{"service":"handoutai-research-labs","surface":"gold-list","page":1,"limit":20,"pages":47,"total":931,"facets":{"areas":[{"value":"中国・四国","label":"中国・四国","count":63},{"value":"中部","label":"中部","count":141},{"value":"九州","label":"九州","count":103},{"value":"北海道","label":"北海道","count":19},{"value":"東北","label":"東北","count":95},{"value":"関東","label":"関東","count":335},{"value":"関西","label":"関西","count":175}],"entityTypes":[{"value":"research-lab","label":"研究室"}],"paperDb":[],"conferences":[{"value":"3dic","label":"3DIC","name":"IEEE 3D Systems Integration Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"a-sscc","label":"A-SSCC","name":"IEEE Asian Solid-State Circuits Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"aicas","label":"AICAS","name":"IEEE International Conference on Artificial Intelligence Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ald-ale","label":"ALD/ALE","name":"AVS International Conference on Atomic Layer Deposition and Atomic Layer Etching Workshop","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"apec","label":"APEC","name":"IEEE Applied Power Electronics Conference and Exposition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"aps-march-meeting","label":"APS GPS","name":"APS Global Physics Summit","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"applied-superconductivity-conference","label":"ASC","name":"Applied Superconductivity Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asicon","label":"ASICON","name":"IEEE International Conference on ASIC","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asmc","label":"ASMC","name":"SEMI Advanced Semiconductor Manufacturing Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"asp-dac","label":"ASP-DAC","name":"Asia and South Pacific Design Automation Conference","tier":"S","count":3,"presentation_count":3,"latest_presentation_year":2026},{"value":"asian-test-symposium","label":"ATS","name":"IEEE Asian Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"avs","label":"AVS","name":"AVS 72nd International Symposium & Exhibition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"bcicts","label":"BCICTS","name":"IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cicc","label":"CICC","name":"IEEE Custom Integrated Circuits Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cleo","label":"CLEO","name":"Conference on Lasers and Electro-Optics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"codes-isss","label":"CODES+ISSS","name":"International Conference on Hardware/Software Codesign and System Synthesis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cs-mantech","label":"CS MANTECH","name":"International Conference on Compound Semiconductor Manufacturing Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"cstic","label":"CSTIC","name":"Conference of Science & Technology for Integrated Circuits","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"compound-semiconductor-week","label":"CSW","name":"Compound Semiconductor Week","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"dac","label":"DAC","name":"Design Automation Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"date","label":"DATE","name":"Design, Automation and Test in Europe Conference","tier":"S","count":2,"presentation_count":2,"latest_presentation_year":2026},{"value":"dpc","label":"DPC","name":"IMAPS Device Packaging Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"drc","label":"DRC","name":"Device Research Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"display-week","label":"Display Week","name":"Display Week / SID International Symposium, Seminar and Exhibition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"emrs-fall","label":"E-MRS Fall","name":"E-MRS Fall Meeting & Exhibit","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"emrs-spring","label":"E-MRS Spring","name":"E-MRS Spring Meeting & Exhibit","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ecce","label":"ECCE","name":"IEEE Energy Conversion Congress and Exposition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ecs-meeting","label":"ECS Meeting","name":"The Electrochemical Society Meeting","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ectc","label":"ECTC","name":"IEEE Electronic Components and Technology Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"edtm","label":"EDTM","name":"IEEE Electron Devices Technology and Manufacturing Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eipbn","label":"EIPBN","name":"International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"electronic-materials-conference","label":"EMC","name":"Electronic Materials Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"empc","label":"EMPC","name":"European Microelectronics & Packaging Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eos-esd-symposium","label":"EOS/ESD Symposium","name":"EOS/ESD Symposium and Exhibits","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"epeps","label":"EPEPS","name":"IEEE Conference on Electrical Performance of Electronic Packaging and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eptc","label":"EPTC","name":"IEEE Electronics Packaging Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"esref","label":"ESREF","name":"European Symposium on Reliability of Electron Devices, Failure Physics and Analysis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"esserc","label":"ESSERC","name":"IEEE European Solid-State Electronics Research Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"estc","label":"ESTC","name":"IEEE Electronics System-Integration Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ets","label":"ETS","name":"IEEE European Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"european-microwave-integrated-circuits-conference","label":"EuMIC","name":"European Microwave Integrated Circuits Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"eurosime","label":"EuroSimE","name":"International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"fmcad","label":"FMCAD","name":"Formal Methods in Computer-Aided Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"fpga","label":"FPGA","name":"ACM/SIGDA International Symposium on Field-Programmable Gate Arrays","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"fpl","label":"FPL","name":"FPL / International Conference on Field-Programmable Logic and Applications","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"gaseous-electronics-conference","label":"GEC","name":"Gaseous Electronics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"glsvlsi","label":"GLSVLSI","name":"ACM Great Lakes Symposium on VLSI","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"hot-chips","label":"Hot Chips","name":"Hot Chips: A Symposium on High Performance Chips","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iccad","label":"ICCAD","name":"IEEE/ACM International Conference on Computer-Aided Design","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-international-conference-on-computer-design","label":"ICCD","name":"IEEE International Conference on Computer Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icds","label":"ICDS","name":"International Conference on Defects in Semiconductors","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icep-hbs","label":"ICEP2027","name":"2027 International Conference on Electronics Packaging","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icept","label":"ICEPT","name":"International Conference on Electronic Packaging Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-conference-on-ic-design-and-technology","label":"ICICDT","name":"International Conference on IC Design and Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-conference-on-magnetism","label":"ICM","name":"International Conference on Magnetism","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmbe","label":"ICMBE","name":"International Conference on Molecular Beam Epitaxy","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmctf","label":"ICMCTF","name":"International Conference on Metallurgical Coatings and Thin Films","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icmts","label":"ICMTS","name":"IEEE International Conference on Microelectronic Test Structures","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icns","label":"ICNS","name":"International Conference on Nitride Semiconductors","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icps","label":"ICPS","name":"International Conference on the Physics of Semiconductors","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icscrm","label":"ICSCRM","name":"International Conference on Silicon Carbide and Related Materials","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"icsict","label":"ICSICT","name":"IEEE International Conference on Solid-State and Integrated Circuit Technology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-display-workshops","label":"IDW","name":"International Display Workshops","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iedm","label":"IEDM","name":"IEEE International Electron Devices Meeting","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-apccas","label":"IEEE APCCAS","name":"IEEE Asia Pacific Conference on Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-biocas","label":"IEEE BioCAS","name":"IEEE Biomedical Circuits and Systems Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-hardware-oriented-security-and-trust-symposium","label":"IEEE HOST","name":"IEEE International Symposium on Hardware Oriented Security and Trust","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-international-conference-on-electronics-circuits-and-systems","label":"IEEE ICECS","name":"IEEE International Conference on Electronics, Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mems","label":"IEEE MEMS","name":"IEEE International Conference on Micro Electro Mechanical Systems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-mtt-s-international-microwave-symposium","label":"IEEE MTT-S IMS","name":"IEEE MTT-S International