"各投稿は4人以上のprogram committeeメンバーがsingle-blindで査読し、途中にrebuttal期間があります。artifactの提出は任意ですが、program committeeの1人が論文と並行して評価し、採否の材料に入ります。2026年は224件の投稿のうちrebuttal後に172件が審議に残り、71件が採択されました。","facts":[{"label":"査読方式（2026 CFP）","value":"single-blind、1件あたり4人以上のPCメンバー","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"rebuttal（2026）","value":"2026-06-30〜07-05","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/important_dates/"},{"label":"2026 投稿数・採択数","value":"投稿224件、採択71件","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"2026 採択率","value":"31.7%","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"artifact評価（2026）","value":"任意提出、PCメンバー1人が論文と並行して評価","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"原著性の条件","value":"未発表かつ同時投稿でない研究","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"}],"title":"査読","eyebrow":"review"},"caveats":{"id":"caveats","body":"FMCAD 2026のサイトには旧版のCall for Papersページ（/FMCAD26/call_for_papers/）が残っており、延長前の論文締切（5月3日）やcamera-ready（7月18日）が載っています。ページ上限も2月に9ページ（long）・5ページ（short）へ引き上げられているため、2025年以前のCFPと数字が混ざりやすい箇所です。","facts":[{"label":"2026 ページ上限の変更","value":"long 9ページ / short 5ページへ引き上げ（2026-02-02告知）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"旧CFPページの日付（2026）","value":"延長前の論文締切 2026-05-03 が残る","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/call_for_papers/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"FMCADの初回は1996年で、2006年まで隔年開催でした。統合前は、FMCADが偶数年に米国、姉妹会議CHARMEが奇数年に欧州で開かれ、2006年に年次の1つの会議になりました。前身はTPCD（Theorem Provers in Circuit Design）で、2020年まではFMCAD Inc.が支えていました。近年は2024年Prague、2025年Menlo Park、2026年Grazと開催地が移っています。","facts":[{"label":"初回開催年","value":"1996年","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"統合前の開催地ローテーション","value":"FMCADは偶数年に米国、CHARMEは奇数年に欧州","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"前身","value":"TPCD（Theorem Provers in Circuit Design）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"旧運営","value":"2020年までFMCAD Inc.","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"2025 開催地","value":"Menlo Park, California, USA","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"2024 開催地","value":"Prague, Czechia","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"2020 開催","value":"Haifa, Israel（online）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年の本会議はTrack 1（SLab）とTrack 2（HS i9）の2トラック並行で、9月16日午後にはHardware Verificationのセッションが組まれました。招待講演はClark Barrett、Claire Xenia Wolf、Laura Kovácsの3件です。チュートリアルではTravis Hanceが「Verifying Rust code with Verus」を取り上げました。Student Forumでは学生が短い発表とポスター発表を行います。","facts":[{"label":"2026 招待講演（9/16）","value":"Clark Barrett「CSLib: Building a Platform for AI-assisted Formal Verification in Lean」","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"},{"label":"2026 招待講演（9/17）","value":"Claire Xenia Wolf（YosysHQ）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"},{"label":"2026 招待講演（9/18）","value":"Laura Kovács「The Vampire Diary」","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"},{"label":"2026 FMCAD Tutorial","value":"Travis Hance「Verifying Rust code with Verus」","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"},{"label":"2026 トラック構成","value":"Track 1（SLab）とTrack 2（HS i9）の並行","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"},{"label":"2026 Student Forum","value":"短い発表とポスター発表","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/student_forum/"},{"label":"2026 Business Meeting","value":"HS i9で開催","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/program/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生にはStudent Forumがあり、学部生・大学院生が進行中の研究を短い報告として出し、発表とポスターで意見をもらえます。応募はabstractが6月21日、報告が6月28日、通知が7月21日でした。企業の調査担当にとっては、Program ChairやPCに企業所属者が入り、Tool & Case Study papersで実務での適用報告が募集されている点が手がかりになります。proceedingsはOpen Accessなので、採択論文はTU Wien Academic Pressから無料で読めます。","facts":[{"label":"2026 Student Forum の対象","value":"学部生・大学院生","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/student_forum/"},{"label":"2026 Student Forum 締切","value":"abstract 2026-06-21 / 報告 2026-06-28 / 通知 2026-07-21","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/important_dates/"},{"label":"Tool & Case Study papers の位置づけ","value":"実務的な文脈での検証技術の設計・実装・利用の報告","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"発表義務","value":"採択論文ごとに著者1人以上が登録・発表","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はFormal Methods in Computer-Aided Designで、運営母体はFMCAD Associationです。IEEE CEDAがtechnical co-sponsorとして名を連ねます。2026年は26回目にあたり、1996年の初回以降、2006年から毎年開催されています。","facts":[{"label":"正式名称","value":"Formal Methods in Computer-Aided Design","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"運営母体","value":"FMCAD Association","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"技術協賛（2026 CFP）","value":"IEEE CEDA（technical co-sponsor）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"開催頻度","value":"年1回","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/"},{"label":"2026 回次","value":"26回目（twenty-sixth）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のProgram ChairsはAWSのBruno DutertreとTU GrazのBettina Könighoferで、Student Forum ChairsはTanja Schindler（University of Basel）とLee A. Barnett（AWS）、Publication ChairはGeorg Weissenbacher（TU Wien）です。Program CommitteeにはSynopsysやAmazon Web Servicesなど企業所属のメンバーも入っています。Steering CommitteeはClark Barrett、Armin Biere、Ruzica Piskac、Anna Slobodova、Georg Weissenbacherです。","facts":[{"label":"2026 Program Chairs","value":"Bruno Dutertre（AWS, USA）、Bettina Könighofer（TU Graz, Austria）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/committees/"},{"label":"2026 Student Forum Chairs","value":"Tanja Schindler（University of Basel）、Lee A. 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Transactions形式（letter-size、10ポイント）で、参考文献を除いて9ページ（long）か5ページ（short）を選びます。ページ上限は2月2日の告知で引き上げられ、締切は延長されました。延長後の日程は、アブストラクトが5月4日、本論文が5月11日、採否通知が7月19日、camera-readyが8月1日です。投稿はEasyChairにPDFで行います。","facts":[{"label":"2026 論文区分","value":"Regular papers / Tool & Case Study papers","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 ページ数","value":"long 9ページ / short 5ページ（参考文献除く）","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 書式","value":"IEEE Transactions format、letter-size、10ポイント","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/cfp/"},{"label":"2026 アブストラクト締切（延長後）","value":"2026-05-04","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"2026 論文締切（延長後）","value":"2026-05-11","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/"},{"label":"2026 採否通知","value":"2026-07-19","checkedAt":"2026-10-08","sourceUrl":"https://fmcad.org/FMCAD26/important_dates/"},{"label":"2026 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CMT","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"},{"label":"Young Researcher Awardの候補資格","value":"学生である筆頭著者が自ら発表すること","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"},{"label":"Young Researcher Awardの選考","value":"委員会が原稿と発表を評価、受賞者2名","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"},{"label":"表彰の場","value":"最終日のclosing session","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"}],"title":"査読と表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"1登録あたりの発表件数の上限が、SUBMISSIONページでは2件（口頭とポスター）、REGISTRATIONページでは1件と食い違っています。締切と採択通知は当初の日付と変更後の日付が同じ行に並んで表示されるため、変更後の値（論文5月7日、通知5月21日）を読み取る必要があります。採択率と査読の方式（single/double-blind）は公式サイトに記載がありません。過去回の開催地一覧と2027年の開催情報は2026年サイトに未公開です。invited講演者の所属表記「Toyora Central R&D Labs」は公式サイトの綴りのままです。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式サイトによると、AWADは1993年から日本と韓国で交互に毎年開かれてきました。2026年は韓国・釜山での開催で、シリーズ33回目にあたります。","facts":[{"label":"開始年と開催地の交代","value":"1993年から日本と韓国で交互に年1回開催","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026"},{"label":"2026 開催国","value":"韓国（Busan）","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026"}],"title":"沿革と開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryはNTT Basic Research LaboratoriesのKatsuya Oguri氏（演題はIWON Concept and Future Prospects）とSamsung ElectronicsのDaewon Ha氏（演題はFrom Scaling to Convergence）の2件でした。invited講演には、AISTのTakefumi Kamioka氏によるGAA 2nm世代のゲートスタック、Novel Crystal TechnologyのKohei Sasaki氏による酸化ガリウムのパワーデバイス、AIxtalのShota Seki氏によるProcess-Digital Twins、Seoul National UniversityのGyuweon Jung氏によるV-NANDのプログラム方式、シリコン量子ビットの高温動作の研究などがあります。ポスターはA0判です。","facts":[{"label":"2026 Plenary 1","value":"Dr. Katsuya Oguri（NTT Basic 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Invited（メモリ）","value":"Prof. Gyuweon Jung（Seoul National University）: A Slowdown-Aware Programming Scheme for Reduced Program Time in V-NAND","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/programs"},{"label":"2026 Invited（量子）","value":"Dr. Jotaro Nakane（Toyora Central R&D Labs表記）: Structural study for high-temperature operation of silicon quantum bit devices","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/programs"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生には事前USD 220の学生料金があり、学生の筆頭著者が発表するとYoung Researcher Awardの候補になります。韓国の参加者向けには、AWADがBK21 Fourの規定上の国際学会にあたると公式サイトに明記されています。企業の調査担当者にとっては、plenaryとinvitedの登壇者所属（NTT、Samsung Electronics、AIST、Novel Crystal Technology、AIxtal）から、2026年に取り上げられた技術テーマを追えます。","facts":[{"label":"韓国参加者向けの位置づけ","value":"BK21 Four規定上の国際学会","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026"},{"label":"2026 Young Researcher賞の種類","value":"Young Researcher（口頭）とYoung Researcher Poster","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"},{"label":"2026 Seniors料金の条件","value":"退職済み（常勤職なし）かつ60歳超","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/registration"}],"title":"参加者と使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"2026年の正式名称は2026 Asia-Pacific Workshop on Advanced Semiconductor Devices（AWAD 2026）です。組織団体は韓国のIEIE、日本のIEICE Electronics Society、IEEE EDS Seoul Section Chapter、Ajou UniversityのBK21プログラムの4者で、公式サイトの運営表示はco-organized by IEIEです。年次開催のワークショップで、2026年が33回目です。","facts":[{"label":"正式名称（2026）","value":"2026 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2026)","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026"},{"label":"2026 組織団体（韓国側）","value":"The Institute of Electronics and Information Engineers (IEIE), 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Univ.のSeongjae Cho氏とAISTのTakahiro Mori氏です。Program Committee ChairsにはAjou Univ.のJunseok Heo氏とToyohashi Univ. of Tech.のHiroshi Okada氏が入っています。Steering CommitteeにはSamsung Electronicsの所属者が含まれます。スポンサー欄にはSamsung Electronics、Tokyo Electron（TEL）、CMTX、Korea Business Serviceの4社が載っています。","facts":[{"label":"2026 Workshop co-Chairs","value":"Il Hwan Cho（Myongji Univ.）/ Hiroya Ikeda（Shizuoka Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/information"},{"label":"2026 Workshop vice-Chairs","value":"Seongjae Cho（Ewha Womans Univ.）/ Takahiro Mori（AIST）","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/information"},{"label":"2026 Program Committee Chairs","value":"Junseok Heo（Ajou Univ.）/ Hiroshi Okada（Toyohashi Univ. of Tech.）ほか","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/information"},{"label":"2026 Steering Committee（企業所属）","value":"Suk-Kang Sung（Samsung 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採択通知","value":"2026-05-21（当初は5月15日）","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026"},{"label":"2026 著者登録締切","value":"2026-06-10（KST）、未登録の論文はproceedingsに収録されない","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/registration"},{"label":"2026 ポスター判型","value":"A0","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/paper-submission"}],"title":"投稿と締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年のproceedingsは登録者向けにパスワード付きで公式サイトから配布され、参加費に1部が含まれます。発表論文の拡張版は、Journal of Semiconductor Technology and Science（JSTS）とIEICE Transactions on Electronicsの特集号に投稿でき、どちらも査読を経て掲載されます。締切はJSTSが2026年7月31日、IEICE Transactions on Electronicsが10月15日です。","facts":[{"label":"2026 proceedingsの公開範囲","value":"登録者のみ、パスワードが必要","checkedAt":"2026-10-08","sourceUrl":"https://sites.google.com/view/awad2026/programs"},{"label":"特集号（2026）","value":"Journal of Semiconductor Technology and Science (JSTS) / IEICE 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Mott PrizeとBryan R. 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Francisco（2018）まで3年おきに開かれた回が並びます。","facts":[{"label":"最古の掲載回","value":"Sendai（1992）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/info"},{"label":"直近の開催地","value":"Montréal（2025）、Incheon（2023）、Amsterdam（2022）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/info"},{"label":"国内開催の前例","value":"Nagano（1999）、Tokyo（2013）、Okayama（2019）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/info"},{"label":"ICM special symposiumの開催年","value":"Cairns（1997）、Recife（2000）、Rome（2003）…San Francisco（2018）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/info"}],"title":"開催の歴史","eyebrow":"history"},"program":{"id":"program","body":"2026年のPlenaryには、RIKENのRyotaro Arita、東京大学のTakasada Shibauchi、Université de SherbrookeのMaia Vergniory（カナダ）らが登壇しました。abstractの閲覧は、支払済みの登録参加者などに限られます。サテライト会合として、岡崎でのIMS Workshop on Advanced Spectroscopy on Correlated Materials 2026（9月23〜25日）と、京都大学基礎物理学研究所でのNovel Physics in Kagome Lattice Materials（10月5〜8日）がありました。","facts":[{"label":"2026 Plenary（例）","value":"Ryotaro Arita（RIKEN, Japan）\"Ab initio exploration of spin-orbit-free functional magnets\"","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/speakers"},{"label":"2026 Plenary（例）","value":"Takasada Shibauchi（The University of Tokyo）\"Thermodynamic evidence for Majorana excitations in Kitaev spin liquid materials\"","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/speakers"},{"label":"2026 Plenary（例）","value":"Maia Vergniory（Université de Sherbrooke, Canada）\"From Theory to Materials: The Search for Topological Quantum Matter\"","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/speakers"},{"label":"abstractの閲覧範囲","value":"支払済みの登録参加者などに限定","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/schedule"},{"label":"2026 Satellite Meeting（例）","value":"IMS Workshop on Advanced Spectroscopy on Correlated 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Electron Systemsで、2026年大会はSCES 2026と表記されます。日本物理学会がCo-hostで、事務局はPCO, Inc.です。","facts":[{"label":"正式名称（2026）","value":"International Conference on Strongly Correlated Electron Systems 2026（SCES 2026）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/"},{"label":"2026 共催","value":"The Physical Society of Japan（日本物理学会）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/get/f9c3033f8cff7b4691a0ff2bcd173f4e"},{"label":"公式サイトによる規模の記述","value":"凝縮系物理分野で世界的に大きな会議の1つ（one of the larger conferences）","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/"},{"label":"2026 事務局","value":"Secretariat of SCES 2026 c/o PCO, Inc.","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/"},{"label":"ICMとの関係","value":"3年に1度、International Conference on Magnetismの中のspecial 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Mott Prize、Bryan R. Coles Prize、Bernard Coqblin Prize）が授与されます。Mott Prizeは理論、Coles Prizeは実験が対象で、どちらも学位後8年以内が条件です。2026年のMott Prize受賞者はAndreas Gleis（Rutgers University, USA）、Prize Committee ChairはAndrea Bianchi（Université de Montréal, Canada）です。企業向けのsponsorship packageはDiamondの550,000円からBronzeの150,000円（税込）で、各段に展示スペースが付きます。","facts":[{"label":"International Advisory Committee（例）","value":"Los Alamos National Laboratory（USA）、MPI Dresden（Germany）など","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/commitee"},{"label":"International Program Committee（例）","value":"ISIS（United Kingdom）、Johns Hopkins University（USA）など","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/commitee"},{"label":"SCES Prizes","value":"Nevill F. Mott Prize（理論・学位後8年以内）/ Bryan R. Coles Prize（実験・学位後8年以内）/ Bernard Coqblin Prize","checkedAt":"2026-10-08","sourceUrl":"https://smartconf.jp/content/sces2026/awards2026"},{"label":"2026 Nevill F. 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Workshop）の主催・共催、第23回（2026年6月・北九州市）の会期と会場、投稿テーマと締切、発表形式、プログラム構成、2004年からの開催地を公式ページから整理しました。","oneLine":"Cat-CVD研究会は、加熱触媒体でガスを分解するCat-CVD（Hot-Wire CVD）技術について、薄膜堆積やデバイス作製を含む基礎から応用までの研究成果を報告・議論する国内の研究会です。","pageTitle":"Cat-CVD研究会とは｜触媒化学気相堆積の基礎から応用までを議論する国内研究会","relatedConferenceIds":["ald-ale","jsap-spring-autumn","icds","nano-society-annual-meeting"],"sections":{"cycle":{"id":"cycle","body":"第23回は2026年6月18日（木）午後から19日（金）午前までの1.5日構成で、会場は北九州市門司区の旧大連航路上屋2階ホールでした。会議の形態は現地参加のみと告知されています。事前参加の締切は2026年6月5日で、参加費は一般・協賛学協会員・協賛広告企業社員・学生で分かれています。","facts":[{"label":"2026 会期","value":"2026-06-18〜19（1日目午後・2日目午前）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"2026 会場","value":"旧大連航路上屋 ホール（2階） / 福岡県北九州市門司区","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free05.html"},{"label":"2026 開催形式","value":"現地参加のみ","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free02.html"},{"label":"2026 事前参加申込締切","value":"2026-06-05","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free02.html"},{"note":"協賛学協会員・協賛広告企業社員は5,000円。6月6日以降の通常参加は一般10,000円・学生3,000円。","label":"2026 事前参加費（一般 / 学生）","value":"7,000円 / 2,000円","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free02.html"},{"label":"2026 実行委員長","value":"片宗 優貴（九州工業大学）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"}],"title":"2026年の会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"対象はCat-CVD（Hot-Wire CVD）技術の基礎から応用までで、投稿フォームは6つのテーマ区分とその他を選ばせます。研究会案内は、シリコン系に加えて有機系やダイヤモンドなどのカーボン系の膜形成、ラジカルを使った表面改質やドーピングまでを応用先として挙げています。","facts":[{"label":"テーマ区分（投稿フォーム）","value":"1 ガスの分解過程、気相反応、触媒体材料 / 2 Cat-CVD、Hot-Wire装置開発 / 3 堆積膜の基礎物性および評価 / 4 ラジカル処理 / 5 デバイス応用 / 6 新分野・新展開 / 7 その他","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/entry.html"},{"label":"対象材料","value":"シリコン系、有機系、ダイヤモンドなどのカーボン系","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"膜堆積以外の対象","value":"ラジカルを用いた表面改質、ドーピング、有機薄膜の分解","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"投稿時キーワード例","value":"化学反応素過程、薄膜トランジスタ、多結晶シリコン、水素化処理、表面処理、キャリア寿命、グラフェン、集積回路など（最大6項目）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/entry.html"}],"title":"対象技術","eyebrow":"scope"},"review":{"id":"review","body":"発表形式は投稿時に口頭かポスターを申告し、主催側が変更を依頼する場合があります。2026年のプログラム委員は片宗優貴（九州工業大学）と大曲新矢（産総研 九州センター）の2名です。","facts":[{"label":"発表形式の調整","value":"希望形式（口頭/ポスター）を申告し、主催側が変更を依頼する場合あり","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/entry.html"},{"label":"2026 プログラム委員","value":"片宗 優貴（九州工業大学） / 大曲 新矢（産総研 九州センター）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年の予稿締切は、投稿案内ページが2026年5月15日、重要なお知らせページが2026年5月1日と、公式サイト内で日付が食い違っています。論文査読の有無や採択率は公式ページに記載がありません。英語版のindex.htmlは2018年のHWCVD10の案内のままです。過去の研究会一覧では、第3回は長岡技術科学大学（2006年）となっています。","facts":[{"label":"英語版トップの内容","value":"HWCVD10（2018年9月3〜6日、北九州）の案内","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/index.html"},{"label":"第3回の開催地（一覧ページ）","value":"長岡技術科学大学（2006年）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"第1回は2004年5月20〜21日に金沢市の石川県地場産業振興センターで開かれ、発起人は松村英樹氏（北陸先端科学技術大学院大学 名誉教授）です。発起人あいさつは、東京地区をほとんど会場にしない点を研究会の特徴に挙げています。2006年の第3回は長岡技術科学大学、2018年の第15回は国際会議HWCVD10と合同で北九州国際会議場、2020年の第17回はオンライン、2025年の第22回は岐阜市のじゅうろくプラザで開かれました。","facts":[{"label":"初回","value":"第1回 2004-05-20〜21 / 石川県地場産業振興センター（金沢市）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"},{"label":"発起人","value":"松村 英樹（北陸先端科学技術大学院大学 名誉教授）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"開催地の方針","value":"東京地区をほとんど開催場所とせず各地域を巡る","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"2018 第15回","value":"第15回 & HWCVD10 / 2018-09-03〜06 / 北九州国際会議場","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"},{"label":"2020 第17回","value":"2020-07-03 / オンライン開催","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"},{"label":"2025 第22回","value":"2025-06-20 / じゅうろくプラザ（岐阜市） / 実行委員長 伊藤 貴司（岐阜大学）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"}],"title":"沿革・開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年のプログラムは、招待講演3件、一般口頭講演7件（O01〜O07、オーラルセッション1〜4）、特別セッション、ポスターで構成されました。招待講演は金沢大学・株式会社Deevecの講演者によるもので、特別セッションでは依頼講演2件（Cat-CVD技術に関する国際会議の動向、Q-diaによるダイヤモンド創製）が行われました。ポスターはP01〜P23の23件です。","facts":[{"label":"2026 招待講演①","value":"中野 正浩（金沢大学）「有機太陽電池の用途開拓と社会実装に向けた研究開発」","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"2026 招待講演②","value":"栗原 香（Deevec）「HFCVD装置で作製したホウ素ドープダイヤモンド電極の電気化学センサ応用」","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"2026 招待講演③","value":"市川 公善（金沢大学）「HFCVD法を用いたダイヤモンドホモエピタキシーにおける成長モードと金属取り込みの制御」","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"2026 特別セッション（依頼講演）","value":"松村 英樹「Cat-CVD技術に関する国際会議の動向」 / 吉武 剛（九州大学）「物理気相成長法によるダイヤモンドの創製：Quenched-produced diamond（Q-dia）」","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free05.html"},{"label":"2026 ポスター件数","value":"23件（P01〜P23、奇数番・偶数番の前後半制）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free05.html"},{"label":"2026 一般口頭講演","value":"O01〜O07の7件（オーラルセッション1〜4）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free05.html"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生の発表はポスター推奨で受け付けられ、参加費にも学生区分（事前2,000円）があります。発起人あいさつは、大学・公共研究機関・企業の研究者と全国の技術者の参加を想定しています。","facts":[{"label":"想定する参加者","value":"大学研究者、公共研究機関研究者、企業研究者、全国の技術者","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"2026 学生参加費（事前）","value":"2,000円","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free02.html"},{"label":"地域産業との接点","value":"各地域で開くことで地場産業の技術者に技術を知ってもらう機会を作る","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"公式サイトの名称はCat-CVD研究会で、主催はCat-CVD研究会自身、共催に化学工学会CVD反応分科会、協賛に応用物理学会・電気学会・日本表面真空学会・高分子学会・応用物理学会原子層プロセス研究会が並びます。研究会案内は2004年から毎年開催と説明し、2026年は第23回です。","facts":[{"label":"名称","value":"Cat-CVD研究会","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"主催","value":"Cat-CVD研究会","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"共催","value":"(公社)化学工学会 CVD反応分科会","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"協賛学協会","value":"高分子学会 / 電気学会 / 日本表面真空学会 / 応用物理学会 / 応用物理学会原子層プロセス研究会","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"開催頻度","value":"2004年から毎年開催","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"},{"label":"2026 回次","value":"第23回","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free01.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年の実行委員会名簿には、アルバック、三菱電機、東京エレクトロン、パナソニック、気相成長の所属者が委員として載っています。協賛企業として気相成長、エイエルエステクノロジー、テクノリサーチ、ExtenD、コミヤマエレクトロンの5社が申込順に並びます。","facts":[{"label":"2026 実行委員（企業所属の例）","value":"株式会社アルバック / 三菱電機株式会社 / 東京エレクトロン株式会社 / パナソニック株式会社 / 気相成長株式会社","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"note":"研究会ページの協賛企業欄への掲載です。","label":"2026 協賛企業（申込順）","value":"気相成長株式会社 / 株式会社エイエルエステクノロジー / テクノリサーチ株式会社 / 株式会社ExtenD / コミヤマエレクトロン株式会社","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"2026 広告掲載料","value":"A4全ページ5万円 / A4半ページ3万円（バナー広告1年掲載の特典付き）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free08.html"},{"label":"所在国","value":"2026年の会場・委員所属はいずれも日本","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free05.html"}],"title":"運営体制・参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"発起人あいさつは、Cat-CVD法をプラズマを使わずに原料ガスを加熱触媒体で接触分解する薄膜堆積法として、PECVD法と対比して説明しています。関連の国際学会としては公式の関連リンクにICANS、PVSEC、ICDS、IDW、AMFPD、SSDMが並びます。","facts":[{"label":"PECVDとの違い（発起人あいさつ）","value":"原料ガスを加熱触媒体との接触分解で分解し、プラズマを使用しない","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/research.html"},{"label":"関連の国際学会（公式リンク）","value":"ICANS28 / PVSEC-29 / ICDS30 / IDW'19 / AMFPD-19 / ssdm2019","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free06.html"},{"label":"国際会議との接点","value":"2018年は国際会議HWCVD10と合同開催","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/free07.html"}],"title":"近い会議との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は公式サイトの投稿フォームから、配布テンプレートで作った講演概要をPDFで提出する方式です。一般の発表は口頭のみで、学生にはポスター発表が推奨されています（口頭も可）。締切後は修正できず、締切前ならログイン画面から上書きで差し替えられます。","facts":[{"label":"投稿物","value":"講演概要（PDF、配布テンプレート使用）","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/entry.html"},{"label":"2026 投稿フォーム記載の締切","value":"2026-05-15","checkedAt":"2026-10-08","sourceUrl":"https://www.cat-cvd.jp/entry.html"},{"note":"投稿案内ページの日付（5月15日）と異なります。","label":"2026 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Lawrence Convention Center(1000 Fort Duquesne Blvd. Pittsburgh, PA 15222)で開催されます。展示会はその中の11月10日から12日に開かれ、授賞式は11月9日18:30から Ballroom BC で行われます。会期は AVS 72 公式トップページの Key Dates ブロックには載っておらず、Greetings ページ本文と AVS 本体の Meetings & Exhibits ページに記載されています。","question":"2026年の AVS はいつ、どこで開催されますか。","sourceUrls":["https://avs72.avs.org/greetings/","https://avs72.avs.org/housing-travel/","https://avs72.avs.org/vendor-exhibit/","https://avs72.avs.org/awards-ceremony/","https://avs.org/meetings-exhibits/"]},{"answer":"2026年の抄録締切は May 18, 2026 です。締切後は Late-Breaking Abstracts の枠があり、September 14, 2026(Abstract Submission ページの STEP 5 では 11:59 p.m. ET と表記)まで受け付けられます。採否とスケジュールの通知は late September に送られると案内されています。","question":"投稿の締切はいつですか。締切後に出す方法はありますか。","sourceUrls":["https://avs72.avs.org/","https://avs72.avs.org/abstract-submission/"]},{"answer":"抄録の査読方式や審査観点を説明した記載は公式ページに見当たりません。公式が明記しているのは、Program Committee が投稿内容をもとに最終セッションを構成すること、採否・スケジュールの通知が9月下旬に送られることです。採択率も投稿件数も公表されていません。シンポジウム後に任意で投稿するジャーナル原稿については「Your article/letter will be peer-reviewed rigorously」と記載されています。","question":"査読はありますか。採択率は公表されていますか。","sourceUrls":["https://avs72.avs.org/abstract-submission/","https://avs72.avs.org/manuscripts/"]},{"answer":"予稿集(proceedings)としての論文集は発行されません。発表者は JVST A、JVST B、Biointerphases、SSS、AQS のいずれかに原稿を投稿でき、JVST A・JVST B・Biointerphases・AQS が AVS 72 の発表を含む Special Topic Collections を設けています。掲載された原稿は article / letter として扱われ、公式ページには「it will NOT be designated as a proceedings paper.」と明記されています。原稿は「at any time」投稿できると案内されており、Special Topic Collection への締切日は掲載されていません。長さの制限も設けられていません。","question":"発表した内容はどこに載りますか。予稿集は出ますか。","sourceUrls":["https://avs72.avs.org/manuscripts/"]},{"answer":"口頭(contributed 15分 / invited 30分)とポスターが用意され、1名につき口頭1件とポスター1件まで、内容の異なる抄録であれば発表できます。抄録は「2,700 characters max., including grammar and spacing」で、任意で1ページのPDF(グラフ・図表)を添付できます。投稿先は Abstract Submission ページの Topics 一覧から1つを選ぶ形式で、同ページ本文では Divisions / Focus Topics / Mini-Symposia の区分けは行われていません。投稿は avsconferences.org から行い、copyright agreement への同意が手順に含まれます。","question":"投稿できる区分と分量を教えてください。","sourceUrls":["https://avs72.avs.org/abstract-submission/"]},{"answer":"2026年の通し登録は Regular Platinum Member $915.00、Regular Platinum Member Plus $1050.00、Regular Non-Member が early $1145.00・late $1265.00 です。学生は Student Platinum Member $310.00、Student Platinum Member Plus $350.00、Student Non-Member が early $415.00・late $465.00。One Day は early $500.00・late $630.00、Two Day は early $905.00・late $1050.00、Exhibits Only は $0.00 です。early は 8/3/26 – 10/5/26、late は 10/6/26 – 11/13/26 と表記されています。Wednesday Tutorials は $10.00〜$25.00 で別料金です。","question":"参加費はいくらですか。","sourceUrls":["https://avs72.avs.org/register/"]},{"answer":"Committee ページには大学、国立研究所、企業の担当者がトピック別に並び、Program Vice-Chair は Tokyo Electron America, Inc. の Angélique Raley です。日本の所属としては Kenji Ishikawa(Nagoya University, Japan)が Plasma Science & Technology の topic co-chair に、plenary speaker には Tokyo Electron Limited の Dr. Akihisa (Aki) Sekiguchi が掲載されています。これらは公式プログラムに印字された所属機関の所在地であり、個人の国籍を示すものではありません。","question":"誰が発表していますか。日本からの参加はありますか。","sourceUrls":["https://avs72.avs.org/committee/","https://avs72.avs.org/greetings/"]},{"answer":"hybrid や online 参加の可否を示す記載は、Housing & Travel、Registration、Vendor Exhibit のいずれのページにも確認できません。2026年の参加登録者数、投稿件数、確定した出展社数も公表されていません。公式サイトに出てくる数量表現は年次の記載を伴わない定型文で、AVS 72 公式トップページの「over 200 participating companies」は AVS 71 公式トップページにも同一文で掲載され、AVS Events Calendar の「More than 3,000 scientists and engineers gather from around the world to attend.」は AVS 72nd と AVS 73rd の両エントリに同じ文として置かれています。いずれも特定年の実績値としては読めません。","question":"オンライン参加はできますか。参加者数はどのくらいですか。","sourceUrls":["https://avs72.avs.org/housing-travel/","https://avs72.avs.org/register/","https://avs72.avs.org/vendor-exhibit/","https://avs72.avs.org/","https://avs.org/about-avs/events-calendar/event-list-view/"]},{"answer":"AVS の Short Course Schedule には、AVS 72 Short Course Program として Fundamentals of Vacuum Technology が In-Person / Pittsburgh, PA / November 9-12, 2026 で掲載されています。講師名と受講料は同ページに記載がなく、Short Course Catalog と Short Course Instructors へのリンクが案内されています。シンポジウム内の Wednesday Tutorials は登録時に追加でき、Regular Platinum/Platinum Plus $20.00、Student Platinum/Platinum Plus $10.00、Regular Non-Member $25.00、Student Non-Member $15.00 です。","question":"short course や tutorial は受けられますか。","sourceUrls":["https://avs.org/education/short-courses/short-course-schedule/","https://avs72.avs.org/register/"]}],"headline":"第72回(2026年)は11月8〜13日にピッツバーグの David L. Lawrence Convention Center で開催され、抄録締切・Late News締切・トピック一覧・原稿投稿先が公式サイトに掲出されています。","metaDescription":"AVS 72nd International Symposium & Exhibition の会期・会場、抄録締切とLate News、トピック構成、原稿のジャーナル投稿先、登録費、committee構成を公式ページの記載に沿ってまとめた調査ページです。","oneLine":"AVS International Symposium & Exhibition は、真空・表面・界面・薄膜の科学技術を軸に、プラズマプロセス、EUVリソグラフィ、先端パッケージ、量子科学までをトピック単位で扱う年次シンポジウムです。","pageTitle":"AVSとは:真空・表面・薄膜からEUV・先端パッケージまで扱う年次国際シンポジウム","relatedConferenceIds":["icmctf","ald-ale","isss-surface-science","jvss-annual-meeting","gaseous-electronics-conference","mrs-fall-meeting"],"sections":{"cycle":{"id":"cycle","body":"会期と会場は Greetings ページの本文と AVS 本体の Meetings & Exhibits ページに記載され、AVS 72 公式トップページの掲出は Key Dates(締切一覧)と Future Meeting Dates(次回以降)が中心です。展示会と授賞式の日時は会期内の特定日に固定されているため、出張日程を組む際はこの2つを起点にできます。次サイクルの AVS 73 は会期と都市まで公表済みで、AVS 74 は TBA です。","facts":[{"note":"Greetings ページ本文に「scheduled to be held at the David L. Lawrence Convention Center in Pittsburgh, PA, November 8-13, 2026.」と記載。","label":"2026 会期","value":"November 8-13, 2026","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/greetings/"},{"note":"Housing & Travel ページの Conference Venue に会場名と住所が記載されている。国は United States。","label":"2026 会場と住所","value":"David L. Lawrence Convention Center / 1000 Fort Duquesne Blvd. Pittsburgh, PA 15222","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/housing-travel/"},{"note":"Housing & Travel ページのホテル表。HOUSING OPENS: AUGUST 3, 2026、HOUSING DEADLINE: SEPTEMBER 30, 2026 と記載。公式の housing provider は Maritz。","label":"2026 公式ホテル","value":"Westin Pittsburgh(1000 Penn Ave / 1 Blocks / $249.00)/ Omni William Penn Hotel(530 William Penn Place / 4 Blocks / $239.00)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/housing-travel/"},{"note":"Vendor Exhibit ページの Exhibit Days/Hours。","label":"2026 展示会の開催時間","value":"Tuesday, November 10 – 10:00 a.m.-5:00 p.m. / Wednesday, November 11 – 10:00 a.m. – 4:30 p.m. / Thursday, November 12 – 10:00 a.m. – 2:30 p.m.","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/vendor-exhibit/"},{"note":"Awards Ceremony ページに日時と部屋名が記載されている。","label":"2026 授賞式","value":"Monday, November 9, 2026, @ 6:30 PM / David L. Lawrence Convention Center / Ballroom BC","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/awards-ceremony/"},{"note":"公式トップページの Key Dates ブロックに掲出。","label":"2026 宿泊・登録の期限","value":"Hotel Deadline: September 30, 2026 / Early Registration Deadline: October 5, 2026","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"公式トップページの Future Meeting Dates ブロックに掲出。同ブロックには AVS 74 (2028): TBA も並記されている。","label":"2027 次サイクル","value":"AVS 73 (2027): October 24-29, 2027 / Portland, Oregon","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"同ブロックの会議名はロゴ画像で示され、テキストとして記載されているのは日付と都市のみ。リンク先は avs72.avs.org。","label":"会期の別掲出先","value":"AVS 本体の Meetings & Exhibits ページの Featured AVS Events に「November 8-13, 2026 / PIttsburgh, PA」が掲出される(ページ上の綴りは PIttsburgh)","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/meetings-exhibits/"}],"title":"2026年サイクル(第72回)の会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"抄録投稿ページは投稿先を1本のフラットな Topics 一覧として示し、Divisions / Focus Topics / Mini-Symposia といった区分けは公式トップページのナビゲーションの側に置かれています。半導体プロセス寄りの読者が追う対象は PS(プラズマ)、EUV、PK(先端パッケージ)、AP(Atomic Scale Processing)、AM(先端マイクロエレクトロニクス材料・デバイス)、TF(薄膜)に集中します。分野横断の会議のため、バイオ界面やアクチノイドなど半導体以外のトピックも同じ週に並走します。","facts":[{"note":"Abstract Submission ページは投稿先を「Topics」という単一の見出しの下にフラットに並べており、同ページ本文では Divisions / Focus Topics / Mini-Symposia の区分けは行われていない。各トピックの下にセッション記号入りの個別セッション名が続く。","label":"2026 抄録投稿ページのトピック一覧","value":"2D Materials (2D) / Actinides and Rare Earths (AC) / Advanced Microelectronic Materials and Devices (AM) / Advanced Packaging (PK) / Advanced Surface Engineering (SE) / Advances in Battery Engineering, Interface Design, and Characterization (BT) / Advances in EUV Lithography (EUV) / AI/ML for Scientific Discovery (AIML) / Applied Surface Science (AS) / Atomic Scale Processing (AP) / AVS Quantum Science Workshop (AQS) / Biomaterial Interfaces (BI) / Biomaterial Plenary (BP) / Chemical Analysis and Imaging of Interfaces (CA) / Electronic Materials and Photonics (EM) / From Ionic Crystals to Ionic Conductivity: A Special Celebration of Gary W. Rubloff's 50+ Years in Science (GWR) / Light Sources Sciences (LS) / Magnetic Interfaces and Nanostructures (MI) / Manufacturing Science and Technology (MS) / Materials and Innovations for Fusion Energy (FUS) / Multifunctional and Hybrid Microsystems (MC) / Nanoscale Science and Technology (NS) / Nanoscale Science and Technology Plenary (NSP) / Plasma Science & Technology (PS) / Quantum Science and Technology (QS) / Spectroscopic Ellipsometry (EL) / Surface Science (SS) / The Future of Temperature Sensing (TS) / Thin Films (TF) / Undergraduate Posters (UN) / Vacuum Technology (VT)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"公式トップページの Technical Program ナビゲーションに置かれた3つの見出しの内訳。Divisions と Groups は同じ見出しの下にまとめられており、どれが Division でどれが Group かの内訳は同ページに示されていない。Greetings ページは全体を「over 25 AVS Divisions, Technical Groups, Focus Topics, and Mini-Symposia」と説明している。","label":"2026 公式サイトのトラック区分","value":"Divisions & Groups: 2D Materials (2D) / Advanced Surface Engineering (SE) / Applied Surface Science (AS) / Biomaterial Interfaces (BI) / Electronic Materials and Photonics (EM) / Magnetic Interfaces and Nanostructures (MI) / Manufacturing Science and Technology (MS) / Nanoscale Science and Technology (NS) / Plasma Science & Technology (PS) / Spectroscopic Ellipsometry (EL) / Surface Science (SS) / Thin Film (TF) / Vacuum Technology (VT)。Focus Topics: Actinides and Rare Earths (AC) / Advanced Packaging (PK) / Advances in EUV Lithography (EUV) / AI/ML Autonomous Experimentation for Thin Films Processing (AIML) / Chemical Analysis and Imaging of Interfaces (CA) / Light Sources Enabled Science (LS) / Materials and Innovations for Fusion Energy (FUS) / Multifunctional and Hybrid Microsystems (MC) / Quantum Science & Technology (QS) / The Future of Temperature Sensing (TS)。Mini-Symposia: Advanced Microelectronic Materials and Devices (AM) / Atomic Scale Processing (AP) / Advances in Battery Engineering, Interface Design, and Characterization (BT)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"Focus Topic EUV ページの説明文。High NA EUV、photoresist platforms、underlayer materials への言及がある。","label":"2026 EUV Focus Topic のスコープ","value":"「recent developments, opportunities, and challenges in EUV technology, as well as emerging patterning technologies, related metrology, and the environmental impact of lithography」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/focus-topic-euv/"},{"note":"Focus Topic PK ページの説明文。chiplet ベースの手法や packaging 能力の reshoring に言及がある。","label":"2026 Advanced Packaging Focus Topic のスコープ","value":"「Advanced Packaging focuses on trends and initiatives shaping Advanced Packaging, the back-end portion of the semiconductor industry.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/focus-topic-pk/"},{"note":"Division PS ページの説明文。続けて atomic-scale processing、advanced packaging、AI/ML、patterning、isotropic etch などが関心領域として挙げられている。","label":"2026 Plasma Science & Technology Division のスコープ","value":"「The Plasma Science & Technology Division (PSTD) program highlights the latest advances in plasma science, ranging from fundamental studies of plasma physics and chemistry to plasma-matter interactions and new applications for etch processing.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/division-ps/"},{"note":"Division PS ページに掲載されたセッションタイトル。ポスターセッション(PS-ThP: Plasma Science and Technology Poster Session)も設定されている。","label":"2026 PS Division のセッション例","value":"PS+AP-MoM: Plasma Processes for Advanced Interconnects / PS1・PS2-TuM: High Aspect Ratio and Cryogenic Etching I・II / PS2+EUV-TuA: Plasma Processes for Feature Scaling / PS1-WeM: Plasmas for 3D Integration / PS2-WeM: Plasma Applications in Packaging and Wafer Bonding / PS1-WeA: Machine Learning for Plasma Processes / PS2-WeA: Low Global Warming Potential and Sustainability in Plasma Processing / PS1・PS2-ThM: Advanced Ion and Reactant Control I・II / PS-ThA: Simulation for Plasma Processes","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/division-ps/"},{"note":"Program Chair インタビュー本文。長年の分野として Plasma Science、Thin Films、Surface Science、2D Materials、Atomic Scale Processing、Biomaterials、Quantum Sciences も併記されている。主催者側の説明であり、第三者による評価ではない。","label":"2026 に強調される新規トピック(Program Chair の説明)","value":"「EUV Lithography, Advanced Packaging, Materials and Innovations for Fusion Energy, AI and Autonomous Experimentation for Thin Film Processing, and the Future of Temperature Sensing」を「really exciting new topics that we are highlighting this year」として挙げる","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/meet-mark-losego-the-avs-72-program-chair/"},{"note":"Greetings ページの記載をそのまま引用。第三者評価ではなく主催者自身の表現。","label":"公式が用いる会議の位置づけ表現","value":"「The AVS Symposium is the premier venue for presenting and discussing interdisciplinary science and technology related to materials, processing, surfaces, interfaces, and devices」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/greetings/"}],"title":"対象技術領域とトピック構成","eyebrow":"scope"},"review":{"id":"review","body":"抄録の採否そのものについて、査読方式や審査観点を説明した記載は公式ページに見当たりません。公式が明記しているのは、Program Committee が投稿内容をもとに最終セッションを構成することと、採否・スケジュールの通知が9月下旬に送られることです。厳密な peer review は、シンポジウム後に任意で投稿する原稿の側に適用されます。","facts":[{"note":"Abstract Submission ページ Step 2 の記載。","label":"2026 抄録の取り扱い主体","value":"「Note that the Program Committee will build the final sessions based on submissions during program development.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"Abstract Submission ページには、抄録の査読者・審査基準・double-blind 等の方式に関する記載がない。同ページで review という語が使われるのは投稿手順の確認を指す文脈のみ。","label":"2026 抄録の査読方式","value":"公表されていない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"公式トップページに採択率・投稿件数の記載がない。Abstract Submission ページにも同様の記載はない。","label":"2026 採択率","value":"公表されていない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"Manuscripts ページの記載。シンポジウム発表を踏まえたジャーナル原稿に対する査読を指す。","label":"原稿の査読","value":"「Your article/letter will be peer-reviewed rigorously and, if accepted, will be published quickly online.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"Manuscripts ページの記載。","label":"proceedings 扱いの否定","value":"「Your article/letter will get either an article or letter designation on online databases such as ISI; it will NOT be designated as a proceedings paper.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"}],"title":"審査の仕組みと公表状況","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトが公表していないのは、抄録の査読方式・審査基準・採択率、2026年の投稿件数と参加登録者数の実数、確定した出展社数とブース数、オンライン参加の可否、Special Topic Collection への原稿締切日、short course の講師名と受講料、Awards Ceremony で授与される賞の一覧と選考基準です。「over 200 participating companies」と「More than 3,000 scientists and engineers」は年次の記載を伴わない定型文で、AVS 71 サイトや翌年の AVS 73 エントリにも同一文が使われているため、2026年の実績値としては読めません。会期も AVS 72 公式トップページの Key Dates ブロックには含まれず、Greetings ページ本文と AVS 本体の Meetings & Exhibits ページに記載されています。同じトピックが公式内で別名で表記される箇所もあるため、コード(2文字〜4文字の略号)で照合するのが確実です。","facts":[{"note":"AVS 72 の会期は Greetings ページ本文に記載されている。","label":"会期記載の所在","value":"公式トップページの掲出は Key Dates ブロック(Major Awards / Student Awards / Abstract Submission / Late News Abstract Submission / Hotel / Early Registration の各締切)と Future Meeting Dates ブロック(AVS 73 (2027): October 24-29, 2027 Portland, Oregon / AVS 74 (2028): TBA)で、AVS 72 の会期はこの2ブロックに含まれない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"同じ略号 AIML が指すトピックだが、ページによって名称が異なる。LS も Abstract Submission ページは「Light Sources Sciences (LS)」、トップページのナビゲーションは「Light Sources Enabled Science (LS)」と表記が分かれる。照合は略号で行うのが確実。","label":"同一トピックの名称ゆれ","value":"AIML は Abstract Submission ページで「AI/ML for Scientific Discovery (AIML)」、公式トップページのナビゲーションと Committee ページで「AI/ML Autonomous Experimentation for Thin Films Processing (AIML)」と表記される","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"Housing & Travel ページ、Registration ページ、Vendor Exhibit ページのいずれにもオンライン参加区分の記載がなく、Registration ページの料金表も現地参加の区分のみで構成されている。","label":"開催形式の記載","value":"現地開催の会場・展示時間・ホテルは公表されているが、hybrid や online 参加の可否を示す記載は確認できない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/housing-travel/"},{"note":"Abstract Submission ページには Topics の一覧と各トピックのセッション名が示されるのみで、除外領域の記載がない。各トピックの Areas of Interest は投稿システム上のポップアップとして提供されると案内されている。","label":"対象外領域の明示","value":"投稿対象外の技術領域を明示した記載は確認できない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"回次を含む正式表記「AVS 72nd International Symposium & Exhibition」は Greetings ページや Registration ページの本文に現れる。Sponsors ページでは「The AVS 72nd Symposium」と表記される。","label":"略称の揺れ","value":"公式トップページは見出しで「AVS72」「#AVS72」、本文で「The AVS International Symposium and Exhibition」、ナビゲーションで「AVS 72」を併用する","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"同ページ本文は「AVS 2026 Awardees」へのリンクを示すにとどまる。","label":"授賞内容の記載","value":"Awards Ceremony ページには日時と会場のみが掲載され、授与される賞の一覧と選考基準は同ページに記載がない","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/awards-ceremony/"}],"title":"未公開項目と読み違えやすい点","eyebrow":"caveats"},"history":{"id":"history","body":"AVS History ページは、1953年の発起集会から団体名の変更、部会の設立年、ジャーナル創刊までを年単位で記述しています。第1回シンポジウムは1954年で、以後の回次はここを起点に数えられます。直近のサイクルはいずれも米国内で開催地を移しており、2025年はシャーロット、2026年はピッツバーグ、2027年はポートランドです。","facts":[{"note":"AVS History ページの記述。「Six days later, the Committee on Vacuum Techniques was formally organized」と続く。","label":"発端","value":"「On June 18, 1953, fifty-six people from diverse technical backgrounds, gathered in New York City to consider the need for a forum to discuss problems and applications of high vacuum technology.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"},{"note":"AVS History ページの記述。1954年が初回開催年にあたる。","label":"初回シンポジウム","value":"「The first symposium was held June 16-18, 1954 and attracted 295 registrants from several countries.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"},{"note":"AVS History ページの記述。「A revised Constitution and By-Laws was adopted in 1961」も同ページに記載されている。現在の公式サイトでは About AVS ページを含め AVS の略称表記が用いられている。","label":"名称変更","value":"「At the 1957 Symposium, the membership changed the name of the group to the American Vacuum Society, Inc.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"},{"note":"AVS History ページに設立順で列挙されている。Technical Groups は1994年に設けられ、2D Materials は2022年と記載されている。","label":"部会の設立年","value":"Vacuum Metallurgy(1961年、最初の Division。1999年に Advanced Surface Engineering となる)、Thin Films(1964年)、Surface Science(1968年)、Vacuum Technology(1970年)","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"},{"note":"AVS History ページの記述。","label":"AIP との関係","value":"「The Society became an affiliate member of the American Institute of Physics (AIP) in 1963 and was elected a full member in 1976.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"},{"note":"AVS 71 の Greetings ページの記載。2025年は9月開催で、2026年の11月開催と時期が異なる。同ページの Program Vice-Chair は Mark Losego(Georgia Tech)。","label":"2025 サイクル(第71回)","value":"「scheduled to be held at the Charlotte Convention Center in Charlotte, NC, USA, from September 21-26, 2025」/ Program Chair: Stephanie Law(Pennsylvania State University)/ plenary speaker: Prof. Michael Manfra(Purdue University)","checkedAt":"2026-08-06","sourceUrl":"https://avs71.avs.org/greetings/"},{"note":"Events Calendar の List View に掲載された各エントリの Location。いずれも米国内。同ページは開始日時のみを表示する形式で、2025年サイクルのエントリは掲載されていない。","label":"開催地の推移(2026→2027)","value":"AVS 72nd International Symposium & Exhibition: Pittsburgh, Pennsylvania / AVS 73rd International Symposium & Exhibition: Portland, Oregon","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"},{"note":"AVS History ページ AIP Affiliation の記述。","label":"事務所","value":"2007年に 125 Maiden Lane の15階にスペースを購入し、2008年7月に AVS オフィスが移転","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/history/"}],"title":"沿革と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"Greetings ページによれば、月曜朝8時30分の Plenary Session から始まり、金曜正午まで9並列の口頭セッションが走ります。日曜には Quantum Sciences・Biomaterials Interfaces・Nanoscale Science and Technology の workshop と plenary、水曜夜に Tutorials、木曜夜に Poster Session が置かれます。技術プログラムは Online Scheduler とモバイルアプリで参照します。展示会は登録者以外も無料の事前登録で入場できるため、聴講と機材調査を分けて動けます。","facts":[{"note":"Greetings ページに plenary speaker として紹介され、SEMI の Board of Industry Leaders と CTO Forum に在籍すること、半導体技術ロードマップと AI・量子計算・先端CMOSロジック開発に触れることが記載されている。公式トップページの Plenary Speaker 欄では所属が「Senior Vice President & General Manager, U.S. R&D, Tokyo Electron America, Inc.」と別表記になっている。","label":"2026 plenary speaker","value":"Dr. Akihisa (Aki) Sekiguchi, Fellow of Tokyo Electron Limited's Corporate Innovation Division","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/greetings/"},{"note":"公式トップページの Technical Program ナビゲーション内「Special Sessions & Events」の項目一覧。Science Educators Workhop はサイト上の表記のまま。","label":"2026 特別セッション・併催プログラム","value":"5K Run / AVS Publications Author & Reviewer Appreciation / Career Center & Job Fair / Plenary Lecture / Special Symposium: A Celebration of Gary W. Rubloff's 50+ Years in Science (GWR) / AVS Quantum Science Workshop / Biomaterials Plenary (BP) / Exhibitor Technology Spotlight (EW) / Nanoscale Science and Technology Plenary (NSP) / Science Educators Workhop / Tutorials / Undergraduate Posters (UN)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"公式トップページのナビゲーション表記。Committee ページでは「FROM IONIC CRYSTALS TO IONIC CONDUCTIVITY: AN ICONIC CELEBRATION OF GARY W. RUBLOFF'S 50+ YEARS IN SCIENCE (GWR)」として5名の topic co-chair が置かれ、Abstract Submission ページでは「A Special Celebration of ...」と表記される。","label":"2026 記念シンポジウム","value":"Special Symposium: A Celebration of Gary W. Rubloff's 50+ Years in Science (GWR)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"AVS Short Course Schedule ページに掲載。講師名と受講料は同ページに記載がなく、Short Course Catalog と Short Course Instructors へのリンクが案内されている。","label":"2026 short course","value":"AVS 72 Short Course Program: Fundamentals of Vacuum Technology / Platform: In-Person / Pittsburgh, PA / November 9-12, 2026","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/education/short-courses/short-course-schedule/"},{"note":"Registration ページの料金表。early(8/3/26 – 10/5/26)と late(10/6/26 – 11/13/26)で同額。","label":"2026 tutorial の受講料","value":"Wednesday Tutorials: Regular Platinum/Platinum Plus $20.00 / Student Platinum/Platinum Plus $10.00 / Regular Non-Member $25.00 / Student Non-Member $15.00","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/register/"},{"note":"Vendor Exhibit ページの記載。Registration ページの料金表でも Exhibits Only は early / late とも $0.00。","label":"2026 展示への入場","value":"「All AVS 72 registrants are invited to attend Tuesday-Thursday.」に加え、consultants, engineers, biologists, chemists, physicists, purchasing professionals, scientists, students, technicians, exhibitor staff は「welcome to pre-register for the AVS Exhibition for FREE」と案内される","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/vendor-exhibit/"},{"note":"同ページの見出しは Online Scheduler(URL は online-desktop-planner)。ログインには registration/confirmation ID number と姓を用いると案内されている。完成版プログラムの公開日は同ページに記載がない。Abstract Book (PDF) と Technical Program (PDF) はサイトの Technical Program ナビゲーションに置かれている。","label":"2026 プログラムの参照手段","value":"「The Online Scheduler allows you to build your schedule and sync it to the Mobile App.」/ ONLINE SCHEDULER・MOBILE APP・TECHNICAL PROGRAM の3つの導線が置かれる","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/online-desktop-planner/"}],"title":"プログラムの骨格と併催イベント","eyebrow":"program"},"audience":{"id":"audience","body":"学生向けには学部生ポスターセッションと学生表彰、学生料金が用意され、指導教員は5月の抄録締切と学生表彰締切を同じ日で管理できます。企業の調査担当は、展示のみ無料登録と Exhibitor Technology Spotlight を使えば、装置・材料側の動向だけを短時間で回れます。日本からの参加は現地渡航が前提で、費用の見積りは登録費に加えて Wednesday Tutorials や short course の受講料を別立てで計算します。","facts":[{"note":"Committee ページに Undergraduate Poster Session の chair 一覧が掲載されている。co-chair は Liney Arnadottir、Ashleigh Baber、Joshua Blechle、Erin Iski。","label":"2026 学生向け枠","value":"UNDERGRADUATE POSTER SESSION (UN) が設定され、Topic Chair: Morgan Hawker(California State University, Fresno)ほか4名の Topic Co-Chair が置かれる","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/committee/"},{"note":"Registration ページの料金表。early は 8/3/26 – 10/5/26、late は 10/6/26 – 11/13/26。Platinum 系は early / late とも同額。","label":"2026 学生の登録費","value":"Student Platinum Member $310.00 / Student Platinum Member Plus $350.00 / Student Non-Member $415.00(early)・$465.00(late)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/register/"},{"note":"Registration ページの料金表。Honorary or Emeritus は $0.00。5K Run は Registrant $30.00(early)・$45.00(late)で別枠。","label":"2026 一般の登録費","value":"Regular Platinum Member $915.00 / Regular Platinum Member Plus $1050.00 / Regular Non-Member $1145.00(early)・$1265.00(late)/ One Day $500.00(early)・$630.00(late)/ Two Day $905.00(early)・$1050.00(late)/ Exhibits Only $0.00","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/register/"},{"note":"公式トップページの Technical Program ナビゲーション内「Special Sessions & Events」の項目。AVS Events Calendar の共通説明文にも Career Workshop と Job Center への言及がある。","label":"2026 就職・採用関連","value":"Career Center & Job Fair、Exhibitor Technology Spotlight (EW) がプログラム項目として掲載","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"Vendor Exhibit ページの記載。出展は展示の事実を示すもので、顧客関係や売上を示すものではない。","label":"2026 展示で扱われる対象","value":"「The Exhibit comprises an extensive display of tools, equipment, and services for Surface Science; Biomaterial Interfaces; Electronic Materials & Photonics; Magnetic Interfaces; Manufacturing Science; MEMS/NEMS; Nanoscience; Thin Film; Plasma Science; Vacuum Technology and professional literature, educational material, career services and publications from numerous publishers.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/vendor-exhibit/"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"会議名は回次を含む形で表記され、2026年の開催は AVS 72nd International Symposium & Exhibition です。AVS 自身は About AVS ページで 501(c)(3) の非営利科学団体として自己紹介し、同ページには共催団体の記載がなく、American Institute of Physics の member society であることが併記されています。技術部会は Technical Divisions と Technical Groups に分かれており、シンポジウムのトピック構成もこの部会構成を反映しています。","facts":[{"note":"About AVS ページの Upcoming Events 一覧に「11/08/2026 ... AVS 72nd International Symposium & Exhibition」としてこの表記が掲出されている。","label":"2026 正式名称","value":"AVS 72nd International Symposium & Exhibition","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/"},{"note":"専用サイト avs72.avs.org のページ見出し(AVS72 / #AVS72)およびナビゲーション(Promote AVS 72、Meet Mark Losego – AVS 72 Program Chair 等)で用いられる表記。","label":"2026 略称・サイト表記","value":"AVS 72","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"About AVS ページ冒頭の記載。同ページに共催・技術協賛団体の記載はなく、末尾に「AVS is a member society of the American Institute of Physics」とある。","label":"主催団体の法人格","value":"「AVS is a not-for-profit 501(c)(3) scientific association established for the purpose of providing services, disseminating information, and providing support to the scientific community-at-large.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/"},{"note":"AVS トップページの Member-Driven Professional Society のブロックに記載。同一の数値は About AVS ページにも掲載されている。","label":"会員規模","value":"「AVS is committed to diversity and inclusiveness and is comprised of approximately 4,500 members worldwide.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/"},{"note":"About AVS ページの一覧。Regional Chapters、International Affiliates、Student Chapters も同ページに並記されている。学会の部会構成であり、シンポジウムのトピック区分とは一致しない。","label":"技術部会の構成","value":"AVS Divisions 10件(Advanced Surface Engineering / Applied Surface Science / Biomaterial Interfaces / Electronic Materials/Photonics / Magnetic Interfaces & Nanostructures / Nanoscale Science & Technology / Plasma Science & Technology / Surface Science / Thin Film Division / Vacuum Technology)と AVS Technical Groups 3件(2D Materials / Manufacturing Science & Technology / Spectroscopic Ellipsometry)","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/"},{"note":"Events Calendar の List View は各イベントの開始日時のみを表示する形式で、終了日は掲載されていない。","label":"開催頻度と回次","value":"年1回。AVS 72nd(2026年11月8日開始)と AVS 73rd(2027年10月24日開始)が公式イベントカレンダーに別項目として掲載されている","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"}],"title":"正式名称と主催","eyebrow":"identity"},"community":{"id":"community","body":"Program Chair は大学、Program Vice-Chair は装置メーカーの所属で、トピック単位の chair にも産業側の担当者が並びます。国立研究所の比率が高く、米国外の大学・研究機関も topic chair に入っています。スポンサーページはロゴ画像だけを掲出し、社名をテキストで示していません。掲載は協賛・出展の事実を示すもので、取引関係・採用・共同研究を示すものではありません。","facts":[{"note":"Committee ページの先頭に記載。Greetings ページの署名欄では Raley の所属が TEL Technology Center, America LLC と表記される。","label":"2026 Program Chair / Vice-Chair","value":"PROGRAM CHAIR: Mark Losego, Georgia Tech / PROGRAM VICE-CHAIR: Angélique Raley, Tokyo Electron America, Inc.","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/committee/"},{"note":"Committee ページのトピック別一覧に Topic Chair / Topic Co-Chair として所属とともに掲載。committee 就任であり、所属企業と AVS の取引関係を示すものではない。","label":"2026 産業側の topic chair 例","value":"John Arnold(IBM Research Division, Albany, NY / PS)、Kenji Ishikawa(Nagoya University, Japan / PS)、Lior Huli(TEL Technology Center America / EUV)、James Papanu(TEL / PK)、Bart DeProspo(SARAS Micro Devices / PK)、John Lannon(Micross / PK)、G. Andrew Antonelli(Femtometrix / EL)、Samantha G. Rosenberg(Kairos Power / AS)、Eric Dombrowski(Commonwealth Fusion Systems / FUS)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/committee/"},{"note":"Committee ページで Topic Chair / Topic Co-Chair の所属として記載されている研究機関。","label":"2026 国立研究所所属の topic chair 例","value":"Argonne National Lab、Sandia National Laboratories、Oak Ridge National Laboratory、Lawrence Berkeley National Laboratory、NIST、Naval Research Laboratory、Brookhaven National Laboratory、Ames Laboratory","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/committee/"},{"note":"Committee ページに国名まで併記されている chair 級の所属。ほかに Charles University, Prague(AC)、Eindhoven University of Technology, Netherlands(BT)、Tyndall National Institute, Univ. College Cork, Ireland(AIML)、Technical University of Vienna, Austria(BP)も topic co-chair として掲載されている。所属機関の所在地であり個人の国籍ではない。","label":"2026 米国外の所属が明記された topic chair","value":"Cristina Satriano(University of Catania, Italy / 2D)、Freek Molkenboer(TNO Science and Industry, the Netherlands / VT)、Kenji Ishikawa(Nagoya University, Japan / PS)、Junjie Zhao(Zhejiang University, China / TF)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/committee/"},{"note":"Sponsors & Exhibitors ページは枠の見出しとロゴ画像のみを掲出しており、社名はテキストとして記載されていない(画像の alt 属性はいずれも「Logo Image」)。Bronze 枠は既定のプレースホルダ画像が2点置かれている。掲載は協賛の事実を示すもので、取引・採用・共同研究を示すものではない。","label":"2026 スポンサー枠の構成","value":"Platinum Sponsors / Gold Sponsors / Silver Sponsors / Bronze Sponsors / Media Sponsors の5枠。各枠にロゴ画像が並ぶ","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/sponsors-exhibitors/"},{"note":"AVS 72 公式トップページの Exhibit @ AVS72 ブロックの記載。同一の一文は AVS 71 公式トップページにも掲載されており、特定年の確定値である旨の注記はない。Vendor Exhibit ページにはブース数・出展社数の記載がなく、問い合わせ先として exhibits@avs.org が案内されている。","label":"展示規模の記載(年次を伴わない定型文)","value":"「The AVS International Symposium and Exhibition is one of the largest in the world and provides an excellent opportunity for AVS attendees and members to view the latest and greatest cutting-edge products and services offered by over 200 participating companies」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"AVS Events Calendar の AVS 72nd と AVS 73rd の両エントリに同一の説明文として掲載されている定型文で、特定年の実績値である旨の注記はない。AVS 72 公式サイト側には2026年の参加登録者数の記載がない。","label":"参加者規模の記載(年次を伴わない定型文)","value":"「More than 3,000 scientists and engineers gather from around the world to attend.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"},{"note":"Awards Ceremony ページのサイドバー Contact に記載。AVS 72 サイトの全ページに同じ連絡先が置かれている。","label":"運営事務局","value":"Conference Administrator: Yvonne Towse / 125 Maiden Lane; Suite 15B, New York, N.Y. 10038 / yvonne@avs.org","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/awards-ceremony/"}],"title":"committee構成と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"AVS は年次シンポジウムのほかに、テーマを絞った国際会議を別会期で運営しています。ALD/ALE と ICMCTF は成膜・コーティングに特化した単一テーマの会議で、年次シンポジウムは複数のトピックを並列に走らせる横断型です。同じ主催団体でも投稿先と時期が異なるため、狙う会議を先に決めてから締切を追う運用になります。","facts":[{"note":"Events Calendar の List View に掲載。AVS 72 とは会期・開催地とも別。","label":"ALD/ALE 2027 の会期","value":"「The conference will take place Sunday, June 20 - Wednesday, June 23, 2027, in Dresden, Germany.」(ALD/ALE 2027: AVS 27th International Conference on Atomic Layer Deposition (ALD 2027) featuring the 14th International Atomic Layer Etching Workshop (ALE 2027))","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"},{"note":"Events Calendar の List View に掲載。同ページは各イベントの開始日時のみを表示する形式で、終了日は掲載されていない。","label":"ICMCTF の会期","value":"ICMCTF'27 - International Conference On Metallurgical Coatings & Thin Films: 2027年4月25日開始 / Town and Country Hotel, San Diego, CA","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"},{"note":"Events Calendar の List View の記載。PEC 2026 のみ本文に会期の終わりが書かれており、他の2件は開始日時のみが掲載されている。","label":"その他の AVS 系会議","value":"Physical Electronics Conference (PEC 2026): 「begin on the evening of August 18 and conclude on the morning of August 21, 2026」/ UC - San Diego, La Jolla, California, USA。52nd International Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-52 2027): 2027年1月17日開始 / Salt Lake City, Utah。International Conference on Secondary Ion Mass Spectrometry (SIMS 2028): 2028年9月17日開始 / Montreal, Canada OR Monterey, California","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"},{"note":"Events Calendar の AVS 72nd / AVS 73rd の両エントリに置かれた共通の説明文。単一テーマの AVS 系会議と異なり、technical divisions と technology groups の発表を1週間に集約する形式であることが示されている。","label":"年次シンポジウムの位置づけ","value":"「The Symposium is a week long forum for science and technology exchange featuring papers from technical divisions and technology groups, and topical conferences on emerging technologies.」","checkedAt":"2026-08-06","sourceUrl":"https://avs.org/about-avs/events-calendar/event-list-view/"}],"title":"AVS が主催する他会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は抄録のみで、フルペーパーの提出は求められません。抄録は2,700文字以内のテキストで、任意で1ページのPDFを添付できます。通常締切を過ぎた後も Late-Breaking Abstracts の枠が9月まで開いており、直前の結果を出す経路が残されています。","facts":[{"note":"Abstract Submission ページの Abstract Submission Guidelines 冒頭の記載。同ページのトピック一覧に各トピックのポスターセッションが並記されている。","label":"2026 発表区分と持ち時間","value":"「Contributed oral presentations are 15 minutes, and invited talks are 30 minutes.」/ 多くのトピックで poster session も設定","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"Abstract Submission ページのポリシー記載。Step 1 にも「presenters are limited to one oral and one poster presentation」とある。","label":"2026 発表本数の上限","value":"「A presenter may present ONE ORAL AND ONE POSTER at the Symposium」(「Note: they must be different abstracts」)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"Abstract Submission ページの Step 3。「you may also submit a supplemental 1-page PDF file containing any graphs, charts, or pictures you wish to include」と続く。","label":"2026 抄録の文字数上限","value":"「abstract 2,700 characters max., including grammar and spacing」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"公式トップページの Key Dates ブロックに掲出。Abstract Submission ページのサイドバーにも同一日付が掲出されている。","label":"2026 抄録締切","value":"Abstract Submission Deadline: May 18, 2026","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"},{"note":"Abstract Submission ページ冒頭の告知。本文にも「Submissions will remain open until September 14.」とある。","label":"2026 Late News 締切","value":"「Call for Late-Breaking Abstracts Submit Your Abstract Now Through: September 14, 2026」(STEP 5 に「Due by 11:59 p.m. ET」)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"Abstract Submission ページの Author Notification。具体的な日付は示されていない。","label":"2026 採否通知の時期","value":"「Acknowledgment that your abstract has been submitted will follow by email shortly after submission, with official acceptance/scheduling emails to be sent by late September.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"投稿手順として Step 1〜5 が示され、セッショントピックと Areas of Interest の確認、oral / poster の選択、抄録本文と著者情報の入力、copyright agreement への同意、送信の順が案内されている。問い合わせ先は yvonne@avs.org。","label":"2026 投稿システム","value":"avsconferences.org(Abstract Submission ページ STEP 5 の「Submit by September 14」ボタンのリンク先)","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/abstract-submission/"},{"note":"公式トップページの Key Dates ブロックに抄録締切と並んで掲出されている。","label":"2026 表彰関連の締切","value":"Major Awards Deadline: March 31, 2026 / Student Awards Deadline: May 18, 2026","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"この会議は論文集(proceedings)を発行せず、発表者が任意で AVS 系ジャーナルに原稿を投稿する形式です。投稿時に AVS 72 の Special Topic Collection を選択でき、通常の投稿論文として査読を受けます。引用可能な業績にする場合は、抄録の採択とは別にジャーナル投稿の手続きが必要です。","facts":[{"note":"Manuscripts ページの記載。SSS は Surface Science Spectra(spectral data records)、AQS は AVS Quantum Science(articles)と同ページで説明されている。","label":"2026 原稿の投稿先ジャーナル","value":"「You can choose either JVST A, JVST B, Biointerphases, SSS, or AQS depending on the topic.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"Manuscripts ページの記載。「Just choose the Special Topic Collection during submission to have your paper included.」と続く。","label":"2026 Special Topic Collection","value":"「JVST A, JVST B, Biointerphases, and AQS are hosting Special Topic Collections including papers presented at AVS 72.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"Manuscripts ページに「published quickly online」「Articles are fully citable as soon as they are published online.」と記載。","label":"掲載形態","value":"査読通過後は article / letter として速やかにオンライン公開され、公開時点で引用可能","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"Manuscripts ページの記載。","label":"原稿の長さ制限","value":"「There are no length limitations. Your manuscript can be as long as it needs to be to convey your ideas and results in the most succinct way.」","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"Manuscripts ページの記載。同ページに掲載されている日付はサイドバーの Key Dates(抄録締切 May 18, 2026 と Late News 締切 September 14, 2026)のみで、Special Topic Collection への原稿締切日の記載はない。問い合わせ先は publications@avs.org。","label":"原稿投稿の締切","value":"締切日は示されず、「You can submit to the journals based on your talk at the AVS 72nd International Symposium at any time.」と案内される","checkedAt":"2026-08-06","sourceUrl":"https://avs72.avs.org/manuscripts/"},{"note":"AVS History ページの Publications の記述。Biointerphases は「launched in 2006 as an open access journal」と記載されている。","label":"ジャーナルの沿革","value":"Journal of Vacuum Science and Technology は1965年に第1巻が刊行され、1983年に A(Vacuum, Surfaces and Films)と B(Microelectronics, Processing and Phenomena)に分割。Surface Science Spectra は1992年、Biointerphases 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Program geography uses first-listed author first affiliation organization location only.","history":{"note":"The official AAU WiPDA-Europe 2026 page identifies the 2026 event as the 3rd bi-annual IEEE WiPDA-Europe workshop. The firstHeldYear is an approximate biennial edition backcast: 2026 - 4 = 2022.","ageYears":4,"sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452","approximate":true,"displayLabel":"Official 2026 page identifies the 3rd bi-annual WiPDA-Europe workshop","sourceStatus":"extractor_v0_source_checked","firstHeldYear":2022,"historyYearBasis":"official_3rd_biannual_backcast","comparisonMaxYears":90},"organizationMix":[{"note":"Rows use named General Chair, Co-Chairs, Technical Program Chair, and Technical Program Co-Chairs from the official 2026 CFP. The AAU event page lists committee roles but not names.","label":"WiPDA-Europe 2026 CFP chair affiliation organization rows","segments":[{"kind":"university","label":"University","value":100}],"sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf#chairs","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"6 official CFP chair affiliation organization rows"},{"note":"Rows count the first-listed author and first affiliation organization for the 15 oral paper rows in the official 2024 programme PDF. Poster-paper affiliations were not visible in the reviewed extracted text.","label":"WiPDA-Europe 2024 oral paper first-listed author affiliation organization rows","segments":[{"kind":"university","label":"University","value":86.7},{"kind":"company","label":"Company","value":6.7},{"kind":"research","label":"Research institute","value":6.7}],"sourceUrl":"https://wipda-europe.org/wp-content/uploads/2024/09/IEEE-WiPDA-Europe-2024-Programme_final.pdf#oral-paper-program","sourceStatus":"extractor_v0_source_checked_previous_full_program_cycle","denominatorLabel":"15 official oral paper first-listed author first-affiliation organization rows"},{"note":"Rows use the current official AAU page fact-box entries for Financial sponsor and Technical Sponsors. The sponsor donut and full sponsor list use the same rows.","label":"WiPDA-Europe 2026 official financial / technical sponsor listing mix","segments":[{"kind":"university","label":"Academic institution","value":66.7},{"kind":"professional-society","label":"Professional society","value":33.3}],"sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452#financial-technical-sponsors","sourceStatus":"extractor_v0_source_checked_current_partial","denominatorLabel":"3 official financial / technical sponsor listing rows"}],"companyBreakdowns":[{"note":"Company rows are official CFP chair source rows, not de-duplicated headcount. All reviewed 2026 chair rows are Aalborg University affiliation rows.","rows":[],"label":"WiPDA-Europe 2026 CFP chair company rows","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf#chairs","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"0 company rows / 6 official chair rows"},{"note":"Company rows are official oral-paper first-listed author first-affiliation organization rows.","rows":[{"rows":1,"company":"Wise-integration","percentage":6.7}],"label":"WiPDA-Europe 2024 oral paper company rows","sourceUrl":"https://wipda-europe.org/wp-content/uploads/2024/09/IEEE-WiPDA-Europe-2024-Programme_final.pdf#oral-paper-program","sourceStatus":"extractor_v0_source_checked_previous_full_program_cycle","denominatorLabel":"1 company rows / 15 official oral paper rows"}],"countryBreakdowns":[{"note":"Country/region rows are based only on the first-listed author first affiliation organization in the official 2024 programme.","rows":[{"rows":8,"country":"United Kingdom","percentage":53.3},{"rows":3,"country":"Germany","percentage":20},{"rows":1,"country":"China","percentage":6.7},{"rows":1,"country":"France","percentage":6.7},{"rows":1,"country":"Italy","percentage":6.7},{"rows":1,"country":"Nigeria","percentage":6.7}],"label":"WiPDA-Europe 2024 oral paper first-listed author affiliation organization countries / regions","sourceUrl":"https://wipda-europe.org/wp-content/uploads/2024/09/IEEE-WiPDA-Europe-2024-Programme_final.pdf#oral-paper-program","sourceStatus":"extractor_v0_source_checked_previous_full_program_cycle","denominatorLabel":"15 official oral paper first-listed author first-affiliation organization rows"}],"sponsorOrganizations":{"note":"Rows list official financial sponsor and technical sponsor entries from the AAU WiPDA-Europe 2026 page. The page separately says the broader sponsor/exhibitor list will be updated; rows are not revenue, customer, procurement, or research-collaboration evidence.","rows":[{"role":"financial-sponsor","tier":"financial-sponsor","organization":"IEEE Power Electronics Society","organizationType":"professional_society"},{"role":"technical-sponsor","tier":"technical-sponsor","organization":"AAU Energy","organizationType":"academic_institution"},{"role":"technical-sponsor","tier":"technical-sponsor","organization":"AAU Innovate","organizationType":"academic_institution"}],"label":"WiPDA-Europe 2026 official financial / technical sponsor listing","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452#financial-technical-sponsors","sourceStatus":"extractor_v0_source_checked_current_partial","denominatorLabel":"3 official sponsor listing rows"}},"city":"Aalborg","tier":"b","venue":"AAU Innovate, Aalborg University","country":"Denmark","fieldId":"power-wide-bandgap","editions":[],"genreIds":["wbg"],"processes":[{"id":"prc_83a12f2dc5ae48119dbc0120455efdc3","nameJa":"デバイス・製品開発","primary":true},{"id":"prc_91e17c1371f94cb382c44b36289412e4","nameJa":"後工程","primary":false}],"cycleLabel":"2026-09-20〜22 / AAU Innovate, Aalborg University, Aalborg, Denmark","fieldTitle":"パワー半導体 / Wide-Bandgap","organizers":[{"id":"org_50f5b5eea5ac4ee59bf57f34c82e448b","name":"Aalborg University"}],"lastVerified":"2026-10-22","digestDeadline":"2026-05-18","currentCycleEnd":"2026-09-22","acceptanceNotice":"2026-07-01","peerReviewStatus":"peer-reviewed","currentCycleStart":"2026-09-20","finalPaperDeadline":"2026-08-01","canonicalId":"conf_9b49ebef3b894a7fb5e2204c7791d614","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[{"name":"AAU Energy","note":"Official technical sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"technical_sponsor","tier":"technical-sponsor","company":null,"checkedAt":"2026-06-17","commonKey":"ix-ff1555baef","eventYear":2026,"sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452","commonKind":"institution","commonName":"Aalborg University","sourceLabel":"WiPDA-Europe 2026 official page","organizationUrl":null,"organizationSlug":"aau-energy","organizationType":"academic_institution","companyLinkStatus":"non_company","companyLinkConfidence":null,"displayName":"Aalborg University","canonicalName":"Aalborg University","canonicalOrganizationSlug":"ix-ff1555baef","canonicalCompanyId":null},{"name":"AAU Innovate","note":"Official technical sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"technical_sponsor","tier":"technical-sponsor","company":null,"checkedAt":"2026-06-17","commonKey":"ix-ff1555baef","eventYear":2026,"sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452","commonKind":"institution","commonName":"Aalborg University","sourceLabel":"WiPDA-Europe 2026 official page","organizationUrl":null,"organizationSlug":"aau-innovate","organizationType":"academic_institution","companyLinkStatus":"non_company","companyLinkConfidence":null,"displayName":"Aalborg University","canonicalName":"Aalborg University","canonicalOrganizationSlug":"ix-ff1555baef","canonicalCompanyId":null},{"name":"IEEE Power Electronics Society","note":"Official sponsor or partner listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":"financial-sponsor","company":null,"checkedAt":"2026-06-17","commonKey":"ix-6ed7f72324","eventYear":2026,"sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452","commonKind":"institution","commonName":"IEEE Power Electronics Society","sourceLabel":"WiPDA-Europe 2026 official page","organizationUrl":"https://www.ieee-pels.org/","organizationSlug":"ieee-power-electronics-society","organizationType":"professional_society","companyLinkStatus":"non_company","companyLinkConfidence":null,"displayName":"IEEE Power Electronics Society","canonicalName":"IEEE Power Electronics Society","canonicalOrganizationSlug":"ix-6ed7f72324","canonicalCompanyId":null}],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"wipda-europe","confidenceScore":0.858,"coverage":{"faqCount":5,"factCount":31,"topicCount":3,"sourceCount":2,"sectionCount":11,"sectionTotal":12,"droppedFactCount":23,"missingSectionIds":["comparison"],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"ワイドバンドギャップのパワーデバイスとその応用を対象に、半導体の専門家、デバイス研究者、回路設計者、応用技術者が集まる2年ごとのIEEEワークショップです。","question":"WiPDA-Europeはどんな会議ですか？","sourceUrls":["https://www.energy.aau.dk/wipda-europe-2026-e156452","https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"]},{"answer":"2026年9月20〜22日に、デンマークAalborgのAAU Innovate（Aalborg University）で開かれました。","question":"WiPDA-Europe 2026はいつ、どこで開かれましたか？","sourceUrls":["https://www.energy.aau.dk/wipda-europe-2026-e156452"]},{"answer":"最初に著者名と所属を伏せた4ページ以内のdigestを投稿し、採択後に最終論文を提出します。","question":"何を投稿しますか？","sourceUrls":["https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf","https://www.energy.aau.dk/wipda-europe-2026-e156452"]},{"answer":"digestはすべてdouble-blind査読を受けます。書式要件を満たさないdigestは査読なしで不採択になります。","question":"査読はどう行われますか？","sourceUrls":["https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"]},{"answer":"2026年のGeneral ChairはAalborg UniversityのStig Munk-Nielsen、Technical Program ChairはHongbo Zhaoで、CFPに載る委員はAalborg Universityの所属です。","question":"運営はどこが担っていますか？","sourceUrls":["https://www.energy.aau.dk/wipda-europe-2026-e156452","https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"]}],"headline":"第3回のWiPDA-Europe 2026は、2026年9月20〜22日にデンマークAalborgのAAU Innovate（Aalborg University）で開かれました。","metaDescription":"WiPDA-Europe（IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe）の2026年Aalborg会期、digest投稿とdouble-blind査読、CFPの締切、募集トピック、運営体制を公式ページから整理しました。","oneLine":"WiPDA-Europeは、ワイドバンドギャップのパワーデバイスとその応用を扱う、半導体専門家、デバイス研究者、回路設計者、応用技術者のための欧州のIEEEワークショップです。","pageTitle":"WiPDA-Europeとは｜ワイドバンドギャップ・パワーデバイスと応用の欧州IEEEワークショップ","relatedConferenceIds":["wipda","icscrm","ispsd","pcim","apec","ecce"],"sections":{"cycle":{"id":"cycle","body":"2026年は9月20〜22日の3日間、デンマークAalborgのAAU Innovate（Thomas Manns Vej 25）で開かれました。開催形式は現地開催（On location）で、使用言語は英語です。","facts":[{"label":"2026 会期・都市","value":"2026-09-20〜22 / Aalborg, Denmark","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 会場","value":"AAU Innovate, Aalborg University（Thomas Manns Vej 25, 9220 Aalborg）","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 開催形式","value":"現地開催（On location）、使用言語は英語","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"CFPのトピックには、Heteroepitaxial and Bulk Materials Growth、Packaging Power Modules and ICs、Ultra-Wide Bandgap Devices and Applicationsが並びます。応用分野には再生可能エネルギー・蓄電、輸送、産業用ドライブ、系統、宇宙・航空が挙がっています。","facts":[{"label":"2026 対象材料","value":"SiC、GaN、ultra-wide bandgap","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 トピック（材料）","value":"Heteroepitaxial and Bulk Materials Growth","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 トピック（実装）","value":"Packaging Power Modules and ICs","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 トピック（応用）","value":"再生可能エネルギー・蓄電、輸送、産業用ドライブ、系統、宇宙・航空","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 トピック（UWBG）","value":"Ultra-Wide Bandgap Devices and Applications","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"digestはすべてdouble-blind査読を受けます。digestには問題設定、主な結果、先行研究と比べた貢献を書き、著者名と所属は入れません。要件を満たさないdigestは査読なしで不採択になります。","facts":[{"label":"査読方式（2026 CFP）","value":"double-blind","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"digest に求める内容","value":"問題設定、主な結果、先行研究と比べた貢献","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"匿名化","value":"著者名・所属を書かない","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"書式違反の扱い","value":"査読なしで不採択","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"査読","eyebrow":"review"},"caveats":{"id":"caveats","body":"CFP PDFの日程（abstract 5月18日、通知7月1日、最終論文8月1日）は当初のものです。公式ページは会期を「September 20th to 22th」と表記しています。","facts":[{"label":"2026 スポンサー・出展者リスト","value":"随時更新と表示","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 当初の通知日（CFP PDF）","value":"2026-07-01","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"2026年のCFPは、この回を第3回、2年ごとの開催と書いています。2026年はデンマークAalborgで開かれました。","facts":[{"label":"2026 回次","value":"第3回（third）","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のCFPは、technical sessions、special sessions、tutorials、keynotes、産業界と研究機関のリーダーによるround-table discussions、expositionを掲げています。","facts":[{"label":"2026 CFP の構成","value":"technical sessions、special sessions、tutorials、keynotes、round-table discussions、exposition","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"CFPは対象者として、半導体の専門家、デバイス研究者、回路設計者、応用技術者を挙げています。参加区分はIEEE Member、Non-IEEE Member、PhD Student、Tutorialに分かれています。","facts":[{"label":"想定参加者（2026 CFP）","value":"半導体専門家、デバイス研究者、回路設計者、応用技術者","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 参加区分（CFP）","value":"IEEE Member / Non-IEEE Member / PhD Student / Tutorial","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はIEEE Workshop on Wide Bandgap Power Devices and Applications in Europeで、略称はWiPDA-Europeです。2026年は第3回で、公式ページは2年ごとの開催（Bi-annual）と書いています。CFPの表記は「The 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications - Europe」です。","facts":[{"label":"正式名称・回次（2026）","value":"3rd IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe（WiPDA-Europe 2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"開催頻度","value":"2年ごと（Bi-annual）","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 財政スポンサー","value":"IEEE PELS（Power Electronics Society）","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 技術スポンサー","value":"AAU Energy、AAU Innovate","checkedAt":"2026-10-08","sourceUrl":"https://www.energy.aau.dk/wipda-europe-2026-e156452"},{"label":"2026 CFP の表記","value":"The 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications - Europe","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のCFPに載る委員はAalborg University所属です。General ChairはStig Munk-Nielsen、Co-ChairはHuai WangとFrede Blaabjerg、Technical Program ChairはHongbo Zhao、Sponsor & Exhibition ChairはPooya Davariです。","facts":[{"label":"2026 General Chair","value":"Stig Munk-Nielsen（Aalborg University）","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 Co-Chair","value":"Huai Wang、Frede Blaabjerg（Aalborg University）","checkedAt":"2026-10-08","sourceUrl":"https://www.aaudxp-cms.aau.dk/media/zxnicll2/wipda-europe-2026-call-for-papers.pdf"},{"label":"2026 Technical Program Chair","value":"Hongbo Zhao（Aalborg 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Joint、Kansai、Fukuoka、Shikokuの各Chapter、福岡大学、徳島大学です。福岡観光コンベンションビューローと福岡市の支援も明記されています。","facts":[{"label":"正式名称・位置付け","value":"IEEE Asia Pacific Conference on Circuits and Systems / IEEE CASS の Region 10 における regional flagship conference","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/"},{"label":"2026 主催（Organizers）","value":"IEEE Circuits and Systems Society、同 Japan Joint Chapter、Kansai Chapter、Fukuoka Chapter、Shikoku Chapter、Fukuoka University、Tokushima University","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=129"},{"label":"2026 Supported by","value":"Fukuoka Convention & Visitors Bureau","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=129"},{"label":"2026 助成","value":"福岡市と福岡観光コンベンションビューローの助成","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=287"},{"label":"2026 テーマ","value":"Towards Creative-AI from 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産業界講演者","value":"Special Sessionへの産業界講演者の参加を強く奨励","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=256"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"通常論文は最大5頁（技術内容4頁＋参考文献のみの任意の5頁目）のIEEE 2段組A4 PDFです。論文締切は4月30日、5月15日を経て最終的に2026年5月22日へ延長され、採否通知も7月3日から7月15日へ更新されました。camera-readyは7月31日、著者登録は8月4日が期限でした。Special Sessionは4〜5本の論文で構成する提案方式です。","facts":[{"label":"2026 頁数","value":"最大5頁（技術内容4頁＋参考文献のみの任意の5頁目）","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=198"},{"label":"2026 書式","value":"IEEE conference template、A4、2段組、PDFのみ、5.0 MBまで、IEEE PDF eXpress（Conference ID 64421X）でXplore準拠を確認","checkedAt":"2026-10-08","sourceUrl":"https://apccas2026.org/?page_id=198"},{"note":"旧締切4月30日、5月15日から延長。Regular、Special、Live-Demo、Embedded Workshopsが対象。","label":"2026 論文投稿締切（最終延長後）","value":"2026年5月22日","checkedAt":"2026-10-14","sourceUrl":"https://apccas2026.org/?page_id=107"},{"note":"旧表示2026年7月3日から更新。","label":"2026 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China で開催されます。公式表記は「The 44th IEEE International Conference on Computer Design (ICCD 2026)」で、第44回にあたります。会場名と住所は Conference Venue ページが Coming Soon 表記のままで、2026-08-05 時点では未公開です。","question":"ICCD 2026 はいつ・どこで開催されますか。","sourceUrls":["https://www.iccd-conf.com/2026/home.html","https://www.iccd-conf.com/2026/venue.html"]},{"answer":"abstract 登録が June 03, 2026 23:59 AOE、full paper 提出が June 10, 2026 23:59 AOE で、いずれも「strict final extension」として当初日程（May 15 / May 22）が取り消し線付きで残されたうえに掲載されています。採否通知は August 20, 2026、camera-ready は September 17, 2026 です。special session 提案は July 2nd, 2026 11:59PM (AoE)、tutorial 提案は July 4, 2026 11:59PM (AoE) が締切でした。","question":"2026年の投稿締切はいつでしたか。","sourceUrls":["https://www.iccd-conf.com/2026/Call_for_papers.html","https://www.iccd-conf.com/2026/Call_for_special_sessions.html","https://www.iccd-conf.com/2026/Call_for_tutorials.html"]},{"answer":"double-blind の査読があり、投稿時に著者を特定できる情報を除去することが求められます。評価は「suitability for the conference, originality and technical soundness」の観点で行われ、program committee の判断で 8 ページ論文を 4 ページの short paper として採択する場合があります。short paper は初回投稿の区分としては受け付けられません。","question":"査読はありますか。どのような方式ですか。","sourceUrls":["https://www.iccd-conf.com/2026/Call_for_papers.html"]},{"answer":"Call for Papers ページに投稿数・採択数・採択率の数値は掲載されていません。査読体制については、6トラックそれぞれに Track Chair 2名を置き、トラック単位で Program Committee の Members 名簿を公開している点までが公表範囲です。","question":"採択率は公表されていますか。","sourceUrls":["https://www.iccd-conf.com/2026/Call_for_papers.html","https://www.iccd-conf.com/2026/Program_Committee.html"]},{"answer":"2026年の Organizing Committee は香港・中国本土の大学が中核で、Program Chairs は Nanyang Technological University（Singapore）と Tufts University（USA）の所属です。Organizing Committee には Panel Chairs の一人として Huawei Inc. 所属の Xuanqi Chen が、Steering Committee には Axion（Korea）所属の Kee Sup Kim が掲載されています。2025年の agenda では Synopsys・NVIDIA・AMD 所属の登壇者による keynote が3件掲載されており、大学と企業の双方から登壇があります。所属の掲載は登壇・委員就任の事実を示すもので、取引関係を示すものではありません。","question":"どのような人が発表する会議ですか。","sourceUrls":["https://www.iccd-conf.com/2026/Organizing_Committee.html","https://www.iccd-conf.com/2026/Steering_Committee1.html","https://www.iccd-conf.com/agenda.html"]},{"answer":"採択論文は ICCD の proceedings に収録されます。収録条件として「著者のいずれか1名が現地で発表すること」が Call for Papers に明記されています。過去回の proceedings は Past Conferences ページから各年の IEEE Xplore 収録ページにリンクされており、1988年から2025年までの回が並びます。ジャーナル特集号への招待制度や best paper award についての記述は掲載されていません。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://www.iccd-conf.com/2026/Call_for_papers.html","https://www.iccd-conf.com/2026/ICCD_Previous_Editions.html"]},{"answer":"2026年の Conference Registration ページは「Coming Soon」表記のみで、参加費の金額・区分（IEEE会員／非会員／学生）・早期登録の締切とも未公開です。渡航手配を伴う予算取りでは、会期（11月16-18日）と開催地（Hong Kong SAR, China）だけを先に確定させ、登録費は公開後に差し替える形になります。","question":"参加費はいくらですか。","sourceUrls":["https://www.iccd-conf.com/2026/Conference_Registration.html","https://www.iccd-conf.com/2026/home.html"]},{"answer":"投稿と提案の締切は AOE（Anywhere on Earth、UTC−12）で示されており、Call for Papers は「June 03, 2026 23:59 AOE」「June 10, 2026 23:59 AOE」、special session と tutorial の提案は「11:59PM (AoE)」の表記です。AOE は UTC−12 なので、23:59 AOE は日本時間（UTC+9）では表示日付の翌日20時59分にあたります。書式は IEEE conference paper guidelines に従い、Letter ページサイズと 10-pt フォントサイズが指定されています。投稿は EasyChair（https://easychair.org/conferences/?conf=iccd2026）で受け付けられ、日本語での投稿や日本語セッションについての記述は掲載されていません。","question":"日本から参加・投稿する場合に注意する点はありますか。","sourceUrls":["https://www.iccd-conf.com/2026/Call_for_papers.html","https://www.iccd-conf.com/2026/Call_for_special_sessions.html","https://www.iccd-conf.com/2026/Call_for_tutorials.html"]}],"headline":"公式サイトの Call for Papers・Organizing Committee・Past Conferences など15ページに、DBLP と IEEE Computer Society のページを加えた17件を直接読み、ICCD 2026 サイクルで確認できる事項と未公開の事項を分けて記載します。","metaDescription":"ICCD（IEEE International Conference on Computer Design）の公式情報を一次ソースで確認。2026年は第44回、11月16-18日に Hong Kong SAR, China で開催。6トラック構成、double-blind査読、8ページ上限、camera-ready期日までを整理しました。","oneLine":"ICCD（IEEE International Conference on Computer Design）は、computer systems とその構成要素の research・design・implementation を対象とする IEEE の年次国際会議で、2026年は第44回として11月16-18日に Hong Kong SAR, China で開催されます。","pageTitle":"ICCDとは｜IEEE International Conference on Computer Design の2026年会期と投稿締切","relatedConferenceIds":["iccad","dac","islped","isvlsi","glsvlsi","codes-isss"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルは会期と都市が確定していますが、会場ページと参加登録ページはいずれも Coming Soon 表記のままです。渡航手配を伴う社内稟議を通す場合は、会期と都市だけを先に押さえ、会場・費用は追って公開を待つ運用になります。proceedings 収録には現地での対面発表が条件として明記されているため、オンライン登壇で代替する前提は立てられません。","facts":[{"note":"2026年トップページのヘッダに印字","label":"2026 会期","value":"November 16–18, 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Test, Verification, and Security","checkedAt":"2026-08-05","sourceUrl":"https://www.computer.org/conferences/cfp/ICCD2020"},{"note":"2024年サイクルのトップページに掲げられたテーマ。2026年トップページに同種のテーマ表記は掲載なし","label":"2024 サイクルのテーマ表記","value":"「Large Language Models and Generative AI: Applications, Methods, and Architectures」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2024/Home.html"},{"note":"採否観点として suitability for the conference が挙げられるにとどまる","label":"対象外領域の明示","value":"Call for Papers に対象外（out of scope）の明示的な記述は掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"}],"title":"対象領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"ICCD は double-blind 査読で、投稿時に著者を特定できる情報を除去することが求められます。採否は会議への適合性・独創性・技術的健全性の3観点で評価され、program committee の判断で 8 ページ論文を 4 ページの short paper として採択する余地が残されています。short paper は初回投稿の区分としては受け付けられないため、最初から短報を狙う投稿設計は取れません。","facts":[{"note":"Call for Papers の投稿要件","label":"2026 査読方式","value":"「Submissions are double-blind; all information identifying authors should be removed.」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"Call for Papers の評価基準","label":"2026 審査観点","value":"「All papers will be evaluated with regard to their suitability for the conference, originality and technical soundness.」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"初回投稿は8ページ論文として提出し、短報化は program committee の裁量","label":"2026 short paper の扱い","value":"「The program committee reserves the right to accept a submission as a short 4 pages paper. Please note that short papers are not accepted during the initial submission phase.」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"Track 1 CompSys / Track 2 SwArch / Track 3 HwArch / Track 4 TVS / Track 5 EDA / Track 6 LCD の順で掲載","label":"2026 トラック別 Program Committee","value":"6トラックそれぞれに Track Chair 2名が置かれ、トラック単位で Members の名簿が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Program_Committee.html"},{"note":"Program Committee ページの Track 5: Electronic Design Automation (EDA) 欄","label":"2026 EDA トラックチェア","value":"Diana Goehringer（TU Dresden, Germany）/ Yuzhe Ma（The Hong Kong University of Science and Technology (Guangzhou), China）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Program_Committee.html"},{"note":"Program Committee ページの Track 4: Test, Verification, and Security (TVS) 欄","label":"2026 TVS トラックチェア","value":"Xiaolong Guo（Kansas State University, USA）/ Yangdi Lyu（The Hong Kong University of Science and Technology (Guangzhou), China）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Program_Committee.html"},{"note":"2026-08-05 時点で同ページに採択率の数値表記を確認できず","label":"採択率","value":"投稿数・採択数・採択率は Call for Papers ページに掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"}],"title":"査読方式と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトは年次ディレクトリ（/2026/、/2025/）とルート直下のページが併存しており、URL に年が入っていないページは旧サイクルの内容を返します。引用時は必ず年次ディレクトリ付きの URL を使い、ルート直下のページは年次を確認してから扱ってください。2026年トップページの「Sponsored by:」欄は4件を略称のまま並べるだけで、正式名称への展開も「host」という語も掲載がないため、本ページでもホスト機関という表現は使っていません。2026-08-05 時点で公式サイトが公開していないのは、会場名と住所、参加費の金額・区分・早期登録の締切、投稿数／採択数／採択率、初回開催年（第1回の年）、各過去回の回次番号、各トラック配下の詳細トピック（Call for Papers 本文は別 PDF を参照する案内にとどまる）、ジャーナル特集号への招待制度、best paper award の有無、camera-ready を提出しなかった場合の扱い、hybrid / online 参加の可否、Student Forum の募集要項、企業スポンサー・出展社の一覧、参加者数、2027年サイクルの会期・開催地です。これらは本ページでも値を置かず、未公開である旨のみを記載しています。本ページは他学会との優劣評価やランキング、投稿数・採択数の推計、掲載企業の取引関係の推定は扱いません。","facts":[{"note":"2026年サイクルの Call for Papers は /2026/ 配下にある。URL に年が入っていないページは年次を確認してから引用する必要がある","label":"サイト構成による年度混在","value":"ルート直下の https://www.iccd-conf.com/Call_for_papers.html は ICCD 2025（第43回・Dallas, USA）のヘッダと Important Dates を返す","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/Call_for_papers.html"},{"note":"2026年サイクルの agenda ページはナビゲーションに掲載なし","label":"ルート直下 agenda の年次","value":"ルート直下の https://www.iccd-conf.com/agenda.html は「The 43rd IEEE International Conference on Computer Design (ICCD 2025)」のヘッダで2025年の時間割を返す","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"公式サイト2025年サイクルのトップページ表記は「Dallas, USA」で、同一の第43回を指すが都市名の表記が異なる","label":"2025 開催地表記の揺れ（DBLP 側）","value":"DBLP の2025年巻タイトルに含まれる開催地表記は「Richardson, TX, USA」","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/iccd/index.html"},{"note":"スコープ文は Call for Papers ページ側に掲載","label":"About ICCD ページの内容","value":"About ICCD ページに掲載されているのは IEEE の equity, diversity, inclusion に関する記述と event conduct policy で、会議の沿革記述・初回開催年・スコープ文は掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/About_ICCD.html"},{"note":"同ページには「For more detais please review: CFP_ICCD2026.pdf」として別 PDF を参照する案内がある（原文どおり detais と表記）","label":"トラック詳細トピックの掲載","value":"Call for Papers ページにはトラック名のみが掲載され、各トラック配下の詳細トピック箇条書きは同ページに掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"参加費についても Conference Registration ページが「Coming Soon」表記のみ","label":"2026-08-05 時点で未公開の会場情報","value":"Conference Venue ページは「Coming Soon」表記のみで、会場名・住所は未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/venue.html"}],"title":"未公開項目と読み違えやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"回次は各年サイトのヘッダに印字され、2024年サイクルが第42回、2025年サイクルが第43回、2026年サイクルが第44回です。Past Conferences ページには1988年まで遡って各回の proceedings リンクが並び、2001年と2003年から2010年の開催年サイトは iccd.et.tudelft.nl のアーカイブとして残されています。DBLP の巻タイトルで見ると2018年以降は米国開催の年が多く、そこに2019年 Abu Dhabi と2024年 Milan が挟まる推移で、2026年は Hong Kong SAR が開催地です。","facts":[{"note":"1988年から2000年までは IEEE Xplore の proceedings リンクのみ、2001年以降は2002年を除いて開催年サイトへのリンクも併記","label":"Past Conferences の掲載範囲","value":"1988年から2025年までの各回が掲載され、最も古い掲載回は1988年","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/ICCD_Previous_Editions.html"},{"note":"同ページは1988年より前の回を掲載していない。各過去回に回次番号の付記もない","label":"初回開催年","value":"初回開催年（第1回の年）の明記は Past Conferences ページに掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/ICCD_Previous_Editions.html"},{"note":"2011年から2025年は iccd-conf.com 配下の年次サイトへのリンク。2002年と2000年以前はサイトリンクがなく proceedings リンクのみ","label":"旧サイトのアーカイブ","value":"2001年および2003年から2010年の開催年サイトは iccd.et.tudelft.nl 配下のページとしてリンクされている","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/ICCD_Previous_Editions.html"},{"note":"DBLP に記録された各年の巻タイトルに含まれる開催地表記","label":"近年の開催地（書誌記録）","value":"2018 Orlando, FL, USA / 2019 Abu Dhabi, United Arab Emirates / 2020 Hartford, CT, USA / 2021 Storrs, CT, USA / 2022 Olympic Valley, CA, USA / 2023 Washington, DC, USA / 2024 Milan, Italy / 2025 Richardson, TX, USA","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/iccd/index.html"},{"note":"2024年サイクルのトップページヘッダ","label":"2024 開催地（公式表記）","value":"The 42nd IEEE International Conference on Computer Design (ICCD 2024) / November 18-20, 2024 / Milan, Italy","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2024/Home.html"}],"title":"回次と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"2025年の agenda では3日間それぞれの朝に keynote が1件ずつ置かれ、その後に2〜3並列の technical session が続く構成でした。tutorial は独立日ではなく本会議のセッション枠に組み込まれる形で、2026年サイクルでは90分枠と明記されています。2025年の keynote 3件はいずれも企業所属の登壇者だったため、産業側の関心テーマを追う場合は agenda の keynote 欄が起点になります。","facts":[{"note":"9:00-10:00 の枠","label":"2025 keynote（月曜）","value":"Dr. Sabya Das（Executive Director R&D Engineering, Synopsys）「Re-Engineering Engineering for the Next Era of IC Design」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"9:00-10:00 の枠","label":"2025 keynote（火曜）","value":"Dr. Mark Ren（Director of Design Automation Research, NVIDIA）「AI for Chip Design: The Inflection Point Is Now」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"9:00-10:00 の枠","label":"2025 keynote（水曜）","value":"Akila Subramaniam（Sr Fellow, AMD）「Application and SW-HW codesign approach to driving low power architecture for GenAI」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"いずれも本会議の technical session と同じ時間帯に並列配置","label":"2025 tutorial","value":"Tutorial 1「Systems Design for Efficient MoE-based LLM Inference」/ Tutorial 2「Machine Learning for Automated Physical Design」/ Tutorial 3「Engineering Privacy at the Edge: A Practical Guide to Differential Privacy in System Architectures」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"agenda 上ではそれぞれセッション 5C・6C・11B・12B に配置","label":"2025 special session","value":"SS-1「Quantum Systems Security: Threats, Forensics & Defenses」/ SS-2「Efficient and Secure Generative AI」/ SS-3「GenAI Meets Silicon: LLMs in Hardware Design, Verification, and Security」/ SS-4「Sustainable Hardware Accelerators with Integrated Electro-Photonics」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"agenda に記載された本会議セッション以外の枠","label":"2025 併設イベント","value":"LLMs for Hardware Design Challenge（水曜のセッション枠）、Welcome Reception（月曜 17:30-18:30）、Social Event 1 - Dinner（火曜 18:30-21:30）、Social Event 2 – Mavericks Game（水曜 18:30-22:30）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"Call for Tutorials に記載","label":"2026 tutorial の枠","value":"「Tutorials will be 90-minute sessions embedded within the main program of ICCD.」","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_tutorials.html"},{"note":"Home / About ICCD / Attend（Conference Registration・Conference Venue・Travel & Hotel Information）/ Call for Contributions（Call for Papers・Call for Special Sessions・Call for Tutorials）/ Committee（Organizing・Program・Steering）/ Past Conferences / Contact Us の構成","label":"展示（exhibition）の掲載","value":"2026年サイトのナビゲーションに exhibition / exhibitor 向けページの掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Steering_Committee1.html"}],"title":"プログラム構成（2025年実績と2026年の枠）","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からの投稿では、6トラックのどこに出すかを決めたうえで abstract 登録と full paper の2段締切を押さえる進め方になります。企業の調査担当は、agenda の keynote と special session を年次で並べると、EDA・AI ハードウェア側の関心テーマの推移を追えます。参加費が未公開の段階では、渡航・宿泊の概算だけ先に置き、登録費は公開後に差し替える運用が必要です。","facts":[{"note":"abstract と full paper の締切は 23:59 AOE 基準","label":"投稿までの手順","value":"abstract 登録（June 03, 2026）→ full paper 提出（June 10, 2026）→ 通知（August 20, 2026）→ camera-ready（September 17, 2026）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"応募要項・締切を掲載する Student Forum ページはナビゲーションに掲載なし","label":"学生向けの枠","value":"Organizing Committee に Student Forum Chairs が置かれている","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Organizing_Committee.html"},{"note":"掲載は登壇の事実を示すもので、取引・共同研究・採用を示すものではない","label":"企業側が追える情報源","value":"2025年 agenda には Synopsys・NVIDIA・AMD の登壇者による keynote 3件が所属付きで掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/agenda.html"},{"note":"早期登録の締切日も未公開","label":"参加費の見積もり可否","value":"2026年の参加費は Coming Soon 表記のみで、区分・金額とも未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Conference_Registration.html"},{"note":"オンライン発表による代替の記述は掲載なし","label":"渡航前提の確認","value":"採択論文は著者のいずれか1名が現地で発表することが proceedings 収録の条件","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ICCD は年次開催で、回次が毎年ひとつ進む形で公式表記されます（2024年が第42回、2025年が第43回、2026年が第44回）。2026年サイクルのサイトは /2026/ 配下に置かれ、前年サイクルは /2025/ 配下に残されています。「Sponsored by:」欄に並ぶ団体表記は開催年ごとに異なり、2026年は HKUST と HKUST Guangzhou、2025年は University of Texas at Dallas が IEEE・IEEE Computer Society に加わる形で掲載されています。公式ページはこれらを「host」とは書いていないため、引用する際は年次を添えたうえで掲載どおりの表記を使ってください。","facts":[{"note":"2026年サイクルのトップページ見出しに印字","label":"2026 正式名称・回次","value":"The 44th IEEE International Conference on Computer Design (ICCD 2026)","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/home.html"},{"note":"2025年サイクルのトップページ見出しに印字","label":"2025 正式名称・回次","value":"The 43rd IEEE International Conference on Computer Design（ICCD 2025）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2025/home.html"},{"note":"2026年トップページ下部の「Sponsored by:」欄に並ぶ4件の団体表記。略称のまま印字されており、正式名称への展開は同ページに掲載なし","label":"2026 主催・支援団体の表記","value":"IEEE / IEEE Computer Society / HKUST / HKUST Guangzhou","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/home.html"},{"note":"2025年サイクルのトップページ「Sponsored by:」欄に並ぶ団体表記。同ページに「host」という語の掲載はない","label":"2025 主催・支援団体の表記","value":"IEEE / IEEE Computer Society / University of Texas at Dallas","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2025/home.html"},{"note":"IEEE Computer Society の ICCD2020 向け CFP ページに掲載された紹介文。2026年サイクルの記述ではない","label":"IEEE Computer Society による会議紹介文（ICCD2020 CFP ページ）","value":"「The International Conference on Computer Design (ICCD) encompasses a wide range of topics in research, design, and implementation of computer systems and their components.」","checkedAt":"2026-08-05","sourceUrl":"https://www.computer.org/conferences/cfp/ICCD2020"},{"note":"同ページには各年の proceedings リンクが並び、2001年以降は2002年を除いて開催年サイトへのリンクも併記","label":"開催頻度","value":"Past Conferences ページに1988年から2025年まで各年1件ずつ過去回が並ぶ。開催頻度そのものを明示する文言は同ページに掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/ICCD_Previous_Editions.html"}],"title":"会議の正体と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"2026年サイクルの Organizing Committee は香港・中国本土の大学が中核で、そこにシンガポール・米国・インド・スイスの所属が加わる構成です。Steering Committee は米国・オランダ・韓国の所属で構成され、開催地サイクルとは別に継続性を担う配置になっています。委員名簿に印字された所属は組織の所在地であり、個人の国籍を示すものではありません。","facts":[{"note":"Organizing Committee ページの印字どおり","label":"2026 General Chairs","value":"Wei Zhang（The Hong Kong University of Science and Technology, Hong Kong SAR）/ Jiang Xu（The Hong Kong University of Science and Technology (Guangzhou), China）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Organizing_Committee.html"},{"note":"同上","label":"2026 Program Chairs","value":"Weichen Liu（Nanyang Technological University, Singapore）/ Yingjie Lao（Tufts University, USA）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Organizing_Committee.html"},{"note":"Steering Committee ページの印字どおり。Organizing Committee ページには Steering Committee の名簿は掲載されていない","label":"2026 Steering Committee","value":"Chair: Omer Khan（University of Connecticut, USA）。Members: Georgi Gaydadjiev（TU Delft, Netherlands）/ Kee Sup Kim（Axion, Korea）/ Peter-Michael Seidel（University of Hawaii, USA）/ Sandip Kundu（University of Massachusetts Amherst, USA）","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Steering_Committee1.html"},{"note":"Organizing Committee ページに印字された所属機関の所在地。個人の国籍ではない","label":"2026 Organizing Committee に印字された所属の所在","value":"Hong Kong SAR / China / Singapore / USA / India / Switzerland","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Organizing_Committee.html"},{"note":"Student Forum の募集要項ページはナビゲーションに掲載なし。所属表記は委員就任の事実を示すもので、取引関係を示すものではない","label":"2026 学生向け・パネル担当の設置","value":"Student Forum Chairs（Zhe Lin: Sun Yat-Sen University, China / Xinyu Chen: The Hong Kong University of Science and Technology (Guangzhou), China）と Panel Chairs（Fengbin Tu: The Hong Kong University of Science and Technology, Hong Kong SAR / Xuanqi Chen: Huawei Inc.）が Organizing Committee に置かれている","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Organizing_Committee.html"},{"note":"掲載された団体表記は開催支援の事実を示すもので、取引関係を示すものではない","label":"sponsor / exhibitor 一覧","value":"2026年トップページに企業スポンサー名や出展社の一覧は掲載なし。「Sponsored by:」欄に並ぶのは IEEE / IEEE Computer Society / HKUST / HKUST Guangzhou の団体表記のみ","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/home.html"}],"title":"委員会構成と参加組織の所在","eyebrow":"community"},"comparison":{"id":"comparison","body":"ICCD は Computing Systems から Logic and Circuit Design までの6トラックを1つの会議で受け付ける構成で、Call for Papers にはトラック名が並列に列挙されています。8ページ上限・double-blind・現地対面発表という3条件は投稿計画に直接効くため、他候補と並べる際はこの3点が比較軸になります。