ESTC 2026IEEE Electronics System-Integration Technology Conference

次回を追う場合は Previous Conferences ページと IEEE EPS の会議一覧を定期的に開き直すことになります。

2026 会期

September 9–11, 2026 IEEE ESTC 2026 公式トップ

2026 開催都市・国

Helsinki, Finland IEEE ESTC 2026 公式トップ

2026 会場

Finlandia Hall / Mannerheimintie 13e / 00100 Helsinki Venue & Hotels

2026 会期・会場（IEEE EPS 側の記載）

Finlandia Hall, Helsinki, Finland / Sep 09, 2026 - Sep 11, 2026 IEEE Electronics Packaging Society - Conferences

2026 開催地の告知

We look forward to welcoming you all at IEEE ESTC 2026 in Helsinki! Previous Conferences 配下の ESTC 2024 振り返りページの末尾 ESTC 2024（Berlin）振り返り

2026 要旨の分量

Submit your abstract of 600 words (max.) and up to 2 (optional) figures IEEE ESTC 2026 Call for Papers（PDF）

2026 投稿システム

ConfTool（https://www.conftool.org/estc2026） IEEE ESTC 2026 Call for Papers（PDF）

2026 要旨締切（改訂後）

Abstract submission deadline: extended until 15 March 2026 Submissions

2026 採択通知（改訂後）

Notification of acceptance: postponed to 24 April 2026 Submissions

2026 論文締切（改訂後）

Paper submission deadline: extended until 21 June 2026 Submissions

2026 発表書式

oral は1件25分で 4–5 minutes remain for questions、スライドは 16:9、There is no presentation template for IEEE ESTC 2026. の一文あり。poster は A0（84.1 × 118.9 cm, portrait orientation）で font size: no smaller than 18 pt スライドは前日の 7:00 p.m. までに ConfTool へアップロードと記載。poster は provided poster template の使用を recommend しつつ not mandatory と書かれている Submissions

2026 登壇者の登録義務

For every accepted paper one person from the group of authors will have to register at the author rate. Registration

査読の担い手

Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees. Technical Program Committee

2026 サブコミッティ数

10（各トピックに Chair と Co-Chair） Advanced Packaging と RF, mm-wave and THz Systems Packaging の Co-Chair、Power Electronics System Packaging の Chair は t.b.a. 表記 Technical Program Committee

2026 Technical Program Chair

Grace O'Malley, INEMI, USA Technical Program Committee

品質面の統括

The ESTC Steering Committee is responsible for observing the general high-level quality of ESTC and for strategic decisions. ESTC Steering Committee

採択率

2020年大会ページに 124 presented papers, extracted from 194 submitted abstracts と記載 2020年サイクルの数値であり、2026年サイクルの数値とは別 ESTC 2020 振り返り

Call for Papers は noncommercial な論文を募ると印字しているため、製品紹介の比重が高い原稿は投稿前に構成を組み替える対象になります。

2026 トピック一覧

Advanced Packaging / Materials for Interconnects and Packaging / Optoelectronic Systems Packaging / Assembly and Manufacturing Technologies / Design Tools and Modeling / Power Electronics System Packaging / Advanced Technologies for Emerging Systems / Reliability of Electronic Devices and Systems / Flexible, Printed and Hybrid Electronics / RF, mm-wave and THz Systems Packaging Topics ページに 10 件が番号付きで並ぶ Topics

Advanced Packaging の副題

Challenges and Solutions in 3D Integration, Embedded Structures, Wafer and Panel Level Packaging, Hybrid-bonding, Packaging Solutions for Chiplets, Advanced Substrates and Interposers Considering Reliability and Quality Aspects Topics

Optoelectronic Systems Packaging の副題

Innovative Packaging Technologies for Quantum Photonic Subsystems, High Density Integration Technologies for SiPh 同じ本文には Thermal Management Challenges at the System Level と Reliability Plans for Quantum Photonic Subsystems Working at Cryogenic Temperatures も続く Topics

Power Electronics System Packaging の副題

High Performance Packaging (Low RDS(on), Low Rth, High Temperature, Fast-switching High-frequency Compatible) 同じ本文に Integration Aspects of Wide Bandgap Power Semiconductor Devices も並ぶ Topics