Microwave Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-mwscas","label":"IEEE MWSCAS","name":"IEEE International Midwest Symposium on Circuits and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-sensors","label":"IEEE SENSORS","name":"IEEE SENSORS Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-nano","label":"IEEE-NANO","name":"IEEE International Conference on Nanotechnology","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iemt","label":"IEMT","name":"IEEE International Electronics Manufacturing Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iirw","label":"IIRW","name":"IEEE International Integrated Reliability Workshop","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iitc","label":"IITC","name":"IEEE International Interconnect Technology Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-liquid-crystal-conference","label":"ILCC","name":"International Liquid Crystal Conference (ILCC)","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"imaps-symposium","label":"IMAPS Symposium","name":"International Symposium on Microelectronics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"impact-iaac","label":"IMPACT-IAAC","name":"International Microsystems, Packaging, Assembly and Circuits Technology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"imw","label":"IMW","name":"IEEE International Memory Workshop","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"intermag","label":"INTERMAG","name":"IEEE International Magnetics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ipfa","label":"IPFA","name":"IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iprm","label":"IPRM","name":"International Conference on Indium Phosphide and Related Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"irmmw-thz","label":"IRMMW-THz","name":"International Conference on Infrared, Millimeter, and Terahertz Waves","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"irps","label":"IRPS","name":"IEEE International Reliability Physics Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"acm-ieee-international-symposium-on-computer-architecture","label":"ISCA","name":"ACM/IEEE International Symposium on Computer Architecture","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iscas","label":"ISCAS","name":"IEEE International Symposium on Circuits and Systems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ise-annual-meeting","label":"ISE Annual","name":"Annual Meeting of the International Society of Electrochemistry","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isec","label":"ISEC","name":"International Superconductive Electronics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"islped","label":"ISLPED","name":"IEEE/ACM International Symposium on Low Power Electronics and Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isocc","label":"ISOCC","name":"International SoC Design Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ispd","label":"ISPD","name":"International Symposium on Physical Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ispsd","label":"ISPSD","name":"International Symposium on Power Semiconductor Devices and ICs","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isqed","label":"ISQED","name":"International Symposium on Quality Electronic Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isscc","label":"ISSCC","name":"IEEE International Solid-State Circuits Conference","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"issm","label":"ISSM","name":"International Symposium on Semiconductor Manufacturing","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"istfa","label":"ISTFA","name":"International Symposium for Testing and Failure Analysis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"isvlsi","label":"ISVLSI","name":"IEEE Computer Society Annual Symposium on VLSI","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"itc","label":"ITC","name":"International Test Conference","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"itherm","label":"ITherm","name":"IEEE ITherm Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ius","label":"IUS","name":"IEEE International Ultrasonics Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"international-vacuum-congress","label":"IVC","name":"International Vacuum Congress","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwls","label":"IWLS","name":"International Workshop on Logic & Synthesis","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwn","label":"IWN","name":"International Workshop on Nitride Semiconductors","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"joint-mmm-intermag-conference","label":"Joint MMM-Intermag","name":"Joint MMM-Intermag Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"lt30","label":"LT30","name":"International Conference on Low Temperature Physics","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-acm-international-symposium-on-microarchitecture","label":"MICRO","name":"IEEE/ACM International Symposium on Microarchitecture","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mmm","label":"MMM","name":"Annual Conference on Magnetism and Magnetic Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mnc","label":"MNC","name":"International Microprocesses and Nanotechnology Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mne","label":"MNE","name":"International Conference on Micro and Nano Engineering","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"materials-research-meeting","label":"MRM","name":"Materials Research Meeting","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mrs-fall-meeting","label":"MRS Fall","name":"MRS Fall Meeting & Exhibit","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"mrs-spring-meeting","label":"MRS Spring","name":"MRS Spring Meeting & Exhibit","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"nsrec","label":"NSREC","name":"IEEE Nuclear and Space Radiation Effects Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"oecc","label":"OECC","name":"OECC / OptoElectronics and Communications Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ofc","label":"OFC","name":"Optical Fiber Communications Conference and Exhibition","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"pcim","label":"PCIM","name":"PCIM Expo & Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"pmj","label":"PMJ","name":"Photomask Japan","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"prime-pacific-rim-meeting","label":"PRiME","name":"Pacific Rim Meeting on Electrochemical and Solid-State Science / PRiME 2028","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ieee-pvsc","label":"PVSC","name":"IEEE Photovoltaic Specialists Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"pvsec","label":"PVSEC","name":"International Photovoltaic Science and Engineering Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"pacifichem","label":"Pacifichem","name":"International Chemical Congress of Pacific Basin Societies / Pacifichem","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"radecs","label":"RADECS","name":"RADiation and its Effects on Components and Systems Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"rfic","label":"RFIC","name":"IEEE Radio Frequency Integrated Circuits Symposium","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"sces","label":"SCES","name":"International Conference on Strongly Correlated Electron Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"semi-therm","label":"SEMI-THERM","name":"SEMI-THERM Semiconductor Thermal Measurement, Modeling and Management Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"sisc","label":"SISC","name":"IEEE Semiconductor Interface Specialists Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"sispad","label":"SISPAD","name":"International Conference on Simulation of Semiconductor Processes and Devices","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"socc","label":"SOCC","name":"IEEE International System-on-Chip Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-alp","label":"SPIE ALP","name":"SPIE Advanced Lithography + Patterning","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-dtco-computational","label":"SPIE DTCO","name":"SPIE DTCO and Computational Patterning","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-advanced-etch","label":"SPIE Etch","name":"SPIE Advanced Etch Technology and Process Integration for Nanopatterning","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-patterning-materials","label":"SPIE Materials","name":"SPIE Advances in Patterning Materials and Processes","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-metrology-inspection","label":"SPIE Metrology","name":"SPIE Metrology, Inspection, and Process Control","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-optical-euv","label":"SPIE Optical/EUV","name":"SPIE Optical and EUV Nanolithography","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photomask-euv","label":"SPIE Photomask/EUV","name":"SPIE Photomask Technology + Extreme Ultraviolet Lithography","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photonics-europe","label":"SPIE Photonics Europe","name":"SPIE Photonics Europe","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"spie-photonics-west","label":"SPIE Photonics West","name":"SPIE Photonics West","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"ssdm","label":"SSDM","name":"International Conference on Solid State Devices and Materials","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"siphotonics","label":"SiPhotonics","name":"IEEE Silicon Photonics Conference","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"therminic","label":"THERMINIC","name":"International Workshop on Thermal Investigations of ICs and Systems","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"tms-annual-meeting","label":"TMS Annual","name":"TMS Annual Meeting & Exhibition","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"transducers","label":"Transducers","name":"International Conference on Solid-State Sensors, Actuators