ここに載せるのは ICCD 公式ページに掲載された条件のみで、他会議の条件や会議間の優劣は本ページの出典範囲外です。","facts":[{"note":"Call for Papers のトラック一覧","label":"1会議で扱う範囲の広さ","value":"systems・compilers/tool chains・hardware architecture・test/verification/security・EDA・logic and circuit design の6トラックを同一会議で受け付ける","checkedAt":"2026-08-05","sourceUrl":"https://www.iccd-conf.com/2026/Call_for_papers.html"},{"note":"いずれも Call for Papers に明記","label":"投稿計画に効く3条件","value":"8 pages 上限（figures・references・appendix 込み）/ double-blind / 採択論文は現地対面発表が proceedings 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differ.","rows":[{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"（株）アカデメイア","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"アールエムテック(株)","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"イノベーションサイエンス（株）","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"(株)エルエイシステムズ","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"電子磁気工業(株)","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"(株)東栄科学産業","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"(株)東陽テクニカ","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"ネオアーク(株)","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"伯東(株)","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"（株）マグネア","organizationType":"company"},{"role":"official_exhibitor_listing","tier":"企業展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"マグネデザイン（株）","organizationType":"company"},{"role":"official_recruit_exhibitor_listing","tier":"リクルート展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"ウエスタンデジタルテクノロジーズ（同）","organizationType":"company"},{"role":"official_recruit_exhibitor_listing","tier":"リクルート展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"東芝デバイス&ストレージ（株）","organizationType":"company"},{"role":"official_recruit_exhibitor_listing","tier":"リクルート展示","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/exhibition/","listingRows":1,"organization":"（株）レゾナック","organizationType":"company"},{"role":"official_supporting_member_presentation_listing","tier":"賛助会員プレゼンテーション","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/supportingmember_presentation/","listingRows":1,"organization":"株式会社東陽テクニカ","organizationType":"company"},{"role":"official_supporting_member_presentation_listing","tier":"賛助会員プレゼンテーション","country":"Japan","sourceUrl":"https://www.magnetics.jp/kouenkai/2025/others/supportingmember_presentation/","listingRows":1,"organization":"株式会社レゾナックハードディスク","organizationType":"company"}],"label":"MSJ 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プロセス統合","organizers":[],"lastVerified":"2026-10-22","currentCycleEnd":"2026-09-04","abstractDeadline":"2026-06-08","peerReviewStatus":"review-unclear","currentCycleStart":"2026-09-01","canonicalId":"conf_5df0db4f9cc9406390a695de81ce5021","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"magnetics-society-of-japan-annual-meeting","confidenceScore":1,"coverage":{"faqCount":6,"factCount":53,"topicCount":5,"sourceCount":13,"sectionCount":12,"sectionTotal":12,"droppedFactCount":3,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"第50回が2026年9月1日（火）〜4日（金）に、東京科学大学大岡山キャンパスの西9号館と西講義棟1で開かれました。","question":"2026年の日本磁気学会学術講演会はいつ、どこで開かれましたか？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/about/intro/"]},{"answer":"A4判1枚の概要集原稿をPDF（1MB未満）で投稿します。2026年はConfitで受け付け、締切は6月8日でした。","question":"講演申込で何を提出しますか？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/registration/inst1/","https://www.magnetics.jp/kouenkai/2026/about/intro/"]},{"answer":"一般講演は口頭発表10分と質疑4分、またはA0サイズのポスター発表です。シンポジウムの招待講演は25分と質疑4分です。","question":"発表の形式と時間は？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/registration/inst1/"]},{"answer":"講演者は原則として日本磁気学会と提携学会の会員ですが、非会員も一定の条件の下で講演できます。","question":"非会員でも講演できますか？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/about/intro/","https://www.magnetics.jp/kouenkai/2026/registration/inst1/"]},{"answer":"Web配信で、参加登録料にダウンロード版の価格が含まれます。冊子版（白黒、B5）は事前登録時に5,500円で申し込めます。","question":"概要集はどのように配布されますか？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/about/intro/"]},{"answer":"会期中に西9号館のコラボレーションルームで企業展示、メディアホールでリクルート展示が開かれます。","question":"企業展示はありますか？","sourceUrls":["https://www.magnetics.jp/kouenkai/2026/others/exhibition/"]}],"headline":"第50回日本磁気学会学術講演会は2026年9月1〜4日に東京科学大学大岡山キャンパスで開かれ、9月2日には第50回を記念した特別企画が組まれました。","metaDescription":"日本磁気学会学術講演会（MSJ Annual Meeting）の第50回（2026年9月・東京科学大学大岡山）の会期、発表分野A〜H、講演申込と概要原稿の規定、シンポジウム、企業展示、1996年以降の開催地を公式ページから整理しました。","oneLine":"日本磁気学会学術講演会は、公益社団法人日本磁気学会が毎年開く学術講演会で、磁気物理、磁性材料、スピントロニクス、薄膜、パワーマグネティックス、計測、生体磁気、磁気記録の研究が口頭とポスターで発表されます。","pageTitle":"日本磁気学会学術講演会とは｜磁性材料・スピントロニクス・磁気記録の年次講演会","relatedConferenceIds":["intermag","mmm","joint-mmm-intermag-conference","international-conference-on-magnetism","jsap-spring-autumn"],"sections":{"cycle":{"id":"cycle","body":"第50回は2026年9月1日（火）〜4日（金）に、東京科学大学大岡山キャンパスの西9号館と西講義棟1で開かれました。9月2日午後にはディジタル多目的ホール（A会場）で表彰式、フェロー講演、特別講演が行われています。事前参加登録の締切は8月1日で、8月2〜31日にはConfitで後期登録を受け付けました。","facts":[{"label":"2026 会期","value":"2026-09-01〜04","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"},{"label":"2026 会場","value":"東京科学大学 大岡山キャンパス 西9号館、西講義棟1（東京都目黒区）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"},{"label":"2026 開催地（学会の講演会一覧）","value":"東京科学大学（東京都目黒区）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/event/nextannualconference/"},{"label":"2026 事前参加登録締切","value":"2026-08-01","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"},{"label":"2026 後期登録","value":"Confitで8月2日〜31日","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/"},{"note":"非会員は講演申込ありで50,000円、聴講のみで23,000円（消費税込み）。","label":"2026 事前参加登録料（正会員 / 学生会員）","value":"10,000円 / 4,000円（不課税）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"}],"title":"2026年の会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"発表分野はA〜Hの8分野とS（シンポジウム）に分かれ、それぞれに細目があります。スピントロニクス（C）にはMRAMやスピントランジスタを含むデバイス・プロセス技術の細目があり、パワーマグネティックス（E）にはモータ・アクチュエータや変圧器・リアクトルが入ります。学会紹介ページは、物理、電気、電子、化学、生物、医学、薬学、歯学などの研究者が集う学会と説明しています。","facts":[{"label":"2026 発表分野","value":"A 磁気物理・強磁場応用 / B ハード・ソフト磁性材料 / C スピントロニクス / D 薄膜・微粒子・多層膜・人工格子 / E パワーマグネティックス / F 計測・高周波デバイス・磁気イメージング / G 生体磁気・医療応用 / H 磁気記録 / S シンポジウム","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/registration/bunya/"},{"label":"C スピントロニクスの細目（例）","value":"デバイス技術・プロセス技術（MRAM, スピントランジスタ, その他）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/registration/bunya/"},{"label":"B 磁性材料の細目（例）","value":"希土類系ハード磁性材料 / 酸化物系ハード磁性材料 / 金属系・フェライト系・アモルファスソフト磁性材料","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/registration/bunya/"},{"label":"E パワーマグネティックスの細目（例）","value":"モータ・アクチュエータ・磁気浮上 / 変圧器・リアクトル","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/registration/bunya/"},{"label":"学会の研究者構成","value":"物理、電気、電子、化学、生物、医学、薬学、歯学などの研究者","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/society/about/"}],"title":"発表分野","eyebrow":"scope"},"review":{"id":"review","body":"講演者はシンポジウム講演者を除き、日本磁気学会の正会員・学生会員と、提携する韓国・台湾・中国の磁気関連学会の会員に限られ、非会員も一定の条件で講演できます。シンポジウムは世話人が推薦する招待講演だけの形式Aと、招待講演に一般講演を加える形式Bに分かれます。学術奨励賞（内山賞）の審査を希望した講演者は、別途論文を投稿する必要があります。","facts":[{"label":"講演者資格","value":"日本磁気学会の正会員・学生会員、Korean Magnetics Society、Taiwan Association of Magnetic Technology、Chinese Society of Magnetic Materials and Applicationの会員（シンポジウム講演者を除く）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"},{"label":"非会員の講演","value":"一定の条件の下で可能","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/intro/"},{"label":"シンポジウムの形式","value":"形式A（世話人推薦の招待講演のみ）/ 形式B（招待講演 + 一般講演）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/about/special-lecture_sym/"},{"label":"2026 学術奨励賞（内山賞）論文締切","value":"2026-10-26（審査希望者は論文投稿が必須）","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/"},{"label":"2026 ポスター講演賞","value":"受賞者を2026年9月3日に掲載","checkedAt":"2026-10-08","sourceUrl":"https://www.magnetics.jp/kouenkai/2026/"}],"title":"講演資格・審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年は第50回で、第49回は2025年（愛媛大学）です。年度を取り違えると回次が一つずれます。講演資格のある台湾・韓国の学会名は、Korean Magnetics Society / The Korean Magnetic Society、Taiwan Association of Magnetic Technology / Taiwan Association for Magnetic Technologyのように表記が揺れています。Web概要集は参加登録の決済者だけが閲覧でき、一般には公開されていません。","facts":[{"label":"講演者資格の表記（学術講演会要項）","value":"Korean Magnetics Society / Taiwan Association of Magnetic 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2026.\" と記されています。採択通知は8月8日、最終原稿（Final Paper Submission）は8月31日です。2026-08-05時点で著者投稿はクローズし、著者アカウントは査読完了までロックされています。","question":"投稿締切と採択通知はいつですか。","sourceUrls":["https://epapers2.org/asscc2026/ESR/authorinfo1.php","https://www.a-sscc2026.org/","https://epapers2.org/asscc2026/"]},{"answer":"公式投稿システムには投稿締切とは別に \"Deadline for ASSCC 2026 review submission: Jul 15, 2026 23:59 (UTC -0500)\" が設定され、\"The review phase is now in PROGRESS\" と表示されているため、査読フェーズが存在することが確認できます。選考はTPC Chair（Junghwan Choi, Samsung）以下、10のsubcommitteeにChairとメンバーが名前つきで配置されたTechnical Program Committeeが担う構成です。ただしdouble-blindかどうか、評価観点の一覧といった審査方針は公式ページに公表されていません。","question":"査読はありますか。どのように選考されますか。","sourceUrls":["https://epapers2.org/asscc2026/","https://www.a-sscc2026.org/technical-program-committee","https://epapers2.org/asscc2026/ESR/authorinfo1.php"]},{"answer":"公表されていません。2026年サイクルの公式サイトのトップページ、および公式投稿システムのAuthor Informationを2026-08-05に確認しましたが、投稿件数・採択件数・採択率のいずれも記載がありません。過去回の採択率も、これらの公式ページには掲載されていません。","question":"採択率は公表されていますか。","sourceUrls":["https://epapers2.org/asscc2026/ESR/authorinfo1.php","https://www.a-sscc2026.org/"]},{"answer":"\"Paper 2 page manuscript plus 1 optional page for supplementary figures\" と規定されており、図・表・参考文献を含めて本体は2ページ、補足図のみ任意で1ページ追加できます。用紙はA4（210mm×297mm）またはUS Letter（8.5\"×11\"）、形式はAdobe PDFで5MB以内、フォントはすべて埋め込みでType 3フォントは避け、ページ番号とセキュリティ設定は付けないよう指定されています。","question":"原稿は何ページ書けばよいですか。","sourceUrls":["https://epapers2.org/asscc2026/ESR/authorinfo1.php","https://www.a-sscc2026.org/"]},{"answer":"公式投稿システムには、発表されなかった採択論文をIEEE Xploreから削除する権利をIEEEが留保する旨が記されており、採択論文がIEEE Xploreで配信される前提であることが読み取れます。proceedingsはIEEE刊行でISBNが付き、DBLPのシリーズ索引にも各年の巻として登録されています。加えて2023年回については、IEEE Journal of Solid-State Circuitsのspecial sectionのguest editorialがSSCSサイトに掲載されています。ただし2026年回について同様の特集が組まれるかどうかは、公式ページに告知がありません。","question":"採択された論文はどこに掲載されますか。ジャーナルへの展開はありますか。","sourceUrls":["https://epapers2.org/asscc2026/ESR/authorinfo1.php","https://dblp.org/db/conf/asscc/index.html","https://sscs.ieee.org/guest-editorial-introduction-to-the-special-section-on-the-2023-asian-solid-state-circuits-conference-a-sscc/"]},{"answer":"2026-08-05時点で公表されていません。公式サイトのRegistrationリンクはunder constructionページに転送され、金額も区分（member / non-member / student）も掲載されていません。ただし採択1件につき著者1名が \"full conference rate\" で登録して発表する義務があることは、公式投稿システムに明記されています。宿泊費の目安としては、会場のThe Lin Hotelが \"From US$ 180 per night\" と公式サイトに掲載されています。","question":"参加費はいくらですか。","sourceUrls":["https://www.a-sscc2026.org/under-construction","https://epapers2.org/asscc2026/ESR/authorinfo1.php","https://www.a-sscc2026.org/accommodation-for-the-conference"]},{"answer":"Steering CommitteeにはMakoto Ikeda（The University of Tokyo）、Masaitsu Nakajima（Socionext）、Sugako Otani（Renesas）、Minoru Fujishima（Hiroshima University）が掲載され、AdvisorsにTadahiro Kuroda（Keio University）とTakayasu Sakurai（The University of Tokyo）が並びます。Technical Program CommitteeでもRF & Wirelessのchairが Kenichi Okada（Institute of Science Tokyo）、Data Convertersのchairが Kazuko Nishimura（Sony Semiconductor Solutions）、FPGAのchairが Jun Deguchi（Kioxia）です。これらは公式ページに印字された所属機関であり、個人の国籍を示すものでも、当該企業との取引・共同研究を示すものでもありません。","question":"日本の研究者・企業はどのように関わっていますか。","sourceUrls":["https://www.a-sscc2026.org/steering-committee","https://www.a-sscc2026.org/technical-program-committee"]},{"answer":"公式講演日程は公開され、11月2日以降のlecture sessionsを日付・部屋別に確認できます。11月1日には4件のtutorialが予定されています。keynoteとinvited talkの全詳細、協賛・出展企業の一覧は、今回確認した資料では確認できません。","question":"keynoteやtutorialのプログラムはいつ分かりますか。","sourceUrls":["https://epapers2.org/asscc2026/ESR/session_sched_view.php?sched_id=1","https://www.a-sscc2026.org/registration"]}],"headline":"2026年サイクルの公式サイト・公式投稿システム・IEEE SSCSの会議一覧・DBLPのシリーズ索引を実際に開き、確認できた記載だけを並べました。","metaDescription":"A-SSCC（IEEE Asian Solid-State Circuits Conference）の公式情報を整理。2026年サイクルの会場・投稿締切・2ページ原稿規定・10の投稿区分・委員会構成・IEEE Xploreに関する公式文言までを、公式ページで読める範囲だけで確認できます。","oneLine":"A-SSCC（IEEE Asian Solid-State Circuits Conference）は、IEEE Solid-State Circuits Societyが「財政的にスポンサーする5つの主要会議」として挙げる会議のひとつで、2005年設立、アジア各地のIC innovation hubを毎年巡回して開催されるsolid-state circuits／SoCの発表会議です。","pageTitle":"A-SSCCとは｜IEEE Asian Solid-State Circuits Conferenceの投稿規定・査読・開催地","relatedConferenceIds":["isscc","esserc","cicc","vlsi","isocc","icsict"],"sections":{"cycle":{"id":"cycle","body":"第22回A-SSCC 2026は2026年11月1〜4日にThe Lin Hotel Taichungで開催されます。公式講演日程には11月2日以降のlecture sessionsが部屋別に掲載され、Registrationページは11月1日に4件のtutorialを予定しています。開催形式が現地のみかhybridかは、今回確認した資料では確認できません。","facts":[{"note":"公式サイトのVenue for the Conferenceページ記載。Accommodationページでは \"The official venue for the A-SSCC 2026\" と表示されている。","label":"2026 会場","value":"The Lin Hotel Taichung（台中林酒店）","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/venue-for-the-conference"},{"note":"同ページに掲載された住所表記そのまま。都市は台中市、国・地域は台湾。","label":"2026 会場所在地","value":"No. 99, Chaofu Road, Xitun District, Taichung City, Taiwan（台灣臺中市西屯區朝富路99號）","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/venue-for-the-conference"},{"note":"公式Registrationページに第22回、会期、会場が掲載されている。","label":"2026 会期","value":"2026年11月1〜4日","checkedAt":"2026-10-14","sourceUrl":"https://www.a-sscc2026.org/registration"},{"note":"2026年サイクル公式サイトのトップに掲げられたテーマ。","label":"2026 テーマ","value":"\"I C the Future of AI\"","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"Venue for the Conferenceページに形式の明示がないことを確認。","label":"2026 開催形式","value":"現地開催・hybrid・onlineのいずれであるかを示す記載は公式サイトにない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/venue-for-the-conference"},{"note":"近隣としてMillennium Hotel Taichung（From US$ 160 per night）、Hung's Mansion（From US$ 120 per night）、Windsor Hotel Taichung（From US$ 140 per night）、Fairfield by Marriott Taichung（From US$ 140 per night）が挙げられている。価格は公式サイト掲載の目安。","label":"2026 宿泊（会場ホテル）","value":"The Lin Hotel は \"From US$ 180 per night\"、会場からの距離は \"Conference Venue (0 min)\" と記載","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/accommodation-for-the-conference"},{"note":"本会議とは別に開催されるTPC meetingの会場。日程は同ページに記載がない。","label":"2026 TPC meeting 会場","value":"Wyndham Sun Moon Lake（日月潭力麗溫德姆溫泉酒店）、No. 312, Zhongzheng Rd., Yuchi Township, Nantou County, Taiwan","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/venue-for-the-tpc-meeting"},{"note":"2026-08-05時点でトップページに「2027」の文字列および次回開催の告知はない。","label":"次サイクル（2027）","value":"2027年の開催地・会期に関する記載は2026年公式サイトにない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"}],"title":"2026年サイクルの会期・会場・公開済みプログラム","eyebrow":"cycle"},"scope":{"id":"scope","body":"投稿先を選ぶときは、トップページの \"Papers are solicited in the following categories:\" の10区分と、Technical Program Committeeページのsubcommittee見出しの両方を見るのが確実です。TPCページでは10個のsubcommitteeに括弧内の略号（ACS / DC / DCS / SISP / ETA / MEM / WLN）まで公式に印字されています。Industryが独立した区分として立っている点、FPGAが単独トラックになっている点は、同じsolid-state circuits系でも会議ごとに違うので確認しておく価値があります。対象外領域の明示はないため、境界事例はTPC Chairへの問い合わせで確かめる形になります。","facts":[{"note":"Technical Program Committeeページに印字されたsubcommittee見出し10件。","label":"2026 トラック（TPC subcommittee見出し）","value":"Analog Circuits and Systems (ACS) / Data Converters (DC) / Digital Circuits and Systems (DCS) / System Integration and Signal Processing Systems (SISP) / RF & Wireless / Emerging Tech. and Applications (ETA) / Memory (MEM) / FPGA / Industry / Wireline (WLN)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"Industry Program については \"This special category accepts only papers based on state-of-the-art industrial products.\" と説明されている。TPCページのsubcommittee見出しとは名称の表記が一部異なる（例：トップページは Industry Program、TPCページは Industry）。","label":"2026 投稿区分（トップページの列挙）","value":"\"Papers are solicited in the following categories:\" として Analog Circuits & Systems / Data Converters / Digital Circuits & Systems / System Integration & Signal Processing Systems / Wireless / Wireline / Emerging Technologies and Applications / Memory / FPGA / Industry Program の10区分","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"領域区分とは別に、横断的に歓迎する観点として挙げられている文の引用。","label":"2026 横断的な観点","value":"トップページは \"Papers on low-power and/or low-voltage approaches, signal integrity, noise, test, and manufacturability for all the above categories are welcomed.\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"メンバーには Surhud Khare (Intel Corporation)、Ting Wu (Norel Systems)、Saki Hatta (NTT)、Takayuki Miyazaki (Kioxia Corporation)、Myoungbo Kwak (Samsung Electronics)、Jinho Han (ETRI) 等が所属つきで印字されている。これは委員としての掲載であり、協賛・取引・共同研究を示すものではない。","label":"Industryトラックの独立","value":"Industry subcommittee が独立して置かれ、Chair は Stefan Rusu (TSMC)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"2026-08-05時点で確認。","label":"明示された対象外領域","value":"対象外（out of scope）を明示する記載は2026年公式サイトのトップページおよびTPCページにない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"A-SSCCは投稿システム上に査読フェーズの締切が別立てで設定されており、投稿→査読→採否決定という工程が公式に読み取れます。実際の選考は、10のsubcommitteeにChairとメンバーが名前つきで置かれたTechnical Program Committeeが担う構成です。ただしdouble-blindかどうか、評価軸が何かといった審査方針の記述は公式ページに出ておらず、採択率も公表されていません。「採択率〇%」という数字を社内資料に載せる根拠は、2026-08-05時点の公式一次情報からは得られません。","facts":[{"note":"公式投稿システムのランディングページに、Submission deadline・Decision notification と並んで表示されている査読側の締切。同ページには \"The review phase is now in PROGRESS\" とも表示されている。","label":"2026 査読フェーズの締切","value":"\"Deadline for ASSCC 2026 review submission: Jul 15, 2026 23:59 (UTC -0500)\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/"},{"note":"2026-08-05時点の投稿システムの状態表示。","label":"2026 査読中のアカウント状態","value":"\"Author Submissions are now CLOSED. Author account access is LOCKED until completion of the review phase.\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/"},{"note":"その下に10のsubcommitteeが置かれ、各subcommitteeにChairと複数のメンバーが所属つきで掲載されている。","label":"2026 選考体制","value":"TPC Chair は Junghwan Choi (Samsung)、Co-Chair は Minoru Fujishima (Hiroshima University)、Vice-Chair は Kyuho Jason Lee (Yonsei University)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"2026年公式サイトのトップページおよび公式投稿システムのAuthor Informationを2026-08-05に確認したが、投稿数・採択数・採択率の記載はない。","label":"採択率","value":"採択率は公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"公式投稿システムのAuthor Informationには原稿仕様・締切・登壇義務が記載されているが、匿名性の方式や審査観点についての記述はない。","label":"double-blind等の査読方式の明示","value":"double-blind / single-blind といった匿名性の方式、および審査観点の一覧は公式ページに記載されていない","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"Contactページに、査読プロセスに関する問い合わせ先として明記されている。","label":"技術的問い合わせ窓口","value":"\"For inquiries about paper submission, review process, acceptance notification, and technical sessions.\" として TPC Chair の Dr. JungHwan Choi が連絡先に指定されている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/contact"}],"title":"査読の進み方と、公表されていない指標","eyebrow":"review"},"caveats":{"id":"caveats","body":"A-SSCC 2026の会期は2026年11月1〜4日、会場はThe Lin Hotel Taichungで、公式講演日程も公開されています。開催形式、採択率、投稿件数、参加者数、査読の匿名性と審査観点、proceedingsのopen accessの扱い、2027年の開催地は、今回確認した資料では確認できません。締切時刻は公式サイトがGMT、投稿システムがUTC -0500で表記しているため、利用時は時刻基準も併記してください。","facts":[{"note":"公式Registrationページで会期が確認できたため、未公表という旧記述を更新。","label":"2026 会期・会場","value":"2026年11月1〜4日 / The Lin Hotel, Taichung, Taiwan","checkedAt":"2026-10-14","sourceUrl":"https://www.a-sscc2026.org/registration"},{"note":"同じ日付だが時刻基準の書き方が異なる。投稿実務では投稿システム側の表記を優先して確認する必要がある。","label":"締切時刻の表記ゆれ","value":"公式サイトは \"June 14, 2026 20:00 (GMT)\"、公式投稿システムは \"Jun 14, 2026 23:59 (UTC -0500)\" と表記している","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"\"Please enter the access password provided by the A-SSCC 2026 OC committee.\" と表示される。一般参加者は内容を確認できないため、ここに含まれる情報はこのページでは扱わない。","label":"TPC meeting関連ページの閲覧制限","value":"Agenda for the TPC Meeting、Registration for the TPC Meeting は \"SC/TPC/OC Members Only\" としてパスワード保護されている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/agenda-for-the-tpc-meeting"},{"note":"Registration・Sponsorship・Program配下のページはすべてunder construction。","label":"このページで扱わない範囲","value":"採択率、投稿件数、参加者数、参加登録費、keynote／tutorialの内容、sponsor・exhibitor一覧はいずれも公式に公表されていないため記載していない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/under-construction"}],"title":"このページで確認できないこと・注意点","eyebrow":"caveats"},"history":{"id":"history","body":"設立年はIEEE SSCSの会議ページに明記されており、2005年です。同じ文でアジア域内のIC開発拠点を毎年巡回することも述べられているため、「どこで開催されるか」は年ごとに変わる前提で見る必要があります。実際の巡回実績はDBLPのシリーズ索引に残る各年のproceedings巻から追え、韓国・日本・台湾・中国（マカオ含む）が繰り返し登場します。2020年回は \"Virtual Event, Japan\" として登録されており、オンライン開催が行われた年があることも確認できます。","facts":[{"note":"スポンサーsocietyのページによる記述。2005年設立、毎年アジア各地で開催。","label":"設立年","value":"IEEE SSCSの会議ページに \"Founded as recently as 2005 and held annually in different hubs of IC innovation in Asia\" と記載されている","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"DBLPのA-SSCCシリーズ索引に掲載されている12巻の記載どおり。2010年以前、2013年、2022年、2025年の巻はこの索引ページには見当たらない（索引が全巻を網羅しているとは限らない）。","label":"開催地ローテーション（DBLP索引に掲載の巻）","value":"2011 Jeju, South Korea / 2012 Kobe, Japan / 2014 KaoHsiung, Taiwan / 2015 Xia'men, China / 2016 Toyama, Japan / 2017 Seoul, Korea (South) / 2018 Tainan, Taiwan / 2019 Macau, SAR, China / 2020 Virtual Event, Japan / 2021 Busan, Korea, Republic of / 2023 Haikou, China / 2024 Hiroshima, Japan","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/asscc/index.html"},{"note":"DBLP索引の巻タイトルの記載。","label":"オンライン開催の実績","value":"2020年回は \"IEEE Asian Solid-State Circuits Conference, A-SSCC 2020, Virtual Event, Japan, November 9-11, 2020\" として登録されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/asscc/index.html"},{"note":"巻タイトルに印字された日付。2026年の会期はこの傾向とは独立に、公式発表を待つ必要がある。","label":"開催時期の傾向（過去巻の会期）","value":"DBLP索引に掲載された12巻の会期はいずれも11月（2011年11月14-16日、2016年11月7-9日、2021年11月7-10日、2024年11月18-21日など）","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/asscc/index.html"},{"note":"文献検索時に両方の綴りを試す必要がある。","label":"名称表記のゆれ","value":"DBLP索引には \"IEEE Asian Solid-State Circuits Conference\" と \"IEEE Asian Solid State Circuits Conference\"（2012年巻、ハイフンなし）の両方が現れる","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/asscc/index.html"}],"title":"設立年と開催地ローテーション","eyebrow":"history"},"program":{"id":"program","body":"2026年サイクルのProgramメニューは、Agenda・Keynotes・Invited Talksがいずれも \"Under Construction\" ページに転送される状態です。したがってkeynote登壇者、tutorial／short course、特別セッションの内容は2026-08-05時点で確認できません。ただしトップページには、3つのdemonstration sessions（Student Design Contest、FPGA Demo、Industry Demo including Start-up Showcase）、Educational Session／Panels／Mini-Forums、Young Professionals and Women-in-Circuits (WiC) Joint Mentoring Session、Start-ups Forum、IT Vision in Asia を開催するという説明があり、技術発表以外の併設企画がある会議であることは読み取れます。プログラム確定を待つ場合は、Agenda／Keynotes／Invited Talksの3リンクが実ページに切り替わるかを見るのが指標になります。","facts":[{"note":"同ページにはRegistration、Sponsorshipもunder constructionとして並んでおり、公開時期の告知はない。","label":"2026 プログラム公開状況","value":"Program配下のAgenda・Keynotes・Invited Talksはいずれも https://www.a-sscc2026.org/under-construction にリンクされている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/under-construction"},{"note":"いずれもトップページの記載。個別の日程・登壇者・申込方法は未公開。","label":"2026 併設企画（トップページの説明）","value":"\"Three demonstration sessions will be held during the Conference.\"（Student Design Contest、FPGA Demo、Industry Demo including Start-up Showcase）、\"Educational Session, Panels, and Mini-Forums\"、\"Young Professionals and Women-in-Circuits (WiC) Joint Mentoring Session, Start-ups Forum, and IT Vision in Asia\" が挙げられている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"\"Please enter the access password provided by the A-SSCC 2026 OC committee.\" と表示される。一般参加者向けのプログラム情報ではない。","label":"2026 TPC meetingの扱い","value":"TPC meeting用のAgenda・Registrationページは \"SC/TPC/OC Members Only\" としてパスワード保護されている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/registration-for-the-tpc-meeting"},{"note":"2026-08-05時点で協賛企業名は一切公開されていない。","label":"2026 展示・exhibitor情報","value":"Sponsorshipページはunder constructionで、sponsor・exhibitorの一覧は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/under-construction"}],"title":"プログラム構成（2026年サイクルは未公開）","eyebrow":"program"},"audience":{"id":"audience","body":"研究室にとっては、原稿が2ページ（＋補足図1ページ）という短さと、アジア域内を巡回する開催地が計画上の前提になります。ただし採択1件につき著者1名がfull conference rateで登録し、会議に出席して発表する義務があるため、旅費と登録費を前提に投稿計画を立てる必要があります。オンライン発表で代替できるかどうかは公式に書かれていません。企業・調査担当にとっては、Technical Program Committeeページが所属つきの人名一覧として読めます。どの企業・大学が、どの技術領域のsubcommitteeに人を出しているかが分かるためです。なお、そこに名前がある組織は運営に関与しているという事実のみを示し、協賛・取引関係や共同研究を示すものではありません。","facts":[{"note":"オンライン発表の可否についての記載はない。","label":"投稿にかかる登壇コスト","value":"採択1件につき著者1名が \"registered at the full conference rate\" で登録し、会議に出席して発表することが必要","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"2026-08-05時点で金額・区分（member / non-member / student）ともに未公開。","label":"2026 参加登録費","value":"参加登録費は公表されていない（Registrationページはunder construction）","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/under-construction"},{"note":"参加要件や申込方法の記載は同ページにない。","label":"若手・多様性向けの企画","value":"トップページに \"Young Professionals and Women-in-Circuits (WiC) Joint Mentoring Session\" と \"Start-ups Forum\" の記載がある","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"同ページに会期の日付はない。中国・香港・マカオからの参加者向けには Taiwan Entry Permit の別ページが案内されている。","label":"日本からの参加に関わる手続き情報","value":"公式サイトのVisa Informationページに台湾の入国ビザ免除要件が掲載され、日本は \"90 days\" のvisa-exempt entry対象国の一覧に含まれている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/visa-information"},{"note":"公式サイト掲載の目安価格。実際の予約条件は各ホテルの案内による。","label":"宿泊予算の目安","value":"会場ホテル The Lin Hotel が From US$ 180 per night、近隣4ホテルが From US$ 120〜160 per night","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/accommodation-for-the-conference"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"A-SSCCが「どの組織の会議か」を確認したい場合は、IEEE SSCSの会議一覧ページを見るのが最短です。ここでは \"The Society financially sponsors five key conferences:\" という一文の下にISSCC・Symposium on VLSI Technology and Circuits・CICC・A-SSCC・ESSERCの5件が並んでおり、A-SSCCがSSCSの財政スポンサー対象であることがそのまま読み取れます。2026年サイクルの公式サイトは、トップページ下部の \"Conference Organizers\" にIEEE・IEEE SSCS・National Yang Ming Chiao Tung Universityの3者のロゴを掲げていますが、「host」「organizer」といった役割の割り当てを文章で説明してはいません。回数表記（第N回）は2026年公式サイトには出ていないため、社内資料で「第N回」を使う場合は根拠を別途探す必要があります。","facts":[{"note":"2026年サイクル公式サイトのトップに掲載された表記。","label":"正式名称","value":"IEEE A-SSCC 2026 (Asian Solid-State Circuits Conference)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"同じ5件に International Solid State Circuits Conference (ISSCC)、Symposium on VLSI Technology and Circuits、Custom Integrated Circuits Conference (CICC)、European Solid-State Electronics Research Conference (ESSERC) が並ぶ。同ページに \"fully sponsored\" という語は印字されていない。","label":"SSCSによる財政スポンサー","value":"IEEE Solid-State Circuits Societyの会議ページは \"The Society financially sponsors five key conferences:\" として \"Asian Solid-State Circuits Conference (A-SSCC)\" を挙げている","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"National Yang Ming Chiao Tung University はロゴとして掲出されている。「host」「主催」といった役割語を割り当てる文章は同ページにない。","label":"2026 サイクルの主催表示","value":"トップページ下部の \"Conference Organizers\" に IEEE、IEEE Solid-State Circuits Society、National Yang Ming Chiao Tung University の3者が並び、本文は \"The conference is supported by the IEEE Solid-State Circuits Society and will be held in Asia.\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"年次開催であること、およびアジア域内を巡回することが同一文で述べられている。","label":"開催頻度","value":"SSCSの会議ページに \"held annually in different hubs of IC innovation in Asia\" と記載されている","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"原文の引用。順位や優劣を示す記述はこの文にはない。","label":"会議の性格に関する公式表現","value":"2026年公式サイトは \"an international forum for presenting the most updated and advanced chips and circuit designs in solid-state and semiconductor fields\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"2026-08-05時点で両ページを確認。回数を書きたい場合は公式の別資料が必要。","label":"第N回（回数表記）","value":"2026年公式サイトのトップページおよびContactページに回数表記（第N回 / 22nd 等）は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/contact"}],"title":"会議の位置づけと主催体制","eyebrow":"identity"},"community":{"id":"community","body":"A-SSCCの運営構造は、Steering Committee（シリーズ全体）、Organizing Committee（開催年の実務）、Technical Program Committee（選考）の三層に分かれており、いずれも公式サイトに氏名と所属が印字されています。Steering Committeeには大学だけでなくMediaTek、Etron Technology、Socionext、Renesas、Samsung、ETRIといった企業・研究機関の所属が並び、産学が同じテーブルに載る運営であることが読み取れます。所属の所在地も台湾・中国・韓国・日本・マカオに広がっており、特定国に閉じた会議ではありません。日本からの関与を確認したい場合は、Steering Committeeの日本所属メンバーとTPC各subcommitteeの日本所属メンバーを見るのが早いです。なお以下はいずれも公式ページに印字された所属であって、個人の国籍ではありません。また、委員として掲載されていることは協賛・取引・共同研究のいずれも意味しません。","facts":[{"note":"Organizing Committeeページの掲載どおり。所属欄に国名の印字はない。","label":"2026 Organizing Committee","value":"Conference Chair: Lawrence Loh (MediaTek) / Organizing Committee Chair: Tsung-Heng Tsai (NYCU) / Organizing Committee Vice Chair: Po-Hung Chen (NYCU) / Secretary: Yi-Chung Wu (NYCU) / Treasurer: Yu-Te Liao (NYCU) / Publicity: Pei-Yun Tsai (NTU) / Publication: Ping-Hsuan Hsieh (NTHU) / Local Arrangement: Soon-Jyh Chang (NCKU) / TPC Liaison: Chia-Hsiang Yang (NTU)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/organizing-committee"},{"note":"Steering Committeeページの筆頭に掲載。","label":"Steering Committee Chair","value":"Zhihua Wang (Tsinghua University)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/steering-committee"},{"note":"掲載は運営委員としての参加を示すもので、協賛・取引・共同研究を意味するものではない。","label":"Steering Committeeの産業側所属","value":"Lawrence Loh (MediaTek)、Nicky Lu (Etron Technology)、Masaitsu Nakajima (Socionext)、Sugako Otani (Renesas)、Jongshin Shin (Samsung)、Bontae Koo (ETRI) が SC Members に掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/steering-committee"},{"note":"公式ページに印字された所属機関の所在地に基づく分類であり、個人の国籍ではない。","label":"Steering Committeeの日本所属メンバー","value":"Makoto Ikeda (The University of Tokyo)、Masaitsu Nakajima (Socionext)、Sugako Otani (Renesas)、Minoru Fujishima (Hiroshima University)。Advisorsに Tadahiro Kuroda (Keio University)、Takayasu Sakurai (The University of Tokyo)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/steering-committee"},{"note":"Steering Committeeページ上で \"Representative from SSCS\" と \"Liaison Members\" が別区分として置かれている。それぞれの枠の役割を説明する文章は同ページにない。","label":"SSCS代表とliaison","value":"Representative from SSCS: Woogeun Rhee (Sungkyunkwan University)、Liaison Members: Anantha Chandrakasan (MIT)、Bram Nauta (Twente University)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/steering-committee"},{"note":"Technical Program Committeeページに印字された所属機関名。所在地の分類はこちらで付したもので、ページ上に国名の印字はない。個人の国籍でもない。","label":"TPC所属機関の所在地の広がり","value":"subcommitteeメンバーの所属には台湾（NTHU, NTU, NCKU, NYCU, TSMC 等）、中国（Tsinghua University, Peking University, Fudan University, Zhejiang University, Southeast University, UESTC 等）、韓国（KAIST, POSTECH, Yonsei University, Samsung Electronics, ETRI, GIST, DGIST 等）、日本（The University of Tokyo, Hiroshima University, Kioxia Corporation, Renesas Electronics, Sony Semiconductor Solutions, Hitachi, National Institute of Advanced Industrial Science and Technology, Kobe University, Osaka University 等）、シンガポール（National University of Singapore, Institute of Microelectronics (A*STAR)）、マカオ（University of Macau）、インド（Indian Institute of Technology Delhi）、欧州（Eindhoven University of Technology, ETH Zurich, IMEC, STMicroelectronics, Fraunhofer EMFT, University College Dublin 等）、北米（University of Southern California, NC State University, University of Pittsburgh, University of Waterloo 等）が含まれる","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"Contactページの掲載どおり。\"Secretariat\" は見出しの語であり、個人の肩書としては \"Assistant, A-SSCC 2026\" と印字されている。","label":"2026 事務局窓口","value":"\"Secretariat Team\" の見出しの下に Mr. Yung-Ming Chiu（\"Assistant, A-SSCC 2026\"）が掲載され、担当範囲は \"For questions regarding registration, payment, invitation letters, venue, and general conference logistics.\" と記載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/contact"}],"title":"委員会構成と参加組織の所在国","eyebrow":"community"},"comparison":{"id":"comparison","body":"A-SSCCの位置づけは、IEEE SSCSが \"The Society financially sponsors five key conferences:\" として挙げる5会議の一覧を見ると対比できます。ISSCC、Symposium on VLSI Technology and Circuits、CICC、A-SSCC、ESSERCが同列に並んでおり、このうちA-SSCCがアジア、ESSERCが欧州を冠した会議です。原稿仕様の面では、A-SSCCは2ページ（＋補足図1ページ）という短い形式を採っているため、フルペーパー型の会議とは投稿準備の重さが大きく異なります。どの会議に出すかを決める際は、この一覧上の並びと、A-SSCCの区分構成（Industryが独立、FPGAが単独）を突き合わせるのが実務的です。なお、5会議の間の優劣や順位を示す記載は同ページにありません。","facts":[{"note":"IEEE SSCSの会議ページに掲載された区分。優劣や順位を示す記載はない。","label":"SSCSが財政スポンサーする5会議","value":"\"The Society financially sponsors five key conferences:\" として International Solid State Circuits Conference (ISSCC)、Symposium on VLSI Technology and Circuits、Custom Integrated Circuits Conference (CICC)、Asian Solid-State Circuits Conference (A-SSCC)、European Solid-State Electronics Research Conference (ESSERC) の5件が挙げられている","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"会議（five key conferences）とワークショップが区別されている。同ページにはtechnical cosponsorの一覧もさらに別枠で置かれている。","label":"SSCSが財政スポンサーする年次ワークショップ","value":"\"The Society also financially sponsors an annual workshop:\" として Chiplets Solution for Custom IC Design (CHISIC) が別枠で掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"同一ページ上の記載に基づく地域区分。","label":"地域の冠","value":"A-SSCCは \"held annually in different hubs of IC innovation in Asia\"、ESSERCは \"European Solid-State Electronics Research Conference\" と、それぞれアジア・欧州を冠している","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"他会議との比較はそれぞれの公式規定を各自で確認する必要がある。ここではA-SSCC側の数値のみを示す。","label":"原稿分量の違いを判断する材料","value":"A-SSCCの投稿原稿は2ページ＋補足図1ページ","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"}],"title":"SSCS系の他会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"A-SSCCの最大の特徴は原稿が2ページであることです。本文・図・表・参考文献をすべて2ページに収め、補足図のみ1ページ追加できるという形式なので、フルペーパー会議のつもりで書き始めると分量設計をやり直すことになります。ファイル仕様（A4またはUS Letter、PDF、5MB以内、フォント埋め込み、Type 3フォント回避、ページ番号なし、セキュリティ設定なし）は公式投稿システムのAuthor Informationに列挙されているので、投稿直前ではなく執筆開始時に一度読んでおくのが安全です。2026年サイクルは投稿締切を過ぎており、2026-08-05時点で著者アカウントは査読完了までロックされています。","facts":[{"note":"公式投稿システムのAuthor Information記載。トップページも \"two-page manuscripts, including figures, tables and references\" と \"one-page additional supplements with figures and figure captions\" として説明している。","label":"2026 原稿ページ数","value":"\"Paper 2 page manuscript plus 1 optional page for supplementary figures\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"同ページに \"Embed ALL fonts in your PDF file. Avoid the use of Type 3 fonts\"、\"Do NOT page number your paper\"、\"Do NOT apply security settings to your PDF file\" が併記されている。","label":"2026 ファイル仕様","value":"Paper Size: A4 (210mm X 297mm) または US Letter (8.5\" x 11\")、File Format: Adobe PDF (.pdf)、Allowed File Size: 5 MB","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"公式投稿システム上の表記。","label":"2026 投稿締切（投稿システム表記）","value":"\"Submission deadline: Jun 14, 2026 23:59 (UTC -0500)\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"同じ6月14日だが、時刻の基準表記が投稿システム（UTC -0500）と公式サイト（GMT）で異なる。","label":"2026 投稿締切（公式サイト表記）","value":"Important Datesは \"Paper Submission: June 03, 2026 June 14, 2026 20:00 (GMT)\" と当初日・延長後の日を併記し、本文に \"The submission deadline has been extended to June 14, 2026.\" と記載している","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"公式サイトのImportant Datesと投稿システムの双方に掲載。","label":"2026 採択通知","value":"Acceptance Notification: August 8, 2026（投稿システムでは \"Decision notification: Aug 8, 2026 23:59 (UTC -0500)\"）","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"公式サイトのImportant Dates記載。投稿システムのAuthor Informationにはcamera-ready締切の記載がない。","label":"2026 最終原稿（camera-ready）","value":"Final Paper Submission: August 31, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/"},{"note":"採択1件につき著者1名がfull conference rateで登録し、会議に出席して発表することが求められる。","label":"登壇・登録の義務","value":"\"One author per accepted submission must be registered at the full conference rate AND attend the conference to present their paper.\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"2026-08-05時点で確認。区分は技術領域（category / subcommittee）単位で示されている。","label":"投稿区分（regular / student / demo等）の細分","value":"regular・student・demo等の投稿区分を分けて説明する記載は、公式投稿システムのAuthor Informationにない","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"}],"title":"投稿区分・原稿仕様・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"A-SSCCのproceedingsはIEEE刊行でISBNが付き、DBLPのシリーズ索引にも各年の巻として登録されています。公式投稿システムには「発表しなかった採択論文をIEEE Xploreから削除する権利をIEEEが留保する」という文言があり、採択論文がIEEE Xploreで配信される前提であることがここから読み取れます。加えて、2023年回についてはIEEE Journal of Solid-State Circuits (JSSC) のspecial sectionのguest editorialがSSCSサイトに掲載されています。ただし2026年回について同様の特集が組まれるかどうかは、2026-08-05時点の公式ページに告知がありません。","facts":[{"note":"採択論文がIEEE Xploreで配信されること、および未発表の場合に除外されうることが同一文で述べられている。","label":"IEEE Xplore配信に関する公式文言","value":"\"IEEE reserves the right to exclude any accepted paper from distribution after the conference (including, removal from IEEE Xplore) if the accepted paper is not presented at the conference.\"","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"DBLPのA-SSCCシリーズ索引に印字された巻情報。刊行者はIEEE。","label":"proceedingsの刊行者とISBN（例：2024年回）","value":"\"IEEE Asian Solid-State Circuits Conference, A-SSCC 2024, Hiroshima, Japan, November 18-21, 2024. IEEE 2024, ISBN 979-8-3503-7632-6\"","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/asscc/index.html"},{"note":"Guest editorsはKen Takeuchi、Tetsuya Iizuka、Kazuko Nishimura、Jerald Yoo。特集への採録本数は同ページに記載がない。2026年回の特集の有無についても記載がない。","label":"JSSC special section（2023年回）","value":"IEEE Journal of Solid-State Circuits に \"Guest Editorial: Introduction to the Special Section on the 2023 Asian Solid-State Circuits Conference (A-SSCC)\" が掲載（Page(s): 3119 – 3122、DOI: 10.1109/JSSC.2024.3435268、25 September 2024）","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/guest-editorial-introduction-to-the-special-section-on-the-2023-asian-solid-state-circuits-conference-a-sscc/"},{"note":"Organizing Committeeページに掲載された役職名と所属。","label":"2026 Publication担当","value":"Publication: Ping-Hsuan Hsieh (NTHU)","checkedAt":"2026-08-05","sourceUrl":"https://www.a-sscc2026.org/organizing-committee"},{"note":"2026-08-05時点で確認。","label":"公開範囲（open access等）","value":"proceedingsをopen accessで公開するかどうかを示す記載は、2026年サイクルの公式投稿システムのAuthor Informationにない","checkedAt":"2026-08-05","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"}],"title":"proceedingsの掲載先とジャーナル特集","eyebrow":"publication"}},"sources":[{"url":"https://www.a-sscc2026.org/","role":"official","label":"IEEE A-SSCC 2026 公式サイト トップページ","checkedAt":"2026-08-05","evidenceLocator":"テーマ \"I C the Future of AI\"、会議の説明文、Important Dates（Paper Submission / Acceptance Notification / Final Paper Submission）と延長の告知文、\"Papers are solicited in the following categories:\" の10区分、横断的観点の一文、特別プログラムの説明文、ページ下部の \"Conference Organizers\"（IEEE / IEEE Solid-State Circuits Society / National Yang Ming Chiao Tung University）、ナビゲーションのリンク先URL。"},{"url":"https://www.a-sscc2026.org/venue-for-the-conference","role":"venue","label":"A-SSCC 2026 Venue for the Conference","checkedAt":"2026-08-05","evidenceLocator":"会場名 The Lin Hotel Taichung（台中林酒店）と住所 No. 99, Chaofu Road, Xitun District, Taichung City, Taiwan。会期・開催形式の記載がないことも同ページで確認。"},{"url":"https://www.a-sscc2026.org/organizing-committee","role":"committee","label":"A-SSCC 2026 Organizing Committee","checkedAt":"2026-08-05","evidenceLocator":"Conference Chair以下9役職の氏名と所属を並べた表。所属欄に国名の印字はない。"},{"url":"https://www.a-sscc2026.org/technical-program-committee","role":"committee","label":"A-SSCC 2026 Technical Program Committee","checkedAt":"2026-08-05","evidenceLocator":"TPC Chair / Co-Chair / Vice-Chairの記載と、10のsubcommittee見出し（ACS, DC, DCS, SISP, RF & Wireless, ETA, MEM, FPGA, Industry, WLN）およびそれぞれのChair・メンバーの所属一覧。out of scopeの記載がないことも同ページで確認。"},{"url":"https://www.a-sscc2026.org/steering-committee","role":"committee","label":"A-SSCC 2026 Steering Committee","checkedAt":"2026-08-05","evidenceLocator":"Chair、SC Members、Advisors、Representative from SSCS、Liaison Membersの各区分と、氏名・所属の並び。"},{"url":"https://www.a-sscc2026.org/accommodation-for-the-conference","role":"venue","label":"A-SSCC 2026 Accommodation for the Conference","checkedAt":"2026-08-05","evidenceLocator":"The Lin Hotel（\"The official venue for the A-SSCC 2026\"、\"Conference Venue (0 min)\"）および近隣4ホテルの名称と \"From US$ ... per night\" の目安価格（US$ 120〜180）。"},{"url":"https://www.a-sscc2026.org/visa-information","role":"official","label":"A-SSCC 2026 Visa Information","checkedAt":"2026-08-05","evidenceLocator":"台湾のビザ免除要件と対象国一覧（\"90 days\" 区分に Japan を含む）。会期の日付が記載されていないことも同ページで確認。"},{"url":"https://www.a-sscc2026.org/contact","role":"official","label":"A-SSCC 2026 Contact","checkedAt":"2026-08-05","evidenceLocator":"\"Secretariat Team\" の Mr. Yung-Ming Chiu（Assistant, A-SSCC 2026）と \"Technical Program Committee\" の Dr. JungHwan Choi（TPC Chair）の担当範囲の説明文。回数表記がないことも同ページで確認。"},{"url":"https://www.a-sscc2026.org/under-construction","role":"program","label":"A-SSCC 2026 Under Construction（Program / Registration / Sponsorship 共通）","checkedAt":"2026-08-05","evidenceLocator":"Agenda、Keynotes、Invited Talks、Registration、Sponsorshipが未公開であることを示すページ本体とナビゲーション。公開時期の告知がないことも確認。"},{"url":"https://www.a-sscc2026.org/taiwan-information","role":"official","label":"A-SSCC 2026 Taiwan Information","checkedAt":"2026-08-05","evidenceLocator":"台湾および交通に関する案内。会期の日付が記載されていないことを確認。"},{"url":"https://www.a-sscc2026.org/agenda-for-the-tpc-meeting","role":"committee","label":"A-SSCC 2026 Agenda for the TPC Meeting（パスワード保護）","checkedAt":"2026-08-05","evidenceLocator":"\"SC/TPC/OC Members Only\" の表示と \"Please enter the access password provided by the A-SSCC 2026 OC committee.\" の文言。"},{"url":"https://www.a-sscc2026.org/registration-for-the-tpc-meeting","role":"registration","label":"A-SSCC 2026 Registration for the TPC Meeting（パスワード保護）","checkedAt":"2026-08-05","evidenceLocator":"\"SC/TPC/OC Members Only\" 表記とパスワード入力欄。"},{"url":"https://www.a-sscc2026.org/venue-for-the-tpc-meeting","role":"venue","label":"A-SSCC 2026 Venue for the TPC Meeting","checkedAt":"2026-08-05","evidenceLocator":"Wyndham Sun Moon Lake（日月潭力麗溫德姆溫泉酒店）の名称と住所 No. 312, Zhongzheng Rd., Yuchi Township, Nantou County, Taiwan。日程の記載がないことも確認。"},{"url":"https://epapers2.org/asscc2026/ESR/authorinfo1.php","role":"cfp","label":"A-SSCC 2026 公式投稿システム Author Information","checkedAt":"2026-08-05","evidenceLocator":"Submission deadline / Decision notification の日時、原稿ページ数、Paper Size・Fonts・File Format・Allowed File Sizeの各項目、登壇と登録の義務、IEEE Xploreからの除外に関する記載。camera-ready締切・投稿区分・採択率・査読方式・open accessの記載がないことも確認。"},{"url":"https://epapers2.org/asscc2026/","role":"official","label":"A-SSCC 2026 公式投稿システム ログインページ","checkedAt":"2026-08-05","evidenceLocator":"Submission deadline / Deadline for ASSCC 2026 review submission / Decision notification の3つの日時表示、\"The review phase is now in PROGRESS\"、および \"Author Submissions are now CLOSED. Author account access is LOCKED until completion of the review phase.\" の表示。"},{"url":"https://sscs.ieee.org/conferences","role":"society","label":"IEEE Solid-State Circuits Society 会議一覧","checkedAt":"2026-08-05","evidenceLocator":"\"The Society financially sponsors five key conferences:\" の5件の並び、\"The Society also financially sponsors an annual workshop:\"（CHISIC）、technical cosponsorの一覧、およびA-SSCCの説明文 \"Founded as recently as 2005 and held annually in different hubs of IC innovation in Asia...\"。"},{"url":"https://sscs.ieee.org/guest-editorial-introduction-to-the-special-section-on-the-2023-asian-solid-state-circuits-conference-a-sscc/","role":"society","label":"IEEE SSCS: Guest Editorial – Special Section on the 2023 A-SSCC","checkedAt":"2026-08-05","evidenceLocator":"掲載誌名 IEEE Journal of Solid-State Circuits、ページ 3119–3122、DOI 10.1109/JSSC.2024.3435268、日付 \"25 September 2024\"、guest editors 4名の氏名。"},{"url":"https://dblp.org/db/conf/asscc/index.html","role":"bibliographic","label":"DBLP: A-SSCC シリーズ索引","checkedAt":"2026-08-05","evidenceLocator":"2011年から2024年までの12巻のタイトル行（会議名・開催都市・国・会期・刊行者IEEE・ISBN）。2013年・2022年・2025年および2010年以前の巻はこの索引に掲載されていない。"},{"url":"https://www.a-sscc2026.org/registration","role":"registration","label":"A-SSCC 2026 Registration（会期・会場）","checkedAt":"2026-10-14","evidenceLocator":"第22回、2026年11月1〜4日、The Lin Hotel, Taichung, Taiwanの案内。"},{"url":"https://epapers2.org/asscc2026/ESR/session_sched_view.php?sched_id=1","role":"program","label":"A-SSCC 2026 Lecture Session Schedule","checkedAt":"2026-10-14","evidenceLocator":"日付・部屋別のlecture session schedule。"}],"summary":"A-SSCCは、IEEE Solid-State Circuits Society（SSCS）が財政的に支援する主要会議の一つで、アジア各地のIC innovation hubを巡回して開催されます。第22回A-SSCC 2026は2026年11月1〜4日に台湾・台中のThe Lin Hotelで開かれ、公式講演日程も公開されています。このページでは、2ページ原稿、6月14日の投稿締切、8月8日の採択通知、10の投稿区分、TPC構成、IEEE Xploreに関する公式文言を確認できます。採択率と投稿件数、開催形式は、今回確認した資料では確認できません。","topics":[{"note":"\"Paper 2 page manuscript plus 1 optional page for supplementary figures\" と規定され、A4またはUS LetterのPDF・5MB以内。","label":"2ページ原稿（＋補足図1ページ）","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"ACS / DC / DCS / SISP / RF & Wireless / ETA / MEM / FPGA / Industry / WLN の10 subcommitteeが公式サイトに印字されている。","label":"10のTechnical Track","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"Industry subcommittee のChairはStefan Rusu (TSMC)。産業側の区分が技術領域と並列に置かれている。","label":"Industryトラックの独立設置","sourceUrl":"https://www.a-sscc2026.org/technical-program-committee"},{"note":"未発表の採択論文をIEEE Xploreから削除する権利をIEEEが留保する旨が明記されている。","label":"IEEE Xplore配信と発表義務の連動","sourceUrl":"https://epapers2.org/asscc2026/ESR/authorinfo1.php"},{"note":"2023年回についてIEEE Journal of Solid-State Circuitsのspecial sectionのguest editorialがSSCSサイトに掲載されている。2026年回の特集の有無は未告知。","label":"JSSC special sectionへの展開","sourceUrl":"https://sscs.ieee.org/guest-editorial-introduction-to-the-special-section-on-the-2023-asian-solid-state-circuits-conference-a-sscc/"},{"note":"SSCSは \"held annually in different hubs of IC innovation in Asia\" と記載。DBLPには韓国・日本・台湾・中国での開催巻が並ぶ。","label":"アジア域内の巡回開催","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"The Lin Hotel Taichung（No. 99, Chaofu Road, Xitun District, Taichung City, Taiwan）。会期は未公表。","label":"2026年サイクルの会場（台中）","sourceUrl":"https://www.a-sscc2026.org/venue-for-the-conference"},{"note":"2026年サイクルのトップページに掲げられたテーマ。","label":"テーマ \"I C the Future of AI\"","sourceUrl":"https://www.a-sscc2026.org/"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"S","publicReason":"IEEE SSCSが支えるアジアの集積回路の主要会議で、産業向けプログラムも持つ。10の技術分野で実測チップを推奨し、選抜論文はJSSCとSSC-Lの特集号へ進む。"},"industryTrend":{"publicBand":"moderate"},"researchOrientation":{"value":"mixed","populationLabel":"135 technical-session presentation rows / official A-SSCC 2025 Advanced Program","populationRows":135,"populationCoverage":1},"geographicReach":{"publicBand":"international","cycleWindow":[2026],"primaryLane":"program_first_listed_affiliation","programMetrics":{"outsideHostCountryShare":0.963,"outsideHostMacroRegionShare":0.0741,"topCountryShare":0.4815,"distinctKnownCountries":9,"effectiveCountryCount":4.2038,"meaningfulMacroRegionCount":2,"knownCountryCoverage":1,"populationCoverage":1}},"fieldPlacements":[{"fieldId":"circuits-systems","subfieldId":"integrated-circuits-systems-design","industryPriorityClass":"specialist","academicPriorityClass":"supplementary","eligibleUniverseSize":7,"ordinalEligible":false,"rankStable":false,"industryOrdinalEligible":false,"academicOrdinalEligible":false,"industryRankStable":false,"academicRankStable":false,"assignmentStatus":"reviewed","assignmentSourceUrl":"https://www.a-sscc2026.org/","assignmentSourceLocator":"Paper Submission > Papers are solicited in the following categories > Regular Sessions; 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Center）で開かれます。","question":"ICPT 2026はいつ、どこで開かれますか？","sourceUrls":["https://www.icpt2026.org/welcome.html","https://www.icpt2026.org/venue.html"]},{"answer":"CMPと平坦化技術に絞った10トピックで、配線金属CMP、先端パッケージ・3D integrationのCMP、post-CMP洗浄、AI・ML、消耗材、サステナビリティなどが挙がっています。","question":"どんな分野の発表がありますか？","sourceUrls":["https://www.icpt2026.org/abstracts.html"]},{"answer":"abstractは5月31日締切が6月14日に延長され、採否通知は7月10日、extended abstractは9月5日締切でした。","question":"2026年の投稿締切はいつでしたか？","sourceUrls":["https://www.icpt2026.org/submission.html","https://www.icpt2026.org/"]},{"answer":"extended abstractはすべてconference proceedingsに収録され、登録・支払い済みの参加者が閲覧できます。発表と収録には登録料の支払いが必要です。","question":"発表はproceedingsに載りますか？","sourceUrls":["https://www.icpt2026.org/submission.html"]},{"answer":"KAISTのJoungho Kim氏、SK hynixのDongkyun Kim氏、Samsung ElectronicsのHoyoung Kim氏の3名です。","question":"keynoteは誰ですか？","sourceUrls":["https://www.icpt2026.org/keynote.html"]},{"answer":"10月19日に終日のTutorial Programがあり、CMP equipment、化学的側面、post-CMP洗浄、AI-assisted CMPの講義が含まれます。","question":"初心者向けの講座はありますか？","sourceUrls":["https://www.icpt2026.org/tutorial.html"]}],"headline":"ICPT 2026は2026年10月19日〜22日に韓国ソウルのScience and Technology Convention Center（ST Center）で開かれ、初日は終日のtutorialです。","metaDescription":"ICPT（International Conference on Planarization/CMP Technology）について、ICPT 2026のソウル会期、10の投稿トピック、abstractとextended abstractの締切、tutorial、keynote、委員会と出展企業を公式ページから整理しました。","oneLine":"ICPTは、Chemical Mechanical Polishing（CMP）をはじめとする平坦化技術を専門に扱う国際会議で、配線金属のCMP、先端パッケージやhybrid bondingのCMP、post-CMP洗浄、スラリーやパッドなどの消耗材を研究者と業界が議論します。","pageTitle":"ICPTとは｜CMP（化学機械研磨）と平坦化技術の国際会議（2026年はソウル）","relatedConferenceIds":["ecs-meeting","mnc","spie-advanced-etch","iedm","vlsi"],"sections":{"cycle":{"id":"cycle","body":"ICPT 2026は2026年10月19日〜22日の4日間で、会場はソウル市江南区のScience and Technology Convention Center（ST Center）です。10月19日はtutorialで、展示はST CenterのB1Fで10月20日から22日の13:00まで開かれます。","facts":[{"label":"2026 会期・都市","value":"2026-10-19〜22 / Seoul, South Korea","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/welcome.html"},{"label":"2026 会場","value":"Science and Technology Convention Center (ST Center), 22, Teheran-ro 7-gil, Gangnam-gu, Seoul","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/venue.html"},{"label":"2026 展示会場・期間","value":"ST Center B1F、10月20日〜22日（22日は13:00まで）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/exhibitors.html"},{"label":"2026 Early Bird登録締切","value":"2026-08-31","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/"},{"label":"2026 program表の版","value":"2026年9月30日時点","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/programglance.html"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"Call for AbstractsはCMPとその他の平坦化技術を対象に、10のトピックを挙げています。配線金属のCMP（トピック01）、hybrid Cu bondingやBSPDN、wafer thinningを含む先端パッケージ・3D integrationのCMP（03）、post-CMP洗浄と欠陥（04）、AI・MLによるプロセス制御（05）、スラリーやパッドなどの消耗材（07）、サステナビリティ（10）が並びます。","facts":[{"label":"2026 対象技術","value":"Chemical Mechanical Polishing（CMP）とその他の平坦化技術","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/abstracts.html"},{"label":"2026 トピック01","value":"Advanced Interconnect CMP (Metal)","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/abstracts.html"},{"label":"2026 トピック03","value":"Advanced Packaging / 3D Integration CMP (Hybrid Cu Bonding, BSPDN, Wafer Thinning)","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/abstracts.html"},{"label":"2026 トピック04","value":"Post-CMP Cleaning / Defect Engineering","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/abstracts.html"},{"label":"2026 トピック05","value":"AI & ML for CMP / Process Control","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/abstracts.html"},{"label":"2026 トピック07","value":"CMP Consumables (Slurry, Abrasive, Pad, Conditioner, Filter 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Ceremony","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/programglance.html"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"ICPTは開催国と運営団体が年ごとに変わり、2026年は韓国（Korea CMP UGMの会長がConference Chair）での開催です。extended abstractのページ数は、現行ページでは「4-page for oral presenters and poster presenters」と1文の中で区別が欠けた表記になっています。採択率は公表されていません。","facts":[{"label":"2026 extended abstractのページ数表記","value":"Extended Abstracts, including figures and references, will be limited to 4-page for oral presenters and poster presenters","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/submission.html"}],"title":"注意点","eyebrow":"caveats"},"program":{"id":"program","body":"10月19日09:15〜17:55のTutorial ProgramはInternational Conference Hall（B1F）で開かれ、Applied MaterialsのSukbae Joo氏がCMP equipmentの入門、Hanyang UniversityのTaegon Kim氏がpost-CMP洗浄の基礎を担当します。Session 2は「The \"C\" in CMP: Chemical Aspects of Planarization」で、AI-assisted CMPの事例紹介もあります。keynoteはKAISTのJoungho Kim氏、SK hynixのDongkyun Kim氏、Samsung ElectronicsのHoyoung Kim氏の3名です。Oral Session 7はPost-CMP Cleaning / Defect Engineeringで、Diamond sponsorのLevitronix、Qnity Electronics、Hubei Dinglongによるluncheon keynoteもあります。発表時間はkeynote 30分、invited 25分、一般口頭20分（いずれも質疑5分込み）です。","facts":[{"label":"2026 Keynote Speaker 1","value":"Joungho Kim（KAIST, Korea）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/keynote.html"},{"label":"2026 Keynote Speaker 2","value":"Dongkyun Kim（SK hynix, Korea）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/keynote.html"},{"label":"2026 Keynote Speaker 3","value":"Hoyoung Kim（Samsung Electronics Co., Ltd.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/keynote.html"},{"label":"2026 Tutorial Program","value":"10月19日 09:15-17:55、International Conference Hall（B1F）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/tutorial.html"},{"label":"2026 Tutorial講師（装置）","value":"Sukbae Joo（Applied Materials）、Introduction to CMP 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Planarization","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/tutorial.html"},{"label":"2026 Tutorial（洗浄）","value":"Fundamentals of Post-CMP Cleaning（Taegon Kim, Hanyang Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/tutorial.html"},{"label":"2026 Tutorial（AI）","value":"AI-assisted CMP: A Case-based Introduction","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/tutorial.html"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Conference on Planarization/CMP Technologyです。2026年のConference ChairのSangwoo Lim氏（Yonsei University）はKorea CMP UGMのPresidentとしてWelcome Messageを書いています。事務局は韓国大田のGenicom, Co., Ltd.が務めます。","facts":[{"label":"正式名称","value":"International Conference on Planarization/CMP Technology（ICPT 2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/welcome.html"},{"label":"2026 Conference Chair","value":"Sangwoo Lim（Yonsei Univ., Korea）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"},{"label":"2026 Conference Chairの所属団体","value":"President of Korea CMP UGM","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/welcome.html"},{"label":"2026 事務局","value":"Genicom, Co., Ltd.（大田）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/"},{"label":"2026 Organizing Committee Chairs","value":"Jin-Goo Park（Hanyang Univ.）／Taesung Kim（Sungkyunkwan Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"}],"title":"名称・運営","eyebrow":"identity"},"community":{"id":"community","body":"Organizing Committee ChairsはHanyang UniversityのJin-Goo Park氏とSungkyunkwan UniversityのTaesung Kim氏です。Executive Committeeには日本のKyushu UniversityとKIOXIA、欧州のimecとFraunhofer ENAS、Program Committeeには米国のIntelとEntegrisの所属者が入っています。Industry Committee ChairはG&P TechnologyのHaedo Jeong氏で、委員にはSamsung Electronics、SK hynix、KC Tech、EBARA、Applied Materials、Qnity、3Mが並びます。展示には3M、RESONAC、Qnity Electronics、EBARA、FUJIFILM Electronic Materials Koreaなどが出展しています。","facts":[{"label":"2026 Executive Committee（日本）","value":"Syuhei Kurokawa（Kyushu Univ.）、Takashi Watanabe（KIOXIA Corp.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"},{"label":"2026 Executive Committee（欧州）","value":"Patrick Ong（imec）、Knut Gottfried（Fraunhofer ENAS）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"},{"label":"2026 Program Committee（米国の例）","value":"Mark Buehler（Intel）、Don Frye（Entegris）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"},{"label":"2026 Industry Committee Chair","value":"Haedo Jeong（G&P Technology, Korea）","checkedAt":"2026-10-08","sourceUrl":"https://www.icpt2026.org/committees.html"},{"label":"2026 Industry Committee Members（例）","value":"Samsung Electronics、SK hynix、KC Tech、EBARA、Applied 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HEMTの高電圧オフ状態での信頼性劣化機構の調査があります。ポスターセッションは27件です。","facts":[{"label":"2026 招待講演（Infineon）","value":"Mattia Capriotti: GaN Bidirectional Switches: The New Frontier","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/program"},{"label":"2026 招待講演（imec）","value":"Aurelien Gauthier-Brun: GaN power platform for applications up to 100V","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/program"},{"label":"2026 招待講演（Nagoya University）","value":"Manabu Arai: Research Activities on Wide Bandgap Semiconductors (GaN, SiC, AlN) at Nagoya University","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/"},{"label":"2026 招待講演（FBH Berlin）","value":"Oliver Hilt: Gallium oxide-based high-voltage transistors towards power switching","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/program"},{"label":"2026 ポスター件数","value":"27件","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/program"},{"label":"2026 一般講演の例","value":"Investigation of High-Voltage Off-State 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Microsystemsで、2026年は第16回にあたります。運営はSlovak University of Technology in Bratislava（STU）とSK Chipsのメンバーで構成するLocal Organising Committeeが担い、Conference OfficeはFEI STUに置かれています。","facts":[{"label":"2026 正式名称・回次","value":"ASDAM 2026 - 16th International Conference on Advanced Semiconductor Devices and Microsystems","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/"},{"label":"2026 Local Organising Committee（大学側）","value":"Slovak University of Technology in Bratislava, Slovakia","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/committees"},{"label":"2026 Local Organising Committee（SK Chips）","value":"SK Chips（Dr. Michal Mičjan / Peter Porubský）","checkedAt":"2026-10-08","sourceUrl":"https://www.asdam.sk/committees"},{"label":"2026 General Chair","value":"doc. 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It does not assert customer, procurement, funding, hiring, or collaboration relationships.","rows":[{"role":"Official sponsor logo","tier":"Sponsor","organization":"CenBrain","organizationType":"Company"},{"role":"Official sponsor logo label","tier":"Sponsor","organization":"test (official logo label)","organizationType":"Unknown"},{"role":"Official sponsor logo","tier":"Sponsor","organization":"EMSI","organizationType":"University"},{"role":"Official partner logo","tier":"Partner","organization":"Power Chapter (official logo label)","organizationType":"Professional society"},{"role":"Official partner logo label","tier":"Partner","organization":"315886544_6004675926223685_6007290771535283060_n (official logo label)","organizationType":"Unknown"},{"role":"Official partner logo","tier":"Partner","organization":"CAS Egypt","organizationType":"Professional society"}],"label":"ICECS 2025 official sponsors and partners","sourceUrl":"https://ieee-icecs2025.org/","sourceStatus":"official_completed_cycle_reviewed","denominatorLabel":"6 official sponsor and partner logo listing rows"}},"city":"Thessaloniki","tier":"a","venue":"Thessaloniki, Greece","country":"Greece","fieldId":"circuits-systems","editions":[],"genreIds":["circuits"],"processes":[{"id":"prc_a6f22e1b038f4c418b05dd9f3360ff02","nameJa":"テスト","primary":true},{"id":"prc_ac264d77acda429da53333b77345f2c7","nameJa":"EDA（電子設計自動化）・PDK（プロセス設計キット）・IP（設計資産）開発","primary":false},{"id":"prc_68c07e3f7bcd46508d80e56a7116cbb7","nameJa":"信頼性評価","primary":false}],"cycleLabel":"2026-11-08〜2026-11-11 / Thessaloniki, Greece","fieldTitle":"回路 / システム / 設計自動化","organizers":[{"id":"org_6c65771310634113ac954c8c54b8e2f9","name":"IEEE Circuits and Systems 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Technologiesの特集号へ投稿するよう招待されます。","question":"ジャーナルへの拡張投稿の機会はありますか。","sourceUrls":["https://www.icecs2026.gr/authors-relevant-info/"]},{"answer":"2025年の第32回はモロッコのMarrakechで11月17〜19日に開かれました。","question":"前回はどこで開かれましたか。","sourceUrls":["https://ieee-cas.org/event/conference/2025-ieee-32nd-international-conference-electronics-circuits-and-systems"]}],"headline":"第33回のICECS 2026は2026年11月8〜11日にギリシャのThessaloniki（The Met Hotel）で開かれ、初日はチュートリアルに充てられます。","metaDescription":"IEEE ICECSの主催とIEEE CASSでの位置づけ、第33回ThessalonikiでのICECS 2026会期、4ページ投稿とEasyChair・PDF eXpress、IEEE Xplore収録条件、対象トピック、委員会構成を公式ページからまとめます。","oneLine":"IEEE ICECSは、IEEE Circuits and Systems Society（CASS）がRegion 8（欧州・アフリカ・中東）で毎年開く、回路とシステムの国際会議です。","pageTitle":"IEEE ICECSとは｜IEEE CASSがRegion 8で毎年開く回路・システム国際会議","relatedConferenceIds":["iscas","ieee-apccas","ieee-mwscas","glsvlsi","isvlsi","vlsi-soc"],"sections":{"cycle":{"id":"cycle","body":"2026年回は11月8〜11日にギリシャのThessalonikiで開かれ、会場はThe Met Hotelです。初日はチュートリアルに充てられます。早期登録の締切は9月18日でした。","facts":[{"label":"2026 会期・都市","value":"2026-11-08〜11 / Thessaloniki, Greece","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/"},{"label":"2026 会場","value":"The Met Hotel（26is Oktovriou 48, Thessaloniki）","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/venue/"},{"label":"2026 初日の構成","value":"初日はチュートリアル","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/"},{"label":"2026 早期登録締切","value":"2026-09-18","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/important-dates/"},{"label":"2026 IEEE Region","value":"Region 08 (Africa, Europe, Middle East)","checkedAt":"2026-10-08","sourceUrl":"https://ieee-cas.org/event/conference/2026-ieee-33rd-international-conference-electronics-circuits-and-systems"}],"title":"開催サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年のTopicsページは分野を「include, but are not limited to」として挙げています。アナログ・ミックスドシグナル・RF、EDA・テスト・信頼性、AIアルゴリズム向け回路とAIによる回路設計、エネルギーハーベスティング・電源管理、VLSIなどが含まれます。","facts":[{"label":"2026 トピックの書き方","value":"列挙は例示（not limited to）","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（アナログ）","value":"Analog/mixed signal/RF circuits","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（EDA）","value":"EDA, Test and Reliability","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（AI向け回路）","value":"Circuits and Systems for AI Algorithms","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（AIによる設計）","value":"AI-driven Circuit Design","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（電源）","value":"Energy Harvesting and Power Management","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"},{"label":"2026 トピック（VLSI）","value":"VLSI Systems and Applications","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/topics/"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"公式ページが示す手続きは、IEEEテンプレートと規則への適合、IEEE CrossCheck Portalによる剽窃チェック、著者1名による発表です。剽窃チェックは全採択論文にIEEE方針に従って行われます。","facts":[{"label":"剽窃チェック","value":"全採択論文をIEEE方針に従い確認","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/authors-relevant-info/"},{"label":"チェックの手段","value":"IEEE CrossCheck Portal","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/authors-relevant-info/"},{"label":"収録条件（書式）","value":"IEEEテンプレートと規則への適合","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/submissions/"},{"label":"収録条件（発表）","value":"著者1名による発表","checkedAt":"2026-10-08","sourceUrl":"https://www.icecs2026.gr/submissions/"}],"title":"査読・採択","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年の締切は延長が重なり、Important Datesページには論文締切が5月25日→6月8日→6月15日、通知が7月25日→7月31日と取り消し線付きで並びます。公式Call for Papers 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Technologies","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs.org/meetings-events/annual-meetings/2026-mrs-fall-meeting/call-for-abstracts"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"MRS Meetingのシンポジウムは研究者が提案・運営し、Poster Spotlightの発表もSymposium Organizersが選びます。ポスターにはBest Poster Awardの審査があり、午後4時までに掲示したポスターが対象です。","facts":[{"label":"シンポジウムの企画者","value":"研究者がシンポジウムを提案・運営（2026 Meeting Chair Yue Qiの言葉）","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs.org/meetings-events/annual-meetings/2026-mrs-fall-meeting"},{"label":"2026 Poster Spotlight の選定","value":"Symposium Organizersが選定","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs.org/meetings-events/annual-meetings/2026-mrs-fall-meeting/meeting-guidelines/presenter-guidelines"},{"label":"2026 Best Poster 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プロセス統合","organizers":[],"lastVerified":"2026-09-13","currentCycleEnd":"2026-11-19","abstractDeadline":"2026-06-17","acceptanceNotice":"2026-07-24","lateNewsDeadline":"2026-09-18","peerReviewStatus":"peer-reviewed","currentCycleStart":"2026-11-16","finalPaperDeadline":"2026-08-28","canonicalId":"conf_9a36384a0d2e40049444c37d0641cec1","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"sensor-micromachine-symposium","confidenceScore":1,"coverage":{"faqCount":6,"factCount":60,"topicCount":6,"sourceCount":11,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年11月16日〜19日に、島根県松江市のくにびきメッセで開かれます。16日〜18日がテクニカルセッション、19日がテクニカルツアーです。","question":"第43回センサシンポジウムはいつ、どこで開かれますか？","sourceUrls":["https://sensorsymposium.org/"]},{"answer":"一般講演はA4・2ページの発表概要を論文委員会が査読して採否を決めます。採択後は、2〜6ページの講演論文を提出します。","question":"査読はありますか？","sourceUrls":["https://sensorsymposium.org/cfp/"]},{"answer":"協力・協賛学協会の会員や非会員も発表できます。五十嵐賞などの賞の選考対象になるには、申込時点で電気学会の会員（申請中を含む）である必要があります。","question":"電気学会の会員でなくても発表できますか？","sourceUrls":["https://sensorsymposium.org/cfp/"]},{"answer":"使用言語は日本語または英語です。","question":"英語で発表できますか？","sourceUrls":["https://sensorsymposium.org/cfp/"]},{"answer":"著作権を原則どおり電気学会に譲渡した講演論文は、IEEJ Digital Libraryに掲載されます。電気学会以外へ譲渡した場合はIEEJ Digital Libraryに載らず、電気学会論文誌Eへの同時投稿もできません。","question":"講演論文はどこに掲載されますか？","sourceUrls":["https://sensorsymposium.org/cfp/"]},{"answer":"センサシンポジウムに参加登録すると、同時に開かれるマイクロ・ナノ工学シンポジウム、集積化MEMSシンポジウム、化学とマイクロ・ナノシステム学会の第54回研究会にも参加できます。","question":"併催の学会行事も聴講できますか？","sourceUrls":["https://sensorsymposium.org/regist/"]}],"headline":"第43回は2026年11月16日〜19日に島根県松江市のくにびきメッセで開かれ、日本機械学会・応用物理学会・化学とマイクロ・ナノシステム学会の催しと合同で「Future Technologies from MATSUE」として行われます。","metaDescription":"第43回「センサ・マイクロマシンと応用システム」シンポジウム（2026年11月16日〜19日・くにびきメッセ）の会期、4学会合同のFuture Technologies from MATSUE、8つの募集分野、A4・2ページの発表概要の査読、速報ポスター、講演論文の著作権、1981年からの開催地を公式サイトから整理しました。","oneLine":"「センサ・マイクロマシンと応用システム」シンポジウムは、電気学会センサ・マイクロマシン部門（E部門）が毎年開く部門大会で、センサとMEMSの研究発表を集めます。","pageTitle":"センサシンポジウムとは｜電気学会E部門のセンサ・MEMS部門大会（第43回は松江・2026年11月）","relatedConferenceIds":["transducers","mems","ieee-sensors","powermems","jsap-spring-autumn"],"sections":{"cycle":{"id":"cycle","body":"第43回は2026年11月16日〜19日に、島根県松江市のくにびきメッセで開かれます。11月16日〜18日がテクニカルセッション、19日がテクニカルツアーです。松江での開催は2010年と2014年に続いて3回目です。次回SS44の実行委員長には立命館大学の小西聡氏が決まっています。","facts":[{"label":"2026 会期","value":"2026-11-16〜19（16〜18日テクニカルセッション、19日テクニカルツアー）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/"},{"label":"2026 会場","value":"くにびきメッセ（島根県松江市）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/wp-content/uploads/FT_MATSUE_2026_Program_261005.pdf"},{"label":"松江での開催実績","value":"2010年、2014年","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/"},{"label":"2026 プログラム公開・予稿集公開","value":"プログラム 2026-10-09 / 予稿集 2026-11-09","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"SS44 実行委員長","value":"小西 聡（立命館大学）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/committee/"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年の発表募集分野は、設計・製作技術・材料、マイクロナノシステム、センサ・アクチュエータシステム、フィジカルセンサ、ケミカルセンサ、バイオセンサ、バイオマイクロナノシステム、センサマイクロシステム実装技術の8つです。分野キーワードには集積化MEMS技術、CMOS-MEMS、真空パッケージ技術、慣性センサ・圧力センサなどが並びます。","facts":[{"label":"2026 募集分野","value":"設計・製作技術，材料 / マイクロナノシステム / センサ・アクチュエータシステム / フィジカルセンサ / ケミカルセンサ / バイオセンサ / バイオマイクロナノシステム / センサマイクロシステム実装技術","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"分野1 キーワード（例）","value":"加工・プロセス技術、パッケージング技術、集積化MEMS技術、信頼性評価技術","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"分野2 キーワード（例）","value":"CMOS-MEMS、マイクロナノシステムパッケージング技術、真空パッケージ技術、量子デバイス応用","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"分野3 キーワード（例）","value":"機械学習連携（Edge AIなど）、デジタルツイン、IoT/ロボティクス応用","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"分野4 キーワード（例）","value":"慣性センサ・圧力センサ・ひずみセンサ、温度センサ、電気・磁気センサ、光センサ","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"一般講演は、発表概要を論文委員会が査読して採否を決めます。CFPは審査観点として独創性と有用性を挙げています。賞は五十嵐賞、奨励賞、最優秀技術論文賞、優秀技術論文賞、優秀ポスター発表賞で、選考対象になるには申込時点で電気学会の会員である必要があります。論文委員長は豊橋科学技術大学の永井萌土氏です。","facts":[{"label":"2026 査読方式","value":"発表概要を論文委員会が査読して採否を決定","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"2026 審査観点","value":"独創性・有用性","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"2026 表彰","value":"五十嵐賞、奨励賞、最優秀技術論文賞、優秀技術論文賞、優秀ポスター発表賞","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"2026 論文委員長","value":"永井 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Matsue」","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/program/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"過去のシンポジウムページでは、第1回が1981年6月18日〜19日に茨城県つくば市の工業技術院筑波研究センターで開かれています。第41回は2024年11月に仙台国際センター、第42回は2025年11月にライトキューブ宇都宮です。2020年の第37回（熊本予定）と2021年の第38回（姫路予定）は、オンライン開催に切り替えています。","facts":[{"label":"第1回","value":"1981-06-18〜19 / 工業技術院筑波研究センター（茨城県つくば市）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/past/"},{"label":"第37回","value":"2020年 オンライン開催（当初熊本開催予定）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/past/"},{"label":"第38回","value":"2021年 オンライン開催（当初姫路開催予定）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/past/"},{"label":"第41回","value":"2024-11-25〜28 / 仙台国際センター","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/past/"},{"label":"第42回","value":"2025-11-10〜13 / ライトキューブ宇都宮","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/past/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"基調講演は3件で、東京大学の中川桂一氏（CHEMINAS）、JAXAの今村裕志氏（日本機械学会）、東京大学の黒田忠広氏（応用物理学会、演題「AIと半導体の未来」）です。シンポジウム招待講演にはプロテリアル安来工場の「たたら製鉄から受け継がれる高級特殊鋼のものづくり」があり、集積化MEMSシンポジウムの招待講演には大阪産業技術研究所の「シリコン基板のフレキシブル・ストレッチャブル化とフォトニクス応用」があります。出展者による技術展示発表はセッションIとIIで、11月16日夜には4学会合同の若手企画があります。","facts":[{"label":"2026 基調講演（応用物理学会）","value":"AIと半導体の未来 / 黒田 忠広（東京大学）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/keynote/"},{"label":"2026 基調講演（CHEMINAS）","value":"深部を見る、高速に見る / 中川 桂一（東京大学）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/keynote/"},{"label":"2026 基調講演（日本機械学会）","value":"今村 裕志（JAXA 宇宙科学研究所 DESTINY⁺プロジェクトチーム）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/keynote/"},{"label":"2026 シンポジウム招待講演","value":"たたら製鉄から受け継がれる高級特殊鋼のものづくり / 株式会社プロテリアル 安来工場","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/invited/"},{"label":"2026 集積化MEMSシンポジウム招待講演","value":"シリコン基板のフレキシブル・ストレッチャブル化とフォトニクス応用 / 大阪産業技術研究所","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/invited/"},{"label":"2026 技術展示発表","value":"出展者による技術展示発表 セッションI・II","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/wp-content/uploads/FT_MATSUE_2026_Program_261005.pdf"},{"label":"2026 若手企画","value":"4学会合同 若手企画（11月16日夜）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/wp-content/uploads/FT_MATSUE_2026_Program_261005.pdf"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"非会員も発表できますが、賞の選考対象になるには申込時点で電気学会の会員である必要があります。電気学会センサ・マイクロマシン部門は初めて入会する人向けに入会キャンペーンを設け、学生は初年度会費が無料になります。企業の調査担当者は、技術展示と出展者による技術展示発表のセッションで、半導体・MEMS関連の装置やサービスに触れられます。60歳以上の退職者向けのシニア料金もあります。","facts":[{"label":"賞の選考対象","value":"発表申込時点で電気学会会員（申請中を含む）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"入会キャンペーン（学生）","value":"学生は初年度無料","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/cfp/"},{"label":"2026 シニア料金","value":"参加費12,000円（原則60歳以上・退職者）","checkedAt":"2026-10-08","sourceUrl":"https://sensorsymposium.org/regist/"},{"label":"2026 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プロセス統合","organizers":[],"lastVerified":"2026-10-22","currentCycleEnd":"2026-09-12","abstractDeadline":"2026-06-22","peerReviewStatus":"review-unclear","currentCycleStart":"2026-09-10","finalPaperDeadline":"2026-07-24","canonicalId":"conf_3eb26a930fff4dfcb03296e372410d8d","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"japanese-liquid-crystal-conference","confidenceScore":1,"coverage":{"faqCount":5,"factCount":59,"topicCount":2,"sourceCount":10,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年9月10〜12日にレンブラントホテル大分で対面形式で開かれ、液晶交流会は9月12日午後〜13日に別府市の豊泉荘で開かれました。","question":"2026年の日本液晶学会討論会はいつ、どこで開かれましたか。","sourceUrls":["https://jlcs.jp/ekitou/2026/top/overview/","https://jlcs.jp/ekitou/2026/"]},{"answer":"申込時に口頭とポスターから選びます。口頭は発表15分と質疑5分の計20分で、スライドとポスターはできる限り英語で作るよう推奨されています。","question":"発表の形式と時間は。","sourceUrls":["https://jlcs.jp/ekitou/2026/top/application/","https://jlcs.jp/ekitou/2026/top/information/"]},{"answer":"4月1日時点で30歳未満のポスター発表者は虹彩賞に、そのうち修士課程以下の学生は若葉賞に同時申請できます。口頭発表者向けにはイーリス賞が2026年に試験的に設けられました。いずれも日本液晶学会の会員が対象です。","question":"学生が応募できる賞はありますか。","sourceUrls":["https://jlcs.jp/ekitou/2026/top/application/"]},{"answer":"当年の予稿集は参加者限定の電子版です。J-STAGEで約9か月後に会員限定、2年後に一般向けに無料公開され、液晶討論会の1975年以降の分も公開されています。","question":"予稿集はどこで読めますか。","sourceUrls":["https://jlcs.jp/ekitou/2026/top/program/","https://jlcs.jp/information/search-collection"]},{"answer":"2027年の討論会は、9月に静岡での開催が予定されています。","question":"次回はいつですか。","sourceUrls":["https://jlcs.jp/ekitou/2026/"]}],"headline":"2026年日本液晶学会討論会は9月10〜12日にレンブラントホテル大分で対面形式で開かれ、260名が参加し150件の発表がありました。","metaDescription":"日本液晶学会討論会（Japanese Liquid Crystal Conference）の主催、2026年大分会期（対面開催）、口頭・ポスターの発表形式と締切、虹彩賞・若葉賞・イーリス賞、予稿集の公開範囲、1998年からの開催地一覧を公式サイトから整理しました。","oneLine":"日本液晶学会討論会は、一般社団法人日本液晶学会が年会として主催する、液晶の研究を口頭・ポスター・国際セッションで発表し討論する学術集会で、液晶交流会が併設されます。","pageTitle":"日本液晶学会討論会とは｜日本液晶学会が年会として主催する液晶研究の討論会","relatedConferenceIds":["international-liquid-crystal-conference","international-display-workshops","display-week","am-fpd","polymer-discussion-meeting","optics-and-photonics-japan"],"sections":{"cycle":{"id":"cycle","body":"2026年の討論会は9月10〜12日にレンブラントホテル大分で、液晶交流会は9月12日午後〜13日に別府市の豊泉荘で開かれました。2026年は対面形式で開催され、参加者は260名、発表は150件でした。2027年は9月に静岡での開催が予定されています。","facts":[{"label":"2026 討論会会期","value":"2026-09-10〜12","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 会場","value":"レンブラントホテル大分（大分県大分市田室町9-20）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 開催形式","value":"対面形式（現地開催）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2026 液晶交流会","value":"2026-09-12午後〜13 / 豊泉荘（大分県別府市）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 参加者数・発表件数","value":"260名 / 150件","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2027 予定","value":"2027年9月 / 静岡","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"}],"title":"2026年会期","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年の案内は、口頭発表、ポスター発表、国際セッションを企画すると書き、大学・公的研究機関・企業の研究者、若手研究者、学生に応募を呼びかけています。受賞者の発表題目には、強誘電性カラムナー液晶（イーリス賞、千葉大）や、強誘電ネマチック液晶探索のための機械学習モデル（虹彩賞、北里大）などがあります。国際セッションでは液晶空間光変調器とその応用が取り上げられました。","facts":[{"label":"2026 企画","value":"口頭発表 / ポスター発表 / 国際セッション","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2026 応募の呼びかけ対象","value":"大学・公的研究機関・企業の研究者、若手研究者、学生","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2026 イーリス賞受賞題目（例）","value":"強誘電性カラムナー液晶（1CO6、千葉大）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2026 虹彩賞受賞題目（例）","value":"強誘電ネマチック液晶探索のための機械学習モデル（PB27、北里大）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/"},{"label":"2026 国際セッション講演（例）","value":"Liquid crystal spatial light modulators: From basic functions to applications（浜松ホトニクス）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"}],"title":"対象領域・セッション構成","eyebrow":"scope"},"review":{"id":"review","body":"4月1日時点で30歳未満のポスター発表者は虹彩賞に、そのうち修士課程以下の学生は若葉賞に申請できます。4月1日時点で30歳未満の口頭発表者はイーリス賞に申請できます。イーリス賞は応募者が多い場合に予稿原稿で事前審査があり、発表に加えて審査員との質疑応答も審査されます。賞に応募できるのは日本液晶学会の会員だけです。","facts":[{"label":"虹彩賞・若葉賞の資格","value":"4月1日時点で30歳未満のポスター発表者（若葉賞は修士課程以下の学生）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 イーリス賞","value":"4月1日時点で30歳未満の口頭発表者が対象、2026年に試験的に設置","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 イーリス賞の事前審査","value":"応募者多数の場合に予稿原稿で事前審査","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"賞の応募資格","value":"日本液晶学会の会員のみ","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 イーリス賞の審査観点","value":"発表に加え、審査員からの質疑と応答を含めて審査","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"}],"title":"審査・表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"過去の一覧は日本液晶学会討論会の1998年からで、J-STAGEの予稿集は前身の液晶討論会の1975年からのため、起点の年が資料により異なります。国際セッションの講演者名は、プログラムのHTMLでは「Srefania Residori」、プログラムPDF（0907版）では「Dr. Stefania Residori」と表記が揺れています。2026年の予稿集本体は参加者限定で、J-STAGEで公開されるまでは一般には読めません。","facts":[{"label":"2026 講演者名の表記揺れ","value":"Srefania Residori（HOASYS）と表記","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 予稿集の閲覧範囲","value":"参加者限定ダウンロード","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 講演者名（プログラムPDF 0907版）","value":"Dr. Stefania Residori","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/wp-content/uploads/2026/09/program_20260907.pdf"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"日本液晶学会は1997年9月に発足し、設立時の案内は、翌年から液晶討論会を日本液晶学会討論会として開くと告げています。過去の討論会の一覧は1998年の千里ライフサイエンスセンターから始まり、2024年は富山大学五福キャンパス、2025年は京都市国際交流会館で開かれました。2020年は討論会・液晶交流会が開かれず、10月29〜30日にオンライン研究発表会が開かれ、2022年はオンライン開催（香川大学 林町キャンパス）でした。","facts":[{"label":"学会発足","value":"1997年9月 日本液晶学会発足","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/about/overview/constitution"},{"label":"名称の移行","value":"液晶討論会 → 日本液晶学会討論会（学会設立の翌年から）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/about/overview/constitution"},{"label":"一覧上の最初の回","value":"1998年 / 千里ライフサイエンスセンター","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/old/"},{"label":"2020 開催状況","value":"討論会・液晶交流会は開催なし、オンライン研究発表会（10月29〜30日）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/old/"},{"label":"2022 開催形式","value":"オンライン開催（香川大学 林町キャンパス）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/old/"},{"label":"2025 会期・会場","value":"2025-09-10〜12（交流会は9月9日）/ 京都市国際交流会館","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/old/"},{"label":"2024 会期・会場","value":"2024-09-11〜13 / 富山大学 五福キャンパス","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/old/"}],"title":"歴史・開催地","eyebrow":"history"},"program":{"id":"program","body":"2026年は中央大学の池田富樹による基調講演、日本液晶学会業績賞と奨励賞の受賞講演、国際セッションが組まれました。国際セッションでは浜松ホトニクス、九州大学、HOASYS、理化学研究所などの講演者が登壇しました。ポスター発表は9月11日にPA・PB・PCの3枠で行われ、会場前のロビーでは企業展示が開かれました。","facts":[{"label":"2026 基調講演","value":"池田 富樹（中央大学）、9月12日 9:00-10:00","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 業績賞受賞講演","value":"舟橋正浩（神戸大学）/ 吉尾正史（物質・材料研究機構）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 奨励賞受賞講演","value":"坂本盛嗣（長岡技術科学大学）/ 仲嶋一真（大阪大学）/ 内田淳也（岡山大学）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 国際セッション講演者（所属）","value":"九州大学 / 理化学研究所・NIFS・中央大学 ほか","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/program/"},{"label":"2026 ポスター発表日","value":"2026-09-11（PA・PB・PCの3セッション）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"},{"label":"2026 企業展示","value":"会期中、2階会場前ロビーで実施","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生と若手研究者は、ポスターで虹彩賞・若葉賞、口頭でイーリス賞に応募でき、学生会員の事前登録費は5,000円（当日6,000円）です。一般会員の事前登録費は10,000円（当日13,000円）で、日本液晶学会賛助会員や協賛学会の会員は、正会員と同じ金額（税込）になります。J-STAGEでは液晶討論会の1975年以降の予稿集が公開されています。","facts":[{"label":"2026 参加費（一般会員・事前）","value":"10,000円（当日13,000円）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 参加費（学生会員・事前）","value":"5,000円（当日6,000円）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 事前参加登録（聴講者）","value":"2026-06-01〜08-17","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"協賛学会の会員","value":"日本液晶学会正会員（または学生会員）と同じ金額（税込）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称は日本液晶学会討論会で、英語ではJapanese Liquid Crystal Conferenceと表記されます。主催は一般社団法人日本液晶学会で、液晶交流会が併設されます。2026年の現地実行委員長は氏家誠司（大分大学）、行事担当理事は齊藤尚平（大阪大学）と吉田純（日本大学）で、発表申込・予稿入稿の受付は株式会社ポラリス・セクレタリーズ・オフィスが担当します。","facts":[{"label":"名称","value":"日本液晶学会討論会・液晶交流会 / Japanese Liquid Crystal Conference","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/"},{"label":"主催","value":"一般社団法人日本液晶学会","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 現地実行委員長","value":"氏家 誠司（大分大学）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 実行委員会（行事担当理事）","value":"齊藤 尚平（大阪大学）/ 吉田 純（日本大学）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"事務局業務","value":"株式会社ポラリス・セクレタリーズ・オフィス（発表申込・予稿入稿の受付）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年の実行委員会は、大分大学の氏家誠司（現地実行委員長）と長屋智之（現地実行副委員長）、学会の行事担当理事、研究会・国際担当理事で構成され、研究会・国際担当理事には産業技術総合研究所の大園拓哉と京都工芸繊維大学の櫻井庸明がいます。企業展示には中本パックス、シーシーエス、オプトサイエンス、朝日ラボ交易が出展しました。日本液晶学会賛助会員の参加費は、正会員と同じです。","facts":[{"label":"2026 現地実行副委員長","value":"長屋 智之（大分大学）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 研究会・国際担当理事","value":"大園 拓哉（産業技術総合研究所）/ 櫻井 庸明（京都工芸繊維大学）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"},{"label":"2026 企業展示 出展企業","value":"中本パックス株式会社","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"},{"label":"2026 企業展示 出展企業","value":"シーシーエス株式会社","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"},{"label":"2026 企業展示 出展企業","value":"株式会社オプトサイエンス / 株式会社朝日ラボ交易","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"},{"label":"参加費（賛助会員）","value":"日本液晶学会賛助会員は正会員と同じ参加費","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/overview/"}],"title":"実行委員会・出展","eyebrow":"community"},"comparison":{"id":"comparison","body":"日本液晶学会討論会は、日本液晶学会が年会として主催する討論会です。学会設立時の案内は、学会の事業として年会の主催と並べて、国際液晶会議ILCC2000の主催を別項目に掲げています。2026年は英語での発表を推奨し、国際セッションを設けています。","facts":[{"label":"学会事業での位置","value":"年会の主催（液晶討論会を日本液晶学会討論会として開催）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/about/overview/constitution"},{"label":"国際会議との関係","value":"学会事業として国際液晶会議（ILCC2000）の主催を別項目で掲載","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/about/overview/constitution"}],"title":"近い会議との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年は研究発表の申込を6月1〜22日に受け付け、予稿の入稿は6月1日〜7月24日でした。イーリス賞の応募者は6月22日までに入稿します。発表形式は申込時に口頭とポスターから選び、口頭は発表15分、質疑5分の計20分です。予稿はA4判2枚のテンプレートを使い、3MB以下のPDF（編集可能・パスワードなし）として入稿します。発表は英語が推奨され、口頭は日本語も可で、スライドとポスターはできる限り英語で作ります。","facts":[{"label":"2026 研究発表申込期間","value":"2026-06-01〜06-22","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 予稿入稿期間","value":"2026-06-01〜07-24（イーリス賞応募者は06-22まで）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 発表形式","value":"口頭・ポスターの2種類から申込時に選択","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 口頭発表時間","value":"発表15分＋質疑応答5分","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"},{"label":"2026 予稿書式","value":"A4サイズ2枚のテンプレート、3MB以下のPDF（編集可能・パスワードなし）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"使用言語","value":"英語での発表を推奨（口頭は日本語可、スライドとポスターはできる限り英語）","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/information/"}],"title":"発表申込・予稿","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年の講演予稿集は9月3日発行予定の電子版のみで、冊子やCD-ROMの配布はなく、参加者限定のページからダウンロードします。学会の案内によれば、予稿集はJ-STAGEで約9か月後に会員限定で公開され、2年後にIDとパスワードなしで一般に無料公開されます。J-STAGEでは液晶討論会の1975年以降、日本液晶学会討論会の1998年以降の予稿集が公開されています。","facts":[{"label":"2026 予稿集発行日","value":"2026-09-03","checkedAt":"2026-10-08","sourceUrl":"https://jlcs.jp/ekitou/2026/top/application/"},{"label":"2026 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’26（第33回）は2026年12月2〜4日に浜松市のACT CITY Hamamatsuで、現地開催として行われます。","question":"IDW 2026はいつ、どこで開かれますか？","sourceUrls":["https://www.idw.or.jp/"]},{"answer":"technical summaryをConfitの投稿サイト（idw.confit.atlas.jp）から提出します。2026年の締切は延長後の6月25日23:59（UTC-10）で、採択通知は7月31日、camera-readyの締切は9月8日です。","question":"通常論文はどう投稿しますか？","sourceUrls":["https://www.idw.or.jp/authinfo.html"]},{"answer":"camera-ready manuscriptは最大4ページで、最低2ページを埋める必要があります。late-news paperはA4・abstract付きの2〜4ページです。","question":"論文のページ数は？","sourceUrls":["https://www.idw.or.jp/authinfo.html"]},{"answer":"会期の数か月後にonline open-access archiveとして公開され、各論文にDOIが付きます。IDW ’25のproceedingsもopen accessとして告知されています。","question":"proceedingsは誰でも読めますか？","sourceUrls":["https://www.idw.or.jp/authinfo.html","https://www.idw.or.jp/"]},{"answer":"公式archiveでは第1回IDW ’94が1994年10月26日に浜松で開かれています。","question":"IDWはいつから開かれていますか？","sourceUrls":["https://www.idw.or.jp/archive.html"]},{"answer":"公式サイトはSponsoring SocietiesとしてITE（映像情報メディア学会）とSIDを掲げ、運営法人はInternational Display Workshops General Incorporated Associationです。","question":"主催はどこですか？","sourceUrls":["https://www.idw.or.jp/"]}],"headline":"IDW ’26は第33回として2026年12月2〜4日に浜松のACT CITY Hamamatsuで現地開催され、3DSAをtopical sessionとして併催します。","metaDescription":"IDW（International Display Workshops）の2026年会期（浜松・ACT CITY Hamamatsu）、technical summaryとlate-news paperの締切、14 workshop、open-access proceedings、1994年からの開催地を公式サイトから整理した資料。","oneLine":"IDWは、ITEとSIDを主催学会とし、情報ディスプレイ技術とその応用を14のworkshopに分けて毎年日本で開く国際会議です。","pageTitle":"IDWとは｜International Display Workshopsの会期・投稿締切・workshop構成","relatedConferenceIds":["display-week","am-fpd","international-liquid-crystal-conference","japanese-liquid-crystal-conference","ieee-sensors"],"sections":{"cycle":{"id":"cycle","body":"IDW ’26は2026年12月2〜4日に静岡県浜松市のACT CITY Hamamatsuで、現地開催（in-person）として行われます。会場は浜松駅に隣接しています。展示会も同じ12月2〜4日に開かれます。","facts":[{"label":"2026 会期","value":"2026-12-02〜04","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/"},{"label":"2026 会場・都市","value":"ACT CITY 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Committeeは発表タイトルを編集することがあり、登録・登録料支払い・camera-ready提出などの条件を満たさない場合は採択を保留し、programから外すことがあります。late-news paperは、重要な新しい成果に限り少数を採択すると書かれています。","facts":[{"label":"審査用原稿","value":"technical summary（camera-readyと同一書式）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/authinfo.html"},{"label":"late-news paperの採択枠","value":"重要な新しい成果に限り少数","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/authinfo.html"},{"label":"採択条件","value":"条件を満たさない場合、Program Committeeが採択を保留しprogramから外すことがある","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/authinfo.html"},{"label":"タイトルの編集","value":"Program Committeeが採択時に発表タイトルを編集することがある","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/authinfo.html"},{"label":"2026 論文賞","value":"Best Paper Award / Best Student Paper Award / Outstanding Poster Paper 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’25、2025-12-03〜05、Hiroshima","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/archive.html"},{"label":"2024（第31回）","value":"IDW ’24、2024-12-04〜06、Sapporo","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/archive.html"},{"label":"online開催年","value":"2020（第27回）・2021（第28回）はVirtual","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/archive.html"},{"label":"名称の変種","value":"IDW/AD ’05・’12・’16、Asia Display / IDW ’01","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/archive.html"}],"title":"開催の歴史","eyebrow":"history"},"program":{"id":"program","body":"2026年のKeynote Addressは計4件で、静岡大学のShoji Kawahitoによる「CMOS Image Sensors: Present Achievements and Future Opportunities」や、Tianma MicroelectronicsのQin Fengによるmicro-LEDと車載ディスプレイの講演が含まれます。口頭発表は1件20分（質疑込み）で、各sessionの直後に20分のExtended Q&Aが設けられます。採択論文の著者はI-DEMOで実演でき、別に2026年12月2〜4日の展示会も開かれます。","facts":[{"label":"2026 Keynote Address","value":"Shoji Kawahito（Shizuoka University）\"CMOS Image Sensors: Present 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Associationの名がサイト末尾に載っています。開催は毎年です。","facts":[{"label":"正式名称・回次（2026）","value":"The 33rd International Display Workshops（IDW ’26）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/"},{"label":"Sponsoring Societies（2026）","value":"The Institute of Image Information and Television Engineers（ITE） / The Society for Information Display（SID）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/"},{"label":"運営法人","value":"International Display Workshops General Incorporated Association","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/"},{"label":"開催頻度","value":"毎年","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/scope.html"},{"label":"2026 事務局","value":"IDW ’26 Secretariat c/o Enhal Inc.（東京都千代田区内神田）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral Chairは静岡大学、Program ChairはTokushima Univ.、Executive ChairはNIMSの所属者です。Overseas Advisorsの所属国はドイツ、韓国、米国、中国、台湾、フランスです。2026年10月2日時点のGold SponsorはHuawei Technologies Japan K. K.とNatsume Optical Corp.、Bronze SponsorはApplied Materials Japan、JNC、Nichia、Sharp、TechnoOptis、Zeonです。応用物理学会、電子情報通信学会（IEICE）、日本液晶学会など22団体がAcademic Supporting Organizationsに名を連ねます。","facts":[{"label":"2026 General Chair","value":"K. Hara（Shizuoka Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/committee.html"},{"label":"2026 Program Chair","value":"K. Yamamoto（Tokushima Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/committee.html"},{"label":"2026 Executive Chair","value":"M. Higuchi（NIMS）","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/committee.html"},{"label":"2026 Overseas Advisorsの所属国","value":"Germany / Korea / USA / China / Taiwan / France","checkedAt":"2026-10-08","sourceUrl":"https://www.idw.or.jp/committee.html"},{"label":"2026 Gold Sponsor（2026-10-02時点）","value":"Huawei Technologies Japan K. 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devicesの4領域、1ページabstractと2ページ目の査読用補足、Plenary、Rump Session、2000年名古屋からの隔年開催を公式サイトから整理しました。","oneLine":"IWNは、III族窒化物半導体の材料とデバイスの科学・技術を扱う国際ワークショップで、2000年のNagoyaを初回に2年ごとに開かれています。","pageTitle":"IWNとは｜III族窒化物半導体の材料とデバイスを扱う隔年の国際ワークショップ（2026年は熊本）","relatedConferenceIds":["icns","compound-semiconductor-week","ispsd","cs-mantech","icscrm"],"sections":{"cycle":{"id":"cycle","body":"IWN2026の会期は2026年11月8日〜13日で、会場はKumamoto Castle Hallです。公式サイトは予定どおり開催すると案内しています。programは11月9日のOpeningから13日のClosingまで組まれ、11月12日夜のBanquetはHotel Nikko Kumamotoで開かれます。参加登録はEarly-birdが8月1日〜9月30日、Normalが10月1日〜10月29日です。","facts":[{"label":"2026 会期","value":"2026-11-08〜13 / Kumamoto","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"2026 会場","value":"Kumamoto Castle Hall","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"2026 Opening","value":"11月9日（月）8:45、Main 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…などのsessionがあります。","facts":[{"label":"対象","value":"group-III nitride semiconductorsの材料とデバイス","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"2026 Topics：Growth","value":"Epitaxial growth; bulk growth; doping and point defects; alloys ほか","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/topics/"},{"label":"2026 Topics：Characterization","value":"光学・電気特性、構造解析、欠陥評価、理論とシミュレーションなど","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/topics/"},{"label":"2026 Topics：Optical devices","value":"UV/VIS-LED、レーザー、micro LED、太陽電池、受光素子、センサなど","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/topics/"},{"label":"2026 Topics：Electronic devices","value":"トランジスタ、ダイオード、power・RF用途、プロセス、コンタクト、信頼性","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/topics/"},{"label":"2026 program：合同session（例）","value":"JT1: Trap Physics, Reliability and Device Engineering in GaN 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/ Outstanding Student Award / Young Researcher Poster Award","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/abstract/award/"},{"label":"Best Paper Awardの対象","value":"一般口頭発表（invitedへ格上げされたものを含む）","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/abstract/award/"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"会場名は公式サイト内で「Kumamoto Castle Hall」（home page）と「Kumamoto-jo Hall」（Women in Nitridesページ）の2通りで表記されています。参加登録の開始日はImportant datesでは8月3日、登録案内の行ではEarly-birdが8月1日からと書かれていて一致しません。特集号は「検討中」の段階で、投稿要領と締切は今後告知される予定です。過去の開催年と開催地の対応表、採択率、IEEE Xplore等へのproceedings収録は公式サイトにありません。","facts":[{"label":"会場名の別表記","value":"Kumamoto-jo Hall","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/women-in-nitrides/"},{"label":"Important datesの登録開始日","value":"2026年8月3日","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"特集号の詳細","value":"投稿要領・締切は今後告知","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/publication/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"IWNは2000年にNagoyaで始まり、以後2年ごとに開かれています。公式サイトは過去の開催地としてAachen、Pittsburgh、Kyoto、Montreux、Tampa、Sapporo、Wrocław、Orlando、Kanazawa、Berlin、Hawaiiを挙げています。Women in NitridesはICNS-13〜15とIWN2022・IWN2024に続く6回目です。","facts":[{"label":"初回","value":"2000年、Nagoya","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"過去の開催地","value":"Aachen, Pittsburgh, Kyoto, Montreux, Tampa, Sapporo, Wrocław, Orlando, Kanazawa, Berlin, Hawaii など","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"Women in Nitridesの系譜","value":"ICNS-13・14・15、IWN2022、IWN2024に続く6回目","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/women-in-nitrides/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"PlenaryにはHiroshi Amano（Nagoya University）、Oliver Häberlen（Infineon Technologies AG）、Kunimichi Omae（Nichia Corporation）らが並びます。Poster Session Iは11月9日15:00〜17:00にCivic Hallで開かれます。11月10日19:10〜21:00にはRoom A1-A3でRump Session（R-ED、R-E&O、R-AI）が開かれ、R-AIの題は「How will AI transform III-Nitrides research?」です。火曜の昼にはnetworking eventのWomen in Nitridesがあります。","facts":[{"label":"2026 Plenary（例）","value":"Hiroshi Amano, Nagoya University「Past, Present, and Future of III-Nitride Semiconductors: From Blue LEDs to a Sustainable Electronics Platform」","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/plenary-invited/"},{"label":"2026 Plenary（企業）","value":"Oliver Häberlen, Infineon Technologies AG「GaN Power Devices: From R&D to 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event（シリーズ6回目）","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/women-in-nitrides/"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"大学院生は学生賞の対象で、申請時に指導教員の情報を提出します。2026年11月12日時点で40歳未満の著者は、Young Researcher Poster Awardの対象です。Women in Nitridesは追加費用なしで参加できます。Advance ProgramはProgramsページで公開されています（Program Only版は2026-09-29付）。","facts":[{"label":"学生賞の対象","value":"大学院生（指導教員の情報を提出）","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/abstract/award/"},{"label":"Young Researcher Poster Awardの対象","value":"2026年11月12日時点で40歳未満","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/abstract/award/"},{"label":"Women in Nitridesの参加費","value":"追加費用なし","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/women-in-nitrides/"},{"label":"2026 Advance Program","value":"Programsページで公開（Program Only版は2026-09-29付）","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/program/programs/"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Workshop on Nitride Semiconductorsで、2026年の回はIWN2026と表記されます。主催はThe Japanese Association for Crystal Growthです。公式サイトは、IWNが2000年のNagoyaで始まって以来2年ごとに開かれていると説明しています。","facts":[{"label":"正式名称","value":"International Workshop on Nitride Semiconductors 2026 (IWN2026)","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"2026 主催","value":"The Japanese Association for Crystal Growth","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"開催頻度","value":"隔年（biennially）","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/"},{"label":"2026 Organizing committee Chair","value":"Hideto Miyake, Mie University","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/committees/committees/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"Organizing committeeはMie UniversityのHideto MiyakeがChair、The University of TokyoのHiroshi FujiokaがCo-Chairを務め、Program committeeのChairはNagoya UniversityのJun Sudaです。Program committeeの委員には、GoogleのAurelien DavidやSumitomo ElectricのJunji Kotaniなど企業所属者も入っています。Sponsors & Exhibitorsページは、Conference Sponsors・Session Sponsors・Exhibitors・Advertisersに分けて出展・協賛企業をロゴで掲載しています。","facts":[{"label":"2026 Organizing committee Co-Chair","value":"Hiroshi Fujioka, The University of Tokyo","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/committees/committees/"},{"label":"2026 Program committee Chair","value":"Jun Suda, Nagoya University","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/committees/program-committee/"},{"label":"2026 Program committee（企業所属の例）","value":"Aurelien David, Google","checkedAt":"2026-10-08","sourceUrl":"https://iwn2026.jp/committees/program-committee/"},{"label":"2026 Program committee（企業所属の例）","value":"Junji Kotani, Sumitomo 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devicesの4領域で、programはED3などのsessionと合同session（JT1）で組まれています。投稿は1ページのabstractに査読用の補足ページ1枚を付ける形式で、abstract bookに載るのは1ページ目だけです。PlenaryにはHiroshi Amano（Nagoya University）、Infineon Technologies、Nichia Corporationの講演者が並び、11月10日夜にはRump Sessionが3室で開かれます。会議論文の特集号はApplied Physics LettersまたはJournal of Applied Physicsで検討されています。","topics":[{"note":"2026年はED3「Vertical GaN Power Devices for Converter …」のsessionがあり、PlenaryでもInfineonのOliver HäberlenがGaN Power Devices: From R&D to Industrializationを講演します。","label":"GaN power device（縦型・高耐圧）","sourceUrl":"https://iwn2026.jp/wp-content/uploads/2026/10/IWN2026_AdvanceProgram_20260929ProgramOnly.pdf"},{"note":"合同sessionのJT1は、GaNエレクトロニクスのトラップ物理、信頼性、デバイス工学を取り上げます。","label":"トラップ物理と信頼性","sourceUrl":"https://iwn2026.jp/wp-content/uploads/2026/10/IWN2026_AdvanceProgram_20260929ProgramOnly.pdf"},{"note":"Optical devicesのTopicsにUV/VIS-LED、レーザー、mLEDが入り、PlenaryではNichia CorporationのKunimichi OmaeがGaN系発光デバイスの最近の進展を講演します。","label":"発光デバイス（LED・レーザー・Micro LED）","sourceUrl":"https://iwn2026.jp/program/topics/"},{"note":"Plenaryで、Nagoya UniversityのHiroshi Amanoが青色LEDから持続可能なエレクトロニクスのプラットフォームまでを講演します。","label":"III族窒化物の過去・現在・未来","sourceUrl":"https://iwn2026.jp/program/plenary-invited/"},{"note":"ICNS-13〜15とIWN2022・IWN2024に続く6回目のnetworking eventが、火曜の昼に開かれます。","label":"Women in 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Bookは2006年の開始と書き、2025年を第20回としています。2026年は第21回です。","question":"いつから開かれていますか？","sourceUrls":["https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf","https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"]},{"answer":"2025年のProgram Bookによると、IMPACT 2024ではabstract、full paper、会場でのoral発表の3段階で審査しました。","question":"審査はどう行われますか？","sourceUrls":["https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"]}],"headline":"第21回のIMPACT-IAAC 2026は2026年10月19〜22日に台北で開かれ、初日はGrand Hilai Taipei、20〜22日は南港展覧館2館（TaiNEX 2）が会場です。","metaDescription":"IMPACT-IAAC（International Microsystems, Packaging, Assembly and Circuits Technology Conference）の主催4団体、2026年台北会期、PackagingとPCBの投稿分野、締切、TPCA Show併催、2006年からの沿革を公式資料から整理しました。","oneLine":"IMPACT-IAACは、先端パッケージからPCBまでの電子実装技術を発表する台湾の国際会議で、IEEE-EPS、iMAPS Taiwan、ITRI、TPCAが主催し、2006年に始まりました。","pageTitle":"IMPACT-IAACとは｜台北で開く先端パッケージ・PCBの国際会議","relatedConferenceIds":["ectc","eptc","estc","icep-hbs","imaps-symposium","3dic"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は10月19日から22日までです。19日の会場はGrand Hilai Taipeiで、開会式とAward Ceremonyがあります。20〜22日は南港展覧館2館（TaiNEX 2）へ移ります。TPCA Show、TAITRONICS、AIoT Taiwanが併設展示として同時に開かれます。General Programの登録は19〜21日、PDCは22日です。","facts":[{"label":"2026 会期","value":"2026-10-19〜22","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 会場","value":"Grand Hilai Taipei（10/19）／Taipei Nangang Exhibition Center II（TaiNEX 2、10/20〜22）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 テーマ","value":"Energy-Efficient AI: From Computing to Systems and Applications","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 併設展示","value":"TPCA Show、TAITRONICS、AIoT Taiwan","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 登録区分の日程","value":"General Program 10/19〜21／PDC 10/22（1コース2時間）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283"},{"label":"2026 早期登録","value":"2026-10-12まで延長","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年の募集範囲はパッケージからPCBまでで、Packagingは先端パッケージのP1からサステナブル技術のP7まで、PCBはB1〜B4の4区分です。P1にはSi/Glass/Organic interposer、Si bridge、Glass substrate、3DIC、Hybrid bonding、TSV、TGVが並び、P2はSi、GaN、SiC、Ga2O3のパワーデバイスとモジュールの実装です。PCBのB3はHDI PCB、IC Substrate、FPC技術です。列挙された範囲に限らず投稿できると明記されています。","facts":[{"label":"2026 募集範囲","value":"PackagingからPCBまで（列挙項目に限定しない）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 対象トピック","value":"advanced packaging、heterogeneous integration、IC substrates、高速・高周波PCB、thermal management、reliability、製造プロセス、材料、sustainability","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"P1 nD architectures","value":"Si/Glass/Organic interposer、Si bridge、Glass substrate、3DIC、Hybrid bonding、TSV、TGV","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"P2 Power Electronics Packaging","value":"Si/GaN/SiC/Ga2O3パワーデバイスとモジュール","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"PCB B3","value":"HDI PCB, IC Substrate and FPC Technology","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"P7 Sustainable Technologies & Systems","value":"Green packaging、Net zero、AI・データセンター向け省エネ設計など","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"}],"title":"対象分野とトラック","eyebrow":"scope"},"review":{"id":"review","body":"2025年のProgram Bookによると、IMPACT 2024には約155本の論文が集まり、abstract、full paper、会場でのoral発表の3段階で審査しました。Best Paper AwardはTechnical Program Committeeが学生論文と企業論文から別々に選び、受賞は翌年に発表・表彰されます。","facts":[{"label":"2024 投稿数と審査段階","value":"約155本／abstract・full paper・oral発表の3段階","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"},{"label":"2026 Best Paper Award の選考","value":"TPCが学生論文と企業論文から別々に選考、翌年に発表・表彰","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 開会式","value":"10/19 Opening & Award Ceremony","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"}],"title":"査読と表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"締切の表記が資料ごとに異なります。3月16日のNewsはabstract締切を6月22日としていますが、Submissionページは延長後の6月30日です。full paper締切もSubmissionページに8月28日と9月9日が併記され、どちらが最終かは本文で区別されていません。論文がIEEE Xploreなどに収録されるか、採択率は、今回開いた公式ページには記載がありません。Committeeページは本文をJavaScriptで読み込むため、委員名は本ドシエのfactから外しています。会議名は年によりIMPACTとIMPACT-IAACの表記が混在します。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"2025年のProgram BookはIMPACTの開始を2006年とし、2025年を第20回としています。2026年は第21回です。2025年のテーマはEnergy Efficient AI: From Cloud to the Edge、2024年はSustainable Technologyでした。","facts":[{"label":"初回","value":"2006年","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"},{"label":"2025 回次","value":"第20回","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"},{"label":"2025 テーマ","value":"Energy Efficient AI : From Cloud to the Edge","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=305&lang=en&sid=1283"},{"label":"2024 テーマ","value":"Sustainable Technology","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=268&lang=en&sid=1283"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryは4件で、Stanford UniversityのH.-S. Philip Wong、ASEのC.P. Hung、Shinko Electric Ind.のYasushi Araki氏、IntelのRahul Manepalliが登壇します。企画セッションには、S3 Compute & Enterprise AI（AMD）、S23 Advanced Package in AI Era（ASE）、S38 Materials & processes research in Japan（JIEP）などがあります。