ASM半導体製造装置海外勤務
Senior Principal Engineer, Global Product Management - Advanced Packaging
- 勤務地海外
- 営業・マーケティングマーケティング・製品企画
- 工程先端パッケージ（2.5D・3D・チップレット）
- 中途
公式ページ 2026/09/20 時点当サイト掲載 2026/09/20
仕事内容
Key Responsibilities
Product Lifecycle Management: Lead advanced packaging product platforms from concept through commercialization, high-volume manufacturing, and end-of-life, ensuring alignment with customer roadmaps and business objectives. Technology & Product Roadmap Development: Define and maintain product roadmaps that support emerging advanced packaging applications, including hybrid bonding, chiplets, 2.5D/3D integration, HBM, wafer-to-wafer and die-to-wafer processes. Product Definition & Configuration Management: Own product
応募条件
必須
- 5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry. Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field.
- 5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies. Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies.
募集要項の原文
5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry. Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field. Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies. Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies. Experience working with semiconductor manufacturers, foundries, OSATs, or advanced packaging organizations. Str
勤務条件
- 勤務地
- 海外
- 出張
- 出張多め・定期出張