2026 募集対象の書き方

The IEEE ESTC 2026 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. noncommercial の語が入っている IEEE ESTC 2026 Call for Papers（PDF）

トピックとサブコミッティの対応

Technical Program Committee の 10 サブコミッティは Topics ページの 10 トピックと同じ名称で、掲載順だけが異なる Topics ページは Optoelectronic Systems Packaging が3番目、TPC ページは4番目 Technical Program Committee

2026 セッションコードの例

AP 1: Substrate Innovation / Rel 1: Reliability of Solder Joints / RF 1: System in Package Solutions for Radar Applications / Flex 1: Material Advances for Flexible Electronics ConfTool のプログラム 9月9日 15:20–16:35 枠に並ぶ4本 IEEE ESTC 2026 ConfTool セッション一覧

keynote は Program ページと Keynotes ページで人数の書き方に差がある。

2026 発表件数

105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics 同ページには Please note that changes in the program may still occur. の注記が付く Program

2026 keynote 登壇者

Sami Repo（Nokia Solutions & Networks, Finland）／Dr. Jan Goetz（IQM Quantum Computers, Germany）／Thorsten Meyer（Infineon Technologies, Germany）／Joris Van Campenhout（imec, Belgium）／John H Lau（Unimicron Technology Corporation, Taiwan）／Dr. Christophe Zinck（ASE, France） Program ページ本文は five distinguished packaging experts as keynote speakers と書いている Keynotes

2026 professional development course

eight professional development courses on the morning of the first conference day Short Courses ページでは 08:00–10:15 と 10:30–12:45 の2枠に各4講座 Program

2026 PDC の題目例

Efficient Thermal Simulations Using Compact Models（Tamara Bechtold, Jade University of Applied Sciences, Germany）／Cu-Cu Hybrid Bonding and Glass Packaging（John H Lau, Unimicron Technology Corporation）／Integrated Photonic Packaging – Materials, Processes, Equipment, and Scaling to Production（Prof. Peter O'Brien, Tyndall Institute, University College Cork, Ireland） Short Courses ページの PDC Session 1 / 2 の一覧より Short Courses

2026 併設ワークショップ

an EPS HIR Workshop ConfTool のプログラムでは 9月9日に IEEE EPS Heterogeneous Integration Roadmap (HIR) I / II として並ぶ Program

2026 special session

Quantum Chips and Their Packaging（9月10日 9:00–10:15am）／Skills Shortage in Electronics Packaging and Case Studies on Addressing It（9月10日 11:00am–12:15pm）／The First Five Pilot Lines Launched Under the Chips for Europe Initiative - Where We Are, and What's Next with Respect to Advanced Packaging（9月10日 1:45–3:00pm） 3件目は NanoIC・FAMES・APECS・WBG・PIXEurope の5件を主題とする Special Sessions

2026 panel discussion

Sustainable Electronics: Emissions, Critical Materials and Circular Strategies（Thursday, September 10, 2026, 5:05pm – 6:20pm、モデレーター Prof. Mervi Paulasto-Kröckel, Aalto University） Panel Discussion

2026 conference dinner

Thursday, September 10, 2026, from 7:15 p.m. / Hilton Helsinki Kalastajatorppa, Kalastajatorpantie 1, 00330 Helsinki Conference Dinner

TPC の Chair・Co-Chair は Fraunhofer 系と欧州の大学が中心で、産業側では Robert Bosch と Texas Instruments が入っています。

2026 General Chair

Toni Mattila, Business Finland, Finland Executive Committee

2026 Executive Committee の役職

General Chair / Program Chair (next GC) / Finance Chairs（Thomas Zerna, Karsten Meier、ともに TU Dresden, Germany）/ Exhibition & Sponsorship Manager（Steffen Kröhnert, ESPAT-Consulting, Germany）/ Marketing Communications Chair（Mikael Broas, IQM Quantum Computers）/ Conference Management（Martina Creutzfeldt, mcc Agentur für Kommunikation GmbH, Germany） Executive Committee

Steering Committee 議長

Chair: Rolf Aschenbrenner, Fraunhofer IZM, Germany 同委員会には EPS Vice President Conferences（Tanja Braun, Fraunhofer IZM Berlin, Germany）と EPS Region 8 Director（Steffen Kröhnert, ESPAT-Consulting, Germany）の席がある ESTC Steering Committee