22日はJohn Lau氏とNing-Cheng Lee氏のPDC 2コースがあり、TPCA Show会場ではOpen Seminarも開かれます。","facts":[{"label":"2026 プログラム構成","value":"Plenary speech、Industrial session、Special session、Invited talks、PDC","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 Plenary I","value":"Beyond the Exit of the Device Miniaturization Tunnel（H.-S. Philip Wong, Stanford University）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 Plenary II","value":"Optimizing AI System with Advanced Packaging（C.P. Hung, ASE, Inc.）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 Plenary III","value":"Advanced Semiconductor Package Substrates for AI and HPC（Yasushi Araki, Shinko Electric Ind. Co., Ltd.）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 Plenary IV","value":"Advanced Packaging Technologies for the AI era（Rahul Manepalli, Intel）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 PDC","value":"PDC 1: Co-Packaged Optics with Silicon Photonics（John Lau）／PDC 2: High Reliability Soldering（Ning-Cheng Lee）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 学会企画セッション例","value":"S38 Materials & processes research in Japan（JIEP）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 IAAC セッション","value":"S1 Substrate Ecosystem and Growth: Scaling ABF, Glass, and High-Density IC Substrates","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生の登録料はGeneral Programの早期登録でNT$3,500と、一般のNT$14,000より低く設定され、学生5人を4人分の料金で登録できる団体割引もあります。Best Paper Awardは学生論文の枠を持っています。企業の技術者向けには、22日のPDCが1コース2時間の講習として用意されています。","facts":[{"label":"2026 学生登録料（General Program・早期）","value":"NT$3,500（USD$110）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283"},{"label":"2026 学生団体割引","value":"学生5人を4人分の料金で登録","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283"},{"label":"2026 一般登録料（General Program・早期）","value":"NT$14,000（USD$440）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283"}],"title":"研究室・企業での使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Microsystems, Packaging, Assembly and Circuits Technology Conferenceで、2026年の公式サイトは第21回と表記しています。2026年はIAAC（IMAPS All Asia Conference）を名称に含めたIMPACT-IAAC 2026です。主催はIEEE-EPS、iMAPS Taiwan、ITRI、TPCAの4団体です。","facts":[{"label":"2026 正式名称・回次","value":"21st International Microsystems, Packaging, Assembly and Circuits Technology Conference","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 主催","value":"IEEE-EPS、iMAPS Taiwan、ITRI、TPCA","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"IAAC の意味（2026 program）","value":"IMAPS All Asia Conference","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2025 主催（Program Book）","value":"IEEE-EPS Taipei、iMAPS-Taiwan Chapter、ITRI、TPCA","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"},{"label":"事務局所在地","value":"Taoyuan City, Taiwan","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年の企画セッションはAMDやASEなどの企業、JIEPなどの団体名を付けて組まれています。スポンサー枠にはIndustry / Special ForumとTabletop Exhibitionがあります。TPCA Show会場のOpen Seminar IIはiNEMIが担当します。2025年の講演者の所属にはNational University of Singaporeがあります。","facts":[{"label":"2026 企業企画セッション例","value":"S3 Compute & Enterprise AI（AMD）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 企業企画セッション例","value":"S23 Advanced Package in AI Era（ASE）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2026 スポンサー枠","value":"Industry / Special Forum、Tabletop Exhibition","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=198&lang=en&sid=1283"},{"label":"2026 Open Seminar（TPCA Show会場）","value":"Open Seminar II: Large Form Factor Assembly（iNEMI）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"},{"label":"2025 講演者の所属例","value":"National University of Singapore","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/IMPACT%202025/IMPACT%202025%20ProgramBook%20%E5%AE%8C%E6%95%B4%E7%89%88(%E5%90%AB%E5%B0%81%E9%9D%A2%E5%B0%81%E5%BA%95)%20%E5%A3%93%E7%B8%AE.pdf"}],"title":"運営と参加者","eyebrow":"community"},"comparison":{"id":"comparison","body":"公式サイトはIMPACT-IAACの範囲をパッケージからPCBまでと定め、PCB区分（B1〜B4）を独立に設けています。TPCA Show 2026と併催で、TPCA ShowのMain StageでOpen Seminarを開く構成です。","facts":[{"label":"2026 TPCA Show との併催","value":"Co-hosting Event - TPCA Show 2026","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283"},{"label":"2026 Open Seminar の会場","value":"TPCA Show Main Stage（L-1409）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年は投稿受付を3月13日に開き、abstract締切は延長後の6月30日、採否通知は7月22日でした。full paperの締切は8月28日と9月9日が併記されています。採択論文（oral・poster）は期限までに登録しないとプログラムから外されます。abstract、full paper、PPT、posterのテンプレートが公式サイトで配布されています。","facts":[{"label":"2026 投稿受付開始","value":"2026-03-13","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 abstract 締切","value":"2026-06-30（延長後）","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 採否通知","value":"2026-07-22","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 full paper 締切表記","value":"August 28, 2026 と September 9, 2026 が併記","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 登録の条件","value":"採択論文（oral・poster）は期限までに登録。未登録の論文はプログラムから削除","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"},{"label":"2026 配布テンプレート","value":"Abstract／Full paper／PPT／Poster","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"}],"title":"投稿と締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年は採択論文（oral・poster）を期限までに登録する必要があり、未登録の論文はプログラムから削除されます。発表形式はoral presentationsとposterです。2025年のauthor guidelineは、oralとposterの両方でfull paperを提出するよう求めていました。","facts":[{"label":"2025 author guideline","value":"full paperはoral・posterとも提出","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/order/1283/news_list.aspx?sid=1283&lang=en&pid=804"},{"label":"2026 発表形式","value":"oral presentations と posters","checkedAt":"2026-10-08","sourceUrl":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283"}],"title":"論文の扱い","eyebrow":"publication"}},"sources":[{"url":"https://www.impact.org.tw/site/page.aspx?lang=en&pid=901&sid=1283","role":"official","label":"IMPACT-IAAC 2026 公式サイト（Home）","checkedAt":"2026-10-08","evidenceLocator":"トップの【Date】【Venue】【Organizer】欄とフッター"},{"url":"https://www.impact.org.tw/site/mypage.aspx?pid=195&lang=en&sid=1283","role":"cfp","label":"Paper Submission（2026）","checkedAt":"2026-10-08","evidenceLocator":"SCOPE OF PAPER SOLICITED、BEST PAPER AWARD、IMPORTANT DATE"},{"url":"https://www.impact.org.tw/site/userdata/1283/Program_final.pdf","role":"program","label":"IMPACT-IAAC 2026 Program（PDF）","checkedAt":"2026-10-08","evidenceLocator":"日別のPlenary、セッション表、PDC、Open Seminar"},{"url":"https://www.impact.org.tw/site/mypage.aspx?pid=124&lang=en&sid=1283","role":"registration","label":"Registration（2026）","checkedAt":"2026-10-08","evidenceLocator":"Registration Information と料金表"},{"url":"https://www.impact.org.tw/site/mypage.aspx?pid=198&lang=en&sid=1283","role":"sponsor","label":"Sponsor（2026）","checkedAt":"2026-10-08","evidenceLocator":"2026 Sponsorship Package の節"},{"url":"https://www.impact.org.tw/site/order/1283/news_list.aspx?sid=1283&lang=en&pid=804","role":"official","label":"News","checkedAt":"2026-10-08","evidenceLocator":"2026 Call For Papers と2025 Author Notice の記事"},{"url":"https://www.impact.org.tw/site/mypage.aspx?pid=305&lang=en&sid=1283","role":"history","label":"History: IMPACT 2025","checkedAt":"2026-10-08","evidenceLocator":"Theme の行"},{"url":"https://www.impact.org.tw/site/mypage.aspx?pid=268&lang=en&sid=1283","role":"history","label":"History: 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face-to-faceと明記され、口頭発表は現地での発表でQ&A込み25分です。初日の11月3日は15:30〜18:00が受付です。","facts":[{"label":"2026 会期","value":"2026-11-03（火）〜06（金）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"2026 会場","value":"Paradise Hotel Busan, Korea","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"2026 開催形式","value":"Onsite face-to-face Symposium","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"2026 初日","value":"11月3日 15:30-18:00 Registration","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=glance"},{"label":"2026 口頭発表","value":"現地発表、Q&A込み25分","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=presentation_guideline"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"ISMP 2026はelectronic materials、devices、packagingの基礎・応用を対象とし、技術分野は7つあります。Package Integrationはflip chip bonding、hybrid bonding、RDL process、2.5D、3Dの5つのsubcommitteeに分かれ、Hybrid Bondingはwafer-to-waferとdie-to-waferのbonding processを扱います。Substrate and Interposersはorganic、ceramic、glass-basedの基板・interposerを対象とし、分野7はReliability Engineeringです。General Chairの挨拶はchiplet package design、2.xD/3.xD integration、fluxless bonding、hybrid bonding、co-packaged optics、qubit integrationを2026年の話題に挙げています。","facts":[{"label":"2026 対象範囲","value":"electronic materials, devices, and packaging の基礎・応用","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"2026 Package Integration の構成","value":"5 subcommittees（Flip Chip Bonding / Hybrid Bonding / RDL Process / 2.5D / 3D）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"2026 Hybrid Bonding の対象","value":"wafer-to-wafer / die-to-wafer bonding","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"2026 Substrate and Interposers","value":"organic, ceramic, glass-based の基板・interposer","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"2026 分野7","value":"Reliability Engineering","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"2026 General Chair が挙げる話題","value":"chiplet package design、2.xD/3.xD integration、fluxless bonding、hybrid bonding、co-packaged optics、qubit integration","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=welcome_message"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"提出されたabstractはProgram Committeeがstandard review proceduresで審査します。発表形式（oral／poster）とセッションの割り当ては著者の希望にかかわらずProgram Committeeが最終決定します。full paperはpeer reviewを経て指定ジャーナルに掲載されます。","facts":[{"label":"abstract審査","value":"Program Committee による standard review procedures","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=submission_guidelines"},{"label":"セッション・発表形式の決定","value":"Program Committee が最終決定","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=topics"},{"label":"full paper の査読","value":"peer review後、指定ジャーナルに掲載","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=full_paper_submission"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"初回開催年と過去の開催地はISMP公式サイトに未公開です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"2026年が第24回にあたります。","facts":[{"label":"2026 回次","value":"第24回","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=welcome_message"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryはOpenAIのTerry KangとSK hynixのJi Yong Parkの2件で、keynoteにはimecのZsolt Tokei、Samsung ElectronicsのWon Kyoung Choi、NVIDIAのNandish Mehtaが登壇します。口頭セッションにはA. Bump Bonding、B. AI/HBM Materials、C. Glass Core I、E. Virtual Metrologyなどがあります。O. ICEP Session、N. IMPACT Session、T. IEIE Sessionという名前のセッションも組まれています。ポスターは幅940mm×高さ1800mm以内です。","facts":[{"label":"2026 Plenary 1","value":"Terry Kang（OpenAI Inc., USA）\"Advanced Packaging Technology Trends, Scaling Challenges, and Industry Solutions\"","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=plenary_speakers"},{"label":"2026 Plenary 2","value":"Ji Yong Park（SK hynix Inc., Korea）\"The Future of AI Memory: Beyond Scaling, Beyond Packaging\"","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=plenary_speakers"},{"label":"2026 Keynote（imec）","value":"Zsolt Tokei（IMEC, Belgium）\"3D System Integration Technology\"","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=keynote_speakers"},{"label":"2026 Keynote（Samsung Electronics）","value":"Won Kyoung Choi \"The New Scaling Law: How Advanced Packaging is Redefining AI Compute Leadership\"","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=keynote_speakers"},{"label":"2026 Keynote（NVIDIA）","value":"Nandish Mehta \"Enabling High-Bandwidth-Density Optical Interconnects for Co-Integrated Optics\"","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=keynote_speakers"},{"label":"2026 口頭セッションの例","value":"A. Bump Bonding / B. AI/HBM Materials / C. Glass Core I / E. Virtual Metrology","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=glance"},{"label":"2026 名前付きセッション","value":"N. IMPACT Session / O. ICEP Session / T. IEIE Session","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=glance"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"学生は登録費が一般より低く設定されています（事前登録でKMEPS会員・海外参加者は一般₩700,000、学生₩400,000）。Regular登録にはplenary・keynote・invited・oral・posterの聴講、昼食（11/4・11/5）、Sponsor Night（11/4）、Banquet（11/5）が含まれます。2026年3月までに年会費を納めたKMEPS団体会員企業の社員は、事前登録のみ無料です。plenary・keynote・invitedの講演者の所属から、どの企業がどの題目で登壇するかを確認できます。","facts":[{"label":"2026 事前登録費（KMEPS会員・海外）","value":"Regular ₩700,000（$600）/ Student ₩400,000（$350）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=registration"},{"label":"2026 団体会員企業の無料登録","value":"2026年3月までに年会費を納めた団体会員企業の社員（事前登録のみ）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=registration"},{"label":"2026 Regular登録に含まれるもの","value":"plenary・keynote・invited・oral・poster、昼食（11/4・11/5）、Sponsor Night（11/4）、Banquet（11/5）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=registration"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Symposium on Microelectronics Packagingで、2026年は第24回です。主催はKorean Microelectronics Packaging Society（KMEPS）で、事務局もKMEPSが担います。KMEPSの学会サイトは、ISMP 2026を本学会が主管・主催する国際学術大会として告知しています。","facts":[{"label":"2026 正式名称・回次","value":"The 24th International Symposium on Microelectronics Packaging","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"主催（Host）","value":"Korean Microelectronics Packaging Society（KMEPS）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"事務局","value":"KMEPS（Seoul）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"学会側の告知","value":"KMEPSが主管・主催する国際学術大会","checkedAt":"2026-10-08","sourceUrl":"https://www.kmeps.or.kr/"},{"label":"公用語","value":"English","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはSeoul National UniversityのYoung-Chang Joo、Program ChairはSungkyunkwan UniversityのTae-Je Choです。Program Committeeには大学に加えてEMC Doctors、Camtec Korea、Hanwha e-ssential、LG Chemなどの企業の所属者が入っています。invited speakerの所属にはDNPやResonacなどの日本企業、オランダのASMPT、オーストリアのEV Groupがあります。","facts":[{"label":"2026 General Chair","value":"Young-Chang Joo（Seoul National University）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=committee"},{"label":"2026 Program Chair","value":"Tae-Je Cho（Sungkyunkwan University）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=committee"},{"label":"2026 Program Committee の企業所属","value":"EMC Doctors Inc. / Camtec Korea Inc. / Hanwha e-ssential / LG Chem","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=committee"},{"label":"2026 invited speaker（Japan所属の例）","value":"Satoru Kuramochi（DNP）/ Sadaaki Katoh（Resonac Corporation）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=speakers"},{"label":"2026 invited speaker（Netherlands所属の例）","value":"Ami Eitan（ASMPT Ltd.）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=speakers"},{"label":"2026 invited speaker（Austria所属の例）","value":"Thomas Kasbauer（EV Group）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=speakers"}],"title":"組織・参加者","eyebrow":"community"},"submission":{"id":"submission","body":"投稿は英語のabstractで、oralとposterの希望を投稿画面で選びます。2026年のabstract締切は6月30日、採否通知は9月4日まで、事前登録締切は10月20日です。採択後に著者登録期限までに登録しないとabstractは最終プログラムから外されます。","facts":[{"label":"2026 abstract締切","value":"2026-06-30","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=submission_guidelines"},{"label":"2026 採否通知","value":"2026-09-04まで（e-mail）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=submission_guidelines"},{"label":"2026 事前登録締切","value":"2026-10-20","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=overview"},{"label":"発表形式の希望","value":"oral / poster を投稿時に選択、最終決定はProgram 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の扱い","value":"推奨ジャーナルへ投稿","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=full_paper_submission"},{"label":"2026 掲載ジャーナル","value":"KMEPS（Journal of the Microelectronics and Packaging Society）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=full_paper_submission"},{"label":"2026 full paper 投稿期限","value":"2026-12-04（submission.kmeps.or.kr）","checkedAt":"2026-10-08","sourceUrl":"https://www.ismp.or.kr/html/?pmode=full_paper_submission"}],"title":"論文の掲載先","eyebrow":"publication"}},"sources":[{"url":"https://www.ismp.or.kr/html/?pmode=overview","role":"official","label":"ISMP 2026 Overview","checkedAt":"2026-10-08","evidenceLocator":"Title / Event Type / Date / Venue / Host / Key Dates の表"},{"url":"https://www.ismp.or.kr/html/?pmode=welcome_message","role":"official","label":"ISMP 2026 Welcome message","checkedAt":"2026-10-08","evidenceLocator":"General 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Semiconductor Conferenceで、略称CASは前身のAnnual Semiconductor Conference時代から引き継がれています。組織はIMT Bucharest、協賛はIEEE Electron Devices Societyで、毎年1回開かれます。2026年は第49回にあたります。","facts":[{"label":"正式名称・回次（2026）","value":"49th International Semiconductor Conference（CAS 2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.imt.ro/cas/"},{"label":"組織・協賛","value":"組織：National Institute for R&D in Microtechnologies（IMT Bucharest）／協賛：IEEE Electron Devices Society","checkedAt":"2026-10-08","sourceUrl":"https://www.imt.ro/cas/"},{"label":"IEEE eventとしての位置づけ","value":"1995年からIEEE event","checkedAt":"2026-10-08","sourceUrl":"https://www.imt.ro/cas/general_info.php"},{"label":"略称の由来","value":"当初の名称はAnnual Semiconductor 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1,600に設定されています。","question":"学生向けの制度はありますか。","sourceUrls":["https://www.iirw.org/publication","https://www.iirw.org/registration"]}],"headline":"IIRW 2026は2026年10月4〜8日にカリフォルニア州South Lake Tahoe近郊のStanford Sierra Conference Centerで開かれ、宿泊と食事を含む合宿形式をとります。","metaDescription":"IEEE International Integrated Reliability Workshop（IIRW）の起源、2026年Stanford Sierra会期、2ページ抄録とLate News、TDMR特集号への選抜、BTI・TDDB・メモリ信頼性などの対象領域を公式ページからまとめます。","oneLine":"IIRWは、1982年のWafer Level Reliability Workshopを起源とし、半導体デバイスの信頼性を製造・設計・試験・評価・シミュレーションの各面から議論するIEEEのワークショップです。","pageTitle":"IIRWとは｜1982年発祥の半導体信頼性ワークショップ、Lake Tahoe合宿形式","relatedConferenceIds":["irps","esref","ipfa","istfa","eos-esd-symposium","iolts"],"sections":{"cycle":{"id":"cycle","body":"2026年回は10月4〜8日、South Lake Tahoeから数マイル離れたFallen Leaf Lakeの奥にあるStanford Sierra Conference Centerで開かれます。最寄りの主要空港はReno International Airportです。登録費に宿泊、全食事、チュートリアル、discussion groups、Reliability Experts Forumが含まれる合宿形式で、宿泊は登録参加者に限られます。SFOとの間にはIIRWが送迎を用意しており、費用はUSD 350です。IEEE会員の登録費はUSD 2,200です。","facts":[{"label":"2026 会期","value":"2026-10-04〜08","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/home"},{"label":"2026 会場・都市","value":"Stanford Sierra Conference Center / South Lake Tahoe, CA, USA","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/home"},{"label":"2026 会場の位置","value":"Fallen Leaf Lakeの奥、South Lake Tahoeから数マイル。最寄りの主要空港はReno International Airport","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/venue"},{"label":"2026 宿泊の条件","value":"宿泊はIIRWの登録参加者のみ","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/venue"},{"label":"2026 登録費に含まれるもの","value":"宿泊、全食事、チュートリアル、discussion groups、Reliability Experts Forum、technical program","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/registration"},{"label":"2026 登録費（IEEE会員）","value":"USD 2,200","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/registration"},{"label":"2026 SFO送迎","value":"SFOとStanford Sierra Conference Centerの間をIIRWが送迎（USD 350）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/registration"}],"title":"開催サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"IIRWは電子デバイスの信頼性を、製造・設計・試験・特性評価・シミュレーションと、劣化を起こす欠陥や物理機構の同定から議論する場と自らを説明しています。2026年のSpecial Focus AreasはPower Electronic Reliability（SiC, GaN, PMICs）とHeterogeneous Integration/3DIC（TSVと積層パッケージ）です。トピックはDevice-Level、Reliability Characterization & Testing、Circuit, System, and Application-Level、Memory Reliabilityの4区分で、デバイス信頼性にはFET、FinFET、SOI、III-V、SiGeのHCI・BTI・TDDB・RTNが挙がっています。","facts":[{"label":"対象の定義","value":"製造・設計・試験・特性評価・シミュレーションを通じた電子デバイス信頼性と、その欠陥・物理機構の同定","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/home"},{"label":"2026 Special Focus Area（パワー）","value":"Power Electronic Reliability (SiC, GaN, PMICs)","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/home"},{"label":"2026 Special Focus Area（3DIC）","value":"Heterogeneous Integration/3DIC (TSV and stacking 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postersは会期中に最終審査を受けてからproceedingsに入ります。抄録には結果とその意義を簡潔に書き、裏付けとなる代表的なデータと図を入れることが求められます。採択された全著者にmentorが付き、発表と最終論文の品質を確保する仕組みです。","facts":[{"label":"論文の種類","value":"regular oral papers / refereed posters / open posters の3種","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"},{"label":"open postersの審査","value":"会期中に最終審査を経てproceedingsに収録","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"},{"label":"抄録に求める内容","value":"結果とその意義を明確かつ簡潔に記述","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"},{"label":"データ・図の要件","value":"代表的なデータと図が必須","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"},{"label":"mentor制度","value":"採択論文の全著者にmentorを割り当て","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"},{"label":"Top 5の選定基準","value":"抄録・発表・最終論文に対する委員会の評価","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/publication"}],"title":"査読・採択","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトはproceedingsがIEEE Xploreに収録されるかを明記しておらず、「workshop proceedings」とだけ書いています。PublicationページのBest student paper説明は「IRPS 2026」と書いており、2026年回の受賞者がどの年のIRPSに招かれるかは更新待ちの可能性があります。採択率、投稿件数、参加者数、国別内訳は公式ページに出ていません。歴代議長の一覧は1996年から始まり、1982〜1995年の各回の開催地や議長は掲載されていません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"前身のWafer Level Reliability Workshopは1982年にDARPAの資金で始まり、DARPAの支援は最初の8年間続きました。1992年初めにIRPS Board of Directorsの議長へ運営が引き継がれ、1993年に現在の名称へ変わりました。公式サイトのHistoryページには1996年以降の歴代General Chair・TPC Chairが、過去のCall for Papersと技術プログラムのページには2022〜2025年のPDFが掲載されています。","facts":[{"label":"初回開催年と根拠","value":"1982年（Wafer Level Reliability 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LaRow氏らが入っています。所属地は米国、オーストリア、ベルギー、イタリアにわたります。","facts":[{"label":"2026 General Chair","value":"Jean Yang-Scharlotta（NASA JPL, United States）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/committees"},{"label":"2026 Technical Program Chair","value":"Michael Waltl（TU Wien, Austria）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/committees"},{"label":"2026 Vice-Technical Program Chair","value":"Alexander Grill（imec, Belgium）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/committees"},{"label":"2026 Reliability Experts Forum Chair","value":"Uma Sharma（Micron, United States）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/committees"},{"label":"2026 Finance Chair","value":"James Ashton（Keysight, United States）","checkedAt":"2026-10-08","sourceUrl":"https://www.iirw.org/committees"},{"label":"2026 Publication Chair","value":"Andrea Padovani（University of Modena and Reggio Emilia, 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Electronic Devices、Electrons, Spins, Photons, Phonons in 1D, 2D Materials、Surfaces under Vacuum, Vapor, Plasmaなどがあります。シンポジウムは量子応用、機械学習、量子ビーム、カーボンニュートラル材料の4本で、量子応用のシンポジウムだけは一般投稿を受け付けていません。対象とする研究者層として、公式ページは物性物理、表面物理、分子物理、無機・有機化学、生物学の分野を挙げています。","facts":[{"label":"2026 Session（デバイス）","value":"Surface and Interface Engineering for Electronic Devices","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/registration"},{"label":"2026 Session（作製）","value":"Fabrication of Nanostructures and Films","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/registration"},{"label":"2026 Session（低次元材料）","value":"Electrons, Spins, Photons, Phonons in 1D, 2D Materials","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/registration"},{"label":"2026 Session（プロセス環境）","value":"Surfaces under Vacuum, Vapor, Plasma","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/registration"},{"label":"2026 Symposia","value":"Quantum Applications / Machine 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Symposium on Atomically Controlled Surfaces and Interfaces）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"名称変更","value":"1999年のACSIN-5からNanostructuresを追加","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"前回","value":"ACSIN-15（2024）/ Suzhou","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"日本開催の例","value":"ACSIN-12（2013）Tsukuba / ACSIN-14（2018）Sendai","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"Nanoscience Prize 創設","value":"ACSIN-5で創設、初回受賞者Don Eigler（IBM）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/awards"},{"label":"ICSPMの国際化","value":"1993年に国際colloquiumへ再編、以後毎年","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"ACSIN-16のplenaryには、Princeton UniversityのRoberto Car氏、Monash UniversityのMichael S. Fuhrer氏、University of Colorado BoulderのSteven M. George氏（Thermal Atomic Layer Etching）などが並びます。MITのPablo Jarillo-Herrero氏はAward Lectureを行います。招待講演には理化学研究所のTakashi Kobayashi氏によるシリコン量子ビットの講演があります。昼にはMicron Technology、RORZE IASによるLuncheon Seminarが組まれています。ポスター賞はStudent AwardとYoung Researcher Awardの2区分で、参加者投票を参考にAward Committeeが選びます。","facts":[{"label":"2026 Plenary（ALE）","value":"Steven M. George（Univ. of Colorado Boulder, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/program"},{"label":"2026 Plenary（量子材料）","value":"Michael S. 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Watanabe氏、Program Committee Chairは神戸大学のH. Onishi氏で、Steering Committee ChairはM. Yoshimura氏（Toyota Technological Inst.）とK. Sumitomo氏（Univ. of Hyogo）です。Exhibition担当にScienta Omicron、Publicity担当にDaicelの所属者が入っています。海外所属の例として、プログラムにはAalto University（Finland）の発表者が載っています。","facts":[{"label":"2026 Conference Chair","value":"H. Watanabe（Osaka Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 Steering committee Chair","value":"M. Yoshimura（Toyota Technological Inst.）/ K. Sumitomo（Univ. of Hyogo）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 Program committee Chair","value":"H. Onishi（Kobe Univ.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 Exhibition担当（企業所属）","value":"S. Toyoda（Scienta Omicron, Inc.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 Publicity担当（企業所属）","value":"T. Yoshikawa（Daicel, Corp.）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 program所属例（海外）","value":"Aalto University（Finland）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/program/all"}],"title":"運営体制","eyebrow":"community"},"comparison":{"id":"comparison","body":"ACSINが2年ごとに大陸を巡回するのに対し、合同相手のICSPMは日本で毎年開かれ（Hawaii開催が2回）、Scanning Probe Microscopyを扱います。公式ページは、両会議の関係を強め、時代の要請に応えるため、2026年は合同で開くと説明しています。","facts":[{"label":"ICSPMの開催地","value":"日本で毎年（Hawaii開催2回）","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"},{"label":"2026 合同開催の理由","value":"ナノ科学技術の発展に向けて両会議の関係を強化","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"ACSIN-16の投稿はA4・1ページのabstract PDFです。abstract締切は当初の2026年6月22日から7月6日に延長され、Late Poster締切は9月7日でした。口頭発表は発表10分と討論5分です。JJAP Focus Collection向けの論文は10月26日から受け付け、締切は12月15日です。","facts":[{"label":"2026 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Reviewの投稿資格が与えられます。招待講演者以外の採択論文には掲載料がかかります。","facts":[{"label":"2026 掲載先","value":"Japanese Journal of Applied Physics (JJAP) Focus Collection","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/publication"},{"label":"2026 Focus Collection名","value":"Atomically Controlled Surfaces, Interfaces and Nanostructures 2026 (ACSIN2026)","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/publication"},{"label":"2026 論文種別（一般発表者）","value":"Regular Papersのみ","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/publication"},{"label":"2026 掲載料","value":"招待講演者以外の採択論文に課金","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/publication"},{"label":"ACSI-1 proceedings","value":"Applied Surface Science Vol. 60-61 (Elsevier 1992)","checkedAt":"2026-10-08","sourceUrl":"https://www.icspm.net/acsin16/publication"},{"label":"ACSIN-13 proceedings","value":"Condensed Matter, Vol. 2 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Microscopy）と合同で開かれます。","label":"走査プローブ顕微鏡（SPM）","sourceUrl":"https://www.icspm.net/acsin16/registration"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"B","publicReason":"1991年に東京で始まり、隔年で大陸を巡回する表面・界面・ナノ構造の国際会議。表面物理から化学・生物までを対象とし、応用物理学会の薄膜・表面物理分科会が関わる。"},"publicReasons":[{"body":"会議サイト","sourceUrl":"https://www.icspm.net/acsin16/"}],"sourceUrls":[{"url":"https://www.icspm.net/acsin16/"},{"url":"https://www.icspm.net/acsin16/program"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"live","label":"開催中","closedNote":"","imminent":false,"staleEnded":false,"steps":[{"id":"pre-cfp","label":"投稿受付前","state":"done"},{"id":"open","label":"投稿受付中","state":"done"},{"id":"review","label":"投稿終了","state":"done"},{"id":"notified","label":"採否通知","state":"done"},{"id":"program","label":"プログラム公開","state":"done"},{"id":"live","label":"開催中","state":"current"},{"id":"ended","label":"終了","state":"upcoming"}],"currentStep":"live","nextEvent":{"kind":"session-end","label":"最終日","date":"2026-10-23","daysUntil":1},"lastPast":{"kind":"late-news","label":"Late News締切","date":"2026-09-07"},"milestones":[{"kind":"abstract","label":"要旨締切","date":"2026-07-06","state":"past"},{"kind":"late-news","label":"Late News締切","date":"2026-09-07","state":"past"},{"kind":"session","label":"開催","date":"2026-10-19","endDate":"2026-10-23","state":"upcoming"},{"kind":"author","label":"最終原稿締切","date":"2026-12-15","state":"upcoming"}],"action":{"kind":"program","text":"会期中です。当日の発表はプログラムに載っています。","href":"https://www.icspm.net/acsin16/program","linkLabel":"プログラムを開く"}},"digestDeadline":null,"paperDeadline":null,"acceptanceNotice":null,"submissionOpensOn":null,"programPublishedOn":null},{"id":"asian-test-symposium","code":"ATS","name":"IEEE Asian Test Symposium","cfpUrl":"https://www.ats2026.tw/submission-guidelines","coverage":"IC testing, design-for-test, reliability, memory test, chiplet/3D IC test, silicon lifecycle management, hardware security, and AI for testをアジア太平洋軸で確認できる。","geography":"アジア太平洋 / グローバル","organizer":"IEEE / IEEE CEDA / National Tsing Hua University / National Sun Yat-sen University","watchItems":"design-for-test, IC testing, chiplet test, 3D IC test, memory test, reliability, silicon lifecycle management, AI for test, hardware security","historyNote":"Official ATS 2026 home identifies the December 1-3, 2026 Kaohsiung meeting as the IEEE 35th Asian Test Symposium.","officialUrl":"https://www.ats2026.tw/","nextDeadline":null,"cfpHighlights":"Official ATS 2026 home lists the final paper submission extension as 2026-07-07 AoE, notification of acceptance as 2026-09-14, camera-ready manuscript as 2026-10-13, and the conference in Kaohsiung on 2026-12-01 to 2026-12-03.","trackingPhase":"投稿受付中 / 公式CFP確認済み","deadlineEvents":[{"code":"ATS","date":"2026-07-07","kind":"paper","name":"IEEE Asian Test Symposium","label":"論文締切","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-68},{"code":"ATS","date":"2026-09-14","kind":"acceptance","name":"IEEE Asian Test Symposium","label":"採択通知","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":1},{"code":"ATS","date":"2026-09-21","kind":"late-news","name":"IEEE Asian Test Symposium","label":"Late News締切","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":8},{"code":"ATS","date":"2026-10-13","kind":"final-paper","name":"IEEE Asian Test Symposium","label":"最終原稿締切","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":30}],"proceedingsUrl":"https://ieeexplore.ieee.org/xpl/conhome/1000669/all-proceedings","primaryDeadline":{"code":"ATS","date":"2026-07-07","kind":"paper","name":"IEEE Asian Test Symposium","label":"論文締切","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-68},"submissionFormat":"Official ATS 2026 submission guidelines request original unpublished PDF manuscripts, with regular paper submissions limited to 6 pages and accepted papers intended for IEEE Xplore publication subject to requirements.","trackingPhaseGroup":"submission-open","nextPrimaryDeadline":null,"primaryDeadlineEvents":[{"code":"ATS","date":"2026-07-07","kind":"paper","name":"IEEE Asian Test Symposium","label":"論文締切","cfpUrl":"https://www.ats2026.tw/submission-guidelines","fieldId":"circuits-systems","fieldTitle":"回路 / システム / 設計自動化","officialUrl":"https://www.ats2026.tw/","conferenceId":"asian-test-symposium","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-68},{"code":"ATS","date":"2026-09-21","kind":"late-news","name":"IEEE Asian Test Symposium","label":"Late 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meeting as the IEEE 35th Asian Test Symposium.","ageYears":35,"checkedAt":"2026-07-02","sourceUrl":"https://www.ats2026.tw/","sourceClass":"official_program","displayLabel":"35th ATS 2026 / Dec. 1-3 in Kaohsiung","sourceStatus":"confirmed","historyYearBasis":"official_edition_count_current_cycle_source","comparisonMaxYears":80},"organizationMix":[{"note":"Combines official ATS 2026 Steering Committee, Organizing Committee, and Technical Program Committee rows; duplicate people in separate official committees remain source rows.","label":"ATS 2026 committee affiliation organization mix","segments":[{"kind":"university","rows":59,"label":"University","value":88.1},{"kind":"research","rows":6,"label":"Research institute","value":9},{"kind":"company","rows":2,"label":"Company","value":3}],"sourceUrl":"https://www.ats2026.tw/technical-program-committee","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"67 official steering, organizing, and technical-program committee source rows"},{"note":"Official ATS/ITC-Asia 2025 Advance Program rows are limited to Session X (ATS) regular-session presentations; only the first listed affiliation organization in each row is counted.","label":"ATS/ITC-Asia 2025 ATS regular-session first-listed affiliation organization mix","segments":[{"kind":"university","rows":19,"label":"University","value":65.5},{"kind":"research","rows":8,"label":"Research institute","value":27.6},{"kind":"company","rows":2,"label":"Company","value":6.9}],"sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"29 official ATS-labeled regular-session presentation rows"},{"note":"Counts official organizer links and visible sponsor rows on the ATS 2026 sponsorship/footer listing; placeholder sponsor slots without an organization name are excluded.","label":"ATS 2026 organizer / sponsor organization mix","segments":[{"kind":"university","rows":2,"label":"University","value":33.3},{"kind":"company","rows":2,"label":"Company","value":33.3},{"kind":"professional-society","rows":2,"label":"Professional society","value":33.3}],"sourceUrl":"https://www.ats2026.tw/sponsorship","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"6 official organizer and sponsor listing rows"}],"companyBreakdowns":[{"note":"Company rows are counted at official committee source-row grain.","rows":[{"rows":1,"company":"NVIDIA"},{"rows":1,"company":"Qualcomm Technologies"}],"label":"ATS 2026 committee company affiliation rows","sourceUrl":"https://www.ats2026.tw/technical-program-committee","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"67 official steering, organizing, and technical-program committee source rows"},{"note":"Company rows are counted at first-listed affiliation organization grain for official ATS-labeled regular-session presentations.","rows":[{"rows":1,"company":"Advantest Corporation"},{"rows":1,"company":"Texas Instruments"}],"label":"ATS/ITC-Asia 2025 ATS regular-session first-listed company affiliation rows","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"29 official ATS-labeled regular-session presentation rows"}],"countryBreakdowns":[{"note":"Country/region rows are based on the listed affiliation organization for the first-listed author group in each official ATS-labeled regular-session row; this is affiliation organization geography.","rows":[{"rows":7,"country":"Germany","percentage":24.1},{"rows":6,"country":"China","percentage":20.7},{"rows":4,"country":"France","percentage":13.8},{"rows":4,"country":"Taiwan","percentage":13.8},{"rows":3,"country":"Japan","percentage":10.3},{"rows":2,"country":"United States","percentage":6.9},{"rows":1,"country":"Belgium","percentage":3.4},{"rows":1,"country":"Cyprus","percentage":3.4},{"rows":1,"country":"India","percentage":3.4}],"label":"ATS/ITC-Asia 2025 ATS regular-session first-listed affiliation organization country/region","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"29 official ATS-labeled regular-session presentation rows"}],"sponsorOrganizations":{"note":"The list enumerates every official organizer and visible sponsor row with an organization name on the ATS 2026 sponsorship/footer listing. Placeholder sponsor slots are excluded.","rows":[{"role":"Organizer","tier":"Organizer","organization":"IEEE","organizationType":"professional_society"},{"role":"Organizer","tier":"Organizer","organization":"IEEE CEDA","organizationType":"professional_society"},{"role":"Organizer","tier":"Organizer","organization":"National Tsing Hua University","organizationType":"university"},{"role":"Organizer","tier":"Organizer","organization":"National Sun Yat-sen University","organizationType":"university"},{"role":"Sponsor","tier":"Sponsor","organization":"Siemens","organizationType":"company"},{"role":"Sponsor","tier":"Sponsor","organization":"Synopsys","organizationType":"company"}],"label":"ATS 2026 organizer / sponsor listing","sourceUrl":"https://www.ats2026.tw/sponsorship","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"6 official organizer and sponsor listing rows"}},"city":"Kaohsiung","tier":"a","venue":"Hotel Nikko Kaohsiung","country":"Taiwan","fieldId":"circuits-systems","editions":[],"genreIds":["circuits","reliability"],"processes":[{"id":"prc_a6f22e1b038f4c418b05dd9f3360ff02","nameJa":"テスト","primary":true},{"id":"prc_504bdbceb4374294bf10f958ebdf3013","nameJa":"DFT（テスト容易化設計）","primary":false},{"id":"prc_68c07e3f7bcd46508d80e56a7116cbb7","nameJa":"信頼性評価","primary":false}],"cycleLabel":"2026-12-01〜03 / Hotel Nikko Kaohsiung, Kaohsiung, Taiwan","fieldTitle":"回路 / システム / 設計自動化","organizers":[{"id":"org_2844a8d98d4c4154af9bff4aa60d7269","name":"National Sun Yat-sen University"},{"id":"org_8edea7d0420048e2b50b900f9e4cb047","name":"National Tsing Hua University"}],"lastVerified":"2026-09-13","paperDeadline":"2026-07-07","currentCycleEnd":"2026-12-03","acceptanceNotice":"2026-09-14","lateNewsDeadline":"2026-09-21","peerReviewStatus":"peer-reviewed","currentCycleStart":"2026-12-01","finalPaperDeadline":"2026-10-13","canonicalId":"conf_f823afb1b0ad479096ec3d994cd6979d","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-08-05","conferenceId":"asian-test-symposium","confidenceScore":1,"coverage":{"faqCount":9,"factCount":87,"topicCount":8,"sourceCount":18,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年12月1日から3日まで、台湾・高雄のHotel Nikko Kaohsiung（No. 268, Linsen 4th Rd., Qianzhen Dist., Kaohsiung City 806023）で開催されます。IEEE CEDAのイベントページも同じ日程と会場を掲載しています。会議名はIEEE 35th Asian Test Symposium (ATS 2026)です。","question":"ATS 2026はいつ、どこで開催されますか。","sourceUrls":["https://www.ats2026.tw/","https://www.ats2026.tw/venue-and-transportation","https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"]},{"answer":"Regular Paperの投稿締切は2026年7月7日で、公式サイトはこれをJune 6, 2026からの最終延長と告知しています。採択通知は2026年9月14日、camera readyは2026年10月13日で、いずれも23:59 Anywhere on Earthです。別枠としてLate-Breaking Resultsは2026年9月21日、Special・Innovative Practices Sessionの提案は2026年8月31日、Doctoral Thesis Awardは2026年8月17日が締切です。","question":"投稿締切はいつですか。","sourceUrls":["https://www.ats2026.tw/","https://www.ats2026.tw/submission-guidelines","https://www.ats2026.tw/doctoral-thesis-award"]},{"answer":"Late-Breaking Resultsトラックの案内に、すべての投稿がATS 2026 Technical Program Committeeによるpeer reviewを受けると明記されています。一方、Submission Guidelinesには著者情報の匿名化やdouble-blindに関する要件は書かれていません。Technical Program CommitteeはChair 1名とMembers 41名で構成されています。","question":"査読はありますか。double-blindですか。","sourceUrls":["https://www.ats2026.tw/","https://www.ats2026.tw/submission-guidelines","https://www.ats2026.tw/technical-program-committee"]},{"answer":"採択率は公表されていません。ATS 2026公式サイトのトップ、Submission Guidelines、Call for Papers PDFのいずれにも投稿件数・採択件数・採択率の記載はありません。過去回の採択率を掲載したページも公式サイト内には設けられていません。","question":"採択率はどのくらいですか。","sourceUrls":["https://www.ats2026.tw/submission-guidelines","https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf"]},{"answer":"採択論文はelectronic proceedingsに収録され、IEEE Xploreのscopeとquality要件を満たすことを条件に収録申請されます。Call for Papers PDFも最終的にIEEE Xplore Digital Libraryで公開される旨を記載しています。掲載には2026年10月13日までのAUTHOR登録の入金と、現地での発表の両方が必要で、発表されなかった論文は掲載されません。","question":"どこに論文が掲載されますか。","sourceUrls":["https://www.ats2026.tw/submission-guidelines","https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf","https://www.ats2026.tw/registration"]},{"answer":"Member Feeは、Author（2026年10月13日まで）TWD 20,000、Advance（10月14日〜11月13日）TWD 20,000、Regular（11月14日〜11月20日）TWD 24,000です。Student Memberは同順にTWD 20,000／8,400／10,800、Non-MemberはTWD 24,000／24,000／28,800です。全技術セッション、tutorial sessions、proceedings、昼食、Welcome reception、Banquet、Social eventが含まれます。","question":"参加費はいくらですか。","sourceUrls":["https://www.ats2026.tw/registration"]},{"answer":"公式サイトは、学術研究者と産業界の実務者の双方を対象とした場であると説明しています。運営面ではOrganizing Committeeの8役職が台湾の大学、North American LiaisonがArizona State University、European LiaisonがUniversity of Stuttgartです。Technical Program Committee 42名のうち企業所属の表記はNVIDIAとQualcomm Technologies Inc.の2名で、他は大学・研究機関です。","question":"誰が投稿・参加する会議ですか。","sourceUrls":["https://www.ats2026.tw/","https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf","https://www.ats2026.tw/technical-program-committee"]},{"answer":"2026年サイクルの会場は台湾・高雄で、ビザ申請用の招待状が必要な場合はsecretariat（Mr. Yung-Ming Chiu）へメールで依頼します。直前の2025年サイクルは東京のTokyo Big Sightで、ITC-Asia 2025との合同かつSEMICON Japan 2025との併催でした。Steering ChairはEhime University所属で、2025年のATS Steering Committeeには日本の機関が複数含まれています。","question":"日本から参加する場合の注意点はありますか。","sourceUrls":["https://www.ats2026.tw/registration","https://www.ats2026.tw/steering-committee","https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/","https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/committees/"]},{"answer":"2026年8月5日時点では未公開です。Agenda、Keynotes、Invited Talks、Tutorial、Floor Planの各メニューはいずれもunder-constructionページにリンクしています。骨格だけはsponsorshipページのTentative Programに、開会式と基調講演、技術論文セッション、産業向けセッション、パネル討論、ポスター・学生向け企画の5構成として示されており、最終内容は査読結果と招待講演者により決まると明記されています。","question":"2026年のキーノートやプログラムはもう分かりますか。","sourceUrls":["https://www.ats2026.tw/under-construction","https://www.ats2026.tw/sponsorship"]}],"headline":"ATS 2026公式サイトと2025年サイクル公式サイト、IEEE CEDAのイベントページ、DBLPの巻一覧から、会期・投稿規定・査読・掲載先・委員会構成・開催地の推移を一次情報だけで確認する。","metaDescription":"IEEE Asian Test Symposium(ATS)の第35回は2026年12月1〜3日に台湾・高雄のHotel Nikko Kaohsiungで開催。投稿区分と締切、査読、IEEE Xplore収録、参加費、委員会構成、開催地の推移を公式情報で整理する。","oneLine":"ATS(Asian Test Symposium)は、IC・モジュール・システムのテスト技術を対象にIEEEとIEEE CEDAがスポンサーするアジア発の国際シンポジウムで、第35回のATS 2026は2026年12月1〜3日に台湾・高雄のHotel Nikko Kaohsiungで開催される。","pageTitle":"ATS(Asian Test Symposium)とは｜IEEE主催のアジア半導体テスト国際会議を公式情報で読む","relatedConferenceIds":["itc","vts","ets","dfts","iolts","date"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルは台湾・高雄で3日間の日程が確定しており、会場住所と空港からの経路まで公式ページに掲載されている。参加費はTWD建てでAuthor／Advance／Regularの3期区分があり、Author期の締切がcamera ready締切と同じ10月13日に置かれている点が実務上重要である。オンライン参加やハイブリッド開催の記載はなく、逆に現地発表が掲載条件として明記されている。","facts":[{"note":"公式トップのConference Overviewとサイト見出しに記載。","label":"2026 会期","value":"2026年12月1日〜12月3日","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"Venue & Transportationページに住所とMRT紅線R8(Sanduo Shopping District)からの徒歩経路が掲載されている。","label":"2026 会場・所在地","value":"Hotel Nikko Kaohsiung（No. 268, Linsen 4th Rd., Qianzhen Dist., Kaohsiung City 806023, Taiwan (R.O.C.)）","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/venue-and-transportation"},{"note":"Registrationページに、発表担当の著者は登録して現地(on-site)で発表しなければならず、発表されなかった論文は掲載されないと明記されている。","label":"2026 開催形式","value":"現地開催（hybrid / online の記載なし）","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"Registrationページの料金表。Non-Member Feeは同順にTWD 24,000 / 24,000 / 28,800。","label":"2026 参加登録費(Member Fee)","value":"Author（〜2026年10月13日）TWD 20,000 / Advance（10月14日〜11月13日）TWD 20,000 / Regular（11月14日〜11月20日）TWD 24,000","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"Social eventはAUTHORおよびfull Member/Non-Member登録に含まれる、と注記されている。","label":"2026 登録費に含まれるもの","value":"全技術セッション、tutorial sessions、conference proceedings、コーヒーブレイクと昼食、Welcome reception(12月1日)、Banquet(12月2日)、Social event(12月3日)","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"キャンセルはsecretariat宛メールで行い確認が必要、と同ページに記載。","label":"2026 キャンセル・返金規定","value":"2026年11月1日より前は80%返金、それ以降は返金なし","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"IEEE CEDAのイベントページのDate・Geographic Location・Venue欄。","label":"2026 CEDA側の会期表記","value":"1 December 2026 – 3 December 2026 / Geographic Location: Kaohsiung, Taiwan / Venue: Hotel Nikko Kaohsiung","checkedAt":"2026-08-05","sourceUrl":"https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"},{"note":"ATS 2026公式トップには2027年サイクルの開催地・会期の告知は掲載されていない。","label":"次サイクル(2027)の公表状況","value":"未公表","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"}],"title":"2026年サイクルの会期・会場・費用","eyebrow":"cycle"},"scope":{"id":"scope","body":"スコープはテスト技術に特化しており、トピック一覧は48項目に及ぶ。ATS 2026ではRegular Paperに加えてLate-Breaking Results(LBR)トラックが新設され、EasyChair上のトラック選択がそのまま投稿区分に対応する。自分のテーマが対象かどうかは、48項目の箇条書きに近い項目があるかで判断でき、リストは「but not limited to」と前置きされている。","facts":[{"note":"公式トップのConference Overview末尾が投稿範囲としてこの範囲を示している。","label":"2026 スコープ文","value":"system, module, and device testing の全側面と、より広い test technologies を対象","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"Submission GuidelinesのTopics欄の箇条書きを数えた件数。冒頭に「Original papers on, but not limited to, the following areas are invited」と前置きされている。","label":"2026 トピック項目数","value":"48項目","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"公式トップのTopics欄からの抜粋。他にATE Design、ATPG、Test Compression、RF Test、Test Economics等が並ぶ。","label":"2026 トピック(抜粋)","value":"AI test and Test for AI / Design for Testability (DFT) / Built-In Self-Test (BIST) / Memory Test, Diagnosis, and Repair / SiP, Chiplet, 2.5D and 3D IC Test / Hardware Oriented Security and Trust / Safety and Test for Automotive ICs / Yield Analysis, Learning, and Enhancement","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップの投稿手順欄が、EasyChairのSelect a Trackページで選ぶトラック名として列挙している。","label":"2026 投稿トラック構成","value":"Regular Paper / ATS 2026 Late-Breaking Results (LBR) / ATS 2026 Special & Innovative Session Proposals の3トラック","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップのCall for Late Breaking Results欄が「For the first time」としてLBRトラックの導入を告知している。","label":"2026 LBRトラックの新設","value":"ATS 2026で初導入","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"Submission Guidelinesのトピック欄は包含リストのみで、除外分野の記述がない。","label":"明示された対象外","value":"対象外分野の明示的な列挙はない","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"2025年サイクルのadvance programで、Session 1・3・4・7・9・10・12が(ATS)、Session 2・5・6・8・11が(ITC-Asia)と付記されている。","label":"2025 セッションの分割","value":"Regular Session全12本のうち、(ATS)表記が7本、(ITC-Asia)表記が5本","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/"}],"title":"対象領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"LBRトラックの案内に、投稿はすべてATS 2026 Technical Program Committeeによるpeer reviewを受けると明記されている。一方でdouble-blind等の匿名化要件はSubmission Guidelinesに書かれておらず、採択率も公表されていない。Special SessionやLBRについては提案・投稿の推奨条件が列挙されており、これが実質的な評価観点として読める。","facts":[{"note":"公式トップのCall for Late Breaking Results欄に、すべての投稿がATS 2026 Technical Program Committeeによりpeer-reviewされると記載。","label":"2026 査読方式(LBR)","value":"peer-review（ATS 2026 Technical Program Committeeによる査読）","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"Technical Program CommitteeページのChairとMembersの掲載人数。","label":"2026 Technical Program Committee 規模","value":"Chair 1名 + Members 41名","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/technical-program-committee"},{"note":"Submission GuidelinesにはFormat・Page Limit・Template・Author Requirements・Publicationの各項目のみで、著者情報の匿名化に関する要件は書かれていない。","label":"2026 double-blind の有無","value":"記載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"公式トップおよびSubmission Guidelinesに投稿件数・採択件数・採択率の記載はない。","label":"2026 採択率","value":"未公表","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"公式トップのSpecial Session Proposals欄が「particularly encouraged when they」として列挙する4条件。","label":"2026 Special Session の推奨条件","value":"重要または萌芽的な研究方向を扱うこと、産学の相補的な視点を集めること、最近の進展・課題・将来機会を集中的に議論すること、ATSコミュニティ内で新たな研究活動と連携を促す話題であること","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップのCall for Late Breaking Results欄が例示する2類型。","label":"2026 LBR の適格例","value":"既知の問題に新しい研究視点から取り組むbreakthroughな手法、および提案の実現可能性を示す十分な根拠を伴う有望な新結果","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"ATS Doctoral Thesis AwardページのSubmission欄。","label":"2026 Doctoral Thesis Award の選考","value":"提出物がselection processを経て、通過者はATS 2026の指定セッションで約15分発表し、juryが受賞者を決定してATS 2026会期中に発表","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/doctoral-thesis-award"}],"title":"査読方式と選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年8月5日時点で、ATS 2026の公式サイト・Call for Papers PDF・IEEE CEDAのイベントページのいずれも、採択率、投稿件数、採択件数、参加者数、2026年のキーノート登壇者と詳細プログラム、フロアプラン、ジャーナル特集号への招待、展示会・出展枠、ATSの初回開催年、2027年サイクルの開催地と会期を公表していない。公式サイトにhistory / past conferencesに相当するページはなく、過去回の統計をまとめたページも存在しない。締切は2026年サイクルで複数回延期されているため、日付は必ず公式トップのImportant Datesで最新を確認する必要がある。委員会ページには所属国が書かれておらず、国別内訳を扱うときは根拠ページを取り違えないようにしたい。スポンサーとして企業名が載っていることは当該イベントへの支援を示すにとどまり、顧客関係・売上・採用・共同研究を示すものではない。2025年サイクルはITC-Asia 2025との合同開催で運営委員会・会場・締切・料金体系が2026年サイクルとは別物であり、両者の数値を混ぜないよう年と回数を必ず添えたい。このページはATS単独の会議情報を対象とし、合同開催相手であるITC-Asia側だけの情報や、収録済み個別論文の技術内容は扱わない。","facts":[{"note":"公式サイト側は取り消し線でJune 6, 2026を残したままJuly 7, 2026を併記している。","label":"締切表記の不一致","value":"IEEE CEDAのイベントページはSubmission Deadlineを6 Jun 2026と表示しているが、公式サイトは2026年7月7日を最終延長後の締切として告知している","checkedAt":"2026-08-05","sourceUrl":"https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"},{"note":"件名は本文・要件欄とも[ATS 2026] Doctoral Thesis Award Submissionで一致している。","label":"Doctoral Thesis Award の連絡先の揺れ","value":"本文ではProgram Chair (tyhsieh.nsysu@gmail.com) 宛の提出と記載される一方、同じページのSubmission Requirements欄にはh.yotsuyanagi@tokushima-u.ac.jpが併記されている","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/doctoral-thesis-award"},{"note":"Agenda / Keynotes / Invited Talks / Tutorial / Floor Planも同じunder-constructionにリンクしている。","label":"メニューと実ページの不一致","value":"グローバルメニューのRegistrationはunder-constructionにリンクしているが、/registrationには料金表と返金規定が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/under-construction"},{"note":"2026年8月5日時点で、公式トップおよびプログラム関連ページにこれらの記載はない。","label":"2026 未公開の項目","value":"採択率、投稿件数、参加者数、キーノート登壇者、詳細プログラム、フロアプラン、2027年サイクルの開催地","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"所属国が読めるのはCall for Papers PDFのOrganizing Committee欄と、2025年サイクルのCommitteesページ。","label":"委員会ページの国名表記","value":"Technical Program CommitteeとSteering Committeeのページは所属機関名のみで国名を併記していない","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/technical-program-committee"},{"note":"2025年サイクルのCommitteesページ。同ページはOrganizing CommitteeとSteering Committee (ATS) / (ITC-Asia) / Program Committeeを別建てで掲載し、Organizing CommitteeとSteering Committee (ATS) では所属機関に国名を併記している。","label":"2025 運営委員会（別サイクルの委員構成）","value":"General Co-Chairs は Satoshi Ohtake (Oita University, Japan) と Yoshinobu Higami (Ehime University, Japan)。Program Co-Chairs 以下の役職も日本の機関の所属者で占められている","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/committees/"}],"title":"未公開項目と読み違えやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"2026年が第35回であることは公式サイトとCFP PDFで確認できるが、初回開催年を明記した公式ページは今回の調査範囲では見つからなかった。DBLPに登録された最古の巻は1995年の第4回で、第1〜3回は登録されていない。2010年以降の開催地はDBLPの一覧から中国・インド・日本・台湾を軸に巡回してきたことが読み取れる。","facts":[{"note":"公式トップのConference Overview。","label":"2026 回数","value":"第35回（IEEE 35th Asian Test Symposium）","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"2025年サイクル公式トップの見出しとOverview欄。","label":"2025 回数と開催地","value":"第34回、2025年12月16〜19日、Conference Tower of Tokyo Big Sight（東京）。ITC-Asia 2025（第9回）と合同、SEMICON Japan 2025と併催","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"},{"note":"sponsorshipページのCall for Sponsorships冒頭の説明文（a history of more than three decades）。","label":"公式サイトによる年数表記","value":"IEEEがスポンサーする長年開催の国際会議で、30年を超える歴史があると記載","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"},{"note":"ATS 2026公式サイトにはhistory / past conferencesに相当するページがなく、sponsorshipページも年数の概括のみで初回年を書いていない。","label":"初回開催年","value":"今回参照した公式ページには明記がない","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"},{"note":"DBLPのATS一覧の最下部の巻。第1〜3回に相当する巻はDBLPに登録されていない。","label":"書誌上の最古の巻","value":"4th Asian Test Symposium (ATS '95), November 23-24, 1995, Bangalore, India","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"},{"note":"DBLPの各巻タイトルに含まれる開催地。第19回(2010)から第34回(2025)まで年順に並べたもの。","label":"開催地の推移(2010-2025)","value":"Shanghai(China) → New Delhi(India) → Niigata(Japan) → Yilan County(Taiwan) → Hangzhou(China) → Mumbai(India) → Hiroshima(Japan) → Taipei City(Taiwan) → Hefei(China) → Kolkata(India) → Penang(Malaysia) → Matsuyama, Ehime(Japan) → Taichung City(Taiwan) → Beijing(China) → Ahmedabad(India) → Tokyo(Japan)","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"},{"note":"DBLPのATS一覧から日本開催の巻を抽出したもの。","label":"日本開催の履歴(1995年以降・DBLP掲載分)","value":"1997 Akita / 2001 Kyoto / 2006 Fukuoka / 2008 Sapporo / 2012 Niigata / 2016 Hiroshima / 2021 Matsuyama, Ehime / 2025 Tokyo","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"},{"note":"例として2007年は16th Asian Test Symposium、2013年は22nd Asian Test SymposiumとIEEEなしで登録される一方、2008年は17th IEEE Asian Test Symposium、2022年はIEEE 31st Asian Test SymposiumとIEEE付きで登録されている。","label":"巻タイトルの表記揺れ","value":"DBLPの巻タイトルは年により「Asian Test Symposium」と「IEEE Asian Test Symposium」が混在","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"}],"title":"回数・開催地の推移と初回開催年の扱い","eyebrow":"history"},"program":{"id":"program","body":"2026年サイクルのAgenda・Keynotes・Invited Talks・Tutorialは2026年8月5日時点でいずれもunder-constructionページに転送され、内容は未公開である。プログラムの骨格を知りたい場合は、sponsorshipページに掲載された暫定構成と、2025年サイクルの実施済みadvance programが手がかりになる。2025年はチュートリアル2本、キーノート2本、招待講演2本、Special Session、Industry Session、2つのワークショップが並ぶ構成だった。","facts":[{"note":"公式トップのグローバルメニューのリンク先がすべて/under-constructionになっている。","label":"2026 プログラム関連ページの状態","value":"Agenda / Keynotes / Invited Talks / Tutorial / Floor Plan はunder-constructionページにリンクされ未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/under-construction"},{"note":"sponsorshipページのTentative Program of ATS 2026欄。最終内容は査読結果と招待講演者により決まると明記されている。","label":"2026 暫定プログラム構成","value":"(1) Opening Ceremony & Keynote Speeches (2) Technical Paper Sessions (3) Industry-Oriented Sessions / Industry Forum (4) Panel Discussions (5) Poster Sessions & Student / Young Researcher Activities","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"},{"note":"Organizing CommitteeページのTutorial Chair欄。","label":"2026 Tutorial Chair","value":"Charles H.-P. Wen (National Yang Ming Chiao Tung University)","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/organizing-committee"},{"note":"2025年サイクル公式トップのUpcoming Event Highlights欄とadvance program。","label":"2025 keynote","value":"[K1] New Design for Test Technologies for the Angstrom Era Multi-Die Designs（Janusz Rajski, Siemens EDA）/ [K2] Software-Based Self-Test with Formal Methods for RISC-V Ecosystems（Bernd Becker, University of Freiburg）","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"},{"note":"2025年サイクル公式トップのUpcoming Event Highlights欄。","label":"2025 invited talk","value":"[I1] 3DIC and advanced packaging technologies for enabling the evolution of AI（Ryutaro Yasuhara, TSMC Japan 3DIC R&D Center）/ [I2] Next-Generation SoC Design “Chiplet 2.5D/3D Technology” and Beyond（Kazuyuki Irie, TSMC Group, GUC Japan）","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"},{"note":"2025年サイクルadvance programの12月16日の欄。いずれもRoom 701で午前・午後に実施。","label":"2025 tutorial","value":"[T1] Designing Chiplets & 3DIC for Silicon Lifecycle Management（Yervant Zorian, Synopsys）/ [T2] Enhancing Trustworthiness in the Global IC Supply Chain（Giorgio Di Natale, Université Grenoble-Alpes）","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/"},{"note":"2025年サイクルadvance programの各枠。Doctoral Thesis Award Contestは12月17日にRoom 702で3件の発表が行われた。","label":"2025 特別セッション・併設イベント","value":"Special Session「6 Years of Graduate School Intelligent Methods Test and Reliability」、Industry Session、ETT workshop（Session 1・2）、AI-TREATS Workshop（Session 1・2）、ATS Doctoral Thesis Award Contest","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/"},{"note":"sponsorshipページの3パッケージの特典一覧に展示ブースの項目はなく、公式サイトにexhibition/exhibitorのページも設けられていない。","label":"2026 展示会の有無","value":"記載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"}],"title":"プログラム構成と併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"研究室側は、6ページのRegular Paperに加えて3ページのLBRで進行中の成果を出せる点と、博士課程学生向けのDoctoral Thesis Awardが年1回・生涯1回の応募枠である点を計画に織り込める。企業側は、Innovative Practices Sessionの提案枠とスポンサーパッケージが産業側の露出手段として用意されている。日本からの参加は2025年が東京開催、2026年は台湾・高雄開催と年により大きく異なるため、渡航とビザの前提が変わる。","facts":[{"note":"投稿締切2026年8月17日、資格通知2026年9月9日。提出物は1ページの論文要旨（図表・参考文献用に1ページ追加可）、別紙のカバーページ、指導教員の推薦。","label":"2026 学生・博士課程向けの枠","value":"ATS Doctoral Thesis Award。2026年に修了した、または2027年に修了予定の博士学生が対象で、生涯1回のみ参加可、複数の地域予選への重複応募は禁止","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/doctoral-thesis-award"},{"note":"Registrationページの料金表。Author区分は学生でも一般と同額に設定されている。","label":"2026 学生の参加費","value":"Student Member: Author TWD 20,000 / Advance TWD 8,400 / Regular TWD 10,800。Student Non-Member: Author TWD 24,000 / Advance TWD 10,800 / Regular TWD 12,100","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"採択後は1ページのセッションアブストラクトを提出する。提案締切は2026年8月31日。","label":"2026 企業実務者向けの枠","value":"Innovative Practices Session。重要な産業課題や実務ニーズ、革新的な手法・技術・ワークフロー、実導入からの教訓、研究と実務のギャップの提示などが推奨条件として列挙されている","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"投稿締切2026年9月21日、通知2026年10月1日。","label":"2026 進行中の成果を出す枠","value":"Late-Breaking Results (LBR) トラック。参考文献込み3ページのextended abstractで新しい結果や着想を投稿でき、採択分はproceedingsに収録される","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"Gold(NTD 200,000)は無料登録4件と広告・ロゴ・資料配布、Silver(NTD 100,000)は無料登録2件とロゴ・資料配布。","label":"2026 企業のスポンサー参加","value":"Platinum(NTD 300,000)は無料登録6件、プログラム調整を前提としたkeynote登壇機会、Program Book広告、公式サイトへのロゴとプロモーション動画リンク、現地での資料配布","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"},{"note":"Registrationページの注記。公式サイトにはVisa Applicationの独立ページも用意されている。","label":"2026 日本から参加する際の手続き","value":"会場は台湾・高雄。台湾ビザ申請用の招待状が必要な場合はsecretariatのMr. Yung-Ming Chiu宛にメールで依頼する","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/registration"},{"note":"SEMICON Japan 2025と併催。開催後の告知としてATS 2025 Best Paper AwardとDoctoral Thesis Award受賞者の掲載がある。","label":"2025 の日本開催実績","value":"2025年サイクルは東京・Tokyo Big Sight Conference Towerで2025年12月16〜19日に開催された","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"}],"title":"研究室と企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ATSは公式サイト上で回数付きの正式名称を用い、2026年サイクルはIEEE 35th Asian Test Symposium (ATS 2026)と表記される。運営主体はページ共通フッタのOrganizers欄に4組織が並び、IEEE側の位置づけはIEEE CEDAのイベントページで確認できる。日本語資料で「ATS」とだけ書かれている場合は年と回数を必ず添えて特定するとよい。","facts":[{"note":"公式トップのConference Overview冒頭とページタイトルに同じ表記が置かれている。","label":"2026 正式名称","value":"IEEE 35th Asian Test Symposium (ATS 2026)","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"IEEE CEDAのイベントページが項目名付きで表示している。","label":"2026 略称・シリーズ表記","value":"Acronym: ATS 2026 / Series: ATS / Event Type: Conference","checkedAt":"2026-08-05","sourceUrl":"https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"},{"note":"公式サイト全ページ共通フッタのOrganizers欄に4組織のリンクが並ぶ。","label":"2026 Organizers表記","value":"IEEE / IEEE CEDA / National Tsing Hua University / National Sun Yat-sen University","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"IEEE CEDAのイベントページのSponsorship欄とIEEE Region欄。","label":"2026 IEEE側の区分","value":"Sponsorship: Financially Sponsored / IEEE Region: Region 10 (Asia and Pacific)","checkedAt":"2026-08-05","sourceUrl":"https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"},{"note":"Call for Papers PDFの本文がThe 35th Asian Test Symposium (ATS 2026)と記す。","label":"第N回","value":"第35回","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf"},{"note":"DBLPのATS一覧には1995年の第4回から2025年の第34回まで、各年1件ずつ巻が登録されている。","label":"開催頻度(書誌ベース)","value":"年1回","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"},{"note":"2025年サイクル公式サイトの見出し行にこの併記がある。","label":"2025 正式名称","value":"The 34th IEEE Asian Test Symposium（The 9th IEEE International Test Conference in Asia と合同、ATS/ITC-Asia 2025）","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"2026年サイクルの運営はNational Tsing Hua UniversityとNational Sun Yat-sen Universityが中核で、Call for Papers PDFには各役職に所属国が併記されている。Steering CommitteeとTechnical Program Committeeのページは所属機関名のみで国名を書いていないため、国別の内訳を示す場合はCFP PDFか2025年サイクルの委員ページを根拠にする必要がある。公式サイトが企業名を掲げているのは共通フッタのSponsors欄で、掲げられているのはSiemensとSynopsysの2社である。スポンサー掲載は当該イベントへの支援を示すものであり、顧客関係・売上・採用・共同研究を示すものではない。スポンサー各社が支払った実際の金額や、どの区分での支援かを示す公式の記載はない。","facts":[{"note":"Finance、Local Arrangement、Registration、Publicity、Publication、Tutorial、North American Liaison、European Liaisonを含む。","label":"2026 Organizing Committee","value":"General Chair: Jing-Jia Liou (National Tsing Hua University) / Program Chair: Tong-Yu Hsieh (National Sun Yat-sen University) ほか計10役職","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/organizing-committee"},{"note":"Call for Papers PDF左段は各役職に所属機関と国名を併記している。ここでの国は公式表記上の所属機関の所在国であり、個人の国籍ではない。","label":"2026 Organizing Committee の所属国表記","value":"Taiwan 8役職、United States of America 1役職（North American Liaison）、Germany 1役職（European Liaison）","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf"},{"note":"Members欄にはArizona State University、National Taiwan University、Nara 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の機関が併記されている","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/committees/"},{"note":"公式サイト共通フッタのSponsors欄に2社名のリンクが並ぶ（テキストリンクで、ロゴ画像ではない）。掲載は当該イベントへの支援を示すもので、取引・採用・共同研究を示すものではない。","label":"2026 sponsor 掲載","value":"Siemens、Synopsys","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"sponsorshipページの特典表。Platinumのみプログラム調整を前提としたkeynote登壇機会とプロモーション動画リンクが付く。","label":"2026 スポンサーパッケージ","value":"Platinum NTD 300,000 / Gold NTD 200,000 / Silver NTD 100,000。無料参加登録はそれぞれ6件・4件・2件","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"}],"title":"委員会構成とスポンサー掲載","eyebrow":"community"},"comparison":{"id":"comparison","body":"ATS自身の公式ページから読める棲み分けの手がかりは2つある。1つはTTTCの博士論文賞の地域予選構成で、ATSはVTS・ETS・LATWと並ぶsemi-finalの1つとされ、finalはITCで行われる。もう1つは2025年サイクルでITC-Asiaと合同開催しセッションを(ATS)と(ITC-Asia)に分けた運用で、アジア地域内での役割分担が具体的に確認できる。","facts":[{"note":"ATS 2026のATS Doctoral Thesis Awardページの説明文。","label":"2027 TTTC's E. J. McCluskey Doctoral Thesis Award の予選会場","value":"semi-finalはAsian Test Symposium (ATS)、VLSI Test Symposium (VTS)、European Test Symposium (ETS)、Latin American Test Workshop (LATW) で開催され、各予選の勝者が2027 International Test Conference (ITC) のfinalで競う","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/doctoral-thesis-award"},{"note":"IEEE CEDAのイベントページのIEEE Region欄。","label":"IEEE上の地域区分","value":"IEEE Region 10 (Asia and Pacific)","checkedAt":"2026-08-05","sourceUrl":"https://ieee-ceda.org/event/conference/2026-ieee-35th-asian-test-symposium"},{"note":"キーノート、招待講演、Special Session、Industry Session、ワークショップは共通枠として編成されている。","label":"2025 ITC-Asiaとの合同開催","value":"第34回ATSと第9回ITC-Asiaが合同開催され、advance program上でSession 1〜12が(ATS)と(ITC-Asia)に区別された","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/advance-program/"},{"note":"ATS 2026公式トップおよびメニューに、他会議との合同開催や併催イベントの告知はない。","label":"2026 の併催関係","value":"他会議との合同・併催の記載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"この表現はATS 2026公式サイト自身の記述であり、第三者による順位評価ではない。","label":"公式サイトによる自己記述","value":"アジアにおけるIC testing、DFT、reliability、system validation、AIおよび高性能計算システムのテスト、hardware securityの分野で「one of the most influential international forums in Asia」と広く認識されている、とsponsorshipページが記載","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/sponsorship"}],"title":"近いテスト系会議との位置関係","eyebrow":"comparison"},"submission":{"id":"submission","body":"Regular Paperは6ページ上限のIEEE 2段組で、投稿はEasyChairのみ、メール投稿は受け付けない。LBRとSpecial／Innovative Practicesは締切も分量も別建てで、Special Sessionは採択後に10ページ1本か4ページ3本という選択制の原稿要件が課される。締切は2026年サイクルで複数回延期されているため、投稿前に公式トップのImportant Datesを直接見るのが確実である。","facts":[{"note":"Submission GuidelinesのFormat / Page Limit / Template欄。","label":"2026 Regular Paper 書式","value":"PDFのみ、IEEE 2-column format(A4)、abstract・図・表・参考文献を含め6ページ以内、標準のIEEE conference 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2026年10月13日","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップのCall for Late Breaking Results内のImportant Dates。","label":"2026 LBR 締切","value":"投稿 2026年9月21日 / 著者通知 2026年10月1日 / camera-ready 2026年10月13日","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップのCall for Special Session and Innovative Practices Session Proposals内のImportant Dates。セッション長は60〜90分、各技術講演は約20〜30分と規定。","label":"2026 Special・Innovative Practices 提案締切","value":"提案 2026年8月31日 / 採択通知 2026年9月13日","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"公式トップの投稿手順欄とAuthorsメニューのOnline Submissionリンク。Regular／LBR／Special & Innovativeで同一のEasyChairを使い、トラック選択で区別する。","label":"2026 投稿システム","value":"EasyChair（https://easychair.org/conferences/?conf=ats2026）。メールによる投稿は受け付けない","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/"},{"note":"2025年サイクル公式サイトのKey Dates。当初の7月22日・8月5日から延期された経緯が取り消し線付きで残っている。","label":"2025 締切（参考・別サイクル）","value":"投稿 2025年8月12日 / 採択通知 2025年9月24日 / camera-ready 2025年10月24日","checkedAt":"2026-08-05","sourceUrl":"https://www.itc-asia.info.hiroshima-cu.ac.jp/2025/"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"採択論文はelectronic proceedingsに収録され、IEEE Xploreへの収録はscopeとquality要件を満たすことを条件に申請される。掲載には著者登録の入金期限と現地発表の両方が条件として課されており、登録1件でカバーされるのは1論文だけである点に注意がいる。ジャーナル特集号への招待については公式サイトに記載がない。","facts":[{"note":"Submission GuidelinesのPublication and IEEE Xplore欄。","label":"2026 掲載先","value":"electronic proceedings。採択論文はIEEE Xploreのscopeおよびquality要件を満たすことを条件に収録申請される","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"Call for Papers PDFのPaper Submission欄。","label":"2026 CFP PDFの掲載表記","value":"最終原稿はelectronic proceedingsに収録され、最終的にIEEE Xplore Digital Libraryで公開される","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/build/assets/ats2026_cfp-CbysE2hz.pdf"},{"note":"公式トップのCall for Late Breaking Results欄。","label":"2026 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Issue招待に関する記述はない。","label":"特集号招待","value":"記載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.ats2026.tw/submission-guidelines"},{"note":"DBLPのAsian Test Symposium一覧。各巻に会期・開催地が付されている。","label":"書誌上の収録状況","value":"DBLPには1995年の第4回から2025年の第34回までの巻が登録されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/ats/index.html"}],"title":"proceedingsと掲載条件","eyebrow":"publication"}},"sources":[{"url":"https://www.ats2026.tw/","role":"official","label":"ATS 2026 公式トップ","checkedAt":"2026-08-05","evidenceLocator":"Latest News & Announcements、Important Dates、Conference Overview、Call for Late Breaking Results (LBR)、Call for Special Session and Innovative Practices Session Proposals、Call for Papers、Topics一覧、共通フッタのOrganizers / Sponsors欄"},{"url":"https://www.ats2026.tw/submission-guidelines","role":"cfp","label":"ATS 2026 Submission Guidelines","checkedAt":"2026-08-05","evidenceLocator":"Submission Guidelines(Format / Page Limit / Template)、Author Requirements、Publication and IEEE 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プログラム委員（表彰担当）","value":"坂本一之（大阪大）、八田振一郎（京都大）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"},{"label":"2021 講演奨励賞の申込","value":"参加登録・各種申込の項目に講演奨励賞申込","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/index.htm"}],"title":"プログラム編成と表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年について本ページで扱った事項は、学会の講演会一覧に載る会期と会場です。セッション構成・講演時間・委員会・協賛団体は2021年大会のページに基づく過去の例です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"学会の講演会一覧は2017年の第37回表面科学学術講演会と、2018年以降の日本表面真空学会学術講演会を並べています。2022年はIVC-22（第22回真空国際会議）と共催、2024年はISSS-10と同時開催で、国際会議と合わせて開かれる年があります。要旨集の一覧では表面科学学術講演会の第25回（2005年）までさかのぼれます。","facts":[{"label":"日本表面真空学会名での最初の掲載","value":"2018年日本表面真空学会学術講演会（2018.11.19-21）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/annual.html"},{"label":"2022 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企業企画","value":"企業展示、実用新技術セミナー","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/index.htm"},{"label":"2021 部会セッション（摩擦）","value":"摩擦の科学研究部会「SDGsの実現に向けた摩擦観測と制御」","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/program.html"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"2021年大会の参加登録費には学生区分があり、学会の学生会員は事前登録3,000円でした。企業向けには、企業展示と実用新技術セミナーが企業企画として組まれ、2021年の企業展示申込は10月15日まででした。","facts":[{"label":"2021 学生会員の参加登録費","value":"事前3,000円 / 会期中3,500円","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"},{"label":"2021 企業展示申込締切","value":"2021-10-15 24:00","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"大会名は年ごとに「YYYY年日本表面真空学会学術講演会」と表記され、主催は公益社団法人日本表面真空学会（The Japan Society of Vacuum and Surface Science）です。2017年までは表面科学学術講演会として回次で数えられていました。2021年大会では応用物理学会、電子情報通信学会、日本半導体製造装置協会、日本真空工業会などが協賛しています。","facts":[{"label":"2026 大会名","value":"2026年日本表面真空学会学術講演会","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/annual.html"},{"label":"主催（2021大会ページ）","value":"公益社団法人 日本表面真空学会（The Japan Society of Vacuum and Surface Science）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"},{"label":"2017年までの名称","value":"表面科学学術講演会（2017年は第37回）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/annual.html"},{"label":"2021 協賛団体（例）","value":"応用物理学会、電子情報通信学会、日本半導体製造装置協会、日本真空工業会など","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2021年大会は実行委員会とプログラム委員会で運営され、実行委員長は東工大の山崎詩郎氏でした。実行委員会には会場、企業展示、Web・広報、Confit・J-STAGE、予算・会計・庶務の担当が置かれ、企業展示担当には入江工研やシエンタ オミクロンの所属者も入っています。","facts":[{"label":"2021 実行委員長","value":"山崎詩郎（東工大）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"},{"label":"2021 企業展示担当","value":"入江則裕（入江工研）、大岩烈（シエンタ オミクロン）ほか","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"},{"label":"2021 実行委員会の担当区分","value":"会場、企業展示、Web・広報、Confit・J-STAGE、予算・会計・庶務","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/scope.html"}],"title":"運営体制","eyebrow":"community"},"comparison":{"id":"comparison","body":"日本表面真空学会は年次の学術講演会とは別に、表面科学のISSS、スパッタリング・プラズマプロセスのISSP（2026年は6月30日〜7月3日、京都リサーチパーク）などの国際会議を学会ページで案内しています。年次大会は2024年にISSS-10、2022年にIVC-22と合わせて開かれました。ISSS-11は2027年11月に新潟の朱鷺メッセで予定されています。","facts":[{"label":"ISSS-10","value":"第10回表面科学に関する国際シンポジウム（2024.10.20-24 北九州国際会議場）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/international.html"},{"label":"ISSS-11","value":"2027-11-14〜18 / 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ポスター形式","value":"A0サイズ、JPGまたはPNG（3MBまで）を事前アップロード","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/program.html"}],"title":"講演申込","eyebrow":"submission"},"publication":{"id":"publication","body":"講演要旨集はJ-STAGEで公開されます。学会の要旨集ページの最新は2025年（2025.10）で、表面科学学術講演会時代は2005年の第25回から掲載されています。2021年大会の要旨集は大会後の12月にJ-STAGEで公開されました。","facts":[{"label":"最新の要旨集","value":"2025年（2025.10）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/summary.html"},{"label":"表面科学学術講演会時代の要旨集","value":"第25回（2005.11）から掲載","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/ja/lecture/summary.html"},{"label":"2021 要旨集の公開","value":"J-STAGEで公開（2021-12-29の更新）","checkedAt":"2026-10-08","sourceUrl":"https://www.jvss.jp/annual/mtg2021/index.htm"}],"title":"講演要旨集","eyebrow":"publication"}},"sources":[{"url":"https://www.jvss.jp/ja/lecture/annual.html","role":"society","label":"日本表面真空学会 学術講演会一覧","checkedAt":"2026-10-08","evidenceLocator":"「学術講演会」見出し下の年別リンク一覧"},{"url":"https://www.jvss.jp/ja/lecture/summary.html","role":"proceedings","label":"日本表面真空学会 学術講演会要旨集","checkedAt":"2026-10-08","evidenceLocator":"「学術講演会要旨集」見出し下の年別リンク一覧"},{"url":"https://www.jvss.jp/ja/lecture/international.html","role":"society","label":"日本表面真空学会 国際会議一覧","checkedAt":"2026-10-08","evidenceLocator":"「国際会議」見出し下の一覧"},{"url":"https://www.jvss.jp/annual/mtg2021/index.htm","role":"archive","label":"2021年日本表面真空学会学術講演会 トップ","checkedAt":"2026-10-08","evidenceLocator":"重要なお知らせとメニュー"},{"url":"https://www.jvss.jp/annual/mtg2021/scope.html","role":"archive","label":"2021年学術講演会 概要","checkedAt":"2026-10-08","evidenceLocator":"概要、重要な締切日、参加登録費、主催・協賛、実行委員会"},{"url":"https://www.jvss.jp/annual/mtg2021/program.html","role":"archive","label":"2021年学術講演会 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seminarが組まれています。","question":"企業は展示できますか？","sourceUrls":["https://imnc.jp/2026/sponsor/"]}],"headline":"第39回のMNC 2026は2026年11月10日〜13日に福岡のHotel New Otani Hakataで開かれ、plenaryにはimec、理化学研究所、University of Twenteの登壇者が入っています。","metaDescription":"MNC（International Microprocesses and Nanotechnology Conference）の主催、第39回MNC 2026の福岡会期、1〜2ページabstractとLate News、JJAP Focus Collection、plenary、過去の参加者数を公式ページから整理しました。","oneLine":"MNCは、応用物理学会（JSAP）が主催し、photon・electron・ionなどを使うリソグラフィとプロセス技術、ナノ材料・ナノデバイス、MEMS、Atomic Layer Processingの研究発表を集める国際会議です。","pageTitle":"MNCとは｜応用物理学会主催のリソグラフィとナノテクノロジーの国際会議（2026年は福岡）","relatedConferenceIds":["spie-alp","spie-photomask-euv","spie-patterning-materials","mems","jsap-spring-autumn","ieee-nano"],"sections":{"cycle":{"id":"cycle","body":"MNC 2026は2026年11月10日〜13日にHotel New Otani Hakata（福岡）で開かれます。初日の11月10日にはkeynote講演がオンデマンドで公開され、視聴期間は12月10日までです。Poster Session Iは11月12日15:40-17:10に組まれています。","facts":[{"label":"2026 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Materials）、Nano Surfaces, Interfaces, and Advanced Nano Metrology、Section 3のNanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces、Section 5のMicrosystem Technology and MEMS、Section 6のAtomic Layer Processing（ALP）があります。","facts":[{"label":"公式の対象範囲（2026 General）","value":"photon、electron、ionなどを使うリソグラフィ科学とプロセス技術、ナノ材料","checkedAt":"2026-10-08","sourceUrl":"https://imnc.jp/2026/general/"},{"label":"2026 Section 1","value":"1: Lithography, Metrology and Related Technologies（1-1 Advanced Lithography and Patterning、1-2 Electron and Ion Beam Technologies、1-3 Patterning Materials）","checkedAt":"2026-10-08","sourceUrl":"https://imnc.jp/2026/general/"},{"label":"2026 Section 2-6","value":"Nano Surfaces, Interfaces, and Advanced Nano Metrology","checkedAt":"2026-10-08","sourceUrl":"https://imnc.jp/2026/general/"},{"label":"2026 Section 3","value":"Nanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces","checkedAt":"2026-10-08","sourceUrl":"https://imnc.jp/2026/general/"},{"label":"2026 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relationship.","role":"supporting_organization","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"cx-f1ce5cedcf","eventYear":2026,"sourceUrl":"https://www.aspdac.com/aspdac2026/sponsor/","commonKind":"company","commonName":"witmem","sourceLabel":"ASP-DAC 2026: Sponsors / Supporters","organizationUrl":"https://www.witmem.com/","organizationSlug":"witmem","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"witmem","canonicalName":"witmem","canonicalOrganizationSlug":"cx-f1ce5cedcf","canonicalCompanyId":null}],"conferenceResearchDossierV1":{"checkedAt":"2026-08-06","conferenceId":"asp-dac","confidenceScore":1,"coverage":{"faqCount":8,"factCount":83,"topicCount":8,"sourceCount":25,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"年次開催で、近年は 1 月に開かれています。第31回の ASP-DAC 2026 は January 19-22, 2026 に Hong Kong Disneyland Hotel で、第32回の ASP-DAC 2027 は Jan. 25-28, 2027 に東京の Hitotsubashi Hall, National Center of Sciences Building で開催されます。開催地は bylaws により日本とアジア・南太平洋地域の他国・他地域とで交互に設定されます。","question":"ASP-DAC は毎年いつ、どこで開かれますか。","sourceUrls":["https://www.aspdac.com/aspdac2026/","https://www.aspdac.com/aspdac2027/","https://www.aspdac.com/aspdac/bylaws/"]},{"answer":"ASP-DAC 2027 はアブストラクト登録が 5 PM AOE July 11 (Sat), 2026、本文 PDF が 5 PM AOE July 18 (Sat), 2026、採否通知が Sept. 4 (Fri), 2026、最終原稿が 5 PM AOE Oct. 27 (Fri), 2026 です。原稿は double-columned PDF で本文 6 ページ以内、参考文献のみ 1 ページ追加できます。University LSI Design Contest は別枠で、投稿 August 15 (Sat), 2026(Extended)、2〜4 ページの camera-ready summary paper を EasyChair から提出します。","question":"投稿締切と原稿の分量を教えてください。","sourceUrls":["https://www.aspdac.com/aspdac2027/cfp/","https://www.aspdac.com/aspdac2027/cfd/"]},{"answer":"double-blind review です。原稿本文・アブストラクト・参考文献・引用のいずれにも著者名や所属を書けない旨が CFP に明記されています。過去サイクルのプログラム冊子には、Technical Program Committee が subcommittee に分かれて審査したことが記載されています(2025 年は 144 名・14 subcommittees、2026 年は 176 名・13 subcommittees)。いずれの年も対面(一部ハイブリッド)の TPC meeting で採否を決めています。","question":"査読はありますか。方式は何ですか。","sourceUrls":["https://www.aspdac.com/aspdac2027/cfp/","https://www.aspdac.com/aspdac2025/pdf/final_program.pdf","https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"]},{"answer":"ASP-DAC 2026 の Full Program に印字された TPC Chair メッセージによると、749 件のアブストラクト(34 countries and regions)のうち 639 件が full manuscript として提出され、612 件が査読に進み、176 件が採択されました。採択率は 28.7% です。ASP-DAC 2025 は 537 submissions のうち 168 papers を採択して 31%、ASP-DAC 2024 は 482 full manuscripts のうち 139 papers を採択して 28.8% でした。2027 年サイクルは会期前のため、採択率はまだ公表されていません。","question":"採択率はどのくらいですか。","sourceUrls":["https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf","https://www.aspdac.com/aspdac2025/pdf/final_program.pdf","https://www.aspdac.com/aspdac2024/technical_program/ASP-DAC%202024%20Program%20Book.pdf"]},{"answer":"投稿者の産学別内訳は公式サイトに掲載されていません。公表されているのは投稿元の広がりで、ASP-DAC 2026 は 749 abstracts が 34 countries and regions から、ASP-DAC 2025 は \"537 full manuscripts from 29 counties/regions\"、ASP-DAC 2024 は 482 full manuscripts が 25 countries/regions からと記載されています(いずれも所属機関の所在地の集計)。運営側では、2027 年 Organizing Committee に TSMC Design Technology Japan、NEC、Hitachi の所属者が入っています。","question":"誰が投稿していますか。大学と企業のどちらですか。","sourceUrls":["https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf","https://www.aspdac.com/aspdac2025/pdf/final_program.pdf","https://www.aspdac.com/aspdac2024/technical_program/ASP-DAC%202024%20Program%20Book.pdf","https://www.aspdac.com/aspdac2027/committee/a_oc/"]},{"answer":"公式 CFP には「proceedings は ACM Digital Library と IEEE Xplore に収録される」という宣言文は置かれていません。CFP が書いているのは、どの著者も会場で発表しなかった論文について、ACM と IEEE が会議後に配布から除外する権利(ACM Digital Library と IEEE Xplore からの削除を含む)を留保する、という条項です。著作権手続きは ACM 側で行い、DOI と ISBN も ACM が発行します。ACM の 100% Open Access 方針が適用され、ACM Open に参加していない機関の著者は APC(2027 年の補助後レートで ACM/SIG 会員 500 ドル、非会員 750 ドル)を支払う必要があると記載されています。書誌データベースの DBLP には ASP-DAC の各巻が登録されています。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://www.aspdac.com/aspdac2027/cfp/","https://www.aspdac.com/aspdac2027/author/","https://dblp.org/db/conf/aspdac/index.html"]},{"answer":"ASP-DAC 2026 の early 登録費は Member 700 USD、Non-member 750 USD、Full-time Student 450 USD で、December 13, 2025 AOE 以降の standard はそれぞれ 750 USD、800 USD、500 USD でした。支払いは USD のクレジットカード(VISA / MasterCard / JCB)のみで、銀行振込は受け付けられません。ASP-DAC 2027 の登録費は 2026 年 8 月 5 日時点で未公開です。発表については \"Accepted papers must be presented on site; online or prerecorded presentations will not be offered.\" と CFP に記載されています。","question":"参加費はいくらですか。オンライン参加はできますか。","sourceUrls":["https://www.aspdac.com/aspdac2026/reg/","https://www.aspdac.com/aspdac2027/cfp/","https://www.aspdac.com/aspdac2027/"]},{"answer":"第1回は 1995 年に Makuhari, Japan で開催され、その後も Yokohama、Kitakyushu、Makuhari、Tokyo で繰り返し開催されています。ASP-DAC 2027 は東京開催で、General Chair は Makoto Ikeda (The University of Tokyo)、Steering Committee Chair は Shinji Kimura (Waseda University) です。ただし日本からの参加者数や日本所属の投稿件数は公式サイトに掲載されていません。","question":"日本からの関与はどの程度ありますか。","sourceUrls":["https://www.aspdac.com/aspdac/history/","https://www.aspdac.com/aspdac2027/committee/a_oc/","https://www.aspdac.com/aspdac2026/committee/c_sc/"]}],"headline":"公式サイト(aspdac.com)の 2026 年サイクル・2027 年サイクル・シリーズ共通ページを読み、会期、投稿区分、締切、査読方式、掲載手続き、委員会構成、履歴を一次情報のまま並べました。","metaDescription":"ASP-DAC(Asia and South Pacific Design Automation Conference)の公式サイトで読める内容だけをまとめた資料。2026年香港開催と2027年東京開催の会期、13トラック、double-blind査読、締切、著作権・Open Access 手続き、登録費までを出典付きで並べます。","oneLine":"ASP-DAC は ACM/SIGDA と IEEE CEDA・IEEE CAS がスポンサーとなる VLSI 設計自動化の年次国際会議で、開催地は bylaws により日本とアジア・南太平洋地域の他国・他地域とで交互に設定されます。","pageTitle":"ASP-DAC とは:アジア・南太平洋の設計自動化会議の会期・投稿締切・査読方式を公式ページで確認する","relatedConferenceIds":["dac","iccad","date","codes-isss","islped","a-sscc"],"sections":{"cycle":{"id":"cycle","body":"2026 年 1 月の第31回(香港)は既に終了しており、2026 年 8 月時点で進行中のサイクルは 2027 年 1 月の第32回(東京)です。社内の年間計画に載せるときは、会場が Hitotsubashi Hall, National Center of Sciences Building である点と、採択論文は現地発表が要件である点を先に共有してください。2028 年は地域だけが公表され、都市と会場は未公表です。","facts":[{"note":"第31回。2026 サイクル公式トップの表記。","label":"2026 会期","value":"January 19-22, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/"},{"note":"2026 サイクル公式トップの会場表記。","label":"2026 開催地・会場","value":"Hong Kong Disneyland Hotel, Hong Kong","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/"},{"note":"第32回。2027 サイクル公式トップの表記(ページ下部の最終更新表記は Mar 31, 2026)。","label":"2027 会期","value":"Jan. 25-28, 2027","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/"},{"note":"2027 サイクル公式トップに 1 行で印字。","label":"2027 会場・都市・国","value":"Hitotsubashi Hall, National Center of Sciences Building, Tokyo, Japan","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/"},{"note":"2027 Call for Papers。オンライン発表・事前録画発表は提供されない旨の明示。","label":"2027 発表形式","value":"\"Accepted papers must be presented on site; online or prerecorded presentations will not be offered.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"2026 サイクルの Committees 目次ページに印字。サイクルごとにディレクトリとアドレスが分かれる。","label":"2026 の会議事務局連絡先","value":"Conference Secretariat E-mail: aspdac2026 [at] aspdac.com","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/"},{"note":"Steering Committee による開催提案募集ページ。提案締切は June 30, 2024。","label":"2028 の開催地域","value":"\"ASP-DAC 2028 is to be held in Asia-South Pacific area outside Japan.\"(都市・会場は当該ページに記載なし)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/cfp2028/"},{"note":"同じく開催提案募集ページ。2026 年 8 月時点で締切通過。","label":"2029 の開催地域","value":"\"According to regional rotation schedule of our bylaws, ASP-DAC 2029 is to be held in Asia-South Pacific area outside Japan.\" 提案締切は July 31, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/cfp2029/"}],"title":"2026 サイクルと 2027 サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"投稿トラックは 13 本で、2026 サイクルと 2027 サイクルで同じ構成です。フロントエンド(システムレベル、合成、AI 向けツール)からバックエンド(physical design、DFM/信頼性、テスト・検証)、さらにハードウェアセキュリティと emerging devices までが 1 本の CFP に収まっているため、自社のテーマがどのトラックに当たるかを番号で指定して社内共有できます。大学向けの University LSI Design Contest は技術トラックとは別枠で、回路種別と実装方式の観点で対象が定義されています。","facts":[{"note":"2027 Call for Papers のトラック一覧。","label":"2027 技術トラック(13本)","value":"1. System-Level Modeling and Design Methodology / 2. Embedded, Cyberphysical (CPS), IoT Systems, and Software / 3. Memory Architecture and Near/In Memory Computing / 4. Tools and Methods for Building Artificial Intelligence (AI) / 5. Hardware Systems and Architectures for AI / 6. Photonic/RF/Analog-Mixed Signal Design / 7. Approximate, Bio-Inspired and Neuromorphic Computing / 8. High-Level, Behavioral, and Logic Synthesis and Optimization / 9. Physical Design and Timing Analysis / 10. Design for Manufacturability/Reliability and Low Power / 11. Testing, Validation, Simulation, and Verification / 12. Hardware and Embedded Security / 13. Emerging Devices, Technologies and Applications","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"2026 Call for Papers のトラック一覧。トラック 3 のみ 2026 は \"Near/In-Memory Computing\"、2027 は \"Near/In Memory Computing\" と表記が異なる。","label":"2026 トラック数","value":"同一構成の 13 トラック(システムレベル設計、組込み/CPS/IoT、メモリアーキテクチャ、AI 向けツール、AI ハードウェア、photonic/RF/analog、approximate・neuromorphic、logic synthesis、physical design、DFM/信頼性/低電力、テスト・検証、セキュリティ、emerging devices)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/cfp/"},{"note":"2026 Call for Papers 冒頭文の引用。会議自体ではなく地域についての形容。","label":"対象分野の公式表記","value":"\"ASP-DAC 2026 is the 31st annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design, CAD, and fabrication of silicon chips in the world.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/cfp/"},{"note":"ASP-DAC 2026 Full Program の University LSI Design Contest 章。","label":"University LSI Design Contest の回路種別","value":"\"The scope of the contest covers circuit techniques for (1) Analog, RF and Mixed-Signal Circuits, (2) Digital Signal Processing, (3) Microprocessors, (4) Custom ASIC.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"同章。実装方式ごとの区分であり、順位や優劣の指定はない。","label":"University LSI Design Contest の実装方式","value":"\"Methods or technology used for implementation include: (a) Custom ASIC and Cell-Based LSIs, (b) Gate Arrays, (c) FPGA/PLDs.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"2027 Call for Designs。","label":"コンテストの応募区分(2027)","value":"\"(a) Implemented on chips/FPGAs in universities or other educational organizations during the last two years.\" / \"(b) Designs that report actual measurements from implementations.\" / \"(c) Innovative design prototypes.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfd/"}],"title":"対象領域と 13 トラック","eyebrow":"scope"},"review":{"id":"review","body":"査読は double-blind で、原稿・アブストラクト・参考文献・引用のいずれにも著者名や所属を書けません。採択率は公式サイトの CFP には出ておらず、開催後に配布されるプログラム冊子の TPC Chair メッセージにだけ印字されます。2024 年・2025 年・2026 年の数値は冊子で確認でき、直近は 2026 年の 28.7%(査読に進んだ 612 件から 176 件を採択)です。2027 年サイクルは会期前のため、投稿数と採択率はまだ印字されていません。","facts":[{"note":"2027 Call for Papers。2026 CFP にも同趣旨の規定。","label":"査読方式","value":"double-blind review。\"The submission must not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the manuscript, abstract, references, and bibliographic citations.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"ASP-DAC 2026 Full Program の TPC Chair メッセージ。\"From the 612 reviewed submissions, 176 high-quality regular papers were selected, yielding an acceptance rate of 28.7%\"。","label":"2026 投稿数・採択数・採択率","value":"749 abstracts(34 countries and regions)登録のうち 639 full manuscripts が提出され、612 件が査読に進み、176 regular papers を採択、採択率 28.7%","checkedAt":"2026-08-06","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"同メッセージ。COI(利益相反)を管理した strict double-blind policy と明記。Best Paper Award は 14 本ノミネートから 2 本を選出。","label":"2026 TPC 規模と選考会","value":"TPC 176 leading experts、13 subcommittees。TPC meeting は Yoshida Campus of Kyoto University, Kyoto, Japan にて August 29, 2025 に face-to-face and partially hybrid で開催","checkedAt":"2026-08-06","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"ASP-DAC 2025 Final Program の TPC Chair メッセージ。\"Out of the 537 submissions, 168 high-quality regular papers were selected, representing a very competitive acceptance rate of 31%\"。","label":"2025 投稿数・採択数・採択率","value":"537 submissions から 168 papers を採択、採択率 31%","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"},{"note":"同メッセージ。所属機関の所在地に基づく集計。","label":"2025 投稿元の広がり","value":"\"537 full manuscripts from 29 counties/regions\"(公式表記のまま)。\"The highest submissions came from the Asia region, followed by North America and Europe.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"},{"note":"同メッセージ。COI(利益相反)を厳格に管理した double-blind 査読と明記。","label":"2025 TPC 規模と選考会","value":"TPC 144 professionals、14 subcommittees。TPC meeting は Marco Polo Hong Kong Hotel, Hong Kong SAR, China にて August 30, 2024 に face-to-face and partially hybrid で開催","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"},{"note":"ASP-DAC 2024 Program Book の TPC Chair メッセージ。投稿元は 25 countries/regions。","label":"2024 投稿数・採択数・採択率","value":"529 abstracts 登録のうち 482 full manuscripts が提出され、139 regular papers を採択、採択率 28.8%","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2024/technical_program/ASP-DAC%202024%20Program%20Book.pdf"},{"note":"同メッセージ。Best Paper Award は 11 本ノミネートから 2 本を選出。","label":"2024 TPC 規模と選考会","value":"TPC 114 professionals、13 subcommittees。TPC meeting は National Taiwan University, Taipei, Taiwan にて September 1, 2023 に face-to-face and partially hybrid で開催","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2024/technical_program/ASP-DAC%202024%20Program%20Book.pdf"},{"note":"ASP-DAC 2025 Final Program の TPC Chair メッセージ。委員長は Vice Technical Program Chair の Takashi Sato。","label":"Best Paper Award の選考手順(2025)","value":"採択済みレギュラー論文のうち 13 本が subcommittee から Best Paper Award にノミネートされ、Best Paper Award Committee が評価して最終的に 2 本を選出","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"}],"title":"査読方式と採択率","eyebrow":"review"},"caveats":{"id":"caveats","body":"aspdac.com はサイクルごとにディレクトリが分かれ、シリーズ共通ページ(/aspdac/)と併存します。同じ項目名でも 2026 サイクルと 2027 サイクルで日付が違うため、URL のディレクトリ名で年を確認してから引用してください。採択率や投稿数は CFP ではなく開催後のプログラム冊子側にしか出ないため、会期前のサイクルでは数値が取れません。公式サイトが公開していないのは、参加者数とその内訳、投稿者の産学別内訳、Supporter のティア区分と支援金額、2027 サイクルの登録費、2028 年の開催都市と会場です。また CFP には proceedings の掲載先を宣言する一文がなく、ACM Digital Library と IEEE Xplore の名前は未発表論文の削除条項の中にだけ現れます。","facts":[{"note":"検索結果から直接開くと前サイクルの CFP を読んでしまう可能性がある。","label":"年度が混ざりやすい箇所","value":"/aspdac2026/cfp/ と /aspdac2027/cfp/ は同じ体裁で締切だけが異なる(2026: アブストラクト July 4 (Fri), 2025 / 2027: アブストラクト July 11 (Sat), 2026)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/cfp/"},{"note":"Steering Committee は /committee/c_sc/、Organizing Committee は /committee/a_oc/、TPC は /committee/c_tpc/、Design Contest は /committee/c_udc/。","label":"委員会ページの URL","value":"委員会情報は /aspdac2026/committee/ 以下に置かれ、/aspdac2026/organization/ は存在しない(HTTP 404)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/"},{"note":"2026 サイクルの実額を 2027 の見込みとして転用しないこと。","label":"2027 登録費","value":"2026 年 8 月 5 日時点で 2027 サイクルの登録費は未公開(公式トップに登録費の記載がなく、/aspdac2027/reg/ は HTTP 404)。参照できるのは 2026 サイクルの実額のみ","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/"},{"note":"開催提案募集ページに記載があるのは地域と提案締切のみ。","label":"2028 開催都市","value":"地域(Asia-South Pacific area outside Japan)のみ公表で、都市・会場・会期は未公表","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/cfp2028/"},{"note":"投稿可否の判断はトラック名との照合で行う。","label":"対象外領域の明示","value":"CFP には対象トラック 13 件の列挙のみで、対象外領域を明示した記述はない","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"顧客・売上・採用・共同研究の根拠としては使えない。","label":"Supporter 掲載の意味","value":"\"Supported by\" 欄は当該会議を支援・出展した組織の掲載であり、ティア区分・支援金額・取引関係の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/sponsor/"},{"note":"Award Archive の目次ページ。参加者数や出展ブースの規模はこのページには載らない。","label":"受賞記録の置き場所","value":"受賞記録は Keynote / Best Paper / Design Contest / 10-year MIP / Student Forum, Other のカテゴリ別ページに分かれて公開されている","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/awardarchive/"}],"title":"未公開項目と読み替えの注意","eyebrow":"caveats"},"history":{"id":"history","body":"公式 History ページには第1回(1995 年)から第30回(2025 年)までが 1 行ずつ並び、回次・開催地・会期を年単位で追えます。2026 年 8 月時点で第31回(2026 年・香港)はこの一覧にまだ反映されていません。開催地は bylaws のローテーション規定に従い、日本とアジア・南太平洋地域の他国・他地域とで交互に設定されます。日本開催では Makuhari、Yokohama、Kitakyushu、Tokyo が使われ、日本国外では Hong Kong、Shanghai、Seoul、Bangalore、Sydney、Singapore、Taiwan、Macao、Beijing、Jeju、Incheon が並びます。","facts":[{"note":"唯一の夏開催回で、VLSI95・CHDL95 との併催。以降は 1 月開催が中心。","label":"第1回","value":"\"1st ASP-DAC, Makuhari, Japan (Aug.29-Sep.1, 1995) (with VLSI95, CHDL95)\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/history/"},{"note":"History ページの一覧に 1996 年の項目は掲載されていない。","label":"第2回","value":"\"2nd ASP-DAC, Makuhari, Japan (Jan.28-31, 1997)\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/history/"},{"note":"2026 年 8 月 5 日時点で一覧の最上段。第31回(2026 年)の行はまだ追加されていない。","label":"History ページの最新行","value":"\"30th ASP-DAC, Tokyo Odaiba Miraikan, Japan (Jan. 20-23, 2025)\"","checkedAt":"2026-08-06","sourceUrl":"https://www.aspdac.com/aspdac/history/"},{"note":"ASP-DAC 2025 Final Program の General Chair メッセージ。","label":"30周年","value":"\"We are very happy to celebrate the 30th anniversary of ASP-DAC.\"(ASP-DAC 2025 / 第30回、Tokyo Odaiba Miraikan, Jan. 20-23, 2025)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"},{"note":"bylaws。開催地は 3 年以上前に決定する運用も同規程に記載。","label":"開催地ローテーション規定","value":"\"The location of the conference shall alternate between Japan and other countries or areas in the Asia South Pacific Region.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/bylaws/"},{"note":"History ページの一覧から日本国外開催回を抽出。","label":"日本国外の開催実績(抜粋)","value":"4th 1999 Hong Kong / 7th 2002 Bangalore, India(VLSI Design 2002 併催) / 10th 2005 Shanghai, China / 13th 2008 Seoul, Korea / 15th 2010 Taiwan / 17th 2012 Sydney, Australia / 19th 2014 Singapore / 21st 2016 Macao / 23rd 2018 Jeju Island, Korea / 25th 2020 Beijing, China / 29th 2024 Incheon Songdo Convensia, South Korea","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/history/"},{"note":"History ページで Virtual Conference と明記された 2 回。","label":"オンライン開催回","value":"\"26th ASP-DAC, Tokyo Odaiba Waterfront, Japan (Virtual Conference) (Jan.18-21, 2021)\" と \"27th ASP-DAC, Taipei International Convention Center, Taiwan (Virtual Conference) (Jan. 17-20, 2022)\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/history/"},{"note":"bylaws。2026 年 8 月時点で 2029 年・2030 年分の開催提案募集まで公開されている。","label":"開催地決定のリードタイム","value":"\"The date, the location, the General Chair and the Technical Program Chair of the conference should be approved by the SC at least 3 years before the conference.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/bylaws/"}],"title":"1995 年からの開催履歴と開催地ローテーション","eyebrow":"history"},"program":{"id":"program","body":"会期 4 日のうち初日が tutorial 専用日、2 日目以降が keynote と 6 並列のテクニカルセッションという構成です。テクニカルセッション以外に Designers' Forum、University LSI Design Contest、Special Session、Panel、ACM SIGDA Student Research Forum、Supporter's Exhibition が並びます。EDA ベンダとファウンドリの keynote が同じ枠に並ぶため、ツール側と製造側の発言を 1 会期で突き合わせられます。","facts":[{"note":"テーマは On-Device AI in Healthcare、Compute-in-Memory、Early Fault Tolerant Quantum Computing、Agentic AI と HW 設計、MLIR ベース HW/SW 協調設計、Post-Silicon Validation & Hardware Security。","label":"2026 tutorial","value":"初日 January 19 に 6 本(09:00-12:00 と 14:00-17:00 の 2 枠 × 3 室)。\"If you register for the conference, you have the option to select two out of the six topics.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"Keynote I-VI。会期 3 日間、各日朝に 2 件ずつ。","label":"2026 keynote(6件)","value":"Prof. Chenming Hu (University of California, Berkeley) \"FinFET - from Lab to Foundry to EDA/Fabless\" / Prof. Yiran Chen (Duke University) \"Edge AI: Everything, Everywhere, All at Once\" / Prof. Yuan Xie (The Hong Kong University of Science and Technology) \"Déjà Vu: From 3D to Chiplet and PIM/NDP — A Historical Perspective\" / Dr. Charles Alpert (Cadence) \"Harnessing Agentic AI to Accelerate Designer Productivity\" / Dr. Chih-Wei Jim Chang (TSMC) \"Unlocking Hyper-Scale AI: Navigating the Future of 3DIC Design Solutions\" / Dr. Takefumi Miyoshi (e-trees.Japan, Inc. & QuEL & The University of Osaka) \"Design and Implementation of Control System for Quantum Computers\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/program/agenda_overview.html"},{"note":"Designers' Forum は \"a unique program that shares the design experience and solutions for real product developments among LSI designers and EDA academia/developers\" と説明。Co-Chair は Qiang Xu (The Chinese University of Hong Kong)。","label":"2026 Designers' Forum と Panel","value":"Designer Forum 1 \"Toward Autonomous Chip Design: From Foundation Models to Agentic EDA\" / Designer Forum 2 \"AI in Production EDA: Digital, Custom, and Manufacturing Use Cases\" / Designer Forum 3 \"Chiplets Go Mainstream: Design Automation for 2.5D/3D Systems\" / Panel \"AI Accelerators at a Crossroads: Who Will Power the Next Decade of AI?\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"\"The banquet will present the Best Design Award and two Special Feature Awards for three outstanding designs.\" と記載。","label":"2026 University LSI Design Contest","value":"7 designs を採択。LLM/AI Inference、FPGA Acceleration、power management、ADC、Neuromorphic Computing、Wireless Interconnect、Analog IC が対象。January 20 に oral(Session 2D)と coffee break 中のポスターセッション","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"Supporter's Exhibition は Foyer で coffee break・ポスターセッションと同じ区画。","label":"2026 併設プログラム","value":"Room Assignment に CEDA Distinguish Lecture、Luncheon Talk、Invited Talk、CEDA-EDS Special Session、ACM SIGDA Student Research Forum、Supporter's Exhibition、Banquet が記載","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"ブースを出した 9 社の紹介文が同章に並ぶ。出展社名と Supported by 一覧は範囲が異なる。","label":"2026 Supporter's Exhibition の規模","value":"\"Supporter's exhibition is held by nine companies which support ASP-DAC 2026 and have exhibition booths.\" 会場は Foyer of the Conference Center at Hong Kong Disneyland Hotel、Exhibit Hours は 08:30-18:00, January 20-22","checkedAt":"2026-08-06","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"ASP-DAC 2025 Final Program の General Chair メッセージ。","label":"2025 プログラム規模","value":"168 papers 採択で 39 technical sessions を編成、Special Session は 9 本","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2025/pdf/final_program.pdf"}],"title":"2026 サイクルのプログラム構成","eyebrow":"program"},"audience":{"id":"audience","body":"学生・研究室にとっては、レギュラー論文のほかに University LSI Design Contest と ACM SIGDA Student Research Forum という 2 つの発表枠があり、テープアウト済みのチップや FPGA 実装があればコンテスト側から入れます。企業の調査担当は、Designers' Forum と Panel のテーマ、keynote の登壇企業、Supporter 一覧を年ごとに並べると、EDA ベンダとファウンドリがその年に何を前面に出したかを比較できます。登録費は 2026 年サイクルで公開済みの実額があり、2027 年サイクルの登録ページは 2026 年 8 月時点で未公開です。","facts":[{"note":"December 13, 2025 AOE 以降の standard は Member 750 / Non-member 800 / Student 500 / Speaker 1論文 750・2論文 1500・3論文 2250 USD。区分ごとに増額幅が異なる。","label":"2026 登録費(early、December 12, 2025 AOE まで)","value":"Conference Member 700 USD / Conference Non-member 750 USD / Conference Full-time Student 450 USD / Conference Speaker(1論文)700 USD、2論文 1400 USD、3論文 2100 USD","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/reg/"},{"note":"\"(Tutorials are included in the conference registration this year)\" と併記。ダウンロードサイトは Jan. 19, 2026 開設。","label":"2026 登録に含まれるもの","value":"\"Admission to all sessions including keynote speeches, designers' forum and tutorials\"、\"A conference kit (a final program and an authority to access the download site for the conference proceedings)\"、\"Access to electronic files of tutorial presentations\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/reg/"},{"note":"日本からの参加では銀行振込が使えない点に注意。","label":"2026 支払方法","value":"\"All registration fees must be paid in USD by credit card.\" VISA、MasterCard、JCB のみ。\"personal checks, bank drafts and bank transfer will not be accepted.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/reg/"},{"note":"\"Interesting or excellent designs selected will be presented at a special session of the conference.\" \"Award(s) will be given to a few numbers of outstanding designs, selected from those presented at the conference.\" と併記。","label":"学生向けの発表枠","value":"University LSI Design Contest の目的は \"The aim of the Contest is to encourage education and research on VLSI design at universities and other educational organizations.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfd/"},{"note":"\"a traditional poster session hosted by ACM SIGDA for PhD students\" と説明。2015 年から MS 学生も対象。","label":"学生研究フォーラム","value":"ACM SIGDA Student Research Forum at ASP-DAC 2026 を会期中に併催(January 20 の 18:15-20:15、Cinderella Ballroom 2/3/5)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"University LSI Design Contest の Best Design Award もこの場で授与。","label":"2026 banquet","value":"January 21 の 18:30-20:30 に Cinderella Ballroom 1/6/7/8 で開催。現地参加登録者が対象で、登録時に banquet ticket を受け取る","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ASP-DAC は単独の主催団体を持たず、ACM/SIGDA と IEEE の 2 つの団体(CEDA と Circuits and Systems Society)がスポンサーに並ぶ形で運営されています。運営規程は Steering Committee の bylaws として公開されており、会議名・回次・スポンサー表記はサイクルごとの公式トップと Full Program 冊子の巻末で照合できます。社名や団体名を資料に転記するときは、この 3 者の正式表記をそのまま使ってください。","facts":[{"note":"シリーズ共通ページの見出し表記。","label":"シリーズ正式名称","value":"Asia and South Pacific Design Automation Conference (ASP-DAC)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/"},{"note":"2026 サイクル公式トップの表記。","label":"2026 正式名称・回次","value":"31st Asia and South Pacific Design Automation Conference (ASP-DAC 2026)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/"},{"note":"2027 サイクル公式トップの表記。","label":"2027 正式名称・回次","value":"32nd Asia and South Pacific Design Automation Conference (ASP-DAC 2027)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/"},{"note":"ASP-DAC 2026 Full Program 巻末の「Sponsorship / Sponsored by」欄に各団体名と URL が併記。","label":"2026 スポンサー(Sponsorship)","value":"ACM/SIGDA、IEEE Council on Electronic Design Automation、IEEE Circuits and Systems Society の 3 者","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf"},{"note":"シリーズ共通の bylaws。個別サイクルのサイトではなくシリーズ規程側の記載。","label":"bylaws 上のスポンサー","value":"\"The conference shall be sponsored by IEEE and ACM.