Sr. Product Package Solution Engineer

Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications.This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction.Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market.You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries.Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external.Translating the product requirements for New product introduction in terms of package specific spec., reliability, cost.Qualifications :Master’s or bachelor’s degree in Material Science, Electrical Engineering.Proactive working attitude and capable to handle new challenge.Analytically strong, drives for results, able to deal with ambiguities.Ambitious, energetic, result-oriented entrepreneur with a strong drive for results.People person and team player, very strong interpersonal skillsRelated field along with at least 10 years of experience in semiconductor IC packaging. Proficient risk assessment, risk mitigation and 8D skill.Knowledge of related package platforms such as leadframe based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging is also expected. Project management experience is required.Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers.Preferred Qualifications :Understanding of foundry process, assembly process, and failure analysis. PMP and Six Sigma certification is preferred.Good coomunication in both English and Japanese languages.More information about NXP in Japan...#LI-047f