and Microsystems","tier":"S","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsi","label":"VLSI","name":"Symposium on VLSI Technology and Circuits","tier":"SS","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsi-tsa","label":"VLSI TSA","name":"International VLSI Symposium on Technology, Systems and Applications","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsi-soc","label":"VLSI-SoC","name":"IFIP/IEEE International Conference on Very Large Scale Integration SoC","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vlsid","label":"VLSID","name":"International Conference on VLSI Design","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"vts","label":"VTS","name":"IEEE VLSI Test Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null},{"value":"iwlpc","label":"WLPS / IWLPC","name":"Microelectronics Packaging & Integration Symposium","tier":"A","count":0,"presentation_count":0,"latest_presentation_year":null}],"presentationYears":[{"value":"2026","label":"2026","count":3,"presentation_count":5}],"careers":[{"value":"listed","label":"就職先あり","count":221,"destinationCount":6687,"employerCount":2854}],"employers":[{"value":"三菱電機","label":"三菱電機","companyId":"mitsubishi-electric","count":83},{"value":"東京エレクトロン","label":"東京エレクトロン","companyId":"tokyo-electron","count":69},{"value":"東芝","label":"東芝","companyId":null,"count":68},{"value":"デンソー","label":"デンソー","companyId":"denso","count":65},{"value":"TOYOTA","label":"TOYOTA","companyId":"toyota","count":64},{"value":"パナソニックグループ","label":"パナソニックグループ","companyId":"panasonic-energy","count":64},{"value":"キヤノン","label":"キヤノン","companyId":"canon","count":61},{"value":"ソニー","label":"ソニー","companyId":null,"count":58},{"value":"村田製作所","label":"村田製作所","companyId":"murata","count":56},{"value":"シャープ","label":"シャープ","companyId":"sharp","count":55},{"value":"日立製作所","label":"日立製作所","companyId":null,"count":53},{"value":"キオクシア","label":"キオクシア","companyId":"kioxia","count":49},{"value":"ローム","label":"ローム","companyId":"rohm","count":48},{"value":"ルネサス","label":"ルネサス","companyId":"renesas","count":47},{"value":"富士通","label":"富士通","companyId":null,"count":45},{"value":"京セラ","label":"京セラ","companyId":"kyocera","count":38},{"value":"リコー","label":"リコー","companyId":null,"count":37},{"value":"住友電工","label":"住友電工","companyId":"sumitomo-electric","count":34},{"value":"三菱重工業","label":"三菱重工業","companyId":"mhi","count":33},{"value":"富士電機","label":"富士電機","companyId":"fuji-electric","count":32},{"value":"本田技研工業","label":"本田技研工業","companyId":"honda","count":32},{"value":"日産自動車","label":"日産自動車","companyId":null,"count":32},{"value":"セイコーエプソン","label":"セイコーエプソン","companyId":"seiko-epson","count":29},{"value":"TDK","label":"TDK","companyId":"tdk","count":28},{"value":"浜松ホトニクス","label":"浜松ホトニクス","companyId":"hamamatsu-photonics","count":28},{"value":"大日本印刷","label":"大日本印刷","companyId":"dnp","count":27},{"value":"関西電力","label":"関西電力","companyId":null,"count":27},{"value":"ソニーセミコンダクタソリューションズ","label":"ソニーセミコンダクタソリューションズ","companyId":"sony-semiconductor-solutions","count":24},{"value":"旭化成","label":"旭化成","companyId":"asahi-kasei","count":22},{"value":"パナソニック","label":"パナソニック","companyId":null,"count":22},{"value":"オリンパス","label":"オリンパス","companyId":null,"count":21},{"value":"SCREEN","label":"SCREEN","companyId":"screen","count":20},{"value":"ソニーセミコンダクタマニュファクチャリング","label":"ソニーセミコンダクタマニュファクチャリング","companyId":"sony-semiconductor-manufacturing","count":20},{"value":"島津製作所","label":"島津製作所","companyId":"shimadzu","count":20},{"value":"NTTデータ","label":"NTTデータ","companyId":null,"count":20},{"value":"NEC","label":"NEC","companyId":"nec-corporation","count":19},{"value":"豊田自動織機","label":"豊田自動織機","companyId":"toyota-industries","count":19},{"value":"Western Digital","label":"Western Digital","companyId":"western-digital","count":18},{"value":"アドバンテスト","label":"アドバンテスト","companyId":"advantest","count":18},{"value":"スズキ","label":"スズキ","companyId":"suzuki","count":18},{"value":"スタンレー電気","label":"スタンレー電気","companyId":"stanley","count":18},{"value":"アクセンチュア","label":"アクセンチュア","companyId":null,"count":18},{"value":"キーエンス","label":"キーエンス","companyId":null,"count":18},{"value":"中部電力","label":"中部電力","companyId":null,"count":17},{"value":"東京電力","label":"東京電力","companyId":null,"count":17},{"value":"東北電力","label":"東北電力","companyId":null,"count":17},{"value":"コニカミノルタ","label":"コニカミノルタ","companyId":"konica-minolta","count":16},{"value":"NTTドコモ","label":"NTTドコモ","companyId":null,"count":16},{"value":"マイクロンメモリジャパン","label":"マイクロンメモリジャパン","companyId":null,"count":16},{"value":"ルネサス エレクトロニクス","label":"ルネサス エレクトロニクス","companyId":null,"count":16},{"value":"野村総合研究所","label":"野村総合研究所","companyId":null,"count":16},{"value":"ニコン","label":"ニコン","companyId":"nikon","count":15},{"value":"JR東海","label":"JR東海","companyId":null,"count":15},{"value":"ファナック","label":"ファナック","companyId":null,"count":15},{"value":"九州電力","label":"九州電力","companyId":null,"count":15},{"value":"富士ゼロックス","label":"富士ゼロックス","companyId":null,"count":15},{"value":"オムロン","label":"オムロン","companyId":"omron","count":14},{"value":"ディスコ","label":"ディスコ","companyId":"disco","count":14},{"value":"マイクロン・テクノロジー","label":"マイクロン・テクノロジー","companyId":"micron","count":14},{"value":"アイシン精機","label":"アイシン精機","companyId":null,"count":14},{"value":"ヤマハ発動機","label":"ヤマハ発動機","companyId":null,"count":14},{"value":"パイオニア","label":"パイオニア","companyId":"pioneer","count":13},{"value":"日本ガイシ","label":"日本ガイシ","companyId":"ngk-insulators","count":13},{"value":"東レ","label":"東レ","companyId":"toray","count":13},{"value":"ソニー LSI デザイン","label":"ソニー LSI デザイン","companyId":null,"count":13},{"value":"ソフトバンク","label":"ソフトバンク","companyId":null,"count":13},{"value":"豊田合成","label":"豊田合成","companyId":null,"count":13},{"value":"ダイキン工業","label":"ダイキン工業","companyId":"daikin","count":12},{"value":"マツダ","label":"マツダ","companyId":"mazda","count":12},{"value":"三菱マテリアル","label":"三菱マテリアル","companyId":"mitsubishi-materials","count":12},{"value":"日立ハイテク","label":"日立ハイテク","companyId":"hitachi-high-tech","count":12},{"value":"IHI","label":"IHI","companyId":null,"count":12},{"value":"JFEスチール","label":"JFEスチール","companyId":null,"count":12},{"value":"KDDI","label":"KDDI","companyId":null,"count":12},{"value":"きんでん","label":"きんでん","companyId":null,"count":12},{"value":"ブラザー工業","label":"ブラザー工業","companyId":null,"count":12},{"value":"住友電装","label":"住友電装","companyId":null,"count":12},{"value":"凸版印刷","label":"凸版印刷","companyId":null,"count":12},{"value":"川崎重工業","label":"川崎重工業","companyId":null,"count":12},{"value":"本田技研","label":"本田技研","companyId":null,"count":12},{"value":"ソシオネクスト","label":"ソシオネクスト","companyId":"socionext","count":11},{"value":"GSユアサ","label":"GSユアサ","companyId":null,"count":11},{"value":"サンディスク","label":"サンディスク","companyId":null,"count":11},{"value":"テルモ","label":"テルモ","companyId":null,"count":11},{"value":"メイテック","label":"メイテック","companyId":null,"count":11},{"value":"古河電工","label":"古河電工","companyId":null,"count":11},{"value":"富士フイルム","label":"富士フイルム","companyId":null,"count":11},{"value":"小糸製作所","label":"小糸製作所","companyId":null,"count":11},{"value":"新日鐵住金","label":"新日鐵住金","companyId":null,"count":11},{"value":"AGC","label":"AGC","companyId":"agc-inc","count":10},{"value":"イビデン","label":"イビデン","companyId":"ibiden","count":10},{"value":"フジクラ","label":"フジクラ","companyId":"fujikura","count":10},{"value":"住友化学","label":"住友化学","companyId":"sumitomo-chemical","count":10},{"value":"横河電機","label":"横河電機","companyId":"yokogawa","count":10},{"value":"NTT東日本","label":"NTT東日本","companyId":null,"count":10},{"value":"ダイキン","label":"ダイキン","companyId":null,"count":10},{"value":"ニチコン","label":"ニチコン","companyId":null,"count":10},{"value":"ヤマハ","label":"ヤマハ","companyId":null,"count":10},{"value":"川崎重工","label":"川崎重工","companyId":null,"count":10},{"value":"DOWA","label":"DOWA","companyId":"dowa","count":9},{"value":"アルプスアルパイン","label":"アルプスアルパイン","companyId":"alps-alpine","count":9},{"value":"ミネベアミツミ","label":"ミネベアミツミ","companyId":"minebea-mitsumi","count":9},{"value":"メガチップス","label":"メガチップス","companyId":"megachips","count":9},{"value":"NTT","label":"NTT","companyId":null,"count":9},{"value":"NTT西日本","label":"NTT西日本","companyId":null,"count":9},{"value":"TOTO","label":"TOTO","companyId":null,"count":9},{"value":"アンリツ","label":"アンリツ","companyId":null,"count":9},{"value":"三菱電機エンジニアリング","label":"三菱電機エンジニアリング","companyId":null,"count":9},{"value":"日本電気","label":"日本電気","companyId":null,"count":9},{"value":"日本電産","label":"日本電産","companyId":null,"count":9},{"value":"日立","label":"日立","companyId":null,"count":9},{"value":"日立国際電気","label":"日立国際電気","companyId":null,"count":9},{"value":"昭和電工","label":"昭和電工","companyId":null,"count":9},{"value":"東芝メモリ","label":"東芝メモリ","companyId":null,"count":9},{"value":"JASM","label":"JASM","companyId":"jasm","count":8},{"value":"JEOL","label":"JEOL","companyId":"jeol","count":8},{"value":"NOK","label":"NOK","companyId":"nok","count":8},{"value":"アルバック","label":"アルバック","companyId":"ulvac","count":8},{"value":"デンソーテクノ","label":"デンソーテクノ","companyId":"denso-techno","count":8},{"value":"デンソーテン","label":"デンソーテン","companyId":"denso-ten","count":8},{"value":"ニューフレアテクノロジー","label":"ニューフレアテクノロジー","companyId":"company-a8aa169e9bec","count":8},{"value":"三菱自動車工業","label":"三菱自動車工業","companyId":"mitsubishi-motors","count":8},{"value":"日亜化学工業","label":"日亜化学工業","companyId":"nichia","count":8},{"value":"荏原製作所","label":"荏原製作所","companyId":"ebara","count":8},{"value":"NTTコミュニケーションズ","label":"NTTコミュニケーションズ","companyId":null,"count":8},{"value":"アルプス電気","label":"アルプス電気","companyId":null,"count":8},{"value":"カネカ","label":"カネカ","companyId":null,"count":8},{"value":"マキタ","label":"マキタ","companyId":null,"count":8},{"value":"中国電力","label":"中国電力","companyId":null,"count":8},{"value":"任天堂","label":"任天堂","companyId":null,"count":8},{"value":"北陸電力","label":"北陸電力","companyId":null,"count":8},{"value":"古河電気工業","label":"古河電気工業","companyId":null,"count":8},{"value":"四国電力","label":"四国電力","companyId":null,"count":8},{"value":"新電元工業","label":"新電元工業","companyId":null,"count":8},{"value":"日本テキサスインスツルメンツ","label":"日本テキサスインスツルメンツ","companyId":null,"count":8},{"value":"明電舎","label":"明電舎","companyId":null,"count":8},{"value":"東京ガス","label":"東京ガス","companyId":null,"count":8},{"value":"東海旅客鉄道","label":"東海旅客鉄道","companyId":null,"count":8},{"value":"沖電気工業","label":"沖電気工業","companyId":null,"count":8},{"value":"豊田中央研究所","label":"豊田中央研究所","companyId":null,"count":8},{"value":"ソニー","label":"ソニー","companyId":"sony-group","count":7},{"value":"ボッシュ","label":"ボッシュ","companyId":"bosch","count":7},{"value":"信越化学工業","label":"信越化学工業","companyId":"shin-etsu-chemical","count":7},{"value":"東ソー","label":"東ソー","companyId":"tosoh","count":7},{"value":"東京精密 / ACCRETECH","label":"東京精密 / ACCRETECH","companyId":"tokyo-seimitsu","count":7},{"value":"芝浦メカトロニクス","label":"芝浦メカトロニクス","companyId":"shibaura-mechatronics","count":7},{"value":"JR東日本","label":"JR東日本","companyId":null,"count":7},{"value":"LIXIL","label":"LIXIL","companyId":null,"count":7},{"value":"NECエレクトロニクス","label":"NECエレクトロニクス","companyId":null,"count":7},{"value":"SONY","label":"SONY","companyId":null,"count":7},{"value":"アルプス技研","label":"アルプス技研","companyId":null,"count":7},{"value":"キャノン","label":"キャノン","companyId":null,"count":7},{"value":"ダイハツ工業","label":"ダイハツ工業","companyId":null,"count":7},{"value":"ルネサス テクノロジ","label":"ルネサス テクノロジ","companyId":null,"count":7},{"value":"三井住友銀行","label":"三井住友銀行","companyId":null,"count":7},{"value":"北海道電力","label":"北海道電力","companyId":null,"count":7},{"value":"半導体エネルギー研究所","label":"半導体エネルギー研究所","companyId":null,"count":7},{"value":"富士フィルム","label":"富士フィルム","companyId":null,"count":7},{"value":"日本信号","label":"日本信号","companyId":null,"count":7},{"value":"日本精工","label":"日本精工","companyId":null,"count":7},{"value":"日本製鉄","label":"日本製鉄","companyId":null,"count":7},{"value":"日立造船","label":"日立造船","companyId":null,"count":7},{"value":"旭硝子","label":"旭硝子","companyId":null,"count":7},{"value":"松下電器産業","label":"松下電器産業","companyId":null,"count":7},{"value":"沖電気","label":"沖電気","companyId":null,"count":7},{"value":"神戸製鋼","label":"神戸製鋼","companyId":null,"count":7},{"value":"KOKUSAI ELECTRIC","label":"KOKUSAI ELECTRIC","companyId":"kokusai-electric","count":6},{"value":"アズビル","label":"アズビル","companyId":"azbil","count":6},{"value":"サンケン電気","label":"サンケン電気","companyId":"sanken-electric","count":6},{"value":"シンフォニアテクノロジー","label":"シンフォニアテクノロジー","companyId":"sinfonia","count":6},{"value":"ダイヘン","label":"ダイヘン","companyId":"daihen","count":6},{"value":"パナソニック インダストリー","label":"パナソニック インダストリー","companyId":"panasonic-industry","count":6},{"value":"レゾナック","label":"レゾナック","companyId":"resonac","count":6},{"value":"レーザーテック","label":"レーザーテック","companyId":"lasertec","count":6},{"value":"安川電機","label":"安川電機","companyId":"yaskawa-electric","count":6},{"value":"日東電工","label":"日東電工","companyId":"nitto-denko","count":6},{"value":"村田機械","label":"村田機械","companyId":"murata-machinery","count":6},{"value":"JR西日本","label":"JR西日本","companyId":null,"count":6},{"value":"NTTファシリティーズ","label":"NTTファシリティーズ","companyId":null,"count":6},{"value":"アビームコンサルティング","label":"アビームコンサルティング","companyId":null,"count":6},{"value":"クボタ","label":"クボタ","companyId":null,"count":6},{"value":"コマツ","label":"コマツ","companyId":null,"count":6},{"value":"トヨタ車体","label":"トヨタ車体","companyId":null,"count":6},{"value":"ヌヴォトン テクノロジージャパン","label":"ヌヴォトン テクノロジージャパン","companyId":null,"count":6},{"value":"三菱ケミカル","label":"三菱ケミカル","companyId":null,"count":6},{"value":"三菱電機","label":"三菱電機","companyId":null,"count":6},{"value":"京セラドキュメントソリューションズ","label":"京セラドキュメントソリューションズ","companyId":null,"count":6},{"value":"住友金属鉱山","label":"住友金属鉱山","companyId":null,"count":6},{"value":"太陽誘電","label":"太陽誘電","companyId":null,"count":6},{"value":"富士通研究所","label":"富士通研究所","companyId":null,"count":6},{"value":"帝人","label":"帝人","companyId":null,"count":6},{"value":"新日本無線","label":"新日本無線","companyId":null,"count":6},{"value":"日星電気","label":"日星電気","companyId":null,"count":6},{"value":"日本IBM","label":"日本IBM","companyId":null,"count":6},{"value":"日清紡マイクロデバイス","label":"日清紡マイクロデバイス","companyId":null,"count":6},{"value":"神戸製鋼所","label":"神戸製鋼所","companyId":null,"count":6},{"value":"豊田通商","label":"豊田通商","companyId":null,"count":6},{"value":"野村総研","label":"野村総研","companyId":null,"count":6},{"value":"SUBARU","label":"SUBARU","companyId":"subaru","count":5},{"value":"TSMC","label":"TSMC","companyId":"tsmc","count":5}],"paperSeries":[],"tags":[{"value":"quantum-structure","label":"量子ドット・ナノ構造","facet":"field","group":"material","groupLabel":"材料","count":175},{"value":"silicon","label":"シリコン","facet":"field","group":"material","groupLabel":"材料","count":116},{"value":"organic","label":"有機半導体","facet":"field","group":"material","groupLabel":"材料","count":108},{"value":"gan","label":"GaN・窒化物","facet":"field","group":"material","groupLabel":"材料","count":95},{"value":"compound","label":"化合物半導体","facet":"field","group":"material","groupLabel":"材料","count":76},{"value":"two-dimensional","label":"二次元材料・グラフェン","facet":"field","group":"material","groupLabel":"材料","count":69},{"value":"oxide","label":"酸化物半導体","facet":"field","group":"material","groupLabel":"材料","count":68},{"value":"sic","label":"SiC","facet":"field","group":"material","groupLabel":"材料","count":51},{"value":"perovskite","label":"ペロブスカイト","facet":"field","group":"material","groupLabel":"材料","count":42},{"value":"magnetic","label":"磁性材料","facet":"field","group":"material","groupLabel":"材料","count":42},{"value":"dielectric","label":"強誘電体・誘電体","facet":"field","group":"material","groupLabel":"材料","count":41},{"value":"diamond","label":"ダイヤモンド","facet":"field","group":"material","groupLabel":"材料","count":32},{"value":"germanium","label":"Ge・SiGe","facet":"field","group":"material","groupLabel":"材料","count":29},{"value":"nanocarbon","label":"カーボンナノチューブ・ナノカーボン","facet":"field","group":"material","groupLabel":"材料","count":28},{"value":"ga2o3","label":"酸化ガリウム","facet":"field","group":"material","groupLabel":"材料","count":26},{"value":"amorphous","label":"アモルファス・薄膜材料","facet":"field","group":"material","groupLabel":"材料","count":15},{"value":"transistor","label":"トランジスタ・CMOS","facet":"field","group":"device","groupLabel":"デバイス","count":167},{"value":"solar-cell","label":"太陽電池","facet":"field","group":"device","groupLabel":"デバイス","count":163},{"value":"sensor","label":"センサ","facet":"field","group":"device","groupLabel":"デバイス","count":158},{"value":"light-emitter","label":"LED・半導体レーザ","facet":"field","group":"device","groupLabel":"デバイス","count":112},{"value":"spintronics","label":"スピントロニクス","facet":"field","group":"device","groupLabel":"デバイス","count":95},{"value":"quantum-device","label":"量子デバイス","facet":"field","group":"device","groupLabel":"デバイス","count":92},{"value":"power-device","label":"パワーデバイス","facet":"field","group":"device","groupLabel":"デバイス","count":82},{"value":"photonics","label":"フォトニクス・光集積","facet":"field","group":"device","groupLabel":"デバイス","count":75},{"value":"memory","label":"メモリ","facet":"field","group":"device","groupLabel":"デバイス","count":67},{"value":"nanoelectronics","label":"ナノ・分子エレクトロニクス","facet":"field","group":"device","groupLabel":"デバイス","count":65},{"value":"mems","label":"MEMS","facet":"field","group":"device","groupLabel":"デバイス","count":54},{"value":"photodetector","label":"受光素子・イメージセンサ","facet":"field","group":"device","groupLabel":"デバイス","count":50},{"value":"thermal","label":"熱電・熱マネジメント","facet":"field","group":"device","groupLabel":"デバイス","count":48},{"value":"flexible","label":"フレキシブル・印刷エレクトロニクス","facet":"field","group":"device","groupLabel":"デバイス","count":45},{"value":"rf-device","label":"高周波・テラヘルツデバイス","facet":"field","group":"device","groupLabel":"デバイス","count":34},{"value":"tft","label":"薄膜トランジスタ（TFT）","facet":"field","group":"device","groupLabel":"デバイス","count":29},{"value":"neuromorphic","label":"ニューロモルフィック","facet":"field","group":"device","groupLabel":"デバイス","count":26},{"value":"radiation-detector","label":"放射線検出器","facet":"field","group":"device","groupLabel":"デバイス","count":10},{"value":"crystal-growth","label":"結晶成長・エピタキシ","facet":"field","group":"process","groupLabel":"プロセス・評価","count":136},{"value":"metrology","label":"評価・計測・分析","facet":"field","group":"process","groupLabel":"プロセス・評価","count":134},{"value":"deposition","label":"成膜","facet":"field","group":"process","groupLabel":"プロセス・評価","count":85},{"value":"lithography","label":"リソグラフィ・微細加工","facet":"field","group":"process","groupLabel":"プロセス・評価","count":58},{"value":"bonding-packaging","label":"接合・実装・パッケージ","facet":"field","group":"process","groupLabel":"プロセス・評価","count":39},{"value":"plasma","label":"プラズマプロセス","facet":"field","group":"process","groupLabel":"プロセス・評価","count":34},{"value":"reliability","label":"信頼性・故障解析","facet":"field","group":"process","groupLabel":"プロセス・評価","count":34},{"value":"doping","label":"ドーピング・イオン注入","facet":"field","group":"process","groupLabel":"プロセス・評価","count":24},{"value":"etching","label":"エッチング","facet":"field","group":"process","groupLabel":"プロセス・評価","count":11},{"value":"cleaning","label":"洗浄・表面処理","facet":"field","group":"process","groupLabel":"プロセス・評価","count":9},{"value":"interconnect","label":"配線形成","facet":"field","group":"process","groupLabel":"プロセス・評価","count":8},{"value":"cmp","label":"CMP・研磨","facet":"field","group":"process","groupLabel":"プロセス・評価","count":6},{"value":"anneal-oxidation","label":"熱処理・酸化","facet":"field","group":"process","groupLabel":"プロセス・評価","count":4},{"value":"ic","label":"集積回路（LSI）","facet":"field","group":"circuit","groupLabel":"回路・設計","count":149},{"value":"analog","label":"アナログ・ミックスドシグナル設計","facet":"field","group":"circuit","groupLabel":"回路・設計","count":55},{"value":"digital","label":"デジタル回路・プロセッサ","facet":"field","group":"circuit","groupLabel":"回路・設計","count":52},{"value":"power-circuit","label":"電源回路・パワーエレクトロニクス","facet":"field","group":"circuit","groupLabel":"回路・設計","count":34},{"value":"ai-hardware","label":"AIハードウェア","facet":"field","group":"circuit","groupLabel":"回路・設計","count":29},{"value":"eda","label":"設計自動化