\" とし、IEEE は Circuits and Systems Society と Council on Electronic Design Automation、ACM は Special Interest Group on Design Automation で構成されると規定","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/bylaws/"},{"note":"2027 Call for Papers 冒頭の自己紹介文の引用。","label":"開催頻度","value":"\"ASP-DAC 2027 is the 32nd annual international conference on VLSI design automation in Asia and South Pacific regions\"(annual = 年次)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"bylaws に規定。Organizing Committee と Technical Program Committee については Supervision の条項が別に置かれ、いずれも会議の 2 年以上前に SC へ通知すると規定。","label":"運営統括組織","value":"\"The Steering Committee (SC) is responsible for: 1) the policies which regulate the conference, and 2) scheduling of future series of conferences.\" 開催日・開催地・General Chair・Technical Program Chair は会議の 3 年以上前に SC が承認する","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/bylaws/"}],"title":"会議の正体とスポンサー","eyebrow":"identity"},"community":{"id":"community","body":"Organizing Committee は開催国の研究者・企業関係者で構成され、2027 年サイクルは日本の大学と企業が中心です。Technical Program Chair は開催国以外から選ばれる年があり、2027 年は韓国 POSTECH、Vice Chair は台湾 NYCU です。Steering Committee には ACM SIGDA、IEEE CAS、IEEE CEDA に加えて DAC・DATE・ICCAD・ESWEEK の代表が席を持ちます。Supporter 一覧は当該会議を支援・出展した組織の記録であり、取引関係や共同研究を示すものではありません。","facts":[{"note":"Past Chair は Tsung-Yi Ho (The Chinese University of Hong Kong)、TPC Liaison は Takashi Sato (Kyoto University)。","label":"2027 General Chair / TPC Chair","value":"General Chair: Makoto Ikeda (The University of Tokyo) / Technical Program Chair: Seokhyeong Kang (Pohang University of Science and Technology) / Technical Program Vice Chair: Hung-Ming Chen (National Yang Ming Chiao Tung University)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/committee/a_oc/"},{"note":"所属は公式ページの印字どおり。所属機関の所在地であり、個人の国籍ではない。","label":"2027 Organizing Committee の産業側メンバー","value":"Tutorial Co-Chair に Shiho Hagiwara (TSMC Design Technology Japan)、GC Secretary に Yuki Kobayashi (NEC)、Designer's Forum Co-Chair に Chihiro Yoshimura (Hitachi)、Secretariat は PCO Works","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/committee/a_oc/"},{"note":"2026 サイクル公式トップに掲載。","label":"2026 General Chair / TPC Chair","value":"General Chair: Tsung-Yi Ho (The Chinese University of Hong Kong) / Technical Program Chair: Takashi Sato (Kyoto University) / Design Contest Chair: Fengbin Tu (The Hong Kong University of Science and Technology)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/"},{"note":"ページ内の as of 表記は April 30, 2025。","label":"Steering Committee 執行部(2026 時点)","value":"Chair: Shinji Kimura (Waseda University) / Vice Chair: Atsushi Takahashi (Institute of Science Tokyo) / Secretaries: Takashi Takenaka (NEC), Tohru Ishihara (Nagoya University)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/c_sc/"},{"note":"スポンサー学会に加えて姉妹会議 4 件の代表が席を持つ構成。","label":"Steering Committee の学会・会議代表","value":"ACM SIGDA Representative: Yu Wang (Tsinghua University) / IEEE CAS Representative: Atsushi Takahashi (Institute of Science Tokyo) / IEEE CEDA Representative: Kazutoshi Wakabayashi (The University of Tokyo) / DAC Representative: Shaojun Wei (Tsinghua University) / DATE Representative: Hussam Amrouch (Technical University of Munich) / ICCAD Representative: Takashi Sato (Kyoto University) / ESWEEK Representative: Soonhoi Ha (Seoul National University)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/c_sc/"},{"note":"2026 サイクルの Committees 目次ページ。","label":"委員会の分類","value":"Organizing、Technical Program、University LSI Design Contest、Steering の 4 委員会","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/"},{"note":"\"Supported by\" 欄の掲載。当該会議を支援・出展した記録であり、取引・売上・採用・共同研究を示すものではない。ティア区分は掲載なし。","label":"2026 Supporter 一覧","value":"Huawei、Cadence、Synopsys、Infinigence、AMEGADAC、Shanghai LEDA Technology、witmem、MediaTek、Siemens、Empyrean、Primarius、footprintku AI、Xpeedic、Easy-Logic、The Hong Kong University of Science and Technology (Guangzhou)、The Chinese University of Hong Kong","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/sponsor/"}],"title":"委員会構成と支援組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"公式サイトは DAC・ICCAD・DATE・ESWEEK を Sister Conferences として掲げ、Steering Committee にもこの 4 会議の代表が入っています。ASP-DAC は bylaws により開催地がアジア・南太平洋地域に限定される点が、地域指定のない DAC・ICCAD や欧州開催の DATE との構造的な違いです。投稿先を選ぶときは、2027 サイクルの締切(アブストラクト July 11, 2026 / 通知 Sept. 4, 2026 / 最終原稿 Oct. 27, 2026)を CFP で、会期(Jan. 25-28, 2027)を公式トップで、それぞれ確かめたうえで見比べてください。","facts":[{"note":"2027 サイクルの Sister Conferences ページ。関係性の説明文は掲載なし。","label":"Sister Conferences の掲載","value":"DAC (Design Automation Conference)、ICCAD (International Conference on Computer Aided Design)、DATE (Design, Automation and Test in Europe)、Embedded Systems Week (ESWEEK) の 4 件","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/assoc_conf/"},{"note":"運営レベルで 4 会議と席を共有している構成。","label":"姉妹会議代表の Steering Committee 参加","value":"DAC Representative: Shaojun Wei / DATE Representative: Hussam Amrouch / ICCAD Representative: Takashi Sato / ESWEEK Representative: Soonhoi Ha","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/committee/c_sc/"},{"note":"開催提案募集ページ。ローテーションの根拠条文は bylaws 側に置かれている。","label":"地域的な制約(2029 の指定)","value":"\"According to regional rotation schedule of our bylaws, ASP-DAC 2029 is to be held in Asia-South Pacific area outside Japan.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac/cfp2029/"}],"title":"姉妹会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"レギュラー論文はアブストラクト登録と PDF アップロードが別日程の 2 段階です。書式は本文 6 ページ以内(double-columned PDF)で、参考文献のみ 1 ページ追加できます。University LSI Design Contest は 2〜4 ページの camera-ready summary paper を EasyChair から出す別ルートで、締切もレギュラー論文とは別に設定されています。Special Session と Panel、Tutorial は論文投稿ではなく提案メールで受け付けます。","facts":[{"note":"本文 6 ページにはアブストラクト・図・表を含む。","label":"書式(2027)","value":"\"Authors must submit full-length, double-columned, original papers, with a maximum of 6 pages in PDF format\" / \"One page of references is allowed and does not count towards the 6-page limitation.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"2026 年 8 月 5 日時点で通過済み。","label":"2027 アブストラクト締切","value":"5 PM AOE (Anywhere on earth) July 11 (Sat), 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"アブストラクト締切の 1 週間後。","label":"2027 本文 PDF 締切","value":"5 PM AOE (Anywhere on earth) July 18 (Sat), 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"2027 Call for Papers の Important Dates。採択 manuscript ID の公表は Sept. 1, 2026 と別に印字。","label":"2027 採否通知","value":"Sept. 4 (Fri), 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"Author 向けページにも \"The final manuscript must be submitted before Oct. 27 (Fri.), 2026.\" と同じ日付が印字。","label":"2027 最終原稿締切","value":"5 PM AOE (Anywhere on earth) Oct. 27 (Fri), 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"前サイクルの実績値。2027 サイクルの日程とは別。","label":"2026 締切実績","value":"アブストラクト July 4 (Fri), 2025 / PDF July 11 (Fri), 2025 / 採否通知 Sept. 5 (Fri), 2025 / 最終版 Oct. 31 (Fri), 2025(採否通知以外は 5 PM AOE)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/cfp/"},{"note":"2027 Call for Designs。camera-ready 日付には tentative の注記。","label":"2027 コンテスト締切","value":"投稿 August 15 (Sat), 2026 (5 PM AOE、Extended) / 採否通知 Sept. 16 (Wed), 2026 / camera-ready Nov. 6 (Fri), 2026 (5 PM AOE、tentative)","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfd/"},{"note":"\"It is strongly recommended that measured experimental results and a chip micrograph are included in the summary.\" と併記。","label":"コンテストの投稿システムと分量","value":"https://easychair.org/conferences/?conf=aspdac2027 経由で、\"A camera-ready summary paper is requested to be prepared within 2-4 pages including figures, tables, and references.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfd/"},{"note":"論文投稿システムではなくメール提案。","label":"Special Session / Tutorial の提案窓口","value":"\"Suggestions and proposals are welcome and have to be addressed to aspdac2027-ss [at] aspdac.com for special sessions & panels, aspdac2027-tutorial [at] aspdac.com for tutorials, no later than September 7(Mon), 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"公式 CFP には「proceedings は ACM Digital Library と IEEE Xplore に収録される」という宣言文は置かれていません。CFP が書いているのは、会場で発表されなかった論文について ACM と IEEE が配布から除外する権利(両ライブラリからの削除を含む)を留保する、という条項です。著作権は ACM 側の手続きで、通知後 2 週間以内に DOI と ISBN を反映した原稿を再提出する運用です。ACM の 100% Open Access 方針が適用されるため、ACM Open に参加していない機関の著者は APC(2027 年は ACM/SIG 会員 500 ドル、非会員 750 ドル)を見込んでおく必要があります。","facts":[{"note":"2027 Call for Papers。2026 CFP にも同文。CFP 上でこの 2 ライブラリ名が出るのはこの条項のみ。","label":"未発表論文の扱い","value":"\"ACM and IEEE reserve the right to exclude a paper from distribution after the conference (e.g., removal from ACM Digital Library and IEEE Xplore) if the paper is not presented at the conference by any author.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfp/"},{"note":"2027 Author 向けページ。期限内に手続きしない場合、採択済みでも proceedings に載らない可能性があると明記。","label":"著作権と DOI/ISBN 手続き","value":"\"If a paper is accepted, the authors must complete the required copyright transfer procedure as soon as possible after the Acceptance Notification.\" 完了後に発行される DOI と ISBN を反映した原稿を \"no later than two weeks after the Acceptance Notification\" に再提出する","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/author/"},{"note":"同ページ。waiver は \"waivers are rare and are granted based on specific criteria set by ACM\" と記載。","label":"Open Access と APC(2027)","value":"ACM の全刊行物は 100% Open Access。ACM Open には約 3,000 機関が参加し現状およそ 76% の論文が APC 不要。\"Authors from institutions not participating in ACM Open will need to pay an\" APC で、2027 年の補助後レートは ACM/SIG 会員 500 ドル、非会員 750 ドル","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/author/"},{"note":"2027 Call for Designs。コンテスト採択分も proceedings に digest が載る。","label":"コンテスト論文の掲載","value":"\"A digest of each design to be presented will be included in the conference proceedings.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2027/cfd/"},{"note":"2026 サイクル公式トップの案内。参加登録者向けの期限付きダウンロード。","label":"2026 参加者向け proceedings 配布","value":"proceedings のダウンロードは January 23 (9:00 PM HKT) まで、tutorial 資料は January 28 (9:00 PM HKT) まで。配布サイトは https://aspdac-paper.iconf.org/ で、開設は January 19, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.aspdac.com/aspdac2026/"},{"note":"巻ごとに開催地が併記されている。公式サイトではなく第三者の書誌データベース。","label":"書誌データベース上のシリーズ","value":"DBLP に \"Asia and South Pacific Design Automation Conference (ASP-DAC)\" として巻ごとに登録(最新は \"31st ASP-DAC 2026: Lantau, Hong Kong\")","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/aspdac/index.html"}],"title":"proceedings と公開範囲","eyebrow":"publication"}},"sources":[{"url":"https://www.aspdac.com/aspdac2026/","role":"official","label":"ASP-DAC 2026 公式トップ","checkedAt":"2026-08-05","evidenceLocator":"ページ冒頭の会議名・回次・会期・会場表記、General Chair / TPC Chair / Design Contest Chair の氏名、proceedings ダウンロード期限と配布サイト URL"},{"url":"https://www.aspdac.com/aspdac2026/cfp/","role":"cfp","label":"ASP-DAC 2026 Call for Papers","checkedAt":"2026-08-05","evidenceLocator":"冒頭の会議紹介文、13 トラック一覧、Submission of Papers の書式規定、締切日付(abstract / PDF / notification / final version)"},{"url":"https://www.aspdac.com/aspdac2026/program/agenda_overview.html","role":"program","label":"ASP-DAC 2026 Program Agenda Overview","checkedAt":"2026-08-05","evidenceLocator":"日別のタイムテーブル、Keynote Speech I-VI の登壇者名・所属・講演タイトル、並列トラック 1A-9F の配置"},{"url":"https://www.aspdac.com/aspdac2026/archive/program/agenda_overview.html","role":"archive","label":"ASP-DAC 2026 Archive Program","checkedAt":"2026-08-05","evidenceLocator":"会期終了後のアーカイブ版アジェンダ。セッションラベル 1A-9F、Special Session、Designer Forum、Panel の配置(セッション総数の明記はなし)"},{"url":"https://www.aspdac.com/aspdac2026/pdf/ASP-DAC_2026_Full_Program.pdf","role":"program","label":"ASP-DAC 2026 Full Program (PDF)","checkedAt":"2026-08-05","evidenceLocator":"Welcome / TPC Chair メッセージ(749 abstracts、34 countries and regions、639 full manuscripts、612 reviewed、TPC 176 名、13 subcommittees、TPC meeting 2025-08-29、176 papers 採択、採択率 28.7%、Best Paper ノミネート 14 本)、Room Assignment 表、Tutorials 章、Keynote Addresses 章、University LSI Design Contest 章、Designers' Forum 章、ACM SIGDA Student Research Forum 章、Supporter's Exhibition 章、General Information の banquet 記載、巻末の Sponsorship / Supported by 一覧"},{"url":"https://www.aspdac.com/aspdac2026/committee/","role":"committee","label":"ASP-DAC 2026 Committees(目次)","checkedAt":"2026-08-05","evidenceLocator":"Organizing / Technical Program / University LSI Design Contest / Steering の 4 委員会リンクと Conference Secretariat のメールアドレス"},{"url":"https://www.aspdac.com/aspdac2026/committee/c_sc/","role":"committee","label":"ASP-DAC 2026 Steering Committee","checkedAt":"2026-08-05","evidenceLocator":"Chair / Vice Chair / Secretaries の氏名と所属、ACM SIGDA・IEEE CAS・IEEE CEDA・DAC・DATE・ICCAD・ESWEEK の Representative 一覧、as of April 30, 2025 の表記"},{"url":"https://www.aspdac.com/aspdac2026/sponsor/","role":"sponsor","label":"ASP-DAC 2026 Supporters","checkedAt":"2026-08-05","evidenceLocator":"Sponsorship 欄の 3 学会名と Supported by 欄の企業・大学一覧(ティア区分の記載なし)"},{"url":"https://www.aspdac.com/aspdac2026/reg/","role":"registration","label":"ASP-DAC 2026 Registration","checkedAt":"2026-08-05","evidenceLocator":"登録費テーブル(early / standard、Member / Non-member / Full-time Student / Speaker)、登録に含まれる範囲の 3 項目、支払方法"},{"url":"https://www.aspdac.com/aspdac2027/","role":"official","label":"ASP-DAC 2027 公式トップ","checkedAt":"2026-08-05","evidenceLocator":"ページ冒頭の第32回表記、会期 Jan. 25-28, 2027、会場 Hitotsubashi Hall, National Center of Sciences Building, Tokyo, Japan、最終更新日 Mar 31, 2026、登録費の記載がないこと"},{"url":"https://www.aspdac.com/aspdac2027/cfp/","role":"cfp","label":"ASP-DAC 2027 Call for Papers","checkedAt":"2026-08-05","evidenceLocator":"冒頭の annual conference 表記、13 トラック番号付き一覧、Important Dates、6 ページ + 参考文献 1 ページの書式規定、double-blind 規定、現地発表要件、未発表論文の除外条項、Special Session / Tutorial 提案窓口と提案締切"},{"url":"https://www.aspdac.com/aspdac2027/cfd/","role":"cfp","label":"ASP-DAC 2027 Call for Designs(University LSI Design Contest)","checkedAt":"2026-08-05","evidenceLocator":"コンテストの目的文、応募区分 (a)(b)(c)、2〜4 ページの分量規定、締切 3 点、EasyChair の投稿 URL、special session での発表と award の記載、proceedings への digest 掲載"},{"url":"https://www.aspdac.com/aspdac2027/author/","role":"official","label":"ASP-DAC 2027 Author Information","checkedAt":"2026-08-05","evidenceLocator":"copyright transfer 手続き、DOI/ISBN 反映原稿の再提出期限、最終原稿締切、ACM Open の参加機関規模と APC の金額、waiver の記載"},{"url":"https://www.aspdac.com/aspdac2027/committee/a_oc/","role":"committee","label":"ASP-DAC 2027 Organizing 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Devices Society","canonicalOrganizationSlug":"ix-cda80a43ee","canonicalCompanyId":null}],"conferenceResearchDossierV1":{"checkedAt":"2026-08-05","conferenceId":"iedm","confidenceScore":1,"coverage":{"faqCount":8,"factCount":79,"topicCount":8,"sourceCount":26,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年12月12日から16日まで、米国San FranciscoのHilton San Francisco Union Squareで開催されます。公式トップはこのサイクルを \"72nd Annual IEEE International Electron Devices Meeting\" と表記しています。土曜がTutorials、日曜がShort Courses、月曜午前がKeynote、月曜から水曜がTechnical Sessions、火曜夜がPanel Sessionという日程です。2027年は12月4〜8日、2028年は12月2〜6日で、いずれも同じHilton Union Square San Franciscoが公表されています。","question":"IEDM 2026はいつ・どこで開催されますか。","sourceUrls":["https://ieee-iedm.org/","https://ieee-iedm.org/program/schedule-at-a-glance/","https://ieee-iedm.org/about/future-conferences/"]},{"answer":"本投稿はsubmission siteが2026年5月26日に開き、締切は延長されて2026年7月19日23:59 PDTでした。Late Newsは2026年8月3日に受付が始まり、締切はLate Newsページでは \"Late News Deadline: August 18, 2026\"、Submission Details では August 18, 2026 23:59 PDT、Call for Papers Overview では \"23:59 PT, Tuesday, August 18\" と表記されています。Late Newsも書式は通常投稿と同じで、Call for Papers Overview は\"four-page, camera-ready papers\" を求めています。ただしLate News採択論文はtravel assistanceとstudent paper awardの対象外と明記されています。","question":"2026サイクルの投稿締切はいつでしたか。Late Newsはまだ間に合いますか。","sourceUrls":["https://ieee-iedm.org/submission-details/","https://ieee-iedm.org/late-news/","https://ieee-iedm.org/call-for-papers-overview/"]},{"answer":"IEDM committeesが \"review submissions\" を担うと明記されています。投稿は9つのtechnical subcommitteeのいずれかに向けて行い、Topics of Interest にはテーマが合わない場合に他のsubcommitteeへ転送されうることが書かれています。採否は投稿された4ページ論文だけで決まり、\"Promises of upcoming results will be ignored\" と書かれています。評価されるのは研究の目的、既存技術に対する前進の度合い（適切な引用付き）、実験条件が明示された具体的な新結果の3点で、最も多いリジェクト理由は具体的な結果の欠如です。double-blind（匿名査読）を示す記述は公式サイト上に確認できません。","question":"査読はありますか。どのように選考されますか。","sourceUrls":["https://ieee-iedm.org/paper-preparation/","https://ieee-iedm.org/committees/","https://ieee-iedm.org/topics-of-interest/","https://ieee-iedm.org/submission-details/"]},{"answer":"公表されていません。Call for Papers Overview、Submission Details、Paper Preparation、Press Overview、Press Kit、Notifications & Policies を確認しましたが、採択率・投稿件数・採択件数のいずれも数値の記載はありませんでした。Late News については \"A limited number of papers are accepted based on significance and timeliness.\"、\"A highly limited number of Late News Papers will be accepted\" という定性的な表現があるだけです。過去年の推定値を当年に当てはめないでください。","question":"採択率は公表されていますか。","sourceUrls":["https://ieee-iedm.org/call-for-papers-overview/","https://ieee-iedm.org/late-news/","https://ieee-iedm.org/press-overview/"]},{"answer":"4ページ厳守で、内訳は \"Up to two pages of text and up to two additional pages of figures and drawings (no text, captions only)\" です。本文2ページまたは図2ページを超えた場合は即リジェクトの対象と明記されています。本文フォントは10ポイント以上、用紙は8-1/2×11インチ、別途150ワードのabstractが必要です。投稿前にIEEE PDF eXpress Plus（Conference ID 50580X）でXplore compliant PDFに変換する必要があり、変換していない論文はリジェクトされます。","question":"論文の書式はどうなっていますか。","sourceUrls":["https://ieee-iedm.org/submission-details/","https://ieee-iedm.org/paper-preparation/"]},{"answer":"投稿区分は regular \"contributed\" paper と \"student paper\" に分かれ、学生が筆頭著者で自身の研究に基づく論文はstudent paperとして投稿時に指定するとBest Student Paper Awardの対象になります。ただし本人が発表することが条件です。運営側は2026 subcommittee chair 9名のうち7名が企業所属（Intel、Quobly、GlobalFoundries、SK Hynix、Apple、Texas Instruments、IBM）、2名が大学所属（POSTECH、University of Michigan）という構成で、Press Overviewは参加者を \"Researchers from academia, industry, and government\" と説明しています。","question":"誰が投稿する会議ですか。学生でも出せますか。","sourceUrls":["https://ieee-iedm.org/submission-details/","https://ieee-iedm.org/student-info/","https://ieee-iedm.org/committees/","https://ieee-iedm.org/press-overview/"]},{"answer":"採択論文は投稿された形のままproceedingsに掲載され、会場での発表が条件です（\"Accepted papers will be published as submitted and must be presented at the event.\" / \"Accepted papers will be published as-is in the proceedings.\"）。投稿PDFはIEEE Xplore compliantであることが必須ですが、IEEE Xploreへの収録そのものを明言する文は今回開いた公式ページ上には見当たりませんでした。事前公開は禁止で、採択論文または研究の主要部分を会議前にpublic domainへ置くことは、proceedingsの有無を問わず違反とされ、自動取り下げの事由になります。","question":"採択された論文はどこに載りますか。事前にプレプリント公開しても大丈夫ですか。","sourceUrls":["https://ieee-iedm.org/call-for-papers-overview/","https://ieee-iedm.org/submission-details/","https://ieee-iedm.org/pre-publish-restrictions/"]},{"answer":"2026サイクルのConference Registrationは、11月10日までがIEEE Member $655、Non-Member $815、Student Member $250、Student Non-Member $300、Life Member $250で、11月11日以降はそれぞれ$755 / $915 / $300 / $350 / $300に上がります。Short Courses・Tutorials・Lunch Ticketは別料金で、返金は不可です。現地に行けない場合はOnDemandがあり、料金は現地参加と同一、OnDemandは2026年12月21日開始で2027年1月31日まで登録できます。なお2026サイクルではStudent Travel Assistanceが廃止され、渡航費の払い戻しはありません。日本からの関与としては、2026のTechnical Program Vice ChairにTohoku University (Japan) 所属の委員が就いていることがCommitteesページで確認できます。","question":"参加費はいくらですか。日本から現地に行けない場合はどうすればよいですか。","sourceUrls":["https://ieee-iedm.org/attendee/registration-details/","https://ieee-iedm.org/student-info/","https://ieee-iedm.org/committees/"]}],"headline":"公式トップ・Call for Papers・Submission Details・Paper Preparation・Topics of Interest・Committees・Program・Registration・Archive など ieee-iedm.org の公開ページを１件ずつ開いて、投稿判断と参加判断に必要な条件だけを取り出しました。","metaDescription":"IEDM（IEEE International Electron Devices Meeting）2026の会期・会場、投稿締切とLate News締切、本文2ページ+図2ページの4ページ書式、9 subcommittee構成、参加費とOnDemand公開範囲を公式ページで確認します。","oneLine":"IEDM 2026（72nd Annual）の会期・会場、延長後の投稿締切とLate News締切、4ページ厳守の書式、9 subcommitteeの守備範囲、参加費とOnDemand公開期間を、ieee-iedm.org の公式ページだけで確認します。","pageTitle":"IEDMとは | 2026年の会期・会場、投稿締切と4ページ書式、9 subcommittee構成と選考基準を公式情報で整理","relatedConferenceIds":["vlsi","isscc","ssdm","irps","iitc","drc"],"sections":{"cycle":{"id":"cycle","body":"2026サイクルは12月12日（土）から16日（水）まで、San FranciscoのHilton San Francisco Union Squareで開催されます。土曜がTutorials、日曜がShort Courses、月曜午前がKeynote、月〜水がTechnical Sessionsという構成で、火曜夜にPanel Sessionが置かれています。現地参加に加えてOnDemandが用意され、OnDemandは2026年12月21日開始・2027年1月31日まで登録可能と明記されています。2027年（12月4〜8日）と2028年（12月2〜6日）も同じHilton Union Square San Franciscoで日程が公表済みなので、複数年の出張計画を先に立てられます。","facts":[{"note":"公式トップの会期表記。","label":"2026 会期","value":"December 12-16, 2026","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/"},{"note":"公式トップに会場名と都市が併記されている。","label":"2026 会場・都市・国","value":"Hilton San Francisco Union Square / San Francisco, CA（米国）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/"},{"note":"登録ページに \"will also receive access to the OnDemand portion which begins on December 21, 2026\" とある。オンライン参加と現地参加で料金は同一と記載。","label":"2026 開催形式","value":"現地開催に加えてOnDemand（現地参加者にもOnDemandアクセスが付与される）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/attendee/registration-details/"},{"note":"同ページには \"there are no registration refunds as all content will be available on demand after the conference\" という返金不可の方針も併記されている。","label":"2026 OnDemand の公開期間","value":"OnDemand は 2026年12月21日開始、\"OnDemand registration will remain open through January 31, 2027.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/attendee/registration-details/"},{"note":"Program ページ側の時間表記（Tutorials 12:00 PM–6:00 PM、Short Courses 8:00 AM–5:00 PM 等）とは一致しないため、確定時刻は開催直前に再確認が必要。","label":"2026 日程内訳（Schedule at a Glance）","value":"12/12(土) Tutorials 1:30 PM–6:00 PM / 12/13(日) Short Courses 9:00 AM–6:00 PM / 12/14(月) Keynote 9:00 AM–12:00 PM + Technical Sessions 1:30 PM–6:00 PM / 12/15(火) Technical Sessions 9:00 AM–6:00 PM + Panel Session 8:00 PM–10:00 PM / 12/16(水) Technical Sessions 9:00 AM–5:30 PM","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/schedule-at-a-glance/"},{"note":"Future Conferences ページに掲載。","label":"2027 会期・会場","value":"\"December 4-8, 2027 | Hilton Union Square San Francisco\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/future-conferences/"},{"note":"Future Conferences ページに掲載。2029年以降の日程は同ページに記載がない。","label":"2028 会期・会場","value":"\"December 2-6, 2028 | Hilton Union Square San Francisco\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/future-conferences/"}],"title":"2026サイクルの会期・会場・開催形式と、次サイクルの公表状況","eyebrow":"cycle"},"scope":{"id":"scope","body":"IEDMの対象は、About ページが列挙するとおりnanometer-scale CMOSから advanced memory、displays、sensors、MEMS、quantum/nano-scale devices、optoelectronics、power・energy harvesting、high speed devices、そしてprocess technologyとdevice modeling/simulationまでを含みます。材料系はsilicon、compound、organic semiconductorに加えてemerging material systemsも対象と明記されています。投稿先は9つのtechnical subcommitteeに分かれ、Topics of Interest ページには「他subcommitteeへ転送されうるテーマ」が明記されているので、投稿前にどのsubcommitteeが自分の主張を評価するかを先に決めておくのが安全です。","facts":[{"note":"同ページは対象を \"semiconductor and electronic device technology, design, manufacturing, physics, and modeling\" とも表現している。","label":"対象領域（About の記述）","value":"\"nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high speed devices, as well as process technology and device modeling and simulation\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/"},{"note":"About ページのscope記述。","label":"対象材料系","value":"\"encompasses devices in silicon, compound and organic semiconductors, but also in emerging material systems\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/"},{"note":"Call for Papers Overview の表記。Committees ページでは MT が \"Memory and Technologies\"、PMB が \"Power, Millimeter Wave and Analog Technology (PMA)\" と略号・名称が揺れている。","label":"2026 technical subcommittee（9件）","value":"Advanced Logic Technology (ALT) / Emerging Device and Compute Technology (EDT) / Memory Technology (MT) / Modeling and Simulation (MS) / Neuromorphic and Novel Computing (NC) / Optoelectronics, Displays and Imagers (ODI) / Power, Millimeter Wave, and Analog Technology (PMB) / Reliability of Systems and Devices (RSD) / Sensors, MEMS, and Bioelectronics (SMB)","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/call-for-papers-overview/"},{"note":"gate-all-around構造、heterogeneous integration、design technology co-optimization も同subcommitteeの範囲として記載。","label":"ALT の対象","value":"\"CMOS platform technologies and applications (e.g., HPC, LOP, mobile, automotive, low-temperature CMOS, etc.)\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"},{"note":"投稿先subcommitteeの選択を誤ると転送対象になることが明記された数少ない箇所。","label":"MT の対象と転送ルール","value":"対象は \"SRAM, DRAM, and Flash, as well as breakthroughs in emerging innovations such as MRAM, PCM, FRAM, RRAM, ECM, SOM Cross-Point memory\"。computing architectureやCiMのようなアルゴリズム中心の論文は \"may be transferred to other technical sections\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"},{"note":"NC自体の対象は \"neuromorphic computing and advanced artificial intelligence (AI) acceleration\"。","label":"NC の転送ルール（明示された対象外）","value":"\"Papers focusing primarily on near-memory computing may be transferred to the MT subcommittee, while papers centered on optical or quantum computing may be transferred to EDT\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"},{"note":"信頼性テーマがIEDM内でどこに入るかの判断材料。","label":"RSD の対象","value":"\"component-level FEOL/MOL/BEOL characterization and reliability modeling\"（transistor degradation、electromigration、latch-up、soft errors を含む）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"}],"title":"対象技術領域・9 subcommittee構成・明示された対象外","eyebrow":"scope"},"review":{"id":"review","body":"IEDMは投稿された4ページ論文そのものだけで採否を決める方式で、\"Promises of upcoming results will be ignored\" と明記されています。審査観点として公式が挙げているのは、研究の目的、既存技術に対してどれだけ前進したか（適切な引用付き）、そして実験条件が明示された具体的な新しい結果の3点で、リジェクト理由として最も多いのは具体的な結果の欠如だと書かれています。選考主体はIEDM committeesで、\"review submissions\" が委員会の役割として明示されています。個々の論文をどの委員が何名で読むかといった手続き、double-blindの記載、採択率はいずれも公式サイト上で確認できませんでした。","facts":[{"note":"この3点がPaper Preparationページで論文に明記すべき事項として並んでいる。","label":"審査観点（公式が求める記載内容）","value":"\"The purpose of the work\" / \"The manner and degree to which it advances the art accompanied with proper references\" / \"Specific new results that have been obtained with clear experimental conditions and their significance\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"公式が明示している唯一のリジェクト傾向の記述。","label":"最頻のリジェクト理由","value":"\"The most common cause of rejection of submitted papers is a lack of specific results.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"追加資料や将来の結果の約束は評価対象外であることが明記されている。","label":"採否の判断材料","value":"\"Paper acceptance will be based solely on the information provided on the four-page paper submitted. Promises of upcoming results will be ignored.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"会議開催時点で未公表であることが条件。","label":"新規性要件","value":"\"Only work that has not been previously published at the time of the conference will be considered.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"Paper Preparation ページに明記。","label":"剽窃チェック","value":"\"All submissions will be checked for plagiarism.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"Committees ページには9つのtechnical subcommitteeと各chairが列挙されている。外部査読者による匿名査読や査読者数を示す記述は同ページに見当たらない。","label":"選考主体","value":"\"IEDM committees bring together global experts who guide the technical program, review submissions, and shape the conference experience.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"Call for Papers Overview、Submission Details、Paper Preparation、Press Overview、Notifications & Policies のいずれにも採択率・投稿件数・採択件数の数値はない。過去年の数値を当年に流用しないこと。","label":"採択率","value":"公式サイト上に記載を確認できない","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/call-for-papers-overview/"},{"note":"むしろ Submission Details は投稿時の author list を採択後に変更できないと定めており、著者情報を伏せる運用を示す記述はない。","label":"double-blind の有無","value":"double-blind / anonymous review を指す記述は公式サイト上に確認できない","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"}],"title":"査読・選考の方式と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"IEDM公式サイトは2026サイクルの運営情報が中心で、採択率・投稿件数・採択件数・参加人数といった統計を公表していません。初回開催年を西暦で示した記述、採択論文がIEEE Xploreに収録されると明言した記述、ジャーナル特集号への招待制度、2026 keynoteの講演タイトル、exhibitorの個社名一覧も、今回開いた公式ページには見当たりませんでした。同じ項目でもページ間で数値や名称が食い違う箇所があるため、引用時はどのページから取ったかを必ず添えてください。特にプログラム時刻はProgram / Schedule at a Glance / Tutorials / Short Courses の4ページで揃っておらず、Featured Sessions & Events ページは2026年8月5日時点でテンプレートのプレースホルダ文（Lorem Ipsum）と仮日付（6月の日付）が残っています。Exhibitor List ページの本文冒頭が \"At IEEE IEDM 2025, ...\" のままである点も、年度混同の原因になります。","facts":[{"note":"同一サイト内で年数表現が異なる。どちらも初回開催年を西暦で示していない。","label":"継続年数の表記揺れ","value":"About は \"more than 70 years\"、Press Overview は \"For over 65 years\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/press-overview/"},{"note":"略号 PMB / PMA が両立している。投稿先を書面で示す際はCFP側の表記に合わせるのが無難。","label":"subcommittee 名称・略号の揺れ","value":"Call for Papers Overview は \"Memory Technology (MT)\" / \"Power, Millimeter Wave, and Analog Technology (PMB)\"、Committees は \"Memory and Technologies (MT)\" / \"Power, Millimeter Wave and Analog Technology (PMA)\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"Technical Sessions の開始時刻も同様に2ページ間で異なる。渡航手配前に最新の Schedule at a Glance を再確認すること。","label":"プログラム時刻の不一致","value":"Tutorials は Program ページで 12:00 PM–6:00 PM、Schedule at a Glance で 1:30 PM–6:00 PM。Short Courses は Program ページで 8:00 AM–5:00 PM、Schedule at a Glance と Short Courses ページで 9:00 AM–6:00 PM","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/schedule-at-a-glance/"},{"note":"このページの内容はまだ確定情報として扱えない。keynoteカードも氏名が名のみ、所属が \"Company Name\"、タイトルが \"Keynote Title\" のプレースホルダのまま。","label":"Featured Sessions & Events ページの未確定状態","value":"2026-08-05 時点で focus session / evening panel の説明文が \"Lorem Ipsum\" のプレースホルダのまま、日付も \"11:30 | 23 June 2026\" などの仮値が残っている","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/featured-sessions-events/"},{"note":"本ページの2026サイクル記述と取り違えないよう、原典ページの年号表記を確認すること。","label":"年度が混ざりやすい箇所","value":"Exhibitor List ページの本文冒頭が \"At IEEE IEDM 2025, ...\" と前サイクルの年号のまま（2026-08-05時点）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/exhibitor-list/"}],"title":"未公開項目・年度の取り違えやすい箇所・公式表記の揺れ","eyebrow":"caveats"},"history":{"id":"history","body":"公式トップは2026サイクルを \"72nd Annual\" と表記し、Aboutページは \"a history stretching back more than 70 years\" と書いています。ただしPress Overviewページは \"For over 65 years\" と別の年数を書いており、初回開催年そのものを明示した記述は今回開いた公式ページ上には見当たりませんでした。開催地は2026・2027・2028のいずれもSan FranciscoのHilton Union Squareで、ローテーションを示す記述はありません。Roger A. Haken Best Student Paper Awardは1990年に逝去した同氏を記念して設けられたもので、受賞者一覧は2014年分まで遡って掲載されています。","facts":[{"note":"公式トップの表記。","label":"2026 の回数表記","value":"\"72nd Annual IEEE International Electron Devices Meeting\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/"},{"note":"Aboutページ。初回開催年（西暦）はこのページに書かれていない。","label":"継続年数の公式表現（About）","value":"\"a history stretching back more than 70 years\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/"},{"note":"Aboutページの \"more than 70 years\" と数値が食い違う。日本語で年数を書く場合はどちらのページを引いたか明示すること。","label":"継続年数の別表現（Press Overview）","value":"\"For over 65 years, the IEEE International Electron Devices Meeting has been the premier forum for presenting breakthroughs in semiconductor devices, device physics, process technologies, and emerging computing architectures.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/press-overview/"},{"note":"About、Press Overview、IEDM Archive、IEEE EDS Info のいずれにも初回開催年の記載はない。\"72nd Annual\" と \"more than 70 years\" から逆算した年は公式の記述ではないため、当ページでは採用しない。","label":"初回開催年","value":"公式サイト上に西暦での明示を確認できない","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/iedm-archive/"},{"note":"都市や大陸をまたぐローテーションを示す記述は同ページにない。2029年以降は未公表。2026の会場（Hilton San Francisco Union Square）は公式トップに別途記載されている。","label":"開催地の推移（公表分）","value":"Future Conferences ページに載る 2027・2028 はいずれも \"Hilton Union Square San Francisco\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/future-conferences/"},{"note":"2025年分および2014年以前は同ページにリンクがない。","label":"アーカイブの遡及範囲","value":"2015年から2024年までの10年分（リンク名は \"2015 Conference\" 〜 \"2024 Conference\"）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/iedm-archive/"},{"note":"\"awarded each year to the best student paper presented at IEDM, and is given at the IEDM conference in the following year\" と、翌年の会議で授与される運用も明記。受賞者一覧は2014年分まで掲載。","label":"Roger A. Haken Best Student Paper Award の由来","value":"\"The award was created in memory of Roger A. Haken who served on the IEEE IEDM Executive Committee for several years including as technical program vice chair in 1990 when he passed away in June of that year.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/roger-a-haken-best-student-paper-award/"}],"title":"継続年数・開催地・アーカイブ・表彰の由来","eyebrow":"history"},"program":{"id":"program","body":"2026サイクルは、月曜午前の3件のKeynoteで始まり、月〜水がTechnical Sessions、火曜夜にPanel Sessionという骨格です。前段の土曜には80分×6本のTutorial、日曜には終日のShort Courseが2コース組まれており、2026年8月5日時点でTutorial 6本とShort Course 2コースのタイトル・登壇者は公表済みです。Keynoteは登壇者3名の氏名・所属までが公式トップに出ていますが、講演タイトルはまだ公開されていません。Expoは月曜12:00から水曜11:30まで開き、ブースは22件に限定されています。一方、Featured Sessions & Events ページはテンプレートのプレースホルダ文（Lorem Ipsum）と仮日付のままで、focus sessionやevening panelの確定内容はまだ読めません。","facts":[{"note":"Schedule at a Glance では 12/14(月) 9:00 AM–12:00 PM に Keynote が置かれている。講演タイトルは Program ページになく、登壇者3名の氏名・役職・所属は公式トップの \"Conference Key Speakers\" 欄に掲載されている。","label":"2026 Keynote","value":"\"Kick-off IEDM on Monday morning with 3 keynote presentations from leaders in the industry.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/"},{"note":"Program ページは 12:00 PM–6:00 PM、Schedule at a Glance は 1:30 PM–6:00 PM、Tutorials ページは \"Saturday, December 12, 1:30-2:50 pm\" と時間表記が揃っていない。","label":"2026 Tutorials（本数・日程）","value":"\"Six tutorial sessions at 80 minutes each\"、Saturday, December 12, 2026","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/"},{"note":"登壇者として Larry Bair (AMD)、Oliver Noblanc (ST Micro)、Fatih Hamzaoglu (Intel)、Elisa Vianello (CEA-Leti)、Pratheep Balasingam (Synopsys)、Joris Vancampenhout (Imec) が掲載されている。","label":"2026 Tutorial タイトル（6件）","value":"Evolution of the transistor from planar to nanosheet and beyond / Chiplet, heterogeneous integration, 3D stacking technologies principles and state of the art / Memory Technologies and System Co-Optimization in the AI Era: Past, Present and Future / Diverse Memory Technologies for Adaptive Computing: From Device Physics to Cooperative Architectures / AI in Physics-based Semiconductor Modeling: From PDE-constrained Learning to Agentic TCAD/DTCO Workflows / Advanced Optical Devices and Wafer-Scale Assembly for next-generation CPO and Optical I/O","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/tutorials/"},{"note":"Short Courses ページの時間表記は 9:00 AM–6:00 PM、Program ページは \"full day course\" で 8:00 AM–5:00 PM。","label":"2026 Short Course（2コース）","value":"Short Course 1: Logic and System Innovations Powering the AI Era / Short Course 2: Powering Next-Generation AI and HPC with Advanced Memory Technologies。Sunday, December 13、各コース6セッション構成","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/short-courses/"},{"note":"Program ページも \"panels, and industry events\" に言及している。個別パネルの題目は確定表示になっていない。","label":"2026 Panel Session","value":"Tuesday, December 15, 8:00 PM – 10:00 PM に \"Panel Session\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/schedule-at-a-glance/"},{"note":"Schedule at a Glance ページは 12/14 1:30 PM–6:00 PM、12/15 9:00 AM–6:00 PM、12/16 9:00 AM–5:30 PM と異なる時刻を掲げており、2ページ間で一致しない。","label":"2026 Technical Sessions","value":"Program ページの表記は December 14-15, 2026 が 8:00 AM–5:00 PM、December 16, 2026 が 8:30 AM–3:00 PM","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/"},{"note":"搬入は月曜 8:00 AM–11:00 AM、搬出は水曜 11:30 AM–2:00 PM。","label":"2026 Expo 開催時間","value":"Monday, Dec 14 12:00 PM–5:30 PM / Tuesday, Dec 15 8:30 AM–5:00 PM / Wednesday, Dec 16 9:00 AM–11:30 AM","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/expo-exhibitors/become-an-exhibitor/"},{"note":"Program ページに記載。Satellite Events は同ページで \"Coming Soon\" 表示。","label":"2026 併設イベント（レセプション）","value":"\"Monday Evening Reception\" が technical session registration に含まれる","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/"}],"title":"2026プログラム構成（Keynote / Tutorials / Short Courses / Panel / Expo）","eyebrow":"program"},"audience":{"id":"audience","body":"学生が筆頭著者の論文は投稿時に student paper として指定すると Roger A. Haken Best Student Paper Award の対象になりますが、本人が発表することが条件です。Student Travel Assistance は廃止され、現在は Student Financial Assistance として会場内で使えるfood and beverage voucher のみになっているため、渡航費は自前で確保する前提で計画してください。企業・調査担当にとっては、Tutorialsと Short Courses のタイトル一覧が「その年に業界が何を主題として整理しようとしているか」を最も早く読める場所で、2026はAI時代のロジック／メモリとCPOが軸になっています。現地に行けない場合はOnDemand登録が同額で用意され、2027年1月31日まで受け付けられます。","facts":[{"note":"\"The award is chosen based on both paper and presentation, and winner is announced and presented following IEDM.\" とも記載。","label":"student paper の指定と受賞条件","value":"\"Papers written by students as the leading (first) author and based on their own work will be considered for the Best Student Paper Award. Papers must be identified as student papers at time of submission, and the presentation must be given by the student to be eligible.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/student-info/"},{"note":"現行の支援は \"IEDM is offering Student Financial Assistance to all student presenters with a food and beverage voucher to be used at Hilton's Herb N' Kitchen.\"。受給には11月10日までに登録・bio/headshotのアップロード・録画のアップロードが必要。","label":"学生支援の内容変更","value":"\"Student Financial Assistance is now in place of the Student Travel Assistance Program. IEDM will no longer provide Student Travel Assistance – there will be no reimbursement for travel.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/student-info/"},{"note":"Short Courses、Tutorials（Option A/B/C）、Lunch Ticket は別料金。\"November 10: Last day to register for IEDM at discounted rate. Rates increase on November 11.\"","label":"2026 参加費（Conference Registration）","value":"IEEE Member $655（11/10まで）/ $755（11/11以降）、Non-Member $815 / $915、Student Member $250 / $300、Student Non-Member $300 / $350、Life Member $250 / $300","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/attendee/registration-details/"},{"note":"ただし同ページはTutorials/Short Coursesを別料金項目としても掲げているため、購入時に対象範囲を確認すること。返金は不可。","label":"参加費に含まれるもの","value":"\"access to technical sessions, keynote presentations, tutorials, and on-demand content\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/attendee/registration-details/"},{"note":"各コース6セッション構成。テーマ一覧は投稿先の選定や技術調査の当たりをつけるのに使える。","label":"2026 Short Course の主題（業界動向の読み取り口）","value":"Short Course 1 は distributed network design、transistor scaling、mobile SoC performance、atomic layer processing、advanced packaging reliability、cryogenic electronics を、Short Course 2 は memory-centric computing、HBM design、oxide-semiconductor DRAM、NAND technology、spintronics/MRAM、chiplet/packaging technologies を扱う","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/program/short-courses/"}],"title":"研究室・学生と、企業・調査担当それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称は \"International Electron Devices Meeting\"、公式トップは2026サイクルを \"72nd Annual IEEE International Electron Devices Meeting\" と表記しています。主催表記は \"Organized and sponsored by IEEE and the Electron Devices Society\" で、共催・技術協賛を分けた別表記は公式サイト上に見当たりません。回数は「第72回」に相当する \"72nd Annual\" が公式トップにあるので、日本語で回数を書く場合はこの表記に合わせてください。なお公式ドメインは www.ieee-iedm.org から ieee-iedm.org へ301リダイレクトされるため、引用URLはリダイレクト後のホストに統一するのが安全です。","facts":[{"note":"2026サイクルの見出しでは \"72nd Annual IEEE International Electron Devices Meeting\" として IEEE を冠した形でも表記されている。","label":"正式名称（公式トップ表記）","value":"International Electron Devices Meeting","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/"},{"note":"公式ドメイン（ieee-iedm.org）、ページタイトル、本文いずれもこの略称を使用。","label":"略称","value":"IEDM","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/"},{"note":"公式トップの会期見出しに記載。\"72nd conference\" ではなく \"72nd Annual\" という書き方。","label":"2026 回数表記","value":"\"72nd Annual IEEE International Electron Devices Meeting\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/"},{"note":"IEEE EDS Info ページの固定文。公式トップでも \"IEEE and the Electron Devices Society\" と書かれている。共催・技術協賛を区別した別表記は確認できない。","label":"主催表記","value":"\"Organized and sponsored by IEEE and the Electron Devices Society\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/ieee-eds-info/"},{"note":"同ページに会員費も掲載され、\"Membership is only USD 10 for professionals and students pay only USD 5!\" と書かれている。","label":"主催学会の自己紹介","value":"\"The IEEE Electron Devices Society (EDS)\" を \"the premier global society in the field of electron device engineering\" と紹介","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/ieee-eds-info/"},{"note":"Future Conferences ページに2027年・2028年が各1件ずつ並ぶこととも整合する。","label":"開催頻度","value":"年1回（\"Researchers from academia, industry, and government gather annually to share innovations shaping the future of electronics.\"）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/press-overview/"}],"title":"識別情報（正式名称・主催・開催頻度・第N回）","eyebrow":"identity"},"community":{"id":"community","body":"2026のExecutive Committeeは、General Chairが台湾（NTHU/TSMC）、Technical Program Chairが米国（Texas Instruments）、Technical Program Vice Chairが日本（東北大学）と、地域が分散した構成になっています。9つのtechnical subcommittee chairはIntel、Quobly、GlobalFoundries、SK Hynix、POSTECH、Apple、Texas Instruments、IBM、University of Michiganの所属で、産業界の比率が高い一方でPOSTECHとUniversity of Michiganという大学所属も入っています。ここに挙がる組織名はcommitteeへの人員拠出を示すもので、投稿の採択しやすさや取引関係を意味するものではありません。展示側は22ブース限定で、学術向けの割安枠が別に用意されています。","facts":[{"note":"国名はCommitteesページに印字された所属組織の所在国表記であり、個人の国籍ではない。","label":"2026 Executive Committee（主要役職）","value":"General Chair: Meng-Fan (Marvin) Chang, NTHU/TSMC (Taiwan) / Technical Program Chair: Jungwoo Joh, Texas Instruments (USA) / Technical Program Vice Chair: Rihito Kuroda, Tohoku University (Japan)","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"同ページの掲載順に沿った記載。","label":"2026 Executive Committee（その他）","value":"Publications Chair: Srabanti Chowdhury, Stanford University (USA) / Publications Co-Chair: Gaudenzio Meneghesso, University of Padova (Italy) / Publicity Chair: John Paul Strachan, Forschungszentrum Juelich (Germany) / Publicity Co-Chair: Sandy Liao, TSMC (Taiwan) / Courses Chair: Kang-ill Seo, IBM (USA) / Treasurer: Jan Hoentschel, GLOBALFOUNDRIES (USA)","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"9件中7件が企業所属、2件が大学所属という内訳がページ上で読み取れる。所属組織名は委員就任の事実のみを示す。","label":"2026 subcommittee chair の所属","value":"ALT: Chung-Hsun Lin, Intel / EDT: Maud Vinet, Quobly / MT: Johannes Mueller, GlobalFoundries / MS: Dongyean Oh, SK Hynix / NC: Seyoung Kim, POSTECH / ODI: Geunsook Park, Apple / PMA: Zhikai Tang, Texas Instruments / RSD: Huimei Zhou, IBM / SMB: Roozbeh Tabrizian, University of Michigan","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"Committeesページの冒頭文。","label":"committee の役割","value":"\"IEDM committees bring together global experts who guide the technical program, review submissions, and shape the conference experience.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/committees/"},{"note":"Press Overview の記述。参加人数・国別内訳の数値は同ページにない。","label":"参加者層の記述","value":"\"Researchers from academia, industry, and government gather annually to share innovations shaping the future of electronics.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/press-overview/"},{"note":"出展条件として \"All companies must be directly involved in the industry.\" と事前承認が求められる。出展は支援・出展の事実のみを示し、取引関係を示すものではない。","label":"2026 展示の枠と費用","value":"\"$2,500 Per 10×10, booth includes: 1-Technical Session/Conference Registration 1-Exhibit Only Registration\"、\"A limited number of academic booths are available for $1,000\"、\"Limited exhibit availability, only 22 booths available\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/expo-exhibitors/become-an-exhibitor/"},{"note":"同ページは出展者像を \"a select group of industry leaders, pioneering start-ups, and research-driven firms\" と説明するにとどまる。本文冒頭は \"At IEEE IEDM 2025, ...\" と前サイクルの年号のままになっている。","label":"2026 exhibitor 一覧の公開状況","value":"Exhibitor List ページに個社名の一覧は掲載されていない（2026-08-05時点）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/exhibitor-list/"}],"title":"committee構成・産学の別・所在国・展示の枠","eyebrow":"community"},"comparison":{"id":"comparison","body":"IEDMが自ら定義している守備範囲は、デバイス技術・デバイス物理・プロセス技術・モデリングであり、回路やアーキテクチャそのものではありません。これはTopics of Interestの転送ルールに端的に表れていて、computing architectureやアルゴリズム中心の論文、near-memory computing中心の論文は他subcommitteeへ回されると明記されています。信頼性はRSDがcomponent-levelのFEOL/MOL/BEOL特性と信頼性モデリングを扱い、パッケージや異種集積はALTのheterogeneous integrationとして扱われます。ISSCC・VLSI・IRPS・IITCなど他会議との具体的な線引きはIEDM公式が書いていないため、比較する場合はそれぞれの公式CFPを併読してください。","facts":[{"note":"回路設計やシステムアーキテクチャを主対象として挙げる記述はAboutページにない。","label":"IEDM が自称する守備範囲","value":"\"semiconductor and electronic device technology, design, manufacturing, physics, and modeling\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/"},{"note":"IEDM内部の振り分けルールであって、他会議への誘導を示すものではない。","label":"アーキテクチャ／アルゴリズム寄りの論文の扱い","value":"MT では computing architecture や CiM のようなアルゴリズム中心の論文が \"may be transferred to other technical sections\"、NC では near-memory computing 中心の論文が MT へ、optical / quantum computing 中心の論文が EDT へ転送されうる","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"},{"note":"IEDM内で信頼性が独立subcommitteeとして確保されていることが読み取れる。","label":"信頼性テーマの位置づけ","value":"RSD が \"component-level FEOL/MOL/BEOL characterization and reliability modeling\" を担当","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/topics-of-interest/"},{"note":"About、Topics of Interest、Call for Papers Overview のいずれにも他会議との比較は書かれていない。比較は各会議の公式CFPを個別に確認すること。","label":"他会議との比較記述","value":"特定の他会議名を挙げた棲み分け説明は公式サイト上に確認できない","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/call-for-papers-overview/"}],"title":"近い会議との棲み分け（IEDM公式の記述から読める範囲）","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026サイクルの投稿は5月26日にsubmission siteが開き、本締切は7月19日23:59 PDTに延長されました。Late Newsは8月3日開始・8月18日締切です（時刻まで含む表記は Submission Details が 23:59 PDT、Call for Papers Overview が \"23:59 PT, Tuesday, August 18\"）。書式は本文が最大2ページ、図がさらに最大2ページ（図ページはキャプションのみ）の計4ページで、これを超えると即リジェクトと明記されているため、ページ配分は投稿前に必ず確認してください。IEEE PDF eXpress Plus（Conference ID 50580X）でXplore compliant PDFに変換してからMiraのsubmission siteにアップロードする二段構えで、変換していないPDFは受け付けられません。採択後は一切の修正が認められず、タイトル・著者リスト・summary は7月16日以降変更不可なので、著者情報や謝辞は投稿時点で確定させる必要があります。","facts":[{"note":"投稿システムは https://submissions.mirasmart.com/IEDM2026/login.aspx（Call for Papers Overview に記載）。","label":"2026 submission site open","value":"\"Submission Site Open.\" May 26, 2026","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"同ページには July 16, 2026 が title / author list / summary の変更最終日として別掲されている。","label":"2026 本投稿締切（延長後）","value":"\"Submission Deadline EXTENDED\" July 19, 2026 23:59 PDT","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"同ページは \"Papers should be in the same format as a regular paper and should be submitted through the submission website in the same way as for regular submissions.\" と、書式が本投稿と同じであることを明記している。時刻まで含む表記は Submission Details（August 18, 2026 23:59 PDT）と Call for Papers Overview（\"23:59 PT, Tuesday, August 18\"）にある。","label":"2026 Late News 締切","value":"\"Late News Submission opens: August 3, 2026\" / \"Late News Deadline: August 18, 2026\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/late-news/"},{"note":"タイムライン上のこの行に年号は付されていない。Late News の通知時期は Late News ページ側に \"Authors of accepted papers will be notified by the end of September.\" と別記されている。","label":"2026 採否通知日","value":"\"Paper Acceptance/Rejection Notifications.\" September 9","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"\"Avoid special international fonts\" も明記。別途150ワードのabstractが必要で、投稿物に別ページとして含めないよう指示されている。","label":"ページ数・書式","value":"4ページ厳守。\"Up to two pages of text and up to two additional pages of figures and drawings (no text, captions only) in 8-1/2\" x 11\" format\"、\"Papers with more than 2 pages of text or 2 pages of figures shall be grounds for immediate rejection.\"、\"The font size for the body of the text must be at least 10 point.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"Call for Papers Overview は Late News を \"A limited number of papers are accepted based on significance and timeliness.\" と説明している。","label":"投稿区分","value":"regular \"contributed\" paper か \"student paper\" のいずれかを投稿時に指定。これとは別に Late News track がある","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"Conference ID は Paper Preparation ページ、リジェクト条件は Submission Details ページに記載。LaTeXテンプレートがダウンロード提供されている。","label":"PDF変換の必須手順","value":"IEEE PDF eXpress Plus で Xplore compliant PDF を作成してから submission site にアップロード。Conference ID は 50580X。\"Papers not converted to the Xplore compliant PDF will be rejected.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"},{"note":"採択後に別途camera-ready版を差し替える工程は公式サイト上に見当たらない。採択者は追加で \"20-minute Video Presentation\" と \"PDF Slide Presentation on IEDM Template\" の提出を求められる。","label":"camera-ready の扱い","value":"\"Accepted papers will be published AS IS. No changes are permitted after acceptance, including author list and funding acknowledements, etc.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"}],"title":"投稿区分・4ページ書式・2026締切一覧・通知日・camera-ready","eyebrow":"submission"},"publication":{"id":"publication","body":"採択論文は投稿された形のままproceedingsに載り、会場での発表が条件です（\"Accepted papers will be published as submitted and must be presented at the event.\"）。投稿段階でIEEE PDF eXpress PlusによるXplore compliant PDFへの変換が必須とされており、変換していない論文はリジェクトされます。一方で「IEEE Xploreに収録される」と明言する文そのものは、今回開いた公式ページ上では確認できませんでした。発表前の公開については、採択された論文や研究の主要部分を会議前にpublic domainに置くことが禁じられ、違反は論文の自動取り下げ事由になります。会議後のコンテンツは登録者向けにOnDemandで提供されます。","facts":[{"note":"Submission Details 側では \"Accepted papers will be published AS IS. No changes are permitted after acceptance, including author list and funding acknowledements, etc.\" と大文字表記。","label":"proceedings掲載の条件","value":"\"Accepted papers will be published as submitted and must be presented at the event.\" / \"Accepted papers will be published as-is in the proceedings.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/call-for-papers-overview/"},{"note":"これは投稿PDFの形式要件であり、収録先を明言した文ではない。IEEE Xplore への収録を明記する文は今回開いた公式ページ上に確認できない。","label":"IEEE Xplore 対応の要件","value":"投稿PDFは \"IEEE Xplore-compliant PDF\" であることが必須。\"Papers not converted to the Xplore compliant PDF will be rejected.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/submission-details/"},{"note":"プレプリント公開や他会議での先行発表を検討している場合の制約になる。","label":"事前公表の禁止","value":"\"Submission of a paper for review and subsequent acceptance is considered by the committee as an agreement that the work will not be placed in the public domain by the author prior to the conference.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/pre-publish-restrictions/"},{"note":"proceedingsの有無にかかわらず他会議での公開も禁止対象に含めている点に注意。","label":"事前公表の範囲と罰則","value":"\"Accepted papers or significant portions of the work may not be placed in the public domain (conference with and without proceedings) prior to the conference.\" / \"Violation will be grounds for automatic withdrawal of the paper by the conference committee.\"","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/pre-publish-restrictions/"},{"note":"\"there are no registration refunds as all content will be available on demand after the conference\" と記載され、これが返金不可の根拠として示されている。一般公開を示す記述はない。","label":"会議後の公開範囲（2026）","value":"登録者向けOnDemandとして 2026年12月21日から提供、OnDemand登録は 2027年1月31日まで","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/attendee/registration-details/"},{"note":"2025年分および2014年以前のリンクは同ページにない。リンク先は ieee-iedm.org 上のPDFで、ログインは求められない。","label":"過去年アーカイブの公開範囲","value":"About > IEDM Archive に 2015年から2024年までの各年のリンクが並ぶ（リンク名は \"2015 Conference\" 〜 \"2024 Conference\"）","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/about/iedm-archive/"},{"note":"Call for Papers Overview、Submission Details、Paper Preparation のいずれにも、採択論文をジャーナル特集号へ招待する制度の記述はない。","label":"特集号招待","value":"公式サイト上に記載を確認できない","checkedAt":"2026-08-05","sourceUrl":"https://ieee-iedm.org/paper-preparation/"}],"title":"proceedings掲載・公開範囲・事前公表の制限","eyebrow":"publication"}},"sources":[{"url":"https://ieee-iedm.org/","role":"official","label":"IEDM 公式トップ（2026サイクル）","checkedAt":"2026-08-05","evidenceLocator":"ヒーロー部の会期見出しに \"72nd Annual IEEE International Electron Devices Meeting\"、\"December 12-16, 2026\"、\"Hilton San Francisco Union Square, San Francisco, CA\"、主催表記 \"Organized and sponsored by IEEE and the Electron Devices Society\"。\"Conference Key Speakers\" 欄に登壇者3名の氏名・役職・所属（講演タイトルはなし）。www.ieee-iedm.org からは301でこのホストへ転送される。"},{"url":"https://ieee-iedm.org/about/","role":"official","label":"About IEDM","checkedAt":"2026-08-05","evidenceLocator":"冒頭段落にscope記述と \"a history stretching back more than 70 years\"、下部に2027・2028年の日程と Organizing Committees / Contacts / Press Kit へのリンク。"},{"url":"https://ieee-iedm.org/call-for-papers-overview/","role":"cfp","label":"Call for Papers Overview（2026）","checkedAt":"2026-08-05","evidenceLocator":"Late News締切 \"23:59 PT, Tuesday, August 18\"、\"four-page, camera-ready papers\"、9 subcommittee一覧、\"Accepted papers will be published as-is in the proceedings\"、Mirasmart投稿サイトへのリンク。"},{"url":"https://ieee-iedm.org/submission-details/","role":"cfp","label":"Submission Details（2026）","checkedAt":"2026-08-05","evidenceLocator":"冒頭のタイムライン表に Submission Site Open (May 26, 2026)、Submission Deadline EXTENDED (July 19, 2026 23:59 PDT)、Late News (Aug 3 / Aug 18)、Paper Acceptance/Rejection Notifications (September 9)。中段に4ページ書式・フォント・用紙サイズ・150-word abstract、下段に camera-ready と採択後提出物。"},{"url":"https://ieee-iedm.org/paper-preparation/","role":"cfp","label":"Paper Preparation","checkedAt":"2026-08-05","evidenceLocator":"論文に明記すべき3項目、\"The most common cause of rejection...\"、\"Paper acceptance will be based solely on...\"、剽窃チェック、LaTeXテンプレート、IEEE PDF eXpress Conference ID 50580X。"},{"url":"https://ieee-iedm.org/late-news/","role":"cfp","label":"Late News（2026）","checkedAt":"2026-08-05","evidenceLocator":"受付期間（August 3, 2026 / August 18, 2026）、\"A highly limited number of Late News Papers will be accepted\"、通知時期、travel assistance と student paper award の対象外規定。"},{"url":"https://ieee-iedm.org/topics-of-interest/","role":"cfp","label":"Topics of Interest（subcommittee別）","checkedAt":"2026-08-05","evidenceLocator":"ALT〜SMBの9見出しごとに対象範囲が列挙され、MTとNCの項に他subcommitteeへの転送ルールが書かれている。"},{"url":"https://ieee-iedm.org/pre-publish-restrictions/","role":"cfp","label":"Pre-Publish Restrictions","checkedAt":"2026-08-05","evidenceLocator":"本文3文で、投稿＝会議前非公開の同意とみなす旨、公開範囲の定義、違反時の自動取り下げを規定。"},{"url":"https://ieee-iedm.org/program/","role":"program","label":"Program（2026）","checkedAt":"2026-08-05","evidenceLocator":"Keynote / Tutorials / Short Courses / Technical Sessions の各カードに日程と時間、Monday Evening Reception への言及、Satellite Events は \"Coming Soon\"。"},{"url":"https://ieee-iedm.org/program/schedule-at-a-glance/","role":"program","label":"Schedule at a Glance（2026）","checkedAt":"2026-08-05","evidenceLocator":"12/12〜12/16の日付別グリッドに Tutorials / Short Courses / Keynote / Technical Sessions / Panel Session と各時間帯。"},{"url":"https://ieee-iedm.org/program/tutorials/","role":"program","label":"Tutorials（2026）","checkedAt":"2026-08-05","evidenceLocator":"6件のtutorialタイトルと登壇者（AMD / ST Micro / Intel / CEA-Leti / Synopsys / Imec）、開催日 Saturday, December 12。"},{"url":"https://ieee-iedm.org/program/short-courses/","role":"program","label":"Short Courses（2026）","checkedAt":"2026-08-05","evidenceLocator":"2コースのタイトルと各6セッションの内訳、開催日 Sunday, December 13、時間 9:00 AM–6:00 PM。"},{"url":"https://ieee-iedm.org/program/featured-sessions-events/","role":"program","label":"Featured Sessions & Events（2026）","checkedAt":"2026-08-05","evidenceLocator":"keynote / highlight session / focus session / evening panel のカードが並ぶが、説明文は \"Lorem Ipsum\" のプレースホルダ、日付は6月の仮値のまま（2026-08-05時点）。"},{"url":"https://ieee-iedm.org/committees/","role":"committee","label":"Committees（2026）","checkedAt":"2026-08-05","evidenceLocator":"冒頭文に委員会の役割、Executive Committee の役職・氏名・所属・国、続いて9 technical subcommittee の chair と所属。"},{"url":"https://ieee-iedm.org/attendee/registration-details/","role":"registration","label":"Attendee Registration Details（2026）","checkedAt":"2026-08-05","evidenceLocator":"料金表（IEEE Member / Non-Member / Student / Life Member の 11/10 前後2段階）、11月10日の割引期限、OnDemand開始日と登録期限、返金不可の方針。"},{"url":"https://ieee-iedm.org/student-info/","role":"official","label":"Student Info","checkedAt":"2026-08-05","evidenceLocator":"student paper の定義と受賞条件、Student Financial Assistance への切り替え文、11月10日までの受給要件。"},{"url":"https://ieee-iedm.org/roger-a-haken-best-student-paper-award/","role":"official","label":"Roger A. Haken Best Student Paper Award","checkedAt":"2026-08-05","evidenceLocator":"冒頭に賞の定義と翌年授与の運用、次段落に Roger A. Haken の経歴と1990年の逝去、以下に2014年分まで遡る受賞者一覧。"},{"url":"https://ieee-iedm.org/expo-exhibitors/become-an-exhibitor/","role":"sponsor","label":"Become an Exhibitor（2026 Expo）","checkedAt":"2026-08-05","evidenceLocator":"ブース料金（$2,500 / 10×10、学術枠 $1,000）、付属備品、Expo開催時間表（12/14〜12/16）、搬入搬出時間、\"only 22 booths available\"、出展資格。"},{"url":"https://ieee-iedm.org/exhibitor-list/","role":"sponsor","label":"Exhibitor List","checkedAt":"2026-08-05","evidenceLocator":"見出しは \"Exhibitor List\"。本文冒頭が \"At IEEE IEDM 2025, ...\" で始まり、出展者像と展示形式の説明のみで個社名の一覧はない（2026-08-05時点）。"},{"url":"https://ieee-iedm.org/about/iedm-archive/","role":"archive","label":"IEDM Archive（過去年）","checkedAt":"2026-08-05","evidenceLocator":"2024年から2015年まで年ごとに \"2024 Conference\" 〜 \"2015 Conference\" というPDFリンクが並ぶ。年ごとの日程・開催地・回数の表記はない。"},{"url":"https://ieee-iedm.org/about/future-conferences/","role":"official","label":"Future Conferences","checkedAt":"2026-08-05","evidenceLocator":"2027年（December 4-8, 2027）と2028年（December 2-6, 2028）の日程と会場 Hilton Union Square San Francisco の2行のみ。"},{"url":"https://ieee-iedm.org/ieee-eds-info/","role":"society","label":"IEEE EDS Info","checkedAt":"2026-08-05","evidenceLocator":"\"Organized and sponsored by IEEE and the Electron Devices Society\" の主催表記、EDSの自己紹介、会員費（USD 10 / USD 5）、IEDMのscope再掲。"},{"url":"https://ieee-iedm.org/press-overview/","role":"official","label":"Press Overview","checkedAt":"2026-08-05","evidenceLocator":"冒頭紹介文に \"For over 65 years...\" と \"Researchers from academia, industry, and government gather annually...\"。統計値やプレスリリース一覧はない。"},{"url":"https://ieee-iedm.org/press/press-kit/","role":"official","label":"Press Kit","checkedAt":"2026-08-05","evidenceLocator":"About IEDM のボイラープレート段落。参加人数・論文数・採択率などの統計は掲載されていない。"},{"url":"https://ieee-iedm.org/notifications-policies/","role":"official","label":"Notifications & Policies","checkedAt":"2026-08-05","evidenceLocator":"撮影ポリシー、非差別方針、code of conduct、安全に関する記述のみ。査読・採択率・no-showに関する記述はない。"},{"url":"https://ieee-iedm.org/page-sitemap.xml","role":"official","label":"公式サイト page-sitemap（掲載ページ一覧）","checkedAt":"2026-08-05","evidenceLocator":"公開ページ40件のURL一覧。history / past-conferences 単独ページが存在せず、過去情報は /about/iedm-archive/ に集約されていることの確認に使用。"}],"summary":"IEDMはIEEEとIEEE Electron Devices Society (EDS) がsponsorする、半導体・電子デバイスの技術・設計・製造・物理・モデリングを対象とした年1回の国際会議です。2026年サイクルは12月12〜16日にSan FranciscoのHilton San Francisco Union Squareで開催され、公式トップは \"72nd Annual\" と表記しています。このページでは、2026サイクルの会期と日程内訳、投稿の締切と4ページ書式、subcommittee単位でどこまでが対象でどこから転送されるか、採択後の扱いと公開範囲、参加費と展示の条件を、公式が実際に書いている範囲だけで整理します。採択率・初回開催年・IEEE Xplore収録の明文・特集号招待のように公式サイト上で確認できなかった項目は、推定せず「公式サイト上に記載を確認できない」と明示します。","topics":[{"note":"\"CMOS platform technologies and applications (e.g., HPC, LOP, mobile, automotive, low-temperature CMOS, etc.)\" を対象とし、gate-all-around構造やdesign technology co-optimizationを含む。","label":"CMOS platform 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Convention Centerで開かれます。","question":"2026年のPVSECはいつ、どこで開かれますか。","sourceUrls":["https://www.pvsec.org/conference/future-conference.html","https://wcpec-9.com/en/overview"]},{"answer":"WCPECはEU PVSEC、IEEE PVSC、PVSECの3会議を4年周期でまとめて開く会議で、アジアの番はPVSECがホストになります。WCPECの年もPVSECの回番号が振られ、2026年はPVSEC-37です。","question":"PVSECとWCPECの関係は何ですか。","sourceUrls":["https://wcpec-9.com/en/history","https://www.pvsec.org/conference/future-conference.html"]},{"answer":"最大300語で、Abstractと任意のKeywordsから成り、図表を含む画像1枚（.jpg/.jpeg）を添えられます。","question":"WCPEC-9のabstractの書式は何ですか。","sourceUrls":["https://wcpec-9.com/en/call_of_abstracts"]},{"answer":"2026年9月21日から10月4日まで、ポスター発表限定で受け付けました。採択後は現地でのポスター発表が必須です。","question":"Late-News Abstractsはいつ受け付けましたか。","sourceUrls":["https://wcpec-9.com/en/notice?mode=view&no=40"]},{"answer":"WCPEC-9にabstractを出した著者は、各誌の手続きに従ってWiley各誌やIEEE Journal of PhotovoltaicsのWCPEC-9 Special Issueに投稿できます。Nano Convergenceは招待のみです。","question":"論文誌に投稿できますか。","sourceUrls":["https://wcpec-9.com/en/publications"]},{"answer":"1984年に創設され、同年に神戸でPVSEC-1が開かれました。","question":"PVSECはいつ始まりましたか。","sourceUrls":["https://www.pvsec.org/","https://www.pvsec.org/history/previous-conferences.html"]},{"answer":"PVSEC-38は2027年11月8〜12日に中国・合肥、PVSEC-39は2028年に横浜、PVSEC-40は2029年にニューデリーで予定されています。","question":"次回以降の開催地はどこですか。","sourceUrls":["https://www.pvsec.org/conference/future-conference.html"]}],"headline":"PVSEC-37は、IEEE PVSC・EU PVSECと合同のWCPEC-9として、2026年11月15〜20日に韓国・大田のDaejeon Convention Centerで開かれます。","metaDescription":"PVSEC（International Photovoltaic Science and Engineering Conference）は1984年創設のアジア太平洋地域の太陽光発電国際会議。PVSEC-37は2026年11月15〜20日に大田でWCPEC-9として開催。締切・技術分野・特集号・開催地履歴を公式ページで整理。","oneLine":"PVSEC（International Photovoltaic Science and Engineering 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2026","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/overview"},{"label":"2026 会期日数","value":"6日間（11月15日〜20日）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/overview"},{"label":"2026 早期登録締切","value":"2026-10-15","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/overview"},{"label":"次回 PVSEC-38","value":"2027-11-08〜12 / Binhu, Fumao Grand Hotel, Hefei, China","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/conference/future-conference.html"},{"label":"PVSEC-39 / PVSEC-40","value":"2028年 Yokohama, Japan / 2029年 New Delhi, India","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/conference/future-conference.html"}],"title":"現行サイクル（PVSEC-37 / WCPEC-9）","eyebrow":"cycle"},"scope":{"id":"scope","body":"PVSECは1984年の創設以来、光起電力効果の基礎物性、太陽電池材料とプロセス、モジュールと周辺機器、太陽光発電システム、普及策を対象にしてきました。WCPEC-9の技術プログラムは7つのAreaと24の主要トピック、約100のセッションで組まれます。タンデム、シリコン、ペロブスカイト、薄膜・新規太陽電池に加え、モジュール・システム、Solar-to-XやAIを含むフロンティア分野、エネルギー転換が並びます。","facts":[{"label":"シリーズの対象","value":"光起電力効果の基礎物性、太陽電池材料・プロセス、モジュール・周辺機器、太陽光発電システム、普及策","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/"},{"label":"2026 プログラムの規模","value":"7つの主要Area、24の主要トピック、約100セッション","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 Area 構成","value":"Tandem / Silicon / Perovskite / Thin-Film and Emerging / PV Module and System Engineering and Integrated/Applied PV / PV Expansion / PV in the Energy Transition","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 フロンティア分野","value":"Solar-to-X、AI・データ駆動のPV、宇宙・極限環境でのPV、circular pathways など","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 Area 1","value":"Tandem Solar Cells and Modules（Area Chair: Seung Yeop Myong, KETEP）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/technical_areas"}],"title":"対象分野・Technical Program Areas","eyebrow":"scope"},"review":{"id":"review","body":"WCPEC-9はabstractで選考し、2026年8月26日に採否を通知しました。Late-News Abstractsは通常投稿の締切延長ではなく、通常締切の時点で知られていなかった新しく重要な結果に限られます。採択されたLate-Newsの著者は会場でポスター発表することが条件で、オンライン発表はありません。","facts":[{"label":"Late-News の対象","value":"通常締切時点で未知または未確定だった新規かつ重要な結果","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/notice?mode=view&no=40"},{"label":"Late-News の位置付け","value":"通常abstract締切の延長ではない","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/notice?mode=view&no=40"},{"label":"Late-News 採択後の条件","value":"現地でのポスター発表が必須、オンライン発表なし","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/notice?mode=view&no=40"},{"label":"abstract の修正期限","value":"投稿締切まで","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/call_of_abstracts"}],"title":"選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年の回はPVSEC-37とWCPEC-9の2つの名前を持ち、公式情報はwcpec-9.comにあります。同じ年にGlobal Photovoltaic Conference 2026も併催されます。PVSEC-36は日程が変更され2025年11月9〜14日に開かれたため、古い告知と日付が合わないことがあります。論文誌のSpecial Issue締切は公式ページでTBDと表記されています。WCPEC-9サイトのLate-News受付は10月4日で終わっています。採択率は公表されていません。","facts":[{"label":"PVSEC-36 の日程変更","value":"2025年11月9〜14日に変更","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/"},{"label":"2026 Special Issue の締切","value":"各誌とも TBD","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/publications"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"PVSEC-1は1984年に神戸で開かれ、2024年のPVSEC-35は沼津、2025年のPVSEC-36はバンコクでした。WCPECは4年周期で米州・欧州・アジアの順に回り、1994年のハワイ（WCPEC-1）はPVSEC-8にあたります。2026年の大田は第9回です。2020年は済州と仮想会議、2021年は仮想会議でした。","facts":[{"label":"創設年","value":"1984年","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/"},{"label":"第1回","value":"1984年 PVSEC-1、Kobe, Japan（General chair: Yoshihiro Hamakawa）","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"WCPEC との対応（初回）","value":"1994年 PVSEC-8 = WCPEC-1（Hawaii, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"2020〜2021 の開催形式","value":"PVSEC-30は済州と仮想会議、PVSEC-31は仮想会議","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"2024 PVSEC-35","value":"Numazu (Mt. Fuji), Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"2025 PVSEC-36","value":"Bangkok, Thailand","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"WCPEC の開催周期と地域","value":"4年周期、米州・欧州・アジアの順（2022 Milan、2018 Hawaii、2014 Kyoto）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/history"}],"title":"沿革・開催地","eyebrow":"history"},"program":{"id":"program","body":"WCPEC-9では5件のplenary lectureが組まれ、講演者には大学と太陽電池メーカーの研究者が並びます。plenary、keynote、invitedの各セッションに150人を超える研究者・専門家の参加が見込まれています。口頭・ポスターに加え、tutorial、outreach、special sessionsも設けられます。","facts":[{"label":"2026 Plenary Speakers","value":"Nam-Gyu Park、Martin A. Green、Henry Snaith、Danielle Merfeld（Hanwha Qcells）、Xixiang Xu（LONGi）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/"},{"label":"2026 plenary の件数","value":"5件","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 招待系セッションの規模","value":"plenary・keynote・invitedに150人超の参加見込み","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 セッション種別","value":"keynote、invited、oral、poster、tutorial、outreach、special sessions","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/program_at_a_glance"},{"label":"2026 Keynote Speakers（日本の所属の例）","value":"Masafumi Yamaguchi（Toyota Technological Institute）、Tsutomu Miyasaka（Toin University of Yokohama）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"PVSECの公式サイトは、学生と若手研究者の積極的な参加を呼びかけています。過去の各回の技術プログラムはPrevious conferencesページからダウンロードできます。企業からは、WCPEC-9のplenaryにHanwha QcellsやLONGi、keynoteにHD Hyundai Energy SolutionやZhejiang Jinko Solarの所属者が並びます。","facts":[{"label":"学生・若手への呼びかけ","value":"学生と若手研究者の積極的な参加を期待","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"過去の技術プログラム","value":"各回の技術プログラムをダウンロード可能","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"2026 Keynote の企業所属の例","value":"HD Hyundai Energy Solution、Zhejiang Jinko Solar Co., Ltd","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational Photovoltaic Science and Engineering Conferenceで、略称はPVSECです。シリーズの公式サイトはPVSEC International Advisory Committeeの体制を掲げ、各回の運営は開催国の組織委員会が担います。2026年のPVSEC-37はWCPEC-9として開催され、主催者欄には韓国の気候エネルギー環境部、大田広域市、Korea Photovoltaic Societyが並びます。","facts":[{"label":"正式名称・略称","value":"International Photovoltaic Science and Engineering Conference（PVSEC）","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/"},{"label":"シリーズの位置付け","value":"米国のIEEE PVSC、欧州のEU-PVSECに対し、アジア太平洋地域で開く国際会議","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"各回の運営","value":"開催国の組織委員会が各回のサイトを運営","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"PVSEC IAC Chair","value":"Noritaka Usami（Nagoya University、2025年11月から）","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/committees.html"},{"label":"2026 WCPEC-9 の Host","value":"Ministry of Climate, Energy and Environment、Daejeon Metropolitan City、Korea Photovoltaic Society","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/"},{"label":"開催の回数（2023年まで）","value":"1984〜2023年に34回","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"WCPEC-9のGeneral ChairはSilla UniversityのChang Sik Son氏、General Co-ChairはUniversity of OttawaのKarin Hinzer氏とCommissariat à l'énergie atomiqueのDelfina Muñoz氏です。PVSEC-37のProgram ChairはDongguk UniversityのJae Joon Lee氏、TPC Co-ChairはNational Laboratory of the RockiesのMyles Steiner氏とForschungszentrum JülichのKaining Ding氏が務めます。WCPEC International Advisory CommitteeはEU-PVSEC-44、PVSEC-37、IEEE PVSC-55の3会議で構成され、PVSEC IAC ChairはNagoya UniversityのNoritaka Usami氏です。","facts":[{"label":"2026 General Chair","value":"Chang Sik Son（Silla University）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/committees"},{"label":"2026 General Co-Chair","value":"Karin Hinzer（University of Ottawa）、Delfina Muñoz（Commissariat à l'énergie atomique）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/committees"},{"label":"2026 TPC Co-Chair","value":"Myles Steiner（National Laboratory of the Rockies）、Kaining Ding（Forschungszentrum Jülich 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PVSC）と欧州（EU-PVSEC）の会議に加えて、アジア太平洋地域で開く","checkedAt":"2026-10-08","sourceUrl":"https://www.pvsec.org/history/previous-conferences.html"},{"label":"WCPEC-9 の構成","value":"EU-PVSEC、IEEE PVSC、PVSEC の3会議を集める","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/overview"},{"label":"WCPEC での地域分担","value":"EU PVSEC（Europe）、IEEE PVSC（Americas）、PVSEC（Asia）","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/history"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"WCPEC-9の投稿は本文300語以内のabstractに、図表を含む画像1枚を添えられます。通常のabstractは2026年1月22日に受付を開始し、7月20日に締め切り、8月26日に採否を通知しました。Late-News Abstractsは9月21日から10月4日まで、メールでWordとPDFの両形式を受け付け、発表はポスターに限られます。","facts":[{"label":"2026 abstract 受付開始","value":"2026-01-22","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/overview"},{"label":"2026 abstract 締切","value":"2026-07-20","checkedAt":"2026-10-08","sourceUrl":"https://wcpec-9.com/en/call_of_abstracts"},{"label":"2026 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held in Fort Worth, TX, USA.」と書かれています。会議レートの宿泊は1泊$218.18で、Venueページには「The conference rate is available for Friday - Wednesday, before 9/28/2026」と適用条件が付記されています。","question":"EPEPS 2026はいつ、どこで開催されますか。","sourceUrls":["https://www.epeps.org/","https://www.epeps.org/venue.html","https://www.epeps.org/papers.html"]},{"answer":"Call for PapersとPaper Submissionの両ページで、June 29, 2026 と July 13, 2026 が取消線で消され、July 22, 2026 が赤字で示されています。公式CFP PDFには延長前の「Paper submission: June 29, 2026」が残っているため、日付を引用する際はWebページ側を参照してください。採否通知はCFP PDFに「Acceptance: End of July, 2026」とあり、具体的な日付は示されていません。","question":"2026年の投稿締切はいつですか。","sourceUrls":["https://www.epeps.org/papers.html","https://www.epeps.org/submission.html","https://www.epeps.org/cfp.pdf"]},{"answer":"Technical Program Committee（名簿に30名）とPaper Review Committee（名簿に46名）が公式サイトに掲載されており、「Noncompliant manuscripts will not be considered for review.」と書式非適合原稿を査読対象外とする規定があります。一方で、投稿原稿の1ページ目に著者名・所属・住所・電話・emailを記載することが求められており、double-blindや匿名化を指示する記載は公式サイトにありません。","question":"査読はありますか。double-blindですか。","sourceUrls":["https://www.epeps.org/tpc.html","https://www.epeps.org/papers.html","https://www.epeps.org/submission.html"]},{"answer":"採択率も投稿件数も公式サイトには掲載されていません。Call for Papers、Paper Submission、Awardsのいずれのページにも数値の記載はありません。規模の目安として使えるのは、EasyChairに残る2025年公式プログラムの講演エントリ65件（チュートリアル6件、キーノート2件、招待講演1件、口頭技術発表40件、ポスター16件）です。これはプログラム上のエントリを数えた件数で、EPEPS側が合計を公表しているわけではありません。","question":"採択率は公開されていますか。","sourceUrls":["https://www.epeps.org/papers.html","https://easychair.org/smart-program/EPEPS2025/"]},{"answer":"EPEPS 2024のEasyChair公式プログラムは著者と座長の所属を国名付きで印刷しており、Samsung Electronics、KAIST、AMD、Intel Corporation、Texas Instruments、Hewlett Packard Enterprise、Meta Platforms Inc.、Cisco Systems, Inc、Alibaba Group、Politecnico di Torino、University of Toronto、Carleton University、Purdue University、University of Illinois at Urbana-Champaignなどが並びます。運営側もTPC・PRCにIntel、Keysight、Nvidia、Qualcomm、IBM、Cadence、Synopsys、Siemens、Google、Apple、Micronなどの企業所属者が入っており、産業側の関与が名簿から確認できます。","question":"どんな組織が発表していますか。","sourceUrls":["https://easychair.org/smart-program/EPEPS2024/","https://www.epeps.org/tpc.html"]},{"answer":"投稿した3ページPDFがそのまま予稿集に転載されます（「the submitted manuscript is reproduced, as is, in the conference proceedings」）。IEEE Xploreへの収録については、Attend Conferenceページに「Your poster must be presented at the conference for the paper to be included in IEEEXplore.」とあり、会場での発表が条件になります。加えて選抜論文にはIEEE Transactions on Components, Packaging and Manufacturing Technologyのspecial sectionへフルレングス投稿する招待があり、SI/PI分野の高評価論文はEMC Magazine SI/PI columnへの拡張に招かれる場合があると書かれています。予稿集のオープンアクセス条件や著作権譲渡の手続きは公式サイトに掲載されていません。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://www.epeps.org/submission.html","https://www.epeps.org/attend.html","https://www.epeps.org/papers.html"]},{"answer":"Registrationページの料金表（USD）では、Early Bird / Regularの順にEPS or MTT Member $650 / $780、IEEE Member $700 / $840、Non IEEE MembersのRegular Registration $880 / $1060、EPS or MTT Student Member $430 / $520、IEEE Student Member $460 / $550、Student Registration（非会員）$570 / $680、Life Member $250 / $250です。Tutorial Onlyの区分もあり、IEEE Members $200、Non-Members $300、IEEE Student and Life Members $100、Student Non-Members $150です。Early birdと著者登録の締切はいずれもSeptember 1, 2026です。","question":"参加費はいくらですか。","sourceUrls":["https://www.epeps.org/registration.html"]},{"answer":"EPEPS 2024のEasyChair公式プログラムには、National Institute of Advanced Industrial Science and Technology (AIST), Japan 所属の著者6名による「Single-Layer Wiring Design in UCIe to Realize Low-Cost Interposer Substrate」が掲載されています。同プログラムに印刷された所属国はSouth Korea、United States、Canada、China、Italy、Germany、Taiwan、Belgium、India、Japan、Turkey、Netherlands、Austria、Spain、Mexico、Singapore、Saudi Arabiaです。日本国内でのサテライト開催やオンライン参加の可否は公式サイトに掲載されていません。学生の渡航支援は米国外機関の学生で上限$2100と公表されています。","question":"日本からの参加や日本の組織の発表はありますか。","sourceUrls":["https://easychair.org/smart-program/EPEPS2024/","https://www.epeps.org/awards.html","https://www.epeps.org/"]}],"headline":"epeps.orgの各ページとEasyChair公式プログラムに実際に印刷されている記載だけを拾い、投稿規定・査読体制・掲載先・参加費までを一次情報で並べます。","metaDescription":"EPEPS（IEEE電子パッケージ・システム電気性能会議）の2026年会期、3ページPDF投稿規定、July 22, 2026の締切、TPC/PRC査読体制、IEEE Xplore収録条件、T-CPMT特集セクション招待を公式ページの記載だけで確認します。","oneLine":"EPEPSは、電子インターコネクト・パッケージ・システムの電気的モデリングと設計を扱うIEEE主催の会議で、2026年サイクルはOctober 18-21, 2026にFort Worth, TXで開催されます。","pageTitle":"EPEPSとは｜IEEE電子パッケージ電気性能会議の2026会期・投稿締切・査読・IEEE Xplore収録を公式確認","relatedConferenceIds":["edaps","ectc","3dic","eptc","itherm"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルはトップページに日付、Call for Papersに都市名、Venueページに具体的なホテル名と住所が分かれて掲載されています。会場ホテルには会議レートが設定され、適用期間の締切も明記されています。オンライン参加やハイブリッド開催に関する記載は公式サイトになく、現地前提の運用指示だけが公開されています。","facts":[{"note":"トップページの見出し「2026 EPEPS Conference / October 18-21, 2026」。","label":"2026 会期","value":"October 18-21, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"},{"note":"Call for Papersの「Location」欄。","label":"2026 開催都市・国","value":"EPEPS 2026 will be held in Fort Worth, TX, USA.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Venueページ本文と住所リンク。","label":"2026 会場","value":"Embassy Suites by Hilton Fort Worth Downtown（600 Commerce Street, Fort Worth, TX 76102）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"},{"note":"Venueページ冒頭の予約リンクと注記。","label":"2026 会議レート宿泊","value":"Book Hotel with Conference Rate ($218.18/night)（The conference rate is available for Friday - Wednesday, before 9/28/2026）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"},{"note":"EasyChair公式プログラムのDays表示。日曜がチュートリアル日。","label":"2025 会期","value":"Sunday, October 19th / Monday, October 20th / Tuesday, October 21st / Wednesday, October 22nd（2025年）","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"EasyChair公式プログラムのDays表示。","label":"2024 会期","value":"Sunday, October 6th / Monday, October 7th / Tuesday, October 8th / Wednesday, October 9th（2024年）","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2024/"},{"note":"Attend Conferenceページの発表者向け指示。オンライン登壇やライブ配信への言及はない。","label":"2026 現地開催前提の運用","value":"口頭発表は会場備え付けの単一MacBookをAV機器に接続して実施し、ポスターは48インチ×36インチのボードにpush pinで掲示する","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/attend.html"},{"note":"トップページ、Venue、Attend Conferenceのいずれにも参加形態の選択肢は書かれていない。","label":"2026 オンライン・hybrid の可否","value":"オンライン開催・ハイブリッド開催に関する記載は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"},{"note":"トップページとConference Programページのいずれにも次年度告知はない。","label":"2027 サイクル","value":"2027年サイクルの会期・開催地は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/program.html"}],"title":"2026年サイクルの会期・会場・開催形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"Call for Papersは技術領域を4つの見出しに分け、その下に個別項目を箇条書きしています。投稿の前提として未発表であることがCFP PDFに書かれており、既発表内容はここで外れます。実際のセッション名は2025年プログラムに並んでおり、CFPの4分類がどう具体化されたかを対照できます。","facts":[{"note":"Call for Papers本文の太字見出し4つ。","label":"2026 トラック（4分類）","value":"Interconnects design & technologies / Manufacturing and measurement / Packaging and integration / Modeling and simulation","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papersの該当箇条書き全項目。","label":"2026 Interconnects design & technologies の項目","value":"High-speed channels, backplanes, SerDes, memory, DDR interfaces / Interconnect and transceiver codesign, equalization / Signal & power integrity issues / Jitter, noise / High-frequency interconnects, packages, antennas-in-package / Novel/unconventional interconnect technologies","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papersの該当箇条書き全項目。","label":"2026 Packaging and integration の項目","value":"Advanced packaging, 3D integration / Heterogeneous integration / Design of interconnects and packages / Quantum systems: interconnection & packaging aspects","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papersの該当箇条書き全項目。","label":"2026 Modeling and simulation の項目","value":"Modeling, simulation, computer-aided design / Thermal, mechanical, multiphysics modeling / ML and AI-based approaches to interconnect and packaging problems","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papersの該当箇条書き全項目。4分類の中で項目数は2つで、箇条書きの数としては最少。","label":"2026 Manufacturing and measurement の項目","value":"Manufacturing, testing, reliability / Measurement techniques","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"公式CFP PDF冒頭の一文。未発表であることが投稿の前提として書かれている。","label":"2026 投稿の前提（明示された対象外）","value":"We welcome new and unpublished contributions on:","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/cfp.pdf"},{"note":"Call for Papersの「Simulation Benchmarking」欄。参照先はpackaging-benchmarks.org。","label":"2026 ベンチマーク投稿の呼びかけ","value":"EPEPS 2026 organizers invite paper submissions covering simulation tool development advances which utilize benchmarks established and released publicly by the IEEE TC-EDMS Packaging Benchmarks Committee","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"EasyChair公式プログラムのセッション見出し。CFPの4分類が実際のセッション名としてどう現れたかを示す。","label":"2025 技術セッション名","value":"Machine Learning 1 / Modeling and Simulation 1 / Signal and Power Integrity 1 / Signal and Power Integrity 2 / Heterogeneous Integration / Modeling and Simulation 2 / Machine Learning 2 / High Bandwidth Memory / Electromagnetics 1 / Electromagnetics 2 / Optics/Quantum / RF","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"査読はTechnical Program Committee（TPC）とPaper Review Committee（PRC）の2階層で運営され、Committeesページに全員の氏名と所属が掲載されています。書式非適合の原稿は査読対象外になるとCall for PapersとPaper Submissionの両ページに書かれており、3ページ・2段組という書式はそのまま査読に進むための条件になります。著者名と所属を1ページ目に記載させる規定があり、double-blindを指示する文言は公式サイトのどこにもありません。","facts":[{"note":"Call for PapersとPaper Submissionの両ページに同一文言。","label":"2026 査読前スクリーニング","value":"Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"EPEPS Committeesページの各見出し以下に印刷されている氏名を数えた件数。ページ自体が人数の数字を書いているわけではない。","label":"2026 査読を担う委員会","value":"Technical Program Committee (TPC) 30名 / Paper Review Committee (PRC) 46名","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"Paper Submissionページの原稿要件。","label":"2026 double-blind の有無","value":"double-blind・匿名化を指示する記載はなく、著者名・所属・住所・電話・emailを原稿1ページ目に記載することが求められている","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Awardsページ。「The TPC will select the above awards by judging the submission based on the following criterion」に続く6項目。","label":"2026 審査観点（受賞選考）","value":"Novelty / Advancement of the theory and application / Quality of the presented results / Quality of the written manuscript / Practicality and industrial relevance of the presented work / Quality of the oral/poster presentation","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/awards.html"},{"note":"AwardsページのEPEPS 2026 Best Benchmark Paper Award選考基準5項目。「The benchmark papers will be evaluated by the TPC based on the following criteria」とTPCが評価主体として書かれている。","label":"2026 ベンチマーク論文の審査観点","value":"公開ベンチマークを用いて提案手法の利点を示しているか / 既存手法に対する優位性があるか / 参照結果と提案手法の差を定量比較しているか / 差異の技術的根拠を示しているか / 手法が他問題へ一般化可能か","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/awards.html"},{"note":"AwardsページのIEEE EPS Student Travel Grant。査読期間中に独立委員会が並行選考することが書かれている。","label":"2026 査読プロセスと連動する選考","value":"The grantees will be selected by an independent committee during paper review process and the recipients will be notified around the same time as paper acceptance.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/awards.html"},{"note":"Call for Papers、Paper Submission、Awardsのいずれにも数値の記載はない。","label":"2026 採択率","value":"採択率・投稿件数は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"}],"title":"査読体制と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"epeps.orgは年ごとにテンプレートを更新する運用で、旧サイクルの文字列が残る箇所があります。回次番号と締切日付はページ間で食い違うため、投稿判断はCall for PapersとPaper Submissionの赤字表示を基準にしてください。公式サイトはEPEPS 2026 EasyChair programへのリンクを公開済みですが、今回保持したページ本文からはセッション、登壇者、時刻を確認できません。採択率・投稿件数・採択件数、2027年の会期・開催地、オンライン／hybrid参加、予稿集のアクセス条件、著作権手続き、IEEE PDF eXpressの要否、ビザ招へい状の申請方法も今回確認した資料では分かりません。","facts":[{"note":"本文は2026年サイクルの内容だが、ブラウザのタブに出る文字列は2024年表記。","label":"ページタイトルの年度ずれ","value":"epeps.org各ページのHTMLタイトルは「Conference on Electrical Performance of Electronic Packaging and Systems 2024」のまま","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"どちらも公式ソース。回次を引用する際は出典を明示する必要がある。","label":"回次番号の不一致","value":"Venueページは「The 25th Conference ...(EPEPS 2026)」、EasyChair公式プログラムは2025年を「34TH」と表記","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"},{"note":"PDFは延長前の日付のまま更新されていない。Web側では旧日付2件が取消線で残されている。","label":"締切日付の不一致","value":"Webページ（Call for Papers / Paper Submission）は July 22, 2026、公式CFP PDFは June 29, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/cfp.pdf"},{"note":"同じ2名（Xu Chen、Rajen Murugan）に対する肩書き表記がページごとに異なる。","label":"役職名の表記ゆれ","value":"公式CFP PDFは「General chair」「Co-chair」、CommitteesページとCall for Papersは「Conference Co-chairs」、Contact Usページは「Conference General Co-Chair」","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/contact.html"},{"note":"公式サイト上のリンク公開を確認。リンク先内容は今回の保持資料に含まれない。","label":"2026 プログラム関連","value":"EasyChair EPEPS2026 smart programへの公式リンクは公開済み。セッション・登壇者・時刻は今回の保持資料では未確認。","checkedAt":"2026-10-14","sourceUrl":"https://www.epeps.org/"},{"note":"Registrationページに載っているのは料金表、キャンセル規定、差し替え規定まで。","label":"ビザ招へい状の案内","value":"ビザ招へい状（invitation letter）の申請方法はRegistrationページに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Venueページには会場周辺の観光地・交通手段・レストランの案内が長文で掲載されている。","label":"本ページで扱わない範囲","value":"Venueページに掲載されているFort Worth周辺の観光・交通・飲食案内、および過去受賞者の個人名詳細は本ページの対象外","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"}],"title":"未公開項目と年度が混ざりやすい箇所","eyebrow":"caveats"},"history":{"id":"history","body":"EasyChairに残る公式プログラムのヘッダに回次番号が入っており、2024年が33rd、2025年が34thと連続しています。一方で初回開催年、開催地の一覧、名称変更の履歴はepeps.orgのどのページにも掲載されていません。Program Archiveページに残っているのは2010年から2013年の受賞者名だけです。","facts":[{"note":"EPEPS2024とEPEPS2025のsmart-programヘッダ。","label":"回次の連続（2024・2025）","value":"2024年 = 33RD、2025年 = 34TH（いずれもEasyChair公式プログラムのヘッダ表記）","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2024/"},{"note":"Venueページ本文。EasyChairの2025年=34thとは連続しない番号がそのまま残っている。公式表記どうしが食い違っている箇所。","label":"2026 公式サイト上の回次表記","value":"The 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2026) will take place at the Embassy Suites by Hilton Fort Worth Downtown","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"},{"note":"Program Archiveページ、トップページ、Call for Papersのいずれにも創設年の記載はない。","label":"初回開催年","value":"初回開催年は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/archive.html"},{"note":"各年について Best Paper Award / Best Student Paper Award / Best Poster Award の受賞者名と所属が並ぶ。2010年にはService Appreciation（Dale Becker, IBM）も併記。","label":"Program Archive の収録範囲","value":"「Program Archive」の見出し以下に掲載されているのは2013年・2012年・2011年・2010年のAward winnersのみ","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/archive.html"},{"note":"Venueページは2026年会場のみを扱い、Program Archiveページにも都市名の一覧はない。","label":"開催地ローテーション","value":"過去開催地の一覧は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/venue.html"},{"note":"トップページとProgram Archiveページのいずれにも旧名称への言及はない。","label":"名称変更の履歴","value":"会議名の変更履歴は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"},{"note":"EasyChair公式プログラム。次サイクルの告知が会期中のセッションとして組まれている。","label":"次回開催の場内告知","value":"Session 22: EPEPS 2026 Announcement（2025年10月21日、Chair: Xu Chen）","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"}],"title":"回次の連続性と公開されている過去情報","eyebrow":"history"},"program":{"id":"program","body":"公式EPEPS 2026ページはEasyChairのEPEPS2026 smart programへのリンクを公開しています。今回保持した公式ページのテキストにはリンク名とURLまでしか含まれないため、セッション、登壇者、時刻はここで追加推定しません。2025年の全31セッションは前サイクルの記録として残します。発表時間とポスターボード寸法は2026年のAttend Conferenceページに掲載されています。","facts":[{"note":"公式epeps.orgのナビゲーションにEPEPS2026 EasyChair smart programへのリンクが掲載された。保持資料ではリンク先の内容までは確認していない。","label":"2026 プログラム公開状況","value":"公式サイトがEPEPS 2026 Program（EasyChair smart program）へのリンクを公開","checkedAt":"2026-10-14","sourceUrl":"https://www.epeps.org/"},{"note":"同ページの表示内容。","label":"2026 キーノート・チュートリアル登壇者","value":"Keynotes, Invited & Tutorial Presentationsページには見出し「EPEPS KEYNOTES, INVITED AND TUTORIAL PRESENTATIONS」だけが表示され、2026年の登壇者は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tutorials.html"},{"note":"EasyChair公式プログラムのセッション番号。Welcome Remarks、TPC Meeting、EPEPS 2026 Announcementなどの運営セッションを含む。","label":"2025 セッション総数","value":"Session 1 から Session 31 まで","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"EasyChair公式プログラム初日のセッション2〜7。","label":"2025 チュートリアル","value":"日曜（10月19日）にTutorial 1〜Tutorial 6の6本。Inna Partin-Vaisband / Masum Hossain / Vladimir Okhmatovski / Rohit Sharma / Patrick Zabinski / Soumitra Joy","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"EasyChair公式プログラムのSession 9、16、26。","label":"2025 キーノート・招待講演","value":"Keynote 1: Jihong Ren「Augmented Reality Applications and Power Electronics Challenges」/ Keynote 2: Olena Zhu「Empowering Engineers, Enabling Innovation: The AI Journey」/ Invited Talk: Samuel Palermo「Transceiver Architectures for Future System Interconnect Demands」","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"EasyChair公式プログラムのセッション見出し。","label":"2025 特別セッション","value":"Session 23: Panel on Co-Design for Heterogeneous Integration（Chair: Jose Schutt-Aine）/ Session 21: IEEE TC on EDMS / Session 19: Keysight Parallel Session: Simulation and Measurement for Power Rail Crosstalk and Ground Bounce","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"EasyChair公式プログラムの各セッション内エントリを数えた件数で、ページ自体が合計を書いているわけではない。口頭技術発表はMachine Learning 1/2、Modeling and Simulation 1/2、Signal and Power Integrity 1/2、Heterogeneous Integration、High Bandwidth Memory、Electromagnetics 1/2、Optics/Quantum、RFの12セッション合計。","label":"2025 講演件数の内訳","value":"プログラム上の講演エントリは65件。内訳はチュートリアル6件、キーノート2件、招待講演1件、口頭技術発表40件、Poster Session 16件","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"Attend Conferenceページ。スライドは30ページを超えないよう推奨されている。","label":"2026 口頭発表の持ち時間","value":"Each oral presentation is scheduled for 17 minutes with 3 minutes additional for Q&A.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/attend.html"},{"note":"Attend Conferenceページ。「EPEPS does not provide a poster template.」とテンプレート非配布も明記されている。","label":"2026 ポスターの規格","value":"4 feet (48 inches) wide and 3 feet (36 inches) tall のボードにpush pinで掲示。ポスターセッションは月曜","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/attend.html"},{"note":"Registrationページ。全登録区分に含まれるものとして列挙されている。","label":"2026 登録に含まれる併設イベント","value":"Coffee Breaks and Social Events / Sunday Tutorials / Keynote Speech / Exhibitions / Poster Session and Industry Reception","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"}],"title":"プログラム構成（2026年の公開状況と2025年の実績）","eyebrow":"program"},"audience":{"id":"audience","body":"学生第一著者にはBest Student Paper Awardと渡航支援が用意され、金額上限まで公開されています。投稿は3ページ・2段組で締切がJuly 22, 2026、著者登録がSeptember 1, 2026と公表されているため、この2つの日付から学生テーマの逆算ができます。企業側はスポンサーパッケージPDFと出展窓口が明示されているほか、登録費のティアがIEEE会員種別まで細かく分かれています。","facts":[{"note":"AwardsページのIEEE EPS Student Travel Grant。少なくとも2名に付与され、うち1件はIEEE TC-EDMS Packaging Benchmarksを用いた学生論文向けに確保される。","label":"2026 学生渡航支援の金額","value":"Costs that are directly tied to EPEPS attendance are reimbursable up to the limits of $1300 for students at US institutions and $2100 for students at non-US institutions.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/awards.html"},{"note":"Awardsページ。現地発表が条件として明記されている。","label":"2026 渡航支援の受給条件","value":"the student needs to be the first author of the paper, and needs to present the work in-person at EPEPS 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/awards.html"},{"note":"Registrationページの料金表。単位はUSD。","label":"2026 学生登録費","value":"EPS or MTT Student Member $430（Early Bird）/ $520（Regular）、IEEE Student Member $460 / $550、Student Registration（Non IEEE Members）$570 / $680","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Registrationページの料金表。左がEarly Bird、右がRegular Registration。同じ表にGuest Badge - Social Event $100 / $150も並ぶ。","label":"2026 一般登録費","value":"EPS or MTT Member $650 / $780、IEEE Member $700 / $840、Life Member $250 / $250、Regular Registration（Non IEEE Members）$880 / $1060","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Registrationページの料金表。本会議に出ずチュートリアルだけ受講する区分がある。","label":"2026 チュートリアルのみの参加費","value":"Tutorial Only: IEEE Members $200、Non-Members $300、IEEE Student and Life Members $100、Student Non-Members $150（Early Bird・Regularとも同額）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Registrationページの赤字表示とCancellation Policy。","label":"2026 早期登録締切とキャンセル規定","value":"The early registration Deadline is September 1, 2026。返金請求はOctober 1, 2026までに書面で受領されたものに限り、50%の事務手数料が控除される。October 1, 2026以降は返金なし","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"RegistrationページのSubstitution Policy。","label":"2026 登録者の差し替え","value":"October 17, 2026までにepepsreg@ieee.org宛に書面で申請すれば別の参加者へ差し替え可能。10%の事務手数料が控除される","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Call for Papersの「Tutorials」欄。実務側が受講対象を判断する材料になる。","label":"2026 チュートリアルの想定テーマ","value":"CAD software tool techniques for package/PCB design, SI and PI modeling, high-speed SerDes simulation, high precision measurement techniques and novel interconnect design","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"}],"title":"研究室・学生と企業側の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"略称EPEPSの正式名称はEasyChair公式プログラムのヘッダに大文字で印刷されており、年次の回次番号もそこに入ります。主催はIEEEの3つのソサイエティによる共同スポンサーで、epeps.orgのトップページ本文に3学会名が並記されています。運営の窓口はConference Co-chairs 2名とUniversity of Illinois側の管理アドレスに集約されています。","facts":[{"note":"EasyChair公式プログラムのヘッダ表記をそのまま引用。","label":"2025 正式名称・回次","value":"EPEPS 2025: 34TH IEEE CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"同一形式のEasyChair公式プログラムヘッダ。2024年が33rd、2025年が34thと連続する。","label":"2024 正式名称・回次","value":"EPEPS 2024: 33RD IEEE CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2024/"},{"note":"epeps.orgトップページ本文の英文をそのまま引用。","label":"主催（共同スポンサー）","value":"EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"},{"note":"各ページ左サイドバー下部のSociety Sponsors欄。リンク先はeps.ieee.org、mtt.org、ieeeaps.org。","label":"Society Sponsors 掲載","value":"IEEE Electronics Packaging Society / The IEEE Microwave Theory and Technology Society / The IEEE Antennas and Propagation Society の3ロゴが「Society Sponsors」欄に掲出","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"epeps.orgトップページ本文の自己紹介文。評価語を含むが公式サイト自身の文言としてそのまま引用。","label":"公式の自己記述","value":"EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"},{"note":"EPEPS Committeesページ冒頭の「Conference Co-chairs」欄。","label":"2026 Conference Co-chairs","value":"Xu Chen, University of Illinois Urbana-Champaign / Rajen Murugan, Texas Instruments","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"Call for Papers本文。4日間開催であることが文中に書かれている。綴りは同ページの表記どおり「highspeed」。","label":"2026 会期日数","value":"Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for SI, PI, and performance optimization in highspeed, RF, wireless and quantum systems.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Contact Usページ。運営全般の問い合わせ先として掲載。","label":"事務局連絡先","value":"Attn: EPEPS Administration / epeps-admin@emlab.illinois.edu","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/contact.html"}],"title":"会議の正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Committeesページには4つの委員会区分が並び、氏名の横に所属が印刷されています。TPCとPRCの双方に半導体・EDA・計測・システムの企業名と大学名が混在し、PRC 46名のうち35名は企業所属として印刷されています。スポンサー欄はティア別に企業ロゴが掲出されていますが、これは出展・支援の事実を示すもので、取引関係や共同研究を示すものではありません。","facts":[{"note":"EPEPS Committeesページの各見出し以下に印刷されている氏名を数えた件数。ページ自体が人数の数字を書いているわけではない。","label":"2026 委員会の区分と人数","value":"Conference Co-chairs 2名 / Technical Program Committee (TPC) 30名 / Paper Review Committee (PRC) 46名 / Emeritus Advisory Board 4名","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"EPEPS CommitteesページのTPC名簿に印刷されている企業名。","label":"2026 TPCの企業所属","value":"Intel / Keysight / Meta Platforms / Siemens / Hewlett-Packard Enterprise / Metawave / Nvidia / Texas Instruments / AMD / Qualcomm / IBM","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"EPEPS CommitteesページのTPC名簿に印刷されている大学・研究機関名。MSTはAlbert Ruehliの所属欄「Emeritus IBM; MST」に印刷されている表記。","label":"2026 TPCの大学・研究機関所属","value":"Carleton University / University of Illinois, Urbana / Indian Institute of Science / Politecnico di Torino / McGill University / KAIST / University of Manitoba / University of Illinois, Chicago / IIT Roorkee / IIT Ropar / IIT Jodhpur / University of Toronto / Ghent University / Oregon State University / National Taiwan University / University of Texas, Austin / MST","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"EPEPS CommitteesページのPRC名簿に印刷されている企業名。46名の所属欄を数えると企業所属が35名、大学・研究機関所属が11名。","label":"2026 PRCの企業所属","value":"Micron / IBM / Siemens / Marvell Technology / Qualcomm / Intel / Palo Alto Networks / AMD / Cadence / Google / Cisco / NXP / Dell / Nvidia / Samsung / Synopsys / Apple / Huawei","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"EPEPS Committeesページ末尾。","label":"2026 Emeritus Advisory Board","value":"Dale Becker, Emeritus IBM / Henning Braunisch, Intel / Paul Franzon, North Carolina State University / Jose Schutt-Aine, University of Illinois, Urbana","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/tpc.html"},{"note":"EPEPS 2024のEasyChair公式プログラムは著者名と座長名の横に「(所属, 国名)」を印刷しており、そこに現れる国名。人物の国籍ではなく所属先の所在国表記。","label":"2024 プログラムに印刷された所属国","value":"South Korea / United States / Canada / China / Italy / Germany / Taiwan / Belgium / India / Japan / Turkey / Netherlands / Austria / Spain / Mexico / Singapore / Saudi Arabia","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2024/"},{"note":"Sponsorships/Exhibitsページに現在掲出されている企業。見出しはGold・Silver・Exhibitorsの3区分のみ（Platinum欄はHTMLコメント内で非表示）。出展・支援の事実を示すもので、顧客関係や共同研究を示すものではない。","label":"2026 掲載スポンサー（ティア別）","value":"Gold Sponsors/Exhibitors: Amphenol / Silver Sponsors/Exhibitors: Intel, GEA（本文の紹介文ではGlobal Electronics Association）, Xpeedic, Nvidia / Exhibitors: Texas Instruments","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/exhibits.html"},{"note":"Sponsorships/Exhibitsページ。Sponsorship Packagesは2026_sponsorship_packages.pdfへのリンク。","label":"2026 スポンサー窓口","value":"For information on how to become a sponsor please check the Sponsorship Packages or contact epeps2026@easychair.org and Xu Chen (xuchen1@illinois.edu).","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/exhibits.html"},{"note":"EasyChair公式プログラム。スポンサー枠が技術プログラム内に時間枠を持っている。","label":"2025 スポンサー枠のプログラム掲載","value":"Session 20: Sponsor Presentation - Keysight / Session 29: Sponsor Presentation - Amphenol","checkedAt":"2026-08-05","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"}],"title":"委員会構成・産学の別・掲載スポンサー","eyebrow":"community"},"comparison":{"id":"comparison","body":"EPEPSが自ら宣言している範囲は「電子インターコネクト・パッケージ・システムの電気的モデリング、解析、設計」で、熱・機械はmultiphysics modelingとして解析対象に入る一方、製造プロセスや信頼性試験そのものはManufacturing and measurementの2項目に絞られています。3ページ・2段組という上限と、投稿原稿がそのまま予稿集になる運用は、フルペーパー型の会議とは投稿負荷が異なります。ここに挙げるのはEPEPS公式ページに書かれている属性のみで、他会議の運営内容については本ページでは扱いません。","facts":[{"note":"Call for Papers冒頭。electricalに軸足を置いた範囲宣言。","label":"2026 自己宣言する守備範囲","value":"advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"熱・機械はモデリング側の項目として位置づけられており、独立トラックにはなっていない。","label":"2026 熱・機械の扱い","value":"Thermal, mechanical, multiphysics modeling（Modeling and simulation トラック内の1項目）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papersの箇条書き。4トラックの箇条書き項目数は6・2・4・3で、このトラックが2項目。","label":"2026 製造・信頼性の扱い","value":"Manufacturing and measurement トラックは「Manufacturing, testing, reliability」「Measurement techniques」の2項目のみ","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Paper Submissionページ。フルペーパー投稿を求める形式とは分量が異なる。","label":"2026 投稿負荷の水準","value":"3ページ・2段組PDF、35 word abstract、3 keywords。投稿原稿がそのまま予稿集に転載される","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"トップページ本文。実装系とマイクロ波・アンテナ系の3学会が同時に関与する体制。","label":"2026 スポンサーソサイエティの組み合わせ","value":"IEEE Electronics Packaging Society / IEEE Microwave Theory and Techniques Society / IEEE Antenna and Propagation Society の3学会共同","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/"}],"title":"EPEPS側の公表内容から引ける境界","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は3ページ・2段組のPDF一本で、初稿の時点でcamera readyであることが要求されます。締切はCall for PapersとPaper Submissionの両ページで2回延長され、旧日付は取消線で残されたまま最終日付が赤字で示されています。CFP PDFに載っている日付は延長前のものなので、投稿計画はWeb側の日付で組む必要があります。","facts":[{"note":"Call for PapersとPaper Submissionの両ページに同じ3日付が同じ体裁で並ぶ。有効な日付はJuly 22, 2026。","label":"2026 投稿締切（Web最終表示）","value":"Submission Deadline: June 29, 2026（取消線） July 13, 2026（取消線） July 22, 2026（赤字）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for Papers本文。ページ数は赤字で強調されている。","label":"2026 投稿書式","value":"Submission Format: 2 column, 3 page, PDF format only.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Paper Submissionページの「Please note that, submitted papers should conform to the following」以下。","label":"2026 原稿要件の詳細","value":"PDF形式・THREE PAGES以内・double-column、図表は白黒、全フォントと図表を埋め込み、英語で執筆、35 word abstractとtopic listから選ぶ3つのkeywordsを付す","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Paper Submissionページ。著者名と所属を伏せる指示はない。","label":"2026 1ページ目の記載事項","value":"The title of the paper, names and affiliations of all authors, including complete mailing addresses, telephone, fax numbers and email addresses must appear on the first page of the paper","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Paper Submissionページの投稿リンク。","label":"2026 投稿システム","value":"EasyChair（TO SUBMIT CLICK HERE のリンク先は https://easychair.org/my/conference?conf=epeps2026 ）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Paper Submissionページ。EPEPS独自テンプレートの配布はない。","label":"2026 テンプレート","value":"For IEEE templates, click here / in Latex, in .doc（いずれもieee.orgのconference templatesページへのリンク）","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"公式CFP PDFの「Important dates」欄。具体的な日付は示されていない。","label":"2026 採否通知","value":"Acceptance: End of July, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/cfp.pdf"},{"note":"公式CFP PDFの「Important dates」欄。投稿締切はWebページ側で2回延長されており、PDFは延長前の日付のまま。","label":"2026 CFP PDF側の締切日付","value":"Paper submission: June 29, 2026 / Sponsor registration: September 1, 2026 / Early bird registration: September 1, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/cfp.pdf"},{"note":"Paper Submissionページ。