2026 TPC の所属所在国

Germany（Fraunhofer IZM, Fraunhofer IWM, TU Dresden, Leibniz University Hannover, ECPE European Center for Power Electronics）／Finland（Aalto University, VTT）／Norway（University of South-Eastern Norway）／France（CEA LETI）／USA（INEMI, Texas Instruments/Kilby Labs）／所属名のみの表記: Robert Bosch GmbH Chris Bailey は Arizona State University, UK と表記されている Technical Program Committee

2026 想定参加規模

more than 300 engineers, managers, and decision makers from all areas of the microelectronics and systemintegration community Exhibition & Sponsoring

2026 スポンサー掲載

Platinum: ASE／Gold: Pactech, Swissbit／Silver: ACCRETECH, ALTER, Besi, DISCO HITEC Europe GmbH, ERS electronic GmbH, HIR, Business Finland／個別枠: Conference Lanyard は Umicore、Welcome Reception は Carl Zeiss Microscopy、Best Paper/Poster Awards・All Conference Breaks・Social Event は ASE、Logo Sponsors は EVG と Murata Exhibition & Sponsoring

2026 出展社掲載

Premium Exhibition Booth: AEMTEC, Amadyne, Fraunhofer-ENAS, Imec, Plasmatreat, Teltec, TNO, VTT／Standard Exhibition Booth: Biolin Scientific, Comsol, DANTEC Dynamics, Eurofins/Maser, FAMES Pilot Line, Finetech, EPS, IMAPS, Lidrotec, PIX Europe, Planoptik, PVATePla, Roartis, Silicon Austria Labs, Semilab, Sentech, SET, Tampere University, TOWA, Tresky, Carl Zeiss Microscopy／Innovation Corner（Tabletop）: TU Dresden Exhibition & Sponsoring

proceedings は参加登録に含まれる。IEEE EPS 側には ECTC・ESTC・EPTC の best paper へ他の flagship conference への渡航費を支給する枠が案内されています。

2026 収録先（Call for Papers の表記）

Accepted contributions will be published in the conference proceedings, and archived in IEEE Xplore (provided they comply with specifications). IEEE ESTC 2026 Call for Papers（PDF）

検索性についての記載

IEEE ESTC papers can be searched through IEEE, Google Scholar and other search engines. IEEE ESTC 2026 Call for Papers（PDF）

2026 参加登録に含まれるもの

Fees cover access to all sessions, the exhibition, the welcome reception, the conference dinner and the conference proceedings. 直前に All fees include 25.5% Finnish VAT. を併記 Registration

IEEE EPS の best paper 渡航支援

To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference. 同段落に up to US$2,125 for intercontinental travel、up to US$1,375 for intracontinental travel と記載 IEEE Electronics Packaging Society - Conferences

回次の数字が一覧に印字されるのは 2008・2014・2016 の3行だけなので、年と回次を対照する場合は各年の振り返りページを開くことになります。

初回開催

2006年 / Dresden, Germany この行の表記は年・都市・国まで Previous Conferences

シリーズ発足の記述

Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. premier venue は公式の自称表現をそのまま引用したもの Mission

開催地の推移

2006 Dresden（Germany）→ 2008 Greenwich, London（UK、紹介文に 2nd edition）→ 2010 Berlin（Germany）→ 2012 Amsterdam（Netherlands）→ 2014 Helsinki（Finland、紹介文に 5th edition）→ 2016 Grenoble（France、紹介文に 6th edition）→ 2018 Dresden（Germany）→ 2020 Digital/Vestfold（Norway）→ 2022 Sibiu（Romania）→ 2024 Berlin（Germany） 回次の数字は 2008・2014・2016 の紹介文にだけ印字され、他の年は年・都市・国のみ Previous Conferences

2020年大会の形態

ESTC 2020 was the first ESTC to take place completely on a virtual platform, enforced by the COVID-19 pandemic. ESTC 2020 振り返り

2020年大会の規模

245 registered attendees / 124 presented papers, extracted from 194 submitted abstracts / 92 oral presentations in parallel sessions / 32 interactive poster presentations / 24 countries 同ページに国別内訳（Germany 33, Norway 19, France 9, Belgium 8, Finland 8, Romania 7, UK 7, Japan 6）も掲載 ESTC 2020 振り返り