（EDA）","facet":"field","group":"circuit","groupLabel":"回路・設計","count":23},{"value":"rf-circuit","label":"RF・無線・高速伝送回路","facet":"field","group":"circuit","groupLabel":"回路・設計","count":20},{"value":"memory-circuit","label":"メモリ回路・インメモリ計算","facet":"field","group":"circuit","groupLabel":"回路・設計","count":9},{"value":"test-dft","label":"テスト・DFT","facet":"field","group":"circuit","groupLabel":"回路・設計","count":9},{"value":"hw-security","label":"ハードウェアセキュリティ","facet":"field","group":"circuit","groupLabel":"回路・設計","count":6},{"value":"semiconductor-physics","label":"半導体物性","facet":"field","group":"physics","groupLabel":"物性・計算","count":210},{"value":"surface-interface","label":"表面・界面","facet":"field","group":"physics","groupLabel":"物性・計算","count":99},{"value":"simulation","label":"シミュレーション・第一原理計算","facet":"field","group":"physics","groupLabel":"物性・計算","count":48},{"value":"informatics","label":"機械学習・データ科学","facet":"field","group":"physics","groupLabel":"物性・計算","count":19},{"value":"computing","label":"AI・コンピューティング","facet":"field","group":"application","groupLabel":"応用","count":104},{"value":"energy-environment","label":"エネルギー・環境","facet":"field","group":"application","groupLabel":"応用","count":98},{"value":"medical-bio","label":"医療・バイオ","facet":"field","group":"application","groupLabel":"応用","count":62},{"value":"communication","label":"通信・IoT","facet":"field","group":"application","groupLabel":"応用","count":53},{"value":"display-lighting","label":"ディスプレイ・照明","facet":"field","group":"application","groupLabel":"応用","count":33},{"value":"extreme-environment","label":"宇宙・極限環境","facet":"field","group":"application","groupLabel":"応用","count":26},{"value":"automotive","label":"自動車・モビリティ","facet":"field","group":"application","groupLabel":"応用","count":6}],"equipment":[{"value":"eq-aligner","label":"マスクアライナ・露光装置","facet":"equipment","group":"lithography-patterning","groupLabel":"露光・描画","count":62},{"value":"eq-coater","label":"スピンコーター","facet":"equipment","group":"lithography-patterning","groupLabel":"露光・描画","count":43},{"value":"eq-ebl","label":"電子線描画装置","facet":"equipment","group":"lithography-patterning","groupLabel":"露光・描画","count":39},{"value":"eq-nil","label":"ナノインプリント装置","facet":"equipment","group":"lithography-patterning","groupLabel":"露光・描画","count":6},{"value":"eq-maskless-lithography","label":"マスクレス描画装置","facet":"equipment","group":"lithography-patterning","groupLabel":"露光・描画","count":2},{"value":"eq-sputter","label":"スパッタ装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":93},{"value":"eq-evaporator","label":"蒸着装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":92},{"value":"eq-mbe","label":"MBE装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":42},{"value":"eq-cvd","label":"CVD装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":41},{"value":"eq-ald","label":"ALD装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":23},{"value":"eq-mocvd","label":"MOCVD・MOVPE装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":17},{"value":"eq-pld","label":"PLD装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":13},{"value":"eq-crystal-furnace","label":"結晶育成炉","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":1},{"value":"eq-proximity-sublimation","label":"近接昇華装置","facet":"equipment","group":"deposition","groupLabel":"成膜・結晶成長","count":1},{"value":"eq-dry-etch","label":"ドライエッチング装置","facet":"equipment","group":"etch","groupLabel":"エッチング","count":47},{"value":"eq-asher","label":"アッシング装置","facet":"equipment","group":"etch","groupLabel":"エッチング","count":10},{"value":"eq-wet-etch","label":"ウェットエッチング","facet":"equipment","group":"etch","groupLabel":"エッチング","count":3},{"value":"eq-cleaning","label":"洗浄装置","facet":"equipment","group":"cleaning","groupLabel":"洗浄","count":15},{"value":"eq-furnace","label":"アニール炉・RTA","facet":"equipment","group":"implant-cmp-anneal","groupLabel":"熱処理・イオン注入・CMP","count":58},{"value":"eq-cmp","label":"CMP・研磨装置","facet":"equipment","group":"implant-cmp-anneal","groupLabel":"熱処理・イオン注入・CMP","count":11},{"value":"eq-implanter","label":"イオン注入装置","facet":"equipment","group":"implant-cmp-anneal","groupLabel":"熱処理・イオン注入・CMP","count":5},{"value":"eq-spm","label":"AFM・走査プローブ顕微鏡","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":96},{"value":"eq-prober","label":"プローバ・半導体パラメータアナライザ","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":77},{"value":"eq-sem","label":"走査電子顕微鏡（SEM）","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":75},{"value":"eq-spectrophotometer","label":"分光光度計・FTIR","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":53},{"value":"eq-xrd","label":"X線回折装置（XRD）","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":51},{"value":"eq-optical-spectroscopy","label":"ラマン・PL分光","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":51},{"value":"eq-profiler","label":"段差計・膜厚計","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":40},{"value":"eq-xps","label":"XPS・光電子分光","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":39},{"value":"eq-tem","label":"透過電子顕微鏡（TEM）","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":34},{"value":"eq-ellipsometer","label":"エリプソメータ","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":30},{"value":"eq-hall","label":"ホール効果測定装置","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":26},{"value":"eq-sims","label":"SIMS","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":6},{"value":"eq-electron-microscope","label":"電子顕微鏡","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":4},{"value":"eq-oscilloscope","label":"オシロスコープ","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":2},{"value":"eq-solar-cell-iv","label":"太陽電池I–V評価装置","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":1},{"value":"eq-peem","label":"光電子顕微鏡（PEEM）","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":1},{"value":"eq-tensile-tester","label":"小型引張試験機","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":1},{"value":"eq-rheed","label":"反射高速電子線回折装置（RHEED）","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":1},{"value":"eq-photocurrent","label":"光電流測定システム","facet":"equipment","group":"inspection-metrology","groupLabel":"評価・計測","count":1},{"value":"eq-bonder","label":"ボンダー・接合装置","facet":"equipment","group":"packaging-test","groupLabel":"実装・テスト","count":30},{"value":"eq-dicer","label":"ダイサー","facet":"equipment","group":"packaging-test","groupLabel":"実装・テスト","count":11},{"value":"eq-cleanroom","label":"クリーンルーム","facet":"equipment","group":"facility","groupLabel":"施設","count":47},{"value":"eq-dilution-refrigerator","label":"希釈冷凍機","facet":"equipment","group":"facility","groupLabel":"施設","count":3},{"value":"eq-fpga-equipment","label":"FPGA機材","facet":"equipment","group":"facility","groupLabel":"施設","count":2},{"value":"eq-3d-printer","label":"3Dプリンタ","facet":"equipment","group":"facility","groupLabel":"施設","count":2},{"value":"eq-glove-box","label":"グローブボックス","facet":"equipment","group":"facility","groupLabel":"施設","count":2},{"value":"eq-helium3-refrigerator","label":"ヘリウム3冷凍機","facet":"equipment","group":"facility","groupLabel":"施設","count":1},{"value":"eq-multi-gpu-server","label":"マルチGPUサーバー","facet":"equipment","group":"facility","groupLabel":"施設","count":1},{"value":"eq-many-core-cpu-server","label":"メニーコアCPUサーバー","facet":"equipment","group":"facility","groupLabel":"施設","count":1},{"value":"eq-co2-laser-processing","label":"CO2レーザー加工機","facet":"equipment","group":"facility","groupLabel":"施設","count":1},{"value":"eq-03k-refrigerator","label":"0.3K冷凍機","facet":"equipment","group":"facility","groupLabel":"施設","count":1},{"value":"eq-15k-refrigerator","label":"1.5K冷凍機","facet":"equipment","group":"facility","groupLabel":"施設","count":1}]},"employerFacet":{"shown":200,"total":2473,"kind":"company"},"evidenceContracts":{"paperDb":null,"majorConferencePresentation":"source-explicit-presenter-current-membership-v1","careerDestinations":"lab-homepage-employer-refetched-string-match-v1","tags":"official-page-controlled-vocabulary-v1","headBirthYear":"official-page-stated-year-v1"},"records":[{"publicLabId":"rlab-c07417873e58144b2c78133d","canonicalId":"lab_edb7bdd91f3d42fca92ea93c0c8b2fbe","labName":"(鬼追研究室、可逆計算/LSI)","institutionName":"広島工業大学","entityType":"research-lab","area":"中国・四国","prefecture":"広島県","officialUrl":"https://www.it-hiroshima.ac.jp/faculty/information/computer/teacher/","evidenceSummary":"広島工業大学の公式ページで、(鬼追研究室、可逆計算/LSI)の研究（可逆計算回路、超低消費電力化LSI、セルオートマトンのスピン反転動作）を確認しました。","researchKeywords":["半導体","集積回路","半導体スピントロニクス"],"principalInvestigators":["鬼追 一雅"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":null,"department":"情報学部 情報工学科","researchTopics":["可逆計算回路","超低消費電力化LSI","セルオートマトンのスピン反転動作"],"principalInvestigatorDetails":[{"name":"鬼追 一雅","nameEn":null,"title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"spintronics","label":"スピントロニクス","group":"device"},{"id":"energy-environment","label":"エネルギー・環境","group":"application"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-d9b04020105c9d389c8626d1","canonicalId":"lab_ff326cebcfcd4502999a4168f5b3f3a6","labName":"EUVリソグラフィー研究開発センター","institutionName":"兵庫県立大学","entityType":"research-lab","area":"関西","prefecture":"兵庫県","officialUrl":"https://www.lasti.u-hyogo.ac.jp/EUV-center/index.html","evidenceSummary":"兵庫県立大学の公式ページで、EUVリソグラフィー研究開発センターの研究（EUVリソグラフィー、半導体レジスト材料、BEUVレジスト開発）を確認しました。","researchKeywords":["半導体","リソグラフィ・半導体計測"],"principalInvestigators":["山川 進二"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"EUV Lithography R&D Center","department":"高度産業科学技術研究所 EUVリソグラフィー研究開発センター（大学院工学研究科 放射光工学分野）","researchTopics":["EUVリソグラフィー","半導体レジスト材料","BEUVレジスト開発","放射光ナノ計測"],"principalInvestigatorDetails":[{"name":"山川 