投稿原稿がそのまま予稿集に載るため、採択後の別途camera-ready締切は掲載されていない。","label":"2026 camera-ready の扱い","value":"Submitted manuscripts should be camera ready ... Please note that, if the paper is accepted, the submitted manuscript is reproduced, as is, in the conference proceedings.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Registrationページ冒頭の赤字表示。Early bird締切と同日。","label":"2026 著者登録締切","value":"Authors registration deadline is September 1, 2026","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/registration.html"},{"note":"Paper Submissionページの「Student Papers」節。文面のひな形もページに掲載されている。","label":"2026 Best Student Paper 応募の追加要件","value":"指導教員が署名した在籍証明文（学生が指導下でフルタイム在籍中であること、当該研究の主要貢献者であること、採択時に本人が発表すること）を別PDFとして添付する","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"投稿した3ページのPDFがそのまま予稿集に転載されるため、投稿時点の完成度がそのまま公開版になります。IEEE Xploreへの収録は会場での発表を条件とすることがAttend Conferenceページに明記されています。選抜論文にはIEEE Transactions on Components, Packaging and Manufacturing Technologyへのフルレングス投稿招待があり、SI/PI分野の論文はEMC Magazineのコラムに広げる道も示されています。","facts":[{"note":"Paper Submissionページ。投稿PDFがそのまま予稿集になる。","label":"2026 予稿集への掲載形態","value":"if the paper is accepted, the submitted manuscript is reproduced, as is, in the conference proceedings","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Attend Conferenceページのポスター発表者向け指示。会場発表がXplore収録の条件として書かれている。","label":"2026 IEEE Xplore収録の条件","value":"Your poster must be presented at the conference for the paper to be included in IEEEXplore.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/attend.html"},{"note":"Call for PapersとPaper Submissionの両ページに同一文言。","label":"2026 特集セクション招待","value":"select papers from this year's EPEPS will be invited to submit a full-length special section paper to IEEE Transactions on Components, Packaging and Manufacturing Technology","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Call for PapersとPaper Submissionの両ページに同一文言。","label":"2026 マガジンへの拡張招待","value":"High-quality papers on SI/PI topics may also be invited for a possible extension in the EMC Magazine SI/PI column.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"},{"note":"Call for Papersの「IEEE Education Credits」欄。","label":"2026 IEEE教育単位","value":"IEEE offers professional development hours (PDHs) and continuing education units (CEUs) for attending the EPEPS program.","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Paper Submissionページに記載があるのはPDF書式とEasyChairへの投稿手順までで、出版手続きの詳細はない。","label":"2026 予稿集の公開範囲","value":"予稿集のオープンアクセス条件、著作権譲渡の手続き、IEEE PDF eXpressの利用要否は公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.epeps.org/submission.html"}],"title":"予稿集・IEEE Xplore収録・特集号招待","eyebrow":"publication"}},"sources":[{"url":"https://www.epeps.org/","role":"official","label":"EPEPS 2026 公式トップページ","checkedAt":"2026-08-05","evidenceLocator":"中央本文の見出し「2026 EPEPS Conference / October 18-21, 2026」と、その下の3学会共同スポンサー文。"},{"url":"https://www.epeps.org/papers.html","role":"cfp","label":"EPEPS 2026 Call for Papers","checkedAt":"2026-08-05","evidenceLocator":"本文の4トラック箇条書き、Submission Deadline行（取消線2件＋赤字1件）、Submission Format行、Location・Tutorials・IEEE Education Credits・Simulation Benchmarking各欄、Conference Co-chairs欄。左サイドバーにSociety Sponsors。HTMLのtitle要素は2024年表記のまま。"},{"url":"https://www.epeps.org/cfp.pdf","role":"cfp","label":"EPEPS 2026 Call for Papers（PDF版）","checkedAt":"2026-08-05","evidenceLocator":"右段の「Important dates」欄（Paper submission / Acceptance / Sponsor registration / Early bird registration）と「Awards & grants」欄、左段冒頭の「We welcome new and unpublished contributions on:」、末尾のGeneral chair / Co-chair表記。"},{"url":"https://www.epeps.org/submission.html","role":"cfp","label":"EPEPS 2026 Paper Submission","checkedAt":"2026-08-05","evidenceLocator":"冒頭の原稿要件段落、TO SUBMIT CLICK HEREのEasyChairリンク、IEEEテンプレートリンク、Submission Deadline行、「Student Papers」節の5条件と指導教員署名文ひな形。オープンアクセス・著作権譲渡・IEEE PDF eXpressへの言及はない。"},{"url":"https://www.epeps.org/venue.html","role":"venue","label":"EPEPS 2026 Venue","checkedAt":"2026-08-05","evidenceLocator":"冒頭の会議レート予約リンク（$218.18/night）と、その直後の「The 25th Conference ... (EPEPS 2026) will take place at the Embassy Suites by Hilton Fort Worth Downtown」および住所行。以降はFort Worth周辺の観光・交通・飲食案内。"},{"url":"https://www.epeps.org/","role":"program","label":"EPEPS 2026公式ページ（current program link）","checkedAt":"2026-10-14","evidenceLocator":"navigation link text “EPEPS 2026 Program” pointing to EasyChair EPEPS2026 smart program"},{"url":"https://www.epeps.org/tutorials.html","role":"program","label":"EPEPS 2026 Keynotes, Invited & Tutorial Presentations","checkedAt":"2026-08-05","evidenceLocator":"本文は見出し「EPEPS KEYNOTES, INVITED AND TUTORIAL PRESENTATIONS」のみで、登壇者一覧は表示されていない。"},{"url":"https://www.epeps.org/attend.html","role":"program","label":"EPEPS 2026 Attend Conference","checkedAt":"2026-08-05","evidenceLocator":"「Oral Presentation Instructions」の持ち時間（17分＋3分）と単一Macbook運用、「Poster Presentation Instructions」のボード寸法・push pin・月曜開催・テンプレート非配布およびIEEE Xplore収録条件の一文。"},{"url":"https://www.epeps.org/registration.html","role":"registration","label":"EPEPS 2026 Registration","checkedAt":"2026-08-05","evidenceLocator":"赤字のearly registration / authors registration締切、登録に含まれる項目の箇条書き、Conference Registration Categories料金表、Cancellation Policy、Substitution Policy。ビザ招へい状の案内はない。"},{"url":"https://www.epeps.org/awards.html","role":"official","label":"EPEPS Awards","checkedAt":"2026-08-05","evidenceLocator":"「EPEPS Best Paper Awards」節の3賞と6つの選考基準、「EPEPS 2026 Best Benchmark Paper Award」節の5基準、「IEEE EPS Student Travel Grant」節の金額と条件。採択率や投稿件数の数値はない。"},{"url":"https://www.epeps.org/tpc.html","role":"committee","label":"EPEPS Committees","checkedAt":"2026-08-05","evidenceLocator":"「Conference Co-chairs」「Technical Program Committee (TPC)」「Paper Review Committee (PRC)」「Emeritus Advisory Board」の4見出しと、その下の氏名・所属リスト。人数の数字はページには印刷されていない。"},{"url":"https://www.epeps.org/exhibits.html","role":"sponsor","label":"EPEPS 2026 Sponsorships/Exhibits","checkedAt":"2026-08-05","evidenceLocator":"冒頭のSponsorship Packagesリンクと問い合わせ先、「Gold Sponsors/Exhibitors」「Silver Sponsors/Exhibitors」「Exhibitors」各見出し以下のロゴと紹介文。Platinum欄はHTMLコメント内にあり表示されない。"},{"url":"https://www.epeps.org/contact.html","role":"official","label":"EPEPS Contact Us","checkedAt":"2026-08-05","evidenceLocator":"「Meeting Administration」節のConference General Co-Chair 2名と、「Attn: EPEPS Administration」のメールアドレス。"},{"url":"https://www.epeps.org/archive.html","role":"history","label":"EPEPS Program Archive","checkedAt":"2026-08-05","evidenceLocator":"見出し「Program Archive」以下に2013年・2012年・2011年・2010年のAward winnersのみが並ぶ。創設年や過去開催地の一覧はない。"},{"url":"https://easychair.org/smart-program/EPEPS2025/","role":"program","label":"EPEPS 2025 公式プログラム（EasyChair Smart Program）","checkedAt":"2026-08-05","evidenceLocator":"ページ上部のヘッダ「EPEPS 2025: 34TH IEEE CONFERENCE ...」、Days行の4日程、Session 1〜31の見出しと各セッション内の講演一覧。"},{"url":"https://easychair.org/smart-program/EPEPS2025/talk_author_index.html","role":"program","label":"EPEPS 2025 Talk Author Index","checkedAt":"2026-08-05","evidenceLocator":"著者名のアルファベット索引と各著者の発表題目。所属は印刷されていない。"},{"url":"https://easychair.org/smart-program/EPEPS2024/","role":"program","label":"EPEPS 2024 公式プログラム（EasyChair Smart Program）","checkedAt":"2026-08-05","evidenceLocator":"ヘッダ「EPEPS 2024: 33RD IEEE CONFERENCE ...」、Days行の4日程、各講演者名の直後に括弧書きで印刷された「(所属, 国名)」。"},{"url":"https://eps.ieee.org/conferences/eps-conference-sponsorship-relationships/","role":"society","label":"IEEE EPS / Conference Sponsorship Relationships","checkedAt":"2026-08-05","evidenceLocator":"Sole Sponsorship / Co-Sponsorship / Technical Co-Sponsor の定義文。EPEPS個別の行は本ページには掲載されていない。"}],"summary":"EPEPS（IEEE Conference on Electrical Performance of Electronic Packaging and Systems）は、IEEE Electronics Packaging Society・IEEE Microwave Theory and Techniques Society・IEEE Antenna and Propagation Societyが共同スポンサーとなる会議です。このページでは、2026年サイクルの会期・会場・投稿締切・投稿書式・登録費、TPCとPRCの構成、IEEE Xplore収録の条件、IEEE Transactions on Components, Packaging and Manufacturing Technologyへの特集セクション招待といった、公式サイトとEasyChair公式プログラムに直接書かれている項目を確認できます。2025年サイクルのセッション構成と講演件数、2024年サイクルのプログラムに印刷された所属国も併せて扱います。採択率、2026年のキーノート・チュートリアル登壇者、2027年サイクル、初回開催年は公式ソースに掲載がないため、このページでは数値を置きません。会場周辺の観光・飲食案内などpublic向けの付随情報は扱いません。","topics":[{"note":"Call for Papersの「Signal & power integrity issues」および2025年のSignal and Power Integrity 1/2セッション。","label":"Signal integrity / Power integrity","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Interconnects design & technologiesトラックの筆頭項目。2025年プログラムにはPCIe Gen 7.0や448 Gbps signalingの発表が並ぶ。","label":"High-speed channels / SerDes / DDR interfaces","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"Packaging and integrationトラックの項目。2025年にはHeterogeneous Integrationセッションと、Co-Design for Heterogeneous Integrationのパネルが設定され、講演題目にもChiplet Channel、Chiplet Interfacesが現れる。","label":"Heterogeneous integration / chiplet","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"2025年プログラムのSession 25「High Bandwidth Memory」に4件の口頭発表。","label":"High Bandwidth Memory","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"Modeling and simulationトラックの「ML and AI-based approaches to interconnect and packaging problems」。2025年はMachine Learning 1/2の2セッション。","label":"ML / AI-based approaches","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"Packaging and integrationトラックの「Quantum systems: interconnection & packaging aspects」。2025年はOptics/Quantumセッションで扱われた。","label":"Quantum systems の実装・配線","sourceUrl":"https://www.epeps.org/papers.html"},{"note":"2025年プログラムに「Machine Learning Framework for System-Level Prediction of Co-Packaged Optics」など複数件が掲載。","label":"Co-packaged optics","sourceUrl":"https://easychair.org/smart-program/EPEPS2025/"},{"note":"2025年のElectromagnetics 1/2セッション、2024年のMacromodeling I/IIおよびComputational Electromagneticsセッション。","label":"Computational electromagnetics / macromodeling","sourceUrl":"https://easychair.org/smart-program/EPEPS2024/"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"A","publicReason":"IEEEのEPS、MTT、APの3ソサイエティが共同で開く、配線・パッケージ・システムの電気性能の会議。信号・電源・熱のインテグリティ、モデル化、高速伝送路、チップレット、HBMを対象とする。"},"publicReasons":[{"body":"会議サイト","sourceUrl":"https://www.epeps.org/"}],"sourceUrls":[{"url":"https://www.epeps.org/"},{"url":"https://easychair.org/smart-program/EPEPS2025/"},{"url":"https://www.epeps.org/tpc.html"},{"url":"https://www.epeps.org/exhibits.html"},{"url":"https://www.epeps.org/venue.html"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"ended","label":"会期終了","closedNote":"","imminent":false,"staleEnded":false,"steps":[{"id":"pre-cfp","label":"投稿受付前","state":"done"},{"id":"open","label":"投稿受付中","state":"done"},{"id":"review","label":"投稿終了","state":"done"},{"id":"notified","label":"採否通知","state":"done"},{"id":"program","label":"プログラム公開","state":"done"},{"id":"live","label":"開催中","state":"done"},{"id":"ended","label":"終了","state":"current"}],"currentStep":"ended","nextEvent":null,"lastPast":{"kind":"paper","label":"論文締切","date":"2026-07-22"},"milestones":[{"kind":"paper","label":"論文締切","date":"2026-07-22","state":"past"},{"kind":"session","label":"開催","date":"2026-10-18","endDate":"2026-10-21","state":"past"}],"action":{"kind":"next","text":"次回の日程は公式サイトで発表されます。","href":"https://www.epeps.org/","linkLabel":"公式サイト"}},"proceedingsUrl":null,"abstractDeadline":null,"digestDeadline":null,"lateNewsDeadline":null,"finalPaperDeadline":null,"acceptanceNotice":null,"submissionOpensOn":null,"programPublishedOn":null},{"id":"spie-photonics-west","code":"SPIE 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The official abstract guidelines list abstracts due 2026-07-22 and authors notified / program posting on 2026-10-12.","trackingPhase":"投稿受付中 / 公式CFP確認済み","deadlineEvents":[{"code":"SPIE Photonics West","date":"2026-07-22","kind":"abstract","name":"SPIE Photonics West","label":"要旨締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-53},{"code":"SPIE Photonics West","date":"2026-10-12","kind":"acceptance","name":"SPIE Photonics West","label":"採択通知","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":29},{"code":"SPIE Photonics West","date":"2027-01-13","kind":"final-paper","name":"SPIE Photonics West","label":"最終原稿締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":122}],"primaryDeadline":{"code":"SPIE Photonics West","date":"2026-07-22","kind":"abstract","name":"SPIE Photonics West","label":"要旨締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-53},"submissionFormat":"Official SPIE Photonics West abstract guidelines request author information, a 200-300 word abstract for technical review, a 50-150 word program summary, and manuscript / poster PDF uploads for SPIE Digital Library publication workflows.","trackingPhaseGroup":"submission-open","nextPrimaryDeadline":{"code":"SPIE Photonics West","date":"2027-01-13","kind":"final-paper","name":"SPIE Photonics West","label":"最終原稿締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":122},"primaryDeadlineEvents":[{"code":"SPIE Photonics West","date":"2026-07-22","kind":"abstract","name":"SPIE Photonics West","label":"要旨締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-53},{"code":"SPIE Photonics West","date":"2027-01-13","kind":"final-paper","name":"SPIE Photonics West","label":"最終原稿締切","cfpUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/presenters/abstract-submission-guidelines","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","officialUrl":"https://spie.org/conferences-and-exhibitions/photonics-west","conferenceId":"spie-photonics-west","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":122}],"researchVisualSignals":{"note":"Official SPIE Photonics West sources reviewed for committee, technical-conference program proxy, sponsor/exhibitor, and history signals. Program geography means affiliation organization country/region.","history":{"note":"Official SPIE society history lists Photonics West debuting in San Jose in 1995; official Photonics West home lists the 2027 San Francisco cycle.","ageYears":32,"sourceUrl":"https://spie.org/about-spie/the-society/history","approximate":false,"displayLabel":"SPIE history page says Photonics West debuted in 1995; 2027 cycle is January 30-February 4 in San Francisco","sourceStatus":"extractor_v0_source_checked","firstHeldYear":1995,"historyYearBasis":"official_spie_history_debut_year","comparisonMaxYears":80},"organizationMix":[{"note":"Counts combine conference chair, co-chair, and program-committee affiliation rows from official SPIE Photonics West 2027 conference detail pages.","label":"SPIE Photonics West 2027 committee organization mix","segments":[{"kind":"company","rows":145,"label":"Company","value":12.1},{"kind":"university","rows":721,"label":"University","value":59.9},{"kind":"research","rows":208,"label":"Research institute","value":17.3},{"kind":"unknown","rows":129,"label":"Unknown / other","value":10.7}],"sourceUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"1203 official chair and program-committee affiliation rows"},{"note":"Rows count one first-listed chair affiliation organization per official technical conference detail page. Accepted-presentation first-listed affiliation rows were not publicly fetchable in this runner.","label":"SPIE Photonics West 2027 technical conference first-listed chair affiliation organization mix","segments":[{"kind":"company","rows":7,"label":"Company","value":10.3},{"kind":"university","rows":45,"label":"University","value":66.2},{"kind":"research","rows":9,"label":"Research institute","value":13.2},{"kind":"unknown","rows":7,"label":"Unknown / other","value":10.3}],"sourceUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/program/browse-program","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"68 official technical-conference first-listed chair affiliation rows"},{"note":"This donut uses the same official Photonics West / BiOS / sponsor listing rows rendered beside the organization list.","label":"SPIE Photonics West 2027 sponsor / exhibitor organization mix","segments":[{"kind":"company","rows":706,"label":"Company","value":81},{"kind":"university","rows":4,"label":"University","value":0.5},{"kind":"research","rows":8,"label":"Research institute","value":0.9},{"kind":"professional-society","rows":10,"label":"Professional society / media","value":1.1},{"kind":"unknown","rows":144,"label":"Unknown / other","value":16.5}],"sourceUrl":"https://spie.org/conferences-and-exhibitions/photonics-west/exhibitions/photonics-west-exhibition/exhibitors","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"872 official sponsor/exhibitor organization rows"}],"companyBreakdowns":[{"note":"Company rows are counted at the same source-row grain as the committee organization mix.","rows":[{"rows":4,"company":"Coherent Corp."},{"rows":4,"company":"Texas Instruments Inc."},{"rows":3,"company":"nLIGHT, Inc."},{"rows":3,"company":"The Aerospace Corp."},{"rows":2,"company":"Advanced Micro Devices, Inc."},{"rows":2,"company":"ams-OSRAM International GmbH"},{"rows":2,"company":"Avo Photonics, Inc."},{"rows":2,"company":"DiPOLE Systems Ltd."},{"rows":2,"company":"EKB Technologies Ltd."},{"rows":2,"company":"Fibertek, Inc."},{"rows":2,"company":"Furukawa Electric Co., Ltd."},{"rows":2,"company":"i-CORE Technology, LLC"},{"rows":2,"company":"Immunophotonics, Inc."},{"rows":2,"company":"Intuitive Surgical, Inc."},{"rows":2,"company":"IQE Inc."},{"rows":2,"company":"Lumileds, LLC"},{"rows":2,"company":"Monarch Quantum"},{"rows":1,"company":"Aalyria Technologies, Inc."},{"rows":1,"company":"Acacia Communications, Inc."},{"rows":1,"company":"Adiuvo Diagnostics, Ltd."},{"rows":1,"company":"Aeon Corp."},{"rows":1,"company":"Aimloxy LLC"},{"rows":1,"company":"Air Water Inc."},{"rows":1,"company":"Amazon.com, Inc."},{"rows":1,"company":"Ansys, Inc."},{"rows":1,"company":"Apple Inc."},{"rows":1,"company":"Arkesso, LLC"},{"rows":1,"company":"Armor Medical Inc."},{"rows":1,"company":"art photonics GmbH"},{"rows":1,"company":"Becker & Hickl GmbH"},{"rows":1,"company":"Berxel Photonics Co., Ltd."},{"rows":1,"company":"Bos Photonics"},{"rows":1,"company":"Boston Scientific Corp."},{"rows":1,"company":"BRELYON, Inc."},{"rows":1,"company":"Brewer Science, Inc."},{"rows":1,"company":"BWT Beijing Ltd."},{"rows":1,"company":"Castor Optics, Inc."},{"rows":1,"company":"Chromis Fiberoptics Inc."},{"rows":1,"company":"Ciena Corp."},{"rows":1,"company":"Coherent LaserSystems GmbH & Co. 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Xploreに載りますか？","sourceUrls":["https://www.isocc.org/2026/pages_introduce/overview.vm","https://www.isocc.org/2026/pages_submission/submission_camera_ready.vm"]},{"answer":"テンプレートに沿った2段組・2ページのfull paperをMicrosoft CMTから出します。2ページを超える原稿は受け付けられません。","question":"投稿の形式とページ数は？","sourceUrls":["https://www.isocc.org/2026/pages_submission/submission_full_papers.vm"]},{"answer":"full paperは6月26日から7月24日に延長され、採否通知は8月7日、final paperとauthor registrationは8月21日が期限でした。","question":"2026年の締切はいつでしたか？","sourceUrls":["https://www.isocc.org/2026/pages_submission/submission_full_papers.vm"]},{"answer":"IEEE CAS Societyが財政的に共催しています。公式サイトの運営団体は韓国の반도체공학회（Institute of Semiconductor Engineers）です。","question":"主催・共催はどこですか？","sourceUrls":["https://www.isocc.org/2026/pages_introduce/overview.vm","https://ieee-cas.org/event/conference/2026-23rd-international-soc-design-conference"]},{"answer":"大学の学生チームが設計をposterで競うChip Design Contestが10月12日に開かれます。IDECが後援し、IDEC CDC committeeの評価を通ったチームが参加します。","question":"学生向けの企画はありますか？","sourceUrls":["https://www.isocc.org/2026/pages_submission/chip_design_contest.vm"]}],"headline":"第23回のISOCC 2026は2026年10月11日〜14日に韓国IncheonのSongdo ConvensiAで開かれ、テーマは「From Silicon to Physical Intelligence: Heterogeneous SoC Innovations」です。","metaDescription":"ISOCC（International SoC Design Conference）の第23回2026年Incheon会期、IEEE CAS Societyの財政的共催、2ページfull paper、IEEE Xplore収録、Keynote、Tutorial、Korea-Japan Joint Session、Chip Design Contestを公式サイトから整理しました。","oneLine":"ISOCCは、アナログ・デジタル回路、RF、wireline、データ変換器、AIアクセラレータ、SoC設計手法とCADなど、system-on-a-chip設計の研究を毎年集める国際会議です。","pageTitle":"ISOCCとは｜SoC設計の国際会議（2026年は第23回、10月仁川）","relatedConferenceIds":["a-sscc","vlsi-dat","socc","ieee-apccas","asicon","ieee-biocas"],"sections":{"cycle":{"id":"cycle","body":"ISOCC 2026の会期は2026年10月11日〜14日、会場は韓国IncheonのSongdo ConvensiAです。Keynoteは10月12日、poster発表は10月13日に組まれています。Tutorialだけはonline hybridで行われ、Zoomで配信されます。オンライン参加登録の締切は9月11日まで延長されました。","facts":[{"label":"2026 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Systems for Emerging Technologiesに分かれます。2.5D/3D集積とadvanced packagingや、Physical AI Circuits and Systemsも対象に入っています。","facts":[{"label":"2026 募集分野の総括","value":"アナログ・デジタル回路とシステムの設計、理論、シミュレーション、モデリング、実装、新技術","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_introduce/overview.vm"},{"label":"2026 Topic：Machine Learning and AI","value":"Machine Learning Accelerators and Circuits / Near-Memory and In-Memory Computation for AI など","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_introduce/topics.vm"},{"label":"2026 Topic：Physical AI","value":"Physical AI Circuits and Systems","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_introduce/topics.vm"},{"label":"2026 Topic：SoC Design Methodology and CAD","value":"System-Level Modeling、Logic/High-Level Synthesis、Physical Design、DfM/Reliability、Testing/Verification","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_introduce/topics.vm"},{"label":"2026 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securityに取り組む研究者・技術者・大学院生を対象にしています。","facts":[{"label":"Chip Design Contestの対象","value":"大学・カレッジの学生","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_submission/chip_design_contest.vm"},{"label":"2026 Tutorial 1の対象","value":"VLSI設計とhardware securityの研究者・技術者・大学院生","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_program/tutorials.vm"},{"label":"2026 Chip Design Contestの賞","value":"Best Design Award / SSCS Seoul Chapter Award / ISE Integrated Circuit Design Research Society Award / Best Poster Award","checkedAt":"2026-10-08","sourceUrl":"https://www.isocc.org/2026/pages_submission/chip_design_contest.vm"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はInternational SoC Design Conferenceで、2026年は第23回です。公式サイトはISOCCを毎年開かれる会議と説明し、2026年はIEEE CAS Societyが財政的に共催しています。公式サイトの運営団体は韓国の반도체공학회（Institute of Semiconductor Engineers, ISE）です。","facts":[{"label":"2026 正式名称・回次","value":"23rd International SoC Design Conference (ISOCC 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2026は2026年10月26〜28日に米国Vermont州BurlingtonのHotel Champlainで開かれ、tutorial、keynote、panel、口頭・poster発表、展示、施設見学が組まれています。","metaDescription":"WiPDA（IEEE Workshop on Wide Bandgap Power Devices and Applications）の主催、2026年Burlington会期と会場、3ページabstractと6ページ論文の書式、締切、tutorial・keynote・panel、2013年以降の開催地を公式サイトから整理しました。","oneLine":"WiPDAは、IEEEとPSMAが主催し、ワイドバンドギャップ（SiC・GaN・UWBG）パワーデバイスの材料・デバイスから変換器・応用までを、デバイス研究者、回路設計者、応用エンジニアが共有する年次workshopです。","pageTitle":"WiPDAとは｜SiC・GaN・UWBGのデバイスから応用までを議論するIEEEのワイドバンドギャップworkshop","relatedConferenceIds":["wipda-europe","icscrm","ispsd","apec","ecce","pcim"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は10月26〜28日の3日間で、会場はBurlingtonのHotel Champlainです。初日の月曜はtutorialと施設見学、火曜と水曜がkeynote、panel、口頭・poster発表の本会議日という構成です。委員会ページには、2027年の担当者としてStony Brook Universityの2名が掲載されています。","facts":[{"label":"2026 会期・都市","value":"2026-10-26〜28 / Burlington, Vermont, USA","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/"},{"label":"2026 会場","value":"Hotel Champlain（60 Battery 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Power Modules & ICs、Gate Drive & Other Auxiliary Circuits、High-Performance Passive Componentsなどが並びます。応用先として再生可能エネルギーと蓄電、輸送、産業用ドライブ、系統、宇宙・航空が明記され、Ultra-Wide Bandgapも独立した項目です。2026年の委員会はGaN Devices、SiC Devices、GaN Apps、SiC Apps、Ultrawide Bandgap、Device and Switching Reliabilityの担当chairを置いています。","facts":[{"label":"材料・プロセス系トピック","value":"Heteroepitaxial & Bulk Materials Growth / Gate Dielectrics & Surface Passivation / Device Structures & Fabrication Techniques","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/"},{"label":"回路・実装系トピック","value":"Very-High Efficiency and Compact Converters / Packaging Power Modules & ICs / Gate Drive & Other Auxiliary Circuits / High-Performance Passive Components","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/"},{"label":"応用分野","value":"Renewable Energy & Energy Storage, Transportation, Industrial Drives, Grid Power Systems, Space and 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Xploreへの収録実績は今回開いた公式ページには明記されていません。開催形式（現地のみかhybridか）も明記はなく、会場・施設見学・展示の記述から現地開催の案内が中心です。2026年の口頭セッション名はスケジュールPDFの暫定表記で、綴りの揺れ（Extrem Enviorment）を含みます。トップページのロゴにはIEEE PELS・EDSの画像がありますが、本文で主催として書かれているのはIEEEとPSMAです。欧州で開かれるWiPDA-Europeは別の会議として扱ってください。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のHistoryページは、2013年のColumbus（Ohio）から始まる開催地を一覧にしています。2024年はDayton（Ohio）、2025年はFayetteville（Arkansas）でした。2020年はPostponed、2021年はVirtual開催でした。","facts":[{"label":"歴代表の最初の回","value":"WiPDA 2013 / Oct. 27 – Oct. 29 / Columbus, OH","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/history/"},{"label":"2020","value":"Postponed（延期）","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/history/"},{"label":"2021","value":"Nov. 7 – Nov. 11 / Virtual","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/history/"},{"label":"2024","value":"Nov. 4 – Nov. 6 / Dayton, 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Applicationsで、略称はWiPDAです。公式のAboutページはIEEEとPSMAを主催者として挙げています。年1回のworkshopとして、2026年は13回目にあたります。","facts":[{"label":"正式名称（2026）","value":"IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2026)","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/"},{"label":"主催","value":"IEEE、PSMA","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/"},{"label":"開催頻度・回次（2026）","value":"年次開催 / 第13回（Thirteenth Annual）","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/"},{"label":"目的","value":"デバイス研究者、回路設計者、応用エンジニアが技術動向・研究成果・開発経験・応用知識を共有する場","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/about/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはRugged MicroPowerのPaul Shepherd、Technical Program ChairはStony Brook UniversityのFang Luoです。委員にはWolfspeed、Texas Instruments、ABB、Ford Motor Company、iDEAL Semiconductorといった企業の所属者が並びます。sponsorship制度にはPlatinum $7,500、Gold $4,000、Silver $2,000、Exhibitor 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Xplore準拠のPDFであることが求められ、2026年はIEEE PDF eXpressのConference ID 68519Xで準拠確認を行います。最終論文の提出にはIEEE著作権フォームが伴います。","facts":[{"label":"PDF準拠","value":"IEEE Xplore準拠PDFが必須","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/authors/"},{"label":"2026 PDF eXpress Conference ID","value":"68519X","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/authors/"},{"label":"著作権","value":"最終論文提出時にIEEE copyright formを提出","checkedAt":"2026-10-08","sourceUrl":"https://wipda.org/"}],"title":"出版","eyebrow":"publication"}},"sources":[{"url":"https://wipda.org/","role":"official","label":"WiPDA 2026 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"冒頭の開催案内、Key Dates、Topics of interest"},{"url":"https://wipda.org/about/","role":"official","label":"WiPDA About","checkedAt":"2026-10-08","evidenceLocator":"冒頭の説明文とTopics of Interest"},{"url":"https://wipda.org/about/history/","role":"history","label":"WiPDA History","checkedAt":"2026-10-08","evidenceLocator":"Date / Location / General Chair 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device","sourceUrl":"https://wipda.org/committees/"},{"note":"委員会にGaN Devices Co-Chairが置かれ、tutorialにはEPCによるGaN-on-Siの熱機械信頼性が入っています。","label":"GaN device / reliability","sourceUrl":"https://wipda.org/tutorials-2/"},{"note":"トピック表の独立項目で、2026年は口頭セッションOral 6: UWBGと水曜のpanelが組まれています。","label":"Ultra-Wide Bandgap","sourceUrl":"https://wipda.org/panels2026/"},{"note":"Topics of InterestにPackaging Power Modules & ICsが入っています。","label":"Packaging Power Modules & ICs","sourceUrl":"https://wipda.org/about/"},{"note":"2026年はOral 4・5がExtreme Environmentの口頭セッションです。","label":"Extreme environment","sourceUrl":"https://wipda.org/wp-content/uploads/sites/739/2026/10/Website-Schedule-Schedule.pdf"},{"note":"2026年は10月27日のpanelが「Wide Bandgap Power Technology Transfer from Research to Commercial 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PELS・EDSとPSMAが支えるワイドバンドギャップのパワーデバイスのワークショップで、10回を超えて続く。材料からデバイス、実装、実応用までを取り上げる。"},"publicReasons":[{"body":"会議サイト","sourceUrl":"https://www.psma.com/HTML/newsletter/page11.html"}],"sourceUrls":[{"url":"https://wipda.org/"},{"url":"https://wipda.org/wp-content/uploads/sites/739/2025/11/WiPDA-2025-Program.pdf"},{"url":"https://wipda.org/about/history/"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"notified","label":"開催直前","closedNote":"投稿受付は終了","imminent":true,"staleEnded":false,"steps":[{"id":"pre-cfp","label":"投稿受付前","state":"done"},{"id":"open","label":"投稿受付中","state":"done"},{"id":"review","label":"投稿終了","state":"done"},{"id":"notified","label":"採否通知","state":"current"},{"id":"program","label":"プログラム公開","state":"upcoming"},{"id":"live","label":"開催中","state":"upcoming"},{"id":"ended","label":"終了","state":"upcoming"}],"currentStep":"notified","nextEvent":{"kind":"session","label":"開催","date":"2026-10-26","endDate":"2026-10-28","daysUntil":4},"lastPast":{"kind":"author","label":"最終原稿締切","date":"2026-09-18"},"milestones":[{"kind":"abstract","label":"要旨締切","date":"2026-07-27","state":"past"},{"kind":"acceptance","label":"採否通知","date":"2026-08-31","state":"past"},{"kind":"author","label":"最終原稿締切","date":"2026-09-18","state":"past"},{"kind":"session","label":"開催","date":"2026-10-26","endDate":"2026-10-28","state":"upcoming"}],"action":{"kind":"program","text":"まもなく開幕です。当日のプログラムと参加登録は公式サイトにあります。","href":"https://wipda.org/","linkLabel":"プログラムを開く"}},"proceedingsUrl":null,"digestDeadline":null,"paperDeadline":null,"lateNewsDeadline":null,"submissionOpensOn":null,"programPublishedOn":null},{"id":"gaseous-electronics-conference","code":"GEC","name":"Gaseous Electronics Conference","cfpUrl":"https://www.apsgec.org/gec2026/abstracts.php","coverage":"Low-temperature plasma science, plasma sources, diagnostics, modeling, plasma chemistry, plasma-surface interactions, microelectronics plasma processing, etch, deposition, and semiconductor fabrication applicationsを確認できる。","geography":"北米 / グローバル","organizer":"Gaseous Electronics Conference / American Physical Society plasma community","programUrl":"https://www.apsgec.org/gec2026/program.php","watchItems":"low-temperature plasma, plasma etch, plasma deposition, plasma-surface interaction, semiconductor fabrication, DRAM etch, process modeling, plasma diagnostics, AI/ML plasma simulation","historyNote":"Official GEC history page lists Books of Abstracts beginning with 1948; official GEC 2026 home identifies the 79th Annual Gaseous Electronics Conference in Chicago.","officialUrl":"https://www.apsgec.org/gec2026/","nextDeadline":null,"cfpHighlights":"GEC：開催日程は2026-11-02〜2026-11-06。要旨締切は2026-07-29。","trackingPhase":"program公開待ち","deadlineEvents":[{"code":"GEC","date":"2026-07-29","kind":"abstract","name":"Gaseous Electronics Conference","label":"要旨締切","cfpUrl":"https://www.apsgec.org/gec2026/abstracts.php","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://www.apsgec.org/gec2026/program.php","officialUrl":"https://www.apsgec.org/gec2026/","conferenceId":"gaseous-electronics-conference","trackingPhase":"program公開待ち","trackingPhaseGroup":"program-watch","daysFromLastVerified":-46},{"code":"GEC","date":"2026-09-04","kind":"acceptance","name":"Gaseous Electronics Conference","label":"採択通知","cfpUrl":"https://www.apsgec.org/gec2026/abstracts.php","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://www.apsgec.org/gec2026/program.php","officialUrl":"https://www.apsgec.org/gec2026/","conferenceId":"gaseous-electronics-conference","trackingPhase":"program公開待ち","trackingPhaseGroup":"program-watch","daysFromLastVerified":-9}],"proceedingsUrl":"https://www.apsgec.org/main/history.php","primaryDeadline":{"code":"GEC","date":"2026-07-29","kind":"abstract","name":"Gaseous Electronics Conference","label":"要旨締切","cfpUrl":"https://www.apsgec.org/gec2026/abstracts.php","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://www.apsgec.org/gec2026/program.php","officialUrl":"https://www.apsgec.org/gec2026/","conferenceId":"gaseous-electronics-conference","trackingPhase":"program公開待ち","trackingPhaseGroup":"program-watch","daysFromLastVerified":-46},"submissionFormat":"Official GEC 2026 abstract page says abstracts are limited to 1,300 characters, author notices of acceptance are tentatively scheduled for September 4, 2026, and contributed papers may be oral or poster presentations.","trackingPhaseGroup":"program-watch","nextPrimaryDeadline":null,"primaryDeadlineEvents":[{"code":"GEC","date":"2026-07-29","kind":"abstract","name":"Gaseous Electronics Conference","label":"要旨締切","cfpUrl":"https://www.apsgec.org/gec2026/abstracts.php","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://www.apsgec.org/gec2026/program.php","officialUrl":"https://www.apsgec.org/gec2026/","conferenceId":"gaseous-electronics-conference","trackingPhase":"program公開待ち","trackingPhaseGroup":"program-watch","daysFromLastVerified":-46}],"researchVisualSignals":{"note":"This note covers GEC official source-backed 2025 committee, workshop/program, sponsor/supporter, and official history/current-cycle signals.","history":{"notes":"Official GEC history page lists Books of Abstracts beginning with 1948; official GEC 2026 home identifies the 79th Annual Gaseous Electronics Conference at Hilton Chicago, November 2-6, 2026.","checkedAt":"2026-07-02","sourceUrl":"https://www.apsgec.org/main/history.php","sourceClass":"official_history","displayLabel":"Official abstract archive begins 1948 / 79th GEC 2026 in Chicago","foundingYear":1948,"sourceStatus":"confirmed","historyYearBasis":"official_abstract_archive_start_year_and_2026_cycle_source"},"organizationMix":[{"note":"Combines official GEC 2025 Local Organizing Committee rows and GEC Executive Committee rows; duplicate people in separate official roles remain source rows.","label":"GEC 2025 local and executive committee affiliation organization mix","segments":[{"kind":"company","rows":5,"label":"Company","value":16.7},{"kind":"university","rows":23,"label":"University","value":76.7},{"kind":"research","rows":2,"label":"Research institute","value":6.7}],"sourceUrl":"https://www.apsgec.org/gec2025/program_committee.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"30 official local organizing + executive committee source rows"},{"note":"Accepted-presentation first-listed affiliation rows were not available in reviewable official 2026 sources, and the 2026 sponsor list is still coming soon, so this uses the official 2025 workshop speaker affiliation rows.","label":"GEC 2025 workshop speaker affiliation organization mix","segments":[{"kind":"company","rows":10,"label":"Company","value":33.3},{"kind":"university","rows":16,"label":"University","value":53.3},{"kind":"research","rows":4,"label":"Research institute","value":13.3}],"sourceUrl":"https://www.apsgec.org/gec2025/workshops.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"30 official workshop speaker affiliation rows"},{"note":"Counts visible official GEC 2025 sponsor/supporter logo rows by sponsor tier; this is listing evidence, not revenue/customer/procurement evidence.","label":"GEC 2025 sponsor and supporter organization mix","segments":[{"kind":"company","rows":9,"label":"Company","value":75},{"kind":"research","rows":1,"label":"Research institute","value":8.3},{"kind":"government","rows":2,"label":"Government / public institution","value":16.7}],"sourceUrl":"https://www.apsgec.org/gec2025/sponsor_list.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"12 official sponsor and supporter listing rows"}],"companyBreakdowns":[{"note":"Company rows are counted at official committee source-row grain.","rows":[{"rows":2,"company":"Applied Materials Inc."},{"rows":2,"company":"Samsung Electronics"},{"rows":1,"company":"Tokyo Electron US"}],"label":"GEC 2025 committee company affiliation rows","sourceUrl":"https://www.apsgec.org/gec2025/program_committee.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"30 official local organizing + executive committee source rows"},{"note":"Company rows are counted at official workshop speaker source-row grain.","rows":[{"rows":3,"company":"Samsung Electronics"},{"rows":1,"company":"ASE Co., Ltd."},{"rows":1,"company":"Lam Research"},{"rows":1,"company":"PSK"},{"rows":1,"company":"Quantemol"},{"rows":1,"company":"RTM"},{"rows":1,"company":"SK hynix"},{"rows":1,"company":"TEL America"}],"label":"GEC 2025 workshop speaker company affiliation rows","sourceUrl":"https://www.apsgec.org/gec2025/workshops.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"30 official workshop speaker affiliation rows"}],"countryBreakdowns":[{"note":"Country/region rows are based on listed affiliation organizations for official GEC 2025 workshop speakers and organizer-provided organization names, not person citizenship.","rows":[{"rows":12,"country":"South Korea","percentage":40},{"rows":7,"country":"United States","percentage":23.3},{"rows":3,"country":"Japan","percentage":10},{"rows":2,"country":"Unknown","percentage":6.7},{"rows":1,"country":"China","percentage":3.3},{"rows":1,"country":"France","percentage":3.3},{"rows":1,"country":"Germany","percentage":3.3},{"rows":1,"country":"Italy","percentage":3.3},{"rows":1,"country":"Spain","percentage":3.3},{"rows":1,"country":"United Kingdom","percentage":3.3}],"label":"GEC 2025 workshop speaker affiliation organization country/region","sourceUrl":"https://www.apsgec.org/gec2025/workshops.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"30 official workshop speaker affiliation rows"}],"sponsorOrganizations":{"note":"The list enumerates all visible official GEC 2025 sponsor and supporter logo rows by tier.","rows":[{"role":"Sponsor","tier":"Mobile App Sponsor","organization":"Lam Research","organizationType":"company"},{"role":"Sponsor","tier":"Gold Sponsor","organization":"Applied Materials","organizationType":"company"},{"role":"Sponsor","tier":"Gold Sponsor","organization":"Tokyo Electron","organizationType":"company"},{"role":"Sponsor","tier":"Gold Sponsor","organization":"Samsung Electronics","organizationType":"company"},{"role":"Sponsor","tier":"Gold Sponsor","organization":"WONIK","organizationType":"company"},{"role":"Sponsor","tier":"Award Presentation Sponsor","organization":"Korea Institute of Fusion Energy","organizationType":"research"},{"role":"Sponsor","tier":"Oral Session Sponsor","organization":"SK hynix","organizationType":"company"},{"role":"Sponsor","tier":"Coffee Break Sponsor","organization":"H&iruja","organizationType":"company"},{"role":"Sponsor","tier":"Registration Area Sponsor","organization":"Hiden","organizationType":"company"},{"role":"Sponsor","tier":"Registration Area Sponsor","organization":"KWT Solution","organizationType":"company"},{"role":"Supporter","tier":"Supporter","organization":"Seoul Metropolitan Government","organizationType":"government"},{"role":"Supporter","tier":"Supporter","organization":"Korea Tourism Organization","organizationType":"government"}],"label":"GEC 2025 sponsor and supporter listing","sourceUrl":"https://www.apsgec.org/gec2025/sponsor_list.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"12 official sponsor/supporter listing rows"}},"city":"Chicago","tier":"a","venue":"Hilton Chicago","country":"United States","fieldId":"device-process","editions":[],"genreIds":["feol","beol"],"processes":[{"id":"prc_9a7f890c2fc84cca9dde7dc701a4dc3e","nameJa":"ドライエッチング","primary":true},{"id":"prc_139ba7babc094997ac88c66e6a1a1755","nameJa":"プラズマ診断・終点検出","primary":false},{"id":"prc_6dce64b0f83148728d07a1a8281fe256","nameJa":"成膜","primary":false},{"id":"prc_3056d6aac5e64d2ebe03a0b910748b78","nameJa":"装置ソフトウェア・シミュレーション","primary":false},{"id":"prc_5ea7c369f77c41a580c2968f9c4d920a","nameJa":"製造装置の開発・設計","primary":false}],"cycleLabel":"2026-11-02〜06 / Hilton Chicago, Chicago, Illinois, United States","fieldTitle":"ロジック / デバイス / プロセス統合","organizers":[{"id":"org_fcbf92af78b34f4d87ba9acaeeaf6e7e","name":"American Physical 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2026はいつ、どこで開かれますか。","sourceUrls":["https://www.apsgec.org/gec2026/"]},{"answer":"アブストラクトで申し込みます。1,300字（約250語）以内で、問題、アプローチ、成果の状況を簡潔に書き、一般向けのPresentation Summaryも添えます。","question":"投稿にはフルペーパーが必要ですか。","sourceUrls":["https://www.apsgec.org/gec2026/abstracts.php"]},{"answer":"一般講演の口頭発表は15分枠で、発表12分と質疑3分です。ポスター発表も選べます。","question":"口頭発表の持ち時間は。","sourceUrls":["https://www.apsgec.org/gec2026/abstracts.php"]},{"answer":"公式サイトは新しい応用領域にmicroelectronicsを挙げ、2026年の招待講演にはプラズマエッチング、選択エッチングと選択成膜、成膜工程の計測などの題目があります。","question":"半導体プロセスの発表はありますか。","sourceUrls":["https://www.apsgec.org/gec2026/","https://www.apsgec.org/gec2026/invited_speakers.php"]},{"answer":"公式の開催一覧では、2022年10月4〜8日に仙台で開かれています。","question":"日本で開かれたことはありますか。","sourceUrls":["https://www.apsgec.org/main/conferences.php"]},{"answer":"GEC2027はポルトガルのリスボンで開かれると公式サイトに告知されています。","question":"次回の開催地は。","sourceUrls":["https://www.apsgec.org/gec2026/"]}],"headline":"79th GECは2026年11月2〜6日にシカゴのHilton Chicagoで、68th APS Division of Plasma Physics Conferenceと合同で開かれます。","metaDescription":"Gaseous Electronics Conference（GEC）の位置づけ、2026年シカゴ会期（APS DPPとの合同開催）、1,300字アブストラクトの投稿規程、招待講演とワークショップ、Executive Committee、1948年からのBooks of Abstractsを公式サイトから整理しました。","oneLine":"GECは、プラズマ源、診断、モデリング、プラズマ化学、原子分子衝突過程など低温プラズマの科学と技術の研究を発表する年次会議で、半導体プラズマ加工も対象分野に含まれます。","pageTitle":"GECとは｜低温プラズマの科学と半導体プラズマ加工の研究が集まるGaseous Electronics Conference","relatedConferenceIds":["plasma-conference","isplasma","avs","icpt","ald-ale","spie-advanced-etch"],"sections":{"cycle":{"id":"cycle","body":"2026年のGECは11月2〜6日にシカゴのHilton Chicagoで、APS Division of Plasma Physics（DPP）の第68回年会と合同で開かれます。公式サイトは合同会議に2,500人以上の物理学者が集まると見込んでいます。2027年はポルトガルのリスボンでの開催が告知されています。","facts":[{"label":"2026 会期・会場","value":"2026-11-02〜06 / Hilton Chicago, Chicago, IL, USA","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"},{"label":"2026 合同開催","value":"68th APS Division of Plasma Physics Conference と合同","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"},{"label":"2026 見込み参加規模（DPP・GEC合同）","value":"2,500+ physicists","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"},{"label":"2026 会場住所","value":"720 South Michigan Avenue, Chicago, IL 60605, USA","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/venue.php"},{"label":"2027 開催地","value":"Lisbon, Portugal","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"}],"title":"2026年会期","eyebrow":"cycle"},"scope":{"id":"scope","body":"公式サイトは重点領域として、プラズマ源の科学、診断、モデリング、プラズマ化学、基礎現象、原子分子衝突過程を挙げます。新しい応用領域としてマイクロエレクトロニクス、推進、バイオ、プラズマ医療、多相プラズマ、環境応用、大気圧プラズマも並びます。2026年の招待講演には、高アスペクト比エッチングにおけるイオンとラジカルの挙動のシミュレーション、選択エッチングと選択成膜、成膜工程の計測といった半導体プロセスの題目が入っています。","facts":[{"label":"重点領域","value":"plasma sources, diagnostics, modeling, plasma chemistry, basic phenomena, atomic and molecular collision processes","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"},{"label":"新しい応用領域","value":"microelectronics, propulsion, biotechnology, plasma medicine, multiphase plasmas, environmental applications, atmospheric-pressure plasma systems","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/"},{"label":"2026 招待講演（半導体エッチング）","value":"Plasma etching: Simulating Ion and Radical Dynamics in High-Aspect-Ratio Plasma-Etch Applications（TEL TechnologyCenter, America）","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/invited_speakers.php"},{"label":"2026 招待講演（選択プロセス）","value":"Selectivity in Radical Plasma processes — switching from selective etching to selective deposition（U Albany）","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/invited_speakers.php"},{"label":"2026 招待講演（成膜計測）","value":"Metrology challenges and opportunities in semiconductor deposition processes（Lam Research Corp）","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/invited_speakers.php"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"GECの一般講演はアブストラクトで選考され、採択の通知が著者に送られます。アブストラクトには、問題、アプローチ、完了または予定の成果の状況を簡潔に書くことが求められます。学生向けのStudent Award for Excellenceでは、委員会が選んだfinalistが口頭で発表し、審査員が受賞者を決めます。","facts":[{"label":"アブストラクトに求める内容","value":"問題の特定、アプローチ、成果の状況","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/abstracts.php"},{"label":"発表区分","value":"口頭（15分枠：発表12分＋質疑3分）またはポスター","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/abstracts.php"},{"label":"採択後の義務","value":"採択された場合は発表する意思と準備が必要","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/abstracts.php"},{"label":"Student Award for Excellence の審査","value":"委員会がfinalistを選び、審査員が口頭発表を聴いて受賞者を選出","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/awards.php"}],"title":"選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"GECの歴史ページの冒頭は「Content To be updated」のままで、79回目という回次と1948年からのBooks of Abstractsは別々の記載です。Governanceページには2020年10月7日のBusiness Meetingに関する古い記述が残っています。","facts":[{"label":"歴史ページの状態","value":"冒頭の説明が未更新","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/main/history.php"},{"label":"Governanceページの古い記述","value":"2020年10月7日のBusiness Meetingへの言及","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/governance.php"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式の歴史ページはBooks of Abstractsを1948年分から掲げ、2026年が79th Conferenceにあたります。米国外の開催には、2010年パリ、2016年ボーフム、2022年仙台、2025年ソウルがあります。2020年はVirtual Conferenceで、公式サイトは2020年と2021年をvirtual GECsと呼んでいます。","facts":[{"label":"最古のBook of 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Abstractsを年ごとのPDFで掲げています。2020年と2021年のオンライン開催の講演録画は、当該会議の登録参加者向けに公開されています。","facts":[{"label":"Books of Abstracts の収録範囲","value":"1948〜2017年","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/main/history.php"},{"label":"オンラインBulletin","value":"2018〜2021年分へのリンク（meetings.aps.org）","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/main/history.php"},{"label":"2020・2021 講演録画","value":"当該会議の登録参加者に公開","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/main/index.php"},{"label":"2026 プログラム掲載先","value":"schedule.aps.org（DPP・GEC合同スケジュール）","checkedAt":"2026-10-08","sourceUrl":"https://www.apsgec.org/gec2026/program.php"}],"title":"出版・記録","eyebrow":"publication"}},"sources":[{"url":"https://www.apsgec.org/gec2026/","role":"official","label":"GEC 2026 Home","checkedAt":"2026-10-08","evidenceLocator":"ページ上部の回次・会期・合同開催、本文の重点領域、メニュー内Conference HistoryのFuture欄"},{"url":"https://www.apsgec.org/gec2026/abstracts.php","role":"cfp","label":"GEC 2026 Abstract 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25分、一般講演（Contributed）15分で、いずれも質疑を含む時間です。","question":"口頭講演の持ち時間はどれくらいですか。","sourceUrls":["https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/information-for-presenters/"]},{"answer":"2025年は早期登録で30,000円、通常登録で35,000円でした。参加費にはBanquetとWelcome Receptionが含まれていました。","question":"学生の参加費はいくらでしたか。","sourceUrls":["https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/registration/"]}],"headline":"KJF-ICOMEP 2026は2026年8月25〜28日にBusanのHanwha Resorts Haeundaeで開催され、A4半ページabstractの締切は7月30日でした。","metaDescription":"KJF-ICOMEP 2026は2026年8月25〜28日にBusanのHanwha Resorts Haeundaeで開催されました。発表用abstractはA4半ページ、締切は7月30日です。2025年大阪大会は履歴として整理しています。","oneLine":"KJF-ICOMEPは、1989年に日韓合同フォーラム（Korea-Japan Joint Forum）として始まった、有機材料のエレクトロニクス・フォトニクス応用を対象とする国際会議です。","pageTitle":"KJF-ICOMEPとは｜2026年Busan大会の会期・A4半ページabstract締切と1989年からの沿革","relatedConferenceIds":["international-display-workshops","polymer-discussion-meeting","molecular-science-annual-meeting","photochemistry-discussion-meeting","icnme","display-week"],"sections":{"cycle":{"id":"cycle","body":"現行の2026年大会は8月25〜28日の4日間、BusanのHanwha Resorts Haeundaeで開催されました。以下の大阪国際会議場、Welcome Reception、Banquet、大阪・関西万博excursionは2025年大会の履歴です。","facts":[{"label":"2026 会期","value":"2026年8月25〜28日","checkedAt":"2026-10-14","sourceUrl":"https://www.kjf-icomep.com/"},{"label":"2026 会場","value":"Hanwha Resorts Haeundae / 52 Marine city 3-ro, Haeundae-gu, Busan, Korea","checkedAt":"2026-10-14","sourceUrl":"https://www.kjf-icomep.com/kjf/info.html?p=location"},{"label":"2026 開催地","value":"Busan, Republic of Korea","checkedAt":"2026-10-14","sourceUrl":"https://www.kjf-icomep.com/"},{"label":"2025 併設行事","value":"Welcome Reception（8/25）、Banquet（8/26、ANA Crowne Plaza Osaka）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/conference-social-events/"},{"label":"2025 Excursion","value":"大阪・関西万博の半日見学ツアー（8/28午後、事前申込制）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/registration/"},{"label":"2025 大会終了告知","value":"2025-08-29付で終了を告知","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/kjf-icomep-2025-was-successfully-completed-we-appreciate-to-all-participant/"}],"title":"2026年Busan大会と2025年大阪大会の開催記録","eyebrow":"cycle"},"scope":{"id":"scope","body":"2025年のConference Scopeは有機トランジスタ・メモリ・太陽電池からOLED、非線形光学、エレクトロクロミック、分子認識、センサとバイオエレクトロニクスまでの8項目です。開催挨拶は材料合成・薄膜作製・界面現象・分光・単一分子操作といった基礎研究と、LED・FET・メモリ・太陽電池・電池・バイオチップ・バイオセンサといった応用研究の両方を対象に挙げています。","facts":[{"label":"2025 Scope: トランジスタ・メモリ・太陽電池","value":"Organic Transistors, Memories, and 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manipulations","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/greetings/"},{"label":"2025 応用研究側の対象","value":"LEDs, FETs, memory devices, solar cells, batteries, biochips, biosensors","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/greetings/"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"2025年の講演はPlenary・Invited・General（Contributed）の3区分で、Plenaryは40分、Invitedは25分、Contributedの口頭講演は15分でした。いずれも発表と討論を含む時間です。アブストラクト締切の延長後は、ポスター発表のみが受け付けられました。","facts":[{"label":"2025 講演区分と時間","value":"PL: Plenary 40分 / IL: Invited 25分 / GL: General（Contributed）15分（質疑込み）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/information-for-presenters/"},{"label":"2025 時間の内訳","value":"発表と討論を含む時間","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/information-for-presenters/"},{"label":"2025 締切延長後の受付区分","value":"ポスター発表のみ","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/registration/"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"KJF-ICOMEP 2026の会期・会場、A4半ページabstract、7月30日締切は、直接DNS/GETで取得できなかったため、公式ページと公式Circularの検索インデックス表示で確認しました。公式ホームの2026年7月22日付ニュースは「Acceptance will be notified」と未来形で掲示し、Circular記載のabstract締切7月30日より前の日付なので、全投稿に共通する確定採否日としては使いません。Circularのproceedings欄はTo be announcedです。2025年大阪大会の出版方式やWord形式を2026年へ流用しません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式の沿革表は1989年のKJF’89（KIST、ソウル）から始まります。初回の参加者は韓国10名・日本20名、論文20件で、2013年の釜山では論文387件でした。2021年はYokohamaを拠点にオンラインで、2023年は九州大学（福岡、論文196件）、2024年は釜山のHotel Nongshim（論文203件）で開かれています。","facts":[{"label":"初回開催","value":"1989年 KJF’89 / KIST (Seoul)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"},{"label":"1989 参加者・論文数","value":"参加者 韓国10 / 日本20、論文20","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"},{"label":"2013 開催","value":"Haeundae Grand Hotel (Busan)、論文387","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"},{"label":"2021 開催","value":"Online (Yokohama)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"},{"label":"2024 開催","value":"Hotel Nongshim (Busan)、参加者 韓国199 / 日本73 / その他5、論文203","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"},{"label":"2023 開催","value":"Kyushu University (Fukuoka)、論文196","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/histry/"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2025年のPlenary SpeakerはYamagata Univ.のJunji Kido教授とKorea Univ.のDong Hoon Choi教授の2名でした。Invited SpeakerにはNational Chung Hsing Univ.のChieh-Tung Lin教授らがいます。Timetable、口頭プログラム、ポスタープログラムはPDFで公開され、8月27日にはNakanoshima Center Buildingでランチビュッフェが用意されました。","facts":[{"label":"2025 Plenary","value":"Prof. Junji Kido (Yamagata Univ.)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/plenary-speakers/"},{"label":"2025 Plenary","value":"Prof. Dong Hoon Choi (Korea Univ.)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/plenary-speakers/"},{"label":"2025 Invited（一例）","value":"Prof. Chieh-Tung Lin (National Chung Hsing Univ.)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/plenary-speakers/"},{"label":"2025 プログラム資料","value":"Timetable / Oral program / poster program（PDF）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/schedule/"},{"label":"2025 昼食","value":"8/27 Lunch Buffet（Nakanoshima Center Building）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/conference-social-events/"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"開催挨拶は若手研究者の参加を特に歓迎すると書いており、学生の登録費は一般より25,000円低く設定されていました。企業向けには技術展示・広告掲載・学会賛助の枠があり、協賛募集ページは韓国を中心とする東アジアの研究者の参加を見込むと説明しています。","facts":[{"label":"2025 若手の参加","value":"若手研究者の参加を特に歓迎","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/greetings/"},{"label":"2025 参加者層（協賛募集ページ）","value":"韓国を中心に東アジアの研究者","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/sponsorship/"},{"label":"2025 対象者","value":"academia と industry の参加者","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/about/"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はKJF International Conference on Organic Materials for Electronics and Photonicsで、KJFはKorea-Japan Joint Forumの頭文字です。2025年大会はConference Chairを大阪大学のYutaka Ie教授、Co-ChairをEwha Womans UniversityのKyungkon Kim教授が務め、日韓双方から事務局長が立っていました。","facts":[{"label":"2025 正式名称","value":"2025 KJF International Conference on Organic Materials for Electronics and Photonics","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/"},{"note":"1989年に30名で発足したと書かれています。","label":"KJFの由来","value":"Korea-Japan Joint Forum (KJF)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/about/"},{"label":"2025 Conference Chair","value":"Prof. Yutaka Ie (Osaka Univ. 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Universityの2名体制でした。協賛には、テレコム先端技術研究支援センター、鹿島学術振興財団、関西エネルギー・リサイクル科学研究振興財団、コニカミノルタ科学技術振興財団のほか、アルバック・ファイ、エネコートテクノロジーズ、東京化成工業、東ソー、理研計器などの企業が並びます。協賛募集ページは、物理・化学・生物・エレクトロニクス関連の研究者約300名が集まる会議だと紹介しています。","facts":[{"label":"2025 International Committee Honorary Chairs","value":"Prof. Hiroyuki Sasabe（日本）/ Prof. Nakjoong Kim（韓国）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/committee/"},{"label":"2025 International Committee Chair","value":"Prof. Shiyoshi Yokoyama (Kyushu Univ., Japan) / Prof. Taek Seung Lee (Chungnam National Univ., Korea)","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/committee/"},{"label":"2025 参加規模（協賛募集ページの紹介）","value":"研究者約300名","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/sponsorship/"},{"label":"2025 協賛（財団）","value":"テレコム先端技術研究支援センター、鹿島学術振興財団、関西エネルギー・リサイクル科学研究振興財団、コニカミノルタ科学技術振興財団","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/sponsorship/"},{"note":"協賛として掲載されている事実のみを示します。","label":"2025 協賛（企業の一部）","value":"アルバック・ファイ、エネコートテクノロジーズ、東京化成工業、東ソー、理研計器 ほか","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/sponsorship/"},{"label":"2025 企業向け募集区分","value":"技術展示・広告掲載・学会賛助（募集終了）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/sponsorship/"}],"title":"委員会・協賛","eyebrow":"community"},"submission":{"id":"submission","body":"2026年はoral・poster発表用のabstractをA4半ページでオンライン提出し、締切は7月30日でした。早期登録締切は7月31日です。公式ホームのニュースは7月22日に「Acceptance will be notified」と掲示していますが、Circular記載のabstract締切7月30日より前なので、全投稿に共通する採否通知日としては扱いません。以下のWord形式、7月25日締切、円建て参加費は2025年大阪大会の履歴です。","facts":[{"label":"2026 abstract形式","value":"A4半ページ / oral・poster発表用 / online 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ポスター寸法","value":"推奨A0（880 mm × 1190 mm）","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/information-for-presenters/"}],"title":"2026年の投稿・締切と2025年の投稿記録","eyebrow":"submission"},"publication":{"id":"publication","body":"2025年大会の論文は、Taylor & FrancisのMolecular Crystals and Liquid Crystals（MCLC）に設けられた特集号「KJF-ICOMEP 2025」へ投稿する方式でした。投稿資格は会議で発表した人に限られ、採択論文は準備が整い次第オンライン公開されます。Abstract Bookは公式サイトからダウンロードできます。","facts":[{"label":"2025 proceedings掲載先","value":"Molecular Crystals and Liquid Crystals（MCLC, Taylor & Francis）特集号","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/wp-content/uploads/2025/09/How-to-submit-KJF-ICOMEP2025-proceeding-1-1.pdf"},{"label":"2025 投稿資格","value":"会議で発表した人","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/wp-content/uploads/2025/09/How-to-submit-KJF-ICOMEP2025-proceeding-1-1.pdf"},{"label":"2025 論文締切（当初）","value":"2025-10-31","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/wp-content/uploads/2025/09/How-to-submit-KJF-ICOMEP2025-proceeding-1-1.pdf"},{"label":"2025 論文締切（延長後）","value":"12月22日","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/conference-proceeding/"},{"label":"2025 公開時期","value":"採択論文は準備でき次第オンライン公開","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/wp-content/uploads/2025/09/How-to-submit-KJF-ICOMEP2025-proceeding-1-1.pdf"},{"label":"2025 Abstract Book","value":"公式サイトでダウンロード配布","checkedAt":"2026-10-08","sourceUrl":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/abstract-book/"}],"title":"論文・出版","eyebrow":"publication"}},"sources":[{"url":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/","role":"official","label":"KJF-ICOMEP 2025 トップページ","checkedAt":"2026-10-08","evidenceLocator":"Invitation、Conference 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のPDFリンク"},{"url":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/conference-social-events/","role":"program","label":"KJF-ICOMEP 2025 Conference Social Events","checkedAt":"2026-10-08","evidenceLocator":"Welcome Reception / Banquet / Lunch Buffet 欄"},{"url":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/venue/","role":"venue","label":"KJF-ICOMEP 2025 Venue","checkedAt":"2026-10-08","evidenceLocator":"Map 欄の会場名と住所"},{"url":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/abstract-book/","role":"proceedings","label":"KJF-ICOMEP 2025 Abstract Book","checkedAt":"2026-10-08","evidenceLocator":"Download Abstract Book リンク"},{"url":"https://www.sanken.osaka-u.ac.jp/labs/omm/KJF-ICOMEP2025/conference-proceeding/","role":"proceedings","label":"KJF-ICOMEP 2025 Conference 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official listing rows"}},"city":"Nagoya","tier":"b","venue":"Nagoya University","country":"Japan","fieldId":"device-process","editions":[],"genreIds":["feol","beol","wbg","three-dimensional-integration"],"processes":[],"cycleLabel":"2026-10-31 to 2026-11-01 / Nagoya University, Nagoya, Japan","fieldTitle":"ロジック / デバイス / プロセス統合","organizers":[],"lastVerified":"2026-09-13","currentCycleEnd":"2026-11-01","abstractDeadline":"2026-07-31","peerReviewStatus":"review-unclear","currentCycleStart":"2026-10-31","canonicalId":"conf_7b2dc5f060d047c29746442810951863","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"chubu-chemistry-joint-autumn-meeting","confidenceScore":1,"coverage":{"faqCount":6,"factCount":60,"topicCount":5,"sourceCount":13,"sectionCount":12,"sectionTotal":12,"droppedFactCount":1,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"第57回は2026年10月31日（土）と11月1日（日）に、名古屋大学東山キャンパスで開かれます。","question":"2026年の中化連秋季大会はいつ、どこで開かれますか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/outline","https://pub.confit.atlas.jp/ja/event/chukaren57/content/greeting"]},{"answer":"2026年の一般研究発表の口頭発表は、会場での対面式発表のみとされています。","question":"オンラインで発表できますか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/submission"]},{"answer":"2026年はA-1有機化学のみでポスター発表を受け付け、ボードは縦180cm×横120cmです。","question":"ポスター発表はどの分野で受け付けていますか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/outline"]},{"answer":"A4のPDFで、一般研究発表は1講演半頁、特別討論会は1講演1頁、ファイル容量は5MB以内です。2026年の提出締切は9月11日でした。","question":"予稿は何頁ですか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/abstract"]},{"answer":"総合講演は参加登録なしで一般の方も聴講できると案内されています。2026年は10月31日に2件が予定されています。","question":"総合講演だけ聴講できますか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/programtime"]},{"answer":"大会ページは、中化連が特許法第30条指定の学術団体ではないと注意を促しています。","question":"中化連での発表は特許法第30条の新規性喪失の例外の対象になりますか。","sourceUrls":["https://pub.confit.atlas.jp/ja/event/chukaren57/content/submission"]}],"headline":"第57回中化連秋季大会は2026年10月31日・11月1日に名古屋大学で開かれ、一般研究発表11分野と特別討論会で構成されます。","metaDescription":"中部化学関係学協会支部連合秋季大会（中化連）の2026年第57回について、主催と共催学協会、名古屋大学での会期、A-1〜A-11の講演分野と特別討論会、申込・予稿締切、過去の開催地を公式Confitページから記載。","oneLine":"中化連秋季大会は、中部地区の化学関係学協会支部が合同で毎年秋に開く、化学全分野の研究発表大会です。","pageTitle":"中化連秋季大会とは｜中部化学関係学協会支部連合の会期・講演分野・投稿要領","relatedConferenceIds":["chemical-society-japan-spring-annual-meeting","csj-chemistry-festa","electrochemical-society-japan-meeting","polymer-discussion-meeting","colloid-interface-chemistry-meeting"],"sections":{"cycle":{"id":"cycle","body":"第57回は2026年10月31日（土）と11月1日（日）の2日間、名古屋大学東山キャンパスで開かれます。豊田講堂と野依記念学術交流会館のほか、理学部・工学部の講義室が会場になります。プログラムは10月7日に公開済みで、予稿集は10月21日に公開予定です。","facts":[{"label":"2026 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高分子を見る・創るパラダイムシフト（高分子化学）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/tokubetsu"},{"label":"2026 特別討論会 B-8","value":"電極の表面構造・機能化（表面技術協会）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/tokubetsu"},{"label":"2026 特別討論会 B-5〜B-7","value":"接着・粘着、ゴム・エラストマー / コロイド・ナノ材料の新規合成と機能創出 / 水系ゲル化剤・増粘剤の化学と機能","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/tokubetsu"},{"label":"2026 特別討論会 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特別討論会の条件","value":"既発表の成果を含みつつ主題に沿った討論ができる内容","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/submission"},{"label":"2026 表彰の応募方法","value":"色材部門・電気化学部門は個別応募、高分子・有機化学・油化学・物理化学/無機化学・分析化学・生体関連化学は申込時のフォームで選択","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/submission"},{"label":"2026 B-1 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名古屋工業大学","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/rireki_shukitaikai"},{"label":"第54回（2023）","value":"2023-11-11〜12 / 三重大学","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/rireki_shukitaikai"},{"label":"第53回（2022）","value":"2022-11-05〜06 / オンライン開催（世話大学：愛知工業大学）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/rireki_shukitaikai"},{"label":"第52回（2021）","value":"2021-10-30〜31 / オンライン開催（静岡大学）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/rireki_shukitaikai"}],"title":"沿革と開催地","eyebrow":"history"},"program":{"id":"program","body":"初日10月31日の15:40と16:45から総合講演が2件あり、参加登録なしで一般の人も聴講できます。特別討論会B-1では、東京大学の金井求氏と東北大学の寺田眞浩氏の招待講演が予定されています。懇親会は同日17時45分から豊田講堂・シンポジオンで開かれます。","facts":[{"label":"2026 総合講演（1）","value":"阿部 洋（名古屋大学 教授）「核酸化学が切り拓くmRNA医薬の最前線」10月31日 15:40〜16:40","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/programtime"},{"label":"2026 総合講演（2）","value":"林 高史（日本化学会副会長、大阪大学 教授）「化学者が扱うタンパク質改変の一例：人工金属酵素をめざして」10月31日 16:45〜17:45","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/programtime"},{"label":"2026 総合講演の公開範囲","value":"参加登録なしで一般の方も聴講可","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/programtime"},{"label":"2026 B-1 招待講演","value":"金井 求（東京大学）、寺田 眞浩（東北大学）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/tokubetsu"},{"label":"2026 懇親会","value":"10月31日 17時45分〜 豊田講堂・シンポジオン","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/outline"}],"title":"総合講演・特別討論会・併設","eyebrow":"program"},"audience":{"id":"audience","body":"学生の参加登録費は4,000円（予約締切以降は5,000円）です。B-1では学生または満40歳未満の希望者が有機合成化学協会東海支部のVIP賞の対象になり、B-7では学生が色材協会中部支部の奨励賞の対象です。企業の調査担当者は、総合講演を登録なしで聴講でき、Confitで過去プログラムを横断検索できます。特許出願前の発表では、中化連が特許法第30条の指定学術団体ではない点を事前に押さえておく必要があります。","facts":[{"label":"2026 学生参加費","value":"学生 4,000円（予約締切以降 5,000円）","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/outline"},{"label":"2026 B-1 VIP賞","value":"学生または満40才未満の希望者が有機合成化学協会東海支部VIP賞の表彰対象","checkedAt":"2026-10-08","sourceUrl":"https://pub.confit.atlas.jp/ja/event/chukaren57/content/submission"},{"label":"2026 B-7 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Awardも設けられています。","question":"学生向けの支援はありますか。","sourceUrls":["https://www.dfts.org/grants.htm","https://www.dfts.org/cfp.htm"]}],"headline":"第39回DFTS 2026は2026年9月30日〜10月2日にローマのChiostro di San Pietro in Vincoliで開かれ、Siemens EDAとSynopsysの基調講演を含む3日間のプログラムが組まれました。","metaDescription":"IEEE DFTS（Defect and Fault Tolerance in VLSI and Nanotechnology Systems）の2026年第39回ローマ大会について、14の対象トピック、6頁・4頁の論文区分、3名以上の査読、IEEE Computer Societyのproceedings、1988年からの開催地を公式サイトの記載からまとめました。","oneLine":"DFTSは、VLSIとナノ技術システムの製造欠陥と動作中の故障に対する設計・テスト・信頼性・セキュリティを扱う、年1回のIEEEシンポジウムです。","pageTitle":"DFTSとは｜VLSIとナノ技術システムの欠陥・故障耐性を扱うIEEEシンポジウム","relatedConferenceIds":["iolts","asian-test-symposium","ets","vts","itc","radecs"],"sections":{"cycle":{"id":"cycle","body":"DFTS 2026は2026年9月30日（水）から10月2日（金）まで、イタリア・ローマで開かれました。会場はコロッセオから徒歩約3分のChiostro di San Pietro in Vincoli（Sapienza Università di Roma）です。現地開催で、採択論文ごとに著者1名の参加と発表が必要です。","facts":[{"label":"2026 会期・都市","value":"2026-09-30〜10-02 / Rome, 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Society"}],"lastVerified":"2026-10-22","paperDeadline":"2026-07-31","currentCycleEnd":"2026-10-16","peerReviewStatus":"program-committee-selected","currentCycleStart":"2026-10-14","finalPaperDeadline":"2026-09-15","canonicalId":"conf_a4c61df20f4f4c9fbabff6a119c1e2c4","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-08-05","conferenceId":"iemt","confidenceScore":1,"coverage":{"faqCount":8,"factCount":87,"topicCount":8,"sourceCount":20,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年10月14日から16日までの3日間、マレーシア・PutrajayaのLe Méridien Putrajayaで第41回として開催されます。Locationページでは会場からKuala Lumpur International Airportまで24kmと案内され、参加者向けの特別レート客室が確保されていると記載されています。online参加やhybrid開催に関する記載はありません。","question":"IEMT 2026はいつ・どこで開催されますか。","sourceUrls":["https://iemt.com.my/","https://iemt.com.my/location/"]},{"answer":"2026年サイクルはabstract提出が2026年4月30日、採否通知が6月3日、full manuscript提出が7月31日、改訂稿(Full Manuscript (Revisions Completed) Submission)の提出が9月15日と公式CFPに掲載されています。abstractは最大200語で、purpose、methodology、results、conclusionsを書くよう指示されています。投稿はConfTool(https://www.conftool.pro/iemt2026/)から行います。","question":"投稿の締切はいつですか。","sourceUrls":["https://iemt.com.my/authors/call-for-paper/"]},{"answer":"公式CFPが査読に言及しているのは、Emerald Publishing社Microelectronics International誌の特集号に招待された拡張版が「full peer review」を受けるという箇所です。会議本体についてはabstractの採否通知とfull manuscript・改訂稿の提出段階が示されるだけで、double-blindなどの査読方式や査読者数は公表されていません。","question":"査読はありますか。査読方式は公開されていますか。","sourceUrls":["https://iemt.com.my/authors/call-for-paper/"]},{"answer":"採択率は公表されていません。2026年サイクルのCall for Paperにも2024年サイクルのCall for Paperにも、投稿件数・採択件数・採択率の記載はありません。投稿判断の材料としては、abstractの200語制限と記載要件、そして4段階の締切だけが公式に示されています。","question":"採択率は公表されていますか。","sourceUrls":["https://iemt.com.my/authors/call-for-paper/","https://2024.iemt.com.my/authors/call-for-paper/"]},{"answer":"スポンサー特典の記述からsoftcopy proceedingが作成されることは読み取れますが、IEEE Xploreへの収録を明示した文は2026年サイクルの公式ページにはありません。会議発表から論文誌へ進む経路としては、Emerald Publishing社Microelectronics International誌の特集号「Advanced Interconnects, Packaging Materials and Reliability in Microelectronics」への招待が案内されています。収録先を確定させたい場合はsecretariatへの照会が必要です。","question":"発表した論文はどこに掲載されますか。IEEE Xploreに載りますか。","sourceUrls":["https://iemt.com.my/sponsor/","https://iemt.com.my/authors/call-for-paper/","https://iemt.com.my/contact-support/"]},{"answer":"Conference Onlyの早期登録はIEEE MemberがMYR 1500、Non-IEEE MemberがMYR 1700、Speaker (author only)がMYR 1000、StudentがMYR 500です。Professional Development Courseを含むConference + PDCは早期でIEEE Member MYR 2400、Student MYR 800となります。早期登録の期限は2026年9月1日で、10名分の支払いで1名無料などのグループ割引も設定されています。","question":"参加費はいくらですか。学生割引はありますか。","sourceUrls":["https://iemt.com.my/conference-cost/"]},{"answer":"運営はIEEE EPS Malaysia Chapterで、2026年サイクルの委員会にはGeneral Chair(Dr. Eu Poh Leng)以下、Program、Publication Chair、Technical Committee、Student Eventなどの役職が並びます。委員の所属機関は掲載されていません。2024年サイクルのスポンサー・出展者一覧にはAmkor Technology、Intel、Micron、NXP Semiconductors、STMicroelectronics、ASMPTなどが掲載されていますが、これは協賛・出展の事実を示すものです。","question":"誰が運営していて、どんな企業が関わっていますか。","sourceUrls":["https://iemt.com.my/organizing-committee/","https://2024.iemt.com.my/sponsor/"]},{"answer":"公式サイトの案内は英語で、Contact & Supportページに日本語の案内や日本国内の窓口はありません。照会はsecretariatメール、投稿はConfToolを通じて行います。参加費はMYR建てで、トップページのHRD Corp Claimable表示はマレーシアの登録雇用主向けの制度に関するものです。プログラムや登壇者は2026年8月5日時点で未公開のため、出張計画は会期と締切から先に固める形になります。","question":"日本から参加・投稿する場合に注意する点はありますか。","sourceUrls":["https://iemt.com.my/contact-support/","https://iemt.com.my/conference-cost/","https://iemt.com.my/program/agenda/"]}],"headline":"IEMT公式サイト(2026/2024/2022各サイクル)とIEEE EPS Malaysia Chapterの公式ページから、会期・投稿手順・出版経路・過去回の開催地を読み取れる範囲でまとめました。","metaDescription":"IEMT(International Electronics Manufacturing Technology Conference)の公式情報です。2026年10月14〜16日の第41回開催、abstract 200語からの投稿手順と締切、参加費、委員会、過去回の開催地を公式ページの記載だけで追えます。","oneLine":"IEMTは、IEEE EPS Malaysia Chapterが運営している電子実装・電子製造技術の国際会議で、2026年は第41回としてマレーシア・Putrajayaで開かれます。","pageTitle":"IEMTとは|IEEE EPS Malaysia主催の電子製造技術国際会議 2026年は第41回・Putrajaya開催","relatedConferenceIds":["eptc","icept","impact-iaac","imaps-symposium","estc","3dic"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルは3日間の現地開催で、会場は2022年(第39回)と同じLe Méridien Putrajayaです。トップページには規模の予告値が並びますが、これは実績値ではなく告知値として読んでください。次サイクル(2028年)の会期・都市は公式サイトに掲載されていません。","facts":[{"note":"トップページに「3 Days Conference」と併記。","label":"2026 会期","value":"October 14-16, 2026(3日間)","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"label":"2026 都市・国","value":"Putrajaya, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"note":"Locationページでは「Le Méridien Putrajaya」、トップページでは「Le Méridien, Putrajaya, Malaysia」と表記。","label":"2026 会場","value":"Le Méridien Putrajaya","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/location/"},{"note":"Locationページは会場からKuala Lumpur International Airportまで24kmと記載。","label":"2026 開催形式","value":"会場・宿泊・空港からの距離など現地開催の案内のみ。online参加やhybrid開催の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/location/"},{"label":"2026 宿泊","value":"「The Organizing Committee of IEMT 2026 have secured a number of rooms at Le Méridien Putrajaya Hotel with special rates for IEMT 2026 attendees.」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/location/"},{"note":"トップページの数値ブロック。実績報告ではなく告知表示。","label":"2026 規模の告知値","value":"24+ Exhibitors / 5+ Keynote Speakers / 6 Professional Development Courses / 2 Panel Discussions","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"label":"2026 早期登録期限","value":"1st September 2026","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"note":"2026年8月5日時点でトップページに2026年より後の開催回の告知はない。","label":"次サイクル(2028年)","value":"会期・都市・会場とも公式サイトに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"}],"title":"2026年サイクルの会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2026年CFPは6本の技術領域に再編されており、2D/3D・heterogeneous integration・chipletsから、power electronics、AI/HPC向け実装、interposerとPCB、材料とサステナビリティ、interconnect/信頼性/製造までを1本のCFPで受けています。2024年サイクルは11項目の細分トラックだったため、投稿先の見出しは年度ごとに読み直してください。対象外領域を明示した記述は公式CFPにありません。","facts":[{"label":"2026 技術領域(1)","value":"Advanced and Emerging Packaging & 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Advanced PCB Technologies: Organic, glass, and silicon interposers, advanced laminates, HDI PCBs, embedded components, RF/mmWave/THz and antenna-in-package solutions, and system/package/PCB co-design.","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"label":"2026 技術領域(5)","value":"Materials, Processes, and Sustainability: Novel and eco-friendly materials, low-carbon and green manufacturing, recyclability, life-cycle assessment, circular-economy approaches, materials for harsh environments, advanced interconnects, and additive manufacturing.","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"label":"2026 技術領域(6)","value":"Interconnections, Modelling, Reliability, and Manufacturing: Advanced interconnect and bonding technologies, multiphysics modelling, thermal/electrical/mechanical characterization, quality and failure analysis, optoelectronics and photonics packaging; smart manufacturing, advanced metrology, and AI/ML-enabled packaging equipment.","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"label":"2026 想定応用市場","value":"「telecommunications, data centers, automotive and EV, healthcare, aerospace, defense」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"2024年サイクルCFPの表記。2026年サイクルとは見出しの粒度が異なる。","label":"2024 トラック構成(参考)","value":"Advanced Packaging (2D, 2.5D, 3.0D, Chiplets, WLCSP, FOWLP, FOPLP & HI) / Thermal・Mechanical・Electrical Simulation & Characterization / Material & Processing / Emerging Packaging (Opto, Medical, Wide Bandgap Electronics, Nano Technology, Wearable Electronics) / Interconnections Technologies (TSV, µ-bump, hybrid bond, FC and embedded) / LED, MEMS, NEMS & Sensor Packaging & IoT / IC Testing Technology / Surface Mount Technology / Quality, Reliability & Failure Analysis / High-Speed, Wireless & Components / Cryogenic and High Temperature Packaging Technology の11項目","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/authors/call-for-paper/"},{"label":"明示された対象外","value":"投稿対象外の技術領域を列挙した節は2026年CFPに置かれていない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"公式CFPが明示している査読は、会議後にEmerald Publishing社の特集号へ招待された拡張版に対するfull peer reviewです。会議本体については、abstract提出→採否通知→full manuscript提出→改訂稿提出という段階だけが示され、double-blindなどの査読方式や査読者数は公表されていません。採択率も公表されていないため、投稿計画では締切とabstractの記載要件を基準にしてください。","facts":[{"label":"2026 選考の流れ","value":"Closing of Abstract Submission → Notification of Abstract Acceptance → Full Manuscript Submission → Full Manuscript (Revisions Completed) Submission の4段階を提示","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"査読者数、スコアリング基準の記載もない。","label":"2026 会議本体の査読方式","value":"double-blind / single-blind など査読方式の明示はCFPにない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"CFPがabstractについて示している要件はこの記述のみで、採点基準は別掲されていない。","label":"2026 abstractの記載要件","value":"purpose / methodology / results / conclusions を明確に述べること(resultsにはdata, drawings, graphs and photographsを含めてよい)","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"full peer reviewはEmerald特集号への投稿に対する記述であり、会議本体の査読方式を述べたものではない。","label":"特集号側の査読","value":"「Selected papers from the IEMT conference will be invited to submit extended full versions to this Special Issue, with all submissions undergoing full peer review.」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"2024年サイクルのCall for Paper(https://2024.iemt.com.my/authors/call-for-paper/)にも記載はない。","label":"採択率","value":"2026年サイクルのCall for Paperに投稿件数・採択件数・採択率の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"2024年サイクルCFPの記載。","label":"2024 投稿物の条件","value":"「Abstract should include original and previously unpublished, non-confidential and non-commercial information」","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/authors/call-for-paper/"}],"title":"選考と査読の公表範囲","eyebrow":"review"},"caveats":{"id":"caveats","body":"このページが対象とするのは、2026年・2024年・2022年の各公式サイトとIEEE EPS Malaysia Chapterのページに書かれている内容だけです。公式が公表していないのは、投稿件数と採択率、原稿のページ数上限と発表時間、oral/posterの割り当て方針、IEEE Xplore収録の有無、proceedingsの公開範囲、初回開催年と第34回以前の開催地、2026年のセッション構成・基調講演者・PDCの科目名・パネルのテーマ、委員の所属機関、参加者数と所属国の内訳、そして2028年の会期・都市です。IEEE EPS Malaysia Chapterの過去イベント一覧は第35回(2012年)以降のマレーシア開催回のみで、Santa Clara側で開催された回は含まれていません。数値や日付を引用する際は、必ずサイクル年と出典ページをセットで記録してください。","facts":[{"note":"引用時はどちらのページを見たかを併記する。","label":"2024 会期表記の不一致","value":"2024年サイクル公式サイトは「16-18 Oct 2024」、IEEE EPS Malaysia Chapterの過去イベント一覧は「15th - 18th October 2024」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"label":"会場名の表記揺れ","value":"トップページは「Le Méridien, Putrajaya, Malaysia」、Locationページは「Le Méridien Putrajaya」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/location/"},{"note":"Agendaページは2026年8月5日時点で「Loading...」表示のみ。","label":"2026 未公開のプログラム情報","value":"セッション構成、基調講演者名、PDCの科目名、パネルのテーマはいずれも未掲載","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/program/agenda/"},{"label":"2026 未公開の投稿仕様","value":"原稿ページ数上限、oral/posterの割り当て方針、発表時間はConference Templatesページに記載がない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/conference-templates/"},{"note":"委員会ページにも所属機関の記載がないため、国別構成はこのページでは示せない。","label":"参加者の所属国","value":"参加者や登壇者の所属国の内訳は公式ページに掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"note":"同一覧は第35回(2012年)以降のマレーシア開催回のみを掲載。","label":"Santa Clara開催回","value":"Santa Clara側で開催された回の会期・プログラムはIEEE EPS Malaysia Chapterの過去イベント一覧に含まれていない","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"}],"title":"未公開項目と表記の揺れ","eyebrow":"caveats"},"history":{"id":"history","body":"IEEE EPS Malaysia Chapterの過去イベント一覧に第35回(2012年)から第40回(2024年)までの開催回・会期・会場が並んでおり、いずれもマレーシア国内で開かれています。第38回(2018年)の次は第39回(2022年)で、2020年サイクルはCOVID-19の影響で延期が告知されました。初回開催年および第1回から第34回までの開催地は公式ページに掲載されていません。","facts":[{"label":"第35回(2012年)","value":"November 6 – November 8 2012 / Kinta Riverfront Hotel, Ipoh, Perak, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"label":"第36回(2014年)","value":"November 11 – November 13 2014 / Renaissance Hotel, Johor Bahru, Johor, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"label":"第37回(2016年)","value":"September 20 – September 22 2016 / G Hotel, Penang, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"label":"第38回(2018年)","value":"September 4 – September 6 2018 / Ramada Plaza Melaka","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"note":"2022年サイクル公式サイトの表記。IEEE EPS Malaysia Chapterの過去イベント一覧は「19th - 21th October 2022」。","label":"第39回(2022年)","value":"19th – 21st Oct 2022 / Le Méridien, Putrajaya, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://2022.iemt.com.my/"},{"note":"2024年サイクル公式サイトの表記。IEEE EPS Malaysia Chapterの過去イベント一覧では「15th - 18th October 2024」と記載されており、日付表記が一致しない。","label":"第40回(2024年)","value":"16-18 Oct 2024 / G-Hotel, Penang, Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/"},{"note":"2022年サイクル公式サイトに掲載された経緯。","label":"2020年サイクルの延期","value":"COVID-19を理由に「postpone the IEMT 2020 conference to next year (Sept 2021)」と告知","checkedAt":"2026-08-05","sourceUrl":"https://2022.iemt.com.my/"},{"note":"掲載されている6回はすべてマレーシア国内の会場。","label":"一覧の収録範囲","value":"過去イベント一覧に載る最も古い回は第35回(2012年)で、Santa Clara開催回は含まれていない","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/events-activities/past-events/iemt-conferences/"},{"note":"「IEMT is an established International conference of long standing organized by the Electronic Packaging Society (EPS) of IEEE.」という定性的な表現のみ。","label":"初回開催年","value":"公式サイトおよびIEEE EPS Malaysia Chapterのページに初回開催年の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"},{"note":"「Past IEMT Conference」メニューからのリンク。","label":"過去サイクルのアーカイブ","value":"2022年サイクル(https://2022.iemt.com.my/)と2024年サイクル(https://2024.iemt.com.my/)の公式サイトが現行サイトから参照できる","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/gallery/"}],"title":"開催回と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"2026年サイクルのagendaとspeakerの各ページは本日時点で「Loading...」表示のみで、セッション名も登壇者も公表されていません。トップページの告知では基調講演5件以上、Professional Development Course(PDC)6本、パネル2本、出展24社以上が予定されています。PDCは参加登録の区分としても独立しており、Conference + PDCの登録には「200 pax (Limited by PDC)」の注記が付いています。","facts":[{"note":"2026年8月5日時点で本文は「Loading...」表示のみ(Powered By Whova)。","label":"2026 agenda公開状況","value":"Agendaページに日程表・セッション名は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/program/agenda/"},{"note":"2026年8月5日時点で本文は「Loading...」表示のみ。","label":"2026 speaker公開状況","value":"Speakerページに登壇者名・所属・講演題目は掲載されていない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/program/speaker/"},{"note":"トップページの告知ブロック。","label":"2026 予定構成","value":"5+ Keynote Speakers / 6 Professional Development Courses / 2 Panel Discussions / 24+ Exhibitors","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"note":"Conference + PDCの組み合わせ登録に付された注記。","label":"2026 PDC定員","value":"「200 pax (Limited by PDC)」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"note":"企画内容そのものは公表されていない。","label":"2026 学生向け企画の担当","value":"委員会にStudent Eventの担当が設けられている","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"note":"GoldとSilverの区分には展示スペースの記載がない。","label":"2026 展示","value":"Platinum・Diamond・Exhibitorの各区分に「Complimentary 1 table & chairs exhibition space for you to showcase your company product.」が含まれる","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/sponsor/"},{"note":"第36回(2014年)についてIEEE EPS Malaysia Chapterが掲載した記述。2026年サイクルの規模を示すものではない。","label":"2014 プログラム構成(参考)","value":"「IEMT 2014 had a total of 9 keynotes, 5 short-courses and 4 parallel sessions (> 80 technical papers & posters)」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"}],"title":"プログラム構成と併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"学生区分はConference Onlyの早期登録でMYR 500と設定されており、金額面の負担は他区分より小さくなっています。企業側は10名・20名単位のグループ割引とスポンサー区分が用意されているため、出展と発表を組み合わせた参加設計を組めます。マレーシアの登録雇用主向けにはHRD Corp Claimableの表示があり、費用計上の可否は自社の経理規程で判断してください。","facts":[{"label":"2026 参加費(Conference Only)","value":"IEEE Member 早期MYR 1500・通常MYR 1800 / Non-IEEE Member 早期MYR 1700・通常MYR 2000 / Speaker (author only) 早期MYR 1000・通常MYR 1300 / Student 早期MYR 500・通常MYR 600","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"label":"2026 参加費(Conference + PDC)","value":"IEEE Member 早期MYR 2400・通常MYR 3000 / Non-IEEE Member 早期MYR 2700・通常MYR 3300 / Speaker (author only) 早期MYR 1500・通常MYR 2100 / Student 早期MYR 800・通常MYR 1000","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"label":"2026 参加費(PDC Only)","value":"IEEE Member 早期MYR 1100・通常MYR 1400 / Non-IEEE Member 早期MYR 1200・通常MYR 1500 / Speaker (author only) 早期MYR 700・通常MYR 1000 / Student 早期MYR 400・通常MYR 500","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"label":"2026 グループ割引","value":"「Pay 10 seats, get 1 free seat. Total: 11 seats」「Pay 20 seats, get 3 free seats. Total: 23 seats」","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"},{"label":"2026 HRD Corp","value":"マレーシアの登録雇用主向けに「HRD Corp Claimable」と表示","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"label":"2026 想定投稿者","value":"「researchers and industry professionals」「academics and industry participants」に向けて投稿を呼びかけ","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"電話番号と郵送先住所の記載はない。渡航関連はEntry Requirementsの外部リンクを掲載。","label":"日本からの参加","value":"Contact & Supportページに日本語の案内や日本国内の窓口はなく、掲載されているのはsecretariatメールのみ","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/contact-support/"}],"title":"研究室・企業からの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"IEMTは略称で、公式表記は開催回の序数を含む長い名称です。運営はIEEE EPS Malaysia Chapterで、過去回ではIEEE Santa Clara Valley Chapterの共催・技術協賛が掲載されています。投稿前の照会先は公式サイトのsecretariatメールに一本化されています。","facts":[{"note":"トップページのイベント名表記。","label":"2026 正式名称","value":"41st International Electronics Manufacturing Technology (IEMT) Conference 2026","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"note":"名称に序数が含まれる。","label":"2026 第N回","value":"第41回(41st)","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"note":"トップページの紹介文に記載。フッターは「Copyright © 2026 IEEE EPS Malaysia Chapter – All Rights Reserved」。","label":"2026 主催","value":"Organised by IEEE EPS Malaysia","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/"},{"note":"2024年サイクル公式サイトの記載。","label":"2024 共催","value":"IEEE EPS Malaysia Chapter が主催し、IEEE Santa Clara Valley Chapter が co-sponsorship","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/"},{"note":"2022年サイクル公式サイトの記載。","label":"2022 技術協賛","value":"IEEE EPS Santa Clara Valley Chapter および IEEE Malaysia Section の technical co-sponsorship","checkedAt":"2026-08-05","sourceUrl":"https://2022.iemt.com.my/"},{"note":"IEEE EPS Malaysia Chapterの第36回(2014年)ページの記述をそのまま引用。同チャプターの過去イベント一覧に載る第35回(2012年)から第40回(2024年)はいずれもマレーシア開催で、Santa Clara開催回は含まれていない。2026年サイクルの公式サイトにこの記述はない。","label":"開催頻度(2014年ページの記述)","value":"「IEMT is the flagship conference from IEEE Santa Clara which EPS Malaysia now hosts once every two years, alternating between Santa Clara and Malaysia.」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"},{"note":"IEEE EPS Malaysia Chapterが第36回(2014年)について掲載したページの表現をそのまま引用。","label":"公式による位置づけ(2014年ページの記述)","value":"「premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"},{"note":"電話番号と郵送先住所の掲載はない。","label":"2026 問い合わせ窓口","value":"IEEE EPS Malaysia Chapter のsecretariatメールアドレスをContact & Supportページに掲載","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/contact-support/"}],"title":"正式名称と主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年サイクルの委員会名簿は役職と氏名のみで、所属機関は掲載されていません。所属を調べる場合は各回のプログラムやEPS Malaysia Chapterの活動報告に当たる必要があります。2024年サイクルのスポンサー・出展者一覧には半導体製造・実装関連の企業名がtier別に並んでいますが、これは出展・協賛の事実を示すもので、取引関係や共同研究を示すものではありません。","facts":[{"note":"Co-ChairはProf. Wong Yew Hoong。","label":"2026 General Chair","value":"Dr. Eu Poh Leng","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"label":"2026 Publication Chair","value":"Dr. Siow Kim Shyong","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"note":"Technical Committeeは10名。","label":"2026 委員会の構成","value":"General Chair、Co-Chair、Secretariat、Co-Secretariat、Treasurer、Co-Treasurer、Program、Sponsor & Exhibition、Logistics & Social Tour、Publication Chair、Publicity Chair、International Liaison、Technical Committee、Student Event、Advisor の各役職を掲載","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"note":"産学の別も同ページからは判別できない。","label":"2026 委員の所属表記","value":"委員会ページに所属機関(大学名・企業名)の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/organizing-committee/"},{"note":"2026年8月5日時点で個別の企業名は掲載されていない。","label":"2026 協賛区分と金額","value":"Platinum RM30,000 / Diamond RM25,000 / Gold RM20,000 / Silver RM15,000 / Exhibitor RM15,000","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/sponsor/"},{"note":"協賛の事実を示す掲載。取引・採用・共同研究を示すものではない。","label":"2024 Platinum Sponsor一覧","value":"Amkor Technology / Crest / Dou Yee / Hi Tech Instrument / Indium Corporation / Intel / Keteca / Leadlap / MacDermid Alpha / Micron / NXP Semiconductors / QES / STMicroelectronics / UTAC Group / Zestron","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/sponsor/"},{"note":"出展の事実を示す掲載。同ページにはDiamond(3S Silicon Tech / Delo / Kyzen / PacTech / TELTEC / TF AMD)、Gold(QDOS)、Silver(AdvanTek / Infineon / Kulicke & Soffa / Mi Equipment)の区分もある。","label":"2024 Exhibitor一覧","value":"ASMPT / Integrated Service Technology / Isodynamique / Novaciq Scientific / NSW / Quasi-S / Sympony 3e / TSC / Worley Consulting / YOLE Group","checkedAt":"2026-08-05","sourceUrl":"https://2024.iemt.com.my/sponsor/"},{"note":"第36回(2014年)についてIEEE EPS Malaysia Chapterが掲載した数値。2026年サイクルの規模ではない。","label":"2014 参加規模(参考)","value":"「20 exhibitors and 50 companies with total participants of more 400 people」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"}],"title":"委員会と支援企業","eyebrow":"community"},"comparison":{"id":"comparison","body":"IEMTの主催はIEEE EPS Malaysia Chapterで、IEEE EPS Malaysia Chapterが第36回(2014年)について掲載したページには「the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems」に軸足があると書かれています。ただし2026年サイクルの公式サイトに同じ位置づけの文はなく、運営形態や開催頻度を他会議と比べる際は各年の公式ページで確認してください。同じ実装分野の会議と突き合わせる観点は、開催地・開催間隔・運営主体・製造工程側かデバイス側かの4点です。relatedConferenceIdsに挙げた各会議の会期や投稿要件は、それぞれの公式ページに当たる前提です。","facts":[{"note":"IEEE EPS Malaysia Chapterが第36回(2014年)について掲載したページの表現。2026年サイクルの公式サイトに同じ文はない。","label":"対象の重心(2014年ページの記述)","value":"「devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems」","checkedAt":"2026-08-05","sourceUrl":"https://www.ieee-epsmalaysia.org/iemt_conference/36th-international-electronics-manufacturing-technology-iemt-conference-2014/"},{"note":"Diamond Sponsorにも「Eligible to have one Invited Speaker」がある。協賛区分と発表枠が結びついている点は投稿計画時に確認する項目。","label":"産業側の組み込み","value":"Platinum Sponsorの特典に「Eligible to have one invited speaker」と「10 minutes sharing at INDUSTRY ENGAGEMENT SESSION with final year undergraduates, Q&A & Resume submission」が含まれる","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/sponsor/"},{"label":"教育プログラムの比重","value":"Professional Development Courseだけを対象にした登録区分(PDC Only)が用意されている","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/conference-cost/"}],"title":"近接する会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿はabstract(最大200語)を先に出し、採否通知を受けてからfull manuscriptを提出する二段構えです。投稿窓口はConfToolで、年度ごとに専用インスタンスが用意されます。full paper・oral・posterのテンプレートは配布されていますが、原稿のページ数上限は公式ページに書かれていないため、Full Paper Submission GuideとFull Paper Templateの中身を各自で開いてください。","facts":[{"note":"「Abstract is limited to of maximum 200 words and clearly state the purpose, methodology, results (which can include data, drawings, graphs and photographs) and conclusions of the work.」","label":"2026 投稿区分","value":"abstract(最大200語)を提出し、採否通知後にfull manuscriptを提出","checkedAt":"2026-08-05","sourceUrl":"https://iemt.com.my/authors/call-for-paper/"},{"note":"Important Datesの行名は「Closing of Abstract 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はいつ、どこで開催されますか。","sourceUrls":["https://www.icsict.org/index.html","https://www.icsict.org/Ven.html","https://www.icsict.org/Tutorial.html"]},{"answer":"Important Dates ページでは Full Paper Submission Deadline が August 06, 2026 (Firm)、Notification of Full Paper Acceptance が September 06, 2026、Final Paper Submission が October 06, 2026 です。Special Session Paper の締切は September 15, 2026 と別枠で掲載されています。competition の日程は competition ページと Important Dates ページで異なる日付が出ているため、Important Dates ページ側を確認してください。","question":"2026年の論文締切と採択通知はいつですか。","sourceUrls":["https://www.icsict.org/dates.html","https://www.icsict.org/competition.html"]},{"answer":"Submission ページに「All submissions will be peer-reviewed by at least two experts in the field.」と記載があり、2名以上の専門家による査読が行われます。匿名査読かどうか、審査観点の項目については公式サイトに記載がなく、Submission & Review 配下の Review ページは2026-08-05時点で「Coming Soon!」の表示だけです。","question":"査読はありますか。double-blind ですか。","sourceUrls":["https://www.icsict.org/Submission.html","https://www.icsict.org/Review.html"]},{"answer":"採択率は公表されていません。投稿数や採択数を掲載するページも公式サイトには見当たらず、過去サイクルの数値も出ていません。通過見込みを数値で見積もる材料は、公式情報の範囲では手に入りません。","question":"採択率は公表されていますか。","sourceUrls":["https://www.icsict.org/Submission-Review.html"]},{"answer":"最小3ページ、最大10ページの double-column で、references・tables・figures を含めた分量です。推奨は3ページと書かれています。英語で執筆し、Paper Format ページで配布される ICSICT_PaperTemplate.doc を使って PDF または DOC 形式で提出します。既発表の論文や他所で同時に審査中の論文は投稿対象外と明記されています。","question":"論文は何ページ書けばよいですか。書式の指定はありますか。","sourceUrls":["https://www.icsict.org/PaperFormat.html","https://www.icsict.org/Submission.html"]},{"answer":"公式サイトには「Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.」とあり、IEEE Xplore への提出予定という書き方です。proceedings は EI Compendex と Scopus への索引提出予定と別文で記載されています。発表者が現れなかった論文は proceedings から除外されるため、現地発表が収録の前提になります。","question":"採択された論文はどこに載りますか。","sourceUrls":["https://www.icsict.org/index.html","https://www.icsict.org/PaperFormat.html"]},{"answer":"Registration Form ページの料金表は Before Sept. 30, 2026 と After Sept. 30, 2026 の2列です。Before は IEEE or IET member 3,500 CNY / 520 USD、Non-member 3,800 CNY / 565 USD、Student 2,700 CNY / 400 USD。After はそれぞれ 3,800 CNY / 565 USD、4,100 CNY / 610 USD、3,000 CNY / 445 USD になります。登録費には全技術セッションへの参加、conference materials、coffee breaks、welcome reception、banquet が含まれ、追加ページは1ページ350 CNY / 52 USD、冊子体 proceedings は500 CNY / 75 USD です。","question":"参加費はいくらですか。","sourceUrls":["https://www.icsict.org/RegistrationForm.html"]},{"answer":"2026年サイクルの Technical Program Committee Chairs に Haruo Kobayashi（Gunma University, Japan）が入っています。Technical Program Committees ページには members の氏名と所属が並び、affiliation の所在地としては China のほか Canada、South Korea、Singapore、United States、Hong Kong, China、Macau, China が現れます。人数の内訳、日本からの投稿数や参加者数は公式サイトに掲載されていません。ここに挙げた国名は公式ページに印字された affiliation の所在地です。","question":"日本から関わっている人はいますか。日本からの投稿数はわかりますか。","sourceUrls":["https://www.icsict.org/Committees.html","https://www.icsict.org/tp.html"]}],"headline":"公式サイトのImportant Dates、Scope、Committees、Historyを直接読み、2026年サイクルで確認できた記載だけを並べました。","metaDescription":"ICSICTの2026年サイクルを公式サイトから確認します。第18回は2026年10月27〜30日に中国・杭州で開催、12トラック構成、論文締切は2026年8月6日、査読は2名以上の専門家、採択論文はIEEE Xploreへの提出予定と記載されています。","oneLine":"ICSICTは、正式名称に IEEE を冠し、公式サイトの History ページに1986年からの開催記録が並ぶ固体素子・集積回路技術の国際会議です。","pageTitle":"ICSICTとは｜固体素子・集積回路技術の国際会議、2026年は杭州で第18回、会期と投稿締切と掲載先を公式サイトで確認する","relatedConferenceIds":["edssc","asicon","a-sscc","ssdm","esserc"],"sections":{"cycle":{"id":"cycle","body":"2026年サイクルは10月27〜30日の4日間で、初日の10月27日午後に tutorial 枠が置かれています。会場は杭州市蕭山区のホテルが Venue ページに単独で掲載されており、渡航・宿泊の手配はこの住所を起点に組めます。オンライン参加や次回サイクルの情報は掲載されていないため、参加可否の判断は現地開催前提で進めることになります。","facts":[{"note":"トップページの開催告知文","label":"2026 会期","value":"Oct. 27 - 30, 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で止まっている","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"}],"title":"2026年サイクルの会期・会場・開催形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"Scope ページは4つの Theme の下に Track 1〜12 を並べる二段構成で、各トラックにはさらに4〜6行の研究方向が箇条書きされています。digital 回路と analog 回路、デバイス、プロセス、パッケージが同じ会議の中に並列で置かれている点が、この構成から読み取れます。自分のテーマがどのトラックに入るか迷う場合は、Track Chairs ページで各トラックの担当者の所属分野まで見てから決められます。","facts":[{"note":"Scope ページのトラック一覧の直前の文","label":"2026 投稿対象の前置き","value":"「paper submissions are solicited in, but not limited to the following areas」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Scope.html"},{"note":"各 Theme の下に3トラックずつ配置","label":"2026 Theme 構成","value":"Theme 1: Digital & System Level IC / Theme 2: Analog / Theme 3: Devices / Theme 4: Process & Technologies","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Scope.html"},{"note":"Scope ページのトラック一覧","label":"2026 トラック（Theme 1・2）","value":"Track 1 Digital Architectures & Systems / Track 2 Digital Circuits / Track 3 Design Methodology & EDA / Track 4 RF & Wireless / Track 5 Wireline / Track 6 General Analog","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Scope.html"},{"note":"Scope ページのトラック一覧","label":"2026 トラック（Theme 3・4）","value":"Track 7 CMOS Logic Devices & Sensors / Track 8 Power Devices & Power IC / Track 9 Device Reliability & Security / Track 10 Semiconductor Process Technologies / Track 11 Optoelectronics and Silicon Photonics Integration / Track 12 Packaging Technologies","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Scope.html"},{"note":"Scope ページと Track Chairs ページの双方で Track 1〜12 の番号が印字されている","label":"2026 トラック数","value":"12トラック（Track 1 から Track 12 まで番号が振られている）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/track_chairs.html"},{"note":"前置きが but not limited to であることのみ確認できる","label":"対象外領域の明示","value":"未掲載。Scope ページには除外領域を示す記述がない","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Scope.html"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"査読は「2名以上の専門家による peer review」とだけ書かれており、匿名査読かどうかや審査観点の項目は公式サイトに載っていません。Submission & Review 配下の Review ページは2026-08-05時点で「Coming Soon!」の一行だけです。審査体制は Committees、Technical Program Committees、Track Chairs の3ページに氏名と所属が並びますが、人数を示す数値は公式サイトのどこにも印字されていません。採択率も公表されていないため、通過見込みを数字で見積もることはできません。","facts":[{"note":"Submission ページおよび Submission & Review ページに同じ文が掲載","label":"査読方式","value":"「All submissions will be peer-reviewed by at least two experts in the field.」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Submission.html"},{"note":"ナビゲーションに Review 項目はあるが、方式を説明する記述は読めない","label":"匿名査読（double-blind）の記載","value":"未掲載。Submission & Review 配下の Review ページは「Coming Soon!」の表示だけ","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Review.html"},{"note":"過去サイクルの採択率を掲載するページも見当たらない","label":"採択率","value":"未公表。Submission & Review ページに採択率や投稿数の記載はない","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Submission-Review.html"},{"note":"人数は一覧を数え上げるしかなく、公式サイトの記載としては存在しない","label":"審査体制の人数の公表状況","value":"未公表。Committees / Technical Program Committees / Track Chairs の各ページは氏名と所属を並べるだけで、人数を示す数値は印字されていない","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/tp.html"},{"note":"Registration Form ページの Registration Notes","label":"発表義務","value":"「Each accepted paper must have at least one author registered and present the paper at the conference.」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"}],"title":"査読方式と審査体制","eyebrow":"review"},"caveats":{"id":"caveats","body":"competitionの日程はページ間で食い違っており、Important Datesページとcompetitionページで3つの日付がすべて異なります。公式サイトが公表していないものもはっきりしています。採択率・投稿数・参加者数、査読の匿名性と審査観点、journal特集号の有無、committeeの人数、そしてトップページのCo-sponsored by / Technically Co-sponsored by / Hosted by / Supported by / Competition Sponsors / Media Partnerに並ぶ組織の名称は、いずれも公式ページの本文から読み取れません。History of ICSICTページも年月と都市名だけの一覧で、回次番号、開催回数の合計、開催間隔、都市の所在国は印字されていません。ポスター発表のサイズや掲示時間も未掲載です。Final Programは2026年10月14日時点で公開済みです。keynoteの講演題目は2026年8月5日時点の個別ページでは未確定表示だったため、現在の時間割はFinal Programで確認してください。","facts":[{"note":"Important Dates ページは September 15 / September 25 / October 15 を表示（トップページの Important Dates 抜粋には Competition Preliminary Paper Submission: September 15, 2026 の1行だけが載る）。日程は Important Dates ページを基準に確認する","label":"competition 日程の表記の食い違い","value":"competition ページは Competition Preliminary Paper Submission: July 16, 2026 / Competition Preliminary Result Announcement: August 16, 2026 / Final Competition Materials Submission: September 05, 2026 と表示","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/competition.html"},{"note":"Exhibition ページの Track Title Sponsorship 欄の説明文","label":"competition トラック数の表記の食い違い","value":"Competition ページは Digital と Analog の2トラックと書き、Exhibition ページは Digital, Analog, RF, Device の4トラックを予定と書いている","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Exhibition.html"},{"note":"Submission & Review ページに数値の記載はない","label":"採択率・投稿数・参加者数","value":"いずれも未公表","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Submission-Review.html"},{"note":"2026-10-14に公式Final Programページを再確認。","label":"Final Program の状態","value":"公開済み（Day 1 Tuesday October 27, 2026〜Day 4 Friday October 30, 2026）","checkedAt":"2026-10-14","sourceUrl":"https://www.icsict.org/FinalProgram.html"},{"note":"Keynote Speeches ページ","label":"keynote の講演題目","value":"掲載6件すべて「TBD」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/KeynoteSpeeches.html"},{"note":"ナビゲーションには Submission & Review > Review の項目がある","label":"Review ページの中身","value":"本文は「Coming Soon!」の一行のみ。査読の記述は Submission ページ側にある","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Review.html"},{"note":"個別論文の収録確定を示すものではない。IEEE Xplore の会議シリーズ一覧ページは2026-08-05時点で自動取得できなかった","label":"IEEE Xplore 収録の位置づけ","value":"公式サイトの記述は「submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements」という提出予定の書き方","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/index.html"},{"note":"Conference Awards ページには Best Poster Award と poster papers の記載がある","label":"ポスター発表の規定","value":"Presentation Duration ページに掲載されているのは口頭発表4種類の持ち時間のみ。ポスターサイズや掲示時間は未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/PresentationFormat.html"}],"title":"このページで扱わない範囲と注意点","eyebrow":"caveats"},"history":{"id":"history","body":"History of ICSICT ページは年月と都市だけの一覧で、1986年10月の北京開催が最初に置かれています。1998年までは北京が続き、2001年に上海が入って以降は西安・桂林・杭州・青島・昆明・南京・珠海と開催地が広がっています。一覧に回次番号は付いていないため、第N回の対応づけは各サイクルの正式名称側で確認することになります。開催回数の合計や開催間隔、都市の所在国はページに印字されていないため、ここでは一覧に載っている年月と都市の組み合わせだけを扱います。","facts":[{"note":"History of ICSICT ページの先頭行","label":"一覧の最古の開催","value":"Oct., 1986 / Beijing","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"},{"note":"History ページの一覧","label":"北京が続いた期間","value":"1986, 1989, 1992, 1995, 1998 の5回がいずれも Beijing","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"},{"note":"History ページの一覧。2001年の行から Beijing 以外の都市名が現れる","label":"開催地の広がり","value":"2001 Shanghai / 2004 Beijing / 2006 Shanghai / 2008 Beijing / 2010 Shanghai / 2012 Xi'An / 2014 Guilin / 2016 Hangzhou / 2018 Qingdao","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"},{"note":"History ページには2020年と2022年に (Online) の注記が付く","label":"直近3回","value":"Nov. 2020 Kunming（Online）/ Oct., 2022 Nanjing（Online）/ Oct. 2024 Zhuhai","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"},{"note":"名称変更の履歴を示す記述もない","label":"回次番号・名称変更の記載","value":"未掲載。History ページは年月と都市だけで、回次番号や過去の会議正式名称は載っていない","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/History.html"}],"title":"1986年からの開催記録","eyebrow":"history"},"program":{"id":"program","body":"2026年のFinal Programは公開済みです。2026年8月5日時点で先に公表されていたplenary speaker 5名、keynote 6件、tutorial 3件、special session 4件の情報は、この欄に日付付きで残しています。個別keynoteページの講演題目は当時TBD表示だったため、現在の時間割はFinal Programで確認してください。発表時間は種別ごとに分単位で案内されています。","facts":[{"note":"Plenary Speeches ページ。所属は同ページに印字された affiliation","label":"2026 plenary speakers","value":"Jianjun Luo（Hangzhou Dianzi University, China）/ Mohamad Sawan（Westlake University, China）/ Paul Penzes（Qualcomm Technologies, USA）/ Wai Tung Ng（University of Toronto, Canada）/ Zewen Liu（Tsinghua University, China）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/PlenarySpeeches.html"},{"note":"Mohamad Sawan の題目は同ページに未掲載","label":"2026 plenary 講演題目","value":"「Non-Volatile Memory Technology & Application Trends in Industry」/「Engineering the Future: How AI Is Transforming Hardware Design」/「3D Hetero-Integration of WBG Power Modules with Silicon-based Smart Power ICs」/「GaN-MEMS Sensor and Its Application」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/PlenarySpeeches.html"},{"note":"Keynote Speeches ページ","label":"2026 keynote speeches","value":"6件掲載（Track 4 RF & Wireless、Track 9 Device Reliability & Security、Special Session 1、Special Session 2 に紐づく）。