ASM半導体製造装置海外勤務
Senior Engineer, Field Process (Boise, ID)
- 勤務地海外
- フィールド・顧客技術支援アプリケーション・フィールドプロセスエンジニア
- 工程エピタキシャル成長
- 中途
公式ページ 2026/09/20 時点当サイト掲載 2026/09/20
仕事内容
Key Responsibilities
New Product Introduction (NPI) Lead joint process development and qualification of new ASM systems and products at customer sites. Receive training from ASM Business Units to gain expertise in newly developed deposition processes (PEALD, PECVD, Epitaxy, LPCVD/vertical furnace) and hardware. Manage the introduction and transfer of new processes and hardware to customer sites. Collaborate closely with field hardware, service, sales teams, and Business Units to support and troubleshoot new product issues. Develop proposals for equipment and process design improvements and conduct experiments with customers. Escalate issues as needed to ensure timely resolution and adherence to project scope and timelines. Document NPI learnings to support future IQ, hardware, and process rollout packages. Facilitate knowledge transfer to local process and service teams at manufacturing sites. Provide in‑depth process and equipment expertise, troubleshooting leadership, and escalation support to ensure successful NPI implementation. On‑Site Process Development Support customer deposition process and hardware development, including new development and continuous improvement projects (CIP). Work closely with customers to design and execute experiments for device integration, process development, troubleshooting, and CIP needs. Analyze baseline process and system performance and identify gaps relative to technology node
応募条件
必須
- Equivalent combination of education and experience with strong fundamentals in thin‑film processing, development, and characterization using deposition reactors such as thermal ALD, PEALD, PECVD, and Epitaxy.
- Minimum of 3–5 years of experience as a process engineer, or a combination of relevant academic and industry experience.
- Experience with DRAM and NAND device integration and technology development preferred.
- Experience with advanced packaging integration and process development (wafer‑level hybrid bonding, fusion bonding, die‑to‑wafer, HBM) preferred.
- Strong knowledge of semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and ALD deposition equipment.
- Demonstrated success in film deposition optimization and process development; experience with ASM ALD, PEALD, PECVD, and Epitaxy tools is a strong plus.
- Experience with Design of E
募集要項の原文
Equivalent combination of education and experience with strong fundamentals in thin‑film processing, development, and characterization using deposition reactors such as thermal ALD, PEALD, PECVD, and Epitaxy. Minimum of 3–5 years of experience as a process engineer, or a combination of relevant academic and industry experience. Experience with DRAM and NAND device integration and technology development preferred. Experience with advanced packaging integration and process development (wafer‑level hybrid bonding, fusion bonding, die‑to‑wafer, HBM) preferred. Strong knowledge of semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and ALD deposition equipment. Demonstrated success in film deposition optimization and process development; experience with ASM ALD, PEALD, PECVD, and Epitaxy tools is a strong plus. Experience with Design of E
勤務条件
- 勤務地
- 海外
- リモート
- 出社勤務
- 出張
- 出張あり