進二","nameEn":null,"title":"准教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"lithography","label":"リソグラフィ・微細加工","group":"process"},{"id":"metrology","label":"評価・計測・分析","group":"process"}],"equipment":[{"id":"eq-ebl","label":"電子線描画装置","group":"lithography-patterning"},{"id":"eq-aligner","label":"マスクアライナ・露光装置","group":"lithography-patterning"},{"id":"eq-dry-etch","label":"ドライエッチング装置","group":"etch"},{"id":"eq-spm","label":"AFM・走査プローブ顕微鏡","group":"inspection-metrology"},{"id":"eq-xps","label":"XPS・光電子分光","group":"inspection-metrology"},{"id":"eq-profiler","label":"段差計・膜厚計","group":"inspection-metrology"},{"id":"eq-cleanroom","label":"クリーンルーム","group":"facility"}],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-bca29e142a51c394b5096bea","canonicalId":"lab_0fc477e8b2ae4f56be8ce1d3dc29c75e","labName":"FUTURE-PV研究室(小長井・石川研究室)","institutionName":"東京都市大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"http://www.konagai-labo.org/","evidenceSummary":"東京都市大学の公式ページで、FUTURE-PV研究室(小長井・石川研究室)の研究（ペロブスカイト太陽電池、CIGS太陽電池、タンデム太陽電池）を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス"],"principalInvestigators":["小長井 誠","石川 亮佑"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"FUTURE-PV Laboratory","department":"総合研究所(ナノエレクトロニクス研究センター) / 理工学部 電気電子通信工学科","researchTopics":["ペロブスカイト太陽電池","CIGS太陽電池","タンデム太陽電池","結晶シリコン太陽電池","原子層材料","薄型太陽電池"],"principalInvestigatorDetails":[{"name":"小長井 誠","nameEn":null,"title":"特別教授"},{"name":"石川 亮佑","nameEn":"Ryousuke ISHIKAWA","title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"silicon","label":"シリコン","group":"material"},{"id":"perovskite","label":"ペロブスカイト","group":"material"},{"id":"two-dimensional","label":"二次元材料・グラフェン","group":"material"},{"id":"compound","label":"化合物半導体","group":"material"},{"id":"solar-cell","label":"太陽電池","group":"device"}],"equipment":[{"id":"eq-mocvd","label":"MOCVD・MOVPE装置","group":"deposition"},{"id":"eq-cvd","label":"CVD装置","group":"deposition"},{"id":"eq-sputter","label":"スパッタ装置","group":"deposition"},{"id":"eq-optical-spectroscopy","label":"ラマン・PL分光","group":"inspection-metrology"},{"id":"eq-ellipsometer","label":"エリプソメータ","group":"inspection-metrology"},{"id":"eq-spectrophotometer","label":"分光光度計・FTIR","group":"inspection-metrology"}],"headBirthYear":null,"headBachelorYear":2005},{"publicLabId":"rlab-88ae075c07de892fa4854ebe","canonicalId":"lab_2d5b5074c280499f98a164ebe673c2a8","labName":"Femtosecond Spectroscopy Unit","institutionName":"沖縄科学技術大学院大学","entityType":"research-lab","area":"九州","prefecture":"沖縄県","officialUrl":"https://www.oist.jp/research/research-units/fsu","evidenceSummary":"沖縄科学技術大学院大学の公式ページで、Femtosecond Spectroscopy Unitの研究（ultrafast PEEM、ARPES、perovskite solar cell materials）を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス"],"principalInvestigators":["Keshav M. Dani"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"Femtosecond Spectroscopy Unit","department":"Okinawa Institute of Science and Technology Graduate University (Research Unit)","researchTopics":["ultrafast PEEM","ARPES","perovskite solar cell materials","two-dimensional semiconductors","excitons","valleytronics"],"principalInvestigatorDetails":[{"name":"Keshav M. Dani","nameEn":"Keshav M. Dani","title":"Professor"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"perovskite","label":"ペロブスカイト","group":"material"},{"id":"two-dimensional","label":"二次元材料・グラフェン","group":"material"},{"id":"solar-cell","label":"太陽電池","group":"device"},{"id":"metrology","label":"評価・計測・分析","group":"process"},{"id":"semiconductor-physics","label":"半導体物性","group":"physics"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-053f4cbeeaec780ed6f6ea13","canonicalId":"lab_7469c4e29e664e9f807842ca625218e3","labName":"ICPKG研究室（青柳・大川・渡辺研究室）","institutionName":"熊本大学","entityType":"research-lab","area":"九州","prefecture":"熊本県","officialUrl":"https://sites.google.com/view/icpkg/","evidenceSummary":"熊本大学の公式ページで、ICPKG研究室（青柳・大川・渡辺研究室）の研究（半導体チップの3次元積層技術、三次元積層実装用TSV・バンプ形成、同軸TSVの高周波信号特性）を確認しました。","researchKeywords":["半導体","集積回路","半導体デバイス・プロセス","マイクロ・ナノデバイス"],"principalInvestigators":["青柳 昌宏","Masahiro Aoyagi","大川 猛","Takeshi Ohkawa","渡辺 直也","Naoya Watanabe"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"ICPKG Labo.","department":"半導体・デジタル研究教育機構（工学部 半導体デバイス工学課程・情報電気工学科）","researchTopics":["半導体チップの3次元積層技術","三次元積層実装用TSV・バンプ形成","同軸TSVの高周波信号特性","3D-ICのESD保護回路設計","LSIのシステム応用(FPGA)"],"principalInvestigatorDetails":[{"name":"青柳 昌宏","nameEn":"Masahiro Aoyagi","title":"卓越教授"},{"name":"大川 猛","nameEn":"Takeshi Ohkawa","title":"教授"},{"name":"渡辺 直也","nameEn":"Naoya Watanabe","title":"准教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"bonding-packaging","label":"接合・実装・パッケージ","group":"process"},{"id":"digital","label":"デジタル回路・プロセッサ","group":"circuit"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-263eb7a7b0485ce057cdccba","canonicalId":null,"labName":"Kohei Itoh Research Group","institutionName":"慶應義塾大学","entityType":"research-lab","area":"関東","prefecture":"神奈川県","officialUrl":"https://www.appi.keio.ac.jp/Itoh_group/","evidenceSummary":"慶應義塾大学の公式の研究室一覧に掲載された研究室。研究テーマ: Semiconductor Isotope Engineering、Quantum Computer、Quantum Sensor、Electronic Materials","researchKeywords":[],"principalInvestigators":["伊藤公平"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-10-22","labNameEn":"Kohei Itoh Research Group","department":"物理情報工学科","researchTopics":["Semiconductor Isotope Engineering","Quantum Computer","Quantum Sensor","Electronic Materials"],"principalInvestigatorDetails":[{"name":"伊藤公平","nameEn":null,"title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-bd1c873b65df485f80358704","canonicalId":"lab_8973cb1c310f4c24aba795f57991e365","labName":"Martin Vacha研究室","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"http://vacha.mat.mac.titech.ac.jp/","evidenceSummary":"東京科学大学の公式ページで、Martin Vacha研究室の研究（有機半導体、半導体量子ドット、ペロブスカイトナノ結晶）を確認しました。","researchKeywords":["半導体","半導体量子デバイス","リソグラフィ・半導体計測"],"principalInvestigators":["Martin Vacha"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":null,"department":"物質理工学院 材料系","researchTopics":["有機半導体","半導体量子ドット","ペロブスカイトナノ結晶","単一分子分光法","有機エレクトロルミネッセンス","励起子拡散"],"principalInvestigatorDetails":[{"name":"Martin Vacha","nameEn":"Martin Vacha","title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"organic","label":"有機半導体","group":"material"},{"id":"perovskite","label":"ペロブスカイト","group":"material"},{"id":"quantum-structure","label":"量子ドット・ナノ構造","group":"material"},{"id":"light-emitter","label":"LED・半導体レーザ","group":"device"},{"id":"metrology","label":"評価・計測・分析","group":"process"},{"id":"semiconductor-physics","label":"半導体物性","group":"physics"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-ee19c3c0bb2994e027e2e8da","canonicalId":"lab_ccaf4be6d4964918b400789263dea69f","labName":"Mixed Signal & パワー電子回路研究室（石塚研究室）","institutionName":"長崎大学","entityType":"research-lab","area":"九州","prefecture":"長崎県","officialUrl":"https://pemsic.eee.nagasaki-u.ac.jp/","evidenceSummary":"長崎大学の公式ページで、Mixed Signal & パワー電子回路研究室（石塚研究室）の研究（スイッチング電源回路、集積化パワー電子回路、ミックスドシグナル信号処理・電力変換回路）を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","光・電子デバイス","集積回路","マイクロ・ナノデバイス","ワイドバンドギャップ半導体","半導体MEMS"],"principalInvestigators":["石塚 洋一","Yoichi Ishizuka"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"PEMSIC: Power-Electronic and Mixed-Signal-Integrated Circuits Lab.","department":"大学院総合生産科学研究科 電気・機械システム分野（工学部工学科 電気電子工学コース）","researchTopics":["スイッチング電源回路","集積化パワー電子回路","ミックスドシグナル信号処理・電力変換回路","センサーネットワーク","プラズマエッチング装置用RF電源回路","プロセッサ電力供給用電流検出回路"],"principalInvestigatorDetails":[{"name":"石塚 洋一","nameEn":"Yoichi Ishizuka","title":"教授"}],"paperSeries":[],"careerDestinationCount":54,"careerDestinations":[{"name":"三菱電機","kind":"company","companyId":"mitsubishi-electric","companySlug":"mitsubishi-electric","labCount":83},{"name":"東芝","kind":"company","companyId":null,"companySlug":null,"labCount":68},{"name":"デンソー","kind":"company","companyId":"denso","companySlug":null,"labCount":65},{"name":"パナソニックグループ","kind":"company","companyId":"panasonic-energy","companySlug":null,"labCount":64},{"name":"キヤノン","kind":"company","companyId":"canon","companySlug":"canon","labCount":61},{"name":"ソニー","kind":"company","companyId":null,"companySlug":null,"labCount":58},{"name":"村田製作所","kind":"company","companyId":"murata","companySlug":"murata","labCount":56},{"name":"シャープ","kind":"company","companyId":"sharp","companySlug":"sharp","labCount":55},{"name":"日立製作所","kind":"company","companyId":null,"companySlug":null,"labCount":53},{"name":"富士通","kind":"company","companyId":null,"companySlug":null,"labCount":45},{"name":"京セラ","kind":"company","companyId":"kyocera","companySlug":"kyocera-official-career","labCount":38},{"name":"富士電機","kind":"company","companyId":"fuji-electric","companySlug":"fuji-electric","labCount":32},{"name":"日産自動車","kind":"company","companyId":null,"companySlug":null,"labCount":32},{"name":"TDK","kind":"company","companyId":"tdk","companySlug":"tdk","labCount":28},{"name":"関西電力","kind":"company","companyId":null,"companySlug":null,"labCount":27},{"name":"ソニーセミコンダクタソリューションズ","kind":"company","companyId":"sony-semiconductor-solutions","companySlug":"sony-semiconductor-solutions","labCount":24},{"name":"パナソニック","kind":"company","companyId":null,"companySlug":null,"labCount":22},{"name":"ソニーセミコンダクタマニュファクチャリング","kind":"company","companyId":"sony-semiconductor-manufacturing","companySlug":"sony-semiconductor-manufacturing","labCount":20},{"name":"九州電力","kind":"company","companyId":null,"companySlug":null,"labCount":15},{"name":"川崎重工業","kind":"company","companyId":null,"companySlug":null,"labCount":12},{"name":"ヤマハ","kind":"company","companyId":null,"companySlug":null,"labCount":10},{"name":"NTT西日本","kind":"company","companyId":null,"companySlug":null,"labCount":9},{"name":"デンソーテン","kind":"company","companyId":"denso-ten","companySlug":null,"labCount":8},{"name":"新電元工業","kind":"company","companyId":null,"companySlug":null,"labCount":8},{"name":"明電舎","kind":"company","companyId":null,"companySlug":null,"labCount":8},{"name":"日本信号","kind":"company","companyId":null,"companySlug":null,"labCount":7},{"name":"サンケン電気","kind":"company","companyId":"sanken-electric","companySlug":"sanken-electric","labCount":6},{"name":"安川電機","kind":"company","companyId":"yaskawa-electric","companySlug":"yaskawa-electric-official-career","labCount":6},{"name":"NTTファシリティーズ","kind":"company","companyId":null,"companySlug":null,"labCount":6},{"name":"ヌヴォトン