講演題目はいずれも「TBD」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/KeynoteSpeeches.html"},{"note":"Tutorial ページ。各 tutorial は2件の talk で構成される。受講料の記載はない","label":"2026 tutorial","value":"3件：「AI-Driven Modular Designs and Optimizations for RFICs」/「Smart Sensing SoCs Based on Heterogeneous CMOS-MEMS Integration and Sensor-AI Co-Designed Architectures」/「Breaking the AI-Computing Driven Interconnect Bottleneck」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Tutorial.html"},{"note":"Special Session ページの Confirmed Special Sessions 欄に organizer 名と所属付きで掲載","label":"2026 special sessions","value":"4件：Ferroelectric Materials and Devices / Oxide Semiconductor Devices / Advanced Memory and Computing-In-Memory Circuit Design / Chiplet-based Integrated Systems","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/special-session.html"},{"note":"Presentation Duration ページ","label":"発表時間","value":"Plenary Speech 40分 / Keynote Speech 30分 / Invited Speech 20分 / Regular Oral Presentation 15分（いずれも Q&A を含む）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/PresentationFormat.html"},{"note":"Competition ページ。受賞チームには certificate と complimentary conference registration quota が1件付く","label":"2026 competition","value":"Digital と Analog の2トラック。課題は Digital が AI Agent-Based NPU Design and Verification、Analog が AI Agent-Based Automatic Optimization Design of FVF LDO。賞金は CNY 5,000（1st）/ CNY 3,000（2nd）/ CNY 2,000（3rd）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/competition.html"},{"note":"Conference Awards ページ。Best Poster Award は poster papers のみ対象","label":"2026 conference awards","value":"Outstanding Young Scholar Award / Best Student Paper Award / Best Paper Award / Best Poster Award","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/awards.html"},{"note":"Final Program ページ本文","label":"2026 Final Program の状態","value":"「Coming Soon!」（2026-08-05時点）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/FinalProgram.html"},{"note":"2026-10-14に公式Final Programページを再確認。Day 1からDay 4までのプログラムが公開されている。","label":"2026 Final Program の状態","value":"公開済み（Day 1: 2026-10-27〜Day 4: 2026-10-30）","checkedAt":"2026-10-14","sourceUrl":"https://www.icsict.org/FinalProgram.html"}],"title":"2026年プログラムの公表状況","eyebrow":"program"},"audience":{"id":"audience","body":"学生は Sept. 30, 2026 までの登録で2,700 CNY、Best Student Paper Award は第一著者かつ本人発表が条件なので、学生発表を前提に計画を立てられます。企業側は Exhibition ページに出展メニューと Talent Recruitment Zone が金額付きで並んでおり、出展判断に必要な数字はそろっています。登録費に何が含まれるか、返金がいつまで効くかも Registration Form ページに日付付きで書かれています。","facts":[{"note":"Registration Form ページの料金表。列見出しは Before / After Sept. 30, 2026","label":"2026 学生登録費","value":"Student：Before Sept. 30, 2026 は 2,700 CNY / 400 USD、After Sept. 30, 2026 は 3,000 CNY / 445 USD","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"},{"note":"Registration Form ページの料金表。Important Dates ページでは Sept. 30, 2026 が Early Bird Registration Deadline と表記される","label":"2026 一般登録費","value":"Before Sept. 30, 2026：IEEE or IET member 3,500 CNY / 520 USD、Non-member 3,800 CNY / 565 USD。After Sept. 30, 2026：IEEE or IET member 3,800 CNY / 565 USD、Non-member 4,100 CNY / 610 USD","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"},{"note":"Registration Form ページ","label":"登録費に含まれるもの","value":"「access to all technical sessions, conference materials, coffee breaks, welcome reception and the banquet」","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"},{"note":"Registration Form ページ。追加ページは6ページ目から課金と注記","label":"2026 追加費用","value":"Extra banquet ticket 350 CNY / 52 USD、Extra pages 350 CNY/page / 52 USD、Additional Paper 2,100 CNY / 310 USD","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"},{"note":"Registration Form ページの Cancellation and Refund Policy","label":"2026 返金規定","value":"30 September, 2026 まで全額返金、30 September, 2026 から 15 October, 2026 までは50%控除、15 October, 2026 以降は返金なし。USD 返金には30 USD の手数料","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/RegistrationForm.html"},{"note":"Conference Awards ページ","label":"2026 Best Student Paper Award の条件","value":"応募する学生が論文の第一著者であること、および口頭またはポスターで本人が時間どおり発表することが条件","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/awards.html"},{"note":"Exhibition ページ。掲載は出展メニューの提示であり、採用実績を示すものではない","label":"2026 採用活動枠","value":"Talent Recruitment Zone Sponsorship（5,000 または 10,000 RMB）が出展メニューにあり、10,000 RMB 側には面接用会議室の専有利用が付く","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Exhibition.html"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ICSICT は略称で、2026年サイクルの正式名称には回次「18th」が入ります。トップページ下部には Co-sponsored by / Technically Co-sponsored by / Hosted by / Supported by という4段階の見出しが並びますが、どの欄もロゴ画像だけで組織名のテキストが印字されておらず、画像に alt 属性もありません。主催・共催の組織名を引用したい場合、公式サイトの本文からは確認できないため、各組織側の公表を当たることになります。問い合わせ窓口だけは Contact Us ページにテキストで載っています。","facts":[{"note":"トップページの開催告知文の冒頭に記載","label":"2026 正式名称","value":"2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/index.html"},{"note":"トップページの見出し「Welcome to ICSICT 2026」と会議名末尾の (ICSICT) に印字","label":"略称","value":"ICSICT","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/"},{"note":"回次はトップページの会議名表記から読める","label":"2026 回次","value":"第18回（正式名称に 18th と含まれる）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/index.html"},{"note":"Contact Us ページに掲載","label":"問い合わせ窓口","value":"Conference Secretary: Ms. Joyce（icsict2026@csj.uestc.edu.cn / ieeeicsict@outlook.com、+86-186 282 638 76）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Contact.html"}],"title":"会議の正式名称と主催構成","eyebrow":"identity"},"community":{"id":"community","body":"General Chairs には米国・フランス・中国の所属が並び、TPC Chairs には日本の大学所属が1名入っています。Technical Program Committees ページには members の氏名と所属が並びますが、人数や国別の内訳を示す数値は公式サイトに印字されていません。ここに挙げた国名は公式ページに印字された affiliation の所在地であり、個人の国籍ではありません。トップページの Competition Sponsors と Media Partner の欄はロゴ画像だけで組織名のテキストがなく、金額付きで読めるのは Exhibition ページの出展・協賛メニューだけです。メニューの掲載は出展や支援の枠組みを示すもので、取引関係や共同研究を示すものではありません。","facts":[{"note":"Committees ページの最上段","label":"2026 Life Honorary Chair","value":"Yangyuan Wang（Peking University, China）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Committees.html"},{"note":"Committees ページ。所在国は同ページの affiliation 表記","label":"2026 General Chairs","value":"Jan Van der Spiegel（University of Pennsylvania, USA）/ Bin Zhao（IEEE EDS, USA）/ Francois Rivet（University of Bordeaux, France）/ Amara Amara（International Innovation Institute, Beihang University, Hangzhou Campus, China）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Committees.html"},{"note":"Committees ページ","label":"2026 Advisory Committee Co-Chairs","value":"Ting-Ao Tang（Fudan University, China）/ Cor Claeys（Proximus, Belgium）/ Mengqi Zhou（IEEE China Council, China）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Committees.html"},{"note":"Committees ページ。日本の大学所属は TPC Chairs に1名","label":"2026 TPC Chairs","value":"Haruo Kobayashi（Gunma University, Japan）/ Ming Li（Peking University, China）/ Bo Zhang（University of Electronic Science and Technology of China, China）/ Yi Zhao（Huada Semiconductor, China）","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Committees.html"},{"note":"Committees ページ","label":"2026 General Co-Chairs","value":"Ning Xu（Wuhan University of Technology）/ Cheng Zhuo（Zhejiang University）/ Yuehang Xu（Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou）/ Gaofeng Wang（Hangzhou Dianzi University）、いずれも China","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/Committees.html"},{"note":"Technical Program Committees ページ。所在国は印字された affiliation の所在地であり、人数の内訳は公式サイトに未掲載","label":"2026 TPC members の所属所在国の表記","value":"Technical Program Committee Members 欄の affiliation には China のほか Canada、South Korea、Singapore、United States、および Hong Kong, China / Macau, China の表記が現れる","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/tp.html"},{"note":"Track Chairs ページ","label":"2026 Track Chairs に入る企業系の所属","value":"Track 12 Packaging Technologies の Co-Chair に NARI Semiconductor R&D Center の所属が入る。他のトラックの Chair / Co-Chair はいずれも大学または研究機関","checkedAt":"2026-08-05","sourceUrl":"https://www.icsict.org/track_chairs.html"},{"note":"Exhibition ページ。標準ブースは backdrop 1.8m×2.0m、display table 1.8m×0.75m、roll-up banner 0.8m×1.8m が各1点。Cooperative Industry Media Sponsorship は金額の記載なし","label":"2026 出展・協賛メニュー","value":"Platinum 80,000 RMB / Gold 50,000 RMB / Silver 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プロセス統合","programUrl":"https://mems27.org/","officialUrl":"https://mems27.org/about/conference_info.html","conferenceId":"mems","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":65}],"primaryDeadline":{"code":"IEEE MEMS","date":"2026-08-06","kind":"abstract","name":"IEEE International Conference on Micro Electro Mechanical Systems","label":"要旨締切","cfpUrl":"https://mems27.org/","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://mems27.org/","officialUrl":"https://mems27.org/about/conference_info.html","conferenceId":"mems","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-38},"submissionFormat":"technical paper / oral and poster program","trackingPhaseGroup":"submission-open","nextPrimaryDeadline":{"code":"IEEE MEMS","date":"2026-11-17","kind":"final-paper","name":"IEEE International Conference on Micro Electro Mechanical Systems","label":"最終原稿締切","cfpUrl":"https://mems27.org/","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://mems27.org/","officialUrl":"https://mems27.org/about/conference_info.html","conferenceId":"mems","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":65},"primaryDeadlineEvents":[{"code":"IEEE MEMS","date":"2026-08-06","kind":"abstract","name":"IEEE International Conference on Micro Electro Mechanical Systems","label":"要旨締切","cfpUrl":"https://mems27.org/","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://mems27.org/","officialUrl":"https://mems27.org/about/conference_info.html","conferenceId":"mems","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":-38},{"code":"IEEE MEMS","date":"2026-11-17","kind":"final-paper","name":"IEEE International Conference on Micro Electro Mechanical Systems","label":"最終原稿締切","cfpUrl":"https://mems27.org/","fieldId":"device-process","fieldTitle":"ロジック / デバイス / プロセス統合","programUrl":"https://mems27.org/","officialUrl":"https://mems27.org/about/conference_info.html","conferenceId":"mems","trackingPhase":"投稿受付中 / 公式CFP確認済み","trackingPhaseGroup":"submission-open","daysFromLastVerified":65}],"researchVisualSignals":{"note":"MEMS official 2026 Conference Officials, Program Committee, Program PDF, Current Support, Exhibitor Brochure, Previous Conferences, and home pages were reviewed. Program country/region means first-listed program affiliation institution country/region. Program PDF source: https://www.mems26.org/files/MEMS2026_Program.pdf.","history":{"note":"The official MEMS 2026 Previous Conferences page lists 1987 Hyannis, Massachusetts as the earliest event; the home page identifies MEMS 2026 as the 39th International Conference on Micro Electro Mechanical Systems.","ageYears":39,"sourceUrl":"https://www.mems26.org/about/previous_conferences.html","displayLabel":"First listed event: 1987","sourceStatus":"extractor_v0_source_checked","firstHeldYear":1987,"historyYearBasis":"official_previous_conferences_first_listed_event","comparisonMaxYears":90,"secondarySourceUrl":"https://www.mems26.org/"},"organizationMix":[{"note":"Official MEMS 2026 Conference Officials and Program Committee rows are counted at source-row grain. No geography breakdown is projected for these committee service rows.","label":"MEMS 2026 official committee person-affiliation rows","segments":[{"kind":"company","label":"Company","value":11.5},{"kind":"university","label":"University","value":42.7},{"kind":"research","label":"Research institute","value":10.7},{"kind":"unknown","label":"Other / unknown","value":35.1}],"sourceUrl":"https://www.mems26.org/about/conference_officials.html","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"131 person-affiliation rows / official MEMS 2026 officials and program committee pages","secondarySourceUrl":"https://www.mems26.org/about/program_committee.html"},{"note":"Official MEMS 2026 Program PDF scheduled oral/invited rows plus coded poster/oral listing rows count the first-listed visible affiliation institution. Service rows, breaks, tours, and conference administration rows are excluded.","label":"MEMS 2026 official Program PDF first-listed affiliation rows","segments":[{"kind":"company","label":"Company","value":3.8},{"kind":"university","label":"University","value":83.2},{"kind":"research","label":"Research institute","value":12.9}],"sourceUrl":"https://www.mems26.org/files/MEMS2026_Program.pdf","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"364 official program presentation rows / first-listed visible affiliation institutions","secondarySourceUrl":"https://www.mems26.org/program/program_overview.html"},{"note":"Official MEMS 2026 Current Support rows enumerate sponsor, benefactor, award sponsor, exhibitor, lanyard benefactor, and contributor listings only. They are not revenue, customer, procurement, hiring, or collaboration evidence.","label":"MEMS 2026 official sponsor / benefactor / exhibitor organization mix","segments":[{"kind":"company","label":"Company","value":81},{"kind":"university","label":"University","value":1.7},{"kind":"research","label":"Research institute","value":3.4},{"kind":"professional-society","label":"Professional society","value":12.1},{"kind":"unknown","label":"Other / unknown","value":1.7}],"sourceUrl":"https://www.mems26.org/sponsors/current_support.html","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"58 official sponsor/benefactor/exhibitor listing rows","secondarySourceUrl":"https://www.mems26.org/sponsors/MEMS2026_ExhibitorBrochure.pdf"}],"companyBreakdowns":[{"note":"Top reviewed company affiliations from official MEMS 2026 officials and program committee person-affiliation rows. Committee service is not customer, revenue, hiring, or collaboration evidence.","rows":[{"rows":4,"company":"Robert Bosch GmbH"},{"rows":2,"company":"Infineon"},{"rows":2,"company":"Northrop Grumman"},{"rows":2,"company":"STMicroelectronics"},{"rows":2,"company":"TDK InvenSense"},{"rows":1,"company":"Analog Devices"},{"rows":1,"company":"Silex Microsystems"},{"rows":1,"company":"Sony DADC Europe GmbH"}],"label":"MEMS committee company affiliations","sourceUrl":"https://www.mems26.org/about/conference_officials.html","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"15 company rows / 131 official committee person-affiliation rows","secondarySourceUrl":"https://www.mems26.org/about/program_committee.html"},{"note":"Top reviewed company affiliations from official MEMS 2026 Program PDF presentation rows using the first-listed visible affiliation institution.","rows":[{"rows":3,"company":"Infineon"},{"rows":3,"company":"STMicroelectronics"},{"rows":2,"company":"Toshiba Corporation"},{"rows":1,"company":"Evatec AG"},{"rows":1,"company":"LG Electronics"},{"rows":1,"company":"Med-El"},{"rows":1,"company":"MIRISE Technologies Corporation"},{"rows":1,"company":"Ricoh Company, Ltd."},{"rows":1,"company":"Robert Bosch GmbH"}],"label":"MEMS program company affiliations","sourceUrl":"https://www.mems26.org/files/MEMS2026_Program.pdf","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"14 company rows / 364 official program first-listed affiliation rows","secondarySourceUrl":"https://www.mems26.org/program/program_overview.html"}],"countryBreakdowns":[{"note":"Rows are grouped by first-listed program affiliation institution country/region from the official MEMS 2026 Program PDF and reviewed institution matching.","rows":[{"rows":148,"country":"China","percentage":40.7},{"rows":38,"country":"South Korea","percentage":10.4},{"rows":36,"country":"United States","percentage":9.9},{"rows":32,"country":"Taiwan","percentage":8.8},{"rows":29,"country":"Japan","percentage":8},{"rows":12,"country":"Austria","percentage":3.3},{"rows":9,"country":"France","percentage":2.5},{"rows":8,"country":"India","percentage":2.2},{"rows":7,"country":"Germany","percentage":1.9},{"rows":7,"country":"Hong Kong","percentage":1.9},{"rows":6,"country":"Singapore","percentage":1.6},{"rows":4,"country":"Spain","percentage":1.1},{"rows":4,"country":"Switzerland","percentage":1.1},{"rows":4,"country":"The Netherlands","percentage":1.1},{"rows":4,"country":"Turkey","percentage":1.1},{"rows":3,"country":"Australia","percentage":0.8},{"rows":3,"country":"Israel","percentage":0.8},{"rows":3,"country":"Italy","percentage":0.8},{"rows":3,"country":"United Kingdom","percentage":0.8},{"rows":2,"country":"Portugal","percentage":0.5},{"rows":1,"country":"Belgium","percentage":0.3},{"rows":1,"country":"Canada","percentage":0.3}],"label":"MEMS 2026 program first-listed affiliation countries / regions","sourceUrl":"https://www.mems26.org/files/MEMS2026_Program.pdf","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"364 official program first-listed affiliation rows","secondarySourceUrl":"https://www.mems26.org/program/program_overview.html"}],"sponsorOrganizations":{"note":"Official MEMS 2026 Current Support page lists sponsor, benefactor, award sponsor, exhibitor, lanyard benefactor, and contributor rows. The exhibitor brochure corroborates the official sponsor/exhibit surface.","rows":[{"role":"Sponsor / benefactor","tier":"Conference Sponsor","organization":"IEEE","sponsorLevel":"Conference Sponsor","sourceSection":"MEMS 2026 Current Support / Conference Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Conference Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Sponsor / benefactor","tier":"Conference Sponsor","organization":"IEEE MEMS Technical Community","sponsorLevel":"Conference Sponsor","sourceSection":"MEMS 2026 Current Support / Conference Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Conference Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Sponsor / benefactor","tier":"Diamond Benefactor","organization":"Robert Bosch GmbH","sponsorLevel":"Diamond Benefactor","sourceSection":"MEMS 2026 Current Support / Diamond Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Diamond Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Diamond Benefactor","organization":"Infineon Technologies AG","sponsorLevel":"Diamond Benefactor","sourceSection":"MEMS 2026 Current Support / Diamond Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Diamond Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Diamond Benefactor","organization":"Siconnex","sponsorLevel":"Diamond Benefactor","sourceSection":"MEMS 2026 Current Support / Diamond Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Diamond Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Diamond Benefactor","organization":"Silicon Austria Labs Gmbh","sponsorLevel":"Diamond Benefactor","sourceSection":"MEMS 2026 Current Support / Diamond Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Diamond Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"research_institute"},{"role":"Sponsor / benefactor","tier":"Diamond Benefactor","organization":"Sumitomo Precision Products Co., Ltd.","sponsorLevel":"Diamond Benefactor","sourceSection":"MEMS 2026 Current Support / Diamond Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Diamond Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Gold Benefactor","organization":"Teledyne MEMS","sponsorLevel":"Gold Benefactor","sourceSection":"MEMS 2026 Current Support / Gold Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Gold Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Silver Benefactor","organization":"NXP Semiconductors","sponsorLevel":"Silver Benefactor","sourceSection":"MEMS 2026 Current Support / Silver Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Silver Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Bronze Benefactor","organization":"STMicroelectronics","sponsorLevel":"Bronze Benefactor","sourceSection":"MEMS 2026 Current Support / Bronze Benefactor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Bronze Benefactor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Sponsor / benefactor","tier":"Outstanding Student Oral Presentation Award Sponsor","organization":"Journal of Micromechanics and Microengineering","sponsorLevel":"Outstanding Student Oral Presentation Award Sponsor","sourceSection":"MEMS 2026 Current Support / Outstanding Student Oral Presentation Award Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Outstanding Student Oral Presentation Award Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Sponsor / benefactor","tier":"Outstanding Student Paper Presentation Award Sponsor","organization":"Microsystems & Nanoengineering","sponsorLevel":"Outstanding Student Paper Presentation Award Sponsor","sourceSection":"MEMS 2026 Current Support / Outstanding Student Paper Presentation Award Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Outstanding Student Paper Presentation Award Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"AP&S International GmbH","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"ATLANT 3D","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"CeNSE, IISc","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Finetech GmbH & Co. KG","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"i-ROM GmbH","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"idonus sarl","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"IEEE MEMS Technical Community","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Infineon Technologies AG","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Innovation Salzburg GmbH","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"IntelliSense Software Corporation","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"JX Advanced Metals","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"KLA Corporation","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Kurt J. Lesker Company GmbH","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"LioniX International BV","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Lyncee Tec","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"MagnetFab","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"MDPI","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Exhibitor","tier":"Exhibitor","organization":"MEMS 2027 Conference","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"unknown"},{"role":"Exhibitor","tier":"Exhibitor","organization":"MicroTAS 2026 Conference","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"professional_society"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Nagase ChemteX America, LLC","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Nanoscribe GmbH & Co. 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AG","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Polytec GmbH","sponsorLevel":"Exhibitor","sourceSection":"MEMS 2026 Current Support / Exhibitor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Exhibitor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"Exhibitor","tier":"Exhibitor","organization":"Polyteknik 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Villageで開かれます。","question":"IEEE MEMS 2027はいつ、どこで開かれますか？","sourceUrls":["https://mems27.org/"]},{"answer":"本文600語以内・2ページのabstractをPDFで出します。採択されると4ページのmanuscriptを2026年11月17日までに提出し、technical digestに掲載されます。","question":"投稿には何を出しますか？","sourceUrls":["https://mems27.org/authors/abstract_guidelines.html","https://mems27.org/authors/deadlines.html"]},{"answer":"2027年はdouble-blind査読で、著者情報は採否決定後にTPCへ開示されます。","question":"査読はdouble-blindですか？","sourceUrls":["https://mems27.org/authors/double_blind_review.html"]},{"answer":"採択された論文はtechnical digestに入り、会議後にIEEE Xploreに収録されます。Open PosterはIEEE Xploreに載りません。","question":"論文はIEEE Xploreに載りますか？","sourceUrls":["https://mems27.org/authors/journal_archiving_options.html","https://mems27.org/authors/what_is_open_poster.html"]},{"answer":"2027年は40回記念のConference-to-Journal Trackがあり、Microsystems & Nanoengineering（MINE）への直接掲載（TPCが30件を選ぶ）と、5ページ以上に拡張してJMEMSに載せる経路があります。","question":"論文誌に直接載せる方法はありますか？","sourceUrls":["https://mems27.org/authors/journal_archiving_options.html"]},{"answer":"technical digestやIEEE Xploreに載せずに成果を共有するポスター枠で、2026年10月27日までに投稿します。","question":"Open Posterとは何ですか？","sourceUrls":["https://mems27.org/authors/what_is_open_poster.html","https://mems27.org/authors/deadlines.html"]}],"headline":"第40回のIEEE MEMS 2027は2027年1月17日〜21日に米国ハワイ島のHilton Waikoloa Villageで開かれ、採択論文は4ページのmanuscriptとしてtechnical digestとIEEE Xploreに収録されます。","metaDescription":"IEEE MEMS 2027（第40回、2027年1月17〜21日・ハワイ島Hilton Waikoloa Village）の2ページabstract投稿、double-blind査読、選考基準、IEEE XploreとJMEMS・MINEへの論文誌トラック、1987年からの開催地を公式サイトから整理。","oneLine":"IEEE MEMSは、MEMSとマイクロシステムの設計・製造・材料・応用の研究成果を単一セッション形式で発表する年次国際会議で、IEEEとMEMS Technical Communityがsponsorです。","pageTitle":"IEEE MEMS（Micro Electro Mechanical 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Posterは正式なabstractとは別枠で、締切は2026年10月27日、通知は11月10日です。採択後は著者1名が登録して発表する必要があります。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"Previous Conferencesの一覧で最も古いのは1987年のHyannis（米国マサチューセッツ州）です。日本では1991年に奈良、2022年に東京（Hybrid）で開かれ、2021年はオンライン開催でした。直近では2024年がAustin（米国テキサス州）、2025年がKaohsiung（台湾）です。","facts":[{"label":"一覧で最も古い開催","value":"1987 - Hyannis, Massachusetts, USA","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"},{"label":"1991 開催地","value":"Nara, JAPAN","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"},{"label":"2022 開催地・形式","value":"Tokyo, JAPAN / Hybrid","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"},{"label":"2021 開催形式","value":"Online","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"},{"label":"2025 開催地","value":"Kaohsiung, TAIWAN","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"},{"label":"2024 開催地","value":"Austin, Texas, USA","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/previous_conferences.html"}],"title":"沿革・開催地","eyebrow":"history"},"program":{"id":"program","body":"2027年のPlenary Speakersには、University College LondonのStephen Hart（MEMS RULES: THE ENABLING TECHNOLOGY BETWEEN SCIENCE AND ENGINEERING）、STMicroelectronicsのDave Monk、KAISTのHyun Myung（SPATIAL AI FOR AUTONOMOUS ROBOT NAVIGATION）が掲載されています。Poster SessionはIからIIIまで組まれ、IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Awardの表彰枠があります。併設企画として2nd PiezoMEMS Design ChallengeとTechnology Showcaseが掲載されています。","facts":[{"label":"2027 Plenary（UCL）","value":"MEMS RULES: THE ENABLING TECHNOLOGY BETWEEN SCIENCE AND ENGINEERING（Stephen Hart）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/program/speakers.html"},{"label":"2027 Plenary（STMicroelectronics）","value":"Dave Monk","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/program/speakers.html"},{"label":"2027 Plenary（KAIST）","value":"SPATIAL AI FOR AUTONOMOUS ROBOT NAVIGATION（Hyun Myung）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/program/speakers.html"},{"label":"2027 表彰枠","value":"IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/program/program_overview.html"},{"label":"2027 Poster Session","value":"Poster Session I〜III","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/program/program_overview.html"},{"label":"2027 併設企画","value":"2nd PiezoMEMS Design Challenge / Technology Showcase","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/"}],"title":"2027年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"研究室にとっては、2ページabstractで採否が決まり、採択後の4ページ論文がIEEE Xploreに載る点と、JMEMSやMINEへの直接掲載経路が投稿先選びの材料になります。Open Posterはdigestに載せずにコミュニティと情報を共有する場です。企業向けには初日のIndustry Sessionと展示があり、Open Posterは技術内容に限られ、産業パートナーの宣伝には使えないと明記されています。","facts":[{"label":"Open Poster の目的","value":"digestやIEEE Xploreに載せずにコミュニティと情報を共有","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/what_is_open_poster.html"},{"label":"Open Poster の内容制限","value":"技術内容に限り、産業パートナーの宣伝は不可","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/what_is_open_poster.html"},{"label":"発表義務","value":"採択後は著者1名が登録して発表","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/abstract_guidelines.html"}],"title":"研究室・企業担当者向けの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"2027年大会の正式表記は「The 40th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2027)」です。投稿者向けページは、IEEEとMEMS Technical Communityが会議のsponsorであると書いています。開催は年1回で、Conference ChairsはUniversity of UtahとNASA JPLの研究者です。","facts":[{"label":"正式名称（2027）","value":"The 40th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2027)","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/"},{"label":"Sponsor","value":"IEEE / MEMS Technical Community","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/journal_archiving_options.html"},{"label":"開催頻度","value":"年1回（annual event）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_info.html"},{"label":"2027 Conference Chairs","value":"Hanseup Kim（University of Utah, USA）/ Mina Rais-Zadeh（NASA JPL, USA）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/"},{"label":"会議形式","value":"単一セッション形式（口頭・ポスターが重ならない）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_info.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"International Steering Committee ChairはUniversidad Pública de NavarraのAndreu Lloberaで、日本からは慶應義塾大学のHiroaki Onoeが入っています。Publication TeamにはCanon Medical SystemsのHiroyuki Fujita、Executive TPCには東京大学のGilgueng Hwangが入っています。Industrial Advisory CommitteeにはSTMicroelectronicsのAndrea Piccoがいます。出展企業のページにはTeledyne MEMS（Booth 2）が掲載されています。","facts":[{"label":"International Steering Committee（日本）","value":"Hiroaki Onoe（Keio University, JAPAN）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_officials.html"},{"label":"International Steering Committee Chair","value":"Andreu Llobera（Universidad Pública de Navarra, SPAIN）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_officials.html"},{"label":"Industrial Advisory Committee（例）","value":"Andrea Picco（STMicroelectronics, Italy）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_officials.html"},{"label":"Publication Team（日本）","value":"Hiroyuki Fujita（Canon Medical Systems Corporation, JAPAN）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/conference_officials.html"},{"label":"Executive TPC（日本）","value":"Gilgueng Hwang（The University of Tokyo, JAPAN）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/about/program_committee.html"},{"label":"2027 出展企業（例）","value":"Teledyne MEMS（Bromont, Quebec, CANADA / Booth 2）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/sponsors/current_support/teledyne.html"}],"title":"委員会・出展","eyebrow":"community"},"submission":{"id":"submission","body":"投稿は2ページのabstract（US Letter・A4どちらも可、本文600語以内）をPDFで出し、2027年の締切は2026年8月6日、通知は10月12日、最終manuscript（4ページ）は11月17日です。締切延長はしないと明記されています。正式なabstractとは別に、digestやIEEE Xploreに載らないOpen Posterの募集があり、2026年10月27日が締切です。AI生成テキストを使った場合は、acknowledgementsで開示します。","facts":[{"label":"2027 Abstract PDF 締切","value":"2026-08-06（延長なし）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/deadlines.html"},{"label":"2027 採否通知","value":"2026-10-12（email）","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/deadlines.html"},{"label":"2027 Final Manuscript 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Xploreに収録されます。Open Posterはdigestにも IEEE Xploreにも載りません。2027年は40回記念のConference-to-Journal Trackが設けられ、MINEへの直接掲載はTPCが30件を選び、JMEMSへの直接掲載は5ページ以上に拡張します。IEEE XploreのOpen Accessを選ぶ場合は著者負担800ドルです。","facts":[{"label":"収録先","value":"technical digest および IEEE Xplore","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/journal_archiving_options.html"},{"label":"Open Poster の扱い","value":"Technical Digest・IEEE Xploreには載らない","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/what_is_open_poster.html"},{"label":"2027 Conference-to-Journal Track","value":"40回記念で新設","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/journal_archiving_options.html"},{"label":"MINE 経路の採択数","value":"TPCが30件を選ぶ","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/journal_archiving_options.html"},{"label":"JMEMS 経路の書式","value":"5ページ以上に拡張","checkedAt":"2026-10-08","sourceUrl":"https://mems27.org/authors/journal_archiving_options.html"},{"label":"IEEE Xplore の Open 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MEMS","checkedAt":"2026-10-08","evidenceLocator":"企業名・所在地・ブース番号"}],"summary":"IEEE International Conference on Micro Electro Mechanical Systems（IEEE MEMS）は、MEMSとMicrosystems技術の研究成果を発表する年次会議で、2027年が第40回です。公式サイトは近年の規模として700名超の参加者、800件超のabstract投稿、200件超の選抜論文を挙げ、口頭とポスターが重ならない単一セッション形式をとると説明しています。投稿は600語以内・2ページのabstractでdouble-blind査読を受け、採択後に4ページのmanuscriptを提出します。2027年は40回記念としてConference-to-Journal Trackが新設され、JMEMSやMicrosystems & Nanoengineering（MINE）への直接掲載の道が用意されています。","topics":[{"note":"MEMSの製造技術・プロセスが開発側の募集分野に挙げられています。","label":"Fabrication technologies and processes","sourceUrl":"https://mems27.org/about/conference_info.html"},{"note":"2027年に新設され、JMEMSとMicrosystems & Nanoengineeringへの直接掲載経路があります。","label":"Conference-to-Journal 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They are listing rows, not revenue, customer, procurement, hiring, or collaboration evidence.","rows":[{"role":"Co-host","tier":"Co-hosted by","rowId":"sponsor-001","sourceUrl":"https://www.mrs-j.org/meeting2025/en/sponsor.php","organization":"CITY OF KITAKYUSHU","sourceStatus":"extractor_v0_source_checked","countryOrRegion":"Japan","organizationType":"government"},{"role":"Sponsor","tier":"Sponsored by","rowId":"sponsor-002","sourceUrl":"https://www.mrs-j.org/meeting2025/en/sponsor.php","organization":"Kitakyushu Convention and Visitors Association","sourceStatus":"extractor_v0_source_checked","countryOrRegion":"Japan","organizationType":"professional_society"}],"label":"MRS-J 2025 official co-host / sponsor listings","sourceUrl":"https://www.mrs-j.org/meeting2025/en/sponsor.php","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"2 official co-host / sponsor listing rows"}},"city":"Yokohama","tier":"b","venue":"Industry & Trade Center 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Hall、共済会館を使います。","question":"2026年の会期と会場は？","sourceUrls":["https://www.mrs-j.org/meeting2026/en/about.php"]},{"answer":"当初の7月31日から延長され、2026年8月7日15時（JST）が締切でした。採否通知は8月21日からMyPageで出されています。","question":"2026年の投稿締切はいつでしたか？","sourceUrls":["https://www.mrs-j.org/meeting2026/en/important.php"]}],"headline":"第36回MRS-J年次大会は2026年12月7〜9日に横浜の産業貿易センタービルなどを会場に対面開催の予定で、5分野のsymposiumと全体ポスター企画で構成されます。","metaDescription":"The Annual Meeting of MRS-Jは日本MRS（The Materials Research Society of Japan）の年次大会。2026年の第36回は12月7〜9日に横浜の産業貿易センタービルほかで開かれ、英語abstractによる口頭・ポスター発表で材料分野のsymposiumを開きます。","oneLine":"MRS-J年次大会は、日本MRS（The Materials Research Society of Japan）が毎年開く、材料科学の分野横断のsymposium型会議です。","pageTitle":"MRS-J年次大会とは：日本MRSが横浜で開く材料科学の年次会議（2026年は第36回）","relatedConferenceIds":["mrs-fall-meeting","mrs-spring-meeting","emrs-fall","materials-research-meeting","jsap-spring-autumn"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は12月7日（月）〜9日（水）で、横浜市中区の産業貿易センタービルを中心に、横浜市開港記念会館、Hatoba Hall、共済会館の4会場を使います。発表は対面で行う予定です。2026年は正式なバンケットを設けず、7日と8日夜のポスターセッションで飲み物と軽食を出します。","facts":[{"label":"2026 会期","value":"2026-12-07〜09","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/about.php"},{"label":"2026 主会場","value":"Industry & Trade Center Bldg（横浜市中区山下町2）/ Yokohama, Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/about.php"},{"label":"2026 その他の会場","value":"Yokohama City Opening Memorial Hall（Jack's Tower）、Y-Port-Kousei-Hatoba Kaikan（Hatoba Hall）、Kyosaikaikan","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/about.php"},{"label":"2026 開催形式","value":"口頭（招待・一般）とポスター（90cm×210cm）、対面開催の予定","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/about.php"},{"label":"2026 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Symposiumです。プログラムのWeb掲載は12月1日の予定です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"日本MRSの前身AMSES（Advanced Materials Science and Engineering Society）は1989年3月に設立され、1990年10月にMRS-Jへ改称しました。会議一覧には2010年の第20回MRS-Japan Academic Symposiumから2025年の第35回Annual Meeting of MRS-Jまでが並び、2013年の第23回からAnnual Meetingの名称で載っています。","facts":[{"label":"前身団体の設立","value":"1989年3月 AMSES（Advanced Materials Science and Engineering Society）設立","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/en/info/history.php"},{"label":"会議一覧に載る最古の回","value":"20th MRS-Japan Academic Symposium（2010）","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/en/event/mrs_meetings.php"},{"label":"Annual Meeting名での掲載","value":"23rd Annual Meeting of MRS-J（2013）以降","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/en/event/mrs_meetings.php"},{"label":"前回","value":"35th Annual Meeting of 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lectureは論文執筆と出版を扱います。聴講だけの参加者もMyPageで「Audience」を選んで登録し、早期登録の締切は9月18日15時（JST）、オンライン登録の締切は11月10日15時（JST）です。","facts":[{"label":"2026 想定参加者","value":"多様な分野の研究者、学生、若手研究者","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/"},{"label":"2026 聴講者の登録","value":"MyPageで「Audience」を選択","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/abstract.php"},{"label":"2026 早期登録締切","value":"2026-09-18 15:00 JST","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/important.php"},{"label":"2026 オンライン登録の締切","value":"2026-11-10 15:00 JST","checkedAt":"2026-10-08","sourceUrl":"https://www.mrs-j.org/meeting2026/en/important.php"}],"title":"読者別の使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"2026年の正式名称はThe 36th Annual Meeting of MRS-Jで、主催・事務局は日本MRS（MRS-J）です。日本MRSの会議一覧は、この年次大会をAnnual Meeting of MRS-J（MRS-Japan Academic Symposium）として毎年の回次で並べています。2026年のChair of the Organizing CommitteeはKINDAI UniversityのNobuto 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閉じ込め・輸送・乱流）などに分かれます。B系統には成膜やエッチング・微細加工といった半導体プロセスに近い細目が並びます。2026年はオーガナイズドセッションも組まれ、E3「【応用】プラズマプロセスの高精度制御」は半導体プロセス、ナノ粒子合成、材料表面処理の分野間の情報共有をうたっています。","facts":[{"label":"2026 講演分野細目 A系","value":"A1 プラズマ基礎・放電物理 ほか A11まで","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/kw.html"},{"label":"2026 講演分野細目 B2","value":"成膜・表面機能化・界面制御","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/kw.html"},{"label":"2026 講演分野細目 B3","value":"エッチング・微細加工・低損傷プロセス","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/kw.html"},{"label":"2026 講演分野細目 C2","value":"閉じ込め・輸送・乱流","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/kw.html"},{"note":"半導体プロセス、ナノ粒子合成、材料表面処理の分野間の情報共有をうたう。","label":"2026 オーガナイズドセッション 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2017(PLASMA2017)/第34回年会）。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"学会の年会一覧によると第1回年会は1984年4月に九州大学で開かれ、1996年3月の第13回は京都大学総合人間学部で開かれました。2011年（第28回）、2014年（第31回）、2017年（第34回）はPlasma Conferenceとの合同開催です。2021年の第38回はオンライン開催で、2024年の第41回はタワーホール船堀（東京都江戸川区）、2025年の第42回は京都工芸繊維大学松ヶ崎キャンパスで開かれました。","facts":[{"label":"第1回年会","value":"1984-04-05〜04-06 / 九州大学","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"第13回年会（春開催期）","value":"1996-03-21〜03-23 / 京都大学総合人間学部","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"2017 合同開催","value":"Plasma Conference 2017(PLASMA2017)/第34回年会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"2021 オンライン開催","value":"第38回年会：2021-11-22〜11-25 オンライン開催","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"2025 会期・会場","value":"第42回年会：2025-12-01〜12-04 / 京都工芸繊維大学松ヶ崎キャンパス","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"2024 会期・会場","value":"第41回年会：2024-11-17〜11-20 / タワーホール船堀（東京都江戸川区）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のプログラムは一般講演（口頭・ポスター）、招待講演、シンポジウム、オーガナイズドセッション、ポストデッドライン講演で構成されています。シンポジウムにはS3「LHDプロジェクトの工学的貢献と今後のフュージョンエネルギー開発への展開」とS4「核融合産業エコシステムの構築に向けて」が入っています。招待講演にはJT-60SAの装置増強とコミッショニングの進展（QST）や、粉体ターゲットプラズマプロセスを用いた薄膜作製（佐世保高専）があります。展示会・バナー広告・合同ランチョンセミナーの申込締切は11月6日です。","facts":[{"label":"2026 シンポジウム S3","value":"LHDプロジェクトの工学的貢献と今後のフュージョンエネルギー開発への展開","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/symp.html"},{"label":"2026 シンポジウム S4","value":"核融合産業エコシステムの構築に向けて —官民連携・地域連携・実行体制の設計","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/symp.html"},{"label":"2026 招待講演の例","value":"JT-60SAの装置増強とコミッショニングの進展（芝間祐介, QST）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/invite.html"},{"label":"2026 招待講演（応用）","value":"粉体ターゲットプラズマプロセスを用いた薄膜作製（川崎仁晴, 佐世保高専）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/invite.html"},{"label":"2026 プログラム区分","value":"ポストデッドライン講演はポスターのみ","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/02.html"},{"label":"2026 企業展示の申込締切","value":"展示会・バナー広告・合同ランチョンセミナー 2026-11-06","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/tenji.html"}],"title":"2026年のプログラム構成","eyebrow":"program"},"audience":{"id":"audience","body":"学生や若手研究者には若手学会発表賞（学生会員部門・正会員部門）があり、2026年4月1日時点で満35歳以下または会議開催中に学生であることが条件です。2026年の事前参加登録（割り増しなし）の締切は10月27日です。企業の担当者は企業展示・広告・合同ランチョンセミナーの枠で参加でき、賛助会員企業の所属者は会員価格で参加登録できます。半導体プロセスの観点ではB3やオーガナイズドセッションE3の発表が該当します。","facts":[{"label":"若手学会発表賞の部門","value":"学生会員部門・正会員部門","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html"},{"label":"2026 若手学会発表賞の年齢条件","value":"2026-04-01時点で満35歳以下または会議開催中に学生","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html"},{"label":"2026 事前参加登録（割り増しなし）締切","value":"2026-10-27 23:59","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"}],"title":"研究室・企業担当者向けの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"主催は一般社団法人プラズマ・核融合学会で、年会は通し番号で数えられ、2024年が第41回、2025年が第42回、2026年が第43回です。学会の年会一覧ページに毎年の回次が並びます。","facts":[{"label":"正式名称（2026）","value":"第43回 プラズマ・核融合学会 年会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"},{"label":"主催","value":"一般社団法人 プラズマ・核融合学会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"},{"note":"2024年が第41回、2025年が第42回、2026年が第43回。","label":"開催頻度","value":"年1回（年会一覧に毎年の回次が並ぶ）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"学会事務局所在地","value":"名古屋市千種区","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年の招待講演者の所属にはQSTや統計数理研究所などが並びます。賛助会員企業の所属者は会員価格で参加でき、1名1件に限り参加費無料で登壇できる規定があります。APSとEPSの外国籍会員は本会会員と同じ扱いです。","facts":[{"label":"2026 招待講演者の所属（例）","value":"QST","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/invite.html"},{"label":"2026 招待講演者の所属（例）","value":"統計数理研究所","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/invite.html"},{"label":"賛助会員企業所属者の参加条件","value":"会員価格で参加、1名1件に限り参加費無料で登壇","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/sankahi.html"},{"label":"海外学会会員の扱い","value":"外国籍のAPS・EPS会員は本会会員と同じ扱い","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/sankahi.html"}],"title":"参加者・会員制度","eyebrow":"community"},"comparison":{"id":"comparison","body":"年会一覧では2011年・2014年・2017年の年会がPlasma Conferenceとの合同回として数えられており、Plasma Conferenceの開催年は年会の回次がその合同会議に充てられています。","facts":[{"label":"2014 合同開催","value":"Plasma Conference 2014(PLASMA2014)/第31回年会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"},{"label":"2011 合同開催","value":"Plasma Conference 2011(PLASMA2011)/第28回年会","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/introduction/nenkai.html"}],"title":"近い学会との関係","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年の一般講演の申込は8月14日に締め切られ、予稿のアップロード締切は11月13日（若手学会発表賞の申請者は10月27日）です。予稿は一般講演が1ページ以内、招待講演やシンポジウム等は2ページ以内のA4縦で、PDFで提出します。発表言語は日本語または英語で、登壇者1名につき口頭1件、ポスター3件までです。11月16日〜20日にはポスター限定のポストデッドライン講演の受付があります。","facts":[{"label":"2026 講演申込締切","value":"2026-08-14 17:00","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html"},{"label":"2026 予稿アップロード締切（若手賞申請者以外）","value":"2026-11-13","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"2026 予稿締切（若手学会発表賞申請者）","value":"2026-10-27","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html"},{"label":"予稿のページ数","value":"一般講演1ページ以内、招待講演・シンポジウム等2ページ以内","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"予稿の書式","value":"A4縦、PDFで提出","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"発表言語","value":"日本語または英語","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"登壇件数の上限","value":"登壇者1名につき口頭1件、ポスター3件まで","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html"},{"label":"2026 ポストデッドライン講演受付","value":"2026-11-16〜11-20 17:00（ポスターのみ）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"}],"title":"講演申込・予稿","eyebrow":"submission"},"publication":{"id":"publication","body":"講演予稿集はオンライン公開のみで、冊子体は配布されません。2026年のオンライン予稿集は11月24日以降に公開予定とされ、提出された予稿の著作権は学会に帰属します。別冊プログラムは学会誌Vol.102の10月号の付録として同封される予定です。","facts":[{"label":"予稿集の形態","value":"オンライン公開のみ（冊子体なし）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"2026 オンライン予稿集公開","value":"2026-11-24以降（予定）","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"},{"label":"予稿の著作権","value":"プラズマ・核融合学会に帰属","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html"},{"label":"2026 別冊プログラム","value":"学会誌 Vol.102 10月号の付録として同封予定","checkedAt":"2026-10-08","sourceUrl":"https://www.jspf.or.jp/jspf_annual2026/01.html"}],"title":"予稿集","eyebrow":"publication"}},"sources":[{"url":"https://www.jspf.or.jp/jspf_annual2026/01.html","role":"official","label":"第43回年会 重要事項","checkedAt":"2026-10-08","evidenceLocator":"ページ上部の会期・会場と「重要日程」の表"},{"url":"https://www.jspf.or.jp/jspf_annual2026/02.html","role":"program","label":"第43回年会 プログラム","checkedAt":"2026-10-08","evidenceLocator":"プログラム区分のリンク一覧"},{"url":"https://www.jspf.or.jp/jspf_annual2026/kw.html","role":"cfp","label":"第43回年会 一般講演分野細目","checkedAt":"2026-10-08","evidenceLocator":"領域キーワード（一般講演分野細目）A1〜D11、E1〜E6"},{"url":"https://www.jspf.or.jp/jspf_annual2026/ippan_wakate.html","role":"cfp","label":"第43回年会 若手学会発表賞・講演申込","checkedAt":"2026-10-08","evidenceLocator":"審査方法、応募条件、応募期限の各段落"},{"url":"https://www.jspf.or.jp/jspf_annual2026/yokou_up.html","role":"cfp","label":"第43回年会 講演予稿アップロード","checkedAt":"2026-10-08","evidenceLocator":"発表形式、原稿書式、アップロード締切、講演予稿集の段落"},{"url":"https://www.jspf.or.jp/jspf_annual2026/pd.html","role":"cfp","label":"第43回年会 ポストデッドライン講演","checkedAt":"2026-10-08","evidenceLocator":"申込方法と採択通知の段落"},{"url":"https://www.jspf.or.jp/jspf_annual2026/symp.html","role":"program","label":"第43回年会 シンポジウム","checkedAt":"2026-10-08","evidenceLocator":"S1〜S5の題目と登壇者"},{"url":"https://www.jspf.or.jp/jspf_annual2026/invite.html","role":"program","label":"第43回年会 招待講演","checkedAt":"2026-10-08","evidenceLocator":"講演番号・講演者・所属・題目の一覧"},{"url":"https://www.jspf.or.jp/jspf_annual2026/os.html","role":"program","label":"第43回年会 オーガナイズドセッション","checkedAt":"2026-10-08","evidenceLocator":"E1〜E6のテーマ紹介"},{"url":"https://www.jspf.or.jp/jspf_annual2026/tenji.html","role":"sponsor","label":"第43回年会 企業展示","checkedAt":"2026-10-08","evidenceLocator":"お申込み締切日の項"},{"url":"https://www.jspf.or.jp/jspf_annual2026/sankahi.html","role":"registration","label":"第43回年会 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Californiaの研究者が講演者として掲載されています。2024年は46件の口頭・ポスター発表に加え、keynote 5件・invited 7件が行われました。","question":"どんな人が発表しているのですか。","sourceUrls":["https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/","https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"]},{"answer":"直近では2024年9月25〜27日に仙台（Hotel Metropolitan Sendai／Sendai Kokusai Hotel）で開催され、220名が参加しました。Organizing Committee ChairとTechnical Program Chairはいずれも東北大学の所属者で、Advanced Programには32ブースの出展社一覧が掲載されています（出展はその年に展示・支援した事実のみを示します）。2026年のsteering committeeにも東北大学の所属者が入っています。","question":"日本からの参加や日本開催の実績はありますか。","sourceUrls":["https://3dic-conf.org/home2024/","https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf","https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"]},{"answer":"Call for Papersは「3D-IC'26 is seeking high quality workshop and tutorial proposals」として提案を募集しており、提案は3dic@gatech.eduへメールで送る形です。2026-08-05時点で、実際に開催されるtutorialの題目や時間割は公表されていません。","question":"tutorialやworkshopはありますか。","sourceUrls":["https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf","https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"]}],"headline":"公式サイト（3dic-conf.org）の2026年サイクル各ページ、Call for Papers PDF原本、2024年Advanced Program PDF、およびDBLPの巻号一覧だけを根拠に、3DICで確認できることと公表されていないことを整理します。","metaDescription":"3DIC（IEEE International 3D Systems Integration Conference）の2026年会期・会場、abstract締切と採択通知、査読体制、委員会、2024年の実績を公式ページとCall for Papers原本で確認。","oneLine":"3DICは、IEEE EPSがtechnical sponsorとなる3D system integrationの国際会議で、2026年は10月1〜2日にGeorgia Institute of Technology（米国アトランタ）で開催されます。","pageTitle":"3DICとは｜IEEE 3D Systems Integration Conferenceの会期・投稿締切・査読を公式情報で確認","relatedConferenceIds":["ectc","eptc","estc","epeps","imaps-symposium","icept"],"sections":{"cycle":{"id":"cycle","body":"2026年は2日間の開催で、会場はGeorgia Institute of Technologyキャンパス内のMarcus Nanotechnology Buildingです。トップページとVenueページのどちらにも、現地開催・hybrid・onlineの別は書かれていません。前サイクルの規模感を知りたい場合は、2024年仙台開催のページに参加者数が明記されているので、そちらを併読してください。","facts":[{"note":"トップページの表記をそのまま記載。","label":"2026 会期","value":"Oct 1 – 2, 2026","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"Call for Papers PDFのLocation欄。","label":"2026 開催地（Call for Papers表記）","value":"\"This year's IEEE International 3D System Integration Conference (3DIC 2026) will be held at Georgia Institute of Technology, Atlanta.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Venueページの会場名。","label":"2026 会場","value":"Marcus Nanotechnology Building","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/venue-2026/"},{"note":"Venueページに住所として記載。同ページはMARTA（Atlanta Rail Transit system）でのアクセスも案内している。","label":"2026 会場住所","value":"345 Ferst Drive, Atlanta, GA 30332（米国ジョージア州アトランタ）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/venue-2026/"},{"note":"Venueページには会場・交通・宿泊の案内のみで、参加形式の別についての記述がない。","label":"2026 開催形式（現地／hybrid／online）","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/venue-2026/"},{"note":"2024年Advanced Programの全ページヘッダに繰り返し印字されている。","label":"2024 会期・会場","value":"September 25-27, 2024 / September 25 at Hotel Metropolitan Sendai、September 26-27 at Sendai Kokusai Hotel（日本・仙台）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年ホームページの告知文。2026年については参加者数の見込みは公表されていない。","label":"2024 参加者数","value":"\"We are pleased to announce that the conference was attended by 220 participants.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/home2024/"},{"note":"トップページ・Conference Archiveのいずれにも2027年の会期・開催地の告知がない。","label":"2027 次サイクル","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/archive/"}],"title":"2026年サイクルの会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"Call for Papersは対象を2つの見出し（Technology / Applications, Design and Computer Aided Design (CAD)）に分けており、材料・装置・接合といったプロセス側と、設計フロー・電源/信号インテグリティ・熱・応力・信頼性・テストといった設計側の両方を1本のCFPで募集しています。「including, but not limited to」と書かれており、対象外領域の明示的な列挙はありません。自分のテーマが該当するか迷う場合は、CFP PDFのキーワード列に自分のキーワードが載っているかで判断するのが最短です。","facts":[{"note":"Call for Papers PDFのTopics Areas / Technology欄。","label":"2026 Technologyトラックの対象","value":"\"Materials, equipment, wafer handling, diverse substrates, Through Silicon Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active, passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Call for Papers PDFのTopics Areas / 第2見出し。","label":"2026 Applications, Design and CADトラックの対象","value":"\"Synthesis, design flows, signal design, power integrity, thermal considerations, mechanical stress, reliability, test, techniques, analysis, chiplet and chiplet design etc.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Call for Papers PDF内の応用領域列挙（原文の表記ゆれを含めそのまま引用）。","label":"2026 想定アプリケーション領域","value":"\"imaging, memory, processors, communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA, RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics, optoelectronics, etc. Application areas such quantum computing, embedded systems, artificial intelligence and others.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"トップページの紹介文。CFP PDFより短いまとめ表記になっている。","label":"2026 トップページのスコープ表記","value":"\"3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"2024年Advanced Programのchairman挨拶。2024年時点でのスコープ変更に関する公式の言及。","label":"2024 スコープ拡張の記載","value":"\"the scope has been expanded to include 3D/Chiplets/AI semiconductors\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Call for Papersは\"Papers are solicited on all 3D IC topics including, but not limited to, the following:\"とだけ書き、除外領域を列挙していない。","label":"対象外領域の明示","value":"明示されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"Call for Papersが会議自体を「a peer-reviewed conference」と明記しており、査読プロセスの運用にはMicrosoft CMTが使われています。2026年のTechnical Program CommitteeはchairのみがOrganizationページに掲載され、メンバーは「(to be announced)」の状態です。採択率や査読基準（審査観点）は公表されていないため、投稿判断は採択率ではなくCall for Papersのトピック一致度で行うことになります。","facts":[{"note":"Call for Papers PDF冒頭の一文。","label":"2026 査読の有無（Call for Papers原文）","value":"\"The IEEE International 3D Systems Integration Conference is a peer-reviewed conference that aims to bring together 3D researchers from academia, government, and industry.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Organizationページを含む2026年サイクルの各ページ下部に記載。double-blindなど匿名性に関する記述はない。","label":"2026 査読プロセスの運用","value":"Microsoft CMT service（\"used for managing the peer-reviewing process for this conference\"）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"Organizationページ。TPCメンバー欄は\"(to be announced)\"と記載されている。","label":"2026 Technical Program Committee Chair","value":"Eren Kurshan (Princeton)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"Papersページ・Programページ・Organizationページのいずれにも投稿数・採択数・採択率の記載がない。","label":"2026 採択率","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"評価軸やスコアリング基準を示すページは公式サイト内に見当たらない。Call for Papersは\"high-quality novel research paper submissions\"を求めるとのみ書いている。","label":"2026 審査観点","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"2024年Advanced ProgramのCONFERENCE PUBLICATION CHAIR欄。2026年ページには同等の役職の記載がない。","label":"2024 Conference Publication Chair","value":"Takafumi Fukushima, Tohoku University","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"}],"title":"査読方式と審査体制","eyebrow":"review"},"caveats":{"id":"caveats","body":"3DICの公式サイトは年ごとにページ構造が変わり、旧サイクルのページに新サイクルのナビゲーションが表示されることがあります。2026年8月5日に確認した表示ではトップと投稿ページの予定日に不一致がありましたが、2026年10月14日時点の現行表示は、両ページともabstract受付と通知が終了し、final camera-ready manuscriptは9月30日締切としています。通知の実施日そのものは現行表示で確認できません。Paper Submissionsはfinal manuscriptを二段組4または5ページとし、非発表論文をIEEE Xploreへ収録しないと明記していますが、収録の全条件と著作権の扱いは今回確認したページだけでは確定できません。採択率・投稿数・審査観点、現地／hybrid／onlineの別、参加費に含まれるものと早期割引、企業スポンサー一覧、Technical Program Committeeの全メンバー、2027年の会期・開催地も今回確認した資料では未確認です。","facts":[{"note":"abstract締切（August 15、延長後）のみ両ページで一致している。Call for Papers PDFはPapersページ側の日付（August 31 / September 30）と一致する。","label":"締切表記の不一致（2026年）","value":"Papersページは「review opens August 3 / notifications August 31 / full paper due September 30」、トップページは「review opens August 18 / notifications September 14 / camera-ready due September 29」と記載しており一致しない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"同一PDF内で単複と略記が揺れているため、検索や引用のときは表記を固定せずに出典側の綴りを確認する必要がある。","label":"会議名の表記ゆれ","value":"Call for Papers PDFは表題を「IEEE International 3D System Integration Conference / 3D-IC 2026」（単数形System）とし、本文冒頭では「The IEEE International 3D Systems Integration Conference」（複数形Systems）と書いている。同PDF内で「3DIC’26」「3D-IC’26」の略記も併用されている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"2024年ホームページを開いてもヘッダのリンク先は2026年のPapers/Program/Registrationになるため、年度の取り違えに注意。","label":"旧サイクルのページが混在","value":"2024年サイクルのページ（home2024 等）が公開されたまま、ナビゲーションは2026年サイクルのリンクを表示している","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/home2024/"},{"note":"2024年の投稿書式・締切を一次情報で確認する手段は、公開されているAdvanced Program PDFに限られる。","label":"2024年Call for Papersページは閲覧不可","value":"https://3dic-conf.org/2024-call-for-papers/ はパスワード保護されており本文を確認できない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/2024-call-for-papers/"},{"note":"「第N回」を引用する場合は、根拠が2024年Advanced ProgramなのかArchiveなのかを明示する必要がある。","label":"回次カウントとArchive一覧の差","value":"2024年プログラムの回次列挙は2016年（第7回）から2019年（第8回）へ飛ぶが、公式Archiveには2018年（Cork, Ireland）の項目が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/archive/"}],"title":"このページで扱わないことと、公式表記の注意点","eyebrow":"caveats"},"history":{"id":"history","body":"3DICは2つの前身会議を統合して2009年にサンフランシスコで第1回が開かれた、と公式が明記しています。以降の開催地は公式Archiveの一覧で確認でき、仙台・大阪（日本）、サンフランシスコ・ローリー（米国）、ミュンヘン（ドイツ）、コーク／キンセール（アイルランド）が並びます。開催地の決め方やローテーション規則を明記した記述は公式サイトにありません。また公式のArchiveページに載っている年と、2024年プログラムに書かれた回次の年が完全には一致しないため、「第N回」を引用するときは根拠ページを添えてください。","facts":[{"note":"2024年ホームページの沿革記述。","label":"統合前の前身会議","value":"\"This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/home2024/"},{"note":"2024年Advanced Programのchairman挨拶。2024年ホームページにも\"the first combined conference in San Francisco in 2009\"の表現がある。","label":"統合後の初回開催","value":"\"The first international 3D conference was held in San Francisco in 2009 after combining the previous two 3D conferences\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced Programのchairman挨拶。2024年が第11回にあたる。","label":"回次と開催地（2024年プログラム記載）","value":"\"The 2nd conference was held in Munich in 2010, the 3rd in Osaka in 2012, the 4th in San Francisco in 2013, the 5th in Cork in 2014, the 6th in Sendai in 2015, the 7th in San Francisco in 2016, the 8th in Sendai in 2019, the 9th in Raleigh in 2021, and the 10th in Cork in 2023\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Conference Archiveページの一覧。2024年プログラムの回次列挙には含まれない2018年の項目が掲載されている。","label":"公式Archiveの掲載年一覧","value":"3DIC 2024 (Sendai, Japan)、2023 (Cork, Ireland)、2021 (Raleigh, NC, USA)、2019 (Sendai, Japan)、2018 (Cork, Ireland)、2016 (San Francisco, USA)、2015 (Sendai, Japan)、2014 (Kinsale, Cork, Ireland)、2013 (San Francisco, California, USA)、2011-2012 (Osaka, Japan)、2010 (Munich, Germany)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/archive/"},{"note":"DBLPのconf/3dicインデックス。","label":"名称表記の変遷（書誌上）","value":"DBLPでは2009年・2010年巻が \"IEEE International Conference on 3D System Integration\"、2011年以降の巻が \"International 3D Systems Integration Conference\"（3DIC）系の表題で索引されている","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/3dic/index.html"},{"note":"年またぎ開催のため表記が分かれている。2024年プログラムは同回を\"the 3rd in Osaka in 2012\"としている。","label":"2011/2012年開催の表記ゆれ","value":"DBLPは2011年巻を \"2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012\" と記載し、公式Archiveは \"3DIC 2011-2012 – Osaka, Japan\" と表記している","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/3dic/index.html"},{"note":"2024年ホームページの告知文。なお公式Conference Archiveには2025年の項目がなく、DBLPにも2025年巻の索引がない（いずれも各ページ側で確認）。","label":"2025年開催の告知","value":"2024年ホームページは次回を \"3DIC 2025\"（October 15-17, 2025, North Carolina, USA）として告知している","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/home2024/"}],"title":"沿革と開催地ローテーション","eyebrow":"history"},"program":{"id":"program","body":"2026年のProgramページは編成途中で、確定した講演者と演題、およびパネルの題目が先行公開されています。時間割やセッション分けはまだ掲載されていません。プログラムの厚みを見積もりたい場合は、2024年のAdvanced Program PDFのセッション構成（プロセス系と設計系が交互に並ぶ構成）が参考になります。","facts":[{"note":"Programページの講演者一覧より抜粋。所属表記は同ページの記載どおり。","label":"2026 確定講演者（一部）","value":"Baris Arslan (imec)「2.5D Test Access Architectures for Automotive Chiplets」／Rozalia Beica (Rapidus)「Heterogeneous Integration / Chiplet technology — new scaling strategy at Rapidus」／Sandeep Kumar Goel (TSMC)「Standardizing the 3D Frontier: How IEEE Std P3537/3Dblox Streamlines 2.5D/3D Advanced Packaging」","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"},{"note":"Programページの講演者一覧より抜粋。","label":"2026 確定講演者（続き）","value":"Sreejit Chakravarty (Ampere Computing)「Chiplet Interconnect Test and Repair Standardization (IEEE Std P3405)」／Imene Jadli (imec)「3D Silicon Photonics」／Sung Kyu Lim (University of Southern California)「Logic Folding and Fine-Grained Logic-on-Logic 3D ICs: A Key Enabler of Tau Law」／Robert Patti (NHanced Semiconductors)「3D Photonic Integration: Enabling Multi-Terabit Operation」","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"},{"note":"Programページの講演者一覧より抜粋。演題未定の2名は「Topic: tbd」と記載されている。","label":"2026 確定講演者（続き2）","value":"Masayoshi Tagami (Kioxia)「Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory」／Andras Vass-Varnai (Siemens-EDA)「From Silicon to System: Enabling Scalable 3D IC Packaging Through Multiphysics Simulation」／Muhannad Bakir (Georgia Tech) 演題未定／Eric Vogel (Georgia Tech) 演題未定","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"},{"note":"Programページのパネル欄。","label":"2026 パネルセッション","value":"「The Self-Sustaining Economics of a Truly Open Chiplet Market」（Martin Keim / Siemens EDA、Robert Patti / NHanced Semiconductors、追加パネリストは未発表）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"},{"note":"Programページの募集文。タイムテーブルは2026-08-05時点で未掲載。","label":"2026 プログラム提案の募集","value":"\"The 3DIC 2026 committee is currently building its program and seeks speakers, tutorial presenters, panel organizers, and workshop leaders.\"（提案の宛先は3dic@gatech.edu）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"},{"note":"2024年Advanced Programのchairman挨拶。","label":"2024 発表規模","value":"\"46 papers will be presented as general oral presentations and poster presentations from worldwide\" ／ \"we have five outstanding keynote speakers and seven distinguished invited speakers\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced ProgramのPROGRAM SCHEDULE。ほかにPoster Session、Panel Session、Award Ceremony & Closing Remarksが組まれている。","label":"2024 セッション名","value":"Session 1: Quantum Technology ／ Session 2: Process Technology for Hybrid Bonding ／ Session 3: Advanced Interposers ／ Session 4: Design&Thermal Management ／ Session 5: Bumpless and Hybrid Bonding Technology","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced Programの会場図・PROGRAM-AT-A-GLANCE。","label":"2024 併設イベント","value":"Exhibition（9月26〜27日、Sendai Kokusai Hotel Heisei Room 2F）、Poster Session（9月26日）、Banquet（9月25日18:00-20:00、Hotel Metropolitan Sendai）、Student Award Ceremony","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"}],"title":"プログラム構成（2026年の確定分と2024年の実績）","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からは、abstractが約500語で、学生登録費が90ドル（税別）と公表されている点を確認できます。企業の調査担当は、2024年Advanced Programに32ブースの出展社一覧とセッション名がそれぞれ掲載されているので、その年に何が展示され、何が議論されたかを別々に確認できます（出展の事実と発表テーマは別の情報です）。参加費はIEEE会員かどうかで125ドル差がつくため、複数名で行く場合は会員種別を先に整理してください。","facts":[{"note":"Registrationページ。\"Rates below are in US dollars and do not include tax (8.9%).\"と付記されている。","label":"2026 参加費","value":"Student $90 ／ IEEE Member $200 ／ Non-student, non-IEEE $325","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/registration-2026/"},{"note":"Registrationページ。論文投稿はMicrosoft CMT、参加登録はEasyChairと系統が分かれている。","label":"2026 参加登録の方法","value":"\"Registration for 3DIC 2026 is processed via EasyChair. If you do not have an EasyChair account you will be prompted to create one (it's free).\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/registration-2026/"},{"note":"Registrationページには料金と課税の記載のみで、含まれるもの（食事・レセプション等）や早期割引の締切日の記載がない。","label":"2026 参加費に含まれるもの","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/registration-2026/"},{"note":"2026年サイクルの各ページには表彰に関する記載が見当たらない（2026-08-05時点）。","label":"学生向けの表彰","value":"2024年Advanced Programは会場案内でHeisei Hall 2Fの用途に「Student Award Ceremony」を挙げ、詳細プログラムでは9月27日12:15-12:30を「Award Ceremony and Closing Remark」としている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Organizationページ。2024年の組織委員会・Technical Program Committeeの東北大学所属者については、community節の2024年Advanced Program由来の項目を参照。","label":"日本からの関与","value":"2026年のsteering committeeにMitsumasa Koyanagi (Tohoku University) が掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"Programページの講演者一覧。所属は同ページの印字どおりで、企業の事業関係を示すものではない。","label":"企業からの登壇（2026年確定分）","value":"imec、Rapidus、Ampere Computing、TSMC、NHanced Semiconductors、Kioxia、Siemens-EDA の所属者が講演者として掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/program-2026/"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"公式サイト上でも表記が一定していないため、検索や社内資料で会議名を書くときは出典ページを合わせて控えておくと安全です。トップページは「IEEE International 3D Systems Integration Conference (3DIC)」、2026年のCall for Papers PDFは「IEEE International 3D System Integration Conference / 3D-IC 2026」と書いています。technical sponsorはIEEE EPSで、問い合わせ窓口はconference chairs宛のメールアドレスのみが公開されています。","facts":[{"note":"トップページの見出しに記載。","label":"2026 正式名称（トップページ表記）","value":"IEEE International 3D Systems Integration Conference (3DIC)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"PDF冒頭の表題行。本文中では「3DIC'26」「3D-IC'26」の両方が使われている。","label":"2026 正式名称（Call for Papers PDF表記）","value":"IEEE International 3D System Integration Conference / 3D-IC 2026","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Organizationページの「Technical Sponsor」欄に1行で記載。","label":"2026 technical sponsor","value":"IEEE EPS","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"2024年Advanced Program冒頭のWELCOME FROM THE CONFERENCE CHAIRMAN（Prof. Tetsu Tanaka, Tohoku University）内の一文。","label":"2024 sponsor表記","value":"\"This international conference is sponsored by the IEEE Electronics Packaging Society (EPS).\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced Programのchairman挨拶。2026年ページには開催回の記載がない。","label":"2024 開催回","value":"第11回（\"This year, the 11th time the conference will be held\"）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Contact Usページには個人名・役職の記載がなく、メールアドレスのみ。","label":"2026 問い合わせ先","value":"3dic@gatech.edu / paulf@ncsu.edu（conference chairs宛）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/contact-us-2026/"},{"note":"2026年サイクルの各ページ下部に共通で表示される定型文。","label":"2026 査読運用サービス","value":"\"The Microsoft CMT service was used for managing the peer-reviewing process for this conference.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/"}],"title":"会議の正式名称と主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のsteering committeeはco-chair 2名とmember 6名で、Organizationページには氏名と所属機関名だけが印字されています（所属の所在国は書かれていません）。2024年の組織委員会はASIA / USA / EUROPEの3ブロックに分けて掲載されていました。企業側の関与を見る場合は、委員会名簿と、2024年の出展社リストを分けて読んでください。出展社リストはその年に展示・出展した事実の記録であり、取引関係や共同研究を示すものではありません。","facts":[{"note":"Organizationページ。","label":"2026 Steering Committee Co-Chairs","value":"Paul Franzon (North Carolina State University)、Robert Harris (Georgia Institute of Technology)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"Organizationページ。所属表記は同ページの記載どおり。","label":"2026 Steering Committee Members","value":"Mitsumasa Koyanagi (Tohoku University)、Eren Kurshan (Princeton)、Erik Jan Marinissen (imec)、Robert Patti (NHanced Semiconductors)、Peter Ramm (Fraunhofer)、Pascal Vivet (CEA Leti)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"},{"note":"2024年Advanced ProgramのCONFERENCE ORGANIZATION。地域見出しは原文どおり。","label":"2024 Organizing Committee（地域別）","value":"ASIA: Tetsu Tanaka (Tohoku University)、Kangwook Lee (SK-Hynix)、Kuan-Neng Chen (National Yang Ming Chiao Tung University)、Takafumi Fukushima (Tohoku University) ／ USA: Paul Franzon (North Carolina State University)、Bob Patti (NHanced Semiconductor)、Muhannad S. Bakir (Georgia Institute of Technology) ／ EUROPE: Peter Ramm (Fraunhofer EMFT)、Pascal Vivet (CEA-Leti)、V. S. Nagaraja (Tyndall National Institute)、Marco del Sarto (STMicroelectronics)","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced Programの3DIC 2024 TECHNICAL PROGRAM COMMITTEE欄より抜粋。大学・公的研究機関と企業が混在する。","label":"2024 Technical Program Committee","value":"Chair: Takafumi Fukushima (Tohoku University)。委員にMasahiro Aoyagi (Kumamoto University)、Kwang-Seong Choi (ETRI)、Fumihiro Inoue (Yokohama National University)、Katsuya Kikuchi (AIST)、Eren Kurshan (Princeton University)、Wei-Chung Lo (ITRI)、Makoto Nagata (Kobe University)、Takayuki Ohba (Tokyo Institute of Technology)、Katsuyuki Sakuma (IBM)、Chuan Seng Tan (Nanyang Technological University)、Sébastien Thuriès (CEA-Leti) ほか","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced Programのchairman挨拶。出展は展示・支援の事実のみを示す。","label":"2024 出展ブース数","value":"\"In the 3DIC 2024, 32 exhibition booths will be installed by leading companies in the electronic components, materials, packaging, and services fields\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"2024年Advanced ProgramのEXHIBITORS (by alphabetical order) 一覧。出展した事実のみを示し、顧客関係・売上・採用・共同研究を意味しない。","label":"2024 出展社（EXHIBITORS一覧より抜粋）","value":"ACCRETECH、AYUMI INDUSTRY、C.Uyemura ＆Co.、Camtek、CKD、Connectec Japan、DAICEL、D-process、Finetech Nipon、HiSOL、IEEE Electronics Packaging Society、JCU、Kitagawa Gress Tech、LINTEC、Marubun、MEIDEN NANOPROCESS INNOVATIONS、SCREEN Holdings、SEKISUI Chemical、Siemens EDA、Sumitomo Bakelite、TAZMO、Tohoku-MicroTec、TOKYO OHKA KOGYO、Toray Engineering、Toray Research Center、Tosetz、TOWA、USHIO、Yamaha Robotics Holdings、Zuken","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Organizationページはtechnical sponsorとしてIEEE EPSのみを掲げ、企業スポンサーや出展社の一覧を掲載していない。","label":"2026 sponsor / exhibitor一覧","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"}],"title":"委員会構成と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"3DICはtechnical sponsorがIEEE EPSであり、扱う範囲がTSV・bonding・interposer/chipletといった実装プロセスから、設計フロー・熱・信頼性・テストまで一続きになっている点が特徴です。実装系の他会議と比べるときは、規模（3DIC 2024で発表46件・出展32ブース・参加220名）とスコープ文を並べて見ると差が把握しやすくなります。ただし他会議の数値やスコープは、それぞれの公式ページで確認してください。このページでは3DIC公式が公表した数字のみを扱います。","facts":[{"note":"Call for Papers PDFのTopics Areas構成。","label":"スコープの重心（2026年）","value":"Technologyトラックと Applications, Design and CAD トラックの2本立てで、材料・装置・接合と、設計・熱・応力・信頼性・テストを同一CFPで募集","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"トップページの表記。2024年が3日間（September 25-27）だったことは2024年Advanced Program側の記載。","label":"会期の長さ（2026年）","value":"2日間（Oct 1 – 2, 2026）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"2024年Advanced Programのchairman挨拶に書かれた数値。参加者数（220名）は同PDFにはなく、2024年ホームページ側の記載（cycle節の該当項目を参照）。","label":"直近実績の規模（2024年）","value":"発表46件、keynote 5件、invited 7件、出展32ブース","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf"},{"note":"Organizationページ。他のIEEE EPS関連会議と比較する場合は、各会議の公式ページでsponsor表記を個別に確認する必要がある。","label":"所属母体","value":"technical sponsorはIEEE EPS","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/committees-and-supporters-2026/"}],"title":"近い会議との棲み分けを確認するときの見方","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年の投稿は初回abstractと、採択後のfinal manuscriptから成る二段階方式です。2026年10月14日時点の公式ホームとPaper Submissionsは、abstract受付と採否通知が終了し、final camera-ready manuscriptの締切を9月30日と表示しています。採択後の原稿はIEEE二段組4または5ページで、PDF Expressで確認後、Georgia TechとIEEE EDASの両方へ提出します。同じ欄には、2026年8月5日時点で公式ページ間にあった予定日の不一致も履歴として残しています。","facts":[{"note":"Call for Papers PDFのLength and Format欄。","label":"2026 abstract書式（Call for Papers原文）","value":"\"Abstracts should be about 500 words in length; some figures and tables can be included.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Call for Papers PDFのLength and Format欄。full paperのページ数上限は同PDFに記載がない。","label":"2026 full paper書式（Call for Papers原文）","value":"\"Notifications will occur by August 31 and full papers in IEEE format will be required by September 30, 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Papersページの Important Dates 欄。年の記載はなく月日のみ。","label":"2026 締切一覧（Papersページ表記）","value":"Abstract submission opens: June 25 ／ Abstract submission extended! Now closes: August 15 ／ Paper review period opens: August 3 ／ Acceptance notifications: August 31 ／ Full paper submissions due: September 30","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"トップページのImportant dates欄。Papersページとreview開始日・通知日・最終原稿日が一致しない。","label":"2026 締切一覧（トップページ表記）","value":"Abstract submission has been extended! Will close: August 15 ／ Paper review period opens: August 18 ／ Acceptance notifications: September 14 ／ Full camera-ready submissions due: September 29","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/"},{"note":"\"Papers for 3DIC 2026 are processed via Microsoft CMT.\" アカウントがない場合は無料で作成するよう案内されている。","label":"2026 投稿システム","value":"Microsoft CMT（https://cmt3.research.microsoft.com/3DIC2026/）","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"Call for Papers PDFのWorkshop and Tutorials欄。提案はCMTではなくメールで受け付ける。","label":"2026 workshop / tutorial提案","value":"\"3D-IC'26 is seeking high quality workshop and tutorial proposals in the areas of 3D Integration technology, applications, design and computer aided design areas. To propose an idea for a tutorial please contact the conference organizers at 3dic@gatech.edu.\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"Paper SubmissionsのSubmission Instructions for Accepted Papers。","label":"2026 final manuscriptの書式・ページ数","value":"IEEE Conference Template（WordまたはLaTeX）、二段組、4または5ページ","checkedAt":"2026-10-14","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"Papersページ末尾で、Call for Papers PDFのダウンロードとあわせて案内されている。","label":"2026 投稿に関する問い合わせ先","value":"3dic@gatech.edu","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"2026-10-14にPaper Submissionsを再確認。現行表示は通知の具体的な実施日を示していない。","label":"2026 投稿状況（Paper Submissions現行表示）","value":"Abstract submission is closed; acceptance notifications have been made ／ Full camera-ready paper submissions due: September 30","checkedAt":"2026-10-14","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"2026-10-14に公式ホームを再確認。現行表示は通知の具体的な実施日を示していない。","label":"2026 投稿状況（公式ホーム現行表示）","value":"Abstract submission: Closed ／ Acceptance notifications: Finished ／ Full camera-ready paper submissions due: September 30","checkedAt":"2026-10-14","sourceUrl":"https://3dic-conf.org/"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年のPaper Submissionsは、採択後のfinal manuscriptをIEEE EDASへ提出させ、発表されなかった論文はIEEE Xploreへ索引・収録しないと明記しています。原稿はIEEE二段組4または5ページで、PDF Expressによる確認が必要です。この記載から発表が収録条件の一つであることは確認できますが、発表を満たした全論文が必ず収録される条件までは、今回確認したページでは確定できません。過去回にはIEEE刊行のproceedingsがあります。","facts":[{"note":"Paper Submissionsは非発表論文を索引・IEEE Xplore収録の対象外と明記。発表を満たした全論文の収録保証までは同ページで確認できない。","label":"2026 IEEE Xplore収録条件の記載","value":"Non-presented papers will not be indexed or included in IEEE Xplore","checkedAt":"2026-10-14","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/paper-submissions-2026/"},{"note":"Call for Papers PDF。IEEEフォーマットを要求する記述はあるが、収録媒体名は書かれていない。","label":"2026 最終原稿のフォーマット要求","value":"\"full papers in IEEE format will be required by September 30, 2026\"","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/wp-content/uploads/2026/07/CallforPapersIEEE3DIC26b.pdf"},{"note":"公式Archiveページの3DIC 2021の項に「Proceedings」としてリンクが置かれている。リンク先のIEEE Xploreページ本体はこの出典の範囲外で、収録内容はArchiveページからは確認できない。","label":"2021 proceedings","value":"Conference ArchiveがIEEE Xplore上の3DIC 2021 proceedings（https://ieeexplore.ieee.org/xpl/conhome/9687597/proceeding）へリンクしている","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/archive/"},{"note":"DBLPのconf/3dicインデックス。2025年および2026年の巻は掲載されていない。","label":"書誌データベース上の刊行主体","value":"DBLPは3DICの各年次巻をIEEE刊行として索引している（2009, 2010, 2011, 2013, 2014, 2015, 2016, 2019, 2021, 2023, 2024）","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/3dic/index.html"},{"note":"DBLPのconf/3dicインデックス。公式サイト上の会期・開催地表記と一致する。","label":"2024 巻のDBLP収録タイトル","value":"\"International 3D Systems Integration Conference, 3DIC 2024, Sendai, Japan, September 25-27, 2024\"","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/3dic/index.html"},{"note":"2026年サイクルの各ページに、採択論文の学術誌特集号への招待に関する記述がない。","label":"特集号招待（journal special issue）","value":"公表されていない","checkedAt":"2026-08-05","sourceUrl":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/"}],"title":"proceedingsと収録先","eyebrow":"publication"}},"sources":[{"url":"https://3dic-conf.org/","role":"official","label":"3DIC 2026 トップページ","checkedAt":"2026-10-14","evidenceLocator":"会議名・会期・開催地、および現行Important dates欄（abstract受付終了、採否通知終了、camera-ready締切9月30日）。"},{"url":"https://3dic-conf.org/3dic-2026/3dic-2026-conference-details/","role":"official","label":"3DIC 2026 Conference 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include tax (8.9%)」の注記、EasyChair経由の登録手順。"},{"url":"https://3dic-conf.org/3dic-2026/contact-us-2026/","role":"official","label":"3DIC 2026 Contact Us","checkedAt":"2026-08-05","evidenceLocator":"conference chairs宛メールアドレス（3dic@gatech.edu、paulf@ncsu.edu）とMicrosoft CMT定型文。"},{"url":"https://3dic-conf.org/archive/","role":"history","label":"3DIC Conference Archive","checkedAt":"2026-08-05","evidenceLocator":"2010年から2024年までの過去回一覧（年・開催地）と、各回のホームページ／プログラム／proceedingsへのリンク（3DIC 2021のIEEE Xplore proceedingsリンクを含む）。"},{"url":"https://3dic-conf.org/home2024/","role":"archive","label":"3DIC 2024 ホームページ","checkedAt":"2026-08-05","evidenceLocator":"前身会議の統合経緯（ASET・IEEE EDS Japan／Fraunhofer・IEEE CPMT、Tokyo 2007-2008／Munich 2003-2007、San Francisco 2009）、参加者220名の告知、3DIC 2025（October 15-17, 2025, North Carolina）の予告。"},{"url":"https://3dic-conf.org/wp-content/uploads/2024/09/3DIC_2024_program_20240921_sd.pdf","role":"program","label":"3DIC 2024 Advanced 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States","fieldId":"packaging","editions":[],"genreIds":["three-dimensional-integration"],"processes":[{"id":"prc_82f4718892634cd0809b56523d16aec3","nameJa":"加速試験","primary":true},{"id":"prc_99c83123778644c3baa332514180d263","nameJa":"信頼性シミュレーション","primary":false},{"id":"prc_3d27981d613a439287c13f2e2ad2914f","nameJa":"先端パッケージ（2.5D・3D・チップレット）","primary":false}],"cycleLabel":"2026-11-12〜13 / UCLA, Los Angeles, California, US","fieldTitle":"実装 / 先端パッケージ / 3D integration","organizers":[{"id":"org_cdc4ef742c754df896a8fe71279044ca","name":"IEEE Electronics Packaging Society"}],"lastVerified":"2026-09-13","currentCycleEnd":"2026-11-13","abstractDeadline":"2026-08-15","acceptanceNotice":"2026-08-30","peerReviewStatus":"review-unclear","currentCycleStart":"2026-11-12","canonicalId":"conf_9e22576532d04a239117d471d58cf22e","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-08","conferenceId":"repp","confidenceScore":0.992,"coverage":{"faqCount":5,"factCount":49,"topicCount":5,"sourceCount":9,"sectionCount":11,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":["comparison"],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026年11月12日〜13日に、米国カリフォルニア州ロサンゼルスのUCLA（Electrical and Computer Engineering building）で開かれます。WebExによるオンライン参加もできます。","question":"REPP 2026はいつ、どこで開かれますか。","sourceUrls":["https://attend.ieee.org/repp/","https://attend.ieee.org/repp/?page_id=2152"]},{"answer":"ありません。投稿は200〜300語のabstractまたは発表提案です。論文化を希望する発表者は、IEEE CPMT TransactionsのSpecial Sectionへ任意で投稿できます。","question":"論文を書く必要はありますか。","sourceUrls":["https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf","https://attend.ieee.org/repp/?page_id=2188"]},{"answer":"電子・フォトニクスのパッケージ信頼性で、2026年のCall for Abstractsには、Component/Sub Component Level、System Level of Integration and RAS、Testing for Yield、加速試験、故障モードと故障メカニズムが挙がっています。","question":"どのような分野が対象ですか。","sourceUrls":["https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"]},{"answer":"2026年は一般の現地参加が早期90ドル、オンラインのInternet Passが早期35ドルで、Internet Passの学生は0ドルです。","question":"参加費はいくらですか。","sourceUrls":["https://attend.ieee.org/repp/?page_id=460"]},{"answer":"2026年の登録者は、終了後2か月間、ほとんどの講演の編集済み動画をIEEE.tvで閲覧できます。","question":"講演動画を見ることはできますか。","sourceUrls":["https://attend.ieee.org/repp/?page_id=460"]}],"headline":"第7回のREPP 2026は2026年11月12日〜13日にUCLAで開かれ、現地参加とWebExによるオンライン参加の両方を受け付けます。","metaDescription":"REPP（Symposium on Reliability for Electronics and Photonics Packaging）の2026年UCLA会期、hybrid形式、200〜300語のabstract募集、論文提出なしの発表形式、IEEE CPMT Transactions特集、IEEE.tvでの講演動画公開を公式サイトから整理しました。","oneLine":"REPPは、電子・フォトニクスのパッケージ信頼性、加速試験、故障モードを扱うIEEEのシンポジウムです。","pageTitle":"REPPとは｜電子・光パッケージ信頼性のIEEEシンポジウム（2026年はUCLA）","relatedConferenceIds":["ectc","eptc","itherm","semi-therm","irps","esref"],"sections":{"cycle":{"id":"cycle","body":"2026年は11月12日〜13日の2日間、UCLAキャンパスのElectrical and Computer Engineering building（EE-IV Shannon, Room #54-134）で開かれます。現地参加とWebExによるオンライン参加を併用するhybrid形式です。2025年はMilpitasのSEMI World Headquarters、2022年はSilicon Valleyで開かれました。","facts":[{"label":"2026 会期・会場","value":"2026-11-12〜13 / University of California Los Angeles (UCLA), Los Angeles, CA USA","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 会場の建物","value":"Electrical and Computer Engineering building, EE-IV Shannon, Room #54-134（420 Westwood Plaza, 5th Floor）","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2152"},{"label":"2026 開催形式","value":"hybrid（現地＋WebEx）","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 テーマ","value":"Reliability for Advanced Semiconductor Packaging","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2025 会期・会場","value":"2025-11-20〜21 / SEMI World Headquarters, Milpitas, CA USA","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2110"}],"title":"会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"2022年のシンポジウム紹介は、電子・フォトニクス・MEMS・MOEMSの材料からシステムまでを対象に、定量的な信頼性、加速試験、寿命の確率的評価を扱うと書いています。2026年のCall for Abstractsの区分には、Component/Sub Component Level、System Level of Integration and RAS、Testing for Yield、Accelerated testing、Failure modes/Failure Mechanismsがあります。Component/Sub Component LevelにはHybrid Bondingが含まれ、加速試験にはFOAT（failure-oriented-accelerated-testing）が含まれます。","facts":[{"label":"2026 対象（Component/Sub Component Level）","value":"Lasers, Diodes, Fan-out IC, Hybrid Bonding, PLC fabrication ほか","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 対象（System Level）","value":"System Level of Integration and RAS","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 対象（Accelerated testing）","value":"FOAT（failure-oriented-accelerated-testing）を含む加速試験","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 対象（Failure modes/Failure Mechanisms）","value":"Accelerated models / FA techniques / Material characterization and failure criteria ほか","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 対象（Testing for Yield）","value":"Burn-in testing / System level testing and yields at scale ほか","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"対象の説明（2022 ページ）","value":"電子・フォトニクス・MEMS・MOEMSの材料から システムまでの定量的信頼性・加速試験・寿命の確率的評価","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=1144"}],"title":"対象分野","eyebrow":"scope"},"review":{"id":"review","body":"発表は論文ではなく提案ベースで選ばれ、Technical Program Co-ChairはNvidiaのFen Chen氏とMediaTekのYan Li氏です。提案には発表内容とシンポジウムのテーマとの関係が明確に示されていることが求められます。任意の雑誌特集では、IEEEのjournals system上で査読が行われます。","facts":[{"label":"2026 Technical Program Co-Chairs","value":"Fen Chen (Nvidia) / Yan Li (MediaTek)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 提案に求める観点","value":"発表とシンポジウムのテーマ・トピックとの関係","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 特集論文の査読","value":"IEEEのjournals system上で査読を調整","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2188"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"会議録（proceedings）の刊行と採択率は公式サイトに記載がありません。2026年のCall for Abstractsは「第7回」としていますが、初回開催年は公式ページに明記されていません。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"2026年のCall for Abstractsは本会を第7回の年次REPPとしています。公式サイトには2022年と2025年の回のページがあり、2022年はSilicon Valley、2025年はMilpitasのSEMI World Headquarters、2026年はUCLAで開かれます。2022年のGeneral ChairはMarvellのRichard Rao氏でした。2022年のページには、REPP-2020が現地とオンラインのhybridで開かれたという注記があります。","facts":[{"label":"2022 会期・開催地","value":"2022-11-09〜10 / Silicon Valley, CA USA","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=1144"},{"label":"2020 開催形式","value":"hybrid","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=1144"},{"label":"2022 General Chair","value":"Richard Rao, Marvell","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=1144"},{"label":"2022 開会挨拶","value":"Kitty Pearsall, IEEE-EPS President","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=1144"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のプログラムには、NvidiaのJames Chambers氏によるAI時代の故障解析、TSMCのDavid Chu氏による先進パッケージの信頼性課題、Intel FoundryのShan Zhong氏による熱圧着ボンディング、STAr TechnologyのCL Lou氏によるシリコンフォトニクス部品・モジュールの信頼性、UC San DiegoのAndrew Kummel教授によるハイブリッドボンディング界面の講演が並びます。会期前にはオンデマンドのPre-REPP Tutorialが3本用意されています。","facts":[{"label":"2026 講演（Nvidia）","value":"Dr. James Chambers: Failure Analysis in the AI Era: Ensuring Reliability at Scale","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 講演（TSMC）","value":"David Chu: Reliability Challenges in Advanced Packaging","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2591"},{"label":"2026 講演（Intel Foundry）","value":"Shan Zhong: The Evolving Role of Thermocompression Bonding in AI-Driven Heterogeneous Integration","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2591"},{"label":"2026 講演（STAr Technology）","value":"CL Lou: Silicon Photonics Components and Modules Reliability","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2591"},{"label":"2026 講演（UC San Diego）","value":"Prof. Andrew Kummel: Chemical and Chemical Processing at Hybrid Bonding Interfaces","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2591"},{"label":"2026 Pre-REPP Tutorial","value":"Reliability Physics and Failure Mechanisms in Electronics Packaging（Prof. Xuejun Fan, Lamar University, on-demand 2時間）ほか計3本","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2591"}],"title":"プログラム","eyebrow":"program"},"audience":{"id":"audience","body":"2026年の登録費は、2日間の現地参加が一般の早期登録（10月16日まで）で90ドル、以降は115ドルです。オンライン参加の2日間Internet Passは早期35ドル、以降45ドルで、学生は0ドルです。発表する大学院生向けに、最大1,000ドルの旅費助成が2件あります。すべての登録にWebExでのライブ参加とオンデマンドのチュートリアルが含まれます。","facts":[{"label":"2026 登録費（一般・現地2日間）","value":"早期（10月16日まで）$90 / 以降$115","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=460"},{"label":"2026 登録費（Two-Day Internet Pass）","value":"早期$35 / 以降$45 / 学生$0","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=460"},{"label":"2026 登録に含まれるもの","value":"WebExでのライブ参加とオンデマンドのPre-Symposium Tutorials","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=460"},{"label":"2026 学生旅費助成","value":"発表する大学院生に最大$1,000を2件","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"}],"title":"参加の目安","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はSymposium on Reliability for Electronics and Photonics Packagingで、公式サイトは2026 IEEE REPP Symposiumと名乗っています。2026年のCall for Abstractsは本会を第7回の年次REPPと書いています。General ChairはUCLAのTiwei Wei教授とMeta Reality LabのHualiang Shi氏です。","facts":[{"label":"正式名称","value":"Symposium on Reliability for Electronics and Photonics Packaging","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 名称表記","value":"2026 IEEE REPP Symposium","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 回次","value":"Seventh Annual REPP","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 副題","value":"Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 General Chair","value":"Prof. Tiwei Wei (UCLA) / Hualiang Shi (Meta Reality Lab)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のProgram Committeeには、Marvell、Cisco Systems、GlobalFoundriesの所属者とJPLのReza Ghaffarian氏が入っています。欧州からはTU Delftとimecがliaisonとして加わっています。協賛はPlatinumがMarvell、STAr Technologies、Shenzhen HFC Co Ltd、GoldがNvidiaとActnanoです。","facts":[{"label":"2026 Program Committee（企業所属の例）","value":"Richard Rao (Marvell Tech.) / Farnood Rezaie (Cisco Systems) / Ranjan Rajoo (GlobalFoundries)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 Program Committee（研究機関）","value":"Reza Ghaffarian (JPL)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 Europe Liaisons","value":"Willem van Driel (TU Delft) / Kristof Croes (imec)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 Platinum Sponsors","value":"Marvell / STAr Technologies / Shenzhen HFC Co Ltd","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 Gold Sponsors","value":"Nvidia / Actnano","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/"},{"label":"2026 Administrative Chair","value":"Paul Wesling, HP (retired)","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"}],"title":"委員会・協賛","eyebrow":"community"},"submission":{"id":"submission","body":"投稿は題名と200〜300語の要旨（任意で図1〜2点）からなるabstractまたは発表提案です。2026年の締切は8月15日、採否の発表は8月30日まででした。論文の提出はありません。現地発表とリモート発表のどちらでも応募でき、発表者の登録費は無料です。","facts":[{"label":"2026 abstract締切","value":"2026-08-15","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 採否通知","value":"2026-08-30まで","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 原稿の形式","value":"題名＋200〜300語の要旨、図1〜2点は任意","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 論文提出","value":"なし（No formal paper）","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 発表区分","value":"現地またはリモート発表","checkedAt":"2026-10-08","sourceUrl":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf"},{"label":"2026 発表者の登録費","value":"無料（complimentary registration）","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2188"}],"title":"投稿・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"REPPでは正式な論文は求められず、2026年の登録者は、終了後2か月間IEEE.tvに置かれるほとんどの講演の編集済み動画を閲覧できます。論文化を希望する発表者は、IEEEのCPMT Transactionsに組まれるSpecial Sectionへ2026年12月5日までに原稿を出すことができ、2027年夏の掲載を目標としています。","facts":[{"label":"2026 雑誌特集","value":"IEEE CPMT Transactions Special Section（Electronics and Photonics Packaging Reliability）","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2188"},{"label":"2026 特集原稿の締切","value":"2026-12-05まで随時","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2188"},{"label":"2026 特集の掲載目標","value":"2027年夏","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=2188"},{"label":"2026 講演動画","value":"終了後2か月間、IEEE.tvで編集済み動画を登録者に公開","checkedAt":"2026-10-08","sourceUrl":"https://attend.ieee.org/repp/?page_id=460"}],"title":"論文・記録","eyebrow":"publication"}},"sources":[{"url":"https://attend.ieee.org/repp/","role":"official","label":"2026 IEEE REPP Symposium 公式トップ","checkedAt":"2026-10-08","evidenceLocator":"冒頭の会期・テーマ・hybrid注記、注目講演、Sponsors欄"},{"url":"https://eps.ieee.org/wp-content/uploads/2026/03/REPP26-CFP.pdf","role":"cfp","label":"REPP 2026 Call for Abstracts（PDF）","checkedAt":"2026-10-08","evidenceLocator":"1ページ目の委員一覧、対象領域、投稿要領"},{"url":"https://attend.ieee.org/repp/?page_id=2591","role":"program","label":"Program 2026","checkedAt":"2026-10-08","evidenceLocator":"Pre-REPP TutorialsとSubmitted Presentationsの表"},{"url":"https://attend.ieee.org/repp/?page_id=2188","role":"cfp","label":"Speaker Info","checkedAt":"2026-10-08","evidenceLocator":"CPMT 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二重投稿","value":"他会議で発表済み・出版済みの成果は不可","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/authors/selection_criteria.html"},{"label":"2026 不採択理由の例","value":"研究ではなく宣伝になっている","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/authors/selection_criteria.html"},{"label":"2026 Late Newsの審査","value":"Technical Program Committeeが発表可否を審査","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/authors/late_news.html"}],"title":"選考","eyebrow":"review"},"caveats":{"id":"caveats","body":"Late Newsの日付は公式ページ間で食い違っており、Deadlinesページは投稿締切2026年9月30日・通知10月7日、Late Newsページは投稿締切9月25日・通知10月1日と書いています。トップページはXiaohong Wangを「Conference Chair」、Conference Officialsページは「General Chair」と表記しています。Previous Conferencesには2001年の行がありません。","facts":[{"label":"2026 Late News締切（Deadlinesページ）","value":"2026-09-30 / 通知 2026-10-07","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/authors/deadlines.html"},{"label":"2026 Late News締切（Late Newsページ）","value":"2026-09-25 / 通知 2026-10-01","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/authors/late_news.html"},{"label":"2026 トップページの議長表記","value":"Conference Chair: Xiaohong Wang","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/"}],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のPrevious Conferencesは2000年のSendaiから始まり、2002年にはTsukuba、直近の日本開催は2017年のKanazawaです。2021年はVirtual Conferenceで、2023年はAbu Dhabi、2024年はノルウェーのTønsberg、2025年は米国Albuquerqueと開催地が移っています。","facts":[{"label":"初回（Previous Conferences の最初）","value":"2000 - Sendai, Japan","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/about/previous_conferences.html"},{"label":"2025 開催地","value":"Albuquerque, New Mexico, USA","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/about/previous_conferences.html"},{"label":"2023・2024 開催地","value":"2023: Abu Dhabi, UAE / 2024: Tønsberg, 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運営表記","value":"PowerMEMS+ 2026 and Interteq","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/"},{"label":"会議の目的（公式説明）","value":"ナノ・マイクロ・ミニチュアスケールの発電・変換・蓄電とエネルギー自律システムのイノベーション促進","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/about/conference_info.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはTsinghua UniversityのXiaohong Wang、Technical Program ChairはShanghai Jiao Tong UniversityのDibin Zhu、Local Organizing ChairはSoochow UniversityのHuicong Liuです。International Steering Committeeには、日本からUniversity of TokyoのYuji SuzukiやTohoku UniversityのShuji Tanakaらが入り、企業所属ではPseudolithICのFlorian Herraultが名を連ねます。","facts":[{"label":"2026 General Chair","value":"Xiaohong Wang（Tsinghua University, CHINA）","checkedAt":"2026-10-08","sourceUrl":"https://www.powermems.org/about/conference_officials.html"},{"label":"2026 Technical Program Chair","value":"Dibin Zhu（Shanghai Jiao Tong University, 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Morial Convention Centerで開かれます。","question":"APEC 2027はいつ、どこで開かれますか。","sourceUrls":["https://apec-conf.org/"]},{"answer":"まず3〜5ページのdigestを1段組・ダブルスペースの専用テンプレートで投稿し、採択後にIEEE 2段組のmanuscriptを提出します。manuscriptは6ページ推奨、最大8ページです。","question":"Technical Sessionsにはどんな形式で投稿しますか。","sourceUrls":["https://apec-conf.org/speakers/ts-author-info/"]},{"answer":"Technical Sessionsの論文はIEEE Xploreに送られます。ただし対面で発表されなかった論文は送られません。","question":"論文はどこに収録されますか。","sourceUrls":["https://apec-conf.org/speakers/ts-author-info/"]},{"answer":"Industry Sessionsは発表資料だけを準備すればよく、正式な論文は不要です。","question":"論文を書かずに発表する方法はありますか。","sourceUrls":["https://apec-conf.org/speakers/call-for-participation/"]},{"answer":"初回は1986年4月28日〜5月1日にNew OrleansのFairmont Hotelで開かれました。","question":"APECはいつから開かれていますか。","sourceUrls":["https://apec-conf.org/about/history/"]},{"answer":"2028年はPhoenix（3月5日〜9日）、2029年はWashington, DC（3月25日〜29日）、2030年はPortland（3月17日〜21日）と公式サイトに載っています。","question":"2028年以降の開催地は決まっていますか。","sourceUrls":["https://apec-conf.org/about/future-locations-dates/"]}],"headline":"APEC 2027は2027年3月7日〜11日に米国New OrleansのErnest N. 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North & Center）とSession B（Essex South）の2会場並行","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"}],"title":"対象分野とトラック","eyebrow":"scope"},"review":{"id":"review","body":"2026年のCFPは、論文を技術的な質に基づいて選ぶと書き、投稿者が希望したsub-committeeとは別の区分で審査する場合があるとしています。論文には目的、新しい結果、従来技術に対する進展、先行研究の参照を明記するよう求めています。表彰にはBest Student Paper Awardがあり、学生が第一著者で発表することが条件です。2025年のBest Overall Paperは、Keysight Technologiesの「A High-Efficiency mm-Wave H-Band Power Amplifier with Over 20% PAE」でした。","facts":[{"label":"2026 選考基準","value":"技術的な質に基づいて選考","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 審査区分の扱い","value":"希望sub-committee以外の区分で審査する場合がある","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 論文に求める記載","value":"目的／新しい結果／state-of-the-artへの進展／先行研究／sub-committee希望","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"Best Student Paper Award の条件","value":"学生が第一著者で、会議で発表すること","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/best-paper-awards/"},{"label":"2025 Best Overall Paper","value":"A High-Efficiency mm-Wave H-Band Power Amplifier with Over 20% PAE（Keysight Technologies）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/best-paper-awards/"}],"title":"査読と表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトのトップページには2024年の招待講演一覧や2020年の記述が残っており、現行年の情報と混ざりやすくなっています。Short Courseの個別ページも2024年（Ft. Lauderdale）の内容のままで、2026年の講習はAdvance Programで確かめる必要があります。投稿締切は延長が重なっており、延長後の日付は通常投稿が5月22日、Late Breaking Newsが8月21日です。","facts":[],"title":"注意点","eyebrow":"caveats"},"history":{"id":"history","body":"BCICTSは2018年に、1986年開始のBipolar/BiCMOS Circuits and Technology Meeting（BCTM）と、1979年開始のGaAs IC Symposiumを前身とするCompound Semiconductor IC Symposium（CSICS）が統合してできました。統合後の第1回は2018年10月にSan Diegoで開かれています。2025年が第8回、2026年が第9回と公式資料が数えています。","facts":[{"label":"統合（2018）","value":"BCTMとCSICSが2018年に統合しBCICTSへ","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"2018 初回会期","value":"2018-10-14〜17 / San Diego, California","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"前身 GaAs IC Symposium の初回","value":"1979年 / Lake Tahoe, California","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"前身 BCTM の初回","value":"1986年","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/07/BCTMHist-Proceedings8-28-16finalrev-DAW2.pdf"},{"label":"CSICS の名称変更","value":"GaAs IC SymposiumからCompound Semiconductor IC Symposium（CSICS）へ改称","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"2025 回次","value":"第8回（eighth BCICTS）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2025/10/BCICTS-2025_BCICTS-Advanced_Program-Finalizing-9-30-25_AAA.pdf"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年のplenaryは2件で、Brown UniversityのLawrence LarsonとCornell UniversityのDebdeep Jenaが登壇します。11日のShort CourseはAIを使った回路設計、Primerはミリ波の設計・パッケージング・測定がテーマです。パネルはWIE/YPパネルとGaN-on-Siのパネルの2つで、Late Newsは8a・8bの2セッションです。","facts":[{"label":"2026 Plenary 1","value":"\"Vibe Design\" of Analog, RF and Microwave Integrated Circuits: Future Directions（Lawrence Larson, Brown University）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 Plenary 2","value":"AlScN/GaN RF HEMTs: From Single to Multiple Channels（Debdeep Jena, Cornell University）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 Short Course","value":"A.I.-Driven Circuit Design: Theory, Tools, and Practice","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 Primer","value":"Millimeter-wave Design, Packaging and Measurements","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 パネル","value":"WIE/YP Panel: AI in Engineering Design／The GaN-on-Si Revolution: Hype or Reality?","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 Late News セッション","value":"8a. Late News 1／8b. Late News 2","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 展示会場","value":"St. George ABC & Essex Foyer","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"Primerは分野に入ったばかりの技術者や学生向けの入門講座、Short Courseは経験のある技術者向けの講座として公式に区別されています。学生は第一著者で発表すればBest Student Paper Awardの対象になり、受賞者には翌年の登録料20%割引も付きます。Executive CommitteeにはStudent and Young Professional Eventの担当があります。","facts":[{"label":"Primer の対象（2026）","value":"分野に入る技術者、学生、専門職向けの入門","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/chairmans-message/"},{"label":"Short Course の対象（2026）","value":"経験のある専門職向け","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/chairmans-message/"},{"label":"受賞者特典","value":"翌年の登録料20%割引コード","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/best-paper-awards/"},{"label":"2026 学生・若手向け担当","value":"IEEE Student and Young Professional Event Chair（Mousumi Roy）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"}],"title":"研究室・企業での使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はIEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposiumで、略称BCICTSは公式に「Be-Six」と読むと案内されています。主催はIEEE Electron Devices Societyで、Solid-State Circuits SocietyとMicrowave Theory & Technology Societyが共催に入ります。2026年は第9回にあたります。","facts":[{"label":"正式名称（2026）","value":"2026 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/"},{"label":"主催・共催（2026 CFP）","value":"主催 IEEE Electron Devices Society／共催 Solid-State Circuits Society、Microwave Theory & Technology Society","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 回次","value":"第9回（ninth edition）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/chairmans-message/"},{"note":"BCTMとCSICSの統合を告知した公式の歴史記事に記載。","label":"名称の読み","value":"Be-Six","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"2026 Symposium Chair / Co-Chair","value":"Jack Pekarik（GlobalFoundries）／Michael Roberg（Qorvo, Inc.）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のExecutive Committeeには、GlobalFoundries、Qorvo、MegaChips、NTT、Texas Instrumentsなどの企業と、University of Notre Dameなどの大学の所属者が入っています。Advance Programに載る発表の所属には日本やドイツの機関が並びます。Advance Programは、集中的な採用活動がIEEEの方針に反すると注記しています。","facts":[{"label":"2026 TPC Chair","value":"Sadayuki Yoshitomi（Megachips Corp）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2026 Publicity Chair","value":"Munehiko Nagatani（NTT Inc.）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2026 Exhibitions Chair","value":"Doug Weiser（Texas Instruments）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2026 program 所属例（日本）","value":"Device Technology Labs, NTT, Inc., Japan","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 program 所属例（ドイツ）","value":"Institute for CMOS Design, TU Braunschweig, Germany","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"label":"2026 採用活動の扱い","value":"集中的な採用活動はIEEEの方針に反する","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"}],"title":"委員会と参加者","eyebrow":"community"},"comparison":{"id":"comparison","body":"2026年のCo-Chairsは、bipolar/BiCMOS、5G/6G IC、GaN HPA、InP THz PA、光CMOS/SiGeトランシーバ、GaN HEMT電力デバイスを一つのプログラムで扱う点を挙げています。シリコン系のBiCMOSと化合物半導体を同じプログラムに載せるのは、2018年のBCTMとCSICSの統合以来です。","facts":[{"label":"統合時に示された範囲","value":"bipolar、SiGe BiCMOS、化合物半導体の回路・デバイス・技術","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf"},{"label":"2026 Co-Chairs の説明","value":"bipolar/BiCMOS、5G/6G IC、GaN HPA、InP THz PA、光CMOS/SiGeトランシーバ、GaN HEMT電力デバイスを一つのプログラムで","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/chairmans-message/"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"2026年の通常投稿は図を含め4ページ以内の論文で、締切は2026年5月22日まで延長されました。通知は7月10日、4ページのcamera-ready PDFは9月9日が期限です。これとは別にLate Breaking Newsの募集があり、締切は8月21日、通知は9月2日でした。