マイクロン・テクノロジーメモリ
Staff / Principal Spares Engineer, Operations Central Team
- 勤務地広島県広島市
- 製造・生産・工場運営装置エンジニア(量産設備技術)
- 中途
- 正社員
仕事内容
Responsibilities
Spares Engineering Lead and execute spares engineering programs to drive operational and cost efficiency Analyze metrics and demand trends to identify and act on improvement opportunities Drive programs in a structured and systematic manner, ensuring milestones, timelines, and deliverables are consistently met Identify process gaps and bottlenecks within spares engineering and implement effective corrective actions Develop and present program status updates, reports, and recommendations to key stakeholders Support technical aspects for Spares Related issues and drive for consistent improvement through collaboration with Suppliers Be a category leader leading global strategy for Spares Lifetime, CCRR, Alternate Source and consumption reduction activities Test Wafers Coordinate with process and equipment engineering teams to optimize test wafer usage and minimize waste as well as fab additional space creation. Establish and maintain test wafer planning processes aligned with engineering demand and capacity Monitor test wafer utilization trends and provide data-driven recommendations to reduce costs and improve efficiency Ensure proper documentation, traceability, and compliance for all test wafer transactions and usage records Shared / Common Collaborate cross-functionally with engineering, operations, supply chain, and leadership teams Travel to multiple sites or Supplier locations as required to support program execution Maintain accurate documentation and ensure compliance with engineering standards and best practices Cross‐Functional & Cross‐Site Coordination Enable collaboration across stakeholders including FE central planning functions, fab planning teams, SMAI, OCT and other central teams. Act as a central integration point to ensure alignment across regions, functions Support recurring global forums and programs specific reviews to ensure consistent execution and escalation of issues. External Benchmarking and Analysis Lead analysis and benchmarking efforts with competitors from Spares and Test Wafer front Identify opportunities for improvement Minimum
応募条件
必須
- Bachelor's degree or higher in Engineering (Electrical, Mechanical, Industrial, Materials, or related discipline) from an accredited university, OR equivalent engineering training/certification ~ 6 years of experience in the semiconductor industry Demonstrated experience in engineering program management or productivity-related initiatives Strong understanding of productivity concepts, demand planning principles Familiarity with semiconductor wafer processes, test wafer usage protocols, or related engineering operations
歓迎
- Experience in spare parts management, equipment engineering, or semiconductor manufacturing environments Familiarity with structured methodologies such as Lean, Six Sigma, or PDCA Proficiency in data analysis tools such as Excel, Power BI, or equivalent platforms Experience presenting to and influencing senior stakeholders Hands-on
募集要項の原文
Qualifications Bachelor's degree or higher in Engineering (Electrical, Mechanical, Industrial, Materials, or related discipline) from an accredited university, OR equivalent engineering training/certification ~ 6 years of experience in the semiconductor industry Demonstrated experience in engineering program management or productivity-related initiatives Strong understanding of productivity concepts, demand planning principles Familiarity with semiconductor wafer processes, test wafer usage protocols, or related engineering operations Preferred Qualifications Experience in spare parts management, equipment engineering, or semiconductor manufacturing environments Familiarity with structured methodologies such as Lean, Six Sigma, or PDCA Proficiency in data analysis tools such as Excel, Power BI, or equivalent platforms Experience presenting to and influencing senior stakeholders Hands-on
勤務条件
- 勤務地
- 広島県広島市
- 雇用形態
- 正社員
- 出張
- 出張あり
同じ職種・工程の求人5件
- HVM DF Equipment Engineerマイクロン・テクノロジー広島県
- Scanner Equipment Engineer (Photolithography / DUV)マイクロン・テクノロジー広島県 / 露光
- CMP・BONDING装置エンジニア(最先端半導体技術開発)/ ENGINEER - F15 MFG CMP/BONDING Equipment Engineerマイクロン・テクノロジー広島県 / CMP(化学機械研磨)
- HVM DRY Equipment Engineerマイクロン・テクノロジー広島県 / ドライエッチング
- ENGINEER, HVM EQUIP PV EQマイクロン・テクノロジー広島県