ASM半導体製造装置海外勤務
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging
- 勤務地海外
- デバイス・プロセス・設計プロセスエンジニア
- 工程CVD（化学気相成長）
- 中途
公式ページ 2026/09/20 時点当サイト掲載 2026/09/20
仕事内容
Job's Mission
As a senior process engineering leader at ASM, you will drive the development of high-thermal-conductivity thin films that enable next generation high-performance computing (HPC) and advanced packaging. You’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer
応募条件
· Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field · 10–15+ years of experience in the semiconductor or semiconductor capital equipment industry, including senior-level technical leadership roles · Proven track record of developing and delivering new semiconductor process technologies to customers · Strong working knowledge of semiconductor device physics and manufacturing processes · Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders · Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment · Excellent communication skills in English; ability to collaborate in a global R&D environment · Willingness to travel approximately 10–20% What sets you apart · Deep expertise in ALD/PEALD, CVD/PECVD, including RF and/or microwave based · E
勤務条件
- 勤務地
- 海外
- 出張
- 出張あり
- 想定役割
- 管理職・マネージャー
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