投稿前に企業・政府の公開許可を得ることが求められています。","facts":[{"label":"2026 投稿形式","value":"図・補足資料を含め4ページ以内の論文（PDFのみ、電子投稿）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 締切・通知・camera-ready","value":"投稿 2026-05-22（延長後）／通知 2026-07-10／camera-ready 2026-09-09","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 camera-ready 形式","value":"4ページのcamera-ready PDF","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 Late Breaking News 日程","value":"締切 2026-08-21（延長後）／通知 2026-09-02／camera-ready 2026-09-09","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/07/IEEE-2026-BCICTS-CFP-LateBreaking-06302026.1.pdf"},{"label":"2026 公式サイトの重要日程","value":"07/10/26 Notice to Authors／08/21/26 Late Breaking News Submission／09/09/26 Final Manuscript","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2026 投稿前の要件","value":"企業・政府の公開許可を投稿前に取得","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"}],"title":"投稿と締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年のCFPは、シンポジウムで選ばれた論文の拡張版を2027年9月号のIEEE Journal of Solid-State Circuitsへ招待すると告知しています。2026年のExecutive CommitteeにはJSSC Guest Editorの役職があります。採択論文のcamera-ready PDFはSymposium Digestに収録されると、Advance Programに載る2027年のCFPが書いています。","facts":[{"label":"2026 特集号","value":"選ばれた論文の拡張版をIEEE Journal of Solid-State Circuits 2027年9月号へ招待","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf"},{"label":"2026 JSSC Guest Editor","value":"Wooram Lee（Penn State University）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2026 Publications Chair","value":"Patrick Fay（University of Notre Dame）","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/executive-committee/"},{"label":"2027 CFP の収録先","value":"4ページのcamera-ready PDFをSymposium Digestに収録","checkedAt":"2026-10-08","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"}],"title":"論文の掲載先","eyebrow":"publication"}},"sources":[{"url":"https://bcicts.org/","role":"official","label":"BCICTS 公式サイト（2026）","checkedAt":"2026-10-08","evidenceLocator":"トップページ見出しと会期表示"},{"url":"https://bcicts.org/chairmans-message/","role":"official","label":"Welcome from the BCICTS 2026 Co-Chairs","checkedAt":"2026-10-08","evidenceLocator":"本文（回次、会場、講習の説明）"},{"url":"https://bcicts.org/executive-committee/","role":"committee","label":"Executive Committee（2026）","checkedAt":"2026-10-08","evidenceLocator":"役職一覧とサイドバーのImportant Dates"},{"url":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf","role":"program","label":"BCICTS 2026 Advance Program（PDF）","checkedAt":"2026-10-08","evidenceLocator":"Schedule at a Glance、Plenary、Conference Program、2027 Call for Papers"},{"url":"https://bcicts.org/wp-content/uploads/2026/05/IEEE-2026-BCICTS-CFP-SubmissionExtended-05052026.1.pdf","role":"cfp","label":"2026 BCICTS Call for Papers（延長版PDF）","checkedAt":"2026-10-08","evidenceLocator":"1ページ目の主催欄、投稿要件、IMPORTANT DATES"},{"url":"https://bcicts.org/wp-content/uploads/2026/07/IEEE-2026-BCICTS-CFP-LateBreaking-06302026.1.pdf","role":"cfp","label":"2026 BCICTS Call for Late Breaking News（PDF）","checkedAt":"2026-10-08","evidenceLocator":"1ページ目のIMPORTANT DATES"},{"url":"https://bcicts.org/best-paper-awards/","role":"official","label":"Best Paper Awards","checkedAt":"2026-10-08","evidenceLocator":"賞の条件と2025 Award Winners"},{"url":"https://bcicts.org/wp-content/uploads/2019/03/CSICS-2017-history.pdf","role":"history","label":"CSICS History Article（PDF）","checkedAt":"2026-10-08","evidenceLocator":"冒頭段落と末尾のBCICTS統合の節"},{"url":"https://bcicts.org/wp-content/uploads/2026/07/BCTMHist-Proceedings8-28-16finalrev-DAW2.pdf","role":"history","label":"BCTM History Article（PDF）","checkedAt":"2026-10-08","evidenceLocator":"I. THE FIRST YEAR, 1986 の節"},{"url":"https://bcicts.org/wp-content/uploads/2025/10/BCICTS-2025_BCICTS-Advanced_Program-Finalizing-9-30-25_AAA.pdf","role":"archive","label":"BCICTS 2025 Advance Program（PDF）","checkedAt":"2026-10-08","evidenceLocator":"冒頭のWelcome文"}],"summary":"BCICTSはIEEE Electron Devices Societyが主催し、Solid-State Circuits SocietyとMicrowave Theory & Technology Societyが共催するシンポジウムです。前身は1986年に始まったBCTMと、1979年に始まったGaAs IC Symposium（のちのCSICS）で、2018年に両者が統合しました。投稿は図を含め4ページ以内の論文で、採択者は4ページのcamera-ready PDFを提出し、選ばれた論文の拡張版はIEEE Journal of Solid-State Circuitsの特集号へ招待されます。2026年はplenary 2件、Short CourseとPrimerの2つの講習、2つのパネル、展示とLate Newsセッションで構成されます。","topics":[{"note":"2026年のCFPはSiとSiGeの集積回路とデバイスを対象に掲げ、Co-Chairsの説明はbipolar/BiCMOSを挙げています。","label":"SiGe BiCMOS / HBT","sourceUrl":"https://bcicts.org/wp-content/uploads/2026/10/BCICTS-2026_BCICTS-Advance_Program-FINAL.pdf"},{"note":"plenaryのAlScN/GaN RF HEMTsと、GaN-on-Siのパネルがあります。","label":"GaN HEMT / GaN 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Manufacturing（TSM）のISSM特集に掲載される機会があります。委員会にはKioxia、Rapidus、東芝デバイス＆ストレージなどの所属者が入っています。","topics":[{"note":"Process Integration群の項目で、歩留まり改善の手法が対象です。","label":"Yield Enhancement and Methodology","sourceUrl":"https://issm.semiconportal.net/cfp/"},{"note":"汚染制御の項目で、2026年は基板表面洗浄技術も重点テーマです。","label":"Ultraclean Technology and Contamination Control","sourceUrl":"https://issm.semiconportal.net/cfp/"},{"note":"Areas of Interestの1群で、3D integration、chiplets packaging、advanced packaging technologyを扱います。","label":"3D Integration, Chiplets Packaging","sourceUrl":"https://issm.semiconportal.net/cfp/"}],"verificationLevel":"reviewed"},"conferenceEvaluationV1":{"sourceOfTruth":"postgresql","modelVersion":"1.0-pilot","evaluatedCycle":2026,"positionTier":{"value":"A","publicReason":"1992年に日本で始まった半導体製造の国際シンポジウムで、米国のASMCに相当する。ファブ管理、歩留まり、クリーン化、実装の研究を選び、最優秀論文をIEEE TSMの特集へ推薦する。"},"publicReasons":[{"body":"会議サイト","sourceUrl":"https://issm.semiconportal.net/"},{"body":"投稿案内","sourceUrl":"https://issm.semiconportal.net/cfp/"}],"sourceUrls":[{"url":"https://issm.semiconportal.net/2024/"},{"url":"https://issm.semiconportal.net/committee/"},{"url":"https://issm.semiconportal.net/keynote-speakers/"},{"url":"https://issm.semiconportal.net/sponsorship/"},{"url":"https://issm.semiconportal.net/past-symposium/"}]},"lifecycleV1":{"version":"conference-lifecycle-v1","today":"2026-10-22","phase":"notified","label":"採否通知後・開催準備段階","closedNote":"通常投稿・Late 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P. Ma賞があります。","question":"学生向けの企画はありますか？","sourceUrls":["https://www.ieeesisc.org/call.html","https://www.ieeesisc.org/past.html"]}],"headline":"第57回のSISC 2026は2026年12月9日〜12日にSan DiegoのCatamaran Resort Hotelで現地開催され、初日の12月9日夜にTutorialが開かれます。","metaDescription":"IEEE SISC（Semiconductor Interface Specialists Conference）の主催、第57回2026年のSan Diego会期、2ページabstract、引用ポリシー、Tutorial、2026 Technical Program Committee、1965年の初回を公式ページから整理しました。","oneLine":"SISCは、半導体と絶縁膜の界面、絶縁薄膜の物理、材料とデバイス物理の関係を、デバイス技術者・固体物理学者・材料研究者が議論するIEEE Electron Devices Society主催のworkshop形式の会議です。","pageTitle":"SISCとは｜半導体と絶縁膜の界面を議論するIEEE EDSの会議（2026年は12月San Diego）","relatedConferenceIds":["iedm","vlsi","icds","iwjt","iscsi"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期は12月9日〜12日で、初日の9日はTutorialの日です。会場は米国カリフォルニア州San DiegoのCatamaran Resort Hotelで、Call for papersは2026年を完全な現地開催と書いています。preliminary programと参加登録はすでに公開されており、early registrationは11月4日に締め切られます。","facts":[{"label":"2026 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papersは、logic、AI向け不揮発メモリ、wide bandgapのpower device、強誘電体デバイス、BEOL oxide transistorなどの領域を募りました。2026年のprogramはSilicon、Emerging Memories、2D Channel、BEOL FET、Ferroelectric Memory、Characterization、Wide Bandgap、Advanced Technologiesのsessionで組まれています。","facts":[{"label":"主要テーマ","value":"semiconductor/insulator interfaces、絶縁薄膜の物理、材料科学・デバイス物理・最先端技術の相互作用","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/"},{"label":"2026 CFP領域：logic","value":"Logic Devices for future technology nodes (Nanosheet, CFET, VFET, etc.)","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 CFP領域：メモリ","value":"Non-Volatile Memory for AI / In-Memory / Neuromorphic Compute (ReRAM, PCM, ECRAM, etc.)","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 CFP領域：wide bandgap","value":"Wide Bandgap semiconductor power devices（SiC、GaN、β-Ga2O3など）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 CFP領域：強誘電体","value":"Ferroelectric devices (FeFET, FeRAM, etc.)","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 CFP領域：BEOL・実装","value":"Monolithic and/or Heterogeneous ICs (BEOL oxide transistors, interconnects, packaging, etc.)","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 program session構成","value":"Session 1〜12（Silicon、Emerging Memories、2D Channel I/II、Poster Preview I/II、BEOL FET、Ferroelectric Memory I/II、Characterization、Wide Bandgap、Advanced Technologies）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"}],"title":"対象領域","eyebrow":"scope"},"review":{"id":"review","body":"abstractは新規性と先行研究との差で一部評価されると投稿案内は書いています。結果や図の大半が既発表のabstractは採択されにくく、今後得られる予定の結果だけを書いたものは審査の対象になりません。学生賞の受賞者はtechnical program committeeの委員が会期末に選びます。","facts":[{"label":"審査観点：新規性","value":"novelty と先行研究との差（differentiation from prior work）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"審査観点：既発表の扱い","value":"結果と図の大半が既発表のabstractは採択されにくい","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"審査観点：予定の結果","value":"今後の結果の予告だけでは審査対象にならない","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"学生賞の選考","value":"technical program committeeの委員が会期末に選ぶ","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"}],"title":"審査","eyebrow":"review"},"caveats":{"id":"caveats","body":"IEDMとの前後関係は、Call for papersが「right before IEDM」、home pageが「right after the IEDM」と書いており、公式ページ内で表記が揺れています。主催団体名もCall for papersは「Electron Device Society」、home pageは「Electron Devices Society」です。SISCのabstractは参考文献に挙げない方針のため、IEEE Xplore等のproceedings収録は公式サイトに案内がなく、査読方式（blind reviewかどうか）や採択率も今回開いた公式ページには記載がありませんでした。2026年のprogramはpreliminary版です。","facts":[{"label":"IEDMとの前後関係の表記（home page）","value":"right after 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Ma賞の開始","value":"2021年（best student poster）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"label":"Wednesday Evening Tutorialの開始","value":"SISC 2008","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"2026年は12月9日夜に、TU ViennaのTibor Grasser教授によるTutorial「New Devices, Same Problems: Reliability Lessons from Si, SiC, and 2D Materials」で始まり、12のsessionが続きます。招待講演は企業と大学の双方から選ばれ、Kioxia、Intelなどの講演者が並びます。10日夜はReception & Poster Session、11日夜はConference Banquet & Limerick Contestです。","facts":[{"label":"2026 Tutorial","value":"Prof. Tibor Grasser（TU Vienna, Austria）「New Devices, Same Problems: Reliability Lessons from Si, SiC, and 2D Materials」","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"2026 招待講演の構成","value":"企業と大学の双方からの招待講演","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/program.html"},{"label":"2026 招待講演（例）","value":"Dr. Keiji Ikeda, Kioxia, Japan「Replacement-channel GAA Nanosheet FET for 3D Oxide-semiconductor Channel Transistor DRAM (3D OCTRAM)」","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/program.html"},{"label":"2026 招待講演（例）","value":"Dr. Rahul Ramamurthy, Intel「Transistor Reliability in the Angstrom Era: Sustaining the Momentum of Moore's Law」","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/program.html"},{"label":"2026 poster","value":"12月10日夜にReception & Poster Session","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"label":"2026 併催行事","value":"Conference Banquet & Limerick Contest（12月11日夜）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"label":"賞","value":"E. H. Nicollianを記念したBest Student Presentation Award、T. P. Maを記念したBest Poster Award","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"}],"title":"2026年のプログラム","eyebrow":"program"},"audience":{"id":"audience","body":"Wednesday Evening Tutorialは学生と分野に新しく入った人を特に想定した講義で、登録者は追加費用なしで参加できます。学生には口頭発表とposterの両方に賞があります。Past conferencesには年ごとのtechnical programと過去のTutorialが並び、2025年のTutorialはASMLとUC BerkeleyのAnthony Yen教授によるフォトリソグラフィの講義でした。","facts":[{"label":"Tutorialの対象","value":"学生と分野の新規参入者","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"Tutorialの参加費","value":"SISC登録者は無料","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/past.html"},{"label":"過去のTutorial（例）","value":"2025: Prof. Anthony Yen（ASML and UC Berkeley）Photolithography for Semiconductor Manufacturing","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/past.html"}],"title":"使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称はIEEE Semiconductor Interface Specialists Conferenceで、2026年は第57回です。主催はIEEEのElectron Devices Societyです。公式のCall for papersは、招待講演・一般講演に加えてposterとrump sessionで議論するworkshop形式の会議だと説明しています。","facts":[{"label":"正式名称","value":"IEEE Semiconductor Interface Specialists Conference (SISC)","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/"},{"label":"2026 回次","value":"第57回（57th IEEE SISC）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"note":"Call for papersでは「Electron Device Society」、home pageでは「Electron Devices Society」と表記されています。","label":"主催","value":"IEEE Electron Device(s) Society","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"},{"label":"会議の形式","value":"workshop-style conference（招待講演・一般講演、posterとrump session）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/call.html"}],"title":"名称・主催","eyebrow":"identity"},"community":{"id":"community","body":"2026年のGeneral ChairはNational University of SingaporeのXiao Gong、Program ChairはTSMCのMatthias Passlackです。Technical Program Committeeには日本からU. Tokyo、AIST、Institute of Science Tokyoの委員が入っています。2026年programのAffiliation Indexには、Kioxia、SUMCO Corporation、Sony Semiconductor Solutions、SCREEN、Hitachiなど日本の企業が国名付きで印字されています。","facts":[{"label":"2026 General Chair","value":"Xiao Gong（National U. of Singapore）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"label":"2026 Program Chair","value":"Matthias Passlack（TSMC, CA, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/programs/2026_SISC_technical_program.pdf"},{"label":"2026 Technical Program Committee（日本の所属）","value":"M. Kobayashi（U. Tokyo）、H. Oka（AIST）、H. Wakabayashi（Institute of Science Tokyo）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/committees.html"},{"label":"2026 Technical Program Committee（企業の所属）","value":"M. M. Frank（IBM, USA）、A. 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deviceなどを募っています。","facts":[{"label":"対象の幅","value":"シリコン系（SiC、SiGeを含む）から高移動度半導体界面、最先端の先の新領域まで","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/"},{"label":"abstract集の目的","value":"新しい未発表の成果や議論のある成果の投稿を促す","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/past.html"}],"title":"近い会議との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は図と参考文献を含めて2ページ以内のextended abstractです。書式はTimes New RomanとSymbolのみ、本文11pt以上、図は12枚までと決まっています。2026年の締切は2026年8月21日（PST）に延長されました。オンライン投稿は現在閉じています。","facts":[{"label":"投稿区分","value":"extended abstract（図・参考文献込みで2ページ以内）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"書式：フォント","value":"Times New RomanとSymbolのみ、本文11pt以上","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"書式：図の数","value":"12枚まで","checkedAt":"2026-10-08","sourceUrl":"https://www.ieeesisc.org/submit.html"},{"label":"2026 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登録方法","value":"オンラインのみ（当日登録・当日払いなし）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/registration.html"},{"label":"2026 登録費","value":"一般 JPY 52,000 / 学生 JPY 42,000","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/registration.html"},{"label":"2026 登録締切","value":"著者 2026-10-08、全参加者 2026-10-14","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/registration.html"},{"label":"2026 Farewell Meeting","value":"中洲の屋形船クルーズ（10月23日 13:00–15:00）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/pdf/AVIC_2026_Tentative_Program_v1.pdf"}],"title":"2026年の会期と会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"対象はアナログ・ミックスドシグナル集積回路で、amplifier、filter、comparator、oscillator、multiplier、PLL、RF IC、A/D・D/A変換器、高速IOインターフェース、energy harvesting、電源管理が挙がります。これに加えて、layout、simulation、HDL、analog IPなどのアナログVLSI設計自動化と、通信・マルチメディア・車載・生体・民生・neural network・宇宙などの応用もtopicsに入っています。","facts":[{"label":"Analog and 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Int'l Analog VLSI Workshop、2012年のValencia以降はInternational Conference on Analog VLSI Circuitsの名で開かれています。直近は2025年がMatsue（10月20〜22日）、2024年がKuala Lumpur（10月15〜17日）です。2003年のMacao開催は中止、2014年はHo Chi Minh Cityで4S-2014との合同開催でした。","facts":[{"label":"第1回","value":"1997、The 1st Analog VLSI Workshop、Ohio State University（Columbus, OH, USA）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/index.html"},{"label":"現名称での最初の掲載回","value":"2012、Valencia, Spain","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/index.html"},{"label":"旧名称での最終掲載回","value":"2011、Bali, Indonesia","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/index.html"},{"label":"2025","value":"Matsue, Japan（2025-10-20〜22）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/index.html"},{"label":"2024","value":"Kuala Lumpur, 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Circuits）が書かれています。協賛にはIEEEの2つの日本支部が入ります。","facts":[{"label":"正式名称（2026）","value":"2026 International Conference on Analog VLSI Circuits（AVIC 2026）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/"},{"label":"旧称","value":"IEEJ International Analog VLSI Workshop","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/index.html"},{"label":"主催（Organizer）","value":"The Institute of Electrical Engineers of Japan（IEEJ、電気学会）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/"},{"label":"開催主体","value":"IEEJ Research Committee on Electronic Circuits（電子回路技術委員会）","checkedAt":"2026-10-08","sourceUrl":"https://www.ieej-ect.org/ect/AVIC/2026/"},{"label":"2026 Sponsors","value":"IEEE CASS Japan Joint Chapter / IEEE SSCS Japan 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extended」のバナー画像、そしてCFP本体のPDFダウンロードリンクです。採択後の日程は文字で公開されており、Microelectronic Engineering特集号の投稿サイト開設が2026年6月22日、同アップロード期限が2026年7月13日、IEEE Xplore向け最終原稿のEasyChairアップロード期限が2026年8月30日、発表スライドの提出期限も2026年8月30日です。参考として、2025年サイクルの公式ページには採否通知が5月9日、proceedings用改訂原稿が6月10日と書かれています(初回投稿の締切行は複数の日付が並ぶ表記で、一意には読み取れません)。","question":"投稿の締切はいつですか。","sourceUrls":["https://www.esref2026.org/call-for-papers/","https://www.esref2026.org/paper-submission/","https://www.esref2026.org/publication/","https://www.esref2026.org/oral-presentation/","https://esref2025.sciencesconf.org/page/paper_submission?lang=en"]},{"answer":"あります。Paper Submissionページに「All Submissions will be peer reviewed by the Technical Program Committee to ensure scientific quality and relevance.」と印字されています。TPCはScope of Papersと同じA〜Jのトラック単位(A/B/C/D/E/F1/F2/F3/G/H/I/J)で編成され、各トラックにChairsとMembersが配置されています。IEEE Xplore掲載用の最終原稿には、これとは別にMentoring processの通過が課されます。double-blindやrebuttalの有無についての記述は公式ページにありません。2025年サイクルのPaper submissionページには「at least five reviewers of the ESREF 2025 Technical Program Chair」による評価と書かれていました。","question":"査読はありますか。どのように審査されますか。","sourceUrls":["https://www.esref2026.org/paper-submission/","https://www.esref2026.org/technical-programm-committee/","https://www.esref2026.org/publication/","https://esref2025.sciencesconf.org/page/paper_submission?lang=en"]},{"answer":"公開されていません。Technical ProgramページにもPaper Submissionページにも、投稿件数・採択件数・採択率の数値は掲載されていません。参加者数を示す数値もWhy Support ESREF 2026ページに掲載されていません。","question":"採択率は公開されていますか。","sourceUrls":["https://www.esref2026.org/technical-program/","https://www.esref2026.org/paper-submission/","https://www.esref2026.org/why-support-esref-2026/"]},{"answer":"2026年サイクルでは2つの経路が案内されています。1つはTechnical Program Committeeの招待を受けてabstractを6ページに拡張し、Elsevier誌Microelectronic Engineeringの特集号(article type「VSI: ESREF2026」)に投稿する経路です。もう1つは4〜6ページの最終原稿をEasyChairにアップロードしてIEEE Xploreに収録する経路で、ESREF提供テンプレートの使用とIEEE copyright formの提出が必要です。いずれも、登録済み著者による現地発表を行わない場合は掲載対象外になると明記されています。なお2025年サイクルはproceedingsがHAL Open Science、特集号がMicroelectronics Reliabilityでした。","question":"どこに論文が載りますか。","sourceUrls":["https://www.esref2026.org/publication/","https://www.esref2026.org/paper-submission/","https://esref2025.sciencesconf.org/page/paper_submission?lang=en"]},{"answer":"Steering Committeeには大学・公的研究機関(Fraunhofer IMWS-CAM、ETH Zürich、IMS University of Bordeaux、CNR-IMM Bologna ほか)と企業(Airbus、STMicroelectronics、NXP Semiconductors、KAI / Infineon)が並び、掲載された所属の所在国はイタリア、フランス、ドイツ、オランダ、ギリシャ、スイス、オーストリア、米国です。2026年のinvited talkにはInfineon Technologies、Polytechnic of Turin、Micron Technology、ams OSRAM AG、IBM Research Europeの登壇者が掲載されています。Why Supportページは参加者を「international experts from academia, research, and industry」と記述し、「leading research institutions, major industrial players, and European space and defense agencies」の関係者が含まれるとしています。参加者数の数値は公表されていません。","question":"誰が投稿・参加していますか。","sourceUrls":["https://www.esref2026.org/steering-committee/","https://www.esref2026.org/invited-talks/","https://www.esref2026.org/why-support-esref-2026/"]},{"answer":"2026年8月1日より前の早期登録はIEEE Member €910、Non Member €990、IEEE Lifetime Member €720、IEEE Student Member €720、Student Non-Member €760です。8月1日以降はそれぞれ €1,010／€1,090／€820／€820／€860 になります。Gala Dinnerの追加は €120で、脚注には「Reduced student fees without the gala dinner are also available」と書かれています。登録にはscientific programと会議資料、コーヒーブレイク、ランチ、社交イベントが含まれます。採択1件につき最低1名のフル登録が必要で、学生料金には在学を証明する書類のアップロードが要ります。","question":"参加費はいくらですか。","sourceUrls":["https://www.esref2026.org/authors-attendees/"]},{"answer":"採択された寄稿は登録済み著者による現地発表が条件と明記されており、Venueページにhybrid開催やオンライン参加の案内はないため、渡航を前提に計画することになります。Technical Program CommitteeにはOsaka University、Renesas Electronics、HAMAMATSU PHOTONICS、Hitachi、Kyoto University、Socionext に所属するメンバーが掲載されており、投稿先トラックの見当をつける材料になります。出展社一覧にはHamamatsu、Seiwa Optical、Hitachi Power Solutions、JEOLなどの社名が並びますが、これは出展の事実を示す掲載です。","question":"日本から参加・投稿する場合に確認しておく点はありますか。","sourceUrls":["https://www.esref2026.org/paper-submission/","https://www.esref2026.org/venue/","https://www.esref2026.org/technical-programm-committee/","https://www.esref2026.org/exhibitors/"]},{"answer":"初回開催年を明示した記述は、2024・2025・2026のいずれの公式サイトにも見当たりません。公式に読めるのは、2024年サイトの「This International Symposium will continue its 35-year history of focusing on the latest research developments...」という表現と、2024年が第35回(Parma, Italy)、2025年が第36回(Bordeaux)、2026年が第37回(Vienna, Austria)という回次の対応です。開催国は年ごとに移動しており、2024年サイトには「in 2024 ESREF will celebrate its return to Italy after 12 years」と書かれています。","question":"ESREFはいつから開催されていますか。","sourceUrls":["https://www.esref2024.org/welcome","https://esref2025.sciencesconf.org/","https://www.esref2026.org/why-support-esref-2026/"]}],"headline":"ESREF 2026公式サイトの各ページと、2025年(Bordeaux)・2024年(Parma)の公式サイトを直接読み、会期・トラック・投稿規定・査読・掲載先・登録費・委員会構成をサイクル単位で並べます。","metaDescription":"ESREF公式サイトから、2026年第37回(ウィーン、9月21〜24日)の会期・会場、A〜J全10トラック、4ページabstract投稿とTPC査読、Microelectronic Engineering特集号とIEEE Xplore収録、登録費を出典付きで記載します。","oneLine":"ESREFは電子デバイスの信頼性・故障物理・故障解析を対象とする欧州のシンポジウムで、2026年は第37回としてオーストリア・ウィーンのTU Wienで9月21〜24日に開催されます。","pageTitle":"ESREFとは｜第37回ESREF 2026(ウィーン)の会期・投稿規定・査読・掲載先を公式ページで確認する","relatedConferenceIds":["irps","ipfa","istfa","iirw","eos-esd-symposium","therminic"],"sections":{"cycle":{"id":"cycle","body":"2026年の会期と都市はWhy Supportページに文字で、会場の建物名と住所はVenueページに分かれて掲載されています。採択された発表は登録済み著者による現地発表が条件で、これを満たさない場合はproceedingsと特集号の掲載資格を失うとPaper Submissionページに明記されています。渡航計画を立てる際は、会期4日間に加えてtutorialとshort courseの実施日が公表されていない点を織り込んでおくと安全です。","facts":[{"note":"Why Support ESREF 2026 ページ冒頭に「Vienna, Austria」と併記された原文。","label":"2026 会期","value":"「from September 21-24, 2026」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/why-support-esref-2026/"},{"note":"Homeページに「hosted in the historic and culturally rich city of Vienna, Austria」と記載。","label":"2026 開催都市・国","value":"Vienna, Austria","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"},{"note":"Venueページに記載。modern lecture halls、seminar rooms、technical facilities を備えるとの説明が続く。","label":"2026 会場","value":"Faculty of Electrical Engineering and Information Technology (ETIT) at TU Wien","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/venue/"},{"note":"Venueページに記載。地下鉄U1/U2/U4のKarlsplatz、U1のTaubstummengasse、Vienna International Airport(20 km)からのアクセスも同ページに掲載。","label":"2026 会場住所","value":"Gußhausstraße 27-29, 1040 Vienna, Austria","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/venue/"},{"note":"Paper Submissionページの原文。現地発表を行わない寄稿はproceedingsおよびESREF 2026特集号への掲載対象外と続けて記載されている。","label":"2026 現地発表の要件","value":"「Each accepted contribution must be presented in person by a registered author at the conference.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"同ページに掲載されているのは会場の設備説明と交通手段のみ。","label":"2026 hybrid・online参加の掲載状況","value":"Venueページにhybrid開催・オンライン参加に関する記述はない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/venue/"},{"note":"原文では EcoEvent が引用符で囲まれている。low-waste catering、eco-friendly materials(使い捨てプラスチック不使用)、travel awareness(公共交通の推奨)、digital-first(paperless proceedings)、sustainable printing(認証紙)の5項目が箇条書きで掲載されている。","label":"2026 Green Event認定","value":"「ESREF 2026 in Vienna has been officially recognized as a Green Event under the city's EcoEvent guidelines」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/eco-event-vienna/"},{"note":"ナビゲーションはHome / Committees / Scope of Papers / Program / Author's Corner / Support ESREF / Registration / Venue / Sustainability / Imprint の各項目で構成され、いずれも2026年サイクル向け。","label":"2027年サイクルの公表状況","value":"次回開催地・会期を告知するページは ESREF 2026 公式サイトのナビゲーションに置かれていない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"}],"title":"2026年サイクルの会期・会場・参加形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"Scope of PapersページはA〜Jの見出しに分かれ、パワーデバイス関連のFのみF1・F2・F3に細分されています。投稿先トラックを決めるときは、劣化機構そのものを扱うB、解析手法を扱うC、デバイス種別で切るD/F/G/H、応用分野で切るI/Jという軸の違いを見てから選ぶと迷いが減ります。2025年サイクルはA〜Iの9見出しで、Automotive and Industrial Electronic Reliabilityに相当する独立見出しがなく、各見出しの題目も異なるため、過去年のトラック記号をそのまま流用すると2026年の区分とずれます。","facts":[{"note":"Scope of Papersページの見出し構成。","label":"2026 トラック数","value":"A〜Jの10見出し。FはF1/F2/F3の3見出しに分割されている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"Design for reliability、Built-in reliability、Virtual qualification、Reliability simulation、Advanced models for reliability prediction、Reliability test structures、Limits to accelerated tests、Screening methods、Yield/reliability relationship、Obsolescence、Counterfeiting を列挙。","label":"2026 Track A","value":"Quality and Reliability Assessment Techniques and Methods for Devices and Systems","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"Hot-carrier injection、NBTI、TDDB、high-k誘電体・advanced gate stacks・metal gates、low-k/Cu interconnect、metal migration(electromigration)、不揮発メモリセル信頼性、SOI、2D材料、FeFET・FeRAM等のbeyond-CMOSを列挙。","label":"2026 Track B","value":"Reliability for Nanoelectronics","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"電子・イオン・光ビーム法、走査プローブ法、backside techniques、acoustic microscopy、電気/熱/熱機械的評価、sample preparation、construction analysis、failure analysis case studies を列挙。","label":"2026 Track C","value":"Progress in Failure Analysis: Defect Detection and Analysis","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"DはGaN HEMT・GaAs pHEMT・InP HBT・SiGeとtrap dynamics、5G/6G・レーダ・衛星応用。Eは3D集積とTSV、flip-chipとはんだ接合、interposer、chip/package interaction。","label":"2026 Track D / Track E","value":"D: Reliability of Microwave Devices and Circuits ／ E: Packaging- and Assembly Reliability and Failure Analysis","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"F1はSi MOSFET・IGBTのaging機構とゲート酸化膜、F2はSiC MOSFET・GaN HEMTのVth安定性と短絡・アバランシェ耐量、F3はコンバータ/インバータの信頼性設計とcondition monitoring。","label":"2026 Track F1 / F2 / F3","value":"F1: Power Devices Reliability: Smart-Power Devices and Silicon Power Devices ／ F2: Power Devices Reliability: Wide-Bandgap Devices ／ F3: Power Devices Reliability: Power Electronic Systems","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"GはSi・薄膜・ペロブスカイト・タンデム太陽電池、レーザ・LED・光検出器、OLED/micro-LED。HはMEMSの機械疲労とstiction、MOEMS/NEMS、harsh environmentのセンサ信頼性、加速試験と寿命予測。","label":"2026 Track G / H","value":"G: Photonics Reliability ／ H: MEMS and Sensor Reliability","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"IはESD/EOS robustness、latch-up、EMC/EMI、放射線効果、宇宙・航空向けhardening。JはEV/HEV、電池・スーパーキャパシタ、パワートレイン、充電・V2G、熱管理。","label":"2026 Track I / J","value":"I: Extreme Environments and Radiation ／ J: Automotive and Industrial Electronic Reliability","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"同ページに置かれているのはA〜Jの見出しと各見出し下のサブトピック箇条書きのみ。","label":"2026 明示された対象外","value":"対象外の技術領域を明示する記述はScope of Papersページにない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"ESREF 2025公式サイトのScope of papersページ。年をまたいでトラック記号を参照する際の相違点。","label":"2025 トラック構成","value":"A〜Iの9見出し。Fは「F - Power Devices and Microelectronic System: Reliability and Failure Analysis」の1見出しで、その下に「F1 - Smart-power devices, IGBT, thyristors,」「F2 - SiC and GaN power devices」「F3 - Power Electronic System」が置かれている。2026年のJ(Automotive and Industrial Electronic Reliability)に相当する独立見出しはない。","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/page/scope_of_papers?lang=en"}],"title":"対象技術領域とトラック構成","eyebrow":"scope"},"review":{"id":"review","body":"ESREFの査読はTechnical Program Committeeが担当するpeer reviewで、判断基準はscientific qualityとrelevanceだとPaper Submissionページに書かれています。TPCはScope of Papersと同じA〜Jのトラック単位で編成され、各トラックにChairsとMembersが配置されているため、投稿前に自分の題材を審査する側の顔ぶれを確認できます。IEEE Xplore向け最終原稿には別途Mentoring processの通過が課され、abstract査読とは別工程として案内されています。","facts":[{"note":"Paper Submissionページの原文。","label":"2026 査読方式","value":"「All Submissions will be peer reviewed by the Technical Program Committee to ensure scientific quality and relevance.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Technical Program Committeeページの構成。Chairsの人数はトラックにより異なる。","label":"2026 TPCのトラック編成","value":"Scope of Papersと同じ Track A / B / C / D / E / F1 / F2 / F3 / G / H / I / J の見出しごとに Chairs と Members を配置。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-programm-committee/"},{"note":"Technical Program Committeeページに記載。企業と大学・公的研究機関の双方がChairsに入っている。","label":"2026 トラックChairsの例","value":"Track A: E. OLTHOF(NXP Semiconductors, Netherlands)、C. SALM(University of Twente, Netherlands)／Track B: M. WALTL(Institute for Microelectronics, TU Wien, Austria)、A. GRILL(IMEC, Belgium)、K. WASCHNECK(Infineon Technologies, Germany)／Track C: G. MURA(DIEE University of Cagliari, Italy)、S. CHEF(Temasek Laboratories @ NTU, Singapore)、F. ALTMANN(Fraunhofer IMWS, Germany)、C. HOBERT(Sector Technologies SAS, France)／Track I: F. PINTACUDA(ST Microelectronics, France)、M. SIMICIC(IMEC, Belgium)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-programm-committee/"},{"note":"Publicationページに記載。","label":"2026 特集号への招待主体","value":"「The Technical Program Committee will invite authors to extend their abstracts to six pages」と記載され、Microelectronic Engineering特集号への投稿はTPCの招待による。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Publicationページ。abstract査読とは別の工程として案内されている。","label":"2026 最終原稿のMentoring process","value":"IEEE Xplore掲載用の最終原稿は Mentoring process の通過が必須と記載されている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"査読の匿名性についての公式記述は確認できない。","label":"2026 double-blindの記載","value":"double-blind・single-blind・rebuttalに関する記述はPaper Submissionページにない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Technical Programページはプログラム概要とPDFリンクのみで、数値の記載はない。","label":"2026 採択率","value":"投稿件数・採択件数・採択率を掲載しているページは ESREF 2026 公式サイト内に見当たらない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-program/"},{"note":"ESREF 2025公式サイト。2026年サイクルのページには査読者数の表記はない。","label":"2025 査読者数","value":"投稿論文は「at least five reviewers of the ESREF 2025 Technical Program Chair」による評価を受けるとPaper submissionページに記載されている。","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/page/paper_submission?lang=en"}],"title":"査読方式と審査体制","eyebrow":"review"},"caveats":{"id":"caveats","body":"公式サイトが本文テキストとして公開していない項目があります。2026年サイクルのabstract締切日と採択通知日、投稿件数・採択件数・採択率、参加者数、ESREFの初回開催年、2027年サイクルの開催地と会期は、ESREF 2026公式サイトのどのページにも数値や日付として印字されていません。tutorialとshort courseの実施日、ポスターの提出期限、査読の匿名性(double-blindなど)、オープンアクセスやAPCの扱いも同様に公表されていません。Call for Papersの本体と詳細プログラムはPDFでのみ配布されており、ページ本文からは読めません。2025年は10月開催、2026年は9月開催と会期の月が異なり、掲載先も年で切り替わっているため、年をまたいで参照する際はサイクル年の確認が必要です。ESREF 2025のトップページは開催都市をBordeauxとだけ記し、国名を印字していません。","facts":[{"note":"ページ上部には「Abstract Submission extended」のバナー画像が置かれている。","label":"abstract締切の未掲載","value":"Call for Papersページの本文はリード文とPDFダウンロードリンクのみで、締切日・投稿区分・書式・トピック一覧のいずれも本文テキストとして掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/call-for-papers/"},{"note":"「The program will be updated as new information becomes available」と記載されており、内容は更新される。","label":"詳細プログラムの未掲載","value":"Technical Programページはセッション名・時刻を本文に持たず、Technical Program BookのPDFへのリンクのみを提供している。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-program/"},{"note":"同一サイト内での表記差。両ページとも本ページのsources[]に収録。","label":"誌名の公式表記ゆれ","value":"Paper Submissionページは特集号の掲載誌を「Microelectronics Engineering (MEE) Journal」と表記しており、Publicationページの「Microelectronic Engineering」と綴りが異なる。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"同一サイト内での表記差。両ページとも本ページのsources[]に収録。","label":"役職名の公式表記ゆれ","value":"Lado Filipovic の役職が Organizing Committee ページでは Vice Chair、Home ページでは Co-Chair と表記されている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/organizing-committee/"},{"note":"取引関係・売上・採用・共同研究を示すものではない。","label":"sponsor・exhibitor掲載の解釈範囲","value":"Patrons/SponsorsページとExhibitorsページの掲載は、本会議への支援または出展の事実のみを示す。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/exhibitors/"},{"note":"ESREF 2026公式サイトのナビゲーションに該当項目のページが存在しない。","label":"このページで扱わない範囲","value":"採択率・投稿件数・参加者数・初回開催年・2027年サイクルの開催地は、公式サイトに数値や日付として印字されていないため扱わない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"}],"title":"このページで扱わない範囲と注意点","eyebrow":"caveats"},"history":{"id":"history","body":"回次と開催地は各サイクルの公式サイトに個別に掲載されており、2024年が第35回のイタリア・パルマ、2025年が第36回のボルドー、2026年が第37回のオーストリア・ウィーンです。ESREF 2025のトップページは開催都市をBordeauxとだけ記し、国名を印字していません。初回開催年を明示した記述は2024年サイトのWelcomeページにはなく、同ページの「its 35-year history」が公式に読める最も長い期間の言及です。同じページには「in 2024 ESREF will celebrate its return to Italy after 12 years」という記述があり、開催国が年ごとに移動する運営であることが公式表記から確認できます。","facts":[{"note":"ESREF 2024公式サイトのWelcomeページ。General ChairはPaolo Cova、運営はSistema Congressi srl。","label":"2024 回次・開催地・会期","value":"35th edition、Parma, Italy、September 23-26, 2024","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2024.org/welcome"},{"note":"ESREF 2024 Welcomeページの原文。初回開催年そのものの記載はない。","label":"2024 公式の歴史表現","value":"「This International Symposium will continue its 35-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for microelectronics and optoelectronics, power, space, and automotive electronics.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2024.org/welcome"},{"note":"ESREF 2024 Welcomeページの原文。開催国が年ごとに移動する運営を示す公式表記。","label":"2024 開催国ローテーションへの言及","value":"「This edition will be a very special one: in 2024 ESREF will celebrate its return to Italy after 12 years.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2024.org/welcome"},{"note":"ESREF 2025公式サイト(sciencesconf.org)のトップページ。","label":"2025 回次・開催地","value":"「ESREF 2025 : 36th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2025」、開催地は Bordeaux。トップページに国名の表記はない。","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/"},{"note":"ESREF 2025公式サイトが Full Programme としてリンクしているEasyChair Smart Programの日付タブ。","label":"2025 会期","value":"Monday, October 6th 〜 Thursday, October 9th, 2025","checkedAt":"2026-08-06","sourceUrl":"https://easychair.org/smart-program/ESREF2025/"},{"note":"ESREF 2026公式サイトのWhy Support ESREF 2026ページ。","label":"2026 回次・開催地・会期","value":"37th、Vienna, Austria、September 21-24, 2026","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/why-support-esref-2026/"},{"note":"同ページで確認できる最も長い期間の公式表現は「its 35-year history」。","label":"初回開催年","value":"ESREF 2024のWelcomeページに初回開催年の記載はない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2024.org/welcome"}],"title":"回次と開催地の推移","eyebrow":"history"},"program":{"id":"program","body":"2026年サイクルはkeynote 2件、tutorial 7件、Short Course I(Emerging Technologies)、invited talk 5件が氏名と題目つきで公開されています。各回の日付と時刻はページ本文に置かれておらず、時間割はTechnical Program BookのPDFにまとめられています。口頭発表の持ち時間は発表15分・質疑5分の計20分と規定されているので、投稿前に発表構成をこの尺で組めます。","facts":[{"note":"Keynotesページに記載。日付・時刻は同ページに掲載されていない。","label":"2026 Keynote I","value":"Ben Kaczer(imec, Belgium)「Technology Strategies for Evolving Compute Challenges」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/keynotes/"},{"note":"Keynotesページに記載。所属の国名表記と日付は同ページにない。","label":"2026 Keynote II","value":"Tomáš Vystavěl(Thermo Fisher Scientific)「Integrated Workflows for Physical Failure Analysis」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/keynotes/"},{"note":"Tutorialsページに記載。開催日と別途登録の要否は同ページに掲載されていない。Tutorial VIIの題目は講演題目としての公式表記をそのまま引用したもので、ESREFによる企業評価ではない。","label":"2026 Tutorials(7件)","value":"I: Hussam Amrouch(Technical University of Munich, Germany)「Unlocking Material-to-System Innovation with AI」／II: Srabanti Chowdhury(Stanford University, USA)「Energy efficient power switches with Gallium Nitride technology」／III: Xavier Garros(CEA-Leti, France)「Reliability of Silicon-based Transistors processed at low temperatures」／IV: Andreas Martin(Infineon Technologies AG, Germany)「CMOS product yield and reliability risk: Plasma Induced Damage (PID) past, present and future nodes」／V: Joe W. McPherson(McPherson Reliability Consulting LLC, USA)「Degradation Physics and Degradation Rate Modeling」／VI: Peter Moens(onsemi Power Solutions Group, Belgium)「Introduction to SiC power MOSFET technology and reliability」／VII: Aidan Taylor(Infineon Technologies Austria AG, Austria)「Failure Analysis at a world-leading semiconductor manufacturer: from high science to high-throughput」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/tutorials/"},{"note":"Emerging Technologiesページに記載。emerging memoryのDTCO、2D FET、MOSゲートスタック安定性、RRAM信頼性、memristiveデバイスの欠陥制御が題目。日付の記載はない。","label":"2026 Short Course I – Emerging Technologies","value":"登壇5名。Erika Covi(Technical University of Munich)、Saptarshi Das(Pennsylvania State University)、Jacopo Franco(imec, Belgium)、Cristian Zambelli(Università degli Studi di Ferrara)、Lambert Alff(Technische Universität Darmstadt)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/emerging-technologies/"},{"note":"Invited Talksページに記載。題目はWBGデバイスの量産信頼性、全液体接続のパワエレ、AI駆動FIBエンドポインティング、フォトニクスのシステム信頼性、量子計算向け極低温低雑音アンプ。","label":"2026 Invited Talks(5件)","value":"Stefano Aresu(Infineon Technologies, Austria)、Francesco Iannuzzo(Polytechnic of Turin, Italy)、Bryan Sang Hoon Lee(Micron Technology, USA)、Michael Rogers(ams OSRAM AG)、Cezar Zota(IBM Research Europe, Switzerland)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/invited-talks/"},{"note":"Oral Presentationページの原文。","label":"2026 口頭発表の持ち時間","value":"「Each oral presentation slot is 20 minutes, including 15 minutes for the presentation and 5 minutes for discussion.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/oral-presentation/"},{"note":"PDFは https://www.esref2026.org/forms/technical_program_20260729.pdf として配布されている。","label":"2026 技術プログラムの公開形態","value":"Technical Programページはkeynote・tutorial・short course・technical sessionを含む概要文とPDFリンクで構成され、セッション名や時刻の一覧は本文に置かれていない。「The program will be updated as new information becomes available」と記載。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-program/"},{"note":"ESREF 2025公式サイトが Full Programme としてリンクしているEasyChair Smart Program。会期は Monday, October 6th 〜 Thursday, October 9th の4日間。","label":"2025 プログラムのセッション構成","value":"Opening session、Keynote、Best papers ISTFA 2024、Best Paper IPFA 2025、Tutorial、A〜Iのトラック別セッション(例: 「F2-1 SiC Reliability」「F2-2 GaN Reliability」「C - Progress in Failure Analysis: Defect Detection and Analysis」「G - Photonics Reliability」)、Poster Session - All topics、Closing session and Best paper awards","checkedAt":"2026-08-06","sourceUrl":"https://easychair.org/smart-program/ESREF2025/"}],"title":"keynote・tutorial・short course・invited talk","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からの投稿は4ページ以内のabstractが単位で、採択1件につき最低1名のフル参加登録と現地発表が必要です。学生料金は在学を証明する書類の提出が条件で、早期登録の区切りは2026年8月1日と明示されているため、採否の見通しが立った段階で登録費の予算を確定できます。企業の調査担当は、トラック別のTPC名簿、invited talkの登壇組織、出展社一覧から、欧州の信頼性・故障解析コミュニティにどの組織が関与しているかを一次情報で確認できます。","facts":[{"note":"Authors/Attendeesページの料金表。","label":"2026 早期登録費(Early Bird, before August 1st, 2026)","value":"IEEE Member €910／Non Member €990／IEEE Lifetime Member €720／IEEE Student Member €720／Student Non-Member €760","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Authors/Attendeesページの料金表。","label":"2026 通常登録費(Standard)","value":"IEEE Member €1,010／Non Member €1,090／IEEE Lifetime Member €820／IEEE Student Member €820／Student Non-Member €860","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Authors/Attendeesページの原文。","label":"2026 登録に含まれるもの","value":"「access to the scientific program and conference materials, as well as coffee breaks, lunch breaks, and social evening events」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Authors/Attendeesページ。脚注に「Reduced student fees without the gala dinner are also available」と記載。","label":"2026 Gala Dinner 追加費用","value":"€120(早期・通常とも同額)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Authors/Attendeesページおよび Paper Submissionページの原文。","label":"2026 著者の登録義務","value":"「Each accepted oral or poster presentation requires at least one full conference registration (Regular or Student).」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Authors/Attendeesページの脚注。","label":"2026 学生料金の条件","value":"「For Bachelor, Master, or PhD students; requires the upload of a document that proves student status」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/authors-attendees/"},{"note":"Tutorialsページ。開催日と、受講に別途登録が必要かどうかは同ページに記載がない。","label":"2026 学習向けプログラム","value":"Tutorial I〜VIIの7件が講師名・所属・題目つきで掲載されている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/tutorials/"}],"title":"研究室・企業からの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"ESREFはサイクルごとに開催国のホスト機関が運営を引き受ける方式で、2026年はTU WienのInstitute for Microelectronicsがホストです。稟議や引用に載せる際は、正式名称とサイクル年、回次(2026年は37th)をセットで書くと年度の取り違えを避けられます。問い合わせ先はホスト機関のメールアドレス1つに集約されており、常設事務局の記載はありません。","facts":[{"note":"Homeページの歓迎文および Why Support ページの冒頭文に同じ名称が印字されている。","label":"2026 正式名称","value":"European Symposium on Reliability of Electron Devices, Failure Physics and Analysis","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"},{"note":"サイト名・ページ見出しとも「ESREF 2026」表記。","label":"2026 略称","value":"ESREF","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"},{"note":"Why Support ESREF 2026 ページ冒頭の原文。Homeページも「the 37th edition of ESREF」と記載。","label":"2026 回次","value":"「the 37th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/why-support-esref-2026/"},{"note":"Homeページの原文「We are delighted to welcome you to the 37th edition of ESREF, hosted in the historic and culturally rich city of Vienna, Austria, by the Institute for Microelectronics at TU Wien.」。","label":"2026 ホスト機関","value":"Institute for Microelectronics at TU Wien(Austria)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"},{"note":"Organizing Committee ページの役職見出し。Homeページでは Lado Filipovic を Co-Chair、Diana Pop を Conference Manager と表記している。","label":"2026 General Chair / Vice Chair","value":"General Chair: Michael WALTL(Institute for Microelectronics, TU Wien, Austria)／Vice Chair: Lado FILIPOVIC(同所属)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/organizing-committee/"},{"note":"Organizing Committee ページ末尾に記載。","label":"2026 問い合わせ先","value":"esref@tuwien.ac.at","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/organizing-committee/"},{"note":"Conference Partner ページに1社のみ掲載。掲載は本会議への支援の事実を示すもので、取引・売上・採用・共同研究を示すものではない。","label":"2026 Conference Partner","value":"Infineon Technologies Austria(原文「As a cooperation partner, Infineon Austria proudly supports ESREF 2026」)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/conference-partner/"},{"note":"ESREF 2025 公式サイトのトップページの原文。サイクルごとにホスト機関が替わる運営であることが年別サイトから読み取れる。","label":"2025 主催体制","value":"「ESREF 2025 will be held in Bordeaux and organized by IMS laboratory, University of Bordeaux, in collaboration with LAAS-CNRS, University of Toulouse, CNES Toulouse, and ADERA.」","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/"},{"note":"同ページにあるのは「the 37th edition of ESREF」という回次表現のみ。回次と年の対応は history セクションの各年公式ページを参照。","label":"開催頻度の公式表記","value":"「annual」など開催頻度を明示する語は、ESREF 2026のHomeページに印字されていない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/home/"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"ESREFはサイクルごとのOrganizing Committeeと、年をまたいで継続するSteering Committeeの二層構造です。Steering Committeeには大学・公的研究機関と半導体メーカー・航空機メーカーが並び、掲載されている所属の所在国はイタリア、フランス、ドイツ、オランダ、ギリシャ、スイス、オーストリア、米国です。Technical Program Committeeには日本の大学・企業に所属するメンバーも掲載されており、日本からの投稿先としてどのトラックが近いかを名簿から確認できます。","facts":[{"note":"Technical Program ChairsはAlexander GRILL(imec, Belgium)、Theresia KNOBLOCH(Institute for Microelectronics, TU Wien, Austria)、Michael NELHIEBEL(KAI Infineon Technologies Austria AG, Villach, Austria)、Dominic WALDHOER(Institute for Microelectronics, TU Wien, Austria)。","label":"2026 Organizing Committee","value":"General Chair 1名、Vice Chair 1名、Technical Program Chairs 4名、Conference Administration/Sponsorship and Exhibition 2名、Webmaster/IT 2名。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/organizing-committee/"},{"note":"ESREF 2026公式サイトのSteering Committeeページ掲載時点。","label":"Steering Committee の人数","value":"現メンバー21名、別枠のEmeritus Members 12名。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/steering-committee/"},{"note":"掲載された所属の所在国であり、個人の国籍ではない。Italy所在の所属として University of Napoli、University of Cassino and Southern Lazio、University of Parma、Polytechnic University of Turin、University of Padova、University of Cagliari、CNR-IMM Bologna が掲載されている。","label":"Steering Committee の所属所在国","value":"Germany, Italy, France, Switzerland, USA, Greece, Netherlands, Austria","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/steering-committee/"},{"note":"Steering Committeeページの名簿。","label":"Steering Committee の産学構成","value":"大学・公的研究機関(Fraunhofer IMWS-CAM、ETH Zürich、IMS University of Bordeaux、CNR-IMM Bologna、Democritus University of Thrace など)と企業(Airbus、STMicroelectronics、NXP Semiconductors、KAI / Infineon)が同一名簿に並ぶ。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/steering-committee/"},{"note":"Technical Program Committeeページ。所属の所在国であり、個人の国籍ではない。","label":"2026 TPCに掲載された日本所在の所属","value":"K. NAKAMAE(Osaka University, Track A)、N. SUZUMURA(Renesas Electronics Corporation, Track B)、H. TERADA(HAMAMATSU PHOTONICS K.K., Track C)、H. SUZUKI(Hitachi, Ltd., Track F1)、T. KIMOTO(Kyoto University, Track F2)、M. OKUSHIMA(Renesas Electronics, Track I)、T. SUZUKI(Socionext Inc., Track I)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/technical-programm-committee/"},{"note":"掲載は本会議への支援の事実のみを示す。取引・売上・採用・共同研究を示すものではない。","label":"2026 Patrons/Sponsors","value":"Silver に PVA TePla が1社掲載。Platinum・Gold・Bronze に掲載企業はない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/patrons-sponsors/"},{"note":"掲載は出展の事実のみを示す。顧客関係・売上・採用・共同研究を示すものではない。","label":"2026 Exhibitors","value":"Section – Central Hall: Infineon, JPKummer, Kleindiek, opSens, Maser Engineering, Imina／Section – Innovation Wing: Hamamatsu, Microsanj, Seiwa Optical, PVA-TePla, QZabre, FS-Bondtec, Sector Technologies, Mercia, Hitachi Power Solutions, Checkpoint Technologies, TIA, Quantum Diamonds, Digit Concept／Section – Foyer: JEOL, Allied High Tech, SCIA Systems","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/exhibitors/"},{"note":"Why Support ESREF 2026 ページ。参加者数の数値はこのページに掲載されていない。","label":"2026 参加者像の公式記述","value":"「international experts from academia, research, and industry」、参加者には「leading research institutions, major industrial players, and European space and defense agencies」の関係者が含まれると記載。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/why-support-esref-2026/"}],"title":"委員会構成と参加組織の所在国","eyebrow":"community"},"comparison":{"id":"comparison","body":"ESREF 2025のプログラムには「Best papers ISTFA 2024」と「Best Paper IPFA 2025」という、他会議の受賞論文を招く枠が明示されています。故障解析系の会議間で受賞論文を持ち込む運用が公式プログラムから読み取れるため、投稿先を1つに絞る前に各会議の受賞枠まで含めて比較できます。ESREF側の対象範囲は先端CMOSの劣化機構からパワーデバイス、フォトニクス、MEMS、パッケージ、車載までA〜Jの10トラックに広がっており、単一デバイス種に限定されていません。掲載先はサイクルごとに切り替わり、2026年はMicroelectronic Engineering特集号とIEEE Xploreの二本立てです。","facts":[{"note":"ESREF 2025 Full Programme(EasyChair Smart Program)。","label":"2025 ISTFAとの接点","value":"2025年プログラムのMonday, October 6thに「Best papers ISTFA 2024」セッションが置かれている。","checkedAt":"2026-08-06","sourceUrl":"https://easychair.org/smart-program/ESREF2025/"},{"note":"ESREF 2025 Full Programme(EasyChair Smart Program)。","label":"2025 IPFAとの接点","value":"2025年プログラムのMonday, October 6thに「Best Paper IPFA 2025」セッションが置かれている。","checkedAt":"2026-08-06","sourceUrl":"https://easychair.org/smart-program/ESREF2025/"},{"note":"Scope of Papersページのトラック構成。","label":"2026 対象範囲の広さ","value":"品質・信頼性評価手法(A)、ナノエレクトロニクス(B)、故障解析(C)、マイクロ波デバイス(D)、パッケージ(E)、パワーデバイス(F1/F2/F3)、フォトニクス(G)、MEMS・センサ(H)、極限環境・放射線(I)、車載・産業(J)を同一シンポジウムで扱う。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/scope-of-papers/"},{"note":"Publicationページ。学術誌掲載と会議録収録の双方が同一サイクルで案内されている。","label":"2026 掲載経路の二本立て","value":"Elsevier誌 Microelectronic Engineering の特集号(招待制・6ページ)と、IEEE Xplore収録のproceedings(4〜6ページ)。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"}],"title":"近い会議との棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"ESREFの投稿単位は本文4ページ以内のabstractで、図表と参考文献を含めた総ページ数が上限です。提出は公式のLaTeXまたはWordテンプレートを使い、EasyChairから行います。2026年サイクルのabstract締切と採択通知日は公式ページの本文テキストに印字されていないため、投稿を検討する場合はCFPのPDFと問い合わせ先で日付を直接確認してください。採択後の日程(特集号の投稿サイト開設・アップロード期限、最終原稿、スライド提出)はPublicationページとOral Presentationページに文字で掲載されています。","facts":[{"note":"Paper Submissionページの原文。図表・参考文献込みで4ページ以内。","label":"2026 投稿単位とページ数","value":"「All submissions must follow the official conference format and must not exceed four pages, including figures and references.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Paper Submissionページに記載。","label":"2026 テンプレート","value":"LaTeX版とMicrosoft Word版の公式テンプレートがサイト上で提供されている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Paper Submissionページに投稿先URLが記載されている。発表スライドと最終原稿のアップロードも同システム。","label":"2026 投稿システム","value":"EasyChair(https://easychair.org/my/conference?conf=esref2026)","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Paper Submissionページの原文。","label":"2026 originality要件","value":"「Submissions must present original research not previously submitted or published elsewhere.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"CFP本体は https://www.esref2026.org/forms/ESREF_Call_for_Papers.pdf からPDFで配布されている。","label":"2026 abstract締切の掲載状況","value":"Call for Papersページの本文は投稿を呼びかけるリード文とCFPのPDFダウンロードリンクのみで、締切日は本文テキストに印字されていない。ページ上部には「Abstract Submission extended」のバナー画像が置かれている。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/call-for-papers/"},{"note":"同ページに書かれているのは査読主体、ページ数上限、テンプレート、originality要件、登録義務と現地発表要件、EasyChairの投稿先URL。","label":"2026 採択通知日","value":"Paper Submissionページに採択通知日の記載はない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"Microelectronic Engineering特集号向けの日程としてPublicationページに記載。投稿時のarticle typeは「VSI: ESREF2026」。","label":"2026 特集号 投稿サイト開設日・アップロード期限","value":"投稿サイト開設が June 22, 2026、アップロード期限が July 13, 2026。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Publicationページに記載。","label":"2026 IEEE Xplore向け最終原稿の締切","value":"EasyChairへのアップロード期限は August 30, 2026。Mentoring processの通過とIEEE copyright formの提出が条件。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Oral Presentationページの原文。対応形式はPPT・PPTX・PDF、16:9推奨、フォント埋め込みが必要。","label":"2026 発表スライドの提出期限","value":"「The slides must be uploaded until August 30th, 2026.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/oral-presentation/"},{"note":"Poster Presentationページに記載。公式PowerPointテンプレートの使用が案内されている。ポスターの提出期限は同ページに記載がない。","label":"2026 ポスターの仕様","value":"「Posters should be prepared in DIN A0 format (approximately 119 cm × 84 cm) in portrait orientation.」、タイトルは最低5 cmの文字高。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/poster-presentation/"},{"note":"ESREF 2025公式サイトのPaper submissionページ。2026年サイクルの日付ではない。","label":"2025 締切実績","value":"採否(oral / poster)の通知が May 9, 2025、proceedings用改訂4ページ原稿の提出が June 10, 2025。初回投稿の締切は「The submission deadline is March 23 17 10, 2025.」と複数の数字が並ぶ表記で、一意に読み取れない。","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/page/paper_submission?lang=en"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"2026年サイクルの掲載経路は2本立てで、ページ数と締切がそれぞれ異なります。TPCの招待を受けた著者は6ページに拡張してElsevierのMicroelectronic Engineering特集号へ、採択されたabstractは4〜6ページの最終原稿としてIEEE Xploreへという案内です。2025年サイクルはproceedingsがHAL Open Science、特集号がMicroelectronics Reliabilityだったため、過去論文を探すときは年ごとに掲載先を切り替えて検索する必要があります。","facts":[{"note":"Publicationページに記載。TPCの招待を受けた著者がabstractを6ページに拡張して投稿する。","label":"2026 特集号","value":"Elsevier誌 Microelectronic Engineering の ESREF 2026 特集号。投稿時に article type「VSI: ESREF2026」を選択する。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Publicationページに記載。誌のmanuscript guidelinesに従うことも併記されている。","label":"2026 特集号のページ数","value":"abstractを six pages に拡張して提出する。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Publicationページに記載。","label":"2026 proceedings収録先","value":"採択されたabstractは IEEE Xplore digital library に収録される。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Publicationページに記載。copyright formはEasyChair上で提出する。","label":"2026 proceedings原稿の仕様","value":"最終proceedings原稿は4〜6ページ。「Using the templates provided by ESREF is mandatory.」と記載され、IEEE copyright form の提出が必要。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"Paper Submissionページの原文。直前に、採択1件につき最低1名のフル参加登録と、登録済み著者による現地発表が要件として記載されている。","label":"2026 掲載の前提条件","value":"「Otherwise, the contribution will not be eligible for publication in the conference proceedings or in the ESREF 2026 Special Issue of the Microelectronics Engineering (MEE) Journal.」","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/paper-submission/"},{"note":"掲載条件は各掲載先の規定に依存する旨の説明も掲載されていない。","label":"2026 オープンアクセスの記載","value":"オープンアクセス、APC、購読範囲に関する記述はPublicationページにない。","checkedAt":"2026-08-06","sourceUrl":"https://www.esref2026.org/publication/"},{"note":"ESREF 2025公式サイトのPaper submissionページ。2026年サイクルとは掲載先・誌名が異なる。","label":"2025 掲載先","value":"proceedings は HAL Open Science system で公開され、閲覧開始は October 6, 2025。特集号は Microelectronics Reliability(Elsevier Ltd)で、「at least 6 up to 8 pages」に拡張のうえ誌側の追加査読を受ける。","checkedAt":"2026-08-06","sourceUrl":"https://esref2025.sciencesconf.org/page/paper_submission?lang=en"}],"title":"掲載先と公開範囲","eyebrow":"publication"}},"sources":[{"url":"https://www.esref2026.org/home/","role":"official","label":"ESREF 2026 Home","checkedAt":"2026-08-06","evidenceLocator":"歓迎文「We are delighted to welcome you to the 37th edition of ESREF, hosted in the historic and culturally rich city of Vienna, Austria, by the Institute for Microelectronics at TU Wien.」。ページ下部にMichael Waltl(General Chair)、Lado Filipovic(Co-Chair)、Diana Pop(Conference Manager)。ヘッダーに全ナビゲーション項目。"},{"url":"https://www.esref2026.org/call-for-papers/","role":"cfp","label":"ESREF 2026 Call for Papers","checkedAt":"2026-08-06","evidenceLocator":"本文のリード文「Researchers, engineers, and practitioners are warmly invited to submit...」と、CFP PDF(forms/ESREF_Call_for_Papers.pdf)へのダウンロードリンク。ページ上部に「Abstract Submission extended」バナー画像。本文に締切日の文字表記はない。"},{"url":"https://www.esref2026.org/scope-of-papers/","role":"cfp","label":"ESREF 2026 Scope of Papers","checkedAt":"2026-08-06","evidenceLocator":"Track A〜Jの見出しと各見出し下のサブトピック箇条書き。FはF1/F2/F3の3見出しに分割されている。対象外を示す記述はない。"},{"url":"https://www.esref2026.org/paper-submission/","role":"cfp","label":"ESREF 2026 Paper Submission","checkedAt":"2026-08-06","evidenceLocator":"投稿要件の段落(4ページ上限、LaTeX/Wordテンプレート、originality)、査読の一文、登録義務と現地発表要件の段落(「Microelectronics Engineering (MEE) Journal」表記を含む)、末尾のEasyChair投稿URL。締切日・採択通知日の記載はない。"},{"url":"https://www.esref2026.org/publication/","role":"proceedings","label":"ESREF 2026 Publication","checkedAt":"2026-08-06","evidenceLocator":"Microelectronic Engineering特集号の段落(6ページ、投稿サイト開設6月22日、期限7月13日、VSI: ESREF2026)と、IEEE Xploreの段落(4-6ページ、Mentoring process、8月30日、IEEE copyright form)。オープンアクセス・APCの記載はない。"},{"url":"https://www.esref2026.org/technical-program/","role":"program","label":"ESREF 2026 Technical Program","checkedAt":"2026-08-06","evidenceLocator":"プログラム概要の段落と更新告知の一文、Technical Program BookのPDFリンク(forms/technical_program_20260729.pdf)。セッション表・投稿件数・採択率は本文になし。"},{"url":"https://www.esref2026.org/keynotes/","role":"program","label":"ESREF 2026 Keynotes","checkedAt":"2026-08-06","evidenceLocator":"Keynote I / Keynote II の見出しに登壇者名・所属・講演題目。日付・時刻の記載はない。"},{"url":"https://www.esref2026.org/tutorials/","role":"program","label":"ESREF 2026 Tutorials","checkedAt":"2026-08-06","evidenceLocator":"Tutorial I〜VII の題目と講師名・所属の一覧。開催日と別途登録の要否の記載はない。"},{"url":"https://www.esref2026.org/emerging-technologies/","role":"program","label":"ESREF 2026 Emerging Technologies(Short Course I)","checkedAt":"2026-08-06","evidenceLocator":"「Short Course I – Emerging Technologies」の見出し下に5名の登壇者名・所属と各講演題目。日付の記載はない。"},{"url":"https://www.esref2026.org/invited-talks/","role":"program","label":"ESREF 2026 Invited Talks","checkedAt":"2026-08-06","evidenceLocator":"招待講演5件の題目と登壇者名・所属。"},{"url":"https://www.esref2026.org/oral-presentation/","role":"program","label":"ESREF 2026 Oral Presentation","checkedAt":"2026-08-06","evidenceLocator":"発表20分(15+5)の一文、スライド提出期限2026年8月30日、対応形式PPT/PPTX/PDFと16:9推奨、フォント埋め込みの指示。"},{"url":"https://www.esref2026.org/poster-presentation/","role":"program","label":"ESREF 2026 Poster Presentation","checkedAt":"2026-08-06","evidenceLocator":"DIN A0(約119 cm × 84 cm)縦向きの指定、タイトル文字高5 cm以上、PowerPointテンプレートの案内。提出期限の記載はない。"},{"url":"https://www.esref2026.org/organizing-committee/","role":"committee","label":"ESREF 2026 Organizing Committee","checkedAt":"2026-08-06","evidenceLocator":"General Chair / Vice Chair / Technical Program Chairs / Conference Administration/Sponsorship and Exhibition / Webmaster/IT の役職見出しごとの氏名・所属。末尾に連絡先メール esref@tuwien.ac.at。"},{"url":"https://www.esref2026.org/steering-committee/","role":"committee","label":"ESREF Steering Committee(2026サイト掲載)","checkedAt":"2026-08-06","evidenceLocator":"現メンバー21名の氏名・所属・国の一覧と、その下のEmeritus Members欄(12名)。"},{"url":"https://www.esref2026.org/technical-programm-committee/","role":"committee","label":"ESREF 2026 Technical Program Committee","checkedAt":"2026-08-06","evidenceLocator":"Track A / B / C / D / E / F1 / F2 / F3 / G / H / I / J の見出しごとにChairsとMembersの氏名・所属・国を列挙。Osaka University、Renesas Electronics Corporation、HAMAMATSU PHOTONICS K.K.、Hitachi, Ltd.、Kyoto University、Socionext Inc. の記載を含む。"},{"url":"https://www.esref2026.org/venue/","role":"venue","label":"ESREF 2026 Venue","checkedAt":"2026-08-06","evidenceLocator":"会場名(ETIT, TU Wien)と住所 Gußhausstraße 27-29, 1040 Vienna、会場説明の段落、地下鉄・鉄道・空港・自転車・駐車場のアクセス一覧。hybrid/オンライン参加の記載はない。"},{"url":"https://www.esref2026.org/authors-attendees/","role":"registration","label":"ESREF 2026 Authors/Attendees(登録)","checkedAt":"2026-08-06","evidenceLocator":"Early Bird(before August 1st, 2026)とStandardの料金表、Gala Dinner追加料金€120、登録に含まれる内容、学生証明の脚注、著者の登録義務の段落。"},{"url":"https://www.esref2026.org/eco-event-vienna/","role":"official","label":"ESREF 2026 EcoEvent Vienna","checkedAt":"2026-08-06","evidenceLocator":"Green Event認定の一文と、サステナビリティ5項目(low-waste catering / eco-friendly materials / travel awareness / digital-first / sustainable printing)の箇条書き。"},{"url":"https://www.esref2026.org/why-support-esref-2026/","role":"sponsor","label":"ESREF 2026 Why Support ESREF 2026","checkedAt":"2026-08-06","evidenceLocator":"冒頭文に「the 37th European Symposium ... Vienna, Austria, from September 21-24, 2026」。続いて参加者像の記述と Platinum / Gold / Silver / Bronze のpatronship tier説明。参加者数の数値はない。"},{"url":"https://www.esref2026.org/patrons-sponsors/","role":"sponsor","label":"ESREF 2026 Patrons/Sponsors","checkedAt":"2026-08-06","evidenceLocator":"Silver に PVA TePla のロゴと紹介文。Platinum / Gold / Bronze に掲載企業はない。"},{"url":"https://www.esref2026.org/conference-partner/","role":"sponsor","label":"ESREF 2026 Conference Partner","checkedAt":"2026-08-06","evidenceLocator":"Infineon Technologies Austriaのロゴと紹介文、「As a cooperation partner, Infineon Austria proudly supports ESREF 2026」の記述。掲載は1社のみ。"},{"url":"https://www.esref2026.org/exhibitors/","role":"sponsor","label":"ESREF 2026 Exhibitors","checkedAt":"2026-08-06","evidenceLocator":"Section – Central Hall / Section – Innovation Wing / Section – Foyer の区画見出しごとに出展社名を列挙。"},{"url":"https://esref2025.sciencesconf.org/","role":"archive","label":"ESREF 2025 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row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Bronze Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"sponsor","tier":"Bronze Sponsor","organization":"ASE Group","sponsorLevel":"Bronze Sponsor","sourceSection":"Bronze Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Bronze Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"sponsor","tier":"Bronze Sponsor","organization":"ULVAC","sponsorLevel":"Bronze Sponsor","sourceSection":"Bronze Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Bronze Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"sponsor","tier":"Bronze Sponsor","organization":"Onto Innovation","sponsorLevel":"Bronze Sponsor","sourceSection":"Bronze Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Bronze Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"},{"role":"best student paper sponsor","tier":"Best Student Paper Sponsor","organization":"ASE Group","sponsorLevel":"Best Student Paper Sponsor","sourceSection":"Best Student Paper Sponsor","sponsorPricing":{"amount":null,"reason":"No same-cycle official rate card mapping was reviewed for this sponsor row.","currency":null,"sourceStatus":"not_priced_no_official_rate_card_mapping","sponsorLevel":"Best Student Paper Sponsor","amountBoundary":"not_calculated_without_official_same_cycle_rate_card"},"organizationType":"company"}],"label":"2025 EPTC official sponsor organizations","sourceUrl":"https://eptc-ieee.net/sponsor","sourceStatus":"extractor_v0_source_checked","denominatorLabel":"19 official sponsor logo/listing rows"}},"city":"Singapore","tier":"a","venue":"Sands Expo and Convention Centre","country":"Singapore","fieldId":"packaging","editions":[{"id":"cfe_8bc2bf97afce464faf9abfa066843082","name":"EPTC 2025"},{"id":"cfe_d10bfeaf20b048b7a33c4489ca56e8fb","name":"2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)"},{"id":"cfe_702adfa3825d40b8b613318db4299d52","name":"2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)"},{"id":"cfe_2799904dcd31417793499e41129ee75d","name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)"}],"genreIds":["three-dimensional-integration"],"processes":[{"id":"prc_3d27981d613a439287c13f2e2ad2914f","nameJa":"先端パッケージ（2.5D・3D・チップレット）","primary":true},{"id":"prc_3562ec10c5ba448881e8580ee9797b9c","nameJa":"ボンディング","primary":false}],"cycleLabel":"2026-12-01〜2026-12-04 / Sands Expo and Convention Centre, Singapore","fieldTitle":"実装 / 先端パッケージ / 3D integration","organizers":[],"lastVerified":"2026-06-15","paperDeadline":"2026-08-31","currentCycleEnd":"2026-12-04","peerReviewStatus":"peer-reviewed","currentCycleStart":"2026-12-01","submissionOpensOn":"2026-03-31","finalPaperDeadline":"2026-10-14","canonicalId":"conf_94b92da532794219ae4c507acf3534b2","researchLabBridge":{"relatedLabCount":0,"sampleLabs":[],"recentSubmissionCount":null,"recentSubmissionStatus":"not-yet-normalized","evidenceLevel":"none","evidenceLabel":"研究室DBのconferenceIdsに接続する研究室は未登録です。"},"sponsorOrganizations":[],"conferenceResearchDossierV1":{"checkedAt":"2026-10-14","conferenceId":"eptc","confidenceScore":1,"coverage":{"faqCount":8,"factCount":88,"topicCount":8,"sourceCount":19,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"2026 サイクルは2026年12月1日から4日までの4日間、シンガポールの Sands Expo & Convention Centre（10 Bayfront Ave, Singapore 018956, Level 3）で開催されます。IEEE EPS の Conferences 一覧にも Singapore, Singapore / Dec 01, 2026 - Dec 04, 2026 として掲載されています。2027年の会期は公式サイトにも IEEE EPS の一覧にも掲載されていません。","question":"EPTC はいつ・どこで開催されますか。","sourceUrls":["https://eptc-ieee.net/","https://eptc-ieee.net/venue","https://eps.ieee.org/conferences/"]},{"answer":"abstractは2026年3月31日に受付を開始し、6月15日締切、7月10日採否通知です。採択後の4〜8ページのdraft manuscriptは7月10日から8月31日まで提出でき、査読は10月1日までに完了する予定です。査読コメントを反映したrevised final manuscriptは10月14日までにConftoolへ再提出します。旧公式CFPにはabstract締切6月8日・採否通知7月30日という異なる日付があるため、この回答では2026年10月12日更新のAuthorsページを現行値として示しています。","question":"2026 の投稿締切はいつですか。","sourceUrls":["https://eptc-ieee.net/authors","https://eptc-ieee.net/"]},{"answer":"あります。abstract と paper の両方を EPTC Technical Program Committee が peer-review します。manuscript には Technical Sub-Committee Chair が2〜3名の査読者を割り当て、2026年10月1日までに review を完了する日程です。abstract 段階で採否と oral / interactive poster の別が決まり、判断材料には査読者の推薦に加えて oral presentation slot の空きも含まれます。single-blind か double-blind かは公表されていません。","question":"査読はありますか。どのように行われますか。","sourceUrls":["https://eptc-ieee.net/authors"]},{"answer":"公表されていません。Authors ページには査読の手順、査読者数、採否の判断材料までは書かれていますが、採択率や投稿件数・採択件数の数値はありません。参加者数の実績についても、確認した公式ページのいずれにも記載がありません。","question":"採択率は公表されていますか。","sourceUrls":["https://eptc-ieee.net/authors"]},{"answer":"会場で発表された採択論文は conference proceedings と IEEE Xplore に掲載されます。oral と interactive poster のどちらであっても、会議で発表されたことが掲載の条件です。全著者は IEEE eCopyright Form に署名して IEEE に著作権を移転します。ジャーナル特集号への招待に関する記載は公式ページにありません。","question":"論文はどこに載りますか。","sourceUrls":["https://eptc-ieee.net/authors"]},{"answer":"2026 の Full Conference Registration は、IEEE 会員の Author/Speaker が Early Bird S$900・Standard S$1,000・Late S$1,200、IEEE 会員の Attendee が S$1,000・S$1,100・S$1,300 です。非会員は Author/Speaker が S$1,000・S$1,200・S$1,300、Attendee が S$1,200・S$1,450・S$1,600、学生は S$600・S$700・S$800 です。この登録費には PDC と Fundamentals Course、毎日の昼食とコーヒーブレイク、12月1日夕方の Welcome Reception が含まれます。","question":"参加費はいくらですか。","sourceUrls":["https://eptc-ieee.net/registration"]},{"answer":"2026 の General Chair は Prof. Yeow Kheng LIM（National University of Singapore）で、Organizing Committee は学術機関・研究機関・企業のボランティアで構成され、EPTC Board が毎年任命します。査読は12の Technical Committee に所属する100名超の専門家が担当し、名簿には Lam Research、Samsung、Infineon、GlobalFoundries、Intel、TSMC、Micron、AMD などの企業所属と、NUS、NTU、Institute of Microelectronics、IMEC、Fraunhofer IZM などの研究機関所属が並びます。名簿に国名が併記されている所属の所在国は Singapore、South Korea、USA、France、Germany、Malaysia、Japan、China、Taiwan、Belgium、Netherlands、Hungary、Hong Kong、Canada です。これは委員の所属機関の表記であり、EPTC との取引関係を示すものではありません。","question":"誰が発表・運営しているのですか。","sourceUrls":["https://eptc-ieee.net/organizing-committee","https://eptc-ieee.net/committees","https://eptc-ieee.net/technical-committee"]},{"answer":"2026 の会場はシンガポールで、投稿も参加登録も Conftool 上で行い、支払は Stripe 経由の Alipay または Visa / MasterCard / Discover / American Express / UnionPay です。manuscript は英語で作成すると Authors ページに明記されており、日本語での投稿・発表に関する記載はありません。Technical Committee の名簿には ULVAC、Kyushu University、Toray Industries など Japan と併記された所属や、Tokyo Institute of Technology、Tokyo Electron Ltd の所属が掲載されています。オンライン参加の可否は公表されていないため、渡航前提で日程を確保してください。","question":"日本から参加・投稿する場合に確認しておくことは何ですか。","sourceUrls":["https://eptc-ieee.net/authors","https://eptc-ieee.net/registration","https://eptc-ieee.net/technical-committee","https://eptc-ieee.net/venue"]}],"headline":"2026 サイクルの公式ページから、会期・12トラック・投稿締切・査読手順・参加費を一次情報のまま並べます。","metaDescription":"IEEE RS/EPS/EDS Singapore Joint Chapter が運営し IEEE EPS が co-sponsor に入る電子実装の国際会議 EPTC。2026年12月1〜4日シンガポール開催の会期、12トラック、投稿締切、査読手順、IEEE Xplore 掲載条件を公式ページの記載で確認できます。","oneLine":"EPTC は IEEE RS/EPS/EDS Singapore Joint Chapter が運営する年次の電子実装国際会議で、IEEE Electronics Packaging Society が co-sponsor に入り、2026年はシンガポールで開催されます。","pageTitle":"EPTCとは｜IEEE Electronics Packaging Technology Conference の会期・投稿・査読","relatedConferenceIds":["ectc","estc","icept","impact-iaac","icep-hbs","iemt"],"sections":{"cycle":{"id":"cycle","body":"2026 サイクルは会場の住所階数まで公表済みで、宿泊も Marina Bay Sands と JW Marriott Hotel Singapore South Beach の2ホテルに EPTC 向けレートが設定されています。オンライン参加の案内は出ていないため、渡航前提で日程を確保してください。2027年の会期は公式サイトにも IEEE EPS の会議一覧にも掲載されていません。","facts":[{"note":"トップページのバナー表記。Program ページも EPTC 2026 is held over four days from 1-4 December 2026 と記載。","label":"2026 会期","value":"2026年12月1日〜12月4日（1st to 4th Dec 2026）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"Venue ページに EPTC 2026 will be held at the Sands Expo & Convention Centre と記載。","label":"2026 会場","value":"Sands Expo & Convention Centre（シンガポール）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/venue"},{"note":"Venue ページの Address 欄。","label":"2026 会場住所","value":"10 Bayfront Ave, Singapore 018956, Level 3","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/venue"},{"note":"IEEE EPS の Conferences 一覧の該当行に 2026 IEEE 28th Electronics Packaging Technology Conference (EPTC) として掲載。","label":"2026 都市・国（IEEE EPS 側の記載）","value":"Singapore, Singapore / Dec 01, 2026 - Dec 04, 2026","checkedAt":"2026-08-06","sourceUrl":"https://eps.ieee.org/conferences/"},{"note":"Venue ページには会場と公式ホテルのみが掲載され、オンライン参加に関する記述はない。トップページ・Program・Registration・Authors の各ページにもオンライン参加の記載はない。","label":"2026 開催形式","value":"現地会場と住所が公表されている。online / hybrid 参加の可否は公表されていない。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/venue"},{"note":"Registration ページの Registration Terms and Conditions に Daily lunches and coffee breaks are included in the registration as well as the Welcome Reception on Dec 1, 2026 evening と記載。","label":"2026 Welcome Reception","value":"2026年12月1日夕方。参加登録費に含まれる（毎日の昼食・コーヒーブレイクも同様）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"EPTEX ページに Held alongside the conference from 1-4 December 2026 at the Sands Expo & Convention Centre, Singapore と記載。","label":"2026 併設展示会","value":"EPTEX（Electronics Packaging Technology EXPO）を2026年12月1〜4日に同会場で併催","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/EPTEX?sid=27"},{"note":"同ページの会議一覧を EPTC で検索した結果、該当行は1件。公式サイト側にも2027年の案内はない。回数と西暦は連動しないため、2027年が第何回になるかは一次情報からは確定できない。","label":"2027 サイクルの公表状況","value":"IEEE EPS の Conferences 一覧に掲載されている EPTC は 2026 年版のみで、2027 年の会期・会場は掲載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://eps.ieee.org/conferences/"}],"title":"2026 サイクルの会期・会場","eyebrow":"cycle"},"scope":{"id":"scope","body":"12トラックの説明文はキーワードがかなり細かいので、投稿先はトラック名だけでなく本文まで読んで決めてください。同じ hybrid bonding でも、プロセス実装側は Assembly and Manufacturing、接続構造側は Interconnection Technologies に振り分けられます。既発表の内容は対象外と明記されています。","facts":[{"note":"Authors ページに Papers on all aspects of electronics packaging are welcome. They will be distributed over the following 12 Tracks と記載。","label":"2026 トラック数","value":"12 Tracks","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Track Topics 節。Committees ページの Technical Committee 節にも同じ12区分が同じ順で並ぶ。","label":"2026 トラック名一覧","value":"Advanced Packaging / Assembly and Manufacturing / Electrical Simulation & Characterization / Emerging Technologies / Interconnection Technologies / Materials and Processing / Mechanical Simulation & Characterization / Optoelectronics & Display Packaging / Quality, Reliability & Failure Analysis / Smart Manufacturing & Equipment Technology / Thermal Management & Characterization / Wafer-Level & Panel-Level Packaging","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Track Topics 節の該当段落。","label":"Advanced Packaging トラックの対象","value":"chiplets、2.5D/3D/3.5D integration、SiP、Si・RDL・organic・SiC interposer と silicon bridge die を用いた heterogeneous integration、AI・HPC・自動車・HBM・RF 向けの package design、large-format substrate の panel warpage 制御と歩留まり、embedded substrate solution、glass core substrate、glass interposer","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Track Topics 節の該当段落。","label":"Interconnection Technologies トラックの対象","value":"wire bonding、flip-chip、TSV、Cu pillar、micro-bump、thermo-compression bonding (TCB)、hybrid bonding、微細ピッチ microbump のスケーリング、C2W および W2W hybrid bonding などの bumpless 技術","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Track Topics 節の該当段落。","label":"Emerging Technologies トラックの対象","value":"flexible / bioelectronics、MEMS/NEMS、SiC・GaN などの wide bandgap デバイス、cryogenic integration や qubit scaling を含む量子デバイス実装、neuromorphic および in-memory computing","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Track Topics 節の該当段落。","label":"Optoelectronics & Display Packaging トラックの対象","value":"光インターコネクトの実装、fiber coupling、co-packaged optics (CPO)、PIC packaging を含む silicon photonics 統合、InP・GaAs・SiN・polymer など非シリコン系フォトニクスと III-V ヘテロ集積、micro/mini LED、AR/VR ディスプレイ","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページ冒頭の Information for Authors 節。","label":"明示された対象外","value":"Only new and unpublished works will be considered（新規かつ未発表の成果のみを審査対象とする）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"}],"title":"対象技術領域と12トラック","eyebrow":"scope"},"review":{"id":"review","body":"abstract と manuscript の両方に査読が入り、通知も2回あります。oral か interactive poster かは abstract 段階で決まり、oral slot の空き具合も判断材料に入ります。査読コメントは Conftool 上で随時読めるため、10月1日の通知を待たずに改稿を始められます。","facts":[{"note":"Authors ページ冒頭に Your abstract and paper will be peer-reviewed by the EPTC Technical Program Committee と記載。","label":"査読方式","value":"abstract と paper を EPTC Technical Program Committee が peer-review する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Manuscript Review Process 節に Two to three reviewers will be assigned by the various Technical Sub-Committee Chairs for each manuscript. All the reviews should be completed by October 1, 2026 と記載。","label":"manuscript の査読者数と完了時期","value":"Technical Sub-Committee Chair が各 manuscript に2〜3名の査読者を割り当て、2026年10月1日までに全 review を完了する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページ冒頭の Information for Authors 節に Depending on the recommendations of the reviewers and the availability of oral presentation slots と記載。","label":"採否の判断材料","value":"査読者の推薦（recommendations of the reviewers）と oral presentation slot の空き","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Abstract Review Process 節。査読は Conftool 上で行われる。","label":"abstract 査読での通知内容","value":"採否に加えて、発表が oral か interactive poster かを2026年7月10日までに通知する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Authors ページの Manuscript Submission Guidelines / Manuscript Review Process 節。","label":"改稿プロセス","value":"提出した manuscript は draft 扱い。査読コメントに沿って改稿し、final version を Conftool に再提出する。査読コメントは Conftool にログインして閲覧する。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Committees ページの Technical Committee 節に more than 100 experts ... members of our following 12 TCs と記載。各 TC が自分のトラックの abstract と manuscript を審査する。","label":"査読体制の規模","value":"12の Technical Committee があり、100名超の専門家が所属する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/committees"},{"note":"Authors ページには査読の手順と担当体制のみが書かれ、採択率や匿名化方式への言及はない。","label":"採択率・blind 方式","value":"採択率の数値も、single-blind / double-blind の別も公表されていない","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Others ページの Best Paper Awards 節に Awards will be given to the best oral papers from Academia, Industry, Students, and to the best interactive paper と記載。","label":"Best Paper Awards の区分","value":"Academia / Industry / Students それぞれの best oral paper と、best interactive paper に授与される","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/others"}],"title":"査読の進み方と表彰","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026年10月12日更新のAuthorsページでは、8月31日に提出する原稿を査読前のdraft manuscript、10月14日に再提出する原稿をrevised final manuscriptと区別しています。旧公式CFPにはabstract締切6月8日、採否通知7月30日とありますが、現行Authorsページは6月15日、7月10日を掲載しています。資料の版で異なる日付を一つに混ぜず、旧CFPの値は資料別の履歴として残します。今回確認した資料では、採択率と投稿・採択件数、参加者数の実績、online／hybrid参加の可否、2027年の会期・会場は確認できません。会場は年ごとに変わるため、過去回の会場名を現行案内に流用しないでください。","facts":[{"note":"会場名は Venue ページ、過去回の会場は Past General Chairs ページ。","label":"会場は年ごとに変わる","value":"2026 は Sands Expo & Convention Centre。Past General Chairs の表では 27th（2025）が Resorts World Sentosa、26th（2024）が Grand Copthorne Waterfront Hotel。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Past General Chairs ページの表。","label":"回数と西暦は連動しない","value":"1999年と2001年に対応する回が一覧にないため、第N回から開催年を逆算できない","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Authors ページの Important Dates 表は2つの表に分かれており、どちらにも Notification of acceptance 行がある。","label":"採否通知が2回ある","value":"abstract の Notification of acceptance（2026年7月10日）と manuscript の Notification of acceptance（2026年10月1日）は別の日付","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"トップページの IMPORTANT DATES 節と Authors ページの Important Dates 節を突き合わせた結果。","label":"トップページと Authors ページで締切の粒度が違う","value":"トップページの Important Dates 表は Abstract Submission を Closed とだけ表示し、abstract の具体的な日付は Authors ページの表にのみ記載されている","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"2026年10月12日更新のAuthorsページに、draft提出期間、査読完了予定、revised finalの締切が別々に記載されている。","label":"draftとrevised finalは別の提出物","value":"8月31日はdraft manuscript締切、10月1日は査読完了予定、10月14日はrevised final manuscript締切","checkedAt":"2026-10-14","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Sponsors ページ。ロゴ画像の alt 属性も Sponsor Logo で企業名を含まない。Exhibitors ページも出展募集の案内と Exhibitor / Official Media Partner / Conference Partner の区分見出しが中心で、出展企業名の一覧はテキストとして掲載されていない。","label":"sponsor・exhibitor 名はテキストで掲載されていない","value":"Sponsors ページは Diamond〜Bronze と Best Student Paper Sponsors の区分見出しのみを表示し、企業名はロゴ画像として掲示される","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/meet-our-sponsor/"},{"note":"Challenge 1（Art of Packaging with AI）と Challenge 2（Tech Challenge 2026）の募集のみが公開されている。","label":"EPTEX の個別イベントは未公表","value":"EPTEX ページの Events @EPTEX 節は Events to be updated soon と表示している","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/EPTEX?sid=27"},{"note":"旧公式3rd Call for Paperと、2026年10月12日更新のAuthorsページを比較。旧CFPの値を現行値へ混在させない。","label":"2026 abstract日程は資料の版で異なる","value":"旧公式CFP: 締切6月8日・採否7月30日 / 現行Authorsページ: 締切6月15日・採否7月10日","checkedAt":"2026-10-14","sourceUrl":"https://eptc-ieee.net/authors"}],"title":"確認するときの注意点","eyebrow":"caveats"},"history":{"id":"history","body":"Past General Chairs の表は回数・年・General Chair・所属・会場を1行ずつ並べており、歴代 General Chair とその所属、そして会場名の推移を一次情報で追えます。Venue 欄には施設名だけが入り、都市名や国名は書かれていません。回数と西暦がずれる年があるので、引用するときは表の行をそのまま参照してください。2020年と2021年の Venue 欄は Virtual です。","facts":[{"note":"Past General Chairs ページの表の先頭行。","label":"第1回の開催","value":"1st / 1997年 / General Chair: Prof Andrew Tay（National University of Singapore）/ Venue: Pan Pacific Hotel","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"トップページの ABOUT EPTC 節。Past General Chairs の表と一致する。","label":"創設年の別記述","value":"About 節に Since its inauguration in 1997 と記載","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"Past General Chairs ページの表。","label":"一覧に回のない年","value":"2nd は1998年、3rd は2000年、4th は2002年と続き、1999年と2001年に対応する回は表に掲載されていない","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Past General Chairs ページの表。","label":"オンライン開催の年","value":"22nd（2020年、General Chair: Prof Tan Chuan Seng, NTU）と 23rd（2021年、General Chair: Dr Tang Gongyue, Institute of Microelectronics）の Venue 欄は Virtual","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Past General Chairs ページの表の末尾2行。2026 Organizing Committee ページでは同じ Dr. Eric PHUA の所属が Isola Asia Pacific (Singapore) Pte Ltd と表記されている。","label":"直近2回の会場と General Chair","value":"26th（2024年）Dr Chui King Jien（Samsung）/ Grand Copthorne Waterfront Hotel、27th（2025年）Dr Eric Phua（Nanofilm Technologies International Ltd）/ Resorts World Sentosa","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Past General Chairs ページの表。同氏は2026年 Organizing Committee でも External Relations を務める。","label":"第25回（2023年）の General Chair","value":"25th（2023年）の General Chair は第1回・第2回と同じ Prof. Andrew TAY（NUS）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"},{"note":"Past General Chairs ページの表の見出しは EPTC / Year / Name of General Chair / Affiliation / Photo / Venue。","label":"名称変更","value":"表は全回を EPTC の通番として並べており、名称変更に関する記載はない","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/post-general-chairs"}],"title":"1997年の第1回から第27回まで","eyebrow":"history"},"program":{"id":"program","body":"2026年8月時点でセッション時間割は未公開ですが、invited talk・panel・Professional Development Courses の一覧は先に出ています。panel は12月1日に集中しているため、初日から参加する前提で日程を組んでください。PDC は Full Conference Registration に含まれます。","facts":[{"note":"Program ページ本文。セッション時間割は掲載されていない。","label":"2026 詳細プログラムの公開状況","value":"Conference Program ページは4日間開催であることのみを記載し、More information to be updated soon と表示している","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/program"},{"note":"トップページの ABOUT EPTC 節に EPTC will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities. として列挙されている。","label":"2026 会議の構成要素","value":"keynotes、technical sessions、invited talks、panels、workshops、exhibitions、networking activities","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"Invited Speakers ページに氏名・肩書・講演タイトル・略歴が掲載。Chan 氏の SPIL は肩書欄ではなく略歴文中の表記。更新日はトップページの LATEST NEWS 節に Invited Talks (Updated 13 Jul 2026) と表示。","label":"2026 Invited Speakers（2026年7月13日更新）","value":"Dr. Bernd Dielacher（EVG）/ Debbie Claire Sanchez（Besi）/ Dr. Sung-Bin Kim（Any Casting）/ Prof. Mehdi Asheghi（Stanford University）/ Pradeep Lall（Auburn University, Electronics Packaging Research Institute）/ Dr. Mu-Hsuan Chan（SPIL）の6名","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/invited-talks"},{"note":"Invited Speakers ページの Title 欄。","label":"2026 invited talk のテーマ例","value":"Scalable manufacturing approaches for co-packaged optics via NIL and advanced wafer bonding / Coexistence by Design: Fluxless Thermo-Compression Bonding and Die-to-Wafer Hybrid Bonding in the Advanced Packaging of AI Computing Modules / Advanced Two-Phase Cooling Solution for Energy Efficient Data Centers","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/invited-talks"},{"note":"Panels ページ。更新日はトップページの LATEST NEWS 節に Panel Speakers (Updated 5 Aug 2026) と表示。","label":"2026 Panel Session（2026年8月5日更新）","value":"12月1日午前 The Economics of Scale: Transitioning AI Production to Panel-Level Processing（moderator: Dr. Seshubabu Desu, Advanced Substrate Technologies, Singapore）／12月1日午後 Scaling AI-Class Packaging: Can Manufacturing Yield Keep Pace with Increasing Package Complexity?（moderator: Thomas Gregorich, Zeiss, USA）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/panel-speakers"},{"note":"Professional Development Courses ページの表（No / Topic / Instructor）。","label":"2026 Professional Development Courses","value":"6コース。Hybrid Bonding, Glass Packaging, and Co-Packaged Optics for Chiplet Heterogeneous Integration（John Lau, Unimicron Technology Corporation）／3D Optoelectronic Integrated Circuits, Optical Interconnects and Advanced Packaging（Alex Yasha Yi, University of Wisconsin-Milwaukee）／Glass Core Substrate Study for Advanced Package Applications（Puru Bruce Lin, Samsung）／Designing Next-Gen 3D Chips with BSPDN and DTCO（Zhao Peng, Peking University）／Practical Thermal Management Solutions for High-Power Electronics and AI Systems（Winston Zhang, UIUC/Novark）／Packaging Reliability in the Era of Chiplets - Failure Mechanisms, Models and Statistical Methods（Shubhada Sahasrabudhe, Shalabh Tandon, QuRIuS）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/Professional%20Development%20Courses?sid=30"},{"note":"Professional Development Courses ページの2つ目の表。TBC 表記のあるものは同ページの記載どおり。","label":"2026 Professional Crash/101 Courses","value":"4コース。Advanced transistors（Xiao Gong, NUS、TBC）／Silicon photonics（Xianshu Luo, A*STAR-IME/NSTIC、TBC）／Flat-optics for information technology（Guangwei Hu, NTU）／Quantum Science and Technology（Leong Chuan Kwek, NIE/NUS）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/Professional%20Development%20Courses?sid=30"},{"note":"トップページ LATEST NEWS 節。リンク先は公式サイト外のファイル配信ホストに置かれた PDF。keynote speaker の氏名は Program ページにも Invited Speakers ページにも掲載がなく、Program 配下に keynote の個別ページも存在しない。","label":"2026 HIR Workshop と keynote","value":"トップページの LATEST NEWS 節に HIR Workshop (Updated 26 Jul 2026) として PDF 資料へのリンクが掲載されている。keynote speaker の氏名は公表されていない。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"}],"title":"2026 プログラムの公開状況","eyebrow":"program"},"audience":{"id":"audience","body":"研究室からは学生1件・非学生2件の投稿枠と、最大20件の渡航支援が使えます。企業側は Full Conference Registration に PDC と Fundamentals Course が含まれる点と、5名以上の団体割引が判断材料になります。キャンセル期限は2026年10月31日で、それ以降は他者への譲渡のみとなります。","facts":[{"note":"Authors ページの Abstract Submission Guidelines 節。","label":"学生の投稿枠","value":"学生は abstract 1件まで、学生以外は2件まで","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/authors"},{"note":"Registration ページの Full Conference Registration Fees 表。Student 行には Membership 欄の記載がない。","label":"2026 学生参加費","value":"Early Bird（10月31日まで）S$600 / Standard（11月24日まで）S$700 / Late（12月4日まで）S$800","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"件数と趣旨は Others ページ（up to 20 Student Travel Reimbursement Grants (STRG) will be awarded for EPTC annually）、応募手順は Authors ページの Abstract Submission Guidelines 節に記載。","label":"学生への渡航支援","value":"EPS Student Travel Reimbursement Grants (STRG) を毎年 最大20件。応募には筆頭著者であることと、abstract 投稿時に該当欄にチェックすることが必要。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/others"},{"note":"Registration ページの Full Conference Registration Fees 表。","label":"2026 Attendee 参加費","value":"IEEE 会員: Early Bird S$1,000 / Standard S$1,100 / Late S$1,300。非会員: S$1,200 / S$1,450 / S$1,600。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"Registration ページの Full Conference Registration Fees 表。","label":"2026 Author/Speaker 参加費","value":"IEEE 会員: Early Bird S$900 / Standard S$1,000 / Late S$1,200。非会員: S$1,000 / S$1,200 / S$1,300。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"Registration ページの表の見出し（Full Conference Registration Fees (includes PDC and Fundamentals Course)）と Registration Terms and Conditions。","label":"参加費に含まれるもの","value":"Full Conference Registration には PDC と Fundamentals Course が含まれる。毎日の昼食とコーヒーブレイク、12月1日夕方の Welcome Reception も含まれる。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"Registration ページの PDC and Fundamentals Course Only Registration Fee 表。","label":"2026 PDC 単独登録費","value":"非学生: Early Bird S$400 / Standard S$500 / Late S$550。学生: S$200 / S$250 / S$300。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"},{"note":"Registration ページの Registration Fees / Payment / Registration Terms and Conditions の各節。","label":"団体割引・取消・支払方法","value":"5名以上の団体登録に割引あり（詳細は事務局へ問い合わせ）。2026年10月31日までは S$100 の事務手数料を差し引いて取消可、それ以降は取消不可で開催2週間前までに連絡すれば他者へ譲渡可。支払は Stripe 経由で Alipay および Visa / MasterCard / Discover / American Express / UnionPay。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/registration"}],"title":"研究室・企業それぞれの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"EPTC は IEEE の単独主催ではなく、シンガポールの IEEE 合同チャプターが運営し IEEE EPS が co-sponsor に入る構成です。窓口は事務局メールに集約されつつ、投稿・登録・展示・協賛は Organizing Committee の役職別メールに分かれています。会議名に西暦が入らないため、資料を引用するときは第何回かと西暦の両方を書き添えてください。","facts":[{"note":"トップページ冒頭のバナー表記。About 節では The IEEE Electronics Packaging Technology Conference (EPTC) と表記される。","label":"2026 正式名称","value":"28th Electronics Packaging Technology Conference","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"About 節で正式名称に併記されている。","label":"略称","value":"EPTC","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"About 節に organized by the IEEE RS/EPS/EDS Singapore Joint Chapter と記載。","label":"運営主体","value":"IEEE RS/EPS/EDS Singapore Joint Chapter が organize する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"About 節に co-sponsored by the IEEE Electronics Packaging Society (EPS) と記載。","label":"co-sponsor","value":"IEEE Electronics Packaging Society (EPS)","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"About 節が an annual international event と記載。","label":"開催頻度","value":"annual（毎年開催）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"トップページのバナー表記。","label":"2026 の回数","value":"第28回（28th）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"公式サイト自身の文言。バナーにも IEEE EPS flagship conference in the Asia-Pacific Region と表示される。","label":"EPS 内での位置づけ（公式文言）","value":"About 節の表記は \"the IEEE EPS flagship conference in the Asia and Pacific Region\"","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/"},{"note":"PCO 名は Committees ページの Professional Conference Organiser 節（This year the PCO is InPrep Pte Ltd and Spark Planners Pte Ltd.）、メールアドレスと担当者名はトップページの CONTACT US 節に記載。","label":"2026 事務局・PCO","value":"PCO は InPrep Pte Ltd と Spark Planners Pte Ltd。連絡先は secretariat@eptc-ieee.net（EPTC 2026 PCO: Fanzhe Low）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/committees"}],"title":"正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"Technical Committee の名簿は所属と国を併記しており、どのトラックにどの企業・大学が関与しているかを一次情報で追えます。sponsor と exhibitor の企業名はロゴ画像でのみ掲示され、テキストとしては公表されていません。掲示されていること自体は協賛・出展の事実を示すだけで、取引関係や共同研究を示すものではありません。Organizing Committee の委員は EPTC Board が毎年任命し直します。","facts":[{"note":"Organizing Committee ページの一覧。役職ごとに連絡用メールアドレスも掲載されている。","label":"2026 主要役職","value":"General Chair: Prof. Yeow Kheng LIM（National University of Singapore）／Technical Chair: Prof. Sunmi SHIN（NUS）／Technical Co-Chair: Dr. Chin Hock TOH（Lam Research）、Prof. Chuan Seng TAN（NTU）／Programme Chair: Dr. Vivek CHIDAMBARAM（Intel Technology）／Programme Co-Chair: Dr. Gong Yue TANG（Institute of Microelectronics）","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/organizing-committee"},{"note":"Organizing Committee ページ。External Relations は Prof. Andrew TAY（NUS）が担当。","label":"2026 その他の Organizing Committee 役職","value":"Technical Platform Chair、Student/YP Engagement Chair、Past General Chair、Finance Chair、Facility Chair、Industry Liaison Chair、Sponsorship Chair / Co-Chair、Exhibition Chair / Co-Chair、Outreach Chair、Engagement Chair / Co-Chair、External Relations","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/organizing-committee"},{"note":"Committees ページの Organizing Committee 節に volunteers from academia, research institutions, and companies / appointed annually by the EPTC Board / The General Chair heads the Organising Committee と記載。","label":"Organizing Committee の任命方式","value":"学術機関・研究機関・企業のボランティアで構成され、委員は EPTC Board が毎年任命する。General Chair が委員会を統括する。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/committees"},{"note":"Board Members ページの名簿と、Committees ページの EPTC Board 節の説明。","label":"EPTC Board","value":"Prof. Andrew TAY（National University of Singapore）／Dr. Alfred YEO（STATS ChipPAC, Singapore）／Mr. Ranjan RAJOO（GlobalFoundries）／Mr. Vempati Srinivasa RAO（Institute of Microelectronics）の4名。IEEE Singapore RS/EPS/EDS Joint Chapter が任命する。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/board-members"},{"note":"Committees ページの Technical Committee 節。","label":"Technical Committee の規模","value":"12トラックそれぞれに TC が置かれ、合計で100名を超える専門家が参加する","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/committees"},{"note":"Technical Committees ページの名簿で、所属名に国名が併記されている行のみを拾ったもの。国名が併記されていない所属も多数ある。人の国籍ではなく所属機関の所在地表記。","label":"TC 名簿に印字された所属の所在国","value":"Singapore / South Korea / USA / France / Germany / Malaysia / Japan / China / Taiwan / Belgium / Netherlands / Hungary / Hong Kong / Canada","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/technical-committee"},{"note":"Technical Committees ページの12 TC 名簿。委員の所属機関であり、EPTC との取引関係を示すものではない。","label":"TC 名簿の産学構成","value":"企業所属として Lam Research、Samsung、Infineon、GlobalFoundries、Intel、NXP、TSMC、Micron、AMD、Applied Materials、Kulicke & Soffa、STMicroelectronics、SK Hynix、Tokyo Electron、ULVAC、Toray Industries、Brewer Science などが、研究・教育機関所属として NUS、NTU、Institute of Microelectronics、IMEC、Fraunhofer IZM、CEA-LETI、Kyushu University、Tokyo Institute of Technology、Auburn University などが並ぶ","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/technical-committee"},{"note":"Sponsors ページの MEET OUR SPONSORS 節は各区分へのリンクのみを表示し、フッターのロゴ画像も alt 属性が Sponsor Logo で企業名を含まない。exhibitor 一覧も Exhibitors ページから案内されるが、企業名のテキスト掲載はない。","label":"sponsor 区分と掲載形式","value":"Diamond / Platinum / Gold / Silver / Bronze の5区分に加えて Best Student Paper Sponsors の区分がある。企業名はロゴ画像として掲示され、テキストとしては記載されていない。","checkedAt":"2026-08-06","sourceUrl":"https://eptc-ieee.net/meet-our-sponsor/"}],"title":"委員会構成と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"IEEE EPS の Conferences 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Photonicsの科学技術に関する未発表の内容で、講演申込時に9つのConference sessionsから選びます。ナノ光学、量子エレクトロニクスから、光学設計・光デバイス、光計測、情報フォトニクス、視覚光学・ディスプレイ・照明、生体医用光学、エネルギー・環境、X線・EUVまでが並びます。X線・EUV分野にはEUV lithographyやX線・EUV光学素子が明記されています。","facts":[{"label":"投稿対象","value":"Optics & Photonicsの科学技術に関する未発表の内容","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"Session 1–2","value":"Nano-optics, Nano-photonics / Quantum electronics","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"Session 3","value":"Optical design, Optical devices（optical lithography system design、光導波路・光集積回路などを含む）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"Session 4–5","value":"Optical metrology / Information optics / information photonics","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"Session 6–8","value":"Vision optics / Display / Illumination / Optical environment、Bio-optics / Bio-photonics / Medical optics、Energy / Environment / Green photonics, Lifestyle photonics","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"Session 9","value":"X-ray / EUV（EUV lithography、X-ray/EUV optical elements・detectors・sourcesなど）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"}],"title":"対象分野・セッション","eyebrow":"scope"},"review":{"id":"review","body":"一般講演で「Oral or Poster」を選ぶと、口頭とポスターの割り振りをprogram committeeが決めます。口頭発表は15分（発表10分と質疑5分）です。PDPはProgram Committeeが原稿を審査し、採否をメールで通知します。","facts":[{"label":"発表形式の割り振り","value":"Oral or Poster を選んだ場合はprogram committeeが決定","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"口頭発表の時間","value":"15分（発表10分＋質疑5分）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"PDP の審査","value":"Program 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Japanで、日本語ページでは日本光学会年次学術講演会と書かれています。主催は日本光学会（OSJ）、共催は応用物理学会フォトニクス分科会で、海外からはEOS、OPTICA、OSK、SPIE、TPS、TOPSが2026年の協力団体に並びます。発表者は日本光学会または主催・協賛学会の会員であることが条件です。","facts":[{"label":"正式名称・略称","value":"Optics & Photonics Japan（OPJ）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/"},{"label":"日本語での位置付け","value":"日本光学会年次学術講演会","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026/"},{"label":"主催","value":"The Optical Society of Japan（OSJ、一般社団法人 日本光学会）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/"},{"label":"共催","value":"Photonics Division, The Japan Society of Applied Physics（応用物理学会 フォトニクス分科会）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/"},{"label":"海外の協力団体（2026）","value":"EOS、OPTICA、OSK、SPIE、TPS、TOPS","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/"},{"label":"事務局","value":"Optics & Photonics Japan Secretariat Office（Adthree Publishing Co.,Ltd. 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Paper（PDP）の枠があり、2026年は10月26日から11月6日にpdp@opt-j.comへPDFをメールで送ります。採択されたPDPは予稿集に収録されます。","facts":[{"label":"2026 講演申込期間","value":"2026-08-03〜09-04（日本語ページでは9月11日まで延長と表示）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/"},{"label":"2026 講演申込期間（延長後）","value":"2026-09-11まで延長","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026/"},{"label":"2026 予稿締切","value":"2026-10-02","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"予稿の書式","value":"A4 1ページ（テンプレートあり）、PDFで提出","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"発表者の資格","value":"OSJまたは主催・協賛学会の会員","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/contribution.html"},{"label":"2026 PDP 投稿期間","value":"2026-10-26〜11-06（pdp@opt-j.com へPDFをメール送付）","checkedAt":"2026-10-08","sourceUrl":"https://opt-j.com/opj2026_e/call-for-post-deadline-paper-pdp.html"},{"label":"2026 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Newsはintent-to-submitが2026年10月7日、最終論文が2026年12月1日と別枠の締切です。","question":"ISSCC 2027の投稿締切はいつですか?","sourceUrls":["https://www.isscc.org/call-for-papers-overview-26","https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"]},{"answer":"ISSCCは採択率（%）を公表していません。公式サイト、ISSCC 2027 CFP、Author Instructions and FAQ、Paper-Review Criteriaのいずれにも記載がありません。ISSCC 2026のpress kitには「around 1025 submissions were received」と「37 technical sessions into which the 265 papers are grouped」という2つの数値がありますが、このpress kit自体が冒頭で暫定版であると断っているため、この2つを割って採択率として使わないでください。","question":"ISSCCの採択率はどのくらいですか?","sourceUrls":["https://www.isscc.org/s/ISSCC2026PressKit.pdf","https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"]},{"answer":"double-blind reviewです。1件の投稿に対して同じsubcommitteeのITPCメンバーから7〜10件の個別レビューが付き、innovation、significance、technical qualityを別々に採点したうえで、Paper-Selection Meetingの投票でoverall ratingを決めます。公式文書は、overall ratingがinnovationとsignificanceの平均ではなく、どちらかが突出した論文を通す意図的なトレードオフだと説明しています。","question":"ISSCCの査読はどう行われますか?","sourceUrls":["https://www.isscc.org/s/ISSCC-Paper-Review-Criteria-2026-08-02.pdf","https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027_AuthorInstructionsAndFAQ.pdf"]},{"answer":"abstractは500文字以内、本文は5ページ以内でsingle-column double-spaced、12pt Arial Narrow、スペース込み11,000文字未満です。図は公式Figure Template（1ページ6スロット）で2ページ以内、参考文献は最大30件を投稿サイトへ個別入力します。CFPは分量超過を即時rejectと明記しているので、書き始める前に文字数と図ページ数を設計してください。","question":"投稿する原稿の分量と書式は?","sourceUrls":["https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf","https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027_AuthorInstructionsAndFAQ.pdf"]},{"answer":"ISSCC Digest of Technical Papersに収録され、IEEE Xploreのconference homeに各年のproceedingsとして並びます。ISSCC 2026の巻はDOI 10.1109/ISSCC49663.2026です。Short Courses and TutorialsはPapersとは別コレクションとして提供されます。JSSC Special Issueへの招待が存在することはCFPが言及していますが、招待基準・対象号・件数は公表されていません。","question":"採択された論文はどこに載りますか?","sourceUrls":["https://ieeexplore.ieee.org/xpl/conhome/1000708/all-proceedings","https://ieeexplore.ieee.org/xpl/conhome/11408863/proceeding","https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"]},{"answer":"学年ごとに入口が分かれています。進行中の研究はStudent Research Preview（ISSCC 2027サイクルのabstract締切は2026年10月21日）、学部3年〜修士入りたてはCircuit Insights、学部生とキャリア初期はNext Generation Circuit Designer Workshop、SSCS会員の博士課程在籍者はStudent Travel Grant Awardsが対象です。","question":"学生はどの枠から関われますか?","sourceUrls":["https://www.isscc.org/information-for-students"]},{"answer":"IEEE SSCSのConferencesページが、同学会がfully sponsorする各会議に1行ずつスコープを付けています。VLSIは米日交互開催でEDS・JSAPと協調、CICCはfirst-published technical workと実務課題志向、A-SSCCはアジア各地の巡回、ESSERCは欧州のフォーラム、CHISICはcustom chiplets専門です。同じページのTechnical Co-Sponsor欄にはDAC / DATE / ISLPED / RFICなどが別枠で並ぶので、SSCSが関与しているというだけで同じ位置づけとして読まないでください。","question":"ISSCCと、VLSI / CICC / A-SSCC / ESSERCはどう違いますか?","sourceUrls":["https://sscs.ieee.org/conferences"]},{"answer":"URLスラッグと掲載内容の年がずれます。Call for Papers Overviewのパスは /call-for-papers-overview-26 ですが中身はISSCC 2027サイクルで、ExhibitionのリンクIDは /isscc-2024-exhibition のまま現行サイクルの内容です。数値を引くときは、press kitが冒頭で暫定版と断っていること、参加者数2800が実績ではなく見込み値であることを必ず添えてください。","question":"公式サイトを読むときに気をつけることは?","sourceUrls":["https://www.isscc.org/call-for-papers-overview-26","https://www.isscc.org/s/ISSCC2026PressKit.pdf"]}],"headline":"公式サイト・ISSCC 2027 CFP・Author Instructions・Paper-Review Criteria・press kit・IEEE Xploreを1件ずつ開いて、投稿判断に必要な条件だけを取り出しました。","metaDescription":"ISSCC（IEEE International Solid-State Circuits Conference）の2027年会期と会場、投稿締切と書式、double-blind査読の審査観点、Digest of Technical Papersの収録先、学生向けの枠を公式ページとCFPで確認します。","oneLine":"ISSCC 2027の会期・会場、2026年9月9日の投稿締切と5ページ書式、double-blind査読の3つの審査観点、Digest of Technical Papersの収録先を、公式ページとCFPだけで確認します。","pageTitle":"ISSCCとは | 2027年の会期・投稿締切・査読方式を公式情報で整理","relatedConferenceIds":["iedm","vlsi","cicc","a-sscc","esserc","rfic"],"sections":{"cycle":{"id":"cycle","body":"現行サイクルは ISSCC 2027 で、会期は2027年2月14〜18日、会場は San Francisco Marriott Marquis（780 Mission Street, San Francisco, CA 94103, USA）と公式ホテル案内に明記されています。テーマは \"TRUSTED SUSTAINABLE SILICON INTELLIGENCE FROM EDGE TO CLOUD\" で、日曜が tutorial と Advanced-Circuit-Design Forum、月曜が plenary 4件＋並行技術セッション、火・水が技術セッション、木曜が Forum 4本と Short Course という5日構成です。次サイクル以降は Future Conferences に \"Tentative future ISSCC dates\" として2032年まで日付のみ公表され、都市・会場は一切載っていないため、出張計画では日付だけを暫定値として扱ってください。参加形態は会場ホテルでの現地開催として案内されており、公式ページに hybrid 参加やライブ配信の明示はなく、登録案内が触れているのは不参加登録者への on-demand 資料提供のみです。","facts":[{"note":"公式トップの会期見出しおよび Call for Papers Overview の見出し行に同じ日付。","label":"ISSCC 2027 会期","value":"2027年2月14日〜18日（February 14-18, 2027）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/"},{"note":"公式トップの会期見出しに会場名が併記されている。","label":"ISSCC 2027 会場","value":"San Francisco Marriott Marquis（San Francisco, CA）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/"},{"note":"公式 Hotel Information ページに \"ISSCC 2027 is February 14-18, 2027 at the San Francisco Marriott Marquis\" とともに掲載。国名 USA まで明記されているのはこのページ。","label":"ISSCC 2027 会場住所・国","value":"780 Mission Street, San Francisco, CA 94103, USA","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/hotel-information-1"},{"note":"米国外からの参加者に早期のビザ申請を促す案内。参照先として travel.state.gov の米国ビザページを提示している。","label":"ISSCC 2027 開催国（ビザ案内での裏付け）","value":"米国。公式ビザ案内が \"Travel to the United States\" の節を設け、\"Conference attendees from outside the United States are urged to begin their visa application early.\" と記載","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/obtaining-a-visa-1"},{"note":"ISSCC 2026 の登録ページ記載。