10.18
– 10.21
実装 / 先端パッケージ / 3D integration · Fort Worth, Texas, United States
SCHEDULE
Embassy Suites by Hilton Fort Worth Downtown
出典確認日: 2026-09-13
WATCH POINTS
Electronic packaging and systems electrical performance, signal integrity, power integrity, thermal integrity, high-speed interconnects, SerDes, DDR and memory interfaces, RF/wireless/quantum system interconnects, advanced packaging, 3D integration, heterogeneous integration, chiplet interfaces, co-packaged optics, package/PCB design, modeling, simulation, measurement, CAD, and ML/AI-assisted interconnect and packaging workflows.
Two-column, three-page PDF only. The submitted manuscript must be camera-ready and IEEE-compliant; noncompliant manuscripts are not considered for review.
EPEPS 2026は2026年10月18〜21日にFort Worthで開催。投稿締切は2026年7月22日、形式は2段組3ページPDF。公式サイトはEPEPS 2026 EasyChair programへのリンクを公開している。