テクノロジージャパン","kind":"company","companyId":null,"companySlug":null,"labCount":6},{"name":"日清紡マイクロデバイス","kind":"company","companyId":null,"companySlug":null,"labCount":6},{"name":"Samsung","kind":"company","companyId":null,"companySlug":null,"labCount":4},{"name":"トヨタ自動車九州","kind":"company","companyId":null,"companySlug":null,"labCount":3},{"name":"富士通九州ネットワークテクノロジーズ","kind":"company","companyId":null,"companySlug":null,"labCount":3},{"name":"TDKラムダ","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"タムラ製作所","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"ニシム電子工業","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"長菱制御システム","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"SONY GM&O","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"オリジン","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ソニーグローバルマニュファクチャリング&オペレーションズ","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ソニーセミコンダクタマニュファクチュアリング","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ソニー・エルエスアイ・デザイン","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"デザイニウム","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"パナソニック DOC","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"パナソニック コネクト","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"パナソニック(株)(エレクトリックワークス社)","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"パナソニックエレクトリックワークス","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ミツミ電機","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ルネサス セミコンダクタ九州・山口","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"不動技研","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"朝日新聞","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"長崎放送","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"長崎放送(株) NBC","kind":"company","companyId":null,"companySlug":null,"labCount":1}],"careerSourceUrls":["https://pemsic.eee.nagasaki-u.ac.jp/?page_id=70"],"careerYears":{"from":1997,"to":2026},"tags":[{"id":"sensor","label":"センサ","group":"device"},{"id":"etching","label":"エッチング","group":"process"},{"id":"plasma","label":"プラズマプロセス","group":"process"},{"id":"ic","label":"集積回路（LSI）","group":"circuit"},{"id":"analog","label":"アナログ・ミックスドシグナル設計","group":"circuit"},{"id":"digital","label":"デジタル回路・プロセッサ","group":"circuit"},{"id":"power-circuit","label":"電源回路・パワーエレクトロニクス","group":"circuit"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-8ac22f98ef98f97c9196f397","canonicalId":null,"labName":"Nano-Engineering Laboratory","institutionName":"茨城大学","entityType":"research-lab","area":"関東","prefecture":"茨城県","officialUrl":"https://sites.google.com/site/nlabibarakiuniv/","evidenceSummary":"茨城大学の公式の研究室一覧に掲載された研究室。研究テーマ: 半導体・光学材料の完全表面創成、ナノ微細加工、プロセスのモデリング&シミュレーション、単結晶基板の超精密加工","researchKeywords":[],"principalInvestigators":["小貫 哲平"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-10-22","labNameEn":"Nano-Engineering Laboratory","department":"機械システム工学領域","researchTopics":["半導体・光学材料の完全表面創成","ナノ微細加工","プロセスのモデリング&シミュレーション","単結晶基板の超精密加工"],"principalInvestigatorDetails":[{"name":"小貫 哲平","nameEn":null,"title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-0f6fe06c1773b968cf48383a","canonicalId":"lab_86ad209017b84ec7be4d6e70b3a3e154","labName":"Nanosystems Laboratory","institutionName":"京都先端科学大学","entityType":"research-lab","area":"関西","prefecture":"京都府","officialUrl":"https://lab.kuas.ac.jp/~banerjee/","evidenceSummary":"京都先端科学大学の公式ページで、Nanosystems Laboratoryの研究（ナノ・マイクロ電気機械システム、センシング・情報処理デバイス、ナノメカニクス）を確認しました。","researchKeywords":["半導体","半導体デバイス","半導体デバイス・プロセス"],"principalInvestigators":["バネルジー アミット"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"BANERJEE Nanosystems Laboratory","department":"工学部 機械電気システム工学科","researchTopics":["ナノ・マイクロ電気機械システム","センシング・情報処理デバイス","ナノメカニクス","ナノエレクトロニクス","ナノ共振器","微細加工"],"principalInvestigatorDetails":[{"name":"バネルジー アミット","nameEn":"Amit Banerjee","title":"准教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"sensor","label":"センサ","group":"device"},{"id":"nanoelectronics","label":"ナノ・分子エレクトロニクス","group":"device"},{"id":"lithography","label":"リソグラフィ・微細加工","group":"process"},{"id":"computing","label":"AI・コンピューティング","group":"application"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-bc6087f750643e7e65b102cb","canonicalId":"lab_26bda920a8664189bb6bec6a20a538e0","labName":"Organic Optoelectronics Unit","institutionName":"沖縄科学技術大学院大学","entityType":"research-lab","area":"九州","prefecture":"沖縄県","officialUrl":"https://www.oist.jp/research/research-units/oou","evidenceSummary":"沖縄科学技術大学院大学の公式ページで、Organic Optoelectronics Unitの研究（organic optoelectronics、optical properties of organic molecules、electrical properties of organic molecules）を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","化合物半導体材料"],"principalInvestigators":["Ryota Kabe"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"Organic Optoelectronics Unit","department":"Okinawa Institute of Science and Technology Graduate University (Research Unit)","researchTopics":["organic optoelectronics","optical properties of organic molecules","electrical properties of organic molecules","optoelectronic device applications"],"principalInvestigatorDetails":[{"name":"Ryota Kabe","nameEn":"Ryota Kabe","title":"Associate Professor"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"organic","label":"有機半導体","group":"material"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-2020b91a7597fd2b82de7a69","canonicalId":null,"labName":"Organic-inorganic spin electronics science (Marumoto Lab)","institutionName":"筑波大学","entityType":"research-lab","area":"関東","prefecture":"茨城県","officialUrl":"https://www.ims.tsukuba.ac.jp/~marumoto_lab/index-e.html","evidenceSummary":"筑波大学の公式の研究室一覧に掲載された研究室。研究テーマ: new semiconductor devices、conducting π-conjugated polymers、solar cells、light-emitting diodes (LEDs)、transistors","researchKeywords":[],"principalInvestigators":["Kazuhiro MARUMOTO"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-10-22","labNameEn":"Organic-inorganic spin electronics science (Marumoto Lab)","department":"Department of Materials Science","researchTopics":["new semiconductor devices","conducting π-conjugated polymers","solar cells","light-emitting diodes (LEDs)","transistors"],"principalInvestigatorDetails":[{"name":null,"nameEn":"Kazuhiro MARUMOTO","title":"Professor"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-6865535e800e6d012112c0aa","canonicalId":"lab_67cb17f7b56a40b98c8f24dc097785ca","labName":"Pham Nam Hai Research Group","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://magn.ee.eng.isct.ac.jp/lab/","evidenceSummary":"東京科学大学の公式ページで、Pham Nam Hai Research Groupの研究（スピン半導体材料とデバイス、Fe系強磁性半導体、BiSbトポロジカル絶縁体）を確認しました。","researchKeywords":["半導体","半導体デバイス・プロセス","半導体スピントロニクス","半導体メモリ","半導体MEMS","マイクロ・ナノデバイス","半導体デバイス"],"principalInvestigators":["ファム ナム ハイ","Pham Nam Hai"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"Pham Nam Hai Research Group","department":"工学院 電気電子系","researchTopics":["スピン半導体材料とデバイス","Fe系強磁性半導体","BiSbトポロジカル絶縁体","SOT-MRAM","スピンp-n接合ダイオード・スピントランジスタ","スピン軌道トルク磁気センサ"],"principalInvestigatorDetails":[{"name":"ファム ナム ハイ","nameEn":"Pham Nam Hai","title":"教授"}],"paperSeries":[],"careerDestinationCount":28,"careerDestinations":[{"name":"三菱電機","kind":"company","companyId":"mitsubishi-electric","companySlug":"mitsubishi-electric","labCount":83},{"name":"東京エレクトロン","kind":"company","companyId":"tokyo-electron","companySlug":"tokyo-electron","labCount":69},{"name":"東芝","kind":"company","companyId":null,"companySlug":null,"labCount":68},{"name":"パナソニックグループ","kind":"company","companyId":"panasonic-energy","companySlug":null,"labCount":64},{"name":"村田製作所","kind":"company","companyId":"murata","companySlug":"murata","labCount":56},{"name":"日立製作所","kind":"company","companyId":null,"companySlug":null,"labCount":53},{"name":"旭化成","kind":"company","companyId":"asahi-kasei","companySlug":"asahi-kasei-official-career","labCount":22},{"name":"パナソニック","kind":"company","companyId":null,"companySlug":null,"labCount":22},{"name":"Western Digital","kind":"company","companyId":"western-digital","companySlug":"western-digital","labCount":18},{"name":"中部電力","kind":"company","companyId":null,"companySlug":null,"labCount":17},{"name":"ファナック","kind":"company","companyId":null,"companySlug":null,"labCount":15},{"name":"古河電工","kind":"company","companyId":null,"companySlug":null,"labCount":11},{"name":"横河電機","kind":"company","companyId":"yokogawa","companySlug":"yokogawa-official-career","labCount":10},{"name":"SanDisk","kind":"company","companyId":null,"companySlug":null,"labCount":4},{"name":"中央大学","kind":"university","companyId":null,"companySlug":null,"labCount":3},{"name":"日本シノプシス","kind":"company","companyId":null,"companySlug":null,"labCount":3},{"name":"経済産業省","kind":"government","companyId":null,"companySlug":null,"labCount":3},{"name":"Micron Memory Japan","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"ウェスタンデジタル","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"フューチャー","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"Amazon Web Service","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"Goertek Technology Japan","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"シンプレクス","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"ホーチミン市教育大学","kind":"university","companyId":null,"companySlug":null,"labCount":1},{"name":"旭化成エレクトロニクス","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"東京科学大学","kind":"university","companyId":null,"companySlug":null,"labCount":1},{"name":"沼津高専","kind":"university","companyId":null,"companySlug":null,"labCount":1},{"name":"電産","kind":"company","companyId":null,"companySlug":null,"labCount":1}],"careerSourceUrls":["https://magn.ee.eng.isct.ac.jp/lab/member/"],"careerYears":{"from":2025,"to":2025},"tags":[{"id":"magnetic","label":"磁性材料","group":"material"},{"id":"transistor","label":"トランジスタ・CMOS","group":"device"},{"id":"memory","label":"メモリ","group":"device"},{"id":"sensor","label":"センサ","group":"device"},{"id":"spintronics","label":"スピントロニクス","group":"device"}],"equipment":[{"id":"eq-aligner","label":"マスクアライナ・露光装置","group":"lithography-patterning"},{"id":"eq-mbe","label":"MBE装置","group":"deposition"},{"id":"eq-ald","label":"ALD装置","group":"deposition"},{"id":"eq-sputter","label":"スパッタ装置","group":"deposition"},{"id":"eq-evaporator","label":"蒸着装置","group":"deposition"},{"id":"eq-spm","label":"AFM・走査プローブ顕微鏡","group":"inspection-metrology"},{"id":"eq-bonder","label":"ボンダー・接合装置","group":"packaging-test"}],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-9742413c362c3a862030bb9b","canonicalId":null,"labName":"Semiconductor Materials Design Lab","institutionName":"筑波大学","entityType":"research-lab","area":"関東","prefecture":"茨城県","officialUrl":"https://www.bk.tsukuba.ac.jp/~semicon","evidenceSummary":"筑波大学の公式の研究室一覧に掲載された研究室。