ライブのオンライン参加や hybrid セッションについての記述はこのページにはない。2026年サイクルの記述であり2027年の条件として転用しないこと。","label":"ISSCC 2026 登録者向け on-demand 提供","value":"\"Paid registrants who do not attend the conference will have access to the on-demand material.\"（有料登録者が現地不参加でも on-demand 資料にアクセス可）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/registration-overview"},{"note":"同ページには2029年2月18〜22日／2030年2月17〜21日／2031年2月16〜20日／2032年2月15〜19日も並ぶ。いずれも日付のみで開催地の記載はない。","label":"次サイクル ISSCC 2028 の公表状況","value":"2028年2月20日〜24日を \"Tentative future ISSCC dates\" として掲載。都市・会場は未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/future-conferences"}],"title":"現行サイクル（ISSCC 2027）の会期・会場・形式","eyebrow":"cycle"},"scope":{"id":"scope","body":"対象は公式定義の \"solid-state circuits and systems-on-a-chip\" で、Call for Papers の Topics of Interest では11の subject area に整理されています。一方 Technical Committees ページの subcommittee は13あり、Digital が Digital Architectures & Systems と Digital Circuits に、RF 系が RF と Wireless に分かれるため、「トラック数」を書くときはCFP側（11）と委員会側（13）のどちらの数字かを必ず明示してください。投稿先選定の基準として innovation（新規な回路・システムアーキテクチャ等）と significance（大量生産製品への搭載、state-of-the-art 指標の更新等）のいずれかが公式に明記されており、公開済みの中核アイデア・結果は pre-publication policy により対象外です。Industry-focused Sessions は招待枠のみ、Demonstration Sessions は採択された regular paper 著者への任意招待なので、一般投稿ルートとは別枠として扱ってください。","facts":[{"note":"About Overview の定義文。IC 設計とその応用に携わる技術者向けの場として位置づけられている。","label":"ISSCC 対象分野（公式定義）","value":"solid-state circuits and systems-on-a-chip","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/about-overview"},{"note":"Topics of Interest の導入文。あわせて \"A high level of technical quality and clarity is required for all submissions.\" と記載。","label":"ISSCC 2027 が求める論文の観点","value":"\"ISSCC seeks papers with outstanding innovation (e.g., novel circuit/system architectures) and/or significance (e.g., high-volume product deployment, advances in state-of-the-art metrics).\"","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/topics-of-interest-26"},{"note":"Topics of Interest ページの見出し単位で11区分。投稿時にはこの subject area を基に subcommittee を指定する。","label":"ISSCC 2027 subject area（CFP上の区分・11件）","value":"ANALOG / DATA CONVERTERS / DIGITAL CIRCUITS, ARCHITECTURES & SYSTEMS / IMAGE SENSORS & DISPLAYS / MEDICAL / MEMORY / POWER MANAGEMENT / RF CIRCUITS & WIRELESS SYSTEMS / SECURITY / TECHNOLOGY DIRECTIONS / WIRELINE","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/topics-of-interest-26"},{"note":"CFP の11 subject area と分割が異なる。Digital が DAS と DCT に、RF 系が RF と Wireless に分かれるため合計13。各 subcommittee は chair・vice-chair と複数メンバーで構成される。","label":"ISSCC subcommittee（技術委員会側の区分・13件）","value":"Analog / Data Converters / Digital Architectures & Systems (DAS) / Digital Circuits (DCT) / Image Sensors and Displays (ISD) / Medical / Memory / Power Management / RF / Security / Technology Directions (TD) / Wireless / Wireline","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/isscc-technical-committees"},{"note":"AI 専用の subject area は設けられておらず、Digital 区分の中に位置づけられている。","label":"AI・機械学習の扱われ方","value":"DIGITAL CIRCUITS, ARCHITECTURES & SYSTEMS 区分に、accelerator、reconfigurable computing、transformer や neural network を含む ML/AI システム、monolithic・chiplet・2.5D・3D のシステムアーキテクチャが含まれる","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/topics-of-interest-26"},{"note":"Topics of Interest の MEMORY 項の列挙。","label":"MEMORY 区分の対象範囲","value":"静的・動的・不揮発メモリ、メモリコントローラ、phase-change / magnetic / ferroelectric / resistive などの新型メモリ、アレイアーキテクチャ、in-memory / near-memory computing","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/topics-of-interest-26"},{"note":"新規デバイス・新領域の受け皿となる区分。","label":"TECHNOLOGY DIRECTIONS 区分の対象範囲","value":"integrated photonics とシリコン電子・光集積、計測/センシング/計算向け量子デバイス、フレキシブル・ストレッチャブル・折り曲げ・印刷・3D エレクトロニクス、生体/化学センサ、遠距離無線給電、宇宙・極限環境向け IC、計算・ML 向けの非従来型プラットフォーム、AI for analog automated IC design、集積メタマテリアル","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/topics-of-interest-26"},{"note":"Call for Papers Overview 側にも \"Undisclosed pre-publications may lead to withdrawal of an accepted paper.\"（未申告の事前公開は採択取消しにつながりうる）と記載。","label":"明示された対象外（事前公開済み成果）","value":"\"key innovative ideas and results have already been disclosed to the public\" に該当する論文は pre-publication policy により受理されない","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/paper-submission-26"}],"title":"対象技術領域とトラック（subcommittee）構成","eyebrow":"scope"},"review":{"id":"review","body":"ISSCCは double-blind review を採用し、著者・査読者双方が匿名のまま Paper Selection が行われます。公式の「ISSCC Paper-Review Criteria: Innovation & Significance」(ITPC向け Reviewer Training から起こした文書)によれば、1件の投稿につき同一subcommitteeのITPCメンバーから7〜10件の個別レビューが付き、各査読者が innovation / significance / technical paper quality を別々に採点したうえで Paper-Selection Meeting で議論し overall rating を投票で決めます。overall rating が innovation と significance の平均ではない点で、公式文書は「どちらかが突出していれば通し、両方が中程度の論文は落とす」という意図的なトレードオフだと明言しているため、FoM の微改善や先端ノード採用そのものは訴求点になりません。投稿前に本文と図の technical quality を上げること、自分の関連研究を漏れなく引用すること、そして社外のProgram Committee メンバーに投稿を知らせないこと(即時rejectに直結)が実務上の必須事項です。","facts":[{"note":"Author Instructions は「In a double-blind review, the identities of the authors are also withheld and not revealed to the reviewers.」とし、所属・製品名・PDFメタデータ・die photo や基板写真のロゴまで除去を要求。著者の身元を知るのは Program Chair / Vice Chair と Subcommittee Chairs のみ。","label":"ISSCC 査読方式","value":"double-blind review(著者・査読者の双方が匿名)","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027_AuthorInstructionsAndFAQ.pdf"},{"note":"公式文書「Each submission receives seven to ten separate reviews from ITPC members per subcommittee who are the leading experts in their respective fields.」内容はISSCC Reviewer Training(ITPC向け)から直接転記されたものと明記。","label":"ISSCC 1件あたりの査読数","value":"各投稿につき subcommittee の ITPC メンバーから7〜10件の個別レビュー","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC-Paper-Review-Criteria-2026-08-02.pdf"},{"note":"innovation は新しいアイデア・設計・手法・応用や新たに解くべき問題、significance はシステム/製品/SSCSコミュニティへの正の影響(industry first、量産投入、state-of-the-artの大幅前進など)と定義。technical paper quality は他2軸から独立して評価される。","label":"ISSCC 審査観点(3軸)","value":"(i) innovation、(ii) significance in the field、(iii) technical quality(本文と図)","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC-Paper-Review-Criteria-2026-08-02.pdf"},{"note":"公式文書は「ISSCC aims to accept highly innovative papers even if the FoM is not state of the art or highly significant papers even if the key ideas mostly, or entirely, build upon prior work.」とし、FoMの増分改善偏重や先端ノード優遇という誤解を明示的に否定している。","label":"ISSCC overall rating の決め方","value":"overall rating は innovation と significance の平均ではなく、どちらかが突出した論文を通し、両方が中程度の論文を通さない意図的なトレードオフ","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC-Paper-Review-Criteria-2026-08-02.pdf"},{"note":"会議での議論は innovation と significance を中心に据え、technical paper quality はコメントとして扱われる。","label":"ISSCC 選考プロセス","value":"各査読者が個別採点+詳細コメントを付けた後、Paper-Selection Meeting に出席して集団で討議し、overall rating を投票で決定","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC-Paper-Review-Criteria-2026-08-02.pdf"},{"note":"CFP「The authors' suggested subcommittees are strongly considered when assigning each submission to a subcommittee.」RF/Wireless と Digital Circuits/Digital Architectures & Systems は複数subcommitteeのいずれかで審査されうると注記されている。","label":"ISSCC 2027 subcommittee の割当方法","value":"投稿時に著者が subcommittee を提案し、それが強く考慮されるが、査読品質確保のため ISSCC 側が変更しうる","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"ISSCC 2027からの新規要件(CFPの「IMPORTANT SUBMISSION UPDATES」項目2、NEW表記)。詳細なCOIガイドラインは投稿サイト側に掲載されるとされている。","label":"ISSCC 2027 COI(利益相反)申告","value":"投稿時に、審査対象として選んだsubcommitteeのiTPCメンバーとの潜在的な利益相反を申告・説明することが新たに求められる","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"Pre-Publication Policy 違反があれば ISSCC は投稿を取り下げうる。自身の関連研究を引用し損ねた場合、Paper Selection 後の Pre-Publication Check で「conditionally accepted paper」が却下されうるとAuthor Instructionsに記載。","label":"ISSCC 査読プロセスに含まれる自動チェック","value":"ソフトウェアによる剽窃チェックを査読過程に含み、Paper Selection 後に著者名と補足資料を用いた最終 Pre-Publication Check を実施","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027_AuthorInstructionsAndFAQ.pdf"},{"note":"CFP「Notifying Program Committee members outside of your organization of your submission is also direct violation of the double-blind-review policy and results in an immediate paper rejection.」自分の過去論文からの図の直接流用も、prior work への明白なリンクを作るため禁止(FAQ)。","label":"ISSCC 2027 blind-review 違反のペナルティ","value":"明白な blind-review 違反は Paper Selection で減点され、採択・受賞・JSSC Special Issue への招待の各判断に影響する。社外のProgram Committeeメンバーに投稿を知らせた場合は即時reject","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"本調査で開いたISSCC公式ページ、ISSCC 2027 CFP、Author Instructions and FAQ、Paper-Review Criteria のいずれにも数値の記載がなかったため、推定値は示さない。","label":"ISSCC 採択率・投稿数","value":"公式サイトおよびISSCC 2027 CFPには採択率・投稿件数・採択件数のいずれも記載されていない","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"}],"title":"査読方式と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"最大の落とし穴はサイクル年の混在で、ISSCC 公式サイトは URL スラッグを更新せずに中身だけ差し替える運用のため、/call-for-papers-overview-26 に ISSCC 2027 の CFP（投稿締切 2026年9月9日、会期 2027年2月14〜18日）が載り、/isscc-2024-exhibition が現行サイクルの Exhibition ページになっている。数値を引くときは、ISSCC 2026 Press Kit が「DRAFT 11-25-2025」で「The material presented here is preliminary. As of November 5, 2025, there is not enough information to guarantee its correctness.」という免責を冒頭に置いている点、参加者数 2800 が実績ではなく「expected」である点を必ず添える。投稿数 1025 件・採択論文 265 件・37セッションは press kit に書かれているが、採択率（%）という形の公表値は今回開いた公式ページのいずれにも存在しないため、割り算で作らないこと。将来会期は future-conferences ページに 2026〜2032 の日付だけが並び都市・会場の記載がない一方、CFP ページには ISSCC 2027 の会場として San Francisco Marriott Marquis が出ており、情報の粒度がページごとに違う。","facts":[{"note":"URLの数字から年度を推測しないこと。ページ本文に書かれた会期・締切で年度を判定する。","label":"URLスラッグと掲載内容の年がずれている","value":"ナビゲーションの Call for Papers Overview は /call-for-papers-overview-26 だが、掲載内容は ISSCC 2027 サイクル（「Submission deadline: Wednesday, September 9, 2026 · 3:00 PM EDT」「February 14-18, 2027 · San Francisco Marriott Marquis」）。Exhibition のリンク先は /isscc-2024-exhibition のまま。","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/call-for-papers-overview-26"},{"note":"press kit 由来の数値・登壇者・企業名を引用する際は暫定版であることを併記する。文書には「© COPYRIGHT 2026 ISSCC—DO NOT REPRODUCE WITHOUT PERMISSION」の表記が各ページに入っている。","label":"Press Kit は暫定版であることが明記されている","value":"表紙に「2026 PRESS KIT DRAFT 11-25-2025」、次頁に「ISSCC Press Kit Disclaimer — The material presented here is preliminary. As of November 5, 2025, there is not enough information to guarantee its correctness. Thus, it must be used with some caution.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"「expected」と書かれており実績報告ではない。過去年の実参加者数は今回開いた公式ページには掲載がなかった。","label":"参加者数は実績値ではなく見込み値","value":"「Attendance at ISSCC 2026 is expected to be around 2800.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"投稿数側は「around」付きの概数。この2値から採択率を計算した値は公式には存在しないため、%表記で書かない。","label":"採択率（%）は公表されていない","value":"公表されているのは「For ISSCC 2026 around 1025 submissions were received」と「all 37 technical sessions into which the 265 papers are grouped」という2つの数値のみ","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"Future Conferences ページには都市名・会場名の記載がない。ISSCC 2027 の会場名は CFP ページ側にのみ出ている。","label":"将来会期は日付のみで都市・会場が未公表","value":"「ISSCC 2026: February 15 – 19」「ISSCC 2027: February 14 – 18」「ISSCC 2028: February 20 - 24」「ISSCC 2029: February 18 - 22」「ISSCC 2030: February 17 - 21」「ISSCC 2031: February 16 – 20」「ISSCC 2032 February 15 – 19」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/future-conferences"},{"note":"それ以前の年次情報は 50th / 60th / 70th Anniversary Supplement の PDF 側にある。ただし 70th Anniversary Supplement の PDF は10MB超で通常のWeb取得では読み込めない。","label":"過去会議アーカイブは2009年以降のみ","value":"Past Conferences ページに並ぶ年次リンクは 2009年〜2026年","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/past-conferences"},{"note":"収録範囲は 2012年〜2026年。文献検索で年をまたいで一括検索する際は「Digest of Technical Papers」の有無で取りこぼしが出る。","label":"書誌データベース上の会議名表記が年ごとに揺れる","value":"DBLP の ISSCC 巻タイトルは「2013 IEEE International Solid-State Circuits Conference - Digest of Technical Papers」「2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers」「IEEE International Solid-State Circuits Conference, ISSCC 2019」など年ごとに異なる","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/isscc/index.html"},{"note":"キャンセル期限のみ本文に明記（「Prior to 11:59PM EST Monday, January 26, 2026」）。金額を引用する場合は年度別のPDFを直接確認すること。","label":"登録費は本文に載らずPDFのみ","value":"Registration Overview ページ本文は「Fees for ISSCC 2026 are available」と別PDFへのリンクを示すのみで、会員/非会員/学生の金額表は本文に無い。参照時点の表示は「Registration is now closed」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/registration-overview"},{"note":"完全オンライン開催ではなく、現地開催＋一部オンライン提供という書き方。ISSCC 2027 サイクルについて同等の形式記述は今回開いたページでは確認できなかった。","label":"開催形式の表記","value":"「The 73rd ISSCC will be held in-person with some online offering from February 15th through February 19th, 2026.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"}],"title":"注意点・未公開事項","eyebrow":"caveats"},"history":{"id":"history","body":"ISSCC の起点は 1954 年 2 月の Philadelphia 開催で、IEEE SSCS の Conferences ページが「The Society's flagship conference since 1954」と明記し、公式 press kit 収録の解説記事「The Origins of the Conference」が初回の運営体制・参加者 601 名・登壇 6 組織まで具体的に記録している。名称は 1954 年時点で The Transistor Conference / Conference on Transistor Circuits / National Conference on Transistor Circuits 等に揺れており、\"International\" が加わったのは 1960 年だと同記事が書いている。開催地は最初の 25 年が Philadelphia 固定、1978 年に初めて San Francisco で開催、その後約 10 年の東西交互期を経て 1990 年に San Francisco が恒久開催地になった。1954 年以前・2009 年以前の年次データを自分で辿る場合、公式サイトの Past Conferences は 2009 年分までしか並んでいないため、isscc-history ページの 50th / 60th / 70th Anniversary Supplement の各 PDF に当たる必要がある。","facts":[{"note":"主催学会自身のページによる創設年の記述。「world's premier forum」は公式サイトの表現をそのまま引用したもの。","label":"ISSCC 初回開催（1954年）","value":"IEEE SSCS の Conferences ページに「The Society's flagship conference since 1954, ISSCC is the world's premier forum for presenting advances in solid-state circuits and systems-on-a-chip.」と記載","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"公式 press kit 内の解説記事「The Origins of the Conference」。初出は IEEE Solid-State Circuits Magazine 2018年冬号。","label":"ISSCC 第1回の登壇組織（1954年2月）","value":"「The program of the first conference in February of the 1954 consisted of papers from just six organizations: Bell Telephone Laboratories, General Electric, RCA, Philco, MIT and (of course) the University of Pennsylvania.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"同記事。初回は Digest of Technical Papers に相当するものがなく、参加者には抄録冊子（booklet of abstracts）が配られたとも書かれている。","label":"ISSCC 第1回の参加者数（1954年）","value":"「The first Conference published a full list of all 601 attendees.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"同記事。「solid-state」の語義自体も当初は曖昧で、極低温回路・薄膜磁気回路・空気圧回路まで扱われたと記述されている。","label":"名称の変遷と \"International\" 追加年（1960年）","value":"1954年の各種文書では The Transistor Conference / the Conference on Transistor Circuits / The National Conference on Transistor Circuits / \"the Philadelphia Conference\" と揺れており、「It would take another seven years to sort out the title, finally adding the word \"International\" in 1960.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"同記事。西海岸移転は U.C. Berkeley の David Hodges による働きかけがきっかけと記述。","label":"開催地ローテーションの推移","value":"「For the first 25 years of its existence ISSCC met religiously every February in Philadelphia.」／1978年に San Francisco で試行／「For about ten years ISSCC alternated between San Francisco on the west coast and either Philadelphia or New York City on the east coast. Then in 1990 San Francisco became the Conference's permanent home.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"同記事。University of Pennsylvania は創設スポンサーの一つで、長年 ISSCC のエンブレムに名が残っていたと記述。","label":"設立母体（1953年の組織会合）","value":"「The first organizing meeting was held September 15, 1953 at IRE headquarters」／共催は後に AIEE 側にも拡大し、「(The IRE and AIEE would later merge to form today's IEEE)」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"同記事。過去30年で追加された企画として Short Course, Short Papers, Tutorials, Visual Supplement, Technical Book Display, Forums, Industry Live Demonstrations, Student Papers を列挙している。初期は「no social hour or industrial exhibits were to be allowed」だった。","label":"参加規模と会期の拡大","value":"「Annual attendance has expanded from hundreds to around 3000. What was once a compact 2 ½ day agenda now spans the better part of a week.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/Press-kit-ISSCC-origins.pdf"},{"note":"ISSCC 2026 Press Kit の FAQ「Where is ISSCC?」と Overview 節。同 press kit は DRAFT 11-25-2025 版。","label":"ISSCC 2026 の回次","value":"「The 73rd ISSCC will be held in-person with some online offering from February 15th through February 19th, 2026.」／「Now in its 73rd year, ISSCC is the flagship conference in solid-state circuit design.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"ページ見出しは「Celebrating 70 Years of Excellence」、ナビゲーション上の項目名は「ISSCC's First 70」。70周年 Supplement の PDF は約10MBあり、単純なWeb取得では読み込めない大きさ。","label":"節目の公式記録物","value":"isscc-history ページに 50th Anniversary Supplement / 60th Anniversary Supplement / 70th Anniversary Supplement の PDF と、Gordon Moore の 50周年 plenary「Moore on Moore: no Exponential is forever」のトランスクリプトが掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/isscc-history"},{"note":"開催都市・会場・回次・参加者数は同ページ本文には書かれておらず、各年の PDF を開く必要がある。2008年以前の年次リンクは同ページにない。","label":"公式サイト上の過去会議アーカイブ範囲","value":"Past Conferences ページに並ぶのは 2009年〜2026年の各年（program / press kit へのリンク）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/past-conferences"}],"title":"沿革","eyebrow":"history"},"program":{"id":"program","body":"ISSCCは技術セッションだけの会議ではなく、難易度の違う枠が日程で分かれています。日曜がTutorialとAdvanced-Circuit-Design Forum、月曜がplenaryと技術セッション、木曜がForumとShort Courseという構成で、Forum / Short Course / Tutorialは本会議とは別登録が必要です。非専門家として一分野を掴みたいならTutorial、実務で設計している分野を深掘りしたいならForumかShort Courseを先に選び、技術セッションはそのあとで絞り込むのが実際的です。Industry SessionsとDemonstration Sessionsは一般投稿の枠ではないため、投稿計画とは分けて考えてください。","facts":[{"note":"各 tutorial は「selected through a competitive process within each subcommittee of the ISSCC」と説明されている。掲載されている個別タイトルは差し替え制のため、参照時点のサイクルを必ず確認すること。","label":"Tutorial の対象読者と本数","value":"「The tutorials are intended for non-experts, graduate students, and practicing engineers who wish to explore and understand a new topic.」／「There are a total of 10 tutorials this year on 10 different topics.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/tutorials"},{"note":"ページ上の年表記は 2027。テーマは毎年入れ替わる。","label":"Short Course の対象読者と構成","value":"「The short course consists of four talks by industry leading experts in a classroom-like format.」／「The short course is targeted at experienced designers who wish to explore a new area in-depth.」／掲載テーマ「Hardware Security, from Fundamentals to Implementations」、開催日 Thursday, February 18","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/short-course"},{"note":"Program Overview では Sunday に2件、Thursday に4件という配置で説明されている。","label":"Forum の対象読者","value":"「In the Advanced-Circuit-Design Forums, leading experts present state-of-the-art design strategies in a workshop-like format.」／「The Forums are targeted at designers experienced in the technical field.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/program-overview"},{"note":"Industry Session は招待制であり、通常論文と同じ査読プロセスを経た枠ではない点を区別して読む必要がある。","label":"産業側の発表枠の性格","value":"Industry Sessions は「chip-product releases alongside the regular technical sessions」を扱い、枠は「by invitation only」。Demonstration Sessions は「authors of accepted regular papers」が実動回路・システムとポスターを提示する任意参加の場。","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/industry-demo-sessions"},{"note":"First-Time Attendees 向け FAQ。Forums / Short course / tutorials は「require separate registration」とされ、本会議登録とは別建て。並列セッションのため「It is impossible to attend every talk in-person.」とも書かれている。","label":"登録に含まれるもの／会場での禁止事項","value":"「Included in your registration is the password to the Conference Wi-Fi and a password to access the Conference Platform.」で、digest 全体・個別論文・スライド・録画の閲覧が可能。一方で「there are no photographs or recordings allowed in sessions.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/faq-for-firsttime-attendees"},{"note":"Industry Session の扱う題材として Modern Processors/SoCs、AI、ML、AR/VR、Mobile/Cellular (5G)、Radar、High-Speed Wireline、Human Interface、Quantum Computing、Next-Generation Automotive、Healthcare、Robotics が挙げられている。Demonstration は月曜・火曜のソーシャルアワー中に実施。","label":"一般投稿対象外の特別トラック","value":"Industry-focused Sessions は \"Slots are by invitation only\"（2020年にパイロット開始）。Demonstration Sessions は \"Authors of accepted regular papers will be invited to demonstrate their working circuit or system\" とあり、採択 regular paper 著者への任意参加招待","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/industry-demo-sessions"},{"note":"Program Overview の日別記述。Conference Timetable ページ側には時間割の本体はなく、2027 Advance Program の PDF ダウンロード導線のみ。","label":"ISSCC 2027 日別構成","value":"2/14(日) tutorial 10本＋Advanced-Circuit-Design Forum 2本＋パネル＋Student Research Preview（20時）／2/15(月) plenary 4件と並行技術セッション／2/16(火)・2/17(水) 技術セッション／2/18(木) Advanced-Circuit-Design Forum 4本＋Short Course","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/program-overview"},{"note":"Program Overview ページ冒頭に掲示された2027年のテーマ。年ごとに変わるため、他年度の記述に流用しないこと。","label":"ISSCC 2027 テーマ","value":"TRUSTED SUSTAINABLE SILICON INTELLIGENCE FROM EDGE TO CLOUD","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/program-overview"}],"title":"program構成とセッションの種類","eyebrow":"program"},"audience":{"id":"audience","body":"学生・研究室側は、投稿前でも Student Research Preview（進行中研究のアブストラクト、ISSCC 2027 サイクルの締切は 2026年10月21日）、学部3年〜修士入りたて向けの Circuit Insights、学部生・卒後2年以内向けの Next Generation Circuit Designer Workshop、SSCS会員かつ博士課程在籍者向けの Student Travel Grant Awards という別々の入口が用意されているので、自分の学年に合う枠を先に選ぶのが実務的。当日の学習設計としては Tutorial（非専門家・大学院生・現場エンジニア向け、10件）→ Technical Session → Forum（当該分野の経験者向け）→ Short Course（経験者が一分野を深掘り、4講演構成）という難易度の階段が公式に説明されており、Forum / Short Course / Tutorial は本会議とは別登録が必要な点に注意する。企業・調査担当は、press kit の「HISTORICAL TRENDS IN TECHNICAL THEMES」節が subcommittee ごとに直近6年の投稿トピック分布と採択傾向を図で出しているため、単年の論文リストより先にここを読むと領域の増減を追いやすい。ただし Exhibition は「学生以外の来場者を採用目的で勧誘する活動は認めない」と明記されているため、出展社リストを採用・取引の証拠として扱ってはいけない。","facts":[{"note":"Students ページに掲載。SRP は進行中の大学院生研究を紹介する枠で、正規論文投稿とは別ルート。press kit では「for the introduction of graduate-student research-in-progress」と説明されている。","label":"Student Research Preview のアブストラクト締切","value":"「October 21, 2026」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/information-for-students"},{"note":"STGA の具体的な支給額は同ページに記載がなく、詳細は SSCS 側に案内されている。","label":"学生向け支援枠の対象条件","value":"Student Travel Grant Awards は「Students who are members of the Solid-State Circuits Society and in a Ph.D. program」が対象で「partial travel to attend ISSCC」を支給。Silkroad Award は「first-time student-presenting authors at ISSCC whose research is conducted in an emerging region of Asia-Pacific (APAC)」が対象。Circuit Insights は「third-year undergraduate students and starting graduate students in the area of circuit design」が対象。","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/information-for-students"},{"note":"締切日付は掲載時点のサイクルのもの。fireside chat、メンタリング、ポスターセッション、キャリアパネルを含むと記載。","label":"学部生・キャリア初期向けワークショップ","value":"Next Generation Circuit Designer Workshop は「Undergraduate students, early graduate students, and professionals ≤2 years post-undergrad」が対象、応募締切「October 6, 2025」、選抜人数26名","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/information-for-students"},{"note":"単年の採択論文リストより先に読むと領域の増減が追える。press kit は Past Conferences ページから過年度分も辿れる。","label":"技術動向の追跡に使える公式資料","value":"ISSCC 2026 Press Kit に「HISTORICAL TRENDS IN TECHNICAL THEMES」節があり、Analog / Power Management / Data Converters / RF / Wireless / Wireline など subcommittee ごとに chair 名と投稿トピック分布の図を掲載。例：「Figure 1. Analog Subcommittee submission topic distribution and trends from 2021-2026.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"金額そのものは HTML ページ本文になく、別PDF（Reg-fees-FINAL-2026.pdf）に置かれている。参照時点では「Registration is now closed」表示だった。","label":"登録費の割引条件","value":"「Members of IEEE receive a substantial discount on conference fees, and members of SSCS receive an additional discount.」／「IEEE Member Authentication via IEEE login will be required for ISSCC 2026 to receive discount membership rates.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/registration-overview"}],"title":"研究室・企業での使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"正式名称は年号を冠した「2027 IEEE International Solid-State Circuits Conference (ISSCC)」で、主催表記は公式サイト全ページのフッターに共通して \"Sponsored by IEEE and SSCS\" と書かれています。IEEE SSCS 側では financially sponsor する5会議のひとつとして \"the Society's flagship conference since 1954\" と紹介されており、綴り（isscc.org は Solid-State、sscs.ieee.org は Solid State）と自己紹介文が両サイトで揺れているため、引用元をそろえて表記してください。回数は公式が \"ISSCC 2027 is in its 74th year.\" と書いており、「第74回」ではなく「74年目」と訳すのが原文に忠実です。開催頻度は Future Conferences ページに2026〜2032年の各年1件ずつ日程が並ぶことから年1回と読み取れますが、同ページの見出しは \"Tentative\"（暫定）です。","facts":[{"note":"公式トップの会期見出しに併記。年号が名称の一部として前置される形式。","label":"ISSCC 2027 正式名称（公式トップ表記）","value":"2027 IEEE International Solid-State Circuits Conference (ISSCC)","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/"},{"note":"公式サイトのドメイン・ページタイトル・本文いずれもこの略称を使用。","label":"ISSCC 略称","value":"ISSCC","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/about-overview"},{"note":"About Overview を含む各ページのフッターに固定文として掲載。共催・技術協賛を区別した別表記は公式サイト上に見当たらない。","label":"ISSCC 主催表記","value":"\"Sponsored by IEEE and SSCS\"","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/about-overview"},{"note":"SSCS 側の綴りは \"The International Solid State Circuits Conference\"（Solid State にハイフンなし）で、isscc.org の \"Solid-State\" と表記が異なる。","label":"IEEE SSCS における ISSCC の位置づけ","value":"SSCS が financially sponsor する5会議の1つ。\"The Society's flagship conference since 1954, ISSCC is the world's premier forum for presenting advances in solid-state circuits and systems-on-a-chip.\"","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"公式は \"74th year\" と書いており、\"74th conference\" や \"74th Annual\" という回数表記は使っていない。日本語で「第74回」と書くと原文より強い主張になる。","label":"ISSCC 2027 の回数に相当する公式表記","value":"\"ISSCC 2027 is in its 74th year.\"（74年目）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/call-for-papers-overview-26"},{"note":"同ページの導入行は \"Tentative future ISSCC dates\" で、あくまで暫定日程として提示されている。「annual」という語自体はこのページにはない。","label":"ISSCC 開催頻度","value":"年1回（Future Conferences ページに 2026・2027・2028・2029・2030・2031・2032 の各年1件ずつ日程を掲載）","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/future-conferences"},{"note":"この \"foremost global forum\" は公式サイト自身の表現。日本語化する場合も出典を示した引用として扱い、こちらの評価語に置き換えない。","label":"ISSCC 公式の自己定義","value":"\"The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip.\"","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/about-overview"}],"title":"識別情報（正式名称・主催・開催頻度）","eyebrow":"identity"},"community":{"id":"community","body":"技術プログラムは、Program ChairとProgram Vice-Chairの下でITPC（International Technical Program Committee）をAmericas / Asia Pacific / Europe, West Asia & Africaの3地域に分け、その下に13のsubcommitteeを置く構成です。参加者の産業比率は公式press kitが見込み値として示しており、大学だけの会議ではありません。ただしpress kitに並ぶ企業名リストは公式に「網羅ではない」と断られており、出展や登壇の事実を取引・採用の証拠として読み替えないでください。","facts":[{"note":"公式のTechnical Committeesページに Chair / Vice-Chair と各subcommitteeのメンバー一覧、Technical Editors、Digest Editor の役割が掲載されている。","label":"ISSCC 2027 ITPC の構成","value":"Program Chair(Marian Verhelst / KU Leuven & imec)と Program Vice-Chair(Stefano Pellerano / Intel)の下、ITPC を Americas(AM)、Asia Pacific(APAC)、Europe, West Asia & Africa(EWAA)の3地域に分け、各地域に Regional Chair と Vice-Chair を置く","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/isscc-technical-committees"},{"note":"ISSCC 2025 の Imagers, Medical, & Display Subcommittee が Image Sensors & Displays と Medical に分割されたとCFP脚注に明記。技術的な相談は該当subcommittee chairまたはregional chairに直接連絡するよう案内されている。","label":"ISSCC 2027 subcommittee chair の掲載数","value":"CFP裏表紙に Analog / Data Converters / Digital Architectures & Systems / Digital Circuits / Image Sensors & Displays / Medical / Memory / Power Management / RF / Security / Technology Directions / Wireless / Wireline の13 subcommittee chair と、EWAA・APAC・AM の3 regional chair の連絡先が掲載","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"あくまで press kit（DRAFT 11-25-2025）時点の見込み値で、実績値ではない。学術中心の会議との性格差を示す公式記述として使える。","label":"ISSCC 参加者の産業比率（ISSCC 2026 見込み）","value":"「Attendance at ISSCC 2026 is expected to be around 2800. Corporate attendees from the semiconductor and system industries typically represent around 60%.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"FAQ欄のリストは抜粋。企業名の有無を「発表の有無」の結論に使わない。また論文発表企業と Exhibition 出展社は別のリストであり、いずれも取引先・売上・採用の証拠にはならない。","label":"press kit の企業名リストは網羅的ではない","value":"「Companies presenting papers at ISSCC 2026 include: AMD, Analog Devices, Broadcom, ... and Vango Technologies, just to name a few. A more complete list can be found in the Index.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/s/ISSCC2026PressKit.pdf"},{"note":"出展は情報提供と学生向けの企業紹介までが公式に認められた範囲。出展・協賛は取引関係や採用実績の証拠にはならない。","label":"Exhibition における企業活動の制限","value":"「Corporations are welcome to provide information about their activities to the participants, and to present themselves to students who could become interested in working for them. However, activities aiming at hiring ISSCC attendees who are not students are not allowed as part of the Exhibit.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/isscc-2024-exhibition"},{"note":"About Overview ページのフッター記載。会場所在地ではなく事務局住所。","label":"ISSCC 運営事務局の連絡先","value":"185 Lakeside Drive, Lewes, DE 19958 USA / 電話 240-687-1765","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/about-overview"}],"title":"運営体制と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"棲み分けを一次情報だけで確認したい場合、IEEE SSCS の Conferences ページが同学会 fully sponsored の ISSCC / VLSI / CICC / A-SSCC / ESSERC / CHISIC それぞれに一行のスコープ説明を付けており、ここが唯一の公式な対比材料になる。ISSCC は「flagship」「world's premier forum」と位置づけられ、VLSI は米日交互開催で EDS・JSAP との協調、A-SSCC はアジア各地の巡回、ESSERC は欧州フォーラム、CICC は「first-published technical work」と実務課題志向、CHISIC は custom chiplets 専門と、地理・粒度・公開状況で書き分けられている。同ページには DAC / DATE / ISLPED / RFIC / BioCAS などが Technical Co-Sponsor 欄に別枠で並んでおり、「SSCS が関与している」だけで ISSCC と同格に扱わないよう欄の区別を確認すること。ISSCC 固有の運用として double-blind review と JSSC Special Issue への招待が Call for Papers に明記されている点は、他会議と比較する際の実務的な差分になる。","facts":[{"note":"IEEE SSCS 公式 Conferences ページの「Fully Sponsored」区分。ISSCC の位置づけを同学会の他会議と比べる際の一次情報。","label":"IEEE SSCS が fully sponsor する会議（2026-08-05時点）","value":"ISSCC / Symposium on VLSI Technology and Circuits (VLSI) / Custom Integrated Circuits Conference (CICC) / Asian Solid-State Circuits Conference (A-SSCC) / European Solid-State Electronics Research Conference (ESSERC)、加えて sponsored workshop として CHISIC","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"「world's premier forum」は SSCS 側の表現をそのまま引用。ISSCC 自身のサイトでは「the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip」という表現を使っている。","label":"ISSCC の公式スコープ表現","value":"「The Society's flagship conference since 1954, ISSCC is the world's premier forum for presenting advances in solid-state circuits and systems-on-a-chip.」","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"米日交互開催であること、EDS・JSAP との協調であること、technology と circuit/system の両方を含むことが ISSCC との差分として読める。","label":"VLSI Symposium の公式スコープ表現","value":"「Held for over 20 years in cooperation with EDS and JSAP, VLSI alternates between the US and Japan, offering an intimate and open platform for discussing the latest advances in solid-state technology, as well as circuit and system implementations.」","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"「first-published」「practical problems」という書き方が公式説明上の性格づけ。ISSCC との採否関係や投稿順序については同ページに記載がない。","label":"CICC の公式スコープ表現","value":"「CICC meetings present first-published technical work and innovative circuit techniques that tackle practical problems.」","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"2005年創設、アジア各地巡回という点が ISSCC（1954年創設・San Francisco 固定）との対比になる。","label":"A-SSCC の公式スコープ表現","value":"「Founded as recently as 2005 and held annually in different hubs of IC innovation in Asia, the A-SSCC is quickly becoming one of the foremost global forums for presenting advances in solid-state circuits and systems-on-a-chip.」","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"ESSERC は欧州、CHISIC は chiplets 特化ワークショップという棲み分け。CHISIC は conference ではなく sponsored workshop 区分。","label":"ESSERC / CHISIC の公式スコープ表現","value":"ESSERC:「The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state technologies, devices, and circuits.」／CHISIC:「CHISIC is the first permanent forum of the Society on custom chiplets design, specifically targeted to an IC designer audience.」","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"SSCS が技術協賛のみを行う会議群。SSCS が名を連ねていることは主催・運営の同一性を意味しない。","label":"Technical Co-Sponsor 欄に並ぶ会議（主催とは別枠）","value":"BCICTS / BioCAS / CAFE / DAC / DATE / ICLAD / ISLPED / LASCAS / RFIC / VLSI-TSA / VLSID","checkedAt":"2026-08-05","sourceUrl":"https://sscs.ieee.org/conferences"},{"note":"double-blind 運用と、採択後の JSSC Special Issue 招待という経路が公式に書かれている点が他会議比較時の実務的差分。ページのURLスラッグは -26 だが内容は ISSCC 2027 サイクル。","label":"ISSCC 固有の査読運用と下流（ISSCC 2027 CFP）","value":"「Guidelines for Double Blind Review」への参照と、iTPC メンバーとの conflicts of interest 申告要求。さらに「Submissions with a clear blind-review violation are penalized during Paper Selection, affecting acceptance, awards, and the JSSC Special Issue invitation.」","checkedAt":"2026-08-05","sourceUrl":"https://www.isscc.org/call-for-papers-overview-26"}],"title":"近い学会との違い","eyebrow":"comparison"},"submission":{"id":"submission","body":"ISSCC 2027の投稿は abstract(500文字以内)と draft manuscript(本文PDF+図PDFの2ファイル)を Mirasmart の公式投稿サイトに上げる方式で、締切は2026年9月9日(水)3:00 PM EDT(19:00 GMT)、採択通知は2026年10月21日と公式CFPに明記されています。本文は5ページ以内・single-column double-spaced・12pt Arial Narrow・11,000文字未満、図は公式テンプレート(1ページ6スロット)で2ページ以内という固い上限があり、CFPは「Papers exceeding the length limit will be immediately rejected.」と長さ超過の即時reject を明言しているので、まず文字数と図ページを設計してから書き始めるのが安全です。regular paper(25分枠/発表20分)と short paper(15分枠/発表12分)の区分は投稿時に選ぶものではなく Program Committee が発表所要時間として決めるもので、投稿・品質基準は同一と書かれています。2027年に向けて製品発表向けの Late Breaking Product News(intent-to-submit 2026年10月7日、最終論文2026年12月1日)と Student Research Preview(abstract締切2026年10月21日)が別枠で用意されています。","facts":[{"note":"CFP表紙・本文・各ページのフッターに同一文言で繰り返し記載。時刻と時間帯まで指定されている。","label":"ISSCC 2027 論文投稿締切","value":"2026年9月9日(水) 3:00 PM Eastern Daylight Time(19:00 GMT)","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"CFP「The Submissions Website will be available starting July 1, 2026.」。abstract と manuscript は同サイトから9月9日15時EDTまでにアップロード。","label":"ISSCC 2027 投稿サイト公開日と URL","value":"2026年7月1日公開、https://submissions.mirasmart.com/ISSCC2027","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"文字数はタイトル・参考文献・著者/所属/謝辞のプレースホルダを除いた本文のカウント(Author Instructions and FAQ の該当Q&Aで確認)。CFPは長さ超過を即時rejectと明記。","label":"ISSCC 2027 本文の分量・書式","value":"5ページ以内 / single-column double-spaced / 12pt Arial Narrow / 11,000文字未満(スペース込み)","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"査読者専用の補足図は Fig. S1/S2/S3 の3枚まで可だが最終原稿には含まれず本文から参照してはいけない。Author Instructions は7ポイント未満のフォントを避けるよう指示。","label":"ISSCC 2027 図の分量・ルール","value":"図は2ページ以内、公式Figure Template(1ページ6スロット)使用。最初の7図(die photo含む)は本文中で参照必須、表は図として収録","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"CFPは「new」「advanced」「novel」「high-performance」「high-speed」といった語をTitle/Abstractで使うことを認めないとし、定量的な実測値の記載を求めている。Titleは12〜14語以内が目安。","label":"ISSCC 2027 abstract の文字数上限","value":"500 characters 以内(スペース込み)","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"公開済み論文は全件URLを添えることが求められる。採択時、参考文献は最終digest版の3ページ目に配置されるとAuthor Instructionsに記載。","label":"ISSCC 2027 参考文献の扱い","value":"最大30件、本文には書かず投稿サイトへ1件ずつ個別入力","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027_AuthorInstructionsAndFAQ.pdf"},{"note":"CFPは通知日をこの日に置く理由を「a thorough Pre-Publication Check」と著者への確認質問のフォローに十分な時間を取るためと説明。Program Committee メンバーが通知日前に状況を著者へ伝えることは厳禁とされる。","label":"ISSCC 2027 採択通知日","value":"2026年10月21日までに通知","checkedAt":"2026-08-05","sourceUrl":"https://submissions.mirasmart.com/ISSCC2027/PDF/ISSCC2027CFP.pdf"},{"note":"CFP「Regular and short papers must meet the same submission and quality standards. 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24 日(10:00〜16:00)で、会場住所は San Jose McEnery Convention Center, 150 W San Carlos Street, San Jose, California 95113 と公式に示されています。開催は毎年で、2026 サイクルも San Jose でした。","question":"SPIE Advanced Lithography + Patterning はいつ・どこで開催されますか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/exhibition","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/highlights"]},{"answer":"abstract は 2026 年 9 月 9 日、採否通知とプログラム公開は 2026 年 11 月 16 日、manuscript と poster PDF の投稿システム開放は 2026 年 12 月 21 日、poster PDF は 2027 年 1 月 27 日、全 manuscript は 2027 年 2 月 3 日、口頭発表スライドの事前アップロードは 2027 年 2 月 19 日が期限です。conference によっては post-deadline abstract を検討する場合があると記載されています。","question":"2027 の投稿締切と原稿締切はいつですか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"]},{"answer":"投稿は conference chairs/committee による review and approval の対象で、\"all submissions will be assessed by the conference chair/editor for technical merit and suitability of content\" と明記されています。口頭かポスターかの最終配置も chair の裁量です。審査用の extended abstract には著者名と所属を含めるよう指示されており、匿名審査(double-blind)の手順は公開されていません。","question":"査読はありますか。どのように選考されますか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines","https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"]},{"answer":"採択率は公表されていません。Abstract Submission Guidelines、Conferences、Program、Highlights のいずれのページにも採択率の記載はありません。規模感を知りたい場合は、proceedings volume ページの \"Contents: N Sessions, N Papers, N Presentations\"(例:2026 の Volume 13979 は 17 Sessions, 60 Papers, 57 Presentations)で採択後の収録件数を確認する方法があります。","question":"採択率はどのくらいですか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines","https://spie.org/Publications/Proceedings/Volume/13979"]},{"answer":"公式の招待文は対象を \"the worldwide practitioners of semiconductor technology and manufacturing with a focus on industrial applications\" と説明しています。委員構成にもそれが表れており、AL101 の chair・co-chair と program committee 38 名の所属は United States 22、Japan 5、Korea, Republic of 3、Belgium 3、Germany 3、Netherlands 1、Switzerland 1 で、装置・材料・デバイス企業と研究機関が混在します(所属機関の所在国であり個人の国籍ではありません)。","question":"どのような人・組織が発表しますか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation","https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"]},{"answer":"Proceedings of SPIE として SPIE Digital Library に掲載されます。conference ごとに volume が分かれ、2026 サイクルでは Optical and EUV Nanolithography XXXIX が Volume 13979(2026 年 4 月 30 日公開)、Novel Patterning Technologies 2026 が Volume 13982(2026 年 4 月 22 日公開)でした。索引データベースとして ADS、Ei Compendex、CrossRef、Google Scholar、Inspec、Scopus、Web of Science が挙げられています。IEEE Xplore への収録の記載はありません。","question":"発表内容はどこに掲載されますか。","sourceUrls":["https://spie.org/Publications/Proceedings/Volume/13979","https://spie.org/Publications/Proceedings/Volume/13982","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"]},{"answer":"2027 の参加費は 2026-08-05 時点で公開されていません。Registration ページには \"2027 registration will open in November\" とだけ記載されています。full registration に含まれる内容は \"All presentations, plenaries, special events, poster sessions, the exhibition\" と proceedings ダウンロード 50 件、火曜・水曜の昼食と示されています。short course は SPIE Member 15% 引き、SPIE Student Member 35% 引き、Early Bird 期限内はさらに 15% 引きです。","question":"参加費はいくらですか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/registration","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/courses"]},{"answer":"SPIE は visa 申請を必要時期の 3〜4 か月前までに始め、大使館の予約も早く取るよう案内しています。招待状は SPIE アカウントにサインインして Invitation Letter Request Form から申請し、パスポート表記と完全に一致する氏名を入力するよう求められます。SPIE は大使館・領事館への個別照会は行わないと明記しており、登録前に visa を確保することを推奨しています。","question":"日本から参加する場合に気をつけることはありますか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/visa-information"]},{"answer":"student grant は登録費全額と onsite course 分最大 $500 をカバーし、旅費は米国内の学生が最大 $500、国外の学生が最大 $1,000 まで実費精算されます(領収書の保管が条件)。応募には proceedings への manuscript 提出が要件として含まれます。2027 サイクルの応募締切は Abstract Submission Guidelines の Important dates 表で \"Student Grant applications due 29 November 2026\" と示されており、award 選考の対象になるには 9 月 9 日までの abstract 提出が必要です。別枠で Nick Cobb Memorial Scholarship($10,000、渡航支援は Siemens EDA 負担、申請開始 2026 年 9 月 1 日)があります。","question":"学生が費用の支援を受ける方法はありますか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/for-students","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"]},{"answer":"SPIE Photomask Technology + Extreme Ultraviolet Lithography は別イベントで、2026 サイクルは 9 月 8〜11 日に Monterey, California, US で開催され、Photomask Technology conference と EUV Lithography conference の 2 conference 構成です。SPIE Advanced Lithography + Patterning は 2 月・San Jose・6 conference 構成で、mask のテーマは AL101 の MASKS 区分として本会議でも扱われます。","question":"SPIE の photomask 系イベントとの違いは何ですか。","sourceUrls":["https://spie.org/conferences-and-exhibitions/photomask-technology-and-extreme-ultraviolet-lithography","https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/browse-call-for-papers"]}],"headline":"2027 サイクルの公式ページ、call for papers、abstract submission guidelines、各 conference detail、proceedings volume ページを読み、投稿と参加の判断に必要な事実だけを抜き出しました。","metaDescription":"SPIE Advanced Lithography + Patterning(SPIE ALP)の2027会期、6つのconference構成、abstract締切とmanuscript締切、chair選考の査読方式、SPIE Digital Libraryへの掲載条件を公式ページの記載だけで整理します。","oneLine":"SPIE Advanced Lithography + Patterning は、SPIE が毎年 San Jose で開催する半導体リソグラフィ・パターニングのシンポジウムで、6 つの conference と application track で構成されます。","pageTitle":"SPIE Advanced Lithography + Patterningとは:会期・投稿締切・査読・掲載先を公式情報で確認","relatedConferenceIds":["spie-optical-euv","spie-patterning-materials","spie-metrology-inspection","spie-dtco-computational","spie-photomask-euv","pmj"],"sections":{"cycle":{"id":"cycle","body":"2027 サイクルは 2 月 21〜25 日の 5 日間で、都市は San Jose, California, US です。展示会場として San Jose McEnery Convention Center の住所が公式に示されており、展示は 2 月 23〜24 日の 2 日間です。技術セッション会場の個別表記と、会議本体を online で聴講できるかどうかは、確認した公式ページには書かれていません。2027 の登録は 2026 年 11 月に開始予定と告知されており、料金表はまだ出ていないため、旅費計画は会期と展示日だけを固定して進めることになります。","facts":[{"note":"全イベントページ共通のヘッダー表記。","label":"2027 会期","value":"21 - 25 February 2027","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"},{"note":"同ヘッダー表記。","label":"2027 開催地","value":"San Jose, California, US","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"},{"note":"Exhibition ページに記載された住所。技術セッション会場の個別表記は、確認したページにはありません。","label":"2027 展示会場","value":"San Jose McEnery Convention Center, 150 W San Carlos Street, San Jose, California 95113","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/exhibition"},{"note":"Exhibition ページの開場時間。","label":"2027 展示日程","value":"Tuesday, 23 February 2027 10:00 AM - 5:00 PM / Wednesday, 24 February 2027 10:00 AM - 4:00 PM","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/exhibition"},{"note":"Registration ページ。参加費の金額は 2026-08-05 時点で公開されていません。","label":"2027 登録開始","value":"\"2027 registration will open in November\"(料金は未掲載)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/registration"},{"note":"Highlights ページ。2026 program PDF へのリンクも同ページにあります。","label":"2026 サイクルの開催地","value":"San Jose(\"Photo highlights from the 2026 event in San Jose\")","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/highlights"}],"title":"2027 サイクルの会期・会場・展示日程","eyebrow":"cycle"},"scope":{"id":"scope","body":"6 つの conference が縦軸、5 つの application track が横軸という二層構造です。abstract は 1 件につき 1 conference を選んで投稿し、該当すれば application track を併せて選択します。商業色の強い発表や新規性のない発表は明示的に対象外とされており、材料系の AL105 では化学構造の開示不足も不採択理由として明記されています。","facts":[{"note":"Conferences ページの \"Conference topics\" 一覧。","label":"2027 の 6 conference","value":"Optical and EUV Nanolithography / DTCO and Computational Patterning / Metrology, Inspection, and Process Control / Novel Patterning Technologies / Advances in Patterning Materials and Processes / Advanced Etch Technology and Process Integration for Nanopatterning","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences"},{"note":"\"In the 2027 program, these topics will include AI / ML, sustainability, stochastics, advanced packaging, and EPE/overlay.\" と記載。conference 横断で発表を束ねる仕組みです。","label":"2027 application tracks","value":"AI / ML、sustainability、stochastics、advanced packaging、EPE/overlay の 5 つ","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences"},{"note":"各 track の定義文(AI/ML、Sustainability、Stochastics、Advanced Packaging、EPE/Overlay)も同ページに掲載。","label":"application track の定義","value":"\"An application track is a grouping of presentations on a topic of interest across all conferences.\" 投稿時に該当すれば著者が選択する","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"high NA / low NA 露光系、EUV・BEUV 光源、mask blank と pellicle、SMO や stochastic control などが列挙されています。","label":"AL101 の対象範囲","value":"LITHOGRAPHY EQUIPMENT / SOURCES / MASKS / PATTERNING の 4 区分。\"covers EUV and Optical projection-based lithography systems, practices, and their applications in IC technology\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"OPC、RET、ILT、anamorphic high-NA EUV の stitching 影響、量子計算や TPU の応用まで含みます。","label":"AL102 の対象範囲","value":"Computational Patterning (EUV and DUV) / Deep Learning, Machine Learning, and AI Techniques / DTCO と STCO / DFM・DFY / Modeling, Simulation, and Computation","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/design-technology-co-optimization-and-computational-patterning"},{"note":"MEMS/NEMS、metasurface、display、量子計算デバイスなど IC 以外の応用も対象に含まれます。","label":"AL104 の対象範囲","value":"\"Direct Write or Maskless Lithography and Patterning Technologies\"(電子・イオンビーム、resistless e-beam or ion beam direct patterning、direct deposition (inkjet, local-area ALD)、scanning probe lithography 等)と \"Process Based Lithography and Patterning\"(directed self-assembly、nanoimprint lithography、selective deposition、colloidal self-assembly 等)の 2 区分","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/novel-patterning-technologies"},{"note":"Abstract Submission Guidelines の \"Only original material should be submitted\" に続く注記。","label":"明示された対象外(全体)","value":"\"Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"AL105 は化学的・物理的原理と化学構造の記述を著者に求めています。","label":"明示された対象外(AL105)","value":"\"Submissions which do not reveal sufficient chemical details to add value to the readers or are principally of a commercial nature may not be accepted for presentation and publication.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"}],"title":"対象領域・トラック構成・対象外","eyebrow":"scope"},"review":{"id":"review","body":"審査は conference chair/editor による技術的妥当性と内容適合性の評価で、口頭かポスターかの最終配置も chair の裁量です。extended abstract には著者名と所属を含めることが求められており、匿名化投稿の手順は公開されていません。採択率は公表されていないため、通過見込みは過去の proceedings の収録件数から間接的に見るほかありません。","facts":[{"note":"Review and program placement 節。","label":"選考主体","value":"\"To ensure a high-quality conference, all submissions will be assessed by the conference chair/editor for technical merit and suitability of content\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"同節。chair/editor と SPIE スタッフには内容不十分な論文を却下する権限があると明記。","label":"口頭/ポスターの決定","value":"\"Final placement in an oral or poster session is subject to chair discretion\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"conference detail ページの EXTENDED ABSTRACT REQUEST 欄の指示。","label":"匿名審査の有無","value":"extended abstract に \"Include author names and affiliations\" が要求されており、double-blind 等の匿名審査手順の記載はありません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"},{"note":"採択=掲載確定ではなく、原稿段階で再度の判断が入ります。掲載可否の決定は最終(final)と明記。","label":"発表後の掲載可否判断","value":"\"Conference chairs/editors or SPIE staff may require revision before approving publication and reserve the right to reject any manuscript or presentation that does not meet acceptable standards for a scientific publication\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"Abstract Submission Guidelines、Conferences、Program、Highlights の各ページに採択率の記載はありません。","label":"採択率","value":"公表されていません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"C. Grant Willson Best Paper Award の選考基準として記載。投稿審査そのものの基準ではありません。","label":"受賞審査の観点(AL105)","value":"\"Judging criteria include the technical originality, completeness, relevance, quality of oral presentation, and quality of proceedings manuscript.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"}],"title":"査読方式と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"2026-08-05 時点で、公式サイトが公開していない項目は次のとおりです。2027 の参加登録料と Early Bird 期限(Registration ページは \"2027 registration will open in November\" のみ)、2027 の plenary 登壇者とセッション名(Special Events ページは plenary・panel・poster session・networking の存在のみ)、short course の科目一覧(Courses ページは \"Full course program to come when registration opens in November 2026.\")、投稿の採択率、参加者数・発表件数・出展社数の統計(Highlights ページに記載なし)、会議本体を online で聴講できるかどうか、そして 2027 の受賞者一覧(Awards ページは告知のみ)です。発表規模を知りたい場合は proceedings volume ごとの \"Contents: N Sessions, N Papers, N Presentations\" を個別に見るしかありません。またイベントサイトは 2027 のヘッダーを掲げたまま 2026 サイクル向けに書かれた本文(招待文など)を残しており、年度が混ざりやすい構造になっています。symposium chair の所属表記もページ間で食い違うため、引用時はどのページの記載かを併記してください。","facts":[{"note":"Registration ページは \"2027 registration will open in November\"、Courses ページは \"Full course program to come when registration opens in November 2026.\" と記載。","label":"2027 の未公開項目","value":"参加登録料、Early Bird 期限、plenary 登壇者、short course の科目一覧","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/registration"},{"note":"同ページの 50 周年の記述も 2026 サイクルを指しています。","label":"年度が混ざる箇所","value":"Invitation ページはヘッダーが \"21 - 25 February 2027\" である一方、本文は \"SPIE Advanced Lithography + Patterning 2026 will cover...\" と 2026 サイクルを記述しています","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation"},{"note":"どちらも spie.org 上の公式ページ。引用時は出典ページを明示してください。","label":"公式表記の揺れ(chair 所属)","value":"Conferences ページでは John Robinson が Canon Nanotechnologies, Inc.、Eric Panning が GenChip。Invitation ページでは同じ 2 名が Diverdy Technologies, LLC. と SiClarity と表記されています","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences"},{"note":"年入りの表記があるページを一次情報として扱うのが安全です。","label":"abstract 締切表記の揺れ","value":"Conferences ページは \"submissions will be due 9 September\" と年を省いた表記。年を含む \"9 September 2026\" は Abstract Submission Guidelines と各 conference detail ページに記載されています","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"発表件数は proceedings volume ごとの \"Contents: N Sessions, N Papers, N Presentations\" で個別に確認する必要があります。","label":"統計値の非掲載","value":"Highlights ページには参加者数・発表件数・出展社数の統計は掲載されていません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/highlights"},{"note":"SPIE Digital Library の一覧ページは 2026-08-05 のアクセス時に bot 判定で内容を取得できませんでした。","label":"このページで扱わない範囲","value":"AL103(Metrology, Inspection, and Process Control XLI)と AL106(Advanced Etch Technology and Process Integration for Nanopatterning XVI)の詳細トピックと委員名簿、および SPIE Digital Library 側の全 volume 一覧","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/browse-call-for-papers"}],"title":"未公開項目と読み取り上の注意","eyebrow":"caveats"},"history":{"id":"history","body":"公式の招待文はこのシンポジウムを 1976 年以来のものと位置づけ、2026 サイクルを 50 周年としています。1976 年の SPIE proceedings Volume 0080 は \"Developments in Semiconductor Microlithography\" という会議名で刊行されており、現在の名称とは異なります。個々の conference にも独自の通番があり、AL101 は 1988 年開始の \"Optical/Laser Microlithography\" を前身として 2022 年に EUV Lithography conference と統合した経緯が明記されています。","facts":[{"note":"Invitation ページの原文。文中の \"This year\" は本文中で 2026 サイクルを指しています。\"premier conference\" は公式の表現をそのまま引用したものです。","label":"起点年の公式記述","value":"\"SPIE Advanced Lithography + Patterning symposium has been the premier conference on lithography and patterning in the semiconductor industry since 1976. This year marks our 50th anniversary\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation"},{"note":"当時の会議名は現在の名称とは異なります。収録論文には photomask、line width measurement、submicron X-ray lithography などが含まれます。","label":"1976 年の proceedings","value":"Proceedings Volume 0080 \"Developments in Semiconductor Microlithography\"、編者 James W. Giffin、Date Published: 20 September 1976、Contents: 1 Sessions, 26 Papers, 0 Presentations、Conference: Developments in Semiconductor Microlithography 1976","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/Publications/Proceedings/Volume/0080"},{"note":"AL101 の call for papers 冒頭。conference 単位の沿革として明記されています。","label":"AL101 の系譜","value":"\"the proceedings from this conference that began in 1988 as 'Optical/Laser Microlithography', and merged with the EUV Lithography conference in 2022\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"Novel Patterning Technologies だけはローマ数字ではなく年号表記です。DTCO は VI と 25th Anniversary が併記されています。","label":"conference 通番(2027)","value":"Optical and EUV Nanolithography XL / Advances in Patterning Materials and Processes XLIV / Metrology, Inspection, and Process Control XLI / Advanced Etch Technology and Process Integration for Nanopatterning XVI / DTCO and Computational Patterning VI: 25th Anniversary Conference / Novel Patterning Technologies 2027","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/browse-call-for-papers"},{"note":"Highlights ページの 2026 記述とイベントヘッダーの 2027 表記による。","label":"開催地ローテーション","value":"2026 サイクル・2027 サイクルとも San Jose, California, US。他都市への巡回に関する記載はありません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/highlights"}],"title":"沿革と節目","eyebrow":"history"},"program":{"id":"program","body":"本会議は 6 つの conference のセッションに加えて、plenary、panel、poster session、short course、展示で構成されます。2027 の plenary 登壇者と short course の科目一覧はまだ公開されておらず、short course の全容は 2026 年 11 月の登録開始時に出るとされています。展示は 2 日間で、出展社リストは投稿前の段階から公開されています。","facts":[{"note":"Invitation ページ本文(2026 サイクルについての記述)。","label":"plenary と panel","value":"\"symposium plenary session(s) where executives, innovators and thought leaders will share grand challenges, major inflection points, industry trends and technology roadmaps\" と \"panel sessions\" を実施","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation"},{"note":"2023 サイクルの special event ページ。2027 の plenary 登壇者は未公開です。","label":"plenary の実施例(2023)","value":"2023 年 2 月 28 日の Tuesday Morning Plenary(Convention Center, Ballroom 220A)では Vivek Singh(NVIDIA)\"Accelerated computing for silicon leadership\"、Bernard Kress(Google)\"Pushing the limits of nano-imprint lithography for immersive displays\" が登壇し、Introduction of New SPIE Fellows も行われました","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/advanced-lithography/event/tuesday-morning-plenary/2662425"},{"note":"講師公募も行われており、\"Proposals for Advanced Lithography + Patterning are due 1 September 2026.\" と記載。","label":"short course","value":"\"SPIE will offer short courses at Advanced Lithography + Patterning.\" 対象トピックは optical and EUV lithography、patterning technologies、metrology、atomic layer etching、microlithography、photoresist processing など。\"Full course program to come when registration opens in November 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/courses"},{"note":"2026-08-05 時点。","label":"2027 special events の公開状況","value":"Special Events ページには plenary・panel・poster session・networking events の存在のみが記載され、個別のセッション名や登壇者は掲載されていません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/special-events"},{"note":"セッション構成の実例は proceedings volume の目次で確認できます。","label":"joint session と student session","value":"conference 間の joint session が設けられる旨が Invitation に記載。2026 の Volume 13979 目次には \"Student Session\"、\"Special Session: Future of EUV\"、\"Joint Session with 13979 and 13980\" が含まれます","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/Publications/Proceedings/Volume/13979"},{"note":"いずれも SPIE Patterning Materials conference committee が候補推薦と選定を行うと記載。invited keynote は Willson Award の対象外。","label":"AL105 の表彰","value":"C. Grant Willson Best Paper Award in Patterning Materials and Processes(前年の最優秀口頭発表、$1,000 USD)、Jeffrey Byers Best Poster Award(前年の最優秀ポスター、$1000 USD)、Hiroshi Ito Student Award(前年の最優秀学生発表、$1,000 USD)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"},{"note":"2026-08-05 時点。","label":"表彰イベントの公開状況","value":"Awards ページは \"Set aside time to see the winners of several annual awards\" と記すのみで、2027 の受賞者や賞名の一覧は掲載されていません","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/special-events/award-events"}],"title":"プログラム構成と併設イベント","eyebrow":"program"},"audience":{"id":"audience","body":"学生は grant で登録費と旅費の一部を賄える設計になっており、abstract 提出が award 選考の前提になります。企業側は 2 月の会期に向けて 9 月の abstract 締切を起点にスケジュールを引く形です。日本から渡航する場合、SPIE は visa 申請を 3〜4 か月前に始めるよう案内しており、招待状は SPIE アカウントからの申請制です。","facts":[{"note":"領収書を保管しないと精算されないと明記。応募には proceedings への manuscript 提出が要件に含まれます。","label":"学生 grant の内容","value":"\"Student grants cover the full cost of admission plus up to $500 for an onsite course.\" 旅費は US students が最大 $500、international students が最大 $1,000 の実費精算","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/for-students"},{"note":"Student Opportunities ページの \"Upcoming deadlines for 2027\"。","label":"2027 学生関連の締切","value":"9 September: Submit an abstract to be considered for an award / 1 November: Nick Cobb Scholarship application / 29 November: Deadline for Student grant application / 7 December: Company deadline to sponsor a Student Grant","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/for-students"},{"note":"advanced lithography 関連分野の大学院生が対象と記載。","label":"Nick Cobb Memorial Scholarship","value":"大学院生 1 名に $10,000、渡航支援は Siemens EDA が負担。\"The 2027 scholarship application opens 1 September 2026.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/for-students"},{"note":"Courses ページ。会議登録料そのものの金額は 2027 分が未公開です。","label":"short course の割引","value":"\"SPIE Members receive 15% off\" / \"SPIE Student Members receive 35% off\"、Early Bird 期限内の登録でさらに 15% 追加割引","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/courses"},{"note":"SPIE は大使館・領事館への個別照会は行わないと明記。出展者用の申請フォームは別に用意されています。","label":"渡航・visa の案内","value":"\"SPIE strongly encourages travelers to apply for their visas as early as possible — at least three to four months before the visa is needed\"。招待状は SPIE アカウントにサインインして Invitation Letter Request Form から申請","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/visa-information"},{"note":"Abstract Submission Guidelines の該当節。","label":"18 歳未満の学生著者の要件","value":"指導教員またはメンターによる事前承認と共著者としての記載、開催 8 週間前までの保護者同意書提出、会期中の同伴が必須","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"}],"title":"研究室・企業からの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"公式サイト上の名称は SPIE Advanced Lithography + Patterning で、SPIE が運営するイベントページに置かれています。単一の会議ではなく 6 つの conference を束ねた symposium 形式で、conference ごとに chair と program committee が独立して置かれます。投稿先を選ぶときは「SPIE ALP に出す」ではなく「AL101〜AL106 のどれに出すか」で考える必要があります。","facts":[{"note":"イベント公式トップページの見出し表記。","label":"正式名称","value":"SPIE Advanced Lithography + Patterning","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"},{"note":"共催・技術協賛団体の記載は、確認した公式ページにはありません。","label":"主催","value":"SPIE(ページフッターに \"© 2026 SPIE\"、招待文で \"SPIE Advanced Lithography + Patterning symposium\" と表記)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation"},{"note":"Program ページの本文。","label":"開催頻度","value":"毎年開催(\"Each year this important community comes together to share and discuss current research\")","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program"},{"note":"call for papers 一覧に \"6 results found\" と表示され、AL101 Optical and EUV Nanolithography XL / AL102 DTCO and Computational Patterning VI: 25th Anniversary Conference / AL103 Metrology, Inspection, and Process Control XLI / AL104 Novel Patterning Technologies 2027 / AL105 Advances in Patterning Materials and Processes XLIV / AL106 Advanced Etch Technology and Process Integration for Nanopatterning XVI が並びます。","label":"構成単位","value":"6 つの conference(AL101〜AL106)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/browse-call-for-papers"},{"note":"Conferences ページの \"2027 Symposium Chairs\" 欄。役職表記は Symposium Chair と Symposium Co-chair。","label":"2027 Symposium Chairs","value":"John Robinson, Canon Nanotechnologies, Inc. (United States) / Eric Panning, GenChip (United States)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences"},{"note":"イベントトップページに掲載。","label":"公式ハッシュタグ","value":"#SPIElitho","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"}],"title":"正式名称と主催","eyebrow":"identity"},"community":{"id":"community","body":"conference ごとに chair・co-chair と program committee が置かれ、所属は装置・材料・デバイスメーカーと研究機関が混在します。AL101 の committee は米国所属が過半で、日本・韓国・欧州の所属が続きます。展示社リストは 2027 分がすでに公開されていますが、これは出展の事実を示すもので、取引関係や共同研究を示すものではありません。","facts":[{"note":"AL101 の Chairs and Committees。","label":"AL101 の chair 構成","value":"Conference Chair: Claire van Lare(ASML Netherlands B.V., Netherlands)/ Conference Co-Chair: Iacopo Mochi(Paul Scherrer Institut, Switzerland)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"同ページの委員一覧を数えた結果。","label":"AL101 の program committee 規模","value":"Program Committee として 36 名を掲載(chair・co-chair を含めて 38 名)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"公式ページに印字された所属機関の所在国表記の内訳であり、個人の国籍ではありません。","label":"AL101 委員の所属国内訳","value":"United States 22、Japan 5、Korea, Republic of 3、Belgium 3、Germany 3、Netherlands 1、Switzerland 1(合計 38)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"所属表記は公式ページの記載どおり。","label":"AL101 委員のうち日本所属","value":"Naoya Hayashi(Dai Nippon Printing Co., Ltd., Japan)、Soichi Inoue(KIOXIA Corp., Japan)、Ken-Ichiro Mori(Canon Inc., Japan)、Yoji Watanabe(Nikon Corp., Japan)、Akiyoshi Suzuki(Consultant, Japan)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"産業界(ASML、KLA、Intel、IBM、KIOXIA、JSR Micro、EV Group 等)と大学・公的機関(University of New Mexico、NIST、TU Ilmenau、LBNL、Syracuse University 等)が混在します。","label":"AL104 の chair と委員の所在国","value":"Chair: Richard A. Farrell(Meta, United States)/ Co-Chair: Laurent Pain(CEA-LETI, France)。program committee の所属は United States、Netherlands、Germany、Japan、Austria、Switzerland に分布","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/novel-patterning-technologies"},{"note":"出展社リストは出展・支援の事実を示すもので、顧客関係・売上・採用・共同研究を示すものではありません。会期までに増減する可能性があります。","label":"2027 出展社の掲載件数","value":"\"44 results found.\"(2026-08-05 時点の出展社リスト)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/exhibition/exhibitors"},{"note":"所在地表記は出展社リストの記載どおり。出展の事実のみを示します。","label":"2027 出展社のうち日本関連の掲載例","value":"LINTEC Corp.(Bunkyo-Ku, Tokyo, Japan)、Mitsui Chemicals America, Inc.、NTT Advanced Technology Corp.、JSR Micro, Inc.、Shin-Etsu MicroSi, Inc.、Canon U.S.A., Inc.、JEOL USA Inc.、HORIBA Instruments Inc.","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/exhibition/exhibitors"},{"note":"SPIE の協会賞ページ。このページには本シンポジウムでの授与に関する記載はありません。","label":"分野の SPIE 協会賞","value":"SPIE Frits Zernike Award for Microlithography(honorarium $2,000)。2026 recipient は Andreas Erdmann、過去受賞者に Akiyoshi Suzuki(2019)、Burn Lin(2004)、C. Grant Willson(2005)などが掲載","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/about-spie/awards-programs/awards-listing/spie-frits-zernike-award-for-microlithography"}],"title":"委員会構成と参加組織","eyebrow":"community"},"comparison":{"id":"comparison","body":"SPIE 内でも photomask と EUVL に特化した別イベントが独立して運営されており、開催時期・場所・conference 構成が異なります。ALP は 2 月・San Jose・6 conference、Photomask Technology + EUV Lithography は 9 月・Monterey・2 conference です。mask 単体の話題はどちらでも扱われるため、投稿先は締切と会期から逆算して選ぶことになります。","facts":[{"note":"ALP とは別のイベントページを持つ SPIE の年次イベントです。","label":"SPIE Photomask Technology + Extreme Ultraviolet Lithography(2026)","value":"Conferences: 8–11 September 2026 / Exhibition: 9–10 September 2026 / Courses: 9 September 2026、Monterey, California, US。conference は Photomask Technology conference と EUV Lithography conference の 2 つ","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/photomask-technology-and-extreme-ultraviolet-lithography"},{"note":"mask のテーマは ALP でも正面から扱われます。","label":"ALP 側の mask 取り扱い","value":"AL101 の MASKS 区分に \"optical, EUV, and EUV mask substrates and blanks, including absorber materials and patterning; patterned and blank mask inspection...; pellicle development and platform integration; mask writing tools and techniques\" が含まれます","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"},{"note":"Invitation ページの原文。","label":"ALP のカバー範囲の自己記述","value":"\"SPIE Advanced Lithography + Patterning covers the entire value-chain in semiconductor lithography and patterning, including circuit design, materials, masks, lithography and etch tools, processes, computational lithography, metrology, testing and yield improvement as well as emerging fields of novel patterning, artificial intelligence..., augmented reality and virtual reality (AR/VR), and sustainability.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/attend/invitation"}],"title":"近い SPIE イベントとの棲み分け","eyebrow":"comparison"},"submission":{"id":"submission","body":"投稿は abstract ベースで、審査用 abstract(200〜300 words)、プログラム掲載用サマリ(50〜150 words)、講演者略歴(1000 文字以内)、2 ページ以内の extended abstract PDF を揃えます。extended abstract は審査専用で公開されません。採択後は manuscript の提出が義務で、AL102 では最低 2 ページと明記されています。締切は 2027 サイクルで abstract が 2026 年 9 月 9 日、manuscript が 2027 年 2 月 3 日です。","facts":[{"note":"Important dates 表。AL101・AL102・AL104・AL105 の各 conference detail ページにも同じ日付が表示されます。","label":"2027 abstract 締切","value":"Abstracts due: 9 September 2026","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"同じ日にプログラムがオンライン公開されます。","label":"2027 採否通知","value":"Authors notified and program posts online: 16 November 2026","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"manuscript アップロードには contact author か speaker の登録が先に必要、slide は期限後は onsite の Speaker Check-In でのアップロードになると注記されています。","label":"2027 manuscript / poster / slide 締切","value":"Submission system opens for manuscripts and poster PDFs: 21 December 2026 / Poster PDFs due: 27 January 2027 / All manuscripts due: 3 February 2027 / Advance upload deadline for oral presentation slides: 19 February 2027","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"extended abstract には著者名と所属、本文、図表、審査に足るデータを含めることが求められます。","label":"投稿時の必要項目","value":"Presentation title / Author(s) information / Speaker biography (1000-character max including spaces) / Abstract for technical review (200-300 words; text only) / Summary of abstract for display in the program (50-150 words; text only) / Extended abstract PDF (two pages maximum) / Keywords(任意)","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"各 conference detail ページの EXTENDED ABSTRACT REQUEST 欄。abstract 投稿ウィザードの step 7 で提出します。","label":"extended abstract の扱い","value":"\"Extended abstracts will be used only for the purpose of review and will not be published.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/design-technology-co-optimization-and-computational-patterning"},{"note":"同一 abstract の複数 conference への重複投稿は認められていません。","label":"投稿先の選び方","value":"\"Choose one conference that most closely matches your abstract topic. You may submit more than one abstract, but submit each only once\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"AL102 の call for papers 本文。symposium 全体に共通する最大ページ数の指定は、確認したページにはありません。","label":"manuscript の分量(AL102)","value":"\"Authors agree to the requirement of a manuscript submission, minimum 2-page, before the conference.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/AL27/conferencedetails/design-technology-co-optimization-and-computational-patterning"},{"note":"post-deadline を受け付けるかは conference ごとの判断で、個別ページを見るよう案内されています。","label":"締切後の投稿","value":"\"Submissions are subject to review and approval by conference chairs/committee and must be received by the deadline for priority placement. Some conferences may consider post-deadline abstracts.\"","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"}],"title":"投稿区分・書式・締切","eyebrow":"submission"},"publication":{"id":"publication","body":"発表内容は Proceedings of SPIE として SPIE Digital Library に収録されます。conference ごとに volume 番号が付き、2026 サイクルの AL101 相当は Volume 13979、AL104 相当は Volume 13982 でした。口頭発表の録画とポスター PDF も収録対象で、著作権は著者に残り SPIE にはライセンスを付与する形です。","facts":[{"note":"投稿同意事項に \"They will submit a manuscript by the advertised due date for publication in the conference proceedings in the SPIE Digital Library\" と明記。","label":"掲載先","value":"conference proceedings in the SPIE Digital Library","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"\"SPIE partners with relevant scientific databases and indexes...\" の列挙。IEEE Xplore への収録の記載はありません。","label":"収録データベース","value":"Astrophysical Data System (ADS)、Ei Compendex、CrossRef、Google Scholar、Inspec、Scopus、Web of Science","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines"},{"note":"SPIE の Proceedings volume ページの Volume Details 欄。","label":"2026 volume の例(AL101 系)","value":"Proceedings Volume 13979 \"Optical and EUV Nanolithography XXXIX\"、編者 Claire van Lare, Iacopo Mochi、Date Published: 30 April 2026、Contents: 17 Sessions, 60 Papers, 57 Presentations、Conference: SPIE Advanced Lithography + Patterning 2026","checkedAt":"2026-08-05","sourceUrl":"https://spie.org/Publications/Proceedings/Volume/13979"},{"note":"同じく Volume Details 欄。会期(2 月)から約 2 か月後に公開されています。","label":"2026 volume の例(AL104 系)","value":"Proceedings Volume 13982 \"Novel Patterning Technologies 2026\"、編者 Ricardo Ruiz, Richard A. 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Conference AL105 です。2027年のシンポジウムは2月21〜25日に San Jose で開かれます。","question":"Advances in Patterning Materials and Processes はどの会議の一部ですか？","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences","https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"]},{"answer":"化学的・物理的原理と十分な化学構造の記述が必須です。読者に価値を与える化学的詳細を欠く投稿や主に商業的な投稿は採択されないことがあります。","question":"材料の化学構造はどこまで書く必要がありますか？","sourceUrls":["https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"]},{"answer":"対象です。PFAS/PFOS フリー材料と規制対応のロードマップが募集トピックに挙がっています。","question":"PFAS 規制に関する研究も対象ですか？","sourceUrls":["https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"]},{"answer":"C. Grant Willson Best Paper Award、Jeffrey Byers Best Poster Award、Hiroshi Ito Student Award の3つです。Willson 賞は前年の口頭発表、Byers 賞は前年のポスターが対象です。","question":"どんな賞がありますか？","sourceUrls":["https://spie.org/AL27/conferencedetails/advances-in-patterning-materials-and-processes"]},{"answer":"発表と原稿は SPIE Digital Library の Conference Proceedings に掲載され、会期後に正式公開されます。過去年の proceedings も SPIE Digital Library で読めます。","question":"論文はどこで読めますか？","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"]}],"headline":"2027年版は Advances in Patterning Materials and Processes XLIV（AL105）として San Jose で開かれ、投稿には化学的・物理的原理と化学構造の説明が求められます。","metaDescription":"SPIE Advanced Lithography + Patterning 内の Advances in Patterning Materials and Processes XLIV（AL105）。EUV 材料、現像技術、DSA、PFAS/PFOS フリー材料などの募集トピック、化学構造の開示要件、2027年の締切と3つの賞をまとめます。","oneLine":"Advances in Patterning Materials and Processes は、SPIE Advanced Lithography + Patterning の中でフォトレジストとパターニング材料・プロセスの化学、物理、性能を対象にする conference です。","pageTitle":"SPIE Advances in Patterning Materials and Processesとは｜レジスト材料の会議","relatedConferenceIds":["spie-alp","spie-optical-euv","spie-advanced-etch","spie-photomask-euv","eipbn"],"sections":{"cycle":{"id":"cycle","body":"2027年は SPIE Advanced Lithography + Patterning の一部として2月21〜25日に San Jose（California, US）で開かれます。米国外からの渡航者には招へい状の早期申請が案内されています。参加登録は2026年11月に始まります。","facts":[{"note":"SPIE Advanced Lithography + Patterning 2027 の会期","label":"2027 会期","value":"2027-02-21〜25 / San Jose, California, US","checkedAt":"2026-10-08","sourceUrl":"https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences"},{"label":"2027 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ですか？","sourceUrls":["https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"]},{"answer":"学生の投稿は ASML Best Student Paper の対象になり、盾と賞金が贈られます。旅費助成と Nick Cobb Memorial Scholarship への応募も案内されています。","question":"学生向けの賞はありますか？","sourceUrls":["https://spie.org/AL27/conferencedetails/optical-and-euv-nanolithography"]},{"answer":"発表と原稿は SPIE Digital Library の Conference Proceedings に掲載され、会期後に正式公開されます。過去年の proceedings も SPIE Digital Library で読めます。","question":"論文はどこで読めますか？","sourceUrls":["https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/program/conferences","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning/presenters/abstract-submission-guidelines","https://spie.org/conferences-and-exhibitions/advanced-lithography-and-patterning"]}],"headline":"2027年版は Optical and EUV Nanolithography XL（Conference AL101）として San Jose で開かれ、アブストラクト締切は2026年9月9日です。","metaDescription":"SPIE Advanced Lithography + Patterning 内の Optical and 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Partners","organizationUrl":null,"organizationSlug":"micron","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"マイクロン・テクノロジー","canonicalName":"マイクロン・テクノロジー","canonicalOrganizationSlug":"micron","canonicalCompanyId":null},{"name":"Racyics GmbH","note":"Official sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"cx-c097db704c","eventYear":2026,"sourceUrl":"https://www.date-conference.com/sponsors","commonKind":"company","commonName":"Racyics","sourceLabel":"DATE 2026: Sponsors and Promotion Partners","organizationUrl":null,"organizationSlug":"racyics","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"Racyics","canonicalName":"Racyics","canonicalOrganizationSlug":"cx-c097db704c","canonicalCompanyId":null},{"name":"Real Intent Inc.","note":"Official sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"cx-183083e3fa","eventYear":2026,"sourceUrl":"https://www.date-conference.com/sponsors","commonKind":"company","commonName":"Real Intent","sourceLabel":"DATE 2026: Sponsors and Promotion Partners","organizationUrl":null,"organizationSlug":"real-intent","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"Real Intent","canonicalName":"Real Intent","canonicalOrganizationSlug":"cx-183083e3fa","canonicalCompanyId":null},{"name":"STMicroelectronics","note":"Official sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"stmicroelectronics","eventYear":2026,"sourceUrl":"https://www.date-conference.com/sponsors","commonKind":"company","commonName":"STマイクロエレクトロニクス","sourceLabel":"DATE 2026: Sponsors and Promotion Partners","organizationUrl":null,"organizationSlug":"stmicroelectronics","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"STマイクロエレクトロニクス","canonicalName":"STマイクロエレクトロニクス","canonicalOrganizationSlug":"stmicroelectronics","canonicalCompanyId":null},{"name":"Tenstorrent","note":"Official sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"cx-c6ac568525","eventYear":2026,"sourceUrl":"https://www.date-conference.com/sponsors","commonKind":"company","commonName":"Tenstorrent","sourceLabel":"DATE 2026: Sponsors and Promotion Partners","organizationUrl":null,"organizationSlug":"tenstorrent","organizationType":"company","companyLinkStatus":"unmatched","companyLinkConfidence":null,"displayName":"Tenstorrent","canonicalName":"Tenstorrent","canonicalOrganizationSlug":"cx-c6ac568525","canonicalCompanyId":null},{"name":"University of Verona","note":"Official sponsor listing only; not evidence of customer, purchasing, hiring, or revenue relationship.","role":"conference_sponsor","tier":null,"company":null,"checkedAt":"2026-06-11","commonKey":"ix-2ba3fc1fed","eventYear":2026,"sourceUrl":"https://www.date-conference.com/sponsors","commonKind":"institution","commonName":"University of Verona","sourceLabel":"DATE 2026: Sponsors and Promotion Partners","organizationUrl":null,"organizationSlug":"university-of-verona","organizationType":"academic_institution","companyLinkStatus":"non_company","companyLinkConfidence":null,"displayName":"University of Verona","canonicalName":"University of Verona","canonicalOrganizationSlug":"ix-2ba3fc1fed","canonicalCompanyId":null}],"conferenceResearchDossierV1":{"checkedAt":"2026-08-05","conferenceId":"date","confidenceScore":1,"coverage":{"faqCount":8,"factCount":86,"topicCount":8,"sourceCount":24,"sectionCount":12,"sectionTotal":12,"droppedFactCount":0,"missingSectionIds":[],"requiredSectionCount":7,"requiredSectionTotal":7},"dossierVersion":"conference-research-dossier-v1","faq":[{"answer":"現行サイクルのDATE 2027は2027年3月22〜24日、ドイツのDresdenで開催されます。会場はVenueページに「ICD | International Congress Center Dresden, Ostra-Ufer 2, 01067 Dresden, Germany」と記載されています。直前のサイクルは2026年4月20〜22日のVerona（Italy、date26サイト）、その前は2025年3月31日〜4月2日のLyon（France、date25サイト）でした。開催地の推移を一覧にした公式ページはなく、年ごとにサイトが分かれています。","question":"DATEはいつ、どこで開催されますか。","sourceUrls":["https://www.date-conference.com/","https://www.date-conference.com/venue","https://date26.date-conference.com/","https://date25.date-conference.com/"]},{"answer":"研究論文はまずタイトル・アブストラクト・共著者の登録を2026年9月13日AoEまでに行い、本文（final paper）を2026年9月20日AoEまでに提出します。本文の締切は「firm deadline」と記載されています。採否通知は2026年11月23日AoE、camera-readyは2026年12月16日AoEです。Late Breaking Resultsは本文2026年11月29日AoE、Focus Sessions・Embedded Tutorials・Workshopsのproposalは2026年10月18日AoEと、区分ごとに締切が異なります。","question":"2027年の投稿締切はいつですか。","sourceUrls":["https://www.date-conference.com/date-2027-call-papers","https://www.date-conference.com/call-for-papers"]},{"answer":"あります。Call for Papersに「DATE follows a double-blind review process. To support it, submissions must not include authors' names and acknowledgements to their projects.」と明記されています。審査観点は「suitability for the conference, originality and technical soundness」で、実験結果に支えられた完結した研究であることが求められます。書式規定に従わない原稿は査読なしでrejectされ得るとも書かれています。","question":"査読はありますか。double-blindですか。","sourceUrls":["https://www.date-conference.com/call-for-papers"]},{"answer":"公表されていません。Call for Papersにも投稿数・採択数・採択率の記載はなく、DATE 2026のawardsページにも投稿統計は掲載されていません。採択率を数値で示す資料は公式側に見当たらないため、他所の推計値を公式情報として扱わないでください。","question":"採択率は公表されていますか。","sourceUrls":["https://www.date-conference.com/call-for-papers","https://date26.date-conference.com/awards"]},{"answer":"Call for Papersには「Accepted papers will be published in the conference proceedings and will be presented in technical sessions at the conference.」とあります。公開ポリシーは公式アーカイブのproceedingsページに「All DATE Proceedings will also be publically available two years after DATE!」と書かれており、実際に1998〜2014年、2015年、2016年、2017年分が公開扱いで掲載されています。公開待ちの巻については同ページが「Meanwhile you will find current proceedings at IEEE Xplore Digital Library or ACM Digital Library!」と案内しています。直近サイクルの本文は参加登録者向けのログイン配布で、DATE 2026は2026年5月末までのダウンロード期間が案内されていました。","question":"採択された論文はどこに載りますか。あとから読めますか。","sourceUrls":["https://past.date-conference.com/proceedings","https://date26.date-conference.com/proceedings/download","https://www.date-conference.com/call-for-papers"]},{"answer":"DECページには2027年のGeneral Chair（Robert Wille, Technical University Munich, DE）、Programme Chair（Lukas Sekanina, Brno University of Technology, CZ）など、大学・公的研究機関所属のchairが並びます。TPCページはトラック→トピック→トピックchair→memberの階層で氏名と所属を公開しており、D1トピックにはUniversity of Toronto（CA）、National University of Singapore（SG）、NVIDIA（US）、Indian Institute of Technology Guwahati（IN）などが含まれます。ここでの国表記は公式プログラム上の所属地であり、個人の国籍ではありません。","question":"どんな人が投稿し、誰が査読していますか。","sourceUrls":["https://www.date-conference.com/dec","https://www.date-conference.com/tpc"]},{"answer":"2027サイクルの参加登録費は公開されていません。Registrationページはログインフォームと会期表記のみで、料金区分も金額も掲載されていません。ただしCall for Papersには「each paper shall be accompanied by at least one full conference registration at the paper author rate」とあり、採択論文ごとにauthor rateでの参加登録が1件必要である点だけは確認できます。","question":"参加費はいくらですか。","sourceUrls":["https://www.date-conference.com/registration","https://www.date-conference.com/call-for-papers"]},{"answer":"できません。Call for Papersに「DATE is a conference held exclusively in person.」と明記され、採択論文については「it is mandatory that at least one author of each accepted paper attends the session where the paper is discussed」とされています。参加者の国や地域に関する制限は公式ページに記載がありません。学生については Young People Programme のページに「students may apply for free student registration and for travel grants」とあり、旅費補助は実費の証明に基づく事後払いで「the grant may not cover the full cost of your trip」と但し書きが付いています。枠数と金額は公表されていません。","question":"日本から参加する場合、オンライン聴講や遠隔発表はできますか。","sourceUrls":["https://www.date-conference.com/call-for-papers","https://www.date-conference.com/ypp"]}],"headline":"公式サイト（2027サイクル）、Call for Papers、委員会ページ、過去サイクルのサブドメイン、公式アーカイブを直接読み、会期・トラック・締切・査読方式・proceedings公開条件を確認できる形で並べました。","metaDescription":"DATE（Design, Automation and Test in Europe Conference）の2027年会期と会場、D/A/T/Eの4トラック、double-blind査読、投稿締切、proceedings公開条件を公式サイトの記載だけで整理しました。","oneLine":"DATEは Design, Automation and Test in Europe Conference の略称で、公式サイトが「The European Event for Electronic System Design & Test」と掲げる電子システム設計・テストの国際会議です。","pageTitle":"DATEとは｜Design, Automation and Test in Europeの会期・投稿締切・査読を公式情報で確認","relatedConferenceIds":["dac","iccad","asp-dac","islped","itc","codes-isss"],"sections":{"cycle":{"id":"cycle","body":"2026年8月5日時点で www.date-conference.com が表示しているのは2027サイクルで、会期は2027年3月22〜24日、開催地はドイツのDresdenです。会場はVenueページに「ICD | International Congress Center Dresden, Ostra-Ufer 2, 01067 Dresden, Germany」と記載されています。開催形式についてはCall for Papersに「DATE is a conference held exclusively in person.」と明記されており、オンライン参加を前提にした運用ではありません。2027年の参加登録費とセッション一覧は本日時点で未掲載のため、費用を見積もる場合は公開を待つ必要があります。","facts":[{"note":"公式トップページのヘッダー表記。","label":"2027 会期","value":"22 - 24 March 2027","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/"},{"note":"トップページおよびVenueページで一致。","label":"2027 開催都市・国","value":"Dresden, Germany","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/"},{"note":"Venueページの会場名・住所欄。","label":"2027 会場","value":"ICD | International Congress Center Dresden（Ostra-Ufer 2, 01067 Dresden, Germany）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/venue"},{"note":"Call for Papersの参加義務条項に記載。オンライン開催・hybrid開催の記載はない。","label":"開催形式","value":"「DATE is a conference held exclusively in person.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"DATE 2026サイト（date26サブドメイン）に残る表記。","label":"2026 会期・会場","value":"20 - 22 April 2026、Palazzo della Gran Guardia, Piazza Brà, 37121 Verona, Italy","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/"},{"note":"DATE 2025サイト（date25サブドメイン）に残る表記。","label":"2025 会期・会場","value":"31 March - 2 April 2025、Centre de Congrès de Lyon (CCC Lyon), 50 Quai Charles de Gaulle, 69006 Lyon, France","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/"},{"note":"Registrationページはログインフォームと会期表記のみで、料金区分・金額の掲載がない。","label":"2027 参加登録費","value":"未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/registration"}],"title":"現行サイクル（2027 Dresden）と直近サイクル","eyebrow":"cycle"},"scope":{"id":"scope","body":"DATEは自らを「The main European event bringing together designers and design automation users, researchers and vendors as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems.」と説明しています。技術的な範囲は、TPCページに並ぶトラックとトピック番号を見るのが最も確実です。2027サイクルのTPCページでは、Design Methods and Tools（D）にD1〜D16の16トピック、Application Design（A）にA1〜A6の6トピック、Test and Dependability（T）にT1〜T3とDT4〜DT6、Embedded Systems Design（E）にE1〜E5が並んでいます。DT4〜DT6のようにDとTの双方に掲載されるトピック番号が設けられており、設計とテストを分断せずに扱う構成であることがトピック名から読み取れます。","facts":[{"note":"DATE 2026 Call for Papersの冒頭説明。","label":"会議の対象範囲（公式文）","value":"「The main European event bringing together designers and design automation users, researchers and vendors as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems.」","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/date-2026-call-papers"},{"note":"TPCページのトラック見出しとトピック番号。","label":"Track D（2027 TPC）","value":"Design Methods and Tools（D1〜D16の16トピック）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"TPCページのトラック見出しとトピック番号。","label":"Track A（2027 TPC）","value":"Application Design（A1〜A6の6トピック）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"TPCページのトラック見出しとトピック番号。","label":"Track T（2027 TPC）","value":"Test and Dependability（T1〜T3に加え、DT4〜DT6が同トラックにも掲載）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"TPCページのトラック見出しとトピック番号。","label":"Track E（2027 TPC）","value":"Embedded Systems Design（E1〜E5の5トピック）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"TPCページに印字されたトピック見出しをそのまま引用。","label":"D-trackトピック名（抜粋）","value":"「D3 Formal methods and verification」「D9 Low-power, energy-efficient and thermal-aware design」「D14 Emerging design technologies for future computing」「D16 Design Automation for Quantum Computing」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"DトラックとTトラックの双方の番号列にDTを冠したトピックが置かれている。","label":"設計とテストにまたがるトピック","value":"「DT4 Design and test for analogue and mixed-signal circuits and systems, and MEMS」「DT5 Design and test of hardware security primitives」「DT6 Design and test of secure systems」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"技術領域としての対象外リストは掲載されていない。除外規定は投稿状態に関するもの。","label":"明示された対象外","value":"他会議・他ジャーナルとの同時投稿は不可（「No Double Submissions: Submissions simultaneously under review or accepted by another conference, symposium, or journal will be rejected.」）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"}],"title":"対象領域とD/A/T/Eの4トラック","eyebrow":"scope"},"review":{"id":"review","body":"DATEはdouble-blind査読を明記しており、原稿に著者名・所属だけでなくプロジェクトへの謝辞も入れないよう求めています。プレプリントの扱いも明文化されていて、arXiv等での公開は採否通知の後に限られます。審査観点は「suitability for the conference, originality and technical soundness」と書かれ、実験結果に裏づけられた完結した研究であることが求められます。採択率は公式ページに数値が出ていないため、投稿の難易度を数字で示す資料としては使えません。","facts":[{"note":"同欄に「Manuscripts should not include authors' names nor affiliations.」も併記。","label":"査読方式","value":"「DATE follows a double-blind review process. To support it, submissions must not include authors' names and acknowledgements to their projects.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"同段落に「The Technical Programme Committee reserves the right to recommend that a submission be reorganised as an extended abstract.」が続く。","label":"審査観点","value":"「All papers will be evaluated with regard to their suitability for the conference, originality and technical soundness.」／「All submissions require novel and complete research work supported by experimental results.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"ページ数・書式規定の直後に置かれた注意書き。","label":"書式不備の扱い","value":"「Manuscripts NOT following the guidelines above may be rejected without review.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"double-blindを維持するための条件として記載。","label":"プレプリント公開の条件","value":"「Submissions can be made available as pre-prints (e.g., on arXiv) only AFTER the authors are notified of whether their manuscript is accepted or rejected.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"Call for Papersにも投稿統計や採択率の記載はない。","label":"採択率","value":"公式ページに数値の掲載なし","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"例としてD1（System-level design methodologies and high-level synthesis）はchairが Benjamin Carrion Schaefer, The University of Texas at Dallas, US、memberに Jason H. Anderson, University of Toronto, CA／Yao Chen, National University of Singapore, SG などが列挙されている。","label":"査読体制の可視性","value":"TPCページにトラック→トピック→トピックchair→memberの階層で氏名と所属が公開されている","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/tpc"},{"note":"査読者を表彰する運用が公式ページで確認できる。","label":"Outstanding Reviewer Award（2026サイクル）","value":"2026サイクルのawardsページにD／A／T／E各トラックのOutstanding Reviewer Awardが受賞者名つきで掲載されている","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/awards"}],"title":"査読方式と審査観点","eyebrow":"review"},"caveats":{"id":"caveats","body":"DATEの公式サイトは最新サイクルをwww.date-conference.comに置き、過去サイクルはdate26・date25などのサブドメインへ移す運用です。そのため同じパス（/call-for-papers、/dec、/registration）でも表示される年が変わります。本ページのfactsは年をラベルに明記していますが、公式ページを再確認する際はサブドメインを合わせてください。公式ページに掲載がないものとして本日時点で確認できたのは、採択率および投稿数・採択数などの投稿統計（Call for Papersにもawardsページにも記載なし）、2027サイクルの参加登録費と料金区分（Registrationページはログインフォームのみ）、2027サイクルのセッション一覧とタイムテーブル（Programme Overviewも同じくログインフォームのみ）、ジャーナル特集号への招待の有無、2027サイクルの回次（第何回か）、初回開催や名称変更を含む沿革の説明、そして2019年以外の年の参加登録者数です。また、アーカイブ側proceedingsページに残る会場WLAN／WHOVAアプリでの閲覧手順はDATE 2019当時の案内で、現行サイクル向けに更新された記載は見当たりません。これらを数値や事実として引用する場合、公式以外の出典に頼ることになる点に注意してください。","facts":[{"note":"同じパスでも参照するホストで年が変わるため、再確認時はサブドメインを合わせる必要がある。","label":"サイト構造による年の切り替わり（www）","value":"www.date-conference.com のトップは2027サイクル（22 - 24 March 2027 | Dresden, Germany）を表示している","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/"},{"note":"keynotes・programme・awards・dec・proceedings/download の各ページも本日時点で参照できた。","label":"2026サイクルの参照先","value":"date26.date-conference.com が DATE 2026（20 - 22 April 2026, Verona, Italy）を保持","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/"},{"note":"Registrationページはログインフォームのみで、料金区分・金額の記載がない。","label":"2027 参加登録費","value":"未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/registration"},{"note":"Call for Papersにも投稿数・採択数・採択率の記載がない。","label":"採択率","value":"公表なし","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"2027サイクルの公式トップページには回数表記が見当たらないため、第N回を引用する場合は年とページを併記する必要がある。","label":"回次表記（2026サイクルのCFP）","value":"「The 29th DATE conference」","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/date-2026-call-papers"},{"note":"1998年以前の情報はDBLPのシリーズ索引側で補っている。","label":"沿革の公式説明","value":"公式Archiveページは DATE 2026〜DATE 2009 の各年へのリンクのみで、初回開催・名称変更・開催頻度を説明する文がない","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/archive"},{"note":"そのため本ページでは併設ワークショップの個別プログラムやexhibitor個社の一覧は扱っていない。","label":"2027 併設企画の確定状況","value":"Focus Sessions／Embedded Tutorials／Workshops はproposal募集段階（proposal締切 Sunday, 18 October 2026 AoE、通知 Tuesday, 1 December 2026 AoE）で、採択結果は未公開","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"}],"title":"本ページの限界と読み違えやすい点","eyebrow":"caveats"},"history":{"id":"history","body":"公式のproceedingsアーカイブは1998年からを公開範囲としており、1998年より前の巻は載っていません。DBLPのDATEシリーズ索引には former name として「European Design and Test Conference (ED&TC)」が併記されています。回数表記はDATE 2026のCall for Papersに「The 29th DATE conference」とあり、2027サイクルのページには回数表記が見当たりません。開催地はサイクルごとに異なり、2025年はLyon（France）、2026年はVerona（Italy）、2027年はDresden（Germany）と、それぞれのサイクルの公式サイトで確認できます。開催地の推移そのものを一覧で示したページは公式側に見当たらないため、年ごとにサイトを分けて確認する必要があります。","facts":[{"note":"DBLPの巻タイトル。出版元は IEEE Computer Society。","label":"DATE '98 の記録","value":"「1998 Design, Automation and Test in Europe (DATE '98), February 23-26, 1998, Le Palais des Congrès de Paris, Paris, France」","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/date/date1998.html"},{"note":"DATE公式サイト側には名称変更の経緯を説明するページが見当たらない。改称年を明示した記述はDBLP側にも確認できなかった。","label":"旧名称の併記","value":"DBLPのDATEシリーズ索引は former name として「European Design and Test Conference (ED&TC)」を併記している","checkedAt":"2026-08-05","sourceUrl":"https://dblp.org/db/conf/date/index.html"},{"note":"1997年以前の巻はこの一覧に掲載されていない。","label":"公式アーカイブの下限年","value":"公開proceedingsの一覧は「1998 - 2014」から始まる","checkedAt":"2026-08-05","sourceUrl":"https://past.date-conference.com/proceedings"},{"note":"DATE 2025サイト内のDATE 2026 Call for Papers冒頭。","label":"2026 の回次","value":"「The 29th DATE conference」","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/date-2026-call-papers"},{"note":"2008年以前のサイクルへのリンクはArchiveページにない。2025・2026にはProceedingsリンクが付いていない。","label":"アーカイブに残る年","value":"DATE 2026〜DATE 2009。2024年以前はProceedingsリンクも併記","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/archive"},{"note":"アーカイブサイトのトップに残るニュース文言。ほかの年の登録者数はこのページには出ていない。","label":"規模に関する公式記述（2019年）","value":"DATE 2019（Florence）は「received over 1,600 registrations from international experts」と記載","checkedAt":"2026-08-05","sourceUrl":"https://past.date-conference.com/"}],"title":"沿革と開催地の移動","eyebrow":"history"},"program":{"id":"program","body":"2027サイクルのセッション一覧はまだ公開されていないため、プログラムの中身を知るには2026サイクル（Verona）のページを見るのが実際的です。DATE 2026の初日（2026年4月20日）には、Opening Ceremony（OC）、Opening Keynote（OK01・OK02）に加えて、Technical Session（TS01〜TS04）、Focus Session（FS01）、Best Paper候補セッション（BPA01）、Young People Programme（YPP01）、keynote登壇者との対話枠（LKS01）が並んでいました。発表形式はCall for Papersに「short pitch presentations, followed by live interactions with a poster and/or demo」と書かれており、口頭のみの形式ではありません。keynoteはimec、Nvidia、Cornell、University of Bremen | DFKI、ETHZ | Università di Bolognaから登壇し、open-source EDAや量子計算向けリアルタイム処理が題材になっていました。","facts":[{"note":"所属は公式keynoteページの表記。","label":"2026 Opening Keynote OK01","value":"Luc Van den hove（imec, Belgium）「It's Time to Futureproof our Prosperity by Superfueling Innovation, Enabling Next-Gen AI」","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/keynotes"},{"note":"公式keynoteページの表記。","label":"2026 Opening Keynote OK02","value":"Bettina Heim（Nvidia, Switzerland）「Ultra-Low Latency Real-Time Processing for Quantum Computing」","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/keynotes"},{"note":"公式keynoteページの表記。","label":"2026 Lunchtime Keynote LK01","value":"Zhiru Zhang（Cornell University, United States）「Unifying Accelerator Design and Programming for Evolvable Computing」（IEEE CEDA Distinguished Lecturer）","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/keynotes"},{"note":"LK02は Rolf Drechsler（University of Bremen | DFKI, Germany）「On My Perfect Life: A Tenured Position While AI Does The Job」。","label":"2026 Lunchtime Keynote LK03","value":"Luca Benini（ETHZ, CH | Università di Bologna, Italy）「Democratizing Silicon: The Rise of Open-Source EDA and Europe's Strategic Roadmap」","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/keynotes"},{"note":"Programmeページ初日（Monday, 20 April 2026）に並ぶセッションから読み取れるコード。","label":"2026 セッション種別コード","value":"OC（Opening Ceremony）／OK（Opening Keynote）／TS（Technical Session）／FS（Focus Session）／BPA／LKS（Later … with the keynote speakers）／YPP（Young People Programme）","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/programme"},{"note":"初日のセッション一覧に掲載。","label":"2026 Focus Sessionの例","value":"FS01「European Startups on Quantum - Is the Breakthrough Near? (Panel)」","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/programme"},{"note":"technical sessionでの発表スタイルとしてCall for Papersに記載。","label":"発表形式","value":"「The technical sessions include short pitch presentations, followed by live interactions with a poster and/or demo.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"本日時点。Call for Papers側でFocus Sessions／Embedded Tutorials／Workshopsの募集は告知されている。","label":"2027 プログラム公開状況","value":"Programme Overviewページは会期表記とログインフォームのみで、セッション一覧・タイムテーブルは未掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/programme-overview"}],"title":"プログラム構成とkeynote（2026サイクルの実績）","eyebrow":"program"},"audience":{"id":"audience","body":"研究室から出す場合、締切が2段階（登録→本文）である点と、採択後に著者1名の現地参加とauthor rateでの参加登録が必須である点を先に共有しておくと計画が崩れにくくなります。学生にはYoung People Programmeが用意され、Panel on Future Career Perspectives、Career Fair、University Fair、Student Teams Presentations、PhD Forumが束ねられており、無償学生登録と旅費補助への応募が案内されています。ただし枠数や金額は公表されておらず、旅費補助は実費の証明に基づく事後払いで全額を賄うとは限らないと明記されています。企業・調査担当は、proceedingsが2年後に一般公開される運用を踏まえ、最新動向は当年のprogramme/keynoteページ、確定した内容は2年前までのproceedingsで追う組み立てが取れます。sponsor・exhibitor欄は協賛と出展の事実を示すものとして扱ってください。","facts":[{"note":"同欄に、発表がない場合は「the paper will be removed from the published proceedings」とも記載。","label":"発表者の義務","value":"「DATE is a conference held exclusively in person. Therefore, it is mandatory that at least one author of each accepted paper attends the session where the paper is discussed.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"author rateの金額は2027サイクルではまだ公開されていない。","label":"採択論文の登録要件","value":"「each paper shall be accompanied by at least one full conference registration at the paper author rate」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/call-for-papers"},{"note":"PhD Forumは EDAA・ACM SIGDA・IEEE CEDA がホストすると記載。","label":"学生向けプログラムの構成","value":"Panel on Future Career Perspectives／Career Fair（Academia・Industryの2区分とSpeed Dating Session）／University Fair／Student Teams Presentations／PhD Forum","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/ypp"},{"note":"PhD Forumは「completed their PhD thesis within the last 12 months or who are close to completing their thesis」が条件と記載。","label":"学生の応募資格","value":"「Applicants must be full-time students in EDA, microelectronics, or an adjacent field.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/ypp"},{"note":"応募はjuryが審査し、採否は複数ラウンドで通知される旨が記載。枠数・金額の明示はない。","label":"学生支援","value":"「students may apply for free student registration and for travel grants」／「the grant may not cover the full cost of your trip」／「The travel grant will be reimbursed after you provide proof of travel expenses at the conference.」","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/ypp"},{"note":"直近サイクルの本文は参加登録者向けの配布に限定される。","label":"調査目的での閲覧経路","value":"開催2年後にproceedingsが一般公開され、1998〜2014年、2015年、2016年、2017年分が公開扱いで掲載","checkedAt":"2026-08-05","sourceUrl":"https://past.date-conference.com/proceedings"}],"title":"研究室・企業からの使い方","eyebrow":"audience"},"identity":{"id":"identity","body":"DATEは公式サイト上で「Design, Automation and Test in Europe Conference」と正式表記され、タグラインとして「The European Event for Electronic System Design & Test」を掲げています。運営はDATE Executive Committee（DEC）、Technical Programme Committee（TPC）、DATE Sponsors Committee（DSC）、DATE Fellowsの4体制に分かれており、どの学会が支えているかはDSCページで名前と liaison 単位まで確認できます。回数表記は2026年のCall for Papersに「The 29th DATE conference」とあり、2027サイクルの公式ページには回数表記が見当たりません。会議名を引用するときは、略称DATEと4トラック記号D/A/T/Eを混同しないよう注意してください。","facts":[{"note":"同ページのタグラインは「The European Event for Electronic System Design & Test」。","label":"正式名称","value":"Design, Automation and Test in Europe Conference","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/"},{"note":"公式サイトのページ見出し・URLともにDATEを用いる。","label":"略称","value":"DATE","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/"},{"note":"DATE 2026サイトに「Sponsor Societies」として並記されている4団体。","label":"sponsor societies（2026サイクル表示）","value":"ACM SIGDA / ESD Alliance / EDAA / IEEE CEDA","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/"},{"note":"ページ見出しは「DATE 2027 Sponsors Committee」。委員会の役割そのものの説明文は掲載されていない。","label":"2027 DATE Sponsors Committee 構成団体","value":"EDAA（Chair: Ian O'Connor）／IEEE Council on EDA (CEDA)／ACM SIGDA（liaison: Christian Pilato）／SEMI ESD Alliance（liaison: Laith Altimime）／SSCS（liaison: Georges Gielen）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/dsc"},{"note":"DATE 2025サイト内に置かれたDATE 2026 Call for Papersページの冒頭文言。","label":"2026 回次表記","value":"「The 29th DATE conference」","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/date-2026-call-papers"},{"note":"DATE 2026 Call for Papersの連絡先欄に記載。","label":"運営事務局","value":"c/o K.I.T. Group GmbH Dresden, Bautzner Str. 117-119, 01099 Dresden, DE（Phone: +49 351 65573-137）","checkedAt":"2026-08-05","sourceUrl":"https://date25.date-conference.com/date-2026-call-papers"},{"note":"Committeesページはこの4つへのリンクのみを持つ索引ページ。","label":"委員会の区分","value":"DATE Executive Committee (DEC) / Technical Programme Committee (TPC) / DATE Sponsors Committee (DSC) / DATE Fellows の4区分","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/committees"},{"note":"各年に Website / Programme が、2024年以前には Proceedings も付く（2025・2026にはProceedingsリンクがない）。開催頻度そのものを明記した文はArchiveページにない。","label":"開催年の連続性（アーカイブ掲載）","value":"Archiveページに DATE 2026 から DATE 2009 まで各年1件ずつ掲載","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/archive"}],"title":"会議の正式名称と主催体制","eyebrow":"identity"},"community":{"id":"community","body":"DECページを見ると、2027サイクルのGeneral Chairは Robert Wille、Past General Chair は Valeria Bertacco と印字されており、2026サイクルのDECページでは Valeria Bertacco が General Chair、Robert Wille が Vice General Chair でした。所属は大学・公的研究機関が中心で、TPCのトピックmemberにはNVIDIAやSynopsysのような企業所属も含まれます。所在国は氏名の後ろに2文字コードで印字されており、DE・FR・IT・BE・NL・CZ・US・CA・SG・IN・CNなど欧州以外も混在します。sponsor欄の企業名は当該サイクルの協賛・出展の事実を示すもので、それ以上の関係を示す記載はありません。","facts":[{"note":"Vice General Chairは Alberto Bosio, University of Lyon, FR。Past General Chairは Valeria Bertacco, University of Michigan, US。","label":"2027 General Chair","value":"Robert Wille, Technical University Munich, DE","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/dec"},{"note":"Vice Programme Chairは Nele Mentens, KU Leuven, BE | Leiden University, NL。","label":"2027 Programme Chair","value":"Lukas Sekanina, Brno University of Technology, CZ","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/dec"},{"note":"DECページの表記をそのまま引用。","label":"2027 トラックchair","value":"D-Track Co-Chairs: Letícia Maria Bolzani Pöhls（IHP - Leibniz Institute for High Performance Microelectronics, DE）/ Graziano Pravadelli（University of Verona, IT）、A-Track: Ioana Vataleju（TIMA/CNRS/Université de Grenoble-Alpes, FR）、T-Track: Marcello Traiola（Inria, FR）、E-Track: Nele Mentens（KU Leuven, BE | Leiden University, NL）","checkedAt":"2026-08-05","sourceUrl":"https://www.date-conference.com/dec"},{"note":"同ページに Vice General Chair として Robert Wille, Technical University Munich, DE、Past General Chair として Aida Todri-Sanial, Eindhoven University of Technology, NL、Programme Chair として Alberto Bosio, École Centrale de Lyon, FR。","label":"2026 General Chair","value":"Valeria Bertacco, University of Michigan, US","checkedAt":"2026-08-05","sourceUrl":"https://date26.date-conference.com/dec"},{"note":"公式プログラム上の所属表記であり、個人の国籍を示すものではない。","label":"TPC memberの所在国（D1トピックの例）","value":"University of Toronto, CA／National University of Singapore, SG／NVIDIA, US／Université de Bretagne Occidentale/Lab-STICC, FR／Simon Fraser University, CA／Indian Institute of Technology Guwahati, IN／Southeast University, 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