マイクロン・テクノロジーメモリ
CMP・BONDING装置エンジニア(最先端半導体技術開発)/ ENGINEER - F15 MFG CMP/BONDING Equipment Engineer
- 勤務地広島県広島市
- 製造・生産・工場運営装置エンジニア（量産設備技術）
- 工程CMP（化学機械研磨）
- 中途
- 正社員
仕事内容
職務内容
CMP/BONDING process toolの立ち上げ必要な安全教育をすべて完了し、Micronの安全方針に従ってすべての作業を実施する新装置の設計、開発、特性評価を主導し、ハードウェアおよび手順上のギャップを特定・解消する作業品質、コスト管理、プロジェクトスケジュールの遵守を確保しながら、装置のインストールとアップグレードを監督する装置ベンダーと連携し、既存製品の改善とロードマップのニーズ実現に努める装置の性能、運用手順、保守仕様、コスト指標をまとめた文書の作成・維持管理を行う社内監査および社外監査への対応AIを用いた業務工数改善、データのサマライズ必須条件半導体業界での経験、または生産現場における装置・設備エンジニアとしての経験をお持ちの方データや事実に基づく問題解決能力をお持ちの方チーム内外の関係者と円滑なコミュニケーションを図り、協働して業務を推進できる方技術的な内容を理解し、説明・教育・開発に活用できる能力をお持ちの方優れた時間管理能力およびマルチタスク遂行能力をお持ちの方Microsoft Office(Excel、Word、PowerPoint)の実務経験をお持ちの方クリーンルーム環境において継続的に業務を遂行できる方日本語での円滑なコミュニケーション能力(JLPT N1相当)英語による基本的なコミュニケーション能力(高校卒業レベル以上)
※海外拠点とのメールや会議、英語の技術資料を扱う機会がありますが、翻訳ツール等を活用しながら対応いただける環境です。現時点で高い英語力は必須ではありませんが、継続的に学習する意欲をお持ちの方を歓迎します歓迎条件:Digital Skills(スクリプト作成、RPA、Tableau等)に関する基礎知識・実務経験ビジネスレベル以上の英語力SummaryThis position is for an Equipment Engineer supporting CMP and advanced Bonding processes.In this role, you will be involved in the startup and qualification of new equipment for advanced Bonding technology, one of the most innovative and rapidly evolving areas in the semiconductor industry. Beyond maintaining and supporting high-volume manufacturing operations, you will play a key role in introducing, optimizing, and scaling new processes and equipment at the forefront of next-generation semiconductor technology development.
仕事内容の続きを表示
Rather than simply operating established technologies, you will have frequent opportunities to solve complex technical challenges through experimentation, data-driven analysis, and continuous improvement. This position is ideal for individuals who are passionate about innovation, enjoy tackling engineering challenges, and are motivated to create new value through proactive problem-solving and collaboration.If you are energized by dynamic environments, cutting-edge technology, and continuous learning rather than routine work, we encourage you to apply and help shape the future of semiconductor manufacturing.ResponsibilitiesLead the startup and qualification of CMP/Bonding process equipment.Complete all required safety training and perform all work in accordance with Micron safety policies and procedures.Drive the design, development, and characterization of new equipment while identifying and closing hardware and process gaps.Oversee equipment installation and upgrade activities while ensuring high-quality execution, cost control, and adherence to project schedules.Collaborate with equipment suppliers to improve existing products and support future technology roadmap
応募条件
必須
- Develop and maintain documentation related to equipment performance, operating procedures, maintenance
- and cost metrics.Support internal and external audits as required.
募集要項の原文
Requirements .Develop and maintain documentation related to equipment performance, operating procedures, maintenance Requirements , and cost metrics.Support internal and external audits as required.Leveraging AI technologies to enhance operational efficiency, analyze complex data, and enable data-driven decision-making.Minimum Qualifications Experience in the semiconductor industry, or experience as an equipment/facilities engineer in a manufacturing environment.Strong analytical and data-driven problem-solving skills.Ability to communicate effectively and collaborate with stakeholders across multiple functions and teams.Ability to understand, present, teach, and develop technical concepts and solutions.Basic knowledge of programming and database technologies.Strong time management and multitasking skills.Proficiency in Microsoft Office applications (Excel, Word, and PowerPoint).Ability
勤務条件
- 勤務地
- 広島県広島市
- 雇用形態
- 正社員
- リモート
- 出社勤務
- 日本語
- 必須