研究テーマ: semiconductor materials、solar energy conversion、thermoelectronics、power semiconductor materials、chalcogenide thin-film solar cells","researchKeywords":[],"principalInvestigators":["Takeaki Sakurai"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-10-22","labNameEn":"Semiconductor Materials Design Lab","department":"College of Engineering Sciences","researchTopics":["semiconductor materials","solar energy conversion","thermoelectronics","power semiconductor materials","chalcogenide thin-film solar cells"],"principalInvestigatorDetails":[{"name":null,"nameEn":"Takeaki Sakurai","title":"Prof."}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-fbfe66be9b90e037d35fb0f2","canonicalId":"lab_e372838562b743108890288841997132","labName":"Solid-State Power Processing Laboratory","institutionName":"京都先端科学大学","entityType":"research-lab","area":"関西","prefecture":"京都府","officialUrl":"https://lab.kuas.ac.jp/~sp2/","evidenceSummary":"京都先端科学大学の公式ページで、Solid-State Power Processing Laboratoryの研究（WBGパワー半導体デバイス、SiC/GaNデバイスの堅牢性評価、高効率・高電力密度パワーコンバータ）を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","半導体デバイス・プロセス","光・電子デバイス","化合物半導体材料","リソグラフィ・半導体計測","マイクロ・ナノデバイス","半導体デバイス"],"principalInvestigators":["アルベルト カステッラッズィ","Alberto Castellazzi"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"Solid-State Power Processing Laboratory (SP2-Lab)","department":"工学部 機械電気システム工学科","researchTopics":["WBGパワー半導体デバイス","SiC/GaNデバイスの堅牢性評価","高効率・高電力密度パワーコンバータ","Yインバータ","両面冷却パッケージング・統合","SiC-GaNハイブリッドスイッチ"],"principalInvestigatorDetails":[{"name":"アルベルト カステッラッズィ","nameEn":"Alberto Castellazzi","title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"sic","label":"SiC","group":"material"},{"id":"gan","label":"GaN・窒化物","group":"material"},{"id":"power-device","label":"パワーデバイス","group":"device"},{"id":"bonding-packaging","label":"接合・実装・パッケージ","group":"process"},{"id":"power-circuit","label":"電源回路・パワーエレクトロニクス","group":"circuit"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-51969b36256f54531df99408","canonicalId":"lab_899109125abd4dbe8c56b803fbe20192","labName":"Tung研究室","institutionName":"東京大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"http://www.vctunglab.org/jp-page","evidenceSummary":"東京大学の公式ページで、Tung研究室の研究（二次元材料のエピタキシャル成長、二次元p型半導体、異次元混成ファンデルワールスヘテロ構造）を確認しました。","researchKeywords":["半導体","半導体結晶成長・エピタキシ","二次元半導体"],"principalInvestigators":["トン ヴィンセント","Vincent Tung"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"VCT 2D Materials Lab","department":"大学院工学系研究科 化学システム工学専攻","researchTopics":["二次元材料のエピタキシャル成長","二次元p型半導体","異次元混成ファンデルワールスヘテロ構造","半導体製造に向けた化学システム工学","異種材料集積","界面化学"],"principalInvestigatorDetails":[{"name":"トン ヴィンセント","nameEn":"Vincent Tung","title":"教授"}],"paperSeries":[],"careerDestinationCount":8,"careerDestinations":[{"name":"Keyence","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"TSMC","kind":"company","companyId":null,"companySlug":null,"labCount":2},{"name":"LAM Research","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"National University of Singapore","kind":"university","companyId":null,"companySlug":null,"labCount":1},{"name":"Nintendo","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"Panasonic North America/ Tesla","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"住友化學","kind":"company","companyId":null,"companySlug":null,"labCount":1},{"name":"浙江大學 衢州研究院","kind":"university","companyId":null,"companySlug":null,"labCount":1}],"careerSourceUrls":["http://www.vctunglab.org/group-member"],"careerYears":null,"tags":[{"id":"two-dimensional","label":"二次元材料・グラフェン","group":"material"},{"id":"quantum-structure","label":"量子ドット・ナノ構造","group":"material"},{"id":"crystal-growth","label":"結晶成長・エピタキシ","group":"process"},{"id":"doping","label":"ドーピング・イオン注入","group":"process"},{"id":"bonding-packaging","label":"接合・実装・パッケージ","group":"process"},{"id":"surface-interface","label":"表面・界面","group":"physics"}],"equipment":[{"id":"eq-aligner","label":"マスクアライナ・露光装置","group":"lithography-patterning"},{"id":"eq-mocvd","label":"MOCVD・MOVPE装置","group":"deposition"},{"id":"eq-spm","label":"AFM・走査プローブ顕微鏡","group":"inspection-metrology"},{"id":"eq-xps","label":"XPS・光電子分光","group":"inspection-metrology"},{"id":"eq-optical-spectroscopy","label":"ラマン・PL分光","group":"inspection-metrology"},{"id":"eq-prober","label":"プローバ・半導体パラメータアナライザ","group":"inspection-metrology"}],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-38e1cc187e02eafb8f2c41d9","canonicalId":"lab_a46c6b623ec94961a25f817deb2ce72c","labName":"VLSI設計・テスト研究室","institutionName":"東京都立大学","entityType":"research-lab","area":"関東","prefecture":"東京都","officialUrl":"https://www.sd.tmu.ac.jp/research/data/ma/695.html","evidenceSummary":"東京都立大学の公式ページで、VLSI設計・テスト研究室の研究（VLSI設計、集積回路テスト、アナログ/デジタル混載VLSI）を確認しました。","researchKeywords":["半導体","集積回路"],"principalInvestigators":["三浦 幸也"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":null,"department":"システムデザイン研究科 電子情報システム工学域（情報科学科）","researchTopics":["VLSI設計","集積回路テスト","アナログ/デジタル混載VLSI","故障解析","CAD開発"],"principalInvestigatorDetails":[{"name":"三浦 幸也","nameEn":"MIURA Yukiya","title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"reliability","label":"信頼性・故障解析","group":"process"},{"id":"ic","label":"集積回路（LSI）","group":"circuit"},{"id":"analog","label":"アナログ・ミックスドシグナル設計","group":"circuit"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-fd50d0796efce8cf416dfa93","canonicalId":"lab_52ecf3365a054b0ea4e9ef043d180801","labName":"WOWアライアンス異種機能集積研究ユニット（大場隆之研究室）","institutionName":"東京科学大学","entityType":"research-lab","area":"関東","prefecture":"神奈川県","officialUrl":"https://www.wow.first.iir.isct.ac.jp/","evidenceSummary":"東京科学大学の公式ページで、WOWアライアンス異種機能集積研究ユニット（大場隆之研究室）の研究（BBCube三次元集積、WOW/COWプロセス、3DI設計及びアーキテクチャ）を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","化合物半導体材料","半導体デバイス・プロセス","マイクロ・ナノデバイス","半導体デバイス"],"principalInvestigators":["大場 隆之","Takayuki Ohba"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-24","labNameEn":"Ohba Laboratory (WOW Alliance)","department":"総合研究院 WOWアライアンス異種機能集積研究ユニット／未来産業技術研究所 先端集積エレクトロニクス研究コア","researchTopics":["BBCube三次元集積","WOW/COWプロセス","3DI設計及びアーキテクチャ","3DI冷却技術","ワイドバンドギャップ半導体パワーデバイス","ウエハ超薄化"],"principalInvestigatorDetails":[{"name":"大場 隆之","nameEn":"Takayuki Ohba","title":"特任教授（ユニット・リーダー）"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"power-device","label":"パワーデバイス","group":"device"},{"id":"bonding-packaging","label":"接合・実装・パッケージ","group":"process"},{"id":"digital","label":"デジタル回路・プロセッサ","group":"circuit"},{"id":"semiconductor-physics","label":"半導体物性","group":"physics"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-b46d98852c1dd83dd4e0d794","canonicalId":"lab_e9e0534ab2a542b5bc29bd31aa04c3dc","labName":"YNUスピントロニクス研究室（関口研究室）","institutionName":"横浜国立大学","entityType":"research-lab","area":"関東","prefecture":"神奈川県","officialUrl":"https://spin.ynu.ac.jp/","evidenceSummary":"横浜国立大学の公式ページで、YNUスピントロニクス研究室（関口研究室）の研究（半導体シリコンにおけるスピン流制御、磁気トンネル接合MRAM、マグノニクス）を確認しました。","researchKeywords":["半導体","半導体メモリ","半導体スピントロニクス","半導体デバイス・プロセス","マイクロ・ナノデバイス","半導体デバイス"],"principalInvestigators":["関口 康爾"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"Spintronics/Magnonics Research Laboratory","department":"大学院工学研究院 知的構造の創生部門（理工学部 数物・電子情報系学科 電子情報システムEP／大学院理工学府 数物・電子情報系理工学専攻）","researchTopics":["半導体シリコンにおけるスピン流制御","磁気トンネル接合MRAM","マグノニクス","マグノントランジスタ","スピン波演算素子","超低電力マグノン演算"],"principalInvestigatorDetails":[{"name":"関口 康爾","nameEn":"Koji Sekiguchi","title":"教授"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"silicon","label":"シリコン","group":"material"},{"id":"transistor","label":"トランジスタ・CMOS","group":"device"},{"id":"memory","label":"メモリ","group":"device"},{"id":"spintronics","label":"スピントロニクス","group":"device"},{"id":"energy-environment","label":"エネルギー・環境","group":"application"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null},{"publicLabId":"rlab-c74a868d3a6dae26fee92a7c","canonicalId":"lab_37a784b2f895440aabe0c5e0b431b3bf","labName":"pi-Conjugated Polymers Unit","institutionName":"沖縄科学技術大学院大学","entityType":"research-lab","area":"九州","prefecture":"沖縄県","officialUrl":"https://www.oist.jp/research/research-units/picpu","evidenceSummary":"沖縄科学技術大学院大学の公式ページで、pi-Conjugated Polymers Unitの研究（polymer semiconductors、organic electronics、OLEDs）を確認しました。","researchKeywords":["半導体","ワイドバンドギャップ半導体","化合物半導体材料","半導体フォトニックデバイス","光・電子デバイス"],"principalInvestigators":["Christine Luscombe"],"paperDbListed":null,"paperCount":null,"latestPaperYear":null,"matchedPresentationCount":0,"explicitPresenterPresentationCount":0,"latestPresentationYear":null,"conferenceActivity":[],"lastVerified":"2026-09-25","labNameEn":"pi-Conjugated Polymers Unit","department":"Okinawa Institute of Science and Technology Graduate University (Research Unit)","researchTopics":["polymer semiconductors","organic electronics","OLEDs","stretchable devices","bioelectronics"],"principalInvestigatorDetails":[{"name":"Christine Luscombe","nameEn":"Christine Luscombe","title":"Professor"}],"paperSeries":[],"careerDestinationCount":0,"careerDestinations":[],"careerSourceUrls":[],"careerYears":null,"tags":[{"id":"organic","label":"有機半導体","group":"material"},{"id":"flexible","label":"フレキシブル・印刷エレクトロニクス","group":"device"}],"equipment":[],"headBirthYear":null,"headBachelorYear":null}]}