2024年大会の規模

430 delegates from 27 countries / 117 oral presentations, and 46 posters / 4 keynote speeches / Three Professional Development Courses (PDCs) / Five Special Sessions 会期は Berlin | September 11 – 13, 2024 ESTC 2024（Berlin）振り返り

EMPC との年次分担

ESTC is held every even year, while EMPC, the IMAPS event, is held every odd year. EMPC は the major conference event organized by IMAPS Europe と書かれている Mission

欧州の実装・組立・信頼性のテーマを偶数年に追う場合は ESTC、奇数年は EMPC が対応する年になります。

ECTC・EPTC との関係

ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore. Mission

ECTC についての記載

the leading conference in the field of electronic packaging since nearly 70 years / held yearly in US Mission

EPTC についての記載

held every year in December in Singapore 同ページは Since 1997 a counterpart to ECTC has been introduced in Asia と書いている Mission

EMPC との合意

Both organizations agreed to organize their respective flagship conference in Europe alternately every two years. 両組織とは IEEE-EPS と IMAPS Europe を指す Mission

IEEE EPS 側の分類

EPS flagship conferences (ECTC, ESTC and EPTC) IEEE Electronics Packaging Society - Conferences

企業側は出展・協賛の枠と価格が公開されているため、出展を選定するための数字はそのまま拾えます。

学生渡航支援

The student travel grant program for IEEE ESTC awards up to 20 grants. The competition is open to all full-time graduate students enrolled at an accredited institution in a program of study within the scope of IEEE ESTC. The student must be listed as the primary author on the abstract. IEEE ESTC 2026 Call for Papers（PDF）

2026 学生コンペ

Student Competition Challenge: Predictive Modeling and Design Optimization for Advanced Electronic Packaging Submissions

2026 学生参加費

Conference ticket for students: Early Bird €500.00 / Standard €600.00 同ページに All fees include 25.5% Finnish VAT. と併記 Registration

2026 一般・著者参加費

Conference ticket for regular attendees: Early Bird €1,100.00 / Standard €1,300.00／Conference ticket for presenting authors, committee, IEEE and IMAPS members: Early Bird €970.00 / Standard €1,150.00 同ページに All fees include 25.5% Finnish VAT. と併記 Registration

2026 PDC 参加費

1 Course: Early Bird €250.00 / Standard €310.00、2 Courses: €400.00 / €500.00、Courses for Bachelor/Master students: €0.00 Registration

2026 出展枠の残数表示

Premium Booth（Exhibition area 6 m², 3 m x 2 m）は SOLD、Standard Booth（Exhibition area 4 m², 2 m x 2 m）は 11 LEFT と表示 価格は until June 1, 2026 で Premium €5,099.61 net / Standard €3,346.62 net、after June 1, 2026 で Premium €5,976.10 net / Standard €3,904.39 net Exhibition & Sponsoring

2026 プログラムの閲覧手段

セッション別プログラムは ConfTool 上で公開（https://www.conftool.org/estc2026/sessions.php） Program ページから Direct link to conference program として案内されている Program

2026 正式名称

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) IEEE ESTC 2026 公式トップ

略称

IEEE ESTC / ESTC Call for Papers 本文は IEEE ESTC、サイトのタイトルとドメインは ESTC IEEE ESTC 2026 Call for Papers（PDF）

主催・共催

It is sponsored by IEEE-EPS and co-sponsored by IMAPS Europe. IEEE ESTC 2026 Call for Papers（PDF）

開催頻度

The conference is held biennially in Europe. IEEE ESTC 2026 Call for Papers（PDF）

シリーズの発足主体

Organized by IEEE-EPS (former CPMT) since 2006 Mission

2026 IEEE EPS 側の呼称

As the flagship conference of IEEE EPS in Europe, co-sponsored by IMAPS Europe, IEEE ESTC 2026 will be the largest electronics packaging and system integration conference in the region this year. IEEE EPS の 2026年6月 eNews 本文の一文をそのまま引用 IEEE Electronics Packaging Society eNews（2026年6月）

IEEE EPS 会議一覧での表記

2026 IEEE 11th Electronics System-Integration Technology Conference (ESTC) 同ページは ECTC・ESTC・EPTC をまとめて EPS flagship conferences と書いている IEEE Electronics Packaging Society - Conferences