ASM半導体製造装置海外勤務
Principal Engineer, Mechanical Engineering (Chemical/Materials Based)
- 勤務地海外
- 装置エンジニアリング機械設計
- 工程先端パッケージ(2.5D・3D・チップレット)
- 中途
公式ページ 2026/09/20 時点当サイト掲載 2026/09/20
仕事内容
Job's Mission
At ASM, our technology powers the most advanced semiconductor devices in the world, and our people are at the heart of that innovation. We are hiring Engineers of various experience levels across multiple KPUs, product lines, and technology domains. Joining ASM gives you the opportunity to join a global organization where the complexity of the challenges matches the scale of the impact. As part of our Advanced Packaging team, you’ll operate at the intersection of cutting-edge technology, engineering, field operations, and customer environments, ensuring our technologies perform reliably from early concept through high-volume manufacturing. The Challenge You’ll apply your expertise to the design and development of next-generation semiconductor equipment within ASM’s Advanced Packaging team. Working alongside experienced engineers, you’ll contribute to cutting-edge mechanical systems while building deep industry knowledge. This role offers hands-on technical challenges, mentorship, and a clear pathway for growth. You’ll also play a key role across the full product lifecycle, from development and first builds through customer qualification and scale. Depending on your
Background
, you may focus on system-level troubleshooting, new product introduction, automation, or driving performance improvements in the field. What you will be working on Contribute to design and development of semiconductor systems, including common modules design, supply chain design, and data analytics. Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards. Collaborate with cross-functional teams in manufacturing, supply chain, and quality to align on goals and deliverables. Provide technical support and troubleshooting for modules such as gas delivery, test
応募条件
必須
- Bachelor’s, Master’s or PhD degree in Engineering (Mechanical, Electrical, Chemical, Systems, or similar disciplines); Data analytics/AI agentic is a plus.
- Experience in semiconductor equipment or complex technical environments Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.
- Strong problem-solving mindset with system-level thinking Hands-on approach and ability to connect theory with real-world system behavior Analytical skills (DOE, data analysis, structured problem solving) Comfortable working across global teams and time zones Strong communication skills, including customer-facing interactions Willingness to travel internationally (~20%) What sets you apart Work across a broad range of technologies (plasma, vacuum, gas delivery, software, hardware integration, data analytics) Operate where product development meets real-world
募集要項の原文
Bachelor’s, Master’s or PhD degree in Engineering (Mechanical, Electrical, Chemical, Systems, or similar disciplines); Data analytics/AI agentic is a plus. Experience in semiconductor equipment or complex technical environments Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment. Strong problem-solving mindset with system-level thinking Hands-on approach and ability to connect theory with real-world system behavior Analytical skills (DOE, data analysis, structured problem solving) Comfortable working across global teams and time zones Strong communication skills, including customer-facing interactions Willingness to travel internationally (~20%) What sets you apart Work across a broad range of technologies (plasma, vacuum, gas delivery, software, hardware integration, data analytics) Operate where product development meets real-world
勤務条件
- 勤務地
- 海外
- リモート
- 出社勤